CN104244589B - A kind of method of raising HDI wiring board exposure accuracies - Google Patents
A kind of method of raising HDI wiring board exposure accuracies Download PDFInfo
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- CN104244589B CN104244589B CN201410229472.4A CN201410229472A CN104244589B CN 104244589 B CN104244589 B CN 104244589B CN 201410229472 A CN201410229472 A CN 201410229472A CN 104244589 B CN104244589 B CN 104244589B
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Abstract
The present invention discloses a kind of method of raising HDI wiring board exposure accuracies, including following operation：A. multiple through hole registration holes are drilled with by machine drilling in copper-clad plate logicalnot circuit area；B. the periphery of each through hole registration holes in copper-clad plate, blind hole registration holes group is drilled with by laser drill at the position of no copper layer；C. in exposure process, the film used is provided with through hole target corresponding with through hole registration holes and blind hole registration holes and blind hole target respectively；Before exposure, first pass through through hole registration holes carries out pre- contraposition with through hole target, then is modified contraposition with corresponding blind hole target by blind hole registration holes group.The present invention is aligned using through hole registration holes and blind hole registration holes simultaneously, and the distance for offseting the film is in two kinds of intermediate values of the difference of registration holes skew, so that the skew of the figure of the blind hole machining position obtained after development and through hole machining position is unlikely to excessive.
Description
Technical field
The present invention relates to HDI roads plate production technical field, and in particular to a kind of side of raising HDI wiring board exposure accuracies
Method.
Background technology
HDI is that High Density Interconnectd write a Chinese character in simplified form, and its Chinese full name is high-density interconnection circuit board, in it
Portion makes to be connected with each other between any one sandwich circuit by blind hole, buried via hole, through hole.Its processing method is generally comprised（1）To as internal layer
The pre-treatments such as the cleaning and roughening of the copper-clad plate of core plate；（2）Circuit is formed on each core material：（3）Core material is interior with secondary
Laminate is pressed；（4）Make buried via hole；（5）Circuit is formed on secondary lamina rara externa；（6）Pressing outer layer copper-clad plate；（7）Using laser drilling
Hole method is drilled with blind hole；（7）Through hole is made using Mechanical Method；（8）Make outer-layer circuit.Make core material, secondary lamina rara externa and
During the circuit of lamina rara externa, the error of circuit between each sandwich circuit board obtained by reduction need in advance be drilled with each layer copper-clad plate
Corresponding registration holes, are then provided with alignment target corresponding with registration holes on the film, the registration holes are used in exposure process by phenanthrene
Woods is positioned in copper-clad plate.The Mechanical Method that existing registration holes are typically as holes drilled through operation is drilled with, Mechanical Method drilling with
Laser drilling method its working environment for making blind hole has larger difference, and especially the heat produced by two kinds of boring methods is not
Unanimously, cause copper-clad plate volume that different degrees of harmomegathus occurs because temperature is different in drilling operating.The difference of this volume harmomegathus
The different difference for having triggered through hole and blind hole machining accuracy.And the processing of blind hole is it is generally necessary to be blind hole in exposure imaging operation
Machining position opens a window, and is removed the copper face at the position.Film aligning is carried out using existing registration holes and alignment target, on the film
Blind hole windowing figure can then be shifted on the basis of through hole registration holes.And in early follow-up blind hole manufacturing procedure, due to covering copper
Plate expansion-contraction degree is different when being processed from through hole, and the blind hole for being processed will produce deviation with blind hole machining position, cause to be formed
Circuit deformation, influence wiring board properties of product performance.It is non-especially in trickle, dense wire production
The insulating materials of blind hole machining position is removed because of deviation, will cause product adjacent layer that irreversible damage occurs because of short circuit.
The content of the invention
In view of this, the present invention discloses a kind of method that can effectively improve HDI wiring board exposure accuracies.
A kind of method of raising HDI wiring board exposure accuracies, including following operation：
A. multiple through hole registration holes are drilled with by machine drilling in copper-clad plate logicalnot circuit area；
B. the periphery of each through hole registration holes in copper-clad plate, removes layers of copper, by laser drill in the portion of no copper layer
Position is drilled with blind hole registration holes group；The blind hole registration holes group includes that multiple is looped around the blind hole registration holes of through hole registration holes periphery；
C. in exposure process, the film used is provided with through hole corresponding with through hole registration holes and blind hole registration holes respectively
Target and blind hole target；Before exposure, first passing through through hole registration holes and through hole target carries out pre- contraposition, make through hole target with it is corresponding
Through hole registration holes be in same axis；After pre- contraposition is finished, then carried out with corresponding blind hole target by blind hole registration holes group
Amendment contraposition, makes each blind hole target be in same axis with corresponding blind hole registration holes.
The present invention is drilled with through hole registration holes and blind hole pair by machine drilling method and laser drilling method respectively in copper-clad plate
Position hole, corresponds to the through hole target and blind hole target on the film respectively.Because above two registration holes are respectively adopted Mechanical Method and swash
The processing of light method is obtained, and in process, because copper-clad plate occurs different degrees of volume harmomegathus, two kinds of registration holes can also occur
Different degrees of skew, and then produce offset deviation.And during film aligning is carried out, the present invention is simultaneously using through hole contraposition
Hole and blind hole registration holes are aligned, and the distance for offseting the film is in two kinds of intermediate values of the difference of registration holes skew, so that aobvious
The skew of blind hole machining position and the figure of through hole machining position that movie queen obtains is unlikely to excessive.And processed and blind in follow-up through hole
In hole machined operation, because the wiring board harmomegathus that processing conditions is produced can be eliminated by above-mentioned skew.Multiple blind hole registration holes are constituted
Blind hole registration holes group around through hole registration holes, it can be ensured that the distance that the deviation of film aligning is in skew is in two kinds of contrapositions
The intermediate value of hole deviation.The through hole registration holes and blind hole registration holes are arranged at the logicalnot circuit area in copper-clad plate.So-called line areas
Refer to be formed in copper-clad plate the region of circuit, logicalnot circuit area is usually in line areas periphery, commonly referred to technique edges.Work
Skill side will be removed in the later stage.Before processing blind hole registration holes, also need to remove the layers of copper of blind hole registration holes machining area.
Further, the multiple blind hole registration holes apertures in the blind hole registration holes group are equal；The blind hole registration holes group
In multiple blind hole registration holes centered on the through hole registration holes center of circle, be symmetrically arranged on through hole registration holes periphery；It is described
The ratio between blind hole registration holes aperture and through hole registration holes aperture are 1:31—1.5:31.
By the design of through hole registration holes at the center of blind hole registration holes group, be conducive to further relaxing the deviation of the two, enter one
Step eliminates the two influence of deviation to film aligning precision.
Further, the blind hole registration holes and a times that the spacing of through hole registration holes is blind hole registration holes aperture.
The removal layers of copper includes carrying out pre- copper removal to the layers of copper around logicalnot circuit area through hole registration holes with emery wheel；Removing in advance
The position coating copper removal liquid that copper is finished, blind hole machining position is formed after removing residual copper；Described its raw material of copper removal liquid is included by weight
Ammonium oxalate solution, 1-3 parts of dodecyl-dimethyl amine second lactone and the 0.1-0.5 parts of nonyl phenol of 5-8 parts of concentration for 5% -20%
APEO；Also include being removed using deionized water spray the copper removal liquid cleaning process of residual copper removal liquid after removing residual copper.
The present invention grinds off the layers of copper around through hole registration holes using emery wheel first, and now the region also remains a small amount of residual
Copper.Further to eliminate the influence that residual copper aligns hole machined to blind hole, prevent blind hole registration holes edge roughness, have burr remaining,
The present invention removes trickle residual copper using copper removal liquid.Not high in view of residual amount of copper, the copper removal liquid for reacting excessively violent easily makes to cover
The layers of copper of copper coin line areas is attacked and damaged, the ammonium oxalate solution using a small amount of coating low concentration of the invention, with remaining
Copper forms soluble complex compound, and after being cleaned through deionized water, complex compound just can be removed.Dodecyl-dimethyl amine second lactone
It is commercially available prod with NPE, its effect is the surface-active for improving copper removal position, dodecyl-dimethyl amine
Second lactone is in itself cationic surface active agent, and to reduce its influence to complex reaction, the present invention is especially equipped with nonionic
The surfactant NPE of type.The use of surfactant can also improve residual copper removal liquid elimination efficiency, prevent
Only its influence to subsequent handling.
Before the operation a also includes processing through hole registration holes, the step of logicalnot circuit area coats heat dissipating layer；The heat dissipating layer
Raw material include 10-15 parts of methyl methacrylate, 1-3 parts of alumina powders and 0.5-1 parts of rutile by weight
The potassium chloride powder of the titania powder and 5-10 of phase part.
Also include removing thermal dispersant coatings operation after being drilled with through hole registration holes；The removal thermal dispersant coatings operation includes that copper will be covered
Plate is cooled to 2-3 DEG C, divests thermal dispersant coatings after aeration-drying, then is cleaned and air-dried with 20-30 DEG C of acetone.
Temperature is too high when due to graph exposure produces skew being processing through hole registration holes causes copper-clad plate volume swollen
It is swollen, as long as therefore when reducing mechanical holes drilled through registration holes copper-clad plate temperature, you can effectively reduce the expansion of copper-clad plate volume.But
The overall falling temperature method of copper-clad plate is put on according to water-cooled, air cooling etc., because rate of temperature fall is too high, copper-clad plate is easily caused everywhere
Temperature is inconsistent, and then produces the problems such as warpage, fracture.Therefore, method of the present invention from heat dissipating layer is coated in logicalnot circuit area,
When mechanical holes drilled through is carried out, heat dissipating layer passively carries out heat conduction and heat radiation, and this process is gentle and effective, and copper-clad plate is not susceptible to
Deformation.The effect of methyl methacrylate fixes each component primarily as matrix, when it undergoes phase transition, can absorb big around
The heat of amount plays a part of to alleviate the rising of copper-clad plate temperature as phase transformation ability.Alumina powder, titanium dioxide have
There is heat transfer efficiency higher, it is scattered in methyl methacrylate each several part, the carrying out of above-mentioned reaction can be promoted.Potassium chloride
Hydrolysis further can lower the temperature to copper-clad plate.Above-mentioned aluminum oxide, titanium dioxide and methyl methacrylate, potassium chloride are equal
It is commercially available prod.The various components of heat dissipating layer of the present invention have stability higher at a certain temperature, it can be ensured that its not with
Copper-clad plate reacts, and is also easy to be peeled off from copper-clad plate after carrying out cool drying.Recycle acetone to be cleaned after stripping, can disappear
Except the residual of heat dissipating layer, and acetone highly volatile, just can be removed through air-drying, thus influence to the production of whole HDI wiring boards compared with
It is small.In addition to above-mentioned technical proposal, other operations such as HDI wiring boards of the present invention exposure, development can be realized using prior art.
The present invention relative to prior art, with following beneficial effect：
（1）The present invention is drilled with through hole registration holes and blind hole by machine drilling method and laser drilling method respectively in copper-clad plate
Registration holes, during film aligning is carried out, the present invention is aligned using through hole registration holes and blind hole registration holes simultaneously, is made
The distance of film skew is in two kinds of intermediate values of the difference of registration holes skew, so that the blind hole machining position obtained after development and through hole
The skew of the figure of machining position is unlikely to excessive.
（2）The present invention is designed the size and relative position of blind hole registration holes and through hole registration holes, it is ensured that through two
The film of secondary contraposition its displacement difference can be alleviated, the precision of further post-exposure.
（3）The present invention is provided with heat dissipating layer, while to the structure of heat dissipating layer in mechanical holes drilled through location hole in logicalnot circuit area
Into being optimized, when mechanical holes drilled through is carried out, heat dissipating layer passively carries out heat conduction and heat radiation, and this process is gentle and effective,
Copper-clad plate is not susceptible to deformation；The volumetric expansion of copper-clad plate has been relaxed simultaneously, has further reduced its influence to exposure accuracy.
Specific embodiment
For the ease of it will be appreciated by those skilled in the art that being described in further detail to the present invention below in conjunction with embodiment：
Embodiment 1
A kind of method of raising HDI wiring board exposure accuracies, including following operation：
A. 4 through hole registration holes are drilled with by machine drilling in the logicalnot circuit area of four drift angles of copper-clad plate；
B. the periphery of each through hole registration holes in copper-clad plate, removes layers of copper, by laser drill in the portion of no copper layer
Position is drilled with blind hole registration holes group；The blind hole registration holes group includes 8 blind hole registration holes for being looped around through hole registration holes periphery；
C. in exposure process, the film used is provided with through hole corresponding with through hole registration holes and blind hole registration holes respectively
Target and blind hole target；Before exposure, first passing through through hole registration holes and through hole target carries out pre- contraposition, make through hole target with it is corresponding
Through hole registration holes be in same axis；After pre- contraposition is finished, then carried out with corresponding blind hole target by blind hole registration holes group
Amendment contraposition, makes each blind hole target be in same axis with corresponding blind hole registration holes.
Further, the blind hole registration holes aperture in the blind hole registration holes group is equal；In the blind hole registration holes group
Blind hole registration holes are symmetrically arranged on through hole registration holes periphery centered on the through hole registration holes center of circle；The blind hole contraposition
The ratio between hole aperture and through hole registration holes aperture are 1:31.
The blind hole registration holes and a times that the spacing of through hole registration holes is blind hole registration holes aperture.
Further, the removal layers of copper is pre- including being carried out to the layers of copper around logicalnot circuit area through hole registration holes with emery wheel
Copper removal；The position finished in pre- copper removal coats copper removal liquid, and blind hole machining position is formed after removing residual copper；The copper removal liquid its raw material bag
Include ammonium oxalate solution, 1-3 parts of dodecyl-dimethyl amine second lactone and 0.1- that 5-8 by weight parts of concentration is 5% -20%
0.5 part of NPE；Also include being removed using deionized water spray the residual copper liquid of residual copper removal liquid after removing residual copper
Cleaning process.
Further, before the operation a also includes processing through hole registration holes, the step of heat dissipating layer is coated in logicalnot circuit area
Suddenly；The raw material of the heat dissipating layer by weight include 10-15 parts methyl methacrylate, 1-3 parts of alumina powders and
The potassium chloride powder of the titania powder and 5-10 of 0.5-1 parts of Rutile Type part.
Also include removing thermal dispersant coatings operation after being drilled with through hole registration holes；The removal thermal dispersant coatings operation includes that copper will be covered
Plate is cooled to 2-3 DEG C, divests thermal dispersant coatings after aeration-drying, then is cleaned and air-dried with 20-30 DEG C of acetone.
Embodiment 2
A kind of method of raising HDI wiring board exposure accuracies, including following operation：
A. 4 through hole registration holes are drilled with by machine drilling in the logicalnot circuit area of four drift angles of copper-clad plate；
B. the periphery of each through hole registration holes in copper-clad plate, removes layers of copper, by laser drill in the portion of no copper layer
Position is drilled with blind hole registration holes group；The blind hole registration holes group includes 8 blind hole registration holes for being looped around through hole registration holes periphery；
C. in exposure process, the film used is provided with through hole corresponding with through hole registration holes and blind hole registration holes respectively
Target and blind hole target；Before exposure, first passing through through hole registration holes and through hole target carries out pre- contraposition, make through hole target with it is corresponding
Through hole registration holes be in same axis；After pre- contraposition is finished, then carried out with corresponding blind hole target by blind hole registration holes group
Amendment contraposition, makes each blind hole target be in same axis with corresponding blind hole registration holes.
Further, the blind hole registration holes aperture in the blind hole registration holes group is equal；In the blind hole registration holes group
Blind hole registration holes are symmetrically arranged on through hole registration holes periphery centered on the through hole registration holes center of circle；The blind hole contraposition
The ratio between hole aperture and through hole registration holes aperture are 1.5:31.
The blind hole registration holes and a times that the spacing of through hole registration holes is blind hole registration holes aperture.
Further, the removal layers of copper is pre- including being carried out to the layers of copper around logicalnot circuit area through hole registration holes with emery wheel
Copper removal；The position finished in pre- copper removal coats copper removal liquid, and blind hole machining position is formed after removing residual copper；The copper removal liquid its raw material bag
Include ammonium oxalate solution, 1-3 parts of dodecyl-dimethyl amine second lactone and 0.1- that 5-8 by weight parts of concentration is 5% -20%
0.5 part of NPE；Also include being removed using deionized water spray the residual copper liquid of residual copper removal liquid after removing residual copper
Cleaning process.
Further, before the operation a also includes processing through hole registration holes, the step of heat dissipating layer is coated in logicalnot circuit area
Suddenly；The raw material of the heat dissipating layer by weight include 10-15 parts methyl methacrylate, 1-3 parts of alumina powders and
The potassium chloride powder of the titania powder and 5-10 of 0.5-1 parts of Rutile Type part.
Also include removing thermal dispersant coatings operation after being drilled with through hole registration holes；The removal thermal dispersant coatings operation includes that copper will be covered
Plate is cooled to 2-3 DEG C, divests thermal dispersant coatings after aeration-drying, then is cleaned and air-dried with 20-30 DEG C of acetone.
Embodiment 3
A kind of method of raising HDI wiring board exposure accuracies, including following operation：
A. 4 through hole registration holes are drilled with by machine drilling in the logicalnot circuit area of four drift angles of copper-clad plate；
B. the periphery of each through hole registration holes in copper-clad plate, removes layers of copper, by laser drill in the portion of no copper layer
Position is drilled with blind hole registration holes group；The blind hole registration holes group includes 8 blind hole registration holes for being looped around through hole registration holes periphery；
C. in exposure process, the film used is provided with through hole corresponding with through hole registration holes and blind hole registration holes respectively
Target and blind hole target；Before exposure, first passing through through hole registration holes and through hole target carries out pre- contraposition, make through hole target with it is corresponding
Through hole registration holes be in same axis；After pre- contraposition is finished, then carried out with corresponding blind hole target by blind hole registration holes group
Amendment contraposition, makes each blind hole target be in same axis with corresponding blind hole registration holes.
Further, the blind hole registration holes aperture in the blind hole registration holes group is equal；In the blind hole registration holes group
Blind hole registration holes are symmetrically arranged on through hole registration holes periphery centered on the through hole registration holes center of circle；The blind hole contraposition
The ratio between hole aperture and through hole registration holes aperture are 1:31.
The blind hole registration holes and a times that the spacing of through hole registration holes is blind hole registration holes aperture.
Further, the removal layers of copper is pre- including being carried out to the layers of copper around logicalnot circuit area through hole registration holes with emery wheel
Copper removal；The position finished in pre- copper removal coats copper removal liquid, and blind hole machining position is formed after removing residual copper；The copper removal liquid its raw material bag
Include ammonium oxalate solution, 1-3 parts of dodecyl-dimethyl amine second lactone and 0.1- that 5-8 by weight parts of concentration is 5% -20%
0.5 part of NPE；Also include being removed using deionized water spray the residual copper liquid of residual copper removal liquid after removing residual copper
Cleaning process.
Accuracy test result
Using the distance that a certain edges of boards of any five blind hole Graph Distances in copper-clad plate are measured microscopically after development, calculate to obtain it
Average value X1；
Measurement the film on above-mentioned five blind hole figures for blind hole Graph Distance film side corresponding with above-mentioned edges of boards
The distance of edge, calculates to obtain its average value X2；
X1-X2, calculate map migration apart from D.
Embodiment 1-3 is tested using the above method, its result is as shown in table 1：
Test to heat dissipating layer effect
Before mechanical holes drilled through registration holes are carried out, the temperature of collection copper-clad plate line areas, while testing certain side of copper-clad plate
Length.
During machine drilling, an above-mentioned two data are gathered per 0.2S.
Embodiment 1-3 is tested, its result is as shown in table 2：
It is above wherein specific implementation of the invention, its description is more specific and detailed, but can not therefore manage
Solution is the limitation to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, not departing from
On the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection domain.
Claims (5)
1. a kind of method of raising HDI wiring board exposure accuracies, including following operation：
A. multiple through hole registration holes are drilled with by machine drilling in copper-clad plate logicalnot circuit area；
B. the periphery of each through hole registration holes in copper-clad plate, removes layers of copper, is bored at the position of no copper layer by laser drill
If blind hole registration holes group；The blind hole registration holes group includes that multiple is looped around the blind hole registration holes of through hole registration holes periphery；
C. in exposure process, the film used is provided with through hole target corresponding with through hole registration holes and blind hole registration holes respectively
And blind hole target；Before exposure, first pass through through hole registration holes carries out pre- contraposition with through hole target, makes through hole target logical with corresponding
Hole registration holes are in same axis；After pre- contraposition is finished, then it is modified with corresponding blind hole target by blind hole registration holes group
Contraposition, makes each blind hole target be in same axis with corresponding blind hole registration holes;
Before the operation a also includes processing through hole registration holes, the step of logicalnot circuit area coats heat dissipating layer；The original of the heat dissipating layer
Material includes 10-15 parts of methyl methacrylate, 1-3 parts of alumina powders and 0.5-1 parts of Rutile Type by weight
Titania powder and 5-10 parts of potassium chloride powder.
2. the method for raising HDI wiring board exposure accuracies according to claim 1, it is characterised in that：The blind hole contraposition
Multiple blind hole registration holes apertures of Kong Zuzhong are equal；Multiple blind hole registration holes in the blind hole registration holes group are with through hole registration holes
Centered on the center of circle, through hole registration holes periphery is symmetrically arranged on；The blind hole registration holes aperture and through hole registration holes aperture
The ratio between be 1:31—1.5:31.
3. the method for raising HDI wiring board exposure accuracies according to claim 2, it is characterised in that：The blind hole contraposition
Hole and a times that the spacing of through hole registration holes is blind hole registration holes aperture.
4. the method for raising HDI wiring board exposure accuracies according to claim 1, it is characterised in that：The removal layers of copper
Including carrying out pre- copper removal to the layers of copper around logicalnot circuit area through hole registration holes with emery wheel；The position finished in pre- copper removal coats copper removal
Liquid, blind hole machining position is formed after removing residual copper；Described its raw material of copper removal liquid includes that 5-8 by weight parts of concentration is 5% -20%
Ammonium oxalate solution, 1-3 part of dodecyl-dimethyl amine second lactone and 0.1-0.5 parts of NPE；Remove residual copper
Also include being removed using deionized water spray the residual copper liquid cleaning process of residual copper removal liquid afterwards.
5. the method for raising HDI wiring board exposure accuracies according to claim 1, it is characterised in that：It is also logical including being drilled with
Thermal dispersant coatings operation is removed after the registration holes of hole；The removal thermal dispersant coatings operation includes for copper-clad plate being cooled to 2-3 DEG C, ventilation
Thermal dispersant coatings are divested after drying, then is cleaned and is air-dried with 20-30 DEG C of acetone.
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| CN106341961B (en) * | 2016-09-12 | 2019-04-16 | 深圳市景旺电子股份有限公司 | High density interconnected printed circuit board and the method for improving blind hole and pattern alignment degree |
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| CN109491220A (en) * | 2018-12-25 | 2019-03-19 | 景旺电子科技(龙川)有限公司 | A method of improving the wiring board aligning accuracy with white anti-solder ink |
| CN110519927A (en) * | 2019-08-05 | 2019-11-29 | 江西志博信科技股份有限公司 | A method of improving HDI cable plate exposure accuracy |
| CN114501799B (en) * | 2020-10-27 | 2023-05-30 | 健鼎（无锡）电子有限公司 | Alignment method for circuit board manufacturing process and composite target point |
| CN112930033B (en) * | 2021-01-22 | 2022-05-03 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
| CN113115525B (en) * | 2021-04-09 | 2023-03-24 | 广州广合科技股份有限公司 | Method for improving alignment of open holes and multilayer PCB |
| CN114885504A (en) * | 2022-05-12 | 2022-08-09 | 广州美维电子有限公司 | Micro blind hole laser alignment method and system |
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| 任意层HDI对位系统研究;孟应许，周尚松，吴六雄，李再;《印制电路信息》;20140410(第4期);第190-196页 * |
| 任意层高密度互连电路板制作关键技术研究;陈世金，徐缓，杨诗伟，韩志伟，邓宏喜;《电子工艺技术》;20130918;第34卷(第5期);第279-283页 * |
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| CN104244589A (en) | 2014-12-24 |
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