CN109848567A - A kind of radium-shine milling edge equipment and method of package substrate - Google Patents
A kind of radium-shine milling edge equipment and method of package substrate Download PDFInfo
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- CN109848567A CN109848567A CN201910095489.8A CN201910095489A CN109848567A CN 109848567 A CN109848567 A CN 109848567A CN 201910095489 A CN201910095489 A CN 201910095489A CN 109848567 A CN109848567 A CN 109848567A
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- package substrate
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- workbench
- milling
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Abstract
The present invention discloses the radium-shine milling edge equipment and method of a kind of package substrate, wherein the radium-shine milling edge equipment of the package substrate includes rack shell, workbench, laser apparatus, X-ray apparatus and host；The rack shell have hollow inner cavity and it is in communication with the inner cavity enter plate mouth；Workbench, laser apparatus and X-ray apparatus are set in the inner cavity；Host connects the workbench, the X-ray apparatus and the laser apparatus, the host is to by controlling the workbench to place and transmit package substrate, the theoretical position of package substrate is obtained by controlling the X-ray apparatus, and side is milled to package substrate progress laser according to the theoretical position by controlling the laser apparatus.Technical solution of the present invention can reduce cost and quality problem in package substrate production process.
Description
Technical field
The present invention relates to electronic circuit board technical field, in particular to the radium-shine milling edge equipment of a kind of package substrate and side
Method.
Background technique
It in the production process of package substrate, needs by doing pressing increasing layer, that is, is laminated to produce multi-layer board, and after being laminated
Multiple-plate edges of boards be usually in flash state, need to be removed the processing of flash.And currently used for going the tradition of Burr removal
Process is as follows: firstly, multi-layer board is placed on work top after laminating technology；Then, matched X-ray equipment first leads to
It crosses x-ray (x-ray) and has an X-rayed multiple-plate interior tomographic image, and grabbed and drilled inside multi-layer board by x-ray brill target
Internal layer target；Finally, after matched edge milling machines carries out sets of holes positioning in the hole for boring target brill by x-ray, then carry out milling side manually
To remove the flash of package substrate.However, it is this milling side positioning method due to process process it is more, therefore have increase production week
The disadvantages of turning the time, increasing production cost, and the positioning method can leave the sets of holes of multiple positioning on plate, and these
Sets of holes will cause that plate is subsequent to tear copper foil difficulty, frequently occurs plate local deformation, the problems such as plate is lost, in turn results in plate
Quality decline.
Summary of the invention
The main object of the present invention is to provide a kind of radium-shine milling edge equipment of package substrate, it is intended to reduce package substrate production
Cost and quality problem in the process.
To achieve the above object, the radium-shine milling edge equipment of package substrate proposed by the present invention includes rack shell, workbench, radium
Injection device, X-ray apparatus and host；The rack shell have hollow inner cavity and it is in communication with the inner cavity enter plate mouth；
Workbench, laser apparatus and X-ray apparatus are set in the inner cavity；Host connects the workbench, X-ray dress
It sets and the laser apparatus, the host controls the workbench to pass through to place and transmit package substrate, pass through control
The theoretical position that the X-ray apparatus obtains package substrate is made, and by controlling the laser apparatus according to the theoretical position
Laser is carried out to the package substrate and mills side.
Optionally, the X-ray apparatus integrates formula and is set on the laser apparatus.
Optionally, the X-ray apparatus includes the radioscopy probe above the workbench, described radium-shine
Device includes moving arm and the laser head above the workbench, one end of the moving arm be connected with the laser head and
The radioscopy probe, the other end connect driving device.
Optionally, the workbench is equipped with locating piece, and the package substrate is positioned and fixed to institute by the locating piece
It states on workbench.
Optionally, the radium-shine milling edge equipment of the package substrate further includes the plate for grabbing and moving the package substrate
Part grabbing device, the plate grabbing device are set in the inner cavity, and are entered between plate mouth and the laser apparatus described in.
Optionally, the plate grabbing device includes the suction disc towards the workbench, is set on the lower face of the suction disc
There are multiple vacuum chucks.
Optionally, the rack shell far from the side of the laser apparatus offer plate outlet and it is described enter plate mouth, and institute
It states into plate mouth and plate outlet spacing side by side setting.
The present invention also proposes a kind of radium-shine milling Bian Fangfa of package substrate, and this method uses the radium-shine milling of aforementioned encapsulation substrate
The radium-shine milling side method of edge equipment, the package substrate includes:
Package substrate is positioned and is fixed by S1, control workbench；
S2, control X-ray equipment have an X-rayed package substrate, and obtain the position of internal layer target；
S3, the position based on the internal layer target, obtain the theoretical position of the package substrate；
S4, it is required according to the theoretical position and cutting edge, control laser apparatus work, with the flash to the package substrate
Carry out milling side.
Optionally, before the step S1, including step S0: control plate grabbing device crawl from enter plate mouth enter
The package substrate, and the package substrate is placed on the workbench；
After the step S4, including step S5: controlling the plate grabbing device crawl and milled the described of side completion
Package substrate, and give to plate outlet.
Optionally, in the step S1, including step S11: controlling the fixed encapsulation of the workbench vacuum suction
Substrate.
In technical solution of the present invention, the interior tomographic image of oriented package substrate is had an X-rayed by radioscopy probe,
Scanning crawl internal layer target, then reuse the laser apparatus of removable laser head and realize directly and neatly, and do not have to bore
Hole can precise positioning realized automatic laser to laser apparatus mill side.Therefore it is bored compared to current traditional lamination → x-ray
Target → milling side → tears the process flow of copper foil, and technical solution of the present invention realizes excellent for the process that x-ray bores target and mills side
Change, the drilling process of target is bored by cancelling x-ray, so that relevant process is reduced to 3 from 4, to reach reduction stream
Cheng Chengben, the purpose for accelerating plate speed of production, and reduce bore target process can also save bore the part exchanging of target, water, electricity,
Manually, the expenses such as maintenance.Simultaneously, due to eliminating this process that drills on plate, therefore copper foil is torn subsequent
In process flow, so that it may eliminate drilling to the adverse effect torn when protection copper foil operates, so that the removal work of protection copper foil
It is more convenient, and can be reduced plate local deformation and lose possibility；And due to not needing to carry out sets of holes positioning to package substrate
Operation, therefore operator can also be reduced and once transport plate movement, to alleviate homework burden, reduced and turn in plate
The probability for situations such as scratch, plate damage, board falling occur during fortune.In addition, being milled in technical solution of the present invention using radium-shine laser
The mode on side can make full use of the mobile flexible advantage of laser head, and realization does not have to the position for adjusting package substrate and can essence
The really purpose on milling side.These improvement integrate, so that it may which the cost and quality being effectively reduced in package substrate production process are asked
Topic.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is that radium-shine one embodiment of milling edge equipment of package substrate of the present invention removes the structural representation after portion chassis shell
Figure；
Fig. 2 is the flow diagram of one embodiment of radium-shine milling side method of package substrate of the present invention.
Drawing reference numeral explanation:
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that if relating to directionality instruction (such as up, down, left, right, before and after ...) in the embodiment of the present invention,
Then directionality instruction be only used for explain under a certain particular pose (as shown in the picture) between each component relative positional relationship,
Motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, being somebody's turn to do " first ", " second " etc. if relating to the description of " first ", " second " etc. in the embodiment of the present invention
Description be used for description purposes only, be not understood to indicate or imply its relative importance or implicitly indicate indicated skill
The quantity of art feature." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one spy
Sign.It in addition, the technical solution between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
It is enough realize based on, will be understood that the knot of this technical solution when conflicting or cannot achieve when occurs in the combination of technical solution
Conjunction is not present, also not the present invention claims protection scope within.
The present invention proposes the radium-shine milling edge equipment and method of a kind of package substrate.
Referring to Figures 1 and 2, in an embodiment of the present invention, the radium-shine milling edge equipment of the package substrate include rack shell 1,
Workbench 2, laser apparatus, X-ray apparatus and host (not shown)；Rack shell 1 has hollow inner cavity 11, and and inner cavity
11 connections enter plate mouth (not shown)；Workbench 2, laser apparatus and X-ray apparatus are set in inner cavity 11；Host connection
Workbench 2, X-ray apparatus and laser apparatus, host by control workbench 2, to place and transmit package substrate, to be led to
The theoretical position that control X-ray apparatus obtains package substrate is crossed, and by control laser apparatus foundation theoretical position to encapsulation base
Plate carries out laser and mills side.
It should be noted that, for the radium-shine milling edge equipment of this package substrate, rack shell 1 includes constituting whole branch herein
The support frame and the plank outside the cladding support frame of part of frame, are equipped with warning device 8 at the top of support frame, are equipped at middle part
Workbench 2 is provided with the conveyer belt that can place and transmit package substrate on the workbench 2；Inner cavity 11 is separated by workbench 2
Epicoele and cavity of resorption, package substrate, laser apparatus, X-ray apparatus etc. are mounted in epicoele, and pressure stabilizing pneumatic device 7 etc. is set to down
In chamber, host can be set in cavity of resorption, can also be set to outside rack shell 1, and be electrically connected by conducting wire and the realization of associated inner device
It connects.
In the actual production process of package substrate, since multiple-plate edges of boards after lamination are usually in flash state, therefore
Need further to be gone the processing of Burr removal, to facilitate the assembly of subsequent package substrate.However, currently used for removing Burr removal
Traditional process be that lamination → x-ray bores target → milling side → and tears copper foil, i.e., after laminating, matched X-ray equipment first passes through x-
Ray has an X-rayed multiple-plate interior tomographic image, and is grabbed by x-ray brill target and the internal layer target that drills；Finally, matched edge milling machines exists
After boring the hole progress sets of holes positioning that target bores by x-ray, then carry out milling side manually to remove the flash of package substrate.It can manage
Solution, this positioning method for milling side have the shortcomings that increase and produce turnaround time and production cost since process process is more,
And the positioning method can leave the sets of holes of multiple positioning on plate, these sets of holes will cause that plate is subsequent to tear copper foil difficulty,
It frequently occurs plate local deformation, the problems such as plate is lost, in turn results in board quality decline.
In the present embodiment, the present invention has an X-rayed the internal layer figure of oriented package substrate by radioscopy probe 41
Then picture, scanning crawl internal layer target do not reuse the laser apparatus of removable laser head 31 and realize directly and neatly, and not
With drilling can precise positioning realize that laser apparatus, automatic laser mills side.Therefore compared to current traditional lamination → x-
Ray bores target → milling side → and tears the process flow of copper foil, and technical solution of the present invention is realized for the process that x-ray bores target and mills side
Optimization, the drilling process that target is bored by cancelling x-ray subtract to reach so that relevant process is reduced to 3 from 4
Few process cost, the purpose for accelerating plate speed of production, and reduce bore target process can also save bore target part exchanging,
The expenses such as water, electricity, artificial, maintenance.Simultaneously, due to eliminating this process that drills on plate, therefore subsequent
It tears in copper foil process flow, so that it may eliminate drilling to the adverse effect torn when protection copper foil operates, so that protection copper foil is gone
Except work is more convenient, and it can be reduced plate local deformation and lose possibility；And due to not needing to cover package substrate
The operation of hole positioning, therefore operator can also be reduced and once transport plate movement, to alleviate homework burden, reduce
The probability for situations such as scratch, plate damage, board falling occur in plate transport process.In addition, use is radium-shine in technical solution of the present invention
Laser mills the mode on side, can make full use of the mobile flexible advantage of laser head 31, and realizes the position for not having to adjustment package substrate
And it can accurately mill the purpose on side.These improvement integrate, so that it may the cost in package substrate production process be effectively reduced
And quality problem.
Referring to Fig.1, in the present embodiment, further, X-ray apparatus preferably integrates formula and is set to laser apparatus
On.In this way, can not only make the radium-shine milling edge equipment structure of this package substrate simpler compact, equipment cost is reduced, Er Qieyou
Conducive to the degree of automation and milling side efficiency of the radium-shine milling edge equipment for improving this package substrate.Specifically, X-ray apparatus includes position
Radioscopy probe 41 above workbench 2, laser apparatus include moving arm 32 and radium-shine above workbench 2
First 31, one end of moving arm 32 is connected with laser head 31 and radioscopy probe 41, and other end connection driving device (is not shown
Out), moving arm 32 can drive laser head 31 and radioscopy probe 41 in certain model after being driven device driving
Interior flexible movement is enclosed, to smoothly realize perspective scanning and laser milling side operation.Here, driving device is preferably cylinder, certainly,
In other embodiments, driving device also can be, but not limited to be driving motor etc..
Further, in the present embodiment, workbench 2 is equipped with locating piece (not shown), and package substrate passes through locating piece
It is positioned and fixed on workbench 2.The locating piece can be, but not limited to be vaccum-suction attachement pad etc., in this way, can be by package substrate
Strong fix is placed on workbench 2, so as to avoid because plate position movement due to caused by accidentally cut phenomenon generation.
Further, referring to Fig.1, in the present embodiment, the radium-shine milling edge equipment of package substrate further includes for grabbing simultaneously
The plate grabbing device 5 of mobile package substrate, plate grabbing device 5 is set in inner cavity 11, and is located at into plate mouth and laser apparatus
Between.Specifically, plate grabbing device 5 includes the suction disc 51 towards workbench 2, and the lower face of suction disc 51 is equipped with multiple vacuum
Sucker (does not indicate).In practical operation, can be adsorbed on suction disc 51 by vacuum chuck from the package substrate that plate mouth enters is entered,
Then the mechanical arm shift position of plate grabbing device 5, package substrate is placed on workbench 2, mills side in radium-shine laser
After the completion, it then is adsorbed on suction disc 51 and is moved at plate outlet, whole process can be by host whole-process control to realize high efficiency
Automatic operation.
In the present embodiment, further, enter plate mouth and plate outlet is set to side of the rack shell 1 far from laser apparatus, and
Enter plate mouth and the setting of plate outlet spacing side by side, in this way, be conducive to distinguish it is to be milled while package substrate and package substrate when having milled,
And has and shorten process stroke and make full use of the benefits such as space.And further, referring to Fig.1, the radium-shine milling of this package substrate
Edge equipment further includes mobile loading board vehicle 6, and the mobile loading board vehicle 6 for being mounted with package substrate, which is movable to, to be closed on into plate mouth and plate outlet
Lower section at, in this way, the package substrate being loaded on mobile loading board vehicle 6 can short distance move to entering at plate mouth, and mill
The package substrate that side is completed can be easily moved from plate outlet to being transported at next process flow on mobile loading board vehicle 6.
Correspondingly, referring to Fig. 2, in the present embodiment, using the radium-shine milling edge equipment of package substrate above-mentioned, it can be achieved that one
The radium-shine milling Bian Fangfa of kind package substrate, this method specifically include following steps:
Package substrate is positioned and is fixed by S1, control workbench 2；
S2, control X-ray equipment have an X-rayed package substrate, and obtain the position of internal layer target；
S3, the position based on internal layer target, obtain the theoretical position of package substrate；
S4, it is required according to theoretical position and cutting edge, control laser apparatus work is milled with the flash to package substrate
Side.
Specifically, after package substrate is located at the lower section commitment positions of laser head 31 and radioscopy probe 41, according to
The Perspective Principles of X-ray can be had an X-rayed by radioscopy probe 41 by the internal layer target that lamina rara externa covers and be seen, and passed through
, can be by the location information of each internal layer target after perspective scanning, i.e., the position coordinate data on 2 face of workbench is sent to master
Machine, to form the theoretical position of package substrate, then, laser head 31 according to host be sent to the cutting edge requirement of laser apparatus with
And the theoretical position measured, it issues laser and automatic milling side is carried out to the flash of package substrate.
It it should be noted that, include herein another lamination before step S1 further in the present embodiment referring to Fig.1
Process flow, lamination refer to the plastic materials such as core plate and PP (Polypropylene, polypropylene) by carrying out pressing increasing layer
Multiple-plate process is obtained, i.e., core plate and plastic material is formed into multiple-plate package substrate by pressing increasing layer, encapsulated
Substrate includes the inner plating for being etched with circuit, and is layered in the lamina rara externa of inner plating or more, and internal layer target is marked on inner plating
Mark.Specifically, in lamination process, the blank space of edges of boards edge is closed in inner plating, that is, core plate, can be equipped with compartment multiple
Internal layer target, the internal layer target can be, but not limited to be circular metal-plated point etc..Further, due to multiple-plate lamina rara externa
Surface have protection copper foil be adhered, therefore milling side complete after, need to will be coated on outside protection copper foil removal.
In the present embodiment, as shown in Fig. 2, further, before step S1, including step S0: control plate crawl
Package substrate and is placed on workbench by device crawl from the package substrate for entering plate mouth and entering；After step s4, including step
Rapid S5: control plate grabbing device crawl has milled the package substrate of side completion, and send to plate outlet.So, it can be achieved that encapsulation
Automation of the substrate in inner cavity 11 when position transfer improves working efficiency.In addition, to prevent from generating because of package substrate movement
It accidentally cuts, includes step S11 in step S1 in the present embodiment further: the fixed encapsulation base of control 2 vacuum suction of workbench
Plate.
In the present embodiment, the technique stream that target → milling side → tears copper foil is bored compared to current traditional lamination → x-ray
Journey, the radium-shine milling of this package substrate device in radium-shine milling of the method due to using package substrate above-mentioned, therefore have aforementioned
Package substrate radium-shine milling side device brought by whole effect, this is no longer going to repeat them.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (10)
1. a kind of radium-shine milling edge equipment of package substrate characterized by comprising
Rack shell, the rack shell have hollow inner cavity and it is in communication with the inner cavity enter plate mouth；
Workbench is set in the inner cavity；
Laser apparatus is set in the inner cavity；
X-ray apparatus is set in the inner cavity；And
Host connects the workbench, the X-ray apparatus and the laser apparatus, and the host is to pass through control institute
Workbench is stated to place and transmit package substrate, obtains the theoretical position of package substrate by controlling the X-ray apparatus, and lead to
It crosses and controls the laser apparatus according to the theoretical position to package substrate progress laser milling side.
2. the radium-shine milling edge equipment of package substrate as described in claim 1, which is characterized in that the X-ray apparatus integrally collects
An accepted way of doing sth is set on the laser apparatus.
3. the radium-shine milling edge equipment of package substrate as claimed in claim 2, which is characterized in that the X-ray apparatus includes position
Radioscopy probe above the workbench, the laser apparatus include moving arm and are located above the workbench
Laser head, one end of the moving arm is connected with the laser head and the radioscopy probe, other end connection driving
Device.
4. the radium-shine milling edge equipment of package substrate as claimed in claim 2, which is characterized in that the workbench is equipped with positioning
Part, the package substrate are positioned and fixed on the workbench by the locating piece.
5. the radium-shine milling edge equipment of package substrate as claimed in claim 2, which is characterized in that the radium-shine milling of the package substrate
Edge equipment further includes the plate grabbing device for grabbing and moving the package substrate, and the plate grabbing device is set to described
In inner cavity, and enter between plate mouth and the laser apparatus described in.
6. the radium-shine milling edge equipment of package substrate as claimed in claim 5, which is characterized in that the plate grabbing device includes
The lower face of suction disc towards the workbench, the suction disc is equipped with multiple vacuum chucks.
7. the radium-shine milling edge equipment of package substrate as described in claim 1, which is characterized in that the rack shell is far from the radium
The side of injection device offer plate outlet and it is described enter plate mouth, and it is described enter plate mouth and the plate outlet spacing side by side setting.
8. a kind of radium-shine milling Bian Fangfa of package substrate, which is characterized in that use envelope as described in any one of claim 1 to 7
The radium-shine milling edge equipment of substrate is filled, the radium-shine milling side method of the package substrate includes:
Package substrate is positioned and is fixed by S1, control workbench；
S2, control X-ray equipment have an X-rayed package substrate, and obtain the position of internal layer target；
S3, the position based on the internal layer target, obtain the theoretical position of the package substrate；
S4, it is required according to the theoretical position and cutting edge, control laser apparatus work is carried out with the flash to the package substrate
Mill side.
9. the radium-shine milling Bian Fangfa of package substrate as claimed in claim 8, which is characterized in that before the step S1, packet
Include step S0: the crawl of control plate grabbing device places the package substrate from the package substrate for entering plate mouth and entering
In on the workbench；
After the step S4, including step S5: controlling the encapsulation that the plate grabbing device crawl has milled side completion
Substrate, and give to plate outlet.
10. the radium-shine milling Bian Fangfa of package substrate as claimed in claim 8, which is characterized in that in the step S1, including
Step S11: the fixed package substrate of the workbench vacuum suction is controlled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910095489.8A CN109848567A (en) | 2019-01-30 | 2019-01-30 | A kind of radium-shine milling edge equipment and method of package substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910095489.8A CN109848567A (en) | 2019-01-30 | 2019-01-30 | A kind of radium-shine milling edge equipment and method of package substrate |
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| Publication Number | Publication Date |
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| CN109848567A true CN109848567A (en) | 2019-06-07 |
Family
ID=66897169
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910095489.8A Pending CN109848567A (en) | 2019-01-30 | 2019-01-30 | A kind of radium-shine milling edge equipment and method of package substrate |
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| CN (1) | CN109848567A (en) |
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| CN111516055A (en) * | 2020-04-27 | 2020-08-11 | 南兴装备股份有限公司 | Rule and square pre-milling mechanism and machining method |
| CN113498275A (en) * | 2020-04-07 | 2021-10-12 | 无锡深南电路有限公司 | Preparation method of coreless circuit board |
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