TWI477214B - Printed circuit board having buried component and method for manufacturing same - Google Patents

Description

Circuit board with embedded components and manufacturing method thereof

The present invention relates to the field of circuit board manufacturing, and in particular to a circuit board having embedded components and a method of fabricating the same.

Printed circuit boards have been widely used due to their high assembly density. For application of the circuit board, please refer to the literature Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima,M.Res.Lab,High density multilayer printed circuit board for HITAC M-880,IEEE Trans .on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425.

In order to achieve the purpose of thinness and shortness and increase the electrical quality of products, various manufacturers have begun to change the electronic components originally soldered on the surface of the multilayer circuit board into the inside of the multilayer circuit board. In order to increase the wiring area of the surface of the board to reduce the size of the board and reduce its weight and thickness, the electronic component can be an active or passive component.

A method for manufacturing a circuit board having a buried component is as follows: first, the electronic component is placed in an insulating layer of the core substrate, and then a multilayering layer of alternately arranged layers is formed on opposite sides of the core substrate by a build-up method. And a conductive circuit layer to form a multilayer circuit board having embedded components. However, in this manufacturing method, the glue layer flows into the electron The gap between the component and the substrate may cause the conductive circuit layer at the corresponding position to be recessed toward the substrate, thereby causing the conductive line not to be flattened, thereby affecting the uniformity of the conductive circuit layer; further, the electrode of the electronic component generally passes through the laser etched hole The conductive hole formed by the hole filling process is electrically connected thereto, and the electrode area of the electronic component is small and the electronic component is buried in the offset, so that the laser hole is difficult to be precisely aligned with the electrode, and the electrode of the laser hole and the electronic component is difficult. The offset affects the quality of the electrical connection between the conductive blind via and the component. In addition, when the component is buried, the component may be damaged due to component damage or poor substrate quality, which may result in a decrease in yield and an increase in cost.

Therefore, it is necessary to provide a circuit board having buried conductors with better uniformity and high quality of the conductive wiring layer and a method of fabricating the same.

A method of fabricating a circuit board having embedded components, comprising the steps of: providing a first circuit board including a first substrate layer, a first conductive wiring layer formed on a side of the first substrate layer, and a first substrate layer opposite thereto On the other side of the plurality of layers, a plurality of second conductive circuit layers and a plurality of first insulating layers are alternately stacked, the first conductive circuit layer includes a plurality of first electrical connection pads, and a first base layer side of the first circuit board a first receiving slot is formed, and the second conductive circuit layer is exposed in the first receiving slot to form a third electrical connection pad; the first electronic component is received in the first receiving slot, and the first electronic component is Fixedly connecting and electrically connected to the third electrical connection pad to form a first multi-layer substrate; providing a second multi-layer substrate comprising a second substrate layer, a third conductive circuit layer formed on a side of the second substrate layer, and a plurality of fourth conductive circuit layers and a plurality of second insulating layers alternately stacked on the opposite side of the second substrate layer, wherein the third conductive circuit layer comprises a plurality of one-to-one correspondence with the plurality of first electrical connection pads A fourth conductive pad; providing film, the film having a plurality of the first plurality of electrically connected a one-to-one corresponding opening, wherein the opening is provided with a conductive bonding block; and the first multilayer substrate, the film having the conductive bonding block and the second multilayer substrate are stacked and pressed in one piece, and The plurality of conductive bonding blocks bond and electrically connect the corresponding first electrical connection pads and the fourth electrical connection pads to obtain a circuit board having embedded components.

A circuit board having a buried component, comprising: a first multilayer substrate, a second multilayer substrate, and a film. The first multilayer substrate includes a first substrate layer, a first conductive circuit layer formed on one side of the first substrate layer, and a plurality of second conductive circuit layers alternately stacked in sequence on the opposite side of the first substrate layer And a plurality of first insulating layers and first electronic components. The first conductive circuit layer includes a plurality of first electrical connection pads, and the first multilayer substrate has a first receiving groove formed on one side of the first substrate layer. A portion of the second conductive circuit layer is exposed in the first receiving groove to form a third electrical connection pad, and the first electronic component is fixedly connected to the third electrical connection pad and electrically connected. The second multilayer substrate includes a second substrate layer, a third conductive circuit layer formed on one side of the second substrate layer, and a plurality of fourth conductive circuit layers alternately stacked in sequence on the opposite side of the second substrate layer And a plurality of second insulating layers. The third conductive circuit layer includes a plurality of fourth electrical connection pads corresponding to the plurality of first electrical connection pads. The film is disposed between the first multilayer substrate and the second multilayer substrate, so that the first multilayer substrate and the second multilayer substrate are bonded to each other, the first conductive circuit layer and the third conductive circuit layer Adjacent to the film, the film has a plurality of openings corresponding to the plurality of first electrical connection pads, wherein the openings are provided with conductive bonding blocks, and the two ends of the plurality of conductive bonding blocks respectively correspond to The first electrical connection pad and the second electrical connection pad are bonded to each other and electrically connected.

Compared with the prior art, the first electronic component and the second electronic component of the embodiment are respectively installed after the first circuit board and the second circuit board are completed, so that the glue layer can be prevented from flowing into the first electronic component and the first circuit. Board and second electronic component and second circuit board The recess of the conductive circuit layer caused by the gap between the two causes the uniformity of the conductive circuit layer to be high; in addition, the first circuit board of the embodiment passes through the third electrical connection pad and the sixth electrical connection pad which are formed in advance respectively. Electrically connecting with the first electronic component and the second electronic component, the alignment is more accurate, the alignment offset between the laser hole and the electrode of the electronic component is avoided, and the production quality of the first circuit board and the second circuit board is improved. . In addition, the structure and method are that after the first circuit board and the second circuit board are completed, the electronic components are connected after being tested, and the loss together with the electronic components can be avoided. Decomposing a complicated circuit board having embedded components into a separately fabricated first circuit board and a second circuit board, the first circuit board and the second circuit board are relatively high in yield, and overall Reduce costs and ease of processing. The circuit board having the embedded component of this embodiment can also be applied to an HDI high density laminated board.

10‧‧‧First circuit board

11‧‧‧First basal layer

12‧‧‧First conductive circuit layer

13‧‧‧Second conductive circuit layer

14‧‧‧First insulation

122‧‧‧First electrical connection pad

132‧‧‧First conductive hole

15‧‧‧First solder mask

152‧‧‧Second electrical connection pad

16‧‧‧First storage trough

17‧‧‧ Third electrical connection pad

18‧‧‧First electronic components

182‧‧‧First electrode

20‧‧‧First multilayer substrate

30‧‧‧second circuit board

31‧‧‧Second basal layer

32‧‧‧ Third conductive circuit layer

33‧‧‧fourth conductive layer

34‧‧‧Second insulation

322‧‧‧4th electrical connection pad

332‧‧‧Second conductive hole

35‧‧‧Second solder mask

352‧‧‧The fifth electrical connection pad

36‧‧‧Second holding trough

37‧‧‧6th electrical connection pad

38‧‧‧Second electronic components

40‧‧‧Second multilayer substrate

382‧‧‧second electrode

50‧‧‧ film

51‧‧‧Opening

52‧‧‧ Conductive bonding block

60‧‧‧Circuit board with embedded components

1 is a cross-sectional view of a first circuit board according to an embodiment of the present invention.

2 is a cross-sectional view showing the first receiving groove formed in the first circuit board of FIG. 1.

3 is a cross-sectional view of the first multilayer substrate formed by disposing the first electronic component in the first receiving groove of FIG. 2.

4 is a cross-sectional view of a second circuit board according to an embodiment of the present invention.

Fig. 5 is a cross-sectional view showing the second receiving groove formed in the second wiring board of Fig. 4;

6 is a cross-sectional view of the second multilayer substrate formed by disposing the second electronic component in the second receiving groove of FIG. 5.

FIG. 7 is a schematic view of a film having a through hole provided by an embodiment of the present invention.

Figure 8 is a cross-sectional view showing the through hole of the film of Figure 7 filled with a conductive adhesive.

Figure 9 is a cross-sectional view of a circuit board having embedded components formed by pressing together the first multilayer substrate of Figure 3, the second multilayer substrate of Figure 6, and the film of Figure 8.

Referring to FIG. 1 to FIG. 9 , an embodiment of the present invention provides a method for fabricating a circuit board having embedded components, including the following steps:

First, referring to FIG. 1, a first circuit board 10 is provided. The first circuit board 10 includes a first base layer 11, a first conductive circuit layer 12 formed on one side of the first base layer 11, and at the first A plurality of second conductive wiring layers 13 and a plurality of first insulating layers 14 are alternately stacked in this order on the opposite side of the base layer 11.

The first circuit board 10 can be formed by a build-up method. It can be understood that the first circuit board 10 can also be formed by other methods, such as an additive method, a semi-additive method, and the like. The first conductive circuit layer 12 includes a plurality of first electrical connection pads 122. In this embodiment, the number of the first electrical connection pads 122 is two. The plurality of second conductive wiring layers 13 and the first conductive wiring layer 12 are electrically connected by a plurality of first conductive vias 132 formed in the first base layer 11 and the plurality of first insulating layers 14.

In this embodiment, the first circuit board 10 further includes a first solder resist layer 15 formed on a side of the first circuit board 10 that faces away from the first conductive circuit layer 12, The first solder resist layer 15 partially covers the outermost second conductive circuit layer 13 of the first circuit board 10 away from the first conductive circuit layer 12, and the outermost second conductive circuit layer 13 is exposed to the first defense. The portion of the solder layer 15 constitutes a plurality of second electrical connection pads 152 for electrical connection with electronic components (not shown) such as resistors, capacitors, wafers, and the like.

In the second step, referring to FIG. 2, the first circuit board 10 is from the side of the first base layer 11 The first receiving groove 16 is opened, and a part of the second conductive wiring layer 13 is exposed from the first base layer 11 side of the first wiring board 10 to form a plurality of third electrical connection pads 17.

The method of forming the first receiving groove 16 may employ a laser etched hole. In this embodiment, the first receiving groove 16 extends only through the first base layer 11 , and a portion of the second conductive circuit layer 13 adjacent to the first base layer 11 is exposed in the first receiving groove 16 to form a third electric Sexual connection pad 17. It can be understood that, if necessary, the first receiving groove 16 can further penetrate one or more layers of the first insulating layer 14 adjacent to the first base layer 11 to make the second conductive circuit layer 13 of the inner layer of the first circuit board 10 The plurality of third electrical connection pads 17 are formed by being exposed to the first receiving groove 16 . In this embodiment, the number of the third electrical connection pads 17 is two. It can be understood that the number of the third electrical connection pads 17 can be increased or decreased according to actual needs, and is not limited to the embodiment.

In the third step, referring to FIG. 3, the first electronic component 18 is disposed in the first receiving slot 16, and the first electronic component 18 is electrically and fixedly connected to the third electrical connecting pad 17 to form a first Multilayer substrate 20.

In this embodiment, the first electronic component 18 is a resistor having an exposed first electrode 182 at each end thereof, and the two first electrodes 182 are respectively fixedly connected and electrically connected by a conductive adhesive (not shown). The conductive adhesive can be a conductive silver paste, a conductive copper paste or a solder paste, or the like. It can be understood that the first first electronic component 18 can be accommodated in the first receiving slot 16, and the storage space of the first receiving slot 16 can be appropriately increased and the number of the third electrical connecting pads 17 can be increased.

Fourth, referring to FIG. 4, a second circuit board 30 is provided. The second circuit board 30 includes a second base layer 31, a third conductive circuit layer 32 formed on one side of the second base layer 31, and the second A plurality of fourth conductive wiring layers 33 and a plurality of second insulating layers 34 are alternately stacked in this order on the opposite side of the base layer 31.

The second circuit board 30 can be formed by a build-up method. It can be understood that the second circuit board 30 can also be formed by other methods, such as an additive method, a semi-additive method, and the like. The third conductive circuit layer 32 includes a plurality of fourth electrical connection pads 322. In this embodiment, the number of the fourth electrical connection pads 322 is two, and is respectively associated with the two first electrical connection pads 122. The location corresponds. The plurality of fourth conductive wiring layers 33 and the third conductive wiring layer 32 are electrically connected by a plurality of second conductive holes 332 formed in the second base layer 31 and the plurality of second insulating layers 34.

In this embodiment, the second circuit board 30 further includes a second solder resist layer 35 formed on a side of the second circuit board 30 that faces away from the third conductive circuit layer 32. The second solder resist layer 35 partially covers the outermost fourth conductive circuit layer 33 of the second circuit board 30 away from the third conductive circuit layer 32. The outermost fourth conductive circuit layer 33 is exposed to the second protection layer. The portion of the solder layer 35 constitutes a plurality of fifth electrical connection pads 352 for electrical connection with electronic components (not shown) such as resistors, capacitors, wafers, and the like.

In the fifth step, referring to FIG. 5, the second circuit board 30 is opened from the second base layer 31 side to form a second receiving slot 36, so that a portion of the fourth conductive circuit layer 33 is removed from the second circuit board 30. The base layer 31 is exposed on one side to form a plurality of sixth electrical connection pads 37.

The method of forming the second receiving groove 36 may employ a laser etching hole. In this embodiment, the second receiving groove 36 penetrates the second base layer 31 and a second insulating layer 34 adjacent to the second base layer 31. It can be understood that, if necessary, the second receiving groove 36 can extend only through the second base layer 31 or further through the second insulating layer 34 of the plurality of layers, so that the fourth conductive circuit layer 33 of the inner layer of the second circuit board 30 The plurality of sixth electrical connection pads 37 are formed by being exposed to the second receiving groove 36. In this embodiment, the number of the sixth electrical connection pads 37 is two. It can be understood that the number of the sixth electrical connection pads 37 can be according to actual needs. It is not limited to this embodiment to increase or decrease.

In the sixth step, referring to FIG. 6, the second electronic component 38 is disposed in the second receiving slot 36, and the second electronic component 38 is electrically and fixedly connected to the sixth electrical connecting pad 37 to form a second Multilayer substrate 40.

In this embodiment, the two ends of the second electronic component 38 respectively have an exposed second electrode 382, and the two second electrodes 382 are respectively fixedly connected and electrically connected to the two through a conductive adhesive (not shown). A sixth electrical connection pad 37, the conductive adhesive may be a conductive silver paste, a conductive copper paste or a solder paste. It can be understood that the second electronic component 38 can be accommodated in the second receiving slot 36, and the storage space of the second receiving slot 36 can be appropriately increased and the number of the sixth electrical connecting pads 37 can be increased.

In the seventh step, referring to FIG. 7 and FIG. 8, a film 50 is provided on the film 50, and the opening 51 corresponding to the plurality of first electrical connection pads 122 is respectively formed in the film 50, and the opening 51 is formed in the opening 51. The conductive adhesive is filled therein to form a plurality of conductive bonding blocks 52.

The film 50 can be a FR4 epoxy glass cloth semi-cured film. The method of forming the opening 51 may be mechanical drilling or laser etching. The material of the conductive bonding block 52 may be a conductive silver paste, a conductive copper paste or a solder paste. As shown in FIG. 8 , in the embodiment, the conductive adhesive material of the conductive bonding block 52 is filled with the corresponding opening 51 and a small amount of conductive adhesive material overflows, so as to facilitate the subsequent pressing step and the first electricity. The connection pads 122 and the fourth electrical connection pads 322 are electrically connected.

The eighth step, referring to FIG. 9, sequentially stacks and presses the first multi-layer substrate 20, the film 50 having the conductive bonding block 52, and the second multi-layer substrate 40 as a whole, thereby obtaining a circuit having embedded components. Board 60.

Stacking the first multilayer substrate 20, the film 50 having the conductive bonding block 52, and the second multilayer In the case of the substrate 40, the plurality of first electrical connection pads 122 are respectively aligned with the corresponding conductive bonding blocks 52, and the plurality of conductive bonding blocks 52 are respectively aligned with the corresponding fourth electrical connection pads 322, thereby being pressed. After that, the plurality of first electrical connection pads 122 are respectively bonded to and electrically connected to the corresponding fourth electrical connection pads 322 through the corresponding conductive bonding blocks 52. The material of the film 50 fills the gaps in the first receiving groove 16 and the second receiving groove 36 under the action of the pressing force.

It can be understood that the first electronic component 18 can be disposed only on the first multilayer substrate 20, and the second electronic component 38 is not disposed in the second multilayer substrate 40, as the case may be. It is also understood that the circuit board 60 having the embedded component of the present embodiment can also be applied to an HDI high density laminate.

Referring to FIG. 9, the circuit board 60 having the embedded component of the embodiment includes a first multilayer substrate 20, a second multilayer substrate 40, and the first multilayer substrate 20 and the second multilayer substrate 40 are bonded thereto. Film 50 together.

The first multilayer substrate 20 includes a first base layer 11, a first conductive wiring layer 12 formed on one side of the first base layer 11, and a plurality of layers alternately stacked one on another on the opposite side of the first base layer 11. The second conductive wiring layer 13 and the plurality of first insulating layers 14 and the first electronic component 18. The first conductive circuit layer 12 includes a plurality of first electrical connection pads 122. The first multi-layer substrate 20 is provided with a first receiving groove 16 on the first substrate layer 11 side, and a portion of the second conductive circuit layer 13 is exposed in the first receiving groove 16 to form a plurality of third electrical connection pads 17 . The first electronic component 18 is fixedly connected to the plurality of third electrical connection pads 17 and electrically connected. The first multilayer substrate 20 further includes a first solder resist layer 15 formed on a side of the first multilayer substrate 20 that faces away from the first conductive wiring layer 12, and the first a solder resist layer 15 partially covering the outermost second conductive wiring layer 13 of the first multilayer substrate 20 away from the first conductive wiring layer 12, the outermost The portion of the second second conductive layer 13 exposed to the first solder resist layer 15 constitutes a plurality of second electrical connection pads 152 for electrical connection with electronic components (not shown) such as resistors, capacitors, wafers, and the like.

The second multilayer substrate 40 includes a second base layer 31, a third conductive wiring layer 32 formed on one side of the second base layer 31, and a plurality of layers alternately stacked in sequence on the opposite side of the second base layer 31. The fourth conductive wiring layer 33 and the plurality of second insulating layers 34 and the second electronic component 38. The third conductive circuit layer 32 includes a plurality of fourth electrical connection pads 322 that are in one-to-one correspondence with the first electrical connection pads 122. The second multi-layer substrate 40 is provided with a second receiving groove 36 on the second base layer 31 side, and a portion of the fourth conductive circuit layer 33 is exposed in the second receiving groove 36 to form a plurality of sixth electrical connection pads 37. The second electronic component 38 is fixedly connected to the plurality of sixth electrical connection pads 37 and electrically connected. The second multilayer substrate 40 further includes a second solder resist layer 35 formed on a side of the second multilayer substrate 40 that faces away from the third conductive circuit layer 32, and the first The second solder resist layer 35 partially covers the outermost fourth conductive circuit layer 33 of the first multilayer substrate 20 away from the third conductive circuit layer 32. The outermost fourth conductive circuit layer 33 is exposed to the second solder resist layer. The portion of 35 constitutes a plurality of fifth electrical connection pads 352 for electrical connection with electronic components (not shown) such as resistors, capacitors, wafers, and the like.

The film 50 is disposed between the first multi-layer substrate 20 and the second multi-layer substrate 40 to adhere the first multi-layer substrate 20 and the second multi-layer substrate 40 to each other. The first conductive circuit layer 12 and the third conductive circuit layer 32 of the second multilayer substrate 40 are respectively adjacent to the film 50, and the material of the film 50 is filled in the first receiving groove 16 and the second receiving groove 36. Void. The film 50 is provided with a plurality of openings 51 corresponding to the first electrical connection pads 122. The plurality of openings 51 are respectively filled with a conductive adhesive, thereby forming a plurality of conductive bonding blocks 52. Both ends of the bonding block 52 The first electrical connection pads 122 and the fourth electrical connection pads 322 are bonded to each other and electrically connected to each other.

With respect to the prior art, the first electronic component 18 and the second electronic component 38 of the present embodiment are respectively mounted after the first circuit board 10 and the second circuit board 30 are completed, thereby preventing the adhesive layer from flowing into the first electronic component. The recess of the conductive circuit layer caused by the gap between the first circuit board 10 and the second electronic component 38 and the second circuit board 30 causes the uniformity of the conductive circuit layer to be high; in addition, the first line of the embodiment The board 10 is electrically connected to the first electronic component 18 and the second electronic component 38 through the pre-formed third electrical connection pad 17 and the sixth electrical connection pad 37, respectively, which is more accurate in alignment and avoids the laser hole and the electronic component. The alignment offset between the electrodes improves the production quality of the first circuit board 10 and the second circuit board 30. In addition, the structure and method of the circuit board 60 having the embedded component of the present embodiment is that after the first circuit board 10 and the second circuit board 30 are completed, the electronic component is connected after being tested, and the electronic component can be avoided. loss. The circuit board 60 having the embedded component is decomposed into the first circuit board 10 and the second circuit board 30 which are simple in structure, and the manufacturing yield of the first circuit board 10 and the second circuit board 30 is relatively high. Overall, it reduces costs and is easy to process.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims.

11‧‧‧First basal layer

13‧‧‧Second conductive circuit layer

14‧‧‧First insulation

122‧‧‧First electrical connection pad

15‧‧‧First solder mask

152‧‧‧Second electrical connection pad

18‧‧‧First electronic components

20‧‧‧First multilayer substrate

31‧‧‧Second basal layer

33‧‧‧fourth conductive layer

34‧‧‧Second insulation

322‧‧‧4th electrical connection pad

35‧‧‧Second solder mask

352‧‧‧The fifth electrical connection pad

38‧‧‧Second electronic components

40‧‧‧Second multilayer substrate

50‧‧‧ film

52‧‧‧ Conductive bonding block

60‧‧‧Circuit board with embedded components

Claims (10)

A method of fabricating a circuit board having embedded components, comprising the steps of: providing a first circuit board including a first substrate layer, a first conductive wiring layer formed on a side of the first substrate layer, and a first substrate layer opposite thereto On the other side of the plurality of layers, a plurality of second conductive circuit layers and a plurality of first insulating layers are alternately stacked, the first conductive circuit layer includes a plurality of first electrical connection pads, and a first base layer side of the first circuit board a first receiving slot is formed, and the second conductive circuit layer is exposed in the first receiving slot to form a third electrical connection pad; the first electronic component is received in the first receiving slot, and the first electronic component is Fixedly connecting and electrically connected to the third electrical connection pad to form a first multi-layer substrate; providing a second multi-layer substrate comprising a second substrate layer, a third conductive circuit layer formed on one side of the second substrate layer, a plurality of fourth conductive circuit layers and a plurality of second insulating layers and second electronic components alternately stacked on the opposite side of the second substrate layer, the third conductive circuit layer comprising a plurality and the first first electrical property even a second electrical connection pad corresponding to the pad, a second receiving slot is formed on a side of the second base layer of the second multilayer substrate, and a portion of the third conductive circuit layer is exposed in the second receiving slot to form a sixth An electrical connection pad, the second electronic component is received in the second receiving slot, the second electronic component is fixedly connected and electrically connected to the sixth electrical connecting pad; and the film is provided, the film has a plurality and the first electrical a corresponding opening of the connecting pad, wherein the opening is provided with a conductive bonding block; and sequentially stacking and pressing the first multilayer substrate, the film with the conductive bonding block and the second multilayer substrate as a whole And the plurality of conductive bonding blocks glue and electrically connect the corresponding first electrical connection pads and the fourth electrical connection pads to obtain a circuit board having embedded components. The method of fabricating a circuit board having a buried component as described in claim 1, wherein the conductive bonding block is made of a conductive silver paste, a conductive copper paste or a solder paste. The method of fabricating a circuit board having a buried component according to claim 1, wherein the first multilayer substrate further comprises a first solder resist layer, the first solder resist layer being formed on the first multilayer substrate The first conductive circuit layer faces away from the side, and the first solder resist layer partially covers the outermost second conductive circuit layer of the first circuit board away from the first conductive circuit layer, and the outermost second conductive line The portion of the layer exposed to the first solder resist layer constitutes a plurality of second electrical connection pads. The method of fabricating a circuit board having a buried component according to claim 1, wherein the second multilayer substrate further comprises a second solder resist layer formed on the second multilayer substrate The third conductive circuit layer faces away from the side, and the second solder resist layer partially covers the outermost fourth conductive circuit layer of the second circuit board away from the third conductive circuit layer, and the outermost fourth conductive line The portion of the layer exposed to the second solder resist layer constitutes a plurality of fifth electrical connection pads. The method of fabricating a circuit board having a buried component according to claim 1, wherein the number of the third electrical connection pads and the sixth electrical connection pads is two, and the first electronic component includes two An electrode, the two first electrodes are fixedly connected to and electrically connected to the two third electrical connection pads, the second electronic component includes two second electrodes, and the two second electrodes respectively The sixth electrical connection pad is fixedly connected and electrically connected. A circuit board having a buried component, comprising: a first multilayer substrate including a first substrate layer, a first conductive wiring layer formed on a side of the first substrate layer, and an opposite side of the first substrate layer And a plurality of first conductive layers and a plurality of first insulating layers and a first electronic component, wherein the first conductive circuit layer comprises a plurality of first electrical connection pads, and the first multilayer substrate is on the first substrate a first receiving slot is formed on one side of the layer, and a portion of the second conductive circuit layer is exposed in the first receiving slot to form a third electrical connecting pad. The first electronic component is fixedly connected to the third electrical connecting pad and electrically connected. a second multilayer substrate comprising a second substrate layer, a third conductive wiring layer formed on one side of the second substrate layer, and a plurality of fourth conductive layers alternately stacked in sequence on the opposite side of the second substrate layer a circuit layer and a plurality of second insulating layers and a second electronic component, the third conductive circuit layer comprising a plurality of fourth electrical connection pads corresponding to the plurality of first electrical connection pads, wherein the second multilayer substrate has a second receiving groove on a side of the second substrate layer, and a portion of the fourth conductive circuit layer is exposed The second receiving slot is configured to form a plurality of sixth electrical connecting pads, the second electronic component is received in the second receiving slot, and the second electronic component is fixedly connected and electrically connected to the plurality of sixth electrical connecting pads; and the film The film is disposed between the first multi-layer substrate and the second multi-layer substrate, so that the first multi-layer substrate and the second multi-layer substrate are bonded to each other, the first conductive circuit layer and the third conductive line The layers are respectively adjacent to the film, and the film has a plurality of openings corresponding to the plurality of first electrical connection pads, wherein the openings are provided with conductive bonding blocks, and the two ends of the plurality of conductive bonding blocks are respectively The corresponding first electrical connection pads and the second electrical connection pads are bonded to each other and electrically connected. The circuit board with a buried component according to claim 6, wherein the first multilayer substrate further comprises a first solder resist layer formed on the first multilayer substrate and the first a side of the conductive circuit layer facing away from the first conductive layer, the first solder mask layer partially covering the outermost second conductive circuit layer of the first multilayer substrate away from the first conductive circuit layer, the outermost second conductive circuit layer being exposed The portion of the first solder resist layer constitutes a plurality of second electrical connection pads. The circuit board with a buried component according to claim 6, wherein the second multilayer substrate further includes a second solder resist layer formed on the second multilayer substrate and the third a side of the conductive circuit layer facing away from the side, and the second solder resist layer partially covering an outermost fourth conductive circuit layer of the first multilayer substrate remote from the third conductive circuit layer, the outermost fourth conductive circuit layer being exposed The portion of the second solder resist layer constitutes a plurality of fifth electrical connection pads. The circuit board with embedded components according to claim 6, wherein the conductive bonding material is made of conductive silver paste, conductive copper paste or solder paste. The circuit board with embedded components according to claim 1, wherein the number of the third electrical connection pads and the sixth electrical connection pads is two, and the first electronic component includes two first electrodes. The two first electrodes are fixedly connected to the two third electrical connection pads and electrically connected to each other. The second electronic component includes two second electrodes, which are respectively fixedly connected to the two sixth electrical connection pads and electrically connected.