CN104607867A - Board cutting and target drilling method - Google Patents
Board cutting and target drilling method Download PDFInfo
- Publication number
- CN104607867A CN104607867A CN201310535486.4A CN201310535486A CN104607867A CN 104607867 A CN104607867 A CN 104607867A CN 201310535486 A CN201310535486 A CN 201310535486A CN 104607867 A CN104607867 A CN 104607867A
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- China
- Prior art keywords
- layer sheet
- board
- cuts
- blade
- cut
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
- B23P2700/12—Laminated parts
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention discloses a board cutting and target drilling method; and the cutting treatment and the target drilling treatment are performed for a multilayer board in one stand to form a circuit board. The board cutting and target drilling method comprises the following steps: (S1) the multilayer board is fixed on a working platform; (S3) a preset cutting and target drilling position of the multilayer board is set by an X-ray positioning unit of the stand, and a present position of the multilayer board is obtained; (S5) the multilayer board is adjusted from the present position to the preset cutting and target drilling position by horizontally adjusting the working platform; (S7) the multilayer board is cut by a cutting unit in the stand; and (S9) multiple target holes are drilled in the multilayer board by a target drilling unit in the stand to form the circuit board. Through the design, the position adjusting times of the multilayer board can be reduced, the production time can be shortened, and the equipment installation space can be saved.
Description
Technical field
The present invention relates to a kind of plate body and cut brill Target process, the method can allow the multi-layer sheet after pressing process in an enterprising line position calibration of workbench, cuts process and bore target process, thus can shorten the installation space of Production Time and the equipment of saving.
Background technology
Multi-layer sheet after pressing process carries out cutting process and being formed after boring target process by known circuits plate, and according to cutting the quality condition of process, user optionally can carry out edging process again.
Above-mentioned cuts the multiple-plate irregular excessive glue excision be treated to after pressing process, and makes multiple-plate shape meet the demand of user.
In known technology, cut process, brill target process and edging process usually to carry out respectively at three kinds of equipment, for user, not only the setting of equipment takes up space very much, and user must carry out multiple-plate position correction respectively on each equipment, such Making programme can increase Production Time.
In addition, art tool knows that the knowledgeable should be appreciated that usually, the positioning unit bored in target equipment or cutting apparatus uses two camera lenses to obtain multiple-plate current position respectively, and sets multiple-plate brill target position or cut position, can carry out position correction to allow multi-layer sheet; But, field range (the FOV of known camera lens, Field of View) be about about 50mmX50mm, therefore when multiple-plate irregular excessive glue more has more more than 30mm than multiple-plate edge, these positioning units can cannot learn multiple-plate current position, and cannot target position be bored to multi-layer sheet setting or cut position, thus multi-layer sheet be made to carry out the process of brill target or to cut process.
More specifically, in existing technology, multi-layer sheet first must be relied on edge, location by cutting apparatus, could position by camera lens, but should be appreciated that, after user carries out the process of brill target to multi-layer sheet, multi-layer sheet still has irregular edge, therefore is difficult to the edge, location that is fixed against by multi-layer sheet in this cutting apparatus.
Therefore, how inventing a kind of plate body and cut brill Target process, reduce multiple-plate position correction number of times, shorten the installation space of Production Time and the equipment of saving, will be that the present invention institute is for positive disclosed feature.
Summary of the invention
For solving the defect of above-mentioned prior art, the object of the present invention is to provide a kind of plate body to cut brill Target process, multiple-plate position correction number of times can be reduced, shorten the installation space of Production Time and the equipment of saving.
For reaching above-mentioned purpose and other objects, the invention provides a kind of plate body and cut brill Target process, in same board, process cut to a multi-layer sheet and bore target process, to form circuit board, this plate body cuts brill Target process and comprises following steps: S1, is fixed on by this multi-layer sheet on a workbench; S3, sets this multiple-plate making a reservation for by the X-ray positioning unit in this board and cuts brill target position, and obtain this multiple-plate current position; S5, by this workbench of horizontal adjustment, calibrates to this by this multi-layer sheet from this current position and makes a reservation for cut brill target position; S7, by cutting unit to cut this multi-layer sheet in this board; And S9, bore target unit by one in this board and this multi-layer sheet is got out multiple wad cutter, to form this circuit board.
Cut at above-mentioned plate body and bore in Target process, wherein, this X-ray positioning unit only has a camera lens, and the field range of this camera lens (FOV, Field of View) is more than 100mmX100mm.
Cut at above-mentioned plate body and bore in Target process, wherein, in step S7, and between step S9, more comprise: S8, grind the multiple-plate edge after cutting by the edging unit in this board.
Cut at above-mentioned plate body and bore in Target process, wherein, this cuts unit and has two multiple hemisect cutters, comprises respectively: circular knives body; Multiple first blade, is sequentially located at the edge of this circular knives body, and respectively the cutter edge of this first blade and the center of this circular knives body have the first distance, and respectively this first blade has the first knife edge angular respectively; Multiple second blade, is sequentially located at the edge of this circular knives body, and respectively the cutter edge of this second blade and the center of this circular knives body have second distance, and respectively this second blade has the second knife edge angular respectively; Wherein, these first blades and these the second blades are spaced, and respectively this first distance is greater than respectively this second distance, and respectively this first knife edge angular is less than respectively this second knife edge angular.
In sum, plate body of the present invention cuts brill Target process, by means of same workbench carrying out position correction to a multi-layer sheet, cutting and bore the design of target, can reduce multiple-plate position correction number of times, shorten the installation space of Production Time and the equipment of saving.
Accompanying drawing explanation
Fig. 1 bores the flow chart of Target process for plate body of the present invention cuts.
Fig. 2 A to Fig. 2 D is that the plate body of the present invention X-ray positioning unit cut in brill Target process obtains multiple-plate current position and multiple-plate the making a reservation for of setting cuts the schematic flow sheet boring target position.
Fig. 3 is that plate body of the present invention cuts the setting position schematic diagram cutting two multiple hemisect cutters of unit bored in Target process.
Fig. 4 is that plate body of the present invention cuts the front view cutting the multiple hemisect cutter of unit bored in Target process.
Fig. 5 is that plate body of the present invention cuts the side view cutting the multiple hemisect cutter of unit bored in Target process.
Fig. 6 is the enlarged drawing at A1 place in Fig. 4.
Fig. 7 is the enlarged drawing at B1 place in Fig. 5.
Fig. 8 is the profile after the plate body of the present invention two multiple hemisect cutters cutting unit cut in brill Target process cut this multi-layer sheet.
[symbol description]
1 multi-layer sheet
2 workbenches
10 circular knives bodies
20 first blades
30 second blades
100 multiple hemisect cutters
D1 first distance
D2 second distance
F1 first tangent plane
F2 second tangent plane
F3 the 3rd tangent plane
F4 the 4th tangent plane
P1 primary importance
The P2 second place
PP is predetermined cuts brill target position
S100-S900 step
V field range
α 1 first corner cut
α 2 second corner cut
α 3 the 3rd corner cut
α 4 the 4th corner cut
θ 1 first knife edge angular
θ 2 second knife edge angular
Detailed description of the invention
For fully understanding object of the present invention, feature and effect, existing by following specific embodiment, and graphic appended by coordinating, the present invention is described in detail, illustrates as rear:
" multi-layer sheet " of the present invention refers to, the multi-layer sheet that user is formed by solderless substrate and multiple Copper Foil, this multiple-plate edge has irregular excessive glue, and this multi-layer sheet can carry out cutting process and boring target process to form a circuit board by those skilled in the art.
As shown in Figure 1, it bores the flow chart of Target process for plate body of the present invention cuts.This plate body cuts and bores Target process is in same board, cut process to a multi-layer sheet and bore target process, to form circuit board.This plate body cuts brill Target process and comprises five steps, below will describe in detail.Please first recognize, although figure does not show, in this board, comprise workbench, X-ray positioning unit, cut unit and bore target unit.
First, carry out step S100, this multi-layer sheet is fixed on the workbench in this board by user, the better central authorities being positioned at this workbench of this multi-layer sheet.
Then, carry out step S300, user sets this multiple-plate making a reservation for by the X-ray positioning unit in this board and cuts brill target position, and obtains this multiple-plate current position; More specifically, the X-ray locator that this X-ray positioning unit is familiar with by those skilled in the art, this X-ray locator has two camera lenses, sets this and multiple-plately predeterminedly cuts brill target position, and learn this multiple-plate current position by these camera lenses.
Then, carry out step S500, when learn this current position and this predetermined cut bores target position after, this multi-layer sheet, by this workbench of horizontal adjustment, is calibrated to this from this current position and makes a reservation for cut brill target position by user; More specifically, this workbench by translation or can horizontally rotate ... adjust etc. mode, thus make this multi-layer sheet move to this from this current position predetermined to cut brill target position.Wherein, when this multi-layer sheet is positioned at this workbench central, this multi-layer sheet can be shortened and move to this and predeterminedly cut the time of boring target position.
Then, carry out step S700, when this multi-layer sheet to calibrate to from this current position this predetermined cut bore target position after, user cuts this multi-layer sheet by the unit that cuts in this board; More specifically, this cuts unit hobboing cutter that be familiar with to by those skilled in the art or milling cutter ... Deng, user is cut this multi-layer sheet by the hobboing cutter or milling cutter being positioned at this multi-layer sheet upper and lower, to remove the irregular excessive glue on this multi-layer sheet, and this multiple-plate shape is made to meet the demand of user.
Finally, carry out step S900, after this multi-layer sheet carries out cutting process, this multi-layer sheet is got out multiple wad cutter, to form this circuit board by the brill target unit in this board by user.
From the above, bore after Target process carries out cutting process because plate body of the present invention cuts, this multi-layer sheet is still positioned on same workbench, therefore when user will carry out the process of brill target, this multi-layer sheet does not need again to carry out position correction.
More specifically, by above-mentioned treatment step, this multi-layer sheet first can be carried out Primary Location by user, and by this multiple-plate neat in edge, therefore, when user will carry out the process of brill target to the multi-layer sheet cut, do not need again to carry out accurate position correction to this multi-layer sheet, just can hole on this multi-layer sheet exactly.
In sum, plate body of the present invention cuts and bores Target process owing to only carrying out a position correction, therefore can save Production Time; In addition, because each step all performs on same board, therefore the installation space of equipment can be saved.
In addition, as shown in Fig. 2 A to Fig. 2 D, X-ray positioning unit (not shown) of the present invention preferably only has a camera lens (not shown), and a field range V of this camera lens (FOV, Field of View) is more than 100mmX100mm.
As shown in Figure 2 A, when plate body of the present invention cut bore Target process carry out step S300 time, predetermined the cutting that the processor (not shown) of this X-ray positioning unit can set multi-layer sheet 1 bores target position PP, and the camera lens of this X-ray positioning unit and a workbench 2 close to each other, the field range V of this camera lens moves along the long side direction of this multi-layer sheet 1.
As shown in Figure 2 B, when a minor face of this multi-layer sheet 1 is positioned at the field range V of this camera lens, this camera lens can learn primary importance P1.
As shown in Figure 2 C, when this multi-layer sheet 1 continues mobile with this camera lens, when another minor face of this multi-layer sheet 1 is positioned at the field range V of this camera lens, this camera lens can learn second place P2.The current position of this multi-layer sheet 1 can be learnt by this primary importance P1 and this second place P2.
As shown in Figure 2 D, after this multi-layer sheet 1 leaves the field range V of this camera lens completely, can step S500 be carried out, by this workbench 2 of horizontal adjustment, the primary importance P1 of this multi-layer sheet 1 and second place P2 position correction be bored target position PP to this predetermined cutting.
Because this multi-layer sheet 1 enters this field range V with long side direction, therefore when the irregular excessive glue of this multi-layer sheet 1 more has more more than 30mm than the edge of this multi-layer sheet 1, still can learn primary importance P1 and the second place P2 of this multi-layer sheet 1; By this design, can allow user when step S500, the primary importance P1 of this multi-layer sheet 1 and second place P2 position correction are bored target position PP to this predetermined cutting.
In addition, should be appreciated that, if the hobboing cutter that to cut unit is familiar with by those skilled in the art described in step S700 or milling cutter ... Deng time, plate body of the present invention cuts brill Target process and also comprises edging step (not shown), when this multi-layer sheet cuts after unit cuts through this, user grinds the multiple-plate edge through cutting by the edging unit in this board, to make this multiple-plate edge round and smoothization.
Then, as shown in Fig. 3 to Fig. 7, the unit that cuts of the present invention has two multiple hemisect cutters 100, be located at the upper and lower of this multi-layer sheet 1 respectively, to carry out multiple hemisect to the upper and lower of this multi-layer sheet 1, this multiple hemisect cutter 100 comprises circular knives body 10, multiple first blade 20 and multiple second blade 30.
These the first blades 20 are sequentially located at the edge of this circular knives body 10, respectively the cutter edge of this first blade 20 and the center of this circular knives body 10 have the first distance D1 (as shown in Figures 4 to 6), and respectively this first blade 20 has the first knife edge angular θ 1 (as shown in Figure 7) respectively.
These the second blades 30 are sequentially located at the edge of this circular knives body 10, respectively the cutter edge of this second blade 30 and the center of this circular knives body 10 have second distance D2 (as shown in Figures 4 to 6), and respectively this second blade 30 has the second knife edge angular θ 2 (as shown in Figure 7) respectively.
Please refer again to Fig. 4, these first blades 20 are spaced with these second blades 30; Please refer again to Fig. 5 and Fig. 6, respectively this first distance D1 is greater than respectively this second distance D2; Please refer again to Fig. 7, respectively this first knife edge angular θ 1 is less than respectively this second knife edge angular θ 2.For example, when respectively this first knife edge angular θ 1 is 35 °, respectively this second knife edge angular θ 2 is 90 °.
Below, again will describe this multi-layer sheet 1 of the how multiple hemisect of these multiple hemisect cutters 100 by Fig. 3, Fig. 8 and word, it comprises two flow processs; In addition, should be appreciated that, by this design, the multi-layer sheet 1 after multiple hemisect does not need the process carrying out edging, therefore can shorten Production Time and save cost.
First, the multiple hemisect cutter 100 being positioned at the top of this multi-layer sheet 1 can decline gradually and come the top of this multi-layer sheet 1 of hemisect; Multiple first blades 20 of this multiple hemisect cutter 100 first can carry out hemisect to the top of this multi-layer sheet 1, these first blades 20 can make hemisect place of this multi-layer sheet 1 form the first tangent plane F1, and the upper side of this first tangent plane F1 and this multi-layer sheet 1 accompanies the first corner cut α 1; After this multiple hemisect cutter 100 declines gradually, multiple second blades 30 of this multiple hemisect cutter 100 also then can carry out hemisect to the top of this multi-layer sheet 1, these second blades 30 can make hemisect place of this multi-layer sheet 1 form one second tangent plane F2, the upper side of this second tangent plane F2 and this multi-layer sheet 1 accompanies one second corner cut α 2, this first tangent plane F1 is connected with this second tangent plane F2, and this first corner cut α 1 is less than this second corner cut α 2.
Then, the multiple hemisect cutter 100 being positioned at the below of this multi-layer sheet 1 can rise gradually and come the below of this multi-layer sheet 1 of hemisect; Multiple first blades 20 of this multiple hemisect cutter 100 first can carry out hemisect to the below of this multi-layer sheet 1, these first blades 20 can make hemisect place of this multi-layer sheet 1 form the 3rd tangent plane F3, and the downside of this first tangent plane F3 and this multi-layer sheet 1 accompanies the 3rd corner cut α 3; After this multiple hemisect cutter 100 rises gradually, multiple second blades 30 of this multiple hemisect cutter 100 also then can carry out hemisect to the below of this multi-layer sheet 1, these second blades 30 can make hemisect place of this multi-layer sheet 1 form the 4th tangent plane F4, the downside of the 4th tangent plane F4 and this multi-layer sheet 1 accompanies one the 4th corner cut α 4, the both sides of the 3rd tangent plane F3 are connected with this first tangent plane F1 and the 4th tangent plane F4 respectively, and the 3rd corner cut α 3 is less than the 4th corner cut α 4.
After above-mentioned two flow processs, as shown in Figure 8, the edge shape of the multi-layer sheet 1 after hemisect is as arc-shaped, therefore user does not need the process carrying out edging, thus can shorten Production Time and save cost; In addition, user does not need the extra equipment arranged for edging process, thus can save the installation space of equipment.
In sum, plate body of the present invention cuts and bores Target process owing to only carrying out a position correction, therefore can save Production Time; In addition, because each step all performs on same board, therefore the installation space of equipment can be saved; Moreover, when to cut unit be multiple hemisect cutter for this, in once cutting in process, multiple hemisect can be carried out to this multiple-plate upper and lower, multi-layer sheet after multiple hemisect does not need the process carrying out edging, therefore also can shorten the installation space of Production Time and the equipment of saving.
The present invention is open with preferred embodiment hereinbefore, and right those of ordinary skill in the art it should be understood that this embodiment only for describing the present invention, and should not be read as and limit the scope of the invention.It should be noted, all changes with this embodiment equivalence and displacement, all should be set to and be covered by category of the present invention.Therefore, protection scope of the present invention is when being as the criterion with the claim person of defining.
Claims (4)
1. plate body cuts a brill Target process, cuts process and bore target process in same board to multi-layer sheet, and to form circuit board, described plate body cuts brill Target process and comprises following steps:
S1, is fixed on the workbench in described board by described multi-layer sheet;
S3, sets described multiple-plate making a reservation for by the X-ray positioning unit in described board and cuts brill target position, and obtain described multiple-plate current position;
S5, by workbench described in horizontal adjustment, calibrates to this by described multi-layer sheet from this current position and makes a reservation for cut brill target position;
S7, by cutting unit to cut described multi-layer sheet in described board; And
S9, gets out multiple wad cutter by described multi-layer sheet, to form described circuit board by the brill target unit in described board.
2. plate body as claimed in claim 1 cuts brill Target process, and wherein, described X-ray positioning unit only has a camera lens, and the field range of described camera lens is more than 100mmX100mm.
3. plate body as claimed in claim 1 or 2 cuts brill Target process, wherein, between step S7 and step S9, also comprises: S8, grinds the multiple-plate edge after cutting by the edging unit in described board.
4. plate body as claimed in claim 1 or 2 cuts brill Target process, wherein, described in cut unit there are two multiple hemisect cutters, comprise respectively: circular knives body; Multiple first blade, is sequentially located at the edge of this circular knives body, and the cutter edge of each described first blade and the center of described circular knives body have the first distance, and each described first blade has the first knife edge angular respectively; Multiple second blade, is sequentially located at the edge of described circular knives body, and each cutter edge of described second blade and the center of this circular knives body have second distance, and each described second blade has the second knife edge angular respectively; Wherein, described first blade and described second blade are spaced, and each described first distance is greater than each described second distance, and each described first knife edge angular is less than each described second knife edge angular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310535486.4A CN104607867B (en) | 2013-11-01 | 2013-11-01 | Board cutting and target drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310535486.4A CN104607867B (en) | 2013-11-01 | 2013-11-01 | Board cutting and target drilling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104607867A true CN104607867A (en) | 2015-05-13 |
| CN104607867B CN104607867B (en) | 2017-05-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310535486.4A Expired - Fee Related CN104607867B (en) | 2013-11-01 | 2013-11-01 | Board cutting and target drilling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104607867B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454746A (en) * | 2016-06-01 | 2017-12-08 | 全亨科技有限公司 | Circuit board dividing bores target and edging method |
| CN107454745A (en) * | 2016-06-01 | 2017-12-08 | 全亨科技有限公司 | Circuit board dividing cuts out mill method |
| CN109773246A (en) * | 2019-01-30 | 2019-05-21 | 无锡深南电路有限公司 | A kind of cutting edge method and apparatus of package substrate |
| CN109848567A (en) * | 2019-01-30 | 2019-06-07 | 无锡深南电路有限公司 | A kind of radium-shine milling edge equipment and method of package substrate |
| CN109905966A (en) * | 2017-12-07 | 2019-06-18 | 捷惠自动机械有限公司 | A kind of circuit twist drill target and cut out the method that mill promotes production capacity |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454746A (en) * | 2016-06-01 | 2017-12-08 | 全亨科技有限公司 | Circuit board dividing bores target and edging method |
| CN107454745A (en) * | 2016-06-01 | 2017-12-08 | 全亨科技有限公司 | Circuit board dividing cuts out mill method |
| CN109905966A (en) * | 2017-12-07 | 2019-06-18 | 捷惠自动机械有限公司 | A kind of circuit twist drill target and cut out the method that mill promotes production capacity |
| CN109773246A (en) * | 2019-01-30 | 2019-05-21 | 无锡深南电路有限公司 | A kind of cutting edge method and apparatus of package substrate |
| CN109848567A (en) * | 2019-01-30 | 2019-06-07 | 无锡深南电路有限公司 | A kind of radium-shine milling edge equipment and method of package substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104607867B (en) | 2017-05-10 |
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