CN1337845A - Printed circuit board forming and hole drilling process - Google Patents
Printed circuit board forming and hole drilling process Download PDFInfo
- Publication number
- CN1337845A CN1337845A CN 00121225 CN00121225A CN1337845A CN 1337845 A CN1337845 A CN 1337845A CN 00121225 CN00121225 CN 00121225 CN 00121225 A CN00121225 A CN 00121225A CN 1337845 A CN1337845 A CN 1337845A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- forming
- plate
- wad cutter
- bore
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The invention relates to forming of printed circuit board and manufacturing the target bore process. The invention includes following process. The target bore is recognized and corrected by an X-Ray generator. The board is located on a forming machine, in order to cut the board to the formed. After the central localizer is centralized and the target bore is centralized by using image of bore the target bore is drilled out. the invention provides a manufacturing technique of printed circuit board with advantages of preventing the position influence from flooding glue, accurately locating the target bore and drilling the bore.
Description
The invention belongs to printed circuit board manufacturing process, particularly a kind of printed circuit board forming and hole drilling process.
Usually in the pressing process, semi-automatic or full-automatic mode is bored target and moulding in the making of multilayer printed circuit (PC) plate at present.As shown in Figure 5, it comprises and milling except that Copper Foil, boring, location and trimming for forming.As shown in Figure 1, semi-automatic mode is the Copper Foil of printed circuit (PC) plate 2 is milled to remove to mill the set milling cutter 11 of target drone 1; Again as shown in Figure 2, cooperate C, C, D32 to be drilled with wad cutter with the drill bit 31 that bores target 3; Then locate with alignment pin in wad cutter; Again on make-up machine 4 as shown in Figure 4 with the moulding of milling cutter 41 millings four sides.
Certainly, aforesaid semi-automatic making mode also can be as shown in Figure 3, cooperates X-RayC, C, D52 and drill bit 53 directly to get out wad cutter with what X-Ray bored target drone 5 with X-Ray generator 51, transfers to make-up machine 4 processing again.
Full-automatic mode then is that operations such as brill target and moulding were finished in a whole piece automatic machining line last time.As shown in Figure 6, each processing station system divides into:
Heap plate feeding, centralized positioning or θ angle coarse positioning, boring, discharging are temporary, feeding and the identification of position, hole and align, trimming for forming, rounding, discharging.
Aforesaid semi-automatic or full-automatic processing procedure, no matter it is to mill to bore target or X-Ray brill target, whole processing procedure all needs two to three work stations, cause labor intensive, take push away put, the disappearance in space such as circulation and board, for present output and the side is quite uneconomical, and operation procedure is many, causes surperficial scratch when making in printed circuit (PC) the plate course of processing conversion relatively easily, increase the defective products rate, form the puzzlement greatly of one on the processing procedure.
The brill target and the molding manufacture procedure of existing printed circuit (PC) plate develop towards the automation mode mostly, right existing multilayer printed circuit (PC) plate is when pressing, be whole time processing of large scale, be cut into the fritter spiral-plate after the pressing again, owing to can make Copper Foil form irregular curling after the pressing in edges of boards; Again, excessive glue problem in out-of-flatness during with aritificial cut-off and the pressing process etc., when causing printed circuit (PC) plate to send into bore position after via centralized positioning or θ angle coarse positioning, wad cutter still exceeds outside the scope of the image visual field (FOV), and identification is located really.
The purpose of this invention is to provide a kind of avoid overflowing glue influence location, wad cutter location really, bore operation printed circuit board forming and hole drilling process accurately.
The present invention includes following steps:
Identification of position, hole and correction:
After the pressing of multilayer printed circuit (PC) plate, immediately with X-Ray generator identification wad cutter;
Trimming for forming:
With the wad cutter location, on make-up machine, printed circuit (PC) plate is carried out trimming for forming;
Centralized positioning:
Printed circuit after the trimming for forming (PC) plate is sent into the centralized positioning machine automatically, really wad cutter is located;
Boring:
Make printed circuit (PC) behind the location when plate enters bore position, wad cutter is located with image capture, accurately finish bore operation.
Owing to the present invention includes: with position, the hole identification of X-Ray generator identification wad cutter with proofread and correct, be positioned to carry out on the make-up machine trimming for forming, accurately finish bore operation after with the image capture location in the certain centralized positioning of centralized positioning machine and to wad cutter with wad cutter.After the present invention lies in the pressing of multilayer printed circuit (PC) plate,, cut edge again, locate, make printed circuit (PC) plate be able to accurate boring earlier with X-Ray identification wad cutter.The glue influence of not only avoiding overflowing is located, and the wad cutter location is certain, bore operation is accurate, thereby reaches purpose of the present invention.
Fig. 1, for milling the target drone structural representation.
Fig. 2, for boring the target drone structural representation.
Fig. 3, be that X-Ray bores the target drone structural representation.
Fig. 4, be the shaping machine structure schematic diagram.
Fig. 5, be known semi-automatic processing operation process chart.
Fig. 6, be known full-automatic processing operation process chart.
Fig. 7, for manufacturing flow chart of the present invention.
Below in conjunction with accompanying drawing the present invention is further elaborated.
As shown in Figure 7, the present invention includes following steps:
Step 1
The feeding of heap plate:
Identification of position, hole and correction:
After the pressing of multilayer printed circuit (PC) plate, immediately with X-Ray generator identification wad cutter;
Step 3
Trimming for forming:
With the wad cutter location, on make-up machine, carry out trimming for forming, prevent to cause wad cutter to exceed outside the scope of the image visual field (FOV), with certain identification location in the step after guaranteeing, to prevent the wad cutter skew because of irregular the curling of overflow glue or edges of boards;
Rounding:
Step 5
Temporary:
Step 6
Centralized positioning:
After trimming for forming, send into the centralized positioning machine automatically, really wad cutter being located, thereby can when entering bore position, wad cutter be located with image capture;
Step 7
Boring:
Step 8
Discharging:
Can learn by above-mentioned processing procedure, after the present invention lies in the pressing of multilayer printed circuit (PC) plate, thereupon with X-Ray generator identification wad cutter, carry out trimming for forming processing more immediately, automatically send into the centralized positioning machine again really wad cutter is located, when making it enter bore position, wad cutter can be located with image capture, and precisely finish bore operation.
In sum, the present invention earlier with X-Ray identification wad cutter, cuts edge, locatees in printed circuit (PC) plate processing procedure, makes printed circuit (PC) plate be able to accurate boring.Improve in the known molding manufacture procedure the excessive glue that curls and produced in injustice and the pressing process because of the edges of boards Copper Foil, caused wad cutter to exceed the image field range and the accurate identification disappearance of locating.
Claims (1)
1, a kind of printed circuit board forming and hole drilling process is characterized in that it comprises the steps:
Identification of position, hole and correction:
After the pressing of multilayer printed circuit (PC) plate, immediately with X-Ray generator identification wad cutter;
Trimming for forming:
With the wad cutter location, on make-up machine, printed circuit (PC) plate is carried out trimming for forming;
Centralized positioning:
Printed circuit after the trimming for forming (PC) plate is sent into the centralized positioning machine automatically, really wad cutter is located;
Boring:
Make printed circuit (PC) behind the location when plate enters bore position, wad cutter is located with image capture, accurately finish bore operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001212257A CN1142711C (en) | 2000-08-07 | 2000-08-07 | Printed circuit board forming and hole drilling process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001212257A CN1142711C (en) | 2000-08-07 | 2000-08-07 | Printed circuit board forming and hole drilling process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1337845A true CN1337845A (en) | 2002-02-27 |
| CN1142711C CN1142711C (en) | 2004-03-17 |
Family
ID=4588661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001212257A Expired - Fee Related CN1142711C (en) | 2000-08-07 | 2000-08-07 | Printed circuit board forming and hole drilling process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1142711C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101316483B (en) * | 2007-06-01 | 2011-03-23 | 欣竑科技有限公司 | Hole drilling calibration method for printed circuit board |
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN101672616B (en) * | 2008-09-11 | 2012-09-05 | 北大方正集团有限公司 | Circuit board molding milling-missing prevention jip and milling-missing prevention inspection method |
| CN102843863A (en) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | High precision electric testing and positioning method |
| CN104607867A (en) * | 2013-11-01 | 2015-05-13 | 得力富企业股份有限公司 | Board cutting and target drilling method |
| CN105376942A (en) * | 2015-10-30 | 2016-03-02 | 江苏博敏电子有限公司 | Stitching process equipment automatic device |
| CN105472892A (en) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | Fabrication method of circuit board |
| CN108337806A (en) * | 2018-01-30 | 2018-07-27 | 江西景旺精密电路有限公司 | Target, which is bored, after a kind of PCB pressing cuts out mill connection line operation production line and operational method |
| CN111050477A (en) * | 2019-12-23 | 2020-04-21 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
-
2000
- 2000-08-07 CN CNB001212257A patent/CN1142711C/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101316483B (en) * | 2007-06-01 | 2011-03-23 | 欣竑科技有限公司 | Hole drilling calibration method for printed circuit board |
| CN101672616B (en) * | 2008-09-11 | 2012-09-05 | 北大方正集团有限公司 | Circuit board molding milling-missing prevention jip and milling-missing prevention inspection method |
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN102098884B (en) * | 2010-12-29 | 2014-07-23 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN102843863A (en) * | 2011-06-21 | 2012-12-26 | 昆山华扬电子有限公司 | High precision electric testing and positioning method |
| CN104607867A (en) * | 2013-11-01 | 2015-05-13 | 得力富企业股份有限公司 | Board cutting and target drilling method |
| CN105376942A (en) * | 2015-10-30 | 2016-03-02 | 江苏博敏电子有限公司 | Stitching process equipment automatic device |
| CN105472892A (en) * | 2015-12-30 | 2016-04-06 | 东莞生益电子有限公司 | Fabrication method of circuit board |
| CN108337806A (en) * | 2018-01-30 | 2018-07-27 | 江西景旺精密电路有限公司 | Target, which is bored, after a kind of PCB pressing cuts out mill connection line operation production line and operational method |
| CN111050477A (en) * | 2019-12-23 | 2020-04-21 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
| CN111050477B (en) * | 2019-12-23 | 2021-04-20 | 深圳市泰科思特精密工业有限公司 | Circuit board cutting edge grinding groove milling machining method and production line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1142711C (en) | 2004-03-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1142711C (en) | Printed circuit board forming and hole drilling process | |
| CN101183255A (en) | Method for setting processing units each with a chipping tool | |
| CN107708305B (en) | Routing process for precisely controlling appearance of substrate | |
| CN101209641A (en) | Laser engraving system and method | |
| CN108481467B (en) | Flexible processing production line and flexible processing method for wood structure laminated wood | |
| CN1458873A (en) | Machining device and machining method | |
| CN1603072A (en) | System and method for generating cutting path automatically | |
| CN101284351A (en) | Printed circuit board contour processing method | |
| CN112222497B (en) | Method for processing large conical adapter space curved surface on three-axis linkage milling machine | |
| CN1260853A (en) | Key plate and method of producing thereof | |
| CN110919766A (en) | CCD die-cutting machine | |
| CN108746788A (en) | A kind of trial cut and milling integration covering five-axis robot method | |
| CN106041578A (en) | Clamping and machining method capable of guaranteeing machining accuracy of aluminum profile frame | |
| CN110434932A (en) | Solar energy film flexible unit automatic trimming method and its scan image acquisition device | |
| CN108620881A (en) | A kind of automation section steel cutting equipment | |
| CN1642386A (en) | Method for replacing and resetting imperfect multi-piece printed circuit board | |
| CN108747386A (en) | A kind of automatic wagon drill all-in-one machine of nut and its application method | |
| CN210432078U (en) | Quick die change jig of general purpose jig | |
| CN218254453U (en) | Sanding high-precision edge cutting equipment | |
| CN218312110U (en) | A revolving stage anchor clamps for high accuracy CNC processing | |
| US5692286A (en) | Method for shaping parts in one or more stacked board shaped elements and machine tool for implementing this method | |
| CN201179740Y (en) | Flutes milling chamfering combined apparatus of space block milling machine | |
| KR20200051368A (en) | The camera and UVW stage system for using in a PCB chamfering automation | |
| CN214264643U (en) | Lock cylinder drilling, milling and discharging equipment | |
| CN113347796A (en) | Processing method for improving alignment precision of U-shaped clamping groove of PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |