CN104113983A - Embedded circuit board and manufacture method thereof - Google Patents
Embedded circuit board and manufacture method thereof Download PDFInfo
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- CN104113983A CN104113983A CN201310133932.9A CN201310133932A CN104113983A CN 104113983 A CN104113983 A CN 104113983A CN 201310133932 A CN201310133932 A CN 201310133932A CN 104113983 A CN104113983 A CN 104113983A
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- copper foil
- foil layer
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Abstract
The invention discloses an embedded circuit board manufacture method comprising: fixing electronic components on a first copper foil layer and producing positioning bonding pads used for position identification; laminating an insulating layer and a second copper foil layer on the first copper foil layer in order that the electronic components are embedded between the first copper foil layer and the second copper foil layer; drilling through holes on the positioning bonding pads by identifying the positioning bonding pads in order to form targets; performing positioning with the targets and processing line patterns or via holes on the first copper foil layer and the second copper foil layer, wherein the line patterns or via holes are connected with the bonding pads of the electronic components. The embodiment of the invention also provides a corresponding embedded circuit board. According to the embedded circuit board manufacture method, positional information inside the circuit board, such as the positional information of the embedded electronic components, can be transmitted to an external part through the positioning bonding pads. Thus, the aligning precision of the line patterns or via holes and the internal embedded electronic components can be improved and the reliability of the connection between the electronic components and the line patterns can be improved.
Description
Technical field
The present invention relates to circuit board making technical field, be specifically related to a kind of embedded circuit board and preparation method thereof.
Background technology
In the manufacture craft of existing embedded circuit board, generally the electronic components such as chip or electric capacity, resistance to be fixed on to the surface of inner plating by chip mounter, and then increase layer by lamination mode, the electronic components such as chip, electric capacity, resistance are embedded to the internal layer of wiring board, finally by the mode of welding or laser drill and the plating of heavy copper, realize the interconnection of chip pin and circuit board line.
In this manufacture craft, because electronic component is to imbed wiring board inside by lamination, cannot electron gain element on the surface at wiring board after lamination in inner positional information, and lamination can cause the dislocation between each layer, by traditional locate mode easily cause processing line pattern or the pad misalignment of interlayer conduction hole and chip, to such an extent as to cannot realize electrical connection or be electrically connected to unreliable.
Summary of the invention
The embodiment of the present invention provides a kind of embedded circuit board and preparation method thereof, easily causes the technical problem of the via of line pattern or interlayer and the pad dislocation of the electronic component of imbedding to solve prior art.
First aspect present invention provides a kind of manufacture method of embedded circuit board, comprising: at the first copper foil layer fixed electronic element and the location soldering dish of making for location recognition; Lamination insulating barrier and the second copper foil layer on described the first copper foil layer, be embedded between the first copper foil layer and the second copper foil layer described electronic component; By identifying described location soldering dish, at described location soldering Pan Chu, drill through hole and form target; Utilize described target to position, on described the first and second copper foil layers, process line pattern or via, described line pattern or via are connected with the pad of described electronic component.
A kind of embedded circuit board of second aspect present invention, comprising: the first copper foil layer, is fixed on the electronic component on the first copper foil layer, and is pressed together on insulating barrier and the second copper foil layer on described the first copper foil layer; Anchor point on described the first copper foil layer is manufactured with location soldering dish, described location soldering Pan Chu is processed with the through hole target that runs through described the first and second copper foil layers, on described the first and second copper foil layers, have and utilize described through hole target to position line pattern or the via being processed into, described via or line pattern are connected with the pad of described electronic component.
The embodiment of the present invention adopts on internal layer is pasted with the copper foil layer of electronic component and makes location soldering dish, by identification, locate the technical scheme that soldering dish is made target and then processing line pattern or via, make the positional information of the electronic component that the positional information of circuit board inside for example imbeds be delivered to outside by location soldering dish, thereby can improve the aligning accuracy of line pattern or via and the inner electronic component of imbedding of externally processing, avoid dislocation, and then improve the reliability that electronic component is connected with line pattern.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of the embedded circuit board that provides of the embodiment of the present invention;
Fig. 2 makes the schematic diagram of welding resistance figure on the first copper foil layer;
Fig. 3 is the schematic diagram of print solder paste on the first copper foil layer;
Fig. 4 makes the schematic diagram of location soldering dish on the first copper foil layer;
Fig. 5 is the schematic diagram of lamination insulating barrier and the second copper foil layer;
Fig. 6 is the schematic diagram of making target;
Fig. 7 is the schematic diagram of processing line pattern;
Fig. 8 is the schematic diagram that continues to increase layer;
Fig. 9 is the schematic diagram of making outer-layer circuit figure.
Embodiment
The embodiment of the present invention provides a kind of manufacture method of embedded circuit board, can solve the technical problem that prior art easily causes the via of line pattern or interlayer and the pad dislocation of the electronic component of imbedding.The embodiment of the present invention also provides corresponding embedded circuit board.Below be elaborated respectively.
Embodiment mono-,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of manufacture method of embedded circuit board, comprising:
110, at the first copper foil layer fixed electronic element with make the location soldering dish for location recognition.
This step is at the first copper foil layer fixed electronic element and make location soldering dish, and this location soldering dish is for the follow-up location recognition of carrying out.This step specifically can comprise:
A, as shown in Figure 2 makes welding resistance figure 202 on the first copper foil layer 201, and described welding resistance figure 202 at least exposes pad 203 and the anchor point 204 of design; Optionally, described welding resistance figure 202 covers all other regions except pad 203 and anchor point 204 on the first copper foil layers 201; Optionally, anchor point 204 is positioned at the periphery of the first copper foil layer 201, and quantity can be more than one.
B, as shown in Figure 3, print solder paste 205 on described anchor point 204, print solder paste 205 or conductive adhesive electronic component 206 is mounted on described pad 203 on described pad 203; Optionally, electronic component 206 can have more than one.
C, as shown in Figure 4, makes described tin cream 205 meltings and solidifies, thereby forms location soldering dishes 207 at described anchor point 204, and described electronic component 206 is fixed on described pad 203; In practical application, print solder paste or conductive adhesive described the first copper foil layer that has mounted electronic component can be crossed to Reflow Soldering, realize tin cream or conduction bonding melting and solidify.
Preferably described location soldering dish 207 is made as to circle.
120, lamination insulating barrier and the second copper foil layer on described the first copper foil layer, be embedded between the first copper foil layer and the second copper foil layer described electronic component.
As shown in Figure 5, this step, by lamination insulating barrier 208 and the second copper foil layer 209 on the first copper foil layer 201, realizes and increases layer; Increase after layer, electronic component 206 is embedded in circuit board inside.The relative position of the first and second copper foil layers may change before and after lamination.If can not identify this variation, between the line pattern of following process and electronic component, will have dislocation.
130,, by the described location soldering dish of identification, at described location soldering Pan Chu, drill through hole and form target.
As shown in Figure 6, on the two-tier circuit plate that this step forms after increasing layer, make target 210.In concrete application, bore target equipment and can utilize X ray to identify described location soldering dish 207, then according to recognition result, at anchor point 204, drill through hole and form target 210.The target 210 forming runs through this two-tier circuit plate, and passes through from the central authorities of location soldering dish 207.Preferably, the diameter of this target 210 is less than the diameter of location soldering dish 207, thus follow-up can also, at surrounding's reservation one circular orientation soldering dish of target 210, increasing again layer so that follow-up and continue on for location recognition afterwards.
140, utilize described target to position, on described the first and second copper foil layers, process line pattern or via, described line pattern or via are connected with the pad of described electronic component.
Because location soldering dish 207 and electronic component 206 are all fixed on the first copper foil layer 201, therefore have definite position relationship between the two, this position relationship can step 110 or before just obtain; And target 210 is to locate soldering dish 207 by identification to be drilled with the central authorities at location soldering dish 207, therefore, can further determine the position relationship of target 210 and electronic component 206.Thereby, according to this position relationship, can utilize described target 210 to position, determine the position of electronic component 206, as shown in Figure 7, relevant position processing line pattern 211 or the via corresponding with this electronic component 206 on the first and second copper foil layers, and line pattern 211 or via are connected with the pad of described electronic component 206.
In other embodiments, also can start processing from double-sided copper-clad substrate or more multi-layered substrate, in such cases, can electronic component 206 is electrically connected to the line pattern of outer or inferior skin or other layer by processing via.
So far, realized at each layer of making of circuit board line pattern or the via accurate corresponding with the positions of electronic parts of imbedding, realized electronic component and be connected with the reliable of line pattern.
In other execution mode, follow-uply can also comprise other conventional steps:
For example, the outer surface at described the first and second copper foil layers carries out lamination, continuation increasing layer.In a kind of execution mode, two-sided continuation increases circuit board after layer as shown in Figure 8, wherein, the 212nd, insulating barrier, 213 is the 3rd copper foil layers, 214 is the 4th copper foil layers.As shown in Figure 9, can, by the described location soldering dish 207 of identification or according to described target 210, in described locating point position processing, run through the location hole 215 of the third and fourth copper foil layer; And utilize described location hole 215 to position, on described the third and fourth copper foil layer, process outer-layer circuit figure 216.
Follow-up, can also be on the pad of outer-layer circuit figure 216 plating nickel gold, on the surface of outer-layer circuit figure 216, make solder mask etc.
Above, the embodiment of the present invention provides a kind of manufacture method of buried circuits, the method sets firmly in the process of electronic component soldering dish in location for production location identification by the internal layer at copper foil layer, identification location soldering dish is made target and then processing line pattern or via again, make the positional information of the electronic component that the positional information of circuit board inside for example imbeds be delivered to outside by location soldering dish, thereby can improve the aligning accuracy of line pattern or via and the inner electronic component of imbedding of externally processing, avoid the problem of the via of line pattern or interlayer and the dislocation of the pad of electronic component, can improve the reliability that the electronic component imbedded is connected with line pattern.
Embodiment bis-,
Please refer to Fig. 7, the invention process provides a kind of embedded circuit board, comprising:
The first copper foil layer 201, is fixed on the electronic component 206 on the first copper foil layer 201, and is pressed together on insulating barrier 208 and the second copper foil layer 209 on described the first copper foil layer 201; Anchor point on described the first copper foil layer 201 is manufactured with location soldering dish, described location soldering dish is processed with the through hole target 210 that runs through described the first and second copper foil layers everywhere, on described the first and second copper foil layers, have and utilize described through hole target 210 to position line pattern 211 or the via being processed into, described via or line pattern 211 are connected with the pad of described electronic component 206.
More detailed description to described buried circuits, please refer to the content of recording in embodiment mono-.Described target and through hole target has identical meanings herein.
Above, the embodiment of the present invention provides a kind of embedded circuit board, on the internal layer Copper Foil of this circuit board, be fixed with on electronic component and internal layer copper foil layer and be manufactured with and locate soldering dish, this circuit board has by locating soldering dish by identification after lamination makes line pattern or the via processing, the aligning accuracy of the pad of its line pattern or via and electronic component is higher, has higher connection reliability.
This above embedded circuit board that the embodiment of the present invention is provided and preparation method thereof is described in detail, but the explanation of above embodiment is just understood method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.In the technical scope that those skilled in the art disclose in the present invention, the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.
Claims (6)
1. a manufacture method for embedded circuit board, is characterized in that, comprising:
At the first copper foil layer fixed electronic element and the location soldering dish of making for location recognition;
Lamination insulating barrier and the second copper foil layer on described the first copper foil layer, be embedded between the first copper foil layer and the second copper foil layer described electronic component;
By identifying described location soldering dish, at described location soldering Pan Chu, drill through hole and form target;
Utilize described target to position, on described the first and second copper foil layers, process line pattern or via, described line pattern or via are connected with the pad of described electronic component.
2. method according to claim 1, is characterized in that, described comprises at the first copper foil layer fixed electronic element and the location soldering dish of making for location recognition:
On the first copper foil layer, make welding resistance figure, described welding resistance figure at least exposes pad and the anchor point of design;
In described anchor point print solder paste, at described pad print solder paste or conductive adhesive and electronic component is mounted on described pad;
Make described tin cream or conductive adhesive melting and solidify, at described anchor point, forming location soldering dish, described electronic component is fixed on described pad.
3. method according to claim 2, is characterized in that, described making described tin cream or conductive adhesive melting and solidify comprises:
Print solder paste or conductive adhesive described the first copper foil layer of having mounted electronic component are crossed to Reflow Soldering.
4. according to the method described in claim 1,2 or 3, it is characterized in that, described location soldering dish is identified in described passing through, and drills through hole formation target comprise at described location soldering Pan Chu:
Bore target equipment and utilize X ray to identify described location soldering dish, according to recognition result, at location soldering Pan Chu, drill through hole and form target.
5. according to the method described in claim 1,2 or 3, it is characterized in that, the described described target that utilizes positions, and processes line pattern or via comprises on described the first and second copper foil layers:
Utilize described target to determine the position of the electronic component mounting, the relevant position on the first or second copper foil layer processes corresponding circuitous pattern or via.
6. an embedded circuit board, is characterized in that, comprising:
The first copper foil layer, is fixed on the electronic component on the first copper foil layer, and is pressed together on insulating barrier and the second copper foil layer on described the first copper foil layer;
Anchor point on described the first copper foil layer is manufactured with location soldering dish, described location soldering Pan Chu is processed with the through hole target that runs through described the first and second copper foil layers, on described the first and second copper foil layers, have and utilize described through hole target to position line pattern or the via being processed into, described via or line pattern are connected with the pad of described electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310133932.9A CN104113983A (en) | 2013-04-17 | 2013-04-17 | Embedded circuit board and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310133932.9A CN104113983A (en) | 2013-04-17 | 2013-04-17 | Embedded circuit board and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104113983A true CN104113983A (en) | 2014-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310133932.9A Pending CN104113983A (en) | 2013-04-17 | 2013-04-17 | Embedded circuit board and manufacture method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107305849A (en) * | 2016-04-22 | 2017-10-31 | 碁鼎科技秦皇岛有限公司 | Encapsulating structure and preparation method thereof |
| TWI640237B (en) * | 2017-12-18 | 2018-11-01 | 台郡科技股份有限公司 | Thin type buried line roll manufacturing method |
| CN115023033A (en) * | 2021-09-18 | 2022-09-06 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038887A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate of embedded element |
| WO2012042668A1 (en) * | 2010-10-01 | 2012-04-05 | 株式会社メイコー | Substrate with built-in component and method for manufacturing substrate with built-in component |
| CN102548221A (en) * | 2010-12-29 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit board |
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2013
- 2013-04-17 CN CN201310133932.9A patent/CN104113983A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101038887A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate of embedded element |
| WO2012042668A1 (en) * | 2010-10-01 | 2012-04-05 | 株式会社メイコー | Substrate with built-in component and method for manufacturing substrate with built-in component |
| CN102548221A (en) * | 2010-12-29 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107305849A (en) * | 2016-04-22 | 2017-10-31 | 碁鼎科技秦皇岛有限公司 | Encapsulating structure and preparation method thereof |
| CN107305849B (en) * | 2016-04-22 | 2020-05-19 | 碁鼎科技秦皇岛有限公司 | Packaging structure and manufacturing method thereof |
| TWI640237B (en) * | 2017-12-18 | 2018-11-01 | 台郡科技股份有限公司 | Thin type buried line roll manufacturing method |
| CN115023033A (en) * | 2021-09-18 | 2022-09-06 | 荣耀终端有限公司 | Circuit board assembly and electronic equipment |
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Application publication date: 20141022 |
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