CN105472892A - Fabrication method of circuit board - Google Patents
Fabrication method of circuit board Download PDFInfo
- Publication number
- CN105472892A CN105472892A CN201511029168.6A CN201511029168A CN105472892A CN 105472892 A CN105472892 A CN 105472892A CN 201511029168 A CN201511029168 A CN 201511029168A CN 105472892 A CN105472892 A CN 105472892A
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- Prior art keywords
- circuit board
- sub
- hole
- target
- boring
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention provides a fabrication method of a circuit board. The fabrication method comprises the following steps: (1) providing a plurality of sub-core boards, and setting alignment marks at four corners of each sub-core board; (2) laminating the plurality of sub-core boards, superposing and aligning the alignment marks on the adjacent sub-core boards, and laminating the plurality of sub-core boards to form a circuit board; (3) grabbing the alignment marks on the surface of the circuit board by a target hole drilling machine, and drilling through target holes in the alignment marks in one direction; and (4) carrying out scanning and positioning on the target holes by a CCD drilling machine through a CCD lens, drilling first drill holes with preset depths in the upper surface of the circuit board, and drilling second drill holes in the lower surface of the circuit board to connect the first drill holes, thus obtaining functional through holes. According to the fabrication method provided by the invention, the machining accuracy of the functional through holes in the high-thickness circuit board can be improved; the alignment deviation between aligning and drilling twice is reduced; and meanwhile, the alignment accuracy of the through holes and an inner pattern can be improved.
Description
Technical field
The present invention relates to the manufacture method of circuit board, particularly relate to a kind of manufacture method of multilayer heavy thickness circuit board.
Background technology
Along with the extensive raising of system complexity and integrated level, and the upgrading of 4G communication system is in sight, improving transfer rate speed is a major challenge that electronics industry faces, and circuit board has become the High-speed Board Design most important thing as its Design and manufactures of function such as bearing function daughter board, Signal transmissions and power delivery.For increasing circuit board capacity, realize by increasing the number of plies at present, cause the number of plies of circuit board more and more higher, thickness is more and more thicker.For thick circuit board in PCB industry, during functional hole after processing on circuit board, normally by first processing location hole on circuit boards, then by pin, circuit board being fixed, getting out functional hole on circuit boards by rig.When boring functional hole, there is the large modes to boring such as adopting positive and negative at present, but traditional pin location easily causes twice borehole throw, mainly owing to adopting pin location, twice, same hole to hole, there is the supporting difference of 2mil in pin and location hole, and in twice position fixing process, during first time location, damage easily appears in location hole, there is deviation when re-using location, this hole in second time, therefore causes twice boring contraposition deviation larger.So, traditional positive and negative etc. is improved the alignment mode bored greatly.
Summary of the invention
In view of the above, the present invention is necessary to provide a kind of manufacture method improving the circuit board of functional hole machining accuracy on large thick circuit board.
A manufacture method for circuit board, is characterized in that: comprise the following steps,
1) some sub-central layers are provided, at each sub-central layer corner place setting alignment mark;
2) some sub-central layers are stacked, and the alignment mark on adjacent sub-central layer is superimposed aligning, and some sub-core layer swagings become circuit board;
3) use the alignment mark boring target drone crawl circuit board surface, get out through target hole in alignment mark position in a direction;
4) CCD rig is used, bore function through hole on circuit boards, first by CCD camera lens, Scan orientation is carried out to four target holes, determine the bore position of function through hole on circuit boards on surface, bore the first boring of predetermined depth at the upper surface of circuit board according to the bore position determined, then, circuit board is inverted, again Scan orientation is carried out to four target holes by CCD camera lens, determine the bore position of function through hole on circuit board lower surface, the lower surface of circuit board is bored to the second boring of predetermined depth, second boring is holed to aim at be communicated with the function through hole needed for obtaining by with first.
Further, step 4) in, first carry out the dark blind brill of conduction control on the upper surface of the circuit board, bore the thickness of slab of dark 55%-60%, then circuit board upset, conduction control gun drilling is carried out to the lower surface of circuit board, bores dark 55%-60% thickness of slab.
Further, each drill bit of CCD rig has Automatic-drawing function, therefore carries out Automatic-drawing boring by the measurement data of four targets during CCD boring, can improve through hole and inner figure aligning accuracy like this.
In addition, the present invention is necessary to provide a kind of circuit board having described manufacture method obtained.
Compared to prior art, the manufacture method of circuit board of the present invention, by getting out through target hole from one towards another side on circuit boards, target hole is suitable with traditional location hole, target hole is as the Scan orientation hole of follow-up CCD rig, right target hole coordinates alignment pin without the need to being used for, therefore, the aperture not circumscribed in target hole, drill by high strength is disposable to be drilled through, target hole is at least three, be preferably four, the bore position of function through hole on circuit boards on surface is determined by target hole, because target hole is the disposable through hole drilled, therefore in the two sides position consistency of circuit board, and there will not be deviation, thus can the bore position of accurate positioning function through hole according to the target hole site on circuit board two sides, according to first boring of upper surface target hole in the upper surface subdrilling predetermined depth of circuit board, then the second boring is got out according to lower surface target hole at the lower surface of circuit board, second boring and first is holed and can be guaranteed that deviation is not aimed at and be communicated with, drastically increase the machining accuracy of function through hole on heavy thickness circuit board.The target hole of every layer is consistent with the figure of internal layer in addition, can be improved the aligning accuracy of boring and inner figure by the contraposition in target hole.
Accompanying drawing explanation
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, accompanying drawing in description is only correspond to specific embodiments of the invention, to those skilled in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings when needing.
Fig. 1 is the flow chart of the manufacture method of the circuit board of a kind of multilayer heavy thickness of present pre-ferred embodiments.
The schematic cross-section of each sub-central layer of Fig. 2 present pre-ferred embodiments composition multilayer heavy thickness circuit board;
The schematic diagram that the target that Fig. 3 is the circuit board surface obtained after sub-central layer pressing designs;
The schematic cross-section that Fig. 4 holes at upper surface CCD for the circuit board obtained after sub-central layer pressing;
Fig. 5 to carry out the schematic cross-section of CCD boring for the circuit board shown in Fig. 4 after the boring of front at lower surface.
Fig. 6 is the schematic cross-section (comprising the extraction schematic top plan view of lower die cutter actinal surface) of the Special riveting die for the sub-central layer employing of lamination.
Embodiment
In order to elaborate the technical scheme that the present invention takes for reaching predetermined technique object, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only section Example of the present invention, instead of whole embodiments, and, under the prerequisite not paying creative work, technological means in embodiments of the invention or technical characteristic can be replaced, below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.
Refer to Fig. 1, the manufacture method of the circuit board of a kind of multilayer heavy thickness of the present invention, comprises the steps.
1) provide some sub-central layers, make alignment mark at every sub-core plate surface.Refer to Fig. 2, shown in provide five pieces of sub-central layers 10, each sub-central layer 10 upper surface design X-RAY alignment mark 11, in the present embodiment, sub-central layer 10 be rectangular slab, and alignment mark 11 is evenly distributed on the corner of sub-central layer 10, distance edges of boards 10mm-20mm.
2) sub-central layer brown; Namely antithetical phrase core plate surface carries out coarse, adhesion time superimposed with enhancer central layer between two between sub-central layer.Particularly, sub-core plate surface is smooth copper face, becomes coarse by copper face oxidation.
3) some sub-central layer 10 laminations pressing, the alignment mark on adjacent sub-central layer is superimposed aligning, and some sub-core layer swagings become circuit board.Particularly, Special riveting die can be adopted each sub-core layer to be pressed and to close in an entirety.
Figure 6 shows that and comprise patrix pin 21, counterdie pin 22, counterdie base 23 and counterdie dust shield seat 24 by the Special riveting die that a kind of the applicant provided by the invention adopts.Patrix pin 21 can move up and down, counterdie pin 22 is fixed on counterdie base 23, counterdie base 23 comprises base body 231 and protrudes out the boss 232 in base body 231, counterdie pin 22 described in the center projection of boss 232 upper surface, and on boss 232 upper surface, form the lower die cutter actinal surface 233 of annular accordingly, lower die cutter actinal surface 233 is formed with the some blade bars 2331 equidistantly radially extended, blade bar 2331 is protruding small contract type body, in order to the perisporium of rivet lower end being cut into some by during rivet punching press, make rivet bottom bloom formed some affixed bar bendings be fixed to sub-central layer bottom surface.Counterdie dust shield seat 24 is installed in base body 231 around described boss 232, in order to hold stacked some sub-central layer, and the upper surface of counterdie dust shield seat 24 slightly exceeds described boss 232 upper surface, with the reserved affixed bar wider space for rivet bottom Post flowering.During punching press, provide some sub-central layers 25, by stacked for some sub-central layers 25, rivet hole 12 position on each sub-central layer 25 aligns, and is carried on counterdie dust shield seat 24, and counterdie pin 22 is through the rivet hole 12 of sub-central layer 25; Rivet 26 is provided, rivet 26 lower end is hollow sleeve structure, rivet 26 lower end is set on counterdie pin 22, then patrix 21 punching press downwards, the head of a nail face of rivet 26 is fixed on the sub-central layer end face of top, blooms and form the sub-central layer bottom surface that some affixed bar bendings are fixed to lowermost end in the bottom of rivet 26.So by rivet 24 riveted on stacked some sub-central layer 25, some sub-central layers 25 are connected into holistic circuit board.
4) use x-ray to bore target drone and capture alignment mark 11 by ray, get out target hole 13 in alignment mark 11 position.Particularly, the circuit board obtained after lamination riveted being fixed to an x-ray bores on target drone, x-ray ray is used to capture alignment mark 11, the mode that face compensates can be adopted, calculate the center of alignment mark 11, then the through x-ray target hole 13 (Fig. 4 is consulted in combination) getting out edges of boards is got out from a plate face to another plate face accordingly in alignment mark position, the through circuit board in target hole 13.
5) use CCD rig, bore function through hole on circuit boards.First by CCD camera lens, Scan orientation is carried out to four target holes 13, determine the bore position (function lead to the hole site 14 as shown in Figure 3) of function through hole on circuit boards on surface, bore the first boring of predetermined depth at the upper surface of circuit board according to the bore position determined, then, circuit board is inverted, again Scan orientation is carried out to four target holes by CCD camera lens, determine the bore position of function through hole on circuit board lower surface, the lower surface of circuit board is bored to the second boring of predetermined depth, second boring is holed to aim at be communicated with the function through hole needed for obtaining by with first.
Particularly, incorporated by reference to consulting Fig. 4, Fig. 5, using the target hole 13 got out as the target of CCD rig, the dark mode of conduction control is adopted to carry out positive and negative etc. gets out greatly circuit board function through hole to brill by CCD rig.Particularly, circuit board placement after getting out target hole 13 is fixed on a CCD rig, the camera of CCD rig scans the position (can be any three target holes 13) in circuit board upper surface target hole 13, in this, as datum mark, then according to datum mark, calculate and move to position circuit board needing hole, first on the upper surface 31 of circuit board, control dark blind brill by conduction, get out the first boring, ensure the thickness of slab of the dark 55%-60% of single-surface drilling, then drill is exited, circuit board is overturn rearmounted on CCD rig, using identical X-RAY target hole 13 as the target of CCD rig, conduction control gun drilling is carried out to the lower surface 32 of circuit board, get out the second boring, bore dark 55%-60% thickness of slab, positive and negatives etc. are large to brill, very grave folded 5%-10% is bored on two sides.Second boring will be holed to aim at and will be communicated with first, circuit board get out function through hole 33.Carry out positive and negative etc. by adopting the dark mode of CCD rig conduction control to hole to brill greatly, the registration at boring two face center can be ensured, and it is long to reduce drill sword, the drill that common sword can be used long is to bore the slab of 8mm-10mm, and drill sword length, then rigidity is strong, can reduce the risk of breaking, ensure that borehole accuracy controls within 3mil.The each drill bit of CCD rig has Automatic-drawing function in addition, therefore carries out Automatic-drawing boring by the measurement data of four targets during CCD boring, can improve through hole and inner figure aligning accuracy like this.
6) functional hole after getting out is electroplated and follow-up flow process.
To sum up, the manufacture method of circuit board of the present invention, by getting out through target hole from one towards another side on circuit boards, target hole is suitable with traditional location hole, target hole is as the Scan orientation hole of follow-up CCD rig, target hole coordinates alignment pin without the need to being used for, therefore, the aperture not circumscribed in target hole, drill by high strength is disposable to be drilled through, target hole is at least three, be preferably four, the bore position of function through hole on circuit boards on surface is determined by target hole, because target hole is the disposable through hole drilled, therefore in the two sides position consistency of circuit board, and there will not be deviation, thus can the bore position of accurate positioning function through hole according to the target hole site on circuit board two sides, according to first boring of upper surface target hole in the upper surface subdrilling predetermined depth of circuit board, then the second boring is got out according to lower surface target hole at the lower surface of circuit board, second boring and first is holed and can be guaranteed that deviation is not aimed at and be communicated with, drastically increase the machining accuracy of function through hole on heavy thickness circuit board.In addition, by the mode in normal drill bit machining functions hole after fixing circuit board compared to traditional employing pin, ensure turnover position, knife face hole precision, satisfied crimping and back drill require within 3mil simultaneously; By adopting above-mentioned steps flow process processing circuit board, can ensure that the thick circuit board Aligning degree of high multilayer large scale controls within 7mil.
The above, it is only preferred embodiment of the present invention, not any pro forma restriction is done to the present invention, although the present invention discloses as above with preferred embodiment, but and be not used to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, make a little change when the technology contents of above-mentioned announcement can be utilized or be modified to the Equivalent embodiments of equivalent variations, in every case be do not depart from technical solution of the present invention content, according to technical spirit of the present invention, within the spirit and principles in the present invention, to any simple amendment that above embodiment is done, equivalent replacement and improvement etc., within the protection range all still belonging to technical solution of the present invention.
Claims (8)
1. a manufacture method for circuit board, is characterized in that: comprise the following steps,
1) some sub-central layers are provided, at each sub-central layer corner place setting alignment mark;
2) some sub-central layers are stacked, and the alignment mark on adjacent sub-central layer is superimposed aligning, and some sub-core layer swagings become circuit board;
3) use the alignment mark boring target drone crawl circuit board surface, get out through target hole in alignment mark position in a direction;
4) CCD rig is used, bore function through hole on circuit boards, first by CCD camera lens, Scan orientation is carried out to four target holes, determine the bore position of function through hole on circuit boards on surface, bore the first boring of predetermined depth at the upper surface of circuit board according to the bore position determined, then, circuit board is inverted, again Scan orientation is carried out to four target holes by CCD camera lens, determine the bore position of function through hole on circuit board lower surface, the lower surface of circuit board is bored to the second boring of predetermined depth, second boring is holed to aim at be communicated with the function through hole needed for obtaining by with first.
2. the manufacture method of circuit board according to claim 1, it is characterized in that: step 4) in, first carry out the dark blind brill of conduction control on the upper surface of the circuit board, bore the thickness of slab of dark 55%-60%, then circuit board upset, conduction control gun drilling is carried out to the lower surface of circuit board, bores dark 55%-60% thickness of slab.
3. the manufacture method of circuit board according to claim 1, is characterized in that: each drill bit of CCD rig has Automatic-drawing function, carries out Automatic-drawing boring by the measurement data of four targets, to improve through hole and inner figure aligning accuracy.
4. the manufacture method of circuit board according to claim 1, is characterized in that: the target hole of every layer is consistent with the figure of internal layer, is improved the aligning accuracy of boring and inner figure by the contraposition in target hole.
5. the manufacture method of circuit board according to claim 1, is characterized in that: step 1) in, sub-central layer is rectangular slab, and alignment mark is evenly distributed on the corner of sub-central layer, apart from edges of boards 10mm-20mm.
6. the manufacture method of circuit board according to claim 1, it is characterized in that: step 1) and step 2) between comprise the step of antithetical phrase central layer brown further, carry out coarse in order to antithetical phrase core plate surface, adhesion when enhancer central layer is superimposed between two between sub-central layer.
7. the manufacture method of circuit board according to claim 1, is characterized in that: step 2) in adopt Special riveting die each sub-core layer to be pressed to close in one overall.
8. a circuit board, is characterized in that, described circuit board is obtained by the circuit board processing method described in any one of claim 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029168.6A CN105472892A (en) | 2015-12-30 | 2015-12-30 | Fabrication method of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511029168.6A CN105472892A (en) | 2015-12-30 | 2015-12-30 | Fabrication method of circuit board |
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| Publication Number | Publication Date |
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| CN105472892A true CN105472892A (en) | 2016-04-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511029168.6A Pending CN105472892A (en) | 2015-12-30 | 2015-12-30 | Fabrication method of circuit board |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211637A (en) * | 2016-07-21 | 2016-12-07 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI circuit board |
| CN106455365A (en) * | 2016-09-22 | 2017-02-22 | 广东工业大学 | On-line adaptive PCB board drilling method |
| CN106793520A (en) * | 2016-12-30 | 2017-05-31 | 昆山元茂电子科技有限公司 | The boring method of printed circuit board (PCB) |
| CN106973493A (en) * | 2017-03-30 | 2017-07-21 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN107072050A (en) * | 2017-03-30 | 2017-08-18 | 生益电子股份有限公司 | The preparation method and PCB of the upper jacks of PCB |
| CN107995804A (en) * | 2017-08-30 | 2018-05-04 | 奥士康精密电路（惠州）有限公司 | A kind of method of reduction PCB pressings foreign matter |
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
| CN110050337A (en) * | 2016-11-07 | 2019-07-23 | 康宁股份有限公司 | Delay through-hole in electronic device is formed |
| CN110461096A (en) * | 2019-08-23 | 2019-11-15 | 深圳市星河电路股份有限公司 | A kind of processing method of segmentation conducting stepped hole |
| CN112230123A (en) * | 2020-09-02 | 2021-01-15 | 湖北金禄科技有限公司 | Flying probe testing device for thin plate and manufacturing method thereof |
| CN112638035A (en) * | 2019-10-09 | 2021-04-09 | 捷惠自动机械有限公司 | Automatic classification and orientation method and equipment for circuit board |
| CN112638044A (en) * | 2021-02-19 | 2021-04-09 | 四川英创力电子科技股份有限公司 | Drilling positioning method for multilayer printed circuit board |
| CN113225938A (en) * | 2021-03-25 | 2021-08-06 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing thermoelectric separation circuit board |
| CN114423158A (en) * | 2021-12-22 | 2022-04-29 | 广州兴森快捷电路科技有限公司 | Circuit board processing method, circuit board, system and storage medium |
| CN115023067A (en) * | 2022-05-23 | 2022-09-06 | 高德(江苏)电子科技股份有限公司 | Processing technology for improving alignment precision of printed circuit board |
| CN117979561A (en) * | 2024-03-29 | 2024-05-03 | 淄博芯材集成电路有限责任公司 | Printed circuit board manufacturing method capable of improving exposure target reading rate |
| CN118019223A (en) * | 2024-01-30 | 2024-05-10 | 昆山沪利微电有限公司 | Preparation method of high-frequency antenna board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1337845A (en) * | 2000-08-07 | 2002-02-27 | 联星科技股份有限公司 | Printed circuit board forming and hole drilling process |
| US20050128672A1 (en) * | 2003-09-19 | 2005-06-16 | Tourne Joseph A. | Closed loop backdrilling system |
| US20060127652A1 (en) * | 2004-12-10 | 2006-06-15 | Yasuhiko Kanaya | Multi-layered circuit board and manufacturing method of multi-layered circuit board |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN103752882A (en) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| CN104349577A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Double-face crimping backboard and hole drilling method thereof |
| US20150245494A1 (en) * | 2014-02-21 | 2015-08-27 | Via Mechanics, Ltd. | Backdrilling Method, and Backdrilling Apparatus |
-
2015
- 2015-12-30 CN CN201511029168.6A patent/CN105472892A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1337845A (en) * | 2000-08-07 | 2002-02-27 | 联星科技股份有限公司 | Printed circuit board forming and hole drilling process |
| US20050128672A1 (en) * | 2003-09-19 | 2005-06-16 | Tourne Joseph A. | Closed loop backdrilling system |
| US20060127652A1 (en) * | 2004-12-10 | 2006-06-15 | Yasuhiko Kanaya | Multi-layered circuit board and manufacturing method of multi-layered circuit board |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN104349577A (en) * | 2013-08-02 | 2015-02-11 | 北大方正集团有限公司 | Double-face crimping backboard and hole drilling method thereof |
| CN103752882A (en) * | 2013-12-27 | 2014-04-30 | 广州兴森快捷电路科技有限公司 | Drilling method for circuit board |
| US20150245494A1 (en) * | 2014-02-21 | 2015-08-27 | Via Mechanics, Ltd. | Backdrilling Method, and Backdrilling Apparatus |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211637A (en) * | 2016-07-21 | 2016-12-07 | 江苏博敏电子有限公司 | A kind of manufacture method of HDI circuit board |
| CN106455365A (en) * | 2016-09-22 | 2017-02-22 | 广东工业大学 | On-line adaptive PCB board drilling method |
| CN110050337A (en) * | 2016-11-07 | 2019-07-23 | 康宁股份有限公司 | Delay through-hole in electronic device is formed |
| CN106793520A (en) * | 2016-12-30 | 2017-05-31 | 昆山元茂电子科技有限公司 | The boring method of printed circuit board (PCB) |
| CN106973493A (en) * | 2017-03-30 | 2017-07-21 | 生益电子股份有限公司 | PCB preparation method and PCB |
| CN107072050A (en) * | 2017-03-30 | 2017-08-18 | 生益电子股份有限公司 | The preparation method and PCB of the upper jacks of PCB |
| CN107995804A (en) * | 2017-08-30 | 2018-05-04 | 奥士康精密电路（惠州）有限公司 | A kind of method of reduction PCB pressings foreign matter |
| CN109699122B (en) * | 2017-10-23 | 2021-01-26 | 健鼎（无锡）电子有限公司 | Circuit board and method for manufacturing the same |
| CN109699122A (en) * | 2017-10-23 | 2019-04-30 | 健鼎（无锡）电子有限公司 | Circuit board and its manufacturing method |
| CN110461096A (en) * | 2019-08-23 | 2019-11-15 | 深圳市星河电路股份有限公司 | A kind of processing method of segmentation conducting stepped hole |
| CN112638035A (en) * | 2019-10-09 | 2021-04-09 | 捷惠自动机械有限公司 | Automatic classification and orientation method and equipment for circuit board |
| CN112230123A (en) * | 2020-09-02 | 2021-01-15 | 湖北金禄科技有限公司 | Flying probe testing device for thin plate and manufacturing method thereof |
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