CN106455365A - On-line adaptive PCB board drilling method - Google Patents

On-line adaptive PCB board drilling method Download PDF

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Publication number
CN106455365A
CN106455365A CN201610841138.3A CN201610841138A CN106455365A CN 106455365 A CN106455365 A CN 106455365A CN 201610841138 A CN201610841138 A CN 201610841138A CN 106455365 A CN106455365 A CN 106455365A
Authority
CN
China
Prior art keywords
hole
pcb board
drilling
line
drilling method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610841138.3A
Other languages
Chinese (zh)
Inventor
王成勇
郑李娟
梁炜年
黄欣
李之源
林淡填
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HUIZHOU MANIA PRECISION EQUIPMENT Co Ltd
Guangdong University of Technology
Original Assignee
HUIZHOU MANIA PRECISION EQUIPMENT Co Ltd
Guangdong University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HUIZHOU MANIA PRECISION EQUIPMENT Co Ltd, Guangdong University of Technology filed Critical HUIZHOU MANIA PRECISION EQUIPMENT Co Ltd
Priority to CN201610841138.3A priority Critical patent/CN106455365A/en
Publication of CN106455365A publication Critical patent/CN106455365A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/429Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH

Abstract

The invention discloses an on-line adaptive PCB board drilling method comprising the following steps: A, providing a PCB substrate; B, drilling positioning holes and a target hole on the PCB board; C, plating the PCB with copper; D, drilling a part of hole copper at the target hole where hole drilling is required to form a drilling hole; and E, performing ultrasonic and high-pressure washing, and cleaning residual cuttings in the drilling hole. The method adopts the three positioning holes to form the coordinate system of the front and the back of the PCB board and achieves precise positioning by the coordinate system, that is, the positioning accuracy of the back drilling hole can be well controlled, and the complexity of mechanical positioning can be overcome in the positioning operation. At the same time, the back drilling hole positioning error compensation part can be reduced, thereby saving board design space.

Description

A kind of online adaptability pcb board back drilling method
Technical field
The present invention relates to PCB manufacture field is and in particular to a kind of online adaptability pcb board back drilling method.
Background technology
With the continuous propulsion of information-based industry, the integrity transmission requirement more and more higher to signal.In multi-layer PCB board Usually through plated through-hole(Plated though hole,PTH)To connect the circuit between levels pcb board, actually using simultaneously Not every PTH is required for connecting all of pcb board, and PTH is through hole, which results in part PTH and has one section It is not used in signal transmission, useless hole copper, this sector hole copper can increase the damage of signal transmission in pcb board, thus passing to signal Defeated integrity causes certain destruction.At present, by the way of back drill, substantially it is reduced as far as in the industry useless hole copper in PTH Partial length, thus be reduced as far as the loss to signal transmission.
During back drill, the Positioning Precision Control to PTH is one of committed step, when position error is excessive, often Affect the treatment effect of useless hole copper, even result in the inefficacy of justifying.At present, back drill process is substantially employing to the positioning of PTH Machinery positioning, to compensate position error, thus reaching on the basis of back of the body boring aperture in the way of hole diameter enlargement again simultaneously Ensure the treatment effect of useless hole copper.
For machinery positioning mode, on the one hand positioning action is required higher, on the other hand due to machinery positioning error still So larger, position error could need to preferably be compensated using bigger back drill aperture, certain loss is caused to pcb board area, The design of impact circuit.
Content of the invention
In view of this, the present invention discloses a kind of online adaptability pcb board back drilling method, the depth of displayable boring, side Just use.
The purpose of the present invention is achieved through the following technical solutions:
A kind of online adaptability pcb board back drilling method, comprises the following steps:
A, offer PCB substrate;
B, get out location hole and target hole in pcb board;
C, copper plating treatment is carried out to pcb board;
D, the target hole needing to carry out back drill hole is bored and removes partial hole copper, form back drill hole;
E, the ultrasonic drilling cuttings involving high-pressure washing, cleaning back drill in the hole residual;
It is characterized in that:In described B, pcb board is face-up placed on rig, bores respectively in three edges of pcb board Go out tri- location holes of B1, B2 and B3, the line of described B1 and B2 is perpendicular to the line of B2 and B3, the position elements of B1, B2 and B3 Constitute a two-dimensional coordinate system XOY, vision measurement record is carried out respectively by CCD alignment system to location hole and B2 is set as The zero of null value, gets out target hole and the coordinate figure in XOY is recorded by target hole.
Further, in described D, the pcb board back side is placed on rig upward, the position elements structure of B1, B2 and B3 Become a two-dimensional coordinate system X ' O ' Y ', vision measurement record is carried out respectively by CCD alignment system to location hole and B2 set For the zero of null value, according to after the coordinate figure conversion of target hole in XOY in the corresponding position drilling back drill hole of X ' O ' Y '.
Described CCD alignment system can be selected for any prior art and realizes.
Further, described back drill hole carries out drilling using the drill that point of a knife angle is 160 ° -165 °.
Further, in described XOY, the line that the B2 center of circle is initial point O, B1 and B2 is taken to be X-axis, the line of B3 and B2 is Y Axle.
Further, in described X ' O ' Y ', the line that the B2 center of circle is initial point O ', B1 and B2 is taken to be X ' axle, the company of B3 and B2 Line is Y ' axle.
Further, in described A, PCB substrate is through sawing sheet, patch dry film, internal layer brown and lamination treatment.
The beneficial effects of the present invention is:
The present invention passes through three location holes and constitutes the front of pcb board and the coordinate system of reverse side, is accurately positioned by coordinate system, can The positioning precision treating back drill hole carries out good control, can overcome again and be mechanical positioning at complexity on positioning action;Can simultaneously Reduce the location error compensation part in back drill aperture, save sheet material design space.
Brief description
Fig. 1 is operation principle schematic diagram of the present invention.
Fig. 2 bores schematic diagram for front of the present invention.
Fig. 3 bores schematic diagram for reverse side of the present invention.
Specific embodiment
For the ease of it will be appreciated by those skilled in the art that being described in further detail to the present invention below in conjunction with embodiment:
Embodiment 1
The present embodiment provides a kind of online adaptability pcb board back drilling method, as shown in Figure 1-Figure 3, comprises the following steps:
A, offer PCB substrate, described PCB substrate is through sawing sheet, patch dry film, internal layer brown and lamination treatment.;
B, get out location hole 4 and target hole 5 in pcb board 1;
C, copper plating treatment is carried out to pcb board 1;
D, the target hole 5 needing carry out back drill hole is bored and removes partial hole copper, form back drill hole;
E, the ultrasonic drilling cuttings involving high-pressure washing, cleaning back drill in the hole residual;
In described B, pcb board 1 is face-up placed on rig, 1 three edges of pcb board get out respectively B1, B2 and The line of tri- location holes 4 of B3, described B1 and B2 constitutes one perpendicular to the line of B2 and B3, the position elements of B1, B2 and B3 Two-dimensional coordinate system XOY, carries out vision measurement record respectively by CCD alignment system 3 and B2 is set as null value to location hole 4 Zero, gets out target hole 5 and the coordinate figure in XOY is recorded by target hole 5.
In described D, pcb board 1 back side is placed on rig upward, the position elements of B1, B2 and B3 constitute one two Dimension coordinate system X ' O ' Y ', carries out vision measurement record respectively by CCD alignment system 3 and B2 is set as null value to location hole Zero, in the corresponding position drilling back drill hole of X ' O ' Y ' after converting according to the coordinate figure of target hole 5 in XOY.
Constitute the front of pcb board 1 and the two-dimensional coordinate of reverse side by three location holes 4, by two-dimensional coordinate to target hole 5 Positioned, accurate positioning, and to be compensated position error without hole diameter enlargement, can accurate drilling back drill hole hole copper, reach High efficiency, high-precision drilling effect.
The drill 2 that described back drill hole is 130 ° -159 ° using point of a knife angle carries out drilling.
In described XOY, the line that the B2 center of circle is initial point O, B1 and B2 is taken to be X-axis, the line of B3 and B2 is Y-axis.
In described X ' O ' Y ', the line that the B2 center of circle is initial point O ', B1 and B2 is taken to be X ' axle, the line of B3 and B2 is Y ' axle.
Embodiment 2
The present embodiment as shown in Figure 1-Figure 3, comprises the following steps:
A, offer PCB substrate, described PCB substrate is through sawing sheet, patch dry film, internal layer brown and lamination treatment.;
B, get out location hole 4 and target hole 5 in pcb board 1;
C, copper plating treatment is carried out to pcb board 1;
D, the target hole 5 needing carry out back drill hole is bored and removes partial hole copper, form back drill hole;
E, the ultrasonic drilling cuttings involving high-pressure washing, cleaning back drill in the hole residual;
In described B, pcb board 1 is face-up placed on rig, 1 three edges of pcb board get out respectively B1, B2 and The line of tri- location holes 4 of B3, described B1 and B2 constitutes one perpendicular to the line of B2 and B3, the position elements of B1, B2 and B3 Two-dimensional coordinate system XOY, carries out vision measurement record respectively by CCD alignment system 3 and B2 is set as null value to location hole 4 Zero, gets out target hole 5 and the coordinate figure in XOY is recorded by target hole 5.
In described D, pcb board 1 back side is placed on rig upward, the position elements of B1, B2 and B3 constitute one two Dimension coordinate system X ' O ' Y ', carries out vision measurement record respectively by CCD alignment system 3 and B2 is set as null value to location hole Zero, in the corresponding position drilling back drill hole of X ' O ' Y ' after converting according to the coordinate figure of target hole 5 in XOY.
Constitute the front of pcb board 1 and the two-dimensional coordinate of reverse side by three location holes 4, by two-dimensional coordinate to target hole 5 Positioned, accurate positioning, and to be compensated position error without hole diameter enlargement, can accurate drilling back drill hole hole copper, reach High efficiency, high-precision drilling effect.
The drill 2 that described back drill hole is 160 ° -165 ° using point of a knife angle carries out drilling.
In described XOY, the line that the B2 center of circle is initial point O, B1 and B2 is taken to be X-axis, the line of B3 and B2 is Y-axis.
In described X ' O ' Y ', the line that the B2 center of circle is initial point O ', B1 and B2 is taken to be X ' axle, the line of B3 and B2 is Y ' axle.
Embodiment 3
The present embodiment as shown in Figure 1-Figure 3, comprises the following steps:
A, offer PCB substrate, described PCB substrate is through sawing sheet, patch dry film, internal layer brown and lamination treatment.;
B, get out location hole 4 and target hole 5 in pcb board 1;
C, copper plating treatment is carried out to pcb board 1;
D, the target hole 5 needing carry out back drill hole is bored and removes partial hole copper, form back drill hole;
E, the ultrasonic drilling cuttings involving high-pressure washing, cleaning back drill in the hole residual;
In described B, pcb board 1 is face-up placed on rig, 1 three edges of pcb board get out respectively B1, B2 and The line of tri- location holes 4 of B3, described B1 and B2 constitutes one perpendicular to the line of B2 and B3, the position elements of B1, B2 and B3 Two-dimensional coordinate system XOY, carries out vision measurement record respectively by CCD alignment system 3 and B2 is set as null value to location hole 4 Zero, gets out target hole 5 and the coordinate figure in XOY is recorded by target hole 5.
In described D, pcb board 1 back side is placed on rig upward, the position elements of B1, B2 and B3 constitute one two Dimension coordinate system X ' O ' Y ', carries out vision measurement record respectively by CCD alignment system 3 and B2 is set as null value to location hole Zero, in the corresponding position drilling back drill hole of X ' O ' Y ' after converting according to the coordinate figure of target hole 5 in XOY.
Constitute the front of pcb board 1 and the two-dimensional coordinate of reverse side by three location holes 4, by two-dimensional coordinate to target hole 5 Positioned, accurate positioning, and to be compensated position error without hole diameter enlargement, can accurate drilling back drill hole hole copper, reach High efficiency, high-precision drilling effect.
The drill 2 that described back drill hole is 166 ° -180 ° using point of a knife angle carries out drilling.
In described XOY, the line that the B2 center of circle is initial point O, B1 and B2 is taken to be X-axis, the line of B3 and B2 is Y-axis.
In described X ' O ' Y ', the line that the B2 center of circle is initial point O ', B1 and B2 is taken to be X ' axle, the line of B3 and B2 is Y ' axle.
From same 300 pieces of pcb board average marks of batch, three groups are done back of the body borehole test respectively:
Back drill hole is that partly useless hole copper is fallen in drilling, and the drill point of a knife angle being usually used is 130 °, because its slope is big, To severity control effect on driving birds is not good, useful hole copper in a large number of easily pruning after drilling, and drilling is excessively shallow can leave useless hole copper in a large number, Increase the damage of signal transmission in pcb board 1, thus certain destruction is caused to the integrity of signal transmission.But it is not point of a knife Angle is the bigger the better, and the size of point of a knife angle also can affect the hole wall quality holed, when the drill being 180 ° using point of a knife angle Although its no slope, useless hole copper of can precisely pruning, but deslagging effect extreme difference during drilling during drilling back drill hole, not only seriously amass Pressure copper wire, dust, and hole wall is easily by tearing.Applicant tests through a large amount of, when drill point of a knife angle is 160 ° -165 ° When, can effectively discharge copper ashes and dust, and not destroy the hole wall in back drill hole, remain useless hole copper-base after drilling few, to PCB In plate 1, signal transmission does not cause to significantly affect.
It is the wherein specific implementation of the present invention above, its description is more concrete and detailed, but can not therefore manage Solution is the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from On the premise of present inventive concept, some deformation can also be made and improve, these obvious alternative forms belong to this Bright protection domain.The ins and outs not described in detail in the present invention all can be passed through any one of prior art and realize.This The bright ins and outs not described in detail all can be realized by any prior art.

Claims (6)

1. a kind of online adaptability pcb board back drilling method, comprises the following steps:
A, offer PCB substrate;
B, get out location hole and target hole in pcb board;
C, copper plating treatment is carried out to pcb board;
D, the target hole needing to carry out back drill hole is bored and removes partial hole copper, form back drill hole;
E, the ultrasonic drilling cuttings involving high-pressure washing, cleaning back drill in the hole residual;
It is characterized in that:In described B, pcb board is face-up placed on rig, bores respectively in three edges of pcb board Go out tri- location holes of B1, B2 and B3, the line of described B1 and B2 is perpendicular to the line of B2 and B3, the position elements of B1, B2 and B3 Constitute a two-dimensional coordinate system XOY, vision measurement record is carried out respectively by CCD alignment system to location hole and B2 is set as The zero of null value, gets out target hole and the coordinate figure in XOY is recorded by target hole.
2. a kind of online adaptability pcb board back drilling method according to claim 1 it is characterised in that:In described D, will The pcb board back side is placed on rig upward, and the position elements of B1, B2 and B3 constitute a two-dimensional coordinate system X ' O ' Y ', pass through CCD alignment system carries out vision measurement record respectively to location hole and B2 is set as the zero of null value, according to mesh in XOY In the corresponding position drilling back drill hole of X ' O ' Y ' after the coordinate figure conversion in mark hole.
3. a kind of online adaptability pcb board back drilling method according to claim 2 it is characterised in that:Described back drill hole is adopted The drill being 160 ° -165 ° with point of a knife angle carries out drilling.
4. a kind of online adaptability pcb board back drilling method according to claim 1 it is characterised in that:In described XOY, take The B2 center of circle is the line of initial point O, B1 and B2 is X-axis, and the line of B3 and B2 is Y-axis.
5. a kind of online adaptability pcb board back drilling method according to claim 2 it is characterised in that:In described X ' O ' Y ', The line that the B2 center of circle is initial point O ', B1 and B2 is taken to be X ' axle, the line of B3 and B2 is Y ' axle.
6. a kind of online adaptability pcb board back drilling method according to claim 1 it is characterised in that:Described PCB substrate Through sawing sheet, patch dry film, internal layer brown and lamination treatment.
CN201610841138.3A 2016-09-22 2016-09-22 On-line adaptive PCB board drilling method Pending CN106455365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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Publications (1)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107860347A (en) * 2017-10-31 2018-03-30 大族激光科技产业集团股份有限公司 Drilling machine two pin accuracy checking methods
CN108237533A (en) * 2017-12-27 2018-07-03 安徽嘉熠智能科技有限公司 A kind of adaptive object positioning method of robot and system
CN108511360A (en) * 2018-04-10 2018-09-07 生益电子股份有限公司 A kind of test structure and method of PCB back drills Aligning degree
CN109699122A (en) * 2017-10-23 2019-04-30 健鼎(无锡)电子有限公司 Circuit board and its manufacturing method
CN109807477A (en) * 2017-11-22 2019-05-28 广东工业大学 A kind of PCB aperture combined machining method
CN110539350A (en) * 2019-07-25 2019-12-06 沪士电子股份有限公司 Manufacturing method of high-alignment-degree back for printed circuit board
CN110839321A (en) * 2018-08-17 2020-02-25 深南电路股份有限公司 PCB back drilling processing equipment and processing method thereof
CN111683458A (en) * 2020-05-19 2020-09-18 江门崇达电路技术有限公司 Back drilling method for small hole with high thickness-diameter ratio in circuit board
CN112969287A (en) * 2021-01-14 2021-06-15 大连崇达电子有限公司 Method for improving roughness of pore wall of PTFE (polytetrafluoroethylene) material
CN113352397A (en) * 2021-06-29 2021-09-07 江苏艾诺信电路技术有限公司 Multilayer board drilling method, system, device, equipment and storage medium
CN113630983A (en) * 2020-05-09 2021-11-09 深圳市大族数控科技股份有限公司 Method and device for back drilling of PCB

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JP2003158381A (en) * 2001-11-19 2003-05-30 Nec Corp Multi-layer wiring board and method for manufacturing the same
CN101352858A (en) * 2008-08-13 2009-01-28 东莞生益电子有限公司 Back drilling method of PCB plate
CN104582318A (en) * 2013-10-16 2015-04-29 北大方正集团有限公司 Manufacturing method of printed circuit board and printed circuit board
CN105472892A (en) * 2015-12-30 2016-04-06 东莞生益电子有限公司 Fabrication method of circuit board

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2003158381A (en) * 2001-11-19 2003-05-30 Nec Corp Multi-layer wiring board and method for manufacturing the same
CN101352858A (en) * 2008-08-13 2009-01-28 东莞生益电子有限公司 Back drilling method of PCB plate
CN104582318A (en) * 2013-10-16 2015-04-29 北大方正集团有限公司 Manufacturing method of printed circuit board and printed circuit board
CN105472892A (en) * 2015-12-30 2016-04-06 东莞生益电子有限公司 Fabrication method of circuit board

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109699122B (en) * 2017-10-23 2021-01-26 健鼎(无锡)电子有限公司 Circuit board and method for manufacturing the same
CN109699122A (en) * 2017-10-23 2019-04-30 健鼎(无锡)电子有限公司 Circuit board and its manufacturing method
CN107860347A (en) * 2017-10-31 2018-03-30 大族激光科技产业集团股份有限公司 Drilling machine two pin accuracy checking methods
CN107860347B (en) * 2017-10-31 2020-08-04 深圳市大族数控科技有限公司 Method for detecting accuracy of two pins of drilling machine
CN109807477A (en) * 2017-11-22 2019-05-28 广东工业大学 A kind of PCB aperture combined machining method
CN109807477B (en) * 2017-11-22 2023-03-31 广东工业大学 Composite processing method for PCB hole
CN108237533A (en) * 2017-12-27 2018-07-03 安徽嘉熠智能科技有限公司 A kind of adaptive object positioning method of robot and system
CN108237533B (en) * 2017-12-27 2020-03-31 安徽嘉熠智能科技有限公司 Robot self-adaptive object positioning method and system
CN108511360B (en) * 2018-04-10 2021-05-25 生益电子股份有限公司 Test structure and method for PCB back drilling alignment
CN108511360A (en) * 2018-04-10 2018-09-07 生益电子股份有限公司 A kind of test structure and method of PCB back drills Aligning degree
CN110839321B (en) * 2018-08-17 2021-11-16 深南电路股份有限公司 PCB back drilling processing equipment and processing method thereof
CN110839321A (en) * 2018-08-17 2020-02-25 深南电路股份有限公司 PCB back drilling processing equipment and processing method thereof
CN110539350A (en) * 2019-07-25 2019-12-06 沪士电子股份有限公司 Manufacturing method of high-alignment-degree back for printed circuit board
CN113630983A (en) * 2020-05-09 2021-11-09 深圳市大族数控科技股份有限公司 Method and device for back drilling of PCB
CN113630983B (en) * 2020-05-09 2023-08-29 深圳市大族数控科技股份有限公司 PCB back drilling processing method and device
CN111683458A (en) * 2020-05-19 2020-09-18 江门崇达电路技术有限公司 Back drilling method for small hole with high thickness-diameter ratio in circuit board
CN112969287A (en) * 2021-01-14 2021-06-15 大连崇达电子有限公司 Method for improving roughness of pore wall of PTFE (polytetrafluoroethylene) material
CN113352397A (en) * 2021-06-29 2021-09-07 江苏艾诺信电路技术有限公司 Multilayer board drilling method, system, device, equipment and storage medium

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Application publication date: 20170222

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