JP5108253B2 - Component mounting module - Google Patents

Description

  The present invention relates to a component mounting module that is a wiring board on which components are mounted, and more particularly to a component mounting module that includes a built-in component in the wiring board.

  As a conventional technique, there is one disclosed in Patent Document 1 below. According to the structure shown in FIG. 1 of the same document, solder (or conductive adhesive) is used for electrical connection of the electrical component to the wiring layer. In the manufacturing method, electrical components are electrically and mechanically connected to a wiring board serving as a core in advance using solder (or conductive adhesive). In addition, a hole is formed in another insulating resin layer, and the hole is filled with a conductive composition, aligned and arranged with the core plate on which the component has been previously mounted, and laminated and integrated.

  In component mounting modules, when another component is externally mounted on this wiring board, or when the component mounting module itself is mounted on another wiring board (both are also referred to as secondary mounting), the connection reliability of the built-in components It is important that sex is not impaired. Specifically, for example, when solder is used as a connection material for a built-in component, it is necessary to prevent connection failure or short circuit due to remelting of the solder.

This document describes the use of high-temperature solder having a high melting point in order to prevent such remelting (paragraph 0034 of the document). However, the specific components of solder are not clear. In general, Sn—Pb-based Pb-rich materials are known as high-temperature solders, including Pb-5Sn (melting point: 314 ° C. to 310 ° C.) and Pb-10 Sn (melting point: 302 ° C. to 275 ° C.). However, a high temperature of 300 ° C. or higher is required as the soldering temperature. At such a high temperature, a general epoxy resin as an insulating plate material for a wiring board is insufficient in heat resistance and is difficult to apply.
JP 2003-197849 A

  An object of the present invention is to provide a component mounting module that is a wiring board on which components (including built-in components) are mounted, and that does not cause a decrease in reliability due to remelting of solder for connecting built-in components. To do.

In order to solve the above-described problem, a component mounting module according to the present invention includes a first insulating layer, a second insulating layer positioned in a stacked manner with respect to the first insulating layer, and the second insulating layer. A first component which is a component embedded in the layer, and a first component for electrically connecting the first component, which is provided between the first insulating layer and the second insulating layer. An inner layer wiring pattern including one land, a solder portion for connecting and fixing the first component to the first land of the inner layer wiring pattern, and the second insulating layer of the first insulating layer. the lower surface is the outer surface not side opposite to the second insulating layer, provided on the upper and lower surfaces defined by the upper surface as the plane of the outer not side opposed to the first insulating layer, the Includes a second land for electrically connecting a second component which is a component located on the upper and lower surfaces Comprising an outer layer wiring pattern, and the comprises a second component, the all components were located on the top and bottom surfaces, only the connecting member material is not a solder is electrically connected to the outer-layer wiring pattern It is characterized by being.

  That is, in this component mounting module, the first component which is a built-in component is mounted by soldering, but all component mounting to the outer layer wiring pattern is non-solder connection. Therefore, since a component mounting method to the outer layer wiring pattern in which the solder connecting the first component is not remelted can be selected, there is no problem that the solder for connecting the built-in component is remelted. Therefore, it is possible to prevent a decrease in reliability due to remelting of the solder for connecting the built-in components.

  ADVANTAGE OF THE INVENTION According to this invention, in the component mounting module which is a wiring board with which components (a built-in component is included) were mounted, the reliability fall by remelting of the solder for a built-in component connection can be prevented.

As an embodiment of the present invention, the front Kise' connection member is bitten other are provided with a bonding wire Ya is either provided with a non-solder material of bumps for performing flip chip connection, and to Can do. Bonding wire connection and flip chip connection are well-known methods often used as non-solder connection. In addition, these connections are generally possible at an application temperature of 200 ° C. or less at the highest. If it is 200 degrees C or less, it is lower than melting | fusing point 217-220 degreeC of Sn-3Ag-0.5Cu which is general lead-free solder, and the remelting can be prevented.

Further, as an embodiment, a portion of said second part, as the connecting member, that is electrically connected to the outer-layer wiring pattern by using the bonding wire and the conductive adhesive separately, and can do. In general, the conductive adhesive is cured by heating. However, if the temperature is selected to be 200 ° C. or lower, remelting of the solder for connecting the built-in component can be prevented. The conductive adhesive is suitable as a functional material for mechanically fixing a component and electrically fixing the component to a reference potential, particularly when mounting the component on an outer layer wiring pattern.

  Further, as an embodiment, the second insulating layer is a laminate of at least two insulating layers, a second inner layer wiring pattern provided between the at least two insulating layers, and the second A portion of the insulating layer passing through a portion in the stacking direction, sandwiched between the surface of the inner layer wiring pattern and the surface of the second inner layer wiring pattern, and made of a conductive composition and coincides with the stacking direction. An interlayer connection body having a shaft and a shape whose diameter is changed in the direction of the shaft. This interlayer connection body is an example of an interlayer connection body that penetrates a part in the stacking direction of the second insulating layer in which the first component is embedded. For example, conductive bumps formed by screen printing of a conductive composition Is an interlayer connection body derived from

  Further, as an embodiment, the second insulating layer is a laminate of at least two insulating layers, a second inner layer wiring pattern provided between the at least two insulating layers, and the second A portion of the insulating layer passing through a part of the layer in the stacking direction and sandwiched between the surface of the inner layer wiring pattern and the surface of the second inner layer wiring pattern, and is made of metal and has an axis that coincides with the layering direction. And an interlayer connection body having a shape whose diameter changes in the direction of the axis. This interlayer connection body is another example of an interlayer connection body that penetrates a part in the stacking direction of the second insulating layer in which the first component is embedded. For example, a conductor bump formed by etching a metal plate Is an interlayer connection body derived from

As an embodiment, the outer layer wiring pattern is provided at least on the lower surface, which is on the first insulating layer, and penetrates the first insulating layer to face the inner layer wiring pattern and the lower surface. it is sandwiched between the surface of the outer-layer wiring pattern of the upper, and a conductive composition, and interlayer connection diameter direction of the shaft having an axis that coincides with the stacking direction has a shape has changed And further comprising a body. This interlayer connection body is an example of an interlayer connection body that penetrates a first insulating layer different from the second insulating layer in which the first component is embedded, and is formed, for example, by screen printing of a conductive composition. It is an interlayer connection body derived from the conductive bump.

As an embodiment, the outer layer wiring pattern is provided at least on the lower surface, which is on the first insulating layer, and penetrates the first insulating layer to face the inner layer wiring pattern and the lower surface. An interlayer connector that is sandwiched between the surface of the outer wiring pattern and is made of metal and has an axis that coincides with the stacking direction and has a diameter that changes in the direction of the axis; It may be provided. This interlayer connection body is another example of an interlayer connection body that penetrates the first insulating layer different from the second insulating layer in which the first component is embedded, and is formed, for example, by etching a metal plate It is an interlayer connection body derived from the conductive bump.

As an embodiment, the outer layer wiring pattern is provided at least on the lower surface, which is on the first insulating layer, and penetrates the first insulating layer to face the inner layer wiring pattern and the lower surface. An interlayer connection that is sandwiched between the upper wiring pattern surface and is made of a conductive composition and has a shape that does not change in the direction of the axis, having an axis that coincides with the lamination direction. The body may be further provided. This interlayer connection body is still another example of the interlayer connection body that penetrates the first insulating layer different from the second insulating layer in which the first component is embedded, and for example, penetrates the first insulating layer. It is an interlayer connection body formed by filling a hole to be filled with a conductive composition.

Further, as an embodiment, the outer layer wiring pattern is provided at least on the lower surface on the first insulating layer, and penetrates the first insulating layer to form the surface of the wiring pattern and the lower surface. An interlayer connection body sandwiched between the outer layer wiring pattern and made of metal and having an axis that coincides with the laminating direction and having a shape in which the diameter does not change in the axis direction. You may do it. This interlayer connection body is still another example of the interlayer connection body that penetrates the first insulating layer different from the second insulating layer in which the first component is embedded, for example, a conductor formed by metal plating. This is an interlayer connection body derived from a bump.

  As an embodiment, the surface of the first component on the side opposite to the side of the first component where the first component is connected to the inner layer wiring pattern by the solder portion is exposed. , And can be. It is the structure which suppressed thickness as much as possible as the wiring board part of a component mounting module.

  As an embodiment, the surface of the first component on the side opposite to the side of the first component where the first component is connected to the inner layer wiring pattern by the solder portion is the second portion. It may be hidden by an insulating layer. The built-in component (first component) is completely confined inside.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of a component mounting module according to an embodiment of the present invention. As shown in FIG. 1, this component mounting module includes an insulating layer 11 (first insulating layer), 12, 12, 13, 14 (second insulating layer at 12, 13, 14, 15). , Protective films 16 and 17, wiring layer 21 (outer layer wiring pattern), 22 (inner layer wiring pattern), 23 (second inner layer wiring pattern), 24 (wiring pattern), 25 (wiring pattern), 26 (outer layer wiring pattern) (= 6 layers in total), interlayer connector 31, 32, 34, 35, through-hole conductor 33, chip component 41 (first component), solder part 42, bonding wire connection Corresponding chip component 51 (second component), non-conductive adhesive 52, bonding wire 53 (connection member), and mold resin (or potting resin) 54 are provided.

  Here, the chip component 41 is, for example, a chip capacitor, and its planar size is, for example, 0.6 mm × 0.3 mm. Terminals (electrodes) are provided at both ends, and the lower side thereof is opposed to a land for mounting a built-in component by the wiring layer 22. The terminals of the chip component 41 and the mounting lands are electrically and mechanically connected by the solder portion 42. The solder part 42 is, for example, lead-free solder (Sn-3Ag-0.5Cu: melting point 210 ° C. to 217 ° C.).

  The wiring layers 21 and 26 are outer wiring layers, and the wiring layers 22, 23, 24 and 25 different from the wiring layers are inner wiring layers. In order, the insulating layer 11 is between the wiring layer 21 and the wiring layer 22, the insulating layer 12 is between the wiring layer 22 and the wiring layer 23, and the insulating layer 13 is between the wiring layer 23 and the wiring layer 24. The insulating layer 14 is located between the wiring layer 25 and the wiring layer 25, and the insulating layer 15 is located between the wiring layer 25 and the wiring layer 26, and the wiring layers 21 to 26 are separated from each other. Each of the wiring layers 21 to 26 is formed by patterning, for example, a metal (copper) foil having a thickness of 18 μm.

  The inner wiring layers 22 to 25 are positioned so as to sink into the insulating layer 12 or the insulating layer 14 side, and there is no sinking of the wiring layer into the insulating layers 11, 13, and 15. This is based on the manufacturing process, and the wiring layers 22 and 25 may be in different subsidence positions due to differences in the manufacturing process (described later).

  Each of the insulating layers 11 to 15 is a rigid material made of, for example, a glass epoxy resin, each having a thickness of 100 μm, for example, only the insulating layer 13 has a thickness of, for example, 300 μm, excluding the insulating layer 13. In particular, the insulating layer 13 has an opening at a position corresponding to the built-in chip component 41, and provides a space for incorporating the chip component 41. The insulating layers 12 and 14 are deformed so as to fill the opening of the insulating layer 13 for the built-in chip component 41 and the space inside the through-hole conductor 33 of the insulating layer 13 and become voids inside. There is no space.

The wiring layer 21 and the wiring layer 22 can be conducted by an interlayer connector 31 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 11. Similarly, the wiring layer 22 and the wiring layer 23 can be conducted by an interlayer connector 32 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 12. The wiring layer 23 and the wiring layer 24 can be conducted by a through-hole conductor 33 provided through the insulating layer 13. The wiring layer 24 and the wiring layer 25 can be conducted by an interlayer connector 34 that is sandwiched between the surfaces of these patterns and penetrates the insulating layer 14. The wiring layer 25 and the wiring layer 26 may be conducted by the interlayer connectors 35 penetrating the sandwiched by and insulating layer 15 between the surfaces of the patterns.

  The interlayer connectors 31, 32, 34, and 35 are derived from conductive bumps formed by screen printing of a conductive composition, respectively, and depend on the manufacturing process in the axial direction (shown in FIG. 1). The diameter changes in the upper and lower stacking directions). The diameter is, for example, 200 μm on the thick side.

  On the insulating layers 11 and 15 provided with the outer wiring layers 21 and 26, protective films 16 and 17 are respectively formed for the purpose of preventing the wiring layers 21 and 26 from being exposed. The protective films 16 and 17 may generally be made of the same material as the solder resist. Each thickness is, for example, 20 μm.

  On the insulating layer 15 provided with the outer wiring layer 26, a chip component 51 corresponding to bonding wire connection is mounted. For electrical connection of the chip component 51 to the outer wiring layer 26, lands are formed in the outer wiring layer 26, and as shown in the drawing, the protective film 17 is formed avoiding the lands. The land of the outer wiring layer 26 and the terminal (electrode) of the chip component 51 are electrically connected by a bonding wire 53 made of, for example, gold (Au). A non-conductive adhesive 52 is applied between the protective film 17 and the chip 51 to mechanically fix the chip component 51.

  The mold resin 54 is formed in an island shape so as to cover the chip component 51, the bonding wire 53, and the land of the outer wiring layer 26 in order to physically and chemically protect the lands of the outer layer wiring layer 26 from the external environment. The mold resin 54 can be generally formed by, for example, transfer molding, but instead, a potting resin obtained by dripping and curing a liquid or paste-like resin may be used. Depending on the application, there may be an aspect without the mold resin 54 (or potting resin), such as the specification of environmental resistance is not strict.

  More specifically, the chip component 51 may be an electronic component such as a semiconductor chip (bare chip) having a bonding wire connection-compatible capacitor or resistor, or a bonding pad. Needless to say, the chip component 51 may be mounted on the insulating layer 11 provided with the outer wiring layer 21 or may be mounted on both sides. Further, there is no limit on the number of chip parts 51.

  The component mounting module described above fixes the built-in chip component 41 by connecting and mounting the chip component 51 with a bonding wire on the insulating layer 15 (11) provided with the outer wiring layer 26 (21). The solder portion 42 is not melted again when the chip component 51 is mounted. This is because the application temperature of the wire bonding process is, for example, about 150 ° C. and is considerably lower than the melting point of the material of the solder part 42. Therefore, it is possible to prevent a decrease in reliability due to remelting of the solder part 42 for connecting the built-in components. It should be noted that the mold resin 54 (or potting resin) or the non-conductive adhesive 52 usually requires a certain high temperature (for example, in the case of thermosetting), but this temperature is set to 200 ° C. or less depending on the material selection. There is not much difficulty.

  Further, in the present embodiment, since the built-in mounting of the component is performed by solder and the mounting on the surface is performed by the bonding wire, management related to the mounting process can be separated and more efficient manufacturing can be realized. In other words, when solder mounting and bonding wire mounting are mixed as a surface mounting process, the bonding land must not be contaminated by solder or flux, and advanced condition management is required for soldering, Alternatively, a cleaning process with a high cleanliness is required. In the said embodiment, the problem which requires such a complicated, advanced, and complicated process is not caused.

  Next, the manufacturing process of the component mounting module shown in FIG. 1 will be described with reference to FIGS. 2 to 4 are process diagrams schematically showing a part of the manufacturing process of the component mounting module shown in FIG. In these figures, the same or equivalent components as those shown in FIG.

  It demonstrates from FIG. FIG. 2 shows a manufacturing process of a portion centering on the insulating layer 11 in each configuration shown in FIG. First, as shown in FIG. 2 (a), a paste-like conductive composition to be an interlayer connection 31 is formed on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm, for example, by screen printing. It is formed in a bump shape (bottom diameter, for example, 200 μm, height, for example, 160 μm). This conductive composition is obtained by dispersing fine metal particles such as silver, gold and copper or fine carbon particles in a paste-like resin. For convenience of explanation, printing is performed on the lower surface of the metal foil 22A, but it may be printed on the upper surface (the following drawings are also the same). After the interlayer connector 31 is printed, it is dried and cured.

  Next, as shown in FIG. 2B, an FR-4 prepreg 11A having a thickness of, for example, 100 μm is laminated on the metal foil 22A to penetrate the interlayer connector 31, so that the head is exposed. To do. At the time of exposure or afterwards, the tip thereof may be crushed by plastic deformation (in any case, the shape of the interlayer connection body 31 is a shape having an axis coinciding with the stacking direction and the diameter changing in the axial direction). Subsequently, as shown in FIG. 2 (c), a metal foil (electrolytic copper foil) 21A is laminated on the prepreg 31A, and the whole is integrated by pressing and heating. At this time, the metal foil 21A is in electrical continuity with the interlayer connector 31, and the prepreg 11A is completely cured to become the insulating layer 11.

  Next, as shown in FIG. 2D, patterning by, for example, well-known photolithography is performed on the metal foil 22A on one side, and this is processed into a wiring pattern 22 including mounting lands. Then, as shown in FIG. 2E, cream solder 42A is printed on the mounting land obtained by the processing, for example, by screen printing. The cream solder 42A can be easily printed in a predetermined pattern by using screen printing. A dispenser can be used instead of screen printing.

  Next, the chip component 41 is placed on the mounting land through the cream solder 42A, for example, by a mounter, and then the cream solder 42A is reflowed in, for example, a reflow furnace. Thereby, as shown in FIG. 2 (f), the wiring board material 1 in a state in which the chip component 41 is connected to the mounting land of the wiring layer 22 through the solder portion 42 is obtained. A subsequent process using the wiring board material 1 will be described later with reference to FIG.

  Next, a description will be given with reference to FIG. FIG. 3 shows a manufacturing process of a part centering on the insulating layer 13 and the same 12 in each configuration shown in FIG. First, as shown in FIG. 3A, for example, an FR-4 insulating layer 13 having a thickness of, for example, 300 μm in which metal foils (electrolytic copper foils) 23A and 24A having a thickness of 18 μm are laminated on both surfaces is prepared. A through-hole 62 for forming a through-hole conductor is formed at a predetermined position, and an opening 61 is formed in a portion corresponding to the chip component 41 to be incorporated.

  Next, electroless plating and electrolytic plating are performed to form a through-hole conductor 33 on the inner wall of the through-hole 62 as shown in FIG. At this time, a conductor is also formed on the inner wall of the opening 61. Further, as shown in FIG. 3C, the metal foils 23A and 24A are patterned in a predetermined manner using well-known photolithography to form wiring layers 23 and 24. By patterning the wiring layers 23 and 24, the conductor formed on the inner wall of the opening 61 is also removed.

  Next, as shown in FIG. 3D, conductive bumps (bottom diameter, for example, 200 μm, height, for example, 160 μm) to be the interlayer connector 32 are formed at predetermined positions on the wiring layer 23 with the paste-like conductive composition. It is formed by screen printing. Subsequently, as shown in FIG. 3E, an FR-4 prepreg 12A (nominal thickness, for example, 100 μm) to be the insulating layer 12 is laminated on the wiring layer 23 side using a press. The prepreg 12 </ b> A is previously provided with an opening corresponding to the built-in chip component 41, similar to the insulating layer 13.

  In this lamination process, the head of the interlayer connector 32 is passed through the prepreg 12A. In addition, the broken line of the head part of the interlayer connection body 32 in FIG. 3 (e) indicates that there are both cases where the head part is plastically deformed and crushed at this stage and when it is not plastically deformed. By this step, the wiring layer 23 is located by sinking to the prepreg 12A side. The wiring board material obtained as described above is referred to as a wiring board material 2.

  Note that the process shown in FIG. 3 can be performed as follows. In the stage of FIG. 3A, only the through hole 62 is formed, and the subsequent steps from FIG. 3B to FIG. 3D are performed without forming the opening 61 for the built-in component. Next, as a process corresponding to FIG. 3E, prepreg 12A (without opening) is stacked. And it is the process of forming simultaneously the opening part for components incorporation in the insulating layer 13 and the prepreg 12A.

  Next, a description will be given with reference to FIG. FIG. 4 is a diagram (FIG. 4A) showing an arrangement relationship in which the wiring board materials 1 and 2 obtained as described above are laminated, and a diagram showing a state after the lamination integration (FIG. 4B). It is. In FIG. 4A, the upper wiring board material 3 shown in FIG. 4 applies the same process as the lower wiring board material 1, and then the interlayer connector 34 and the prepreg 14A are connected to the intermediate wiring board material 2 shown in FIG. It is formed in the same manner as the interlayer connector 32 and the prepreg 12A. However, there is no component (chip component 41) and no part (mounting land) for connecting it, and the prepreg 14A is not provided with an opening for the chip component 41. Other than that, the metal foil (electrolytic copper foil) 26A, the insulating layer 15, the interlayer connection body 35, the wiring layer 25, the prepreg 14A, and the interlayer connection body 34 are the metal foil 21A of the wiring board material 1, the insulating layer 11, and the interlayer connection, respectively. The same as the body 31, the wiring layer 22, the prepreg 12 </ b> A of the wiring board material 2, and the interlayer connection body 32.

  Each wiring board material 1, 2, and 3 is laminated | stacked by arrangement | positioning as shown to Fig.4 (a), and it pressurizes and heats with a press. Thereby, the prepregs 12A and 14A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 12 </ b> A and 14 </ b> A obtained by heating, the prepregs 12 </ b> A and 14 </ b> A are deformed into the space around the chip component 41 and the space inside the through-hole conductor 33, and no gap is generated. The wiring layers 22 and 24 are electrically connected to the interlayer connectors 32 and 34, respectively.

  After this lamination step, the upper and lower metal foils 26A, 21A are patterned in a predetermined manner using well-known photolithography to form outer wiring layers 26, 21. Further, protective films 16 and 17 are formed on the outer wiring layers 26 and 21 and the insulating layers 15 and 11 except for a land region for mounting the chip component 51. As a result, the state shown in FIG. 4B (the state of the component built-in wiring board) is obtained. The land region for mounting the chip component 51 may be appropriately subjected to surface treatment (for example, nickel plating treatment and gold plating treatment) for use in bonding.

  Next, a mounting process of the chip component 51 is performed. That is, for example, the nonconductive adhesive 52 is applied on the protective film 17 corresponding to the mounting position of the chip component 51, and then the chip component 51 is placed on the nonconductive adhesive 52 with a mounter, for example. Then, the non-conductive adhesive 52 is cured by heat, for example, and a wire bonding process is performed to connect the land of the wiring layer 26 and the pad on the chip component 51 with the bonding wire 53. Finally, a mold resin 54 is formed so as to cover at least the lands of the chip component 51, the bonding wire 53, and the outer wiring layer 26. As described above, the component mounting module as shown in FIG. 1 can be obtained.

  As a modification, the through-hole conductor 33 provided in the intermediate insulating layer 13 can naturally have a configuration similar to the interlayer connector 31 or 32. In addition, the outer wiring layers 21 and 26 are formed at the stage of each wiring board material 1 and 3 (for example, at the stage of FIG. 2D) other than being obtained by patterning after the final lamination process. May be.

  4A, for the wiring board materials 1 and 2, the prepreg 12A and the interlayer connector 32 are provided not on the wiring board material 2 side but on the wiring board material 1 side. You may make it leave. That is, the formation of the interlayer connector 32 and the lamination of the prepreg 12A are performed in advance on the wiring layer 22 (on the insulating layer 11) of the wiring board material 1. In this case, the mounted chip component 41 seems to be an interference factor when the interlayer connection body 32 is formed by screen printing at first glance. However, when the chip component 41 is a sufficiently thin component, what is actually an interference factor? Don't be. In the step of laminating the prepreg 12A, the prepreg 12A can be laminated uniformly in the in-plane direction by pressing and heating with a cushioning material capable of absorbing the thickness of the chip component 41 interposed therebetween.

  Next, a component mounting module according to another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing the configuration of a component mounting module according to another embodiment of the present invention. Components that are the same as or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is attached. The description of the part is omitted unless there is an additional matter.

  In this embodiment, the electronic component 51A is used as a component for surface mounting, and the back surface (the surface without the bonding pad) of the electronic component 51A and a partial pattern by the wiring layer 26 are electrically connected by the conductive adhesive 52A. is doing. This is suitable, for example, when the electronic component 51A is a component having a semiconductor substrate and the potential of the substrate needs to be fixed to a predetermined potential (for example, ground potential). Or, it is suitable for the case of electronic components that pass current through a semiconductor substrate (often used in power MOS transistors).

  As a manufacturing process, the protective film 17 is not formed in a region of the wiring layer 26 to which the conductive adhesive 52A is applied in addition to a region to be a land. Thereafter, the same process as in the above embodiment may be applied using the conductive adhesive 52 </ b> A instead of the non-conductive adhesive 51. The curing process of the conductive adhesive 52A usually requires a certain amount of high temperature (for example, in the case of thermosetting), but there is not much difficulty in setting this temperature to 200 ° C. or less by selecting a material. Therefore, even in the curing process of the conductive adhesive 52A, there is no decrease in reliability due to remelting of the solder part 42 for connecting the built-in component.

  Next, a component mounting module according to still another embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing the configuration of a component mounting module according to still another embodiment of the present invention. Components that are the same as or equivalent to the components shown in the already described drawings are denoted by the same reference numerals. Is attached. The description of the part is omitted unless there is an additional matter.

  In this embodiment, the chip component 51 is mounted on the wiring layer 26 by flip-chip connection. That is, since the chip component 51 is compatible with bonding wire connection, flip chip connection using the flip chip connection bump 55 (connection member) is used for electrical connection between the pad and the land of the wiring layer 26. The bump 55 is a bump made of, for example, gold (Au) similar to the bonding wire 53. Note that it is preferable that the land of the wiring layer 26 to which the bumps 55 are connected be appropriately subjected to surface treatment (for example, nickel plating treatment and gold plating treatment) in order to achieve strong solid-phase connection.

  An underfill resin 52B is filled between the chip component 51 and the insulating layer 15 in order to physically and chemically protect the flip chip connecting portion and to firmly mechanically fix the chip component 51. Such a filling can be achieved by applying a liquid or paste resin on the land in advance before mounting the chip component 51 on the land of the wiring layer 26 as a manufacturing method. Alternatively, after the chip component 51 is mounted, a liquid resin may be infiltrated into the formed gap by utilizing capillary action.

  The entire chip component 51 is further covered with a mold resin 54 (or potting resin). Depending on the application, there may be a mode without the mold resin 54 (or potting resin), or a mode in which the underfill resin 52B is omitted depending on the application.

  In mounting the chip component 51 by flip chip connection as shown in FIG. 6, heat is applied in the flip chip connection process itself, the curing process of the underfill resin 52B, and the curing process of the mold resin 54. It is possible to set the temperature so as not to reach a temperature at which the solder part 42 for melting is remelted. That is, for example, the temperature can be set to 200 ° C. at the highest, so that a decrease in reliability due to remelting of the solder part 42 for connecting the built-in component can be prevented. For the above flip chip connection, a thermocompression bonding method, an ultrasonic method, or the like can be used.

  In FIG. 6, the mounting of the chip component 51 by flip chip connection may be mixed with the component mounting by wire bonding as in the previous embodiment. Further, as the chip component 51, it is possible to use a chip part having an electrical connection part by wire bonding inside, but it is also possible to use a chip part 51 having an electrical connection part by solder inside. “Those having an electrical connection portion by solder” include a component built-in wiring board as shown in FIG. That is, this is a case where the component built-in wiring board itself is a mounted component. Even in such a case, it is advantageous that the solder on the mounting component side is not remelted. The same applies to an aspect in which connection by wire bonding is performed using the component built-in wiring board itself as a mounting component.

  For general purposes, chip stack mounting can be easily realized by combining flip-chip connection and connection by wire bonding.

  Next, a component mounting module according to still another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a cross-sectional view schematically showing a configuration of a component mounting module according to still another embodiment of the present invention. Components that are the same as or equivalent to the components shown in the already described drawings are denoted by the same reference numerals. Is attached. The description of the part is omitted unless there is an additional matter.

  This embodiment has interlayer connectors 72 and 74 formed by metal plate etching instead of the interlayer connectors 32 and 34 by printing of the conductive composition. As shown in the drawing, an etching stopper layer remains on the wiring layer 22 side or the wiring layer 25 side of these interlayer connectors 72 and 74. Further, the boundary between the insulating layer 11 (15) and the insulating layer 12 (14) is moved deeper by the thickness of the wiring layer 22 (25) as compared with the embodiment shown in FIG. Other parts are the same as those of the embodiment shown in FIG. Hereinafter, the manufacturing process will be described including the reason for such a configuration.

  FIG. 8 is a process diagram schematically showing a part of the manufacturing process of the component mounting module shown in FIG. 7, and includes the insulating layer 11, the wiring layers 21 and 22 (including the mounting land), and the interlayer in FIG. 7. The manufacturing process of the part of the connection bodies 31 and 72 is shown. The manufacturing process of the insulating layer 15, the wiring layers 25 and 26, and the interlayer connectors 35 and 74 in FIG. In addition, the same code | symbol is attached | subjected to the same or equivalent thing as the component shown in FIG.

  First, for example, a laminated film in which a layer (etching stopper layer ES) made of, for example, a nickel alloy having a very thin thickness, for example, 2 μm, is prepared on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm is prepared, and this etching stopper layer ES is prepared. A metal plate (copper plate) 72A having a thickness of 120 μm, for example, is laminated and integrated on the side to obtain a clad material having a three-layer structure as shown in FIG.

  Next, as shown in FIG. 8B, the metal foil 22A is patterned in a predetermined pattern with an etchant that can etch only copper using well-known photolithography. Thereby, the wiring layer 22 is formed. Further, as shown in FIG. 8C, an interlayer connection 31 is formed at a predetermined position on the wiring layer 22 by screen printing of a paste-like conductive composition. Subsequently, as shown in FIG. 8D, the prepreg 11A to be the insulating layer 11 is laminated on the wiring layer 22 side using a press machine. At this time, the head of the interlayer connector 31 is made to penetrate the prepreg 11A. By this lamination process, the wiring layer 22 sinks to the prepreg 11A side and is positioned. Note that the broken line at the head of the interlayer connector 31 in FIG. 8D indicates that there are both cases where the head of the interlayer connector 31 is plastically deformed and crushed at this stage and when it is not plastically deformed. .

  Next, a metal foil (electrolytic copper foil) 21A having a thickness of 18 μm, for example, is arranged on the laminated prepreg 11A, and is pressed and heated in the laminating direction by a press. As a result, as shown in FIG. 8E, the prepreg 11A is completely cured to become the insulating layer 11 and laminated and integrated. At this time, the metal foil 21A is electrically connected to the interlayer connector 31.

  Next, an etching resist at a predetermined position is formed on the metal plate 72A. This etching resist is left where the interlayer connector 72 is to be formed by etching. Then, etching is performed using an etchant capable of etching only copper, and an interlayer connector 72 is formed by etching a metal plate as shown in FIG. The shape varies depending on the shape and size of the etching resist and the etching processing time. Generally, the shape has an axis that coincides with the stacking direction, and the diameter changes in the direction of the axis.

  Then, by etching away the etching stopper layer ES using the formed interlayer connector 72 as a mask, a wiring board material having a form as shown in FIG. 8G can be obtained. As the following steps, the mounting of the chip component 41 shown in FIG. 2E and the following, and the lamination of the prepreg 12A shown in FIG. 3E (however, the prepreg 12A is the wiring layer 22 in FIG. 8G). Layer). The obtained wiring board material can be used in place of the lower wiring board material 1 in the laminating process shown in FIG. As the intermediate wiring board material 2, the one without the formation of the interlayer connector 32 and the lamination of the prepreg 12 </ b> A is used. After the above stacking process, the component mounting module shown in FIG. 7 can be obtained by performing the mounting process of the chip component 51.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 9 is a cross-sectional view schematically showing the configuration of a component mounting module (but before mounting the chip component 51) according to still another embodiment of the present invention. Components that are the same as or equivalent to the components shown in the drawings already described are denoted by the same reference numerals. The description of the part is omitted unless there is an additional matter. In this embodiment, instead of the interlayer connection bodies 31 and 35 of the component mounting module shown in FIG. 1, the interlayer connection body is made of metal and has an axis that coincides with the stacking direction and has a shape whose diameter changes in the axial direction. 81 and 85 are used. Other parts are the same as those of the embodiment shown in FIG.

  Hereinafter, the manufacturing process of the embodiment shown in FIG. 9 will be described with reference to FIG. FIG. 10 is a process diagram schematically showing a partial manufacturing process of the component mounting module shown in FIG. 9 (but before mounting of the chip component 51). The wiring layer 22 (more precisely, the wiring layer 22 is processed). The manufacturing process of the part which consists of the metal foil 22A) and the interlayer connection body 81 which are made is shown.

  First, for example, a laminated film in which a layer (etching stopper layer ES) made of, for example, a nickel alloy having a very thin thickness, for example, 2 μm, is prepared on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm is prepared, and this etching stopper layer ES is prepared. A metal plate (copper plate) 81A is laminated and integrated on the side to obtain a clad material having a three-layer structure as shown in FIG. Then, an etching mask 89 is formed at a predetermined position on the metal plate 81A.

  Next, the three-layer clad metal plate 81A on which the etching mask 89 is formed is etched with an etchant that can etch only copper. Thereby, as shown in FIG. 10B, an interlayer connection 81 can be obtained. Then, the etching stopper layer ES is removed by etching using the formed interlayer connector 81 as a mask. As a result, the material shown in FIG. 10C is obtained. In the following steps, the material shown in FIG. 10C may be replaced with the material shown in FIG. 2A, and the steps shown in FIG. The above description is the same for the portion composed of the wiring layer 25 and the interlayer connector 85.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 11 is a cross-sectional view schematically showing a configuration of a component mounting module (but before mounting of the chip component 51) according to still another embodiment of the present invention. In FIG. 11, the same or equivalent parts as those already described are denoted by the same reference numerals, and the description thereof is omitted. In this embodiment, instead of the interlayer connection bodies 31 and 35 of the component mounting module shown in FIG. Interlayer connectors 91 and 95 are used. Other parts are the same as those of the embodiment shown in FIG.

  Hereinafter, the manufacturing process of the component mounting module shown in FIG. 11 will be described with reference to FIG. FIG. 12 is a process diagram schematically showing a partial manufacturing process of the component mounting module shown in FIG. 11 (but before mounting the chip component 51) in a cross-sectional view. The insulating layer 11 and the wiring layers 21, 22 on both sides thereof are shown in FIG. The manufacturing process of the part of the interlayer connector 91 that penetrates the insulating layer 11 is shown.

  First, as shown in FIG. 12A, for example, a predetermined position of a prepreg 11A having a nominal thickness of 100 μm is drilled, and the inside of the hole is filled with a conductive composition to form an interlayer connector 91. Next, as shown in FIG. 12B, metal foils (electrolytic copper foils) 21A, 22A having a thickness of 18 μm, for example, are laminated on both surfaces of the prepreg 11A, and are integrated by pressing and heating. By this lamination and integration, the respective metal foils 21A and 22A establish electrical continuity with the interlayer connector 91, and the prepreg 11A is completely cured to become the insulating layer 11.

  Next, as shown in FIG. 12C, the metal foil 22A on one side is subjected to patterning by, for example, well-known photolithography, and processed into a wiring layer 22 (including mounting lands). Then, the material shown in FIG. 12C is used instead of the material shown in FIG. 2D, and the subsequent steps are the same as those described in FIG. The above description is the same for the insulating layer 15, the wiring layers 25 and 26 on both sides thereof, and the portion of the interlayer connector 95 that penetrates the insulating layer 15.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 13 is a cross-sectional view schematically showing a configuration of a component mounting module (but before mounting the chip component 51) according to still another embodiment of the present invention. In FIG. 13, parts that are the same as or equivalent to those already described are given the same reference numerals, and descriptions thereof are omitted. In this embodiment, instead of the interlayer connection bodies 31 and 35 of the component mounting module shown in FIG. 1, the interlayer connection body is made of metal and has a shape that has an axis that coincides with the stacking direction and does not change in diameter in the axial direction. 101 and 105 are used. Other parts are the same as those of the embodiment shown in FIG.

  Hereinafter, the manufacturing process of the component mounting module shown in FIG. 13 will be described with reference to FIG. FIG. 14 is a process diagram schematically showing a partial manufacturing process of the component mounting module shown in FIG. 13 (but before mounting of the chip component 51) in the cross section. In the above description, the wiring layer 22 (more strictly, The manufacturing process of the part which consists of the metal foil 22A) processed into the wiring layer 22 and the interlayer connection body 101 is shown.

  First, as shown in FIG. 14A, a plating prevention mask 109 having a mask removal portion 109A at a predetermined position is formed on a metal foil (electrolytic copper foil) 22A having a thickness of 18 μm, for example. The shape of the mask removal unit 109A is, for example, a substantially cylindrical shape. Next, an electrolytic plating process is performed on the plating prevention mask 109 side using the metal foil 22A as an electric supply path, and as shown in FIG. 14B, for example, a copper plating layer is grown in the mask removal portion 109A. This grown plating layer becomes the interlayer connection body 101. After the plating layer is grown, the plating blocking mask 109 is removed to obtain a material as shown in FIG. In the following steps, the material shown in FIG. 14C may be replaced with the material shown in FIG. 2A, and the steps shown in FIG. The above description is the same for the portion composed of the wiring layer 25 and the interlayer connector 104.

  9 to 14, the part of the double-sided wiring board comprising the insulating layer 11 and the wiring layers 21 and 22 on both sides thereof, and the part of the double-sided wiring board comprising the insulating layer 15 and the wiring layers 25 and 26 on both sides thereof are shown. The examples are shown from the viewpoint of the structure of the interlayer connector. Of course, a double-sided wiring board having an interlayer connection other than those described above may be used. For example, the interlayer connection body may be a well-known through-hole inner wall conductor formed by a drilling and plating process. Furthermore, a double-sided wiring board having various other configurations of the interlayer connector can be used.

  Next, still another embodiment of the present invention will be described with reference to FIG. FIG. 15 is a cross-sectional view schematically showing a configuration of a component mounting module according to still another embodiment of the present invention. In FIG. 15, parts that are the same as or equivalent to those already described are given the same reference numerals, and descriptions thereof are omitted. In this embodiment, the component mounting module shown in FIG. 1 does not have a portion above the insulating layer 14 (interlayer connector 34, wiring layer 25, insulating layer 15, interlayer connector 35, wiring layer 26). With this, the side opposite to the mounting side of the chip component 41 is exposed. As a component mounting module, the thickness is suppressed as much as possible. The component 51 is mounted on the surface on the insulating layer 11 side. Of course, the component 51 can be mounted on the surface on the insulating layer 13 side.

  FIG. 16 is a process diagram schematically showing a part of the manufacturing process of the component mounting module shown in FIG. Components that are the same as or equivalent to the components shown in the drawings already shown are denoted by the same reference numerals. FIG. 16 shows a stacking process corresponding to FIG. 4A, and as shown, the same wiring board materials 1 and 2 as those described with reference to FIGS. 1 to 4 can be used.

  In this lamination step, a release sheet 141 is used on the upper side of the lamination. As a result, a slight protrusion such as the wiring layer 24 is absorbed on the upper side surface so that the release sheet 141 adheres. The prepreg 12 </ b> A obtains fluidity by heating at the time of lamination, and the prepreg 12 </ b> A deforms and enters the space around the chip component 41 and the space inside the through-hole conductor 33. After the lamination process, the release sheet is removed. The height of the chip component 41 is adjusted to the upper side of the insulating layer 13, and thereby the surface of the chip component 41 is exposed.

  After this laminating step, the outer wiring layer 21 is formed by predetermined patterning of the metal foil 21A on the lower surface using well-known photolithography. Further, the protective film 16 is formed on the outer wiring layer 21 and the insulating layer 11 except for the land region for mounting the chip component 51. A protective film 17 is formed so as to cover at least the wiring layer 24 and the insulating layer 13 to be protected. Thereafter, the chip component 51 is mounted in the same manner as the embodiment shown in FIGS. Thereby, a component mounting module as shown in FIG. 15 can be obtained.

1 is a cross-sectional view schematically showing a configuration of a component mounting module according to an embodiment of the present invention. Process drawing which shows a part of manufacturing process of the component mounting module shown in FIG. 1 with a typical cross section. Process drawing which shows another part of manufacturing process of the component mounting module shown in FIG. 1 with a typical cross section. FIG. 10 is a process diagram schematically showing still another part of the manufacturing process of the component mounting module shown in FIG. 1. Sectional drawing which shows typically the structure of the component mounting module which concerns on another embodiment of this invention. Sectional drawing which shows typically the structure of the component mounting module which concerns on another embodiment of this invention. Sectional drawing which shows typically the structure of the component mounting module which concerns on another embodiment of this invention. Process drawing which shows a part of manufacturing process of the component mounting module shown in FIG. 7 with a typical cross section. Sectional drawing which shows typically a part of structure of the component mounting module which concerns on another embodiment of this invention. Process drawing which shows a part of manufacturing process of the component mounting module (however, before mounting of the chip component 51) shown in FIG. 9 with a typical cross section. Sectional drawing which shows typically a part of structure of the component mounting module which concerns on another embodiment of this invention. FIG. 12 is a process diagram schematically showing a part of a manufacturing process of the component mounting module shown in FIG. 11 (but before mounting the chip component 51). Sectional drawing which shows typically a part of structure of the component mounting module which concerns on another embodiment of this invention. FIG. 14 is a process diagram schematically showing a part of a manufacturing process of the component mounting module shown in FIG. 13 (but before mounting the chip component 51). Sectional drawing which shows typically the structure of the component mounting module which concerns on another embodiment of this invention. FIG. 16 is a process diagram schematically showing a part of a manufacturing process of the component mounting module shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring board material, 2 ... Wiring board material, 3 ... Wiring board material, 11 ... Insulating layer, 11A ... Prepreg, 12 ... Insulating layer, 12A ... Prepreg, 13 ... Insulating layer, 14 ... Insulating layer, 14A ... Prepreg, DESCRIPTION OF SYMBOLS 15 ... Insulating layer, 16, 17 ... Protective film, 21 ... Wiring layer (outer layer wiring pattern), 21A ... Metal foil (copper foil), 22 ... Wiring layer (inner layer wiring pattern), 22A ... Metal foil (copper foil), 23 ... wiring layer (second inner layer wiring pattern), 23A ... metal foil (copper foil), 24 ... wiring layer (wiring pattern), 24A ... metal foil (copper foil), 25 ... wiring layer (wiring pattern), 26 ... Wiring layer (outer layer wiring pattern), 26A ... Metal foil (copper foil), 31 ... Interlayer connection (conductive bump by conductive composition printing), 32 ... Interlayer connection (conductive bump by conductive composition printing) 33 ... through-hole conductor, 34 ... layer Connection body (conductive bump by conductive composition printing), 35 ... interlayer connection body (conductive bump by conductive composition printing), 41 ... chip part (first part), 42 ... solder part, 42A ... cream Solder, 51... Chip component (second component) corresponding to bonding wire connection, 51 A. Electronic component (second component), 52... Non-conductive adhesive, 52 A... Conductive adhesive, 52 B. 53: Bonding wire (connection member), 54: Mold resin (or potting resin), 55: Bump for flip chip connection (connection member), 61: Opening, 62: Through hole, 72, 74 ... Interlayer connection body (metal) Metal bumps formed by plate etching), 72A ... Metal plate (copper plate), 81, 85 ... Interlayer connector (metal bumps formed by metal plate etching), 81A ... Metal plate (copper plate), 89 ... etching mask, 91,95 ... interlayer connection (filled with conductive composition), 101,105 ... interlayer connection (conductor bump formed by plating), 109 ... plating prevention mask, 109A ... mask removal part, 141 ... release sheet, ES ... etching stopper.

Claims (11)

A first insulating layer;
A second insulating layer positioned in a stack with respect to the first insulating layer;
A first component that is a component embedded in the second insulating layer;
An inner layer wiring pattern including a first land for electrically connecting the first component, which is provided between the first insulating layer and the second insulating layer;
A solder portion for connecting and fixing the first component to the first land of the inner wiring pattern;
Is said first insulating layer, said second insulating layer not side facing outwardly the lower surface as the surface of the second insulating layer, the surface of the outer not side opposed to the first insulating layer And an outer layer wiring pattern including a second land for electrically connecting a second component, which is a component positioned on the upper and lower surfaces, defined on the upper and lower surfaces defined by the upper surface. ,
Component mounting module comprising said second component, all components were located on the top and bottom surfaces, only the connecting member material is not a solder, characterized in that it is electrically connected to the outer-layer wiring pattern .   2. The component mounting module according to claim 1, wherein the connecting member is provided with either a bonding wire or a bump made of a non-solder material for performing flip chip connection. Part of the second part, as the connecting member, according to claim 2, characterized that you have been electrically connected to the outer-layer wiring pattern by using the bonding wire and the conductive adhesive separately The component mounting module described. The second insulating layer is a stack of at least two insulating layers;
A second inner layer wiring pattern provided between the at least two insulating layers;
A part of the second insulating layer in the stacking direction is interposed between the surface of the inner layer wiring pattern and the surface of the second inner layer wiring pattern, and is made of a conductive composition, and is stacked in the stacking direction 2. The component mounting module according to claim 1, further comprising: an interlayer connector having a shape that has an axis that coincides with the first axis and has a diameter that changes in a direction of the axis. The second insulating layer is a stack of at least two insulating layers;
A second inner layer wiring pattern provided between the at least two insulating layers;
The second insulating layer penetrates a part in the stacking direction and is sandwiched between the surface of the inner layer wiring pattern and the surface of the second inner layer wiring pattern, and is made of metal and coincides with the stacking direction. The component mounting module according to claim 1, further comprising: an interlayer connection body having a shaft and a shape whose diameter changes in a direction of the shaft. The outer layer wiring pattern is provided at least on the lower surface on the first insulating layer;
An axis that penetrates through the first insulating layer and is sandwiched between the surface of the inner layer wiring pattern and the surface of the outer layer wiring pattern on the lower surface, is made of a conductive composition, and coincides with the stacking direction 2. The component mounting module according to claim 1, further comprising an interlayer connection body having a shape having a diameter that changes in a direction of the axis. The outer layer wiring pattern is provided at least on the lower surface on the first insulating layer;
An axis that penetrates the first insulating layer and is sandwiched between the surface of the inner layer wiring pattern and the surface of the outer layer wiring pattern on the lower surface, is made of metal, and has an axis that coincides with the stacking direction The component mounting module according to claim 1, further comprising an interlayer connection body having a shape whose diameter changes in a direction of the axis. The outer layer wiring pattern is provided at least on the lower surface on the first insulating layer;
An axis that penetrates through the first insulating layer and is sandwiched between the surface of the inner layer wiring pattern and the surface of the outer layer wiring pattern on the lower surface, is made of a conductive composition, and coincides with the stacking direction The component mounting module according to claim 1, further comprising an interlayer connection body having a shape in which the diameter does not change in the direction of the axis. The outer layer wiring pattern is provided at least on the lower surface on the first insulating layer;
An axis that penetrates the first insulating layer and is sandwiched between the surface of the wiring pattern and the surface of the outer layer wiring pattern on the lower surface, is made of metal, and has an axis that coincides with the stacking direction; The component mounting module according to claim 1, further comprising an interlayer connection body having a shape whose diameter does not change in the axial direction.   The surface of the first component on the side opposite to the side of the first component where the first component is connected to the inner layer wiring pattern by the solder portion is exposed. Item mounting module according to Item 1.   The surface of the first component on the side opposite to the side of the first component where the first component is connected to the inner layer wiring pattern by the solder portion is hidden by the second insulating layer. The component mounting module according to claim 1, wherein:

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