WO2008010289A1

WO2008010289A1 - Method of perforating coverlay film

Info

Publication number: WO2008010289A1
Application number: PCT/JP2006/314433
Authority: WO
Inventors: Kazuhiko Kato
Original assignee: Beac Co., Ltd.
Priority date: 2006-07-20
Filing date: 2006-07-20
Publication date: 2008-01-24
Also published as: JPWO2008010289A1; JP4993397B2

Abstract

A method of perforating a coverlay film, characterized by including the first perforating step of making multiple first product holes (H1) and two reference holes (H4) in coverlay film (W) by means of first perforating metal die (510) and the second perforating step of making multiple second through-holes (H3) in the coverlay film (W) by means of second perforating metal die (540), wherein in the second perforating step, the two reference holes (H4) are photographed to thereby measure the positions of the reference holes (H4) in the coverlay film (W), subsequently the position and/or posture of the coverlay film (W) against the second perforating metal die (540) is regulated on the basis of measuring results, and thereafter second product holes (H3) are formed in the coverlay film (W). Accordingly, this coverlay film perforating method realizes forming of the product holes (H3) made in the second perforating step to the product holes (H1) made in the first perforating step with precision corresponding to miniaturization and as a result, forming of a product hole pattern finer than in the prior art.

Description

Specification

How to punch coverlay film

Technical field

The present invention relates to a method for punching a cover lay film, a cover lay film, a flexible circuit board, an electronic device, and a cover lay film punching device.

Background art

[0002] In the process of forming a flexible circuit board, a surface protection film for a flexible circuit board (hereinafter referred to as a cover) having a thermosetting adhesive layer on the pattern forming surface of a base film on which a conductor pattern such as copper foil is formed. There is a process of pasting together (referred to as Patent Document 1) o

FIG. 14 is a diagram for explaining the cover lay film W. As shown in FIG. 14 (a) is a plan view schematically showing the cover lay film W, and FIG. 14 (b) is a cross-sectional view taken along line AA in FIG. 14 (a). In FIG. 14, the product hole H is assumed to be circular, and is exaggerated and drawn larger than the actual size.

[0004] In the coverlay film W, as shown in FIG. 14 (a), a plurality of product holes H are formed. Further, as shown in FIG. 14 (b), the cover lay film W has a structure in which the cover lay film body Wb and the release paper We are laminated. According to such a cover lay film W, the cover lay film main body Wb is peeled from the release paper We, and then the cover lay film main body Wb and the base film are bonded together under an appropriate positional relationship to the base film. It is possible to manufacture a flexible circuit board in which a portion necessary for connection with an external device, an electronic device, etc. is selectively exposed in the formed conductor pattern.

[0005] Incidentally, the coverlay film W generally has a product hole pattern having a portion in which the interval between adjacent product holes is extremely narrow (see FIG. 14 (b);). However, it is not easy to form such a product hole of the coverlay film W by a single punching process using a punching die having a punching die and a die die. The reason for this is that the punch pattern corresponding to the product hole pattern having a part where the interval between adjacent product holes is extremely narrow. This is because it is extremely difficult to produce a die hole pattern.

[0006] Therefore, conventionally, the product holes to be formed are divided into a first product hole group and a second product hole group complementary to each other, and these first product hole and second product hole are used for the first drilling. There is known a method for punching a coverlay film that is sequentially formed using a die and a second punching die. According to the conventional method for perforating a cover lay film, it is possible to form a product hole pattern on the cover lay film W having a portion where the distance between adjacent product holes is extremely narrow.

FIG. 15 is a view for explaining a first punching die 10 (first punch die 20 and first die die 30) used in the conventional method for punching a cover lay film. is there. FIG. 15 (a) is a plan view showing the first punch mold 20, and FIG. 15 (b) is a plan view showing the first die 30. FIG.

FIG. 16 is a view for explaining the second punching die 40 (second punch die 50 and second die die 60) used in the conventional method for punching a coverlay film. 16 (a) is a plan view showing the second punch mold 50, FIG. 16 (b) is a plan view showing the second die mold 60, and FIG. 16 (c) is a plan view of FIG. FIG.

FIG. 17 is a view for explaining a conventional method for punching a cover lay film.

Fig. 17 (a) is a diagram showing the perforated state of the cover lay film W after the first perforating step is performed, and Fig. 17 (b) is the perforated state of the cover lay film W after the second perforating step. FIG. In FIGS. 17 (a) and 17 (b), the left side of the drawing is shown as the upstream side of the cover lay film W.

The first punch die 20 in the first punch die 10 has a plurality of first product hole punches 22 and two positioning hole punches 24 as shown in FIG. 15 (a). Of these, the first product hole punch 22 is a punch for forming the first product hole H (see FIG. 17A) in the coverlay film W, and the positioning hole punch 24 is the second punching step. The positioning hole H used when positioning the coverlay film W at V (Fig. 17 (a) and

2

See Fig. 17 (b). ). As shown in FIG. 15 (b), the first die die 30 in the first punch die 10 has a plurality of first product hole die holes corresponding to the plurality of first product hole punches 22. 2 corresponding to 32 and 2 positioning hole punches 24 A die hole 34 for positioning holes is formed.

[0010] As shown in FIG. 16 (a), the second punch die 50 in the second punch die 40 has a plurality of second product hole punches 52, and two positioning pin recesses 54. Is formed. Of these, the second product hole punch 52 is the second product hole H in the coverlay film W (

3 See Figure 17 (b). The positioning pin recess 54 is a recess provided corresponding to a positioning pin 64 described later (see FIG. 17 (b);). As shown in FIGS. 16 (b) and 16 (c), the second die mold 60 in the second drilling mold 40 includes a plurality of second die holes 52 corresponding to the plurality of second product hole punches 52. A die hole 62 for product hole is formed, and two positioning pins 64 used for positioning the coverlay film W are erected during the second drilling process.

[0011] In the conventional method for punching a cover lay film, first, as shown in FIG. 17 (a), a first punching step is performed using a first punching die 10, and a cover lay film W is formed. A plurality of first product holes H and two positioning holes H are formed. Next, as shown in Figure 17 (b)

1 2

Then, the second perforation process is performed using the second perforation mold 40 to form a plurality of second product holes H in the cover lay film W that has undergone the first perforation process. At this time, in the second drilling step

Three

The cover lay fill for the second die 40 is inserted by inserting the positioning hole H of the cover lay film W into the positioning pin 64 erected on the second die die 60.

2

Position W.

Therefore, according to the conventional method for punching a cover lay film, the product hole H to be punched in the first punching step and the product hole H to be punched in the second punching step are correctly aligned.

13

It becomes possible to form a product hole.

[0013] Patent Document 1: International Publication No. 2005Z100220 Pamphlet

Disclosure of the invention

Problems to be solved by the invention

Incidentally, in recent years, with the refinement of circuit patterns on flexible circuit boards, there is a demand for forming a finer product hole pattern on the coverlay film than in the past. However, in the conventional method for punching a cover lay film, when a finer product hole pattern is formed in the cover lay film than in the conventional method, the first punching film is used. The product hole H to be formed in the second drilling process is made more refined than the product hole H to be formed

13

Therefore, there is a problem that it is difficult to form with a high accuracy, and as a result, a finer product hole pattern cannot be formed.

Accordingly, the present invention has been made to solve such a problem, and provides a method for punching a coverlay film that can form a finer product hole pattern than before. Objective. Further, the present invention is a cover lay film manufactured using such a method for punching a cover lay film, a flexible circuit board manufactured using the cover lay film, and manufactured using the flexible circuit board. The purpose is to provide electronic equipment. Furthermore, an object of the present invention is to provide a cover lay film punching device that can be suitably used in such a method for punching a cover lay film.

Means for solving the problem

[0016] In order to achieve the above object, the inventor of the present invention uses the conventional method for punching a cover lay film, so that the second punching step is performed on the product hole H formed in the first punching step. Investigate why it is difficult to form product holes H with high precision according to miniaturization

Three

As a result of intensive efforts, this is caused by the position of the second die for standing up when positioning the coverlay film with respect to the second punching die. Occurs between the outer diameter of the fixing pin 64 and the diameter of the positioning hole H of the coverlay film W

2

As a result of the existence of the clearance, it was found that the coverlay film could not be aligned with high accuracy with respect to the second punching die.

[0017] Therefore, based on the above knowledge, the inventor of the present invention passes the positioning hole H of the coverlay film W through the positioning pin 64 of the second die mold 60, and the position of the coverlay film.

2

Measure the position of the first through hole (first product hole or positioning reference hole) formed in the first drilling process without adjusting the position of the device using an imaging device. Thus, the inventors have conceived that the above problems can be solved by adjusting the position and posture of the coverlay film, and the present invention has been completed.

[0018] (1) That is, the method for punching a cover lay film of the present invention uses a first punch die having a first punch die and a first die die. 1st penetration A plurality of second through holes are formed in the coverlay film using a first punching step for forming a hole, and a second punching die having a second punching die and a second die die. A second perforation step, wherein in the second perforation step, the first through hole is photographed using an imaging device to measure the position of the first through hole in the cover lay film, and the measurement result The second through hole is formed in the cover lay film after adjusting the position and Z or the posture of the cover lay film with respect to the second punching die.

[0019] Therefore, according to the method for punching a coverlay film of the present invention, the position of the first through hole formed in the first punching step is measured using an imaging device, and the cover is based on the measurement result. In order to adjust the position and Z or the posture of the lay film, if the above measurement and adjustment are performed with accuracy according to the miniaturization, the second perforation is made for the product hole formed in the first perforation process. Product holes to be formed in the process can be formed with an accuracy corresponding to the miniaturization, and as a result, a product hole pattern that is finer than before can be formed.

[0020] (2) In the method for punching a cover lay film of the present invention, in the first punching step, a plurality of product holes are used as the first through holes, and the cover layer in the second punching step. It is preferable to form a reference hole used as a reference for adjusting the position and Z or the posture of the film.

In the cover lay film perforating method of the present invention (the cover lay film perforating method described in (1) above), in the first perforation step, only the product hole is formed as the first through hole, and the second perforation is performed. In the process, it is possible to adjust the position and Z or the posture of the cover lay film using the product hole, but the method for punching the cover lay film of the present invention (the method for punching the force burley film described in (2) above) ), In the second drilling process, the position and Z or orientation of the cover lay film can be determined with higher accuracy by using the reference hole suitable for adjusting the position and Z or orientation of the cover lay film than the product hole. It becomes possible to adjust. For this reason, it is possible to form the product hole formed in the second drilling process with higher positional accuracy than the product hole formed in the first drilling process, resulting in the formation of a finer product hole pattern. It becomes possible to do.

(3) In the coverlay film punching method of the present invention, in the second punching step, Thus, it is preferable to photograph the first through hole using at least two imaging devices as the imaging device.

By adopting such a method, it is possible to measure the positions of at least two first through holes in the second drilling step. Therefore, the position of the first through hole can be measured with higher accuracy, and the position and orientation of the cover lay film with respect to the second punching die can be adjusted with higher accuracy. This makes it possible to form the product holes formed in the second drilling process with higher positional accuracy than the product holes formed in the first drilling process, and as a result, a finer product hole pattern can be formed. It becomes possible.

(4) In the cover lay film punching method of the present invention, the second punching die has at least two shooting holes corresponding to the at least two imaging devices. I like it! /

[0025] By adopting such a method, in the second drilling step, it is possible to photograph the first through hole through at least two photographing holes. Therefore, the position of the first through hole can be measured with higher accuracy, and the position and posture of the cover lay film with respect to the second punching die can be adjusted with higher accuracy. . This makes it possible to form the product holes formed in the second drilling step with higher positioning accuracy than the product holes formed in the first drilling step, and as a result, form a finer product hole pattern. It becomes possible.

(5) In the method for punching a cover lay film of the present invention, in the second punching step, the cover lay film is formed by the second punch die and the second die die. It is preferable that the first through hole is photographed in a sandwiched state.

[0027] By adopting such a method, in the second punching step, it is possible to photograph the first through-hole without the coverlay film being undulated. As a result, the position of the first through hole can be measured with higher accuracy, and the position and orientation of the force burley film with respect to the second punching die can be adjusted with higher accuracy. This makes it possible to form the product holes formed in the second drilling process with higher positional accuracy than the product holes formed in the first drilling process, and as a result, form a finer product hole pattern. Can be achieved.

[0028] (6) The cover lay film of the present invention is a cover lay film manufactured using the method for punching a cover lay film of the present invention.

[0029] For this reason, the cover lay film of the present invention is manufactured by using the excellent method for perforating a cover lay film as described above, and thus a finer product hole pattern is formed than before. It becomes a cover lay film.

[0030] (7) The flexible circuit board of the present invention is a flexible circuit board manufactured using the cover lay film of the present invention.

[0031] For this reason, the flexible circuit board of the present invention is manufactured using a coverlay film in which a finer product hole pattern is formed than in the prior art. Become.

(8) The electronic device of the present invention is an electronic device manufactured using the flexible circuit board of the present invention.

[0033] For this reason, the electronic device of the present invention is manufactured using a flexible circuit board with a higher quality than before, and thus becomes an electronic device with a higher quality than before.

(9) A cover lay film punching device of the present invention includes a first punch die and a first die die, and a first for forming a plurality of first through holes in the cover lay film. In order to form a plurality of second through holes in a cover lay film having a punching mold, a second punch mold, and a second die mold, wherein the plurality of first through holes are formed. A second drilling die, a first punching die and a second punching die attaching portion to which the second punching die can be attached and detached, and an imaging device for photographing the first through-hole, A measurement device that measures the position of the first through-hole in the cover lay film based on a result of imaging by the imaging device, and a cover layout for the second punching die based on the measurement result of the measurement device. Coverlay film position / posture adjustment device for adjusting the position, Z or posture of the film Characterized in that it comprises and.

Therefore, according to the cover lay film punching device of the present invention, the position of the first through hole formed in the first punching step is measured using the imaging device, and the cover is based on the measurement result. Since it is possible to adjust the position and Z or posture of the lay film, If the adjustment is performed with the accuracy corresponding to the miniaturization, the product hole formed in the second drilling process can be formed with the accuracy according to the miniaturization with respect to the product hole formed in the first drilling process. As a result, it is possible to form a finer product hole pattern than before.

In the cover lay film punching device of the present invention, the first punching die and the second punching die are preferably punching dies having different product hole forming patterns.

[0037] By configuring in this way, the first product hole is formed using the first drilling die, and the second product hole is formed using the second drilling die. It is also possible to produce a coverlay film having a fine product hole pattern.

(10) In the cover lay film punching device of the present invention, it is preferable that the measuring device has at least two imaging devices as the imaging device.

[0039] With this configuration, in the second drilling step, the positions of at least two first through holes can be measured. Therefore, the position of the first through hole can be measured with higher accuracy, and the position and orientation of the cover lay film with respect to the second punching die can be adjusted with higher accuracy. This makes it possible to form the product holes formed in the second drilling process with higher positional accuracy than the product holes formed in the first drilling process, and as a result, a finer product hole pattern can be formed. It becomes possible.

[0040] (11) In the cover lay film punching device of the present invention, the second punching die may have at least two shooting holes corresponding to the at least two imaging devices. preferable.

[0041] With this configuration, in the second drilling step, it is possible to photograph the first through hole through at least two photographing holes. As a result, the position of the first through hole can be measured with higher accuracy, and the position and orientation of the cover lay film relative to the second punching die can be adjusted with higher accuracy. This makes it possible to form the product holes formed in the second drilling process with higher positional accuracy than the product holes formed in the first drilling process, and as a result, form a finer product hole pattern. Is possible. [0042] (12) The cover lay film punching device of the present invention preferably further includes a punching die driving device that performs a punching operation by driving a servo motor.

[0043] In the cover lay film punching device of the present invention, for example, a punching die driving device that performs a punching operation by hydraulic drive can be used as the punching die driving device. However, as described above, by using the punching die driving device that performs the punching operation by the servo motor drive as the punching die drive device, the controllability of the punching operation in the punching die is improved. This makes it possible to improve the quality of product holes to be formed. In addition, it is possible to improve workability when drilling.

[0044] (13) In the cover lay film punching device of the present invention, an RTR type cover lay film punching device using a long cover lay film wound as a roll as the cover lay film, A force for feeding the roll-shaped cover lay film into a sheet shape, a bar lay film feeding device, a cover lay film feeding device for feeding the sheet-like cover lay film fed by the cover lay film feeding device to a punching position, and And a cover lay film winding device for winding the sheet-like cover lay film, which has been punched by the first punching die or the second punching die, into a roll.

[0045] With this configuration, it is possible to form fine product holes with high efficiency by the RTR (roll-to-roll) method.

[0046] (14) In the cover lay film punching device of the present invention, it is disposed between the punching position and the cover lay film winding device and can remove punch scraps attached to the cover lay film. A perforated waste removing device, wherein the perforated waste removing device includes at least one first adhesive roller rotatably disposed in contact with one surface of the force barley film, and the first adhesive roller. 1 a first punch debris removal mechanism having a second adhesive roller that is rotatably arranged in contact with the adhesive roller and has a higher adhesiveness than the first adhesive roller; and the other surface of the cover lay film And at least one third adhesive roller rotatably disposed in contact with the roller, and rotatably disposed in contact with the third adhesive roller and stronger adhesive than the third adhesive roller. 4th viscosity with It is preferable to have a second perforated waste removal mechanism having a landing roller.

With this configuration, the first adhesive roller and the third adhesive roller can remove the perforated dust adhering to the coverlay film by suction. For this reason, it is possible to manufacture a high-quality cover lay film with no perforated scrap attached.

[0048] Further, with this configuration, it becomes possible for the second adhesive roller to remove the perforated dust adsorbed by the first adhesive roller, and the fourth adhesive roller adsorbs the perforated waste adsorbed by the third adhesive roller. The roller can be removed. For this reason, it is possible to suppress a decrease in the adsorptivity of the first adhesive roller and the third adhesive roller. The second adhesive roller and the fourth adhesive roller can be replaced with new adhesive rollers if the adhesive force decreases.

[0049] (15) In the cover lay film punching device of the present invention, the cover lay film punching device is disposed between the punching die attaching portion and the cover lay film winding device. It is preferable to further include a half-cut device for cutting the cover lay film main body.

[0050] With this configuration, even when the cover lay film body is manually supplied to the base film and the cover lay film is bonded to the base film, the release paper strength is also covered. The lay film main body can be easily peeled off, and workability can be improved.

[0051] (16) A cover lay film punching device according to the present invention is the cover lay film punching device used in the cover lay film punching device according to any one of (9) to (15) above, A drilling die mounting portion to which the mold for die and the second punching die can be attached and detached, and an imaging device for photographing the first through hole, and based on the result of photographing by the imaging device, A measuring device that measures the position of the first through-hole in the cover lay film, and a cover that adjusts the position and Z or the posture of the cover lay film with respect to the second punching mold based on the measurement result of the measuring device. A lay film position / posture adjustment device is provided.

[0052] For this reason, according to the cover lay film punching device of the present invention, if the first punching die and the second punching die are separately prepared, any of the above (9) to (15) may be shifted. It becomes possible to constitute the coverlay film punching device described in 1. above. Brief Description of Drawings

FIG. 1 is a front view for explaining a cover lay film punching device 100 according to a first embodiment.

FIG. 2 is a plan view for explaining the cover lay film punching apparatus 100 according to the first embodiment.

FIG. 3 is an enlarged view of an essential part schematically showing a punching mechanism 500.

FIG. 4 is a view for explaining a first punching die 510 (first punch die 520 and first die die 530) used in the first embodiment.

FIG. 5 is a view for explaining a second punching die 540 (second punching die 550 and second die die 560) used in the first embodiment.

FIG. 6 is a flowchart for explaining the first drilling step S110.

FIG. 7 is a flowchart for explaining the second drilling step S 120.

FIG. 8 is a view for explaining the first drilling step S110.

FIG. 9 is a view for explaining the second drilling step S 120.

[Fig. 10] Drilling dies 510a, 540a used in Embodiment 2 (first punch die 520a, first die die 530a, second punch die 550a, and second die die 560a) It is a figure shown in order to explain.

FIG. 11 is a flow chart for explaining the method for punching a coverlay film according to the second embodiment.

FIG. 12 is a view for explaining a method for punching a coverlay film according to the second embodiment.

FIG. 13 is a side view for explaining a cover lay film punching device 104 according to a third embodiment.

FIG. 14 is a view for explaining a cover lay film W.

FIG. 15 is a view for explaining a first punch die 10 (first punch die 20 and first die die 30) used in the conventional method for punching a coverlay film.

FIG. 16 is a view for explaining a second punch die 40 (second punch die 50 and second die die 60) used in a conventional coverlay film punching method. FIG. 17 is a view for explaining a conventional method for punching a cover lay film.

BEST MODE FOR CARRYING OUT THE INVENTION

[0054] Hereinafter, a cover lay film punching method, a cover lay film, a flexible circuit board, an electronic device, and a cover lay film punching device according to the present invention will be described based on the embodiments shown in the drawings.

[0055] [Embodiment 1]

First, a cover lay film punching apparatus 100 according to Embodiment 1 will be described with reference to FIGS.

FIG. 1 is a front view for explaining a cover lay film punching apparatus 100 according to Embodiment 1. FIG. FIG. 2 is a plan view for explaining the coverlay film punching apparatus 100 according to the first embodiment. FIG. 3 is an enlarged view of an essential part schematically showing the punching mechanism 500. As shown in FIG. 3 (a) is a side view of the punching mechanism 500, and FIG. 3 (b) is a cross-sectional view taken along the line AA in FIG. 3 (a).

[0056] In the following description, three directions orthogonal to each other are defined as the X-axis direction (parallel to the paper surface in FIG. 1 and the left-right direction), the y-axis direction (direction perpendicular to the paper surface in FIG. 1), and The z-axis direction (vertical direction parallel to the paper surface in Fig. 1).

[0057] As shown in Figs. 1 to 3, the coverlay film punching device 100 according to the first embodiment is mounted with various mechanisms (described later). Cover lay film unwinding device 300 that unwinds cover lay film W into a sheet shape, and cover lay film take-up device 400 that winds sheet-like cover lay film W unwound from cover lay film unwinding device 300 The punching mechanism 500 for forming a through-hole in the coverlay film W, the punching die driving device 900 for driving the punching die 510 in the punching mechanism 500, and the coverlay film feeding device 300 Coverlay film feed device 600 that feeds the covered cover film W to the punching position in the punching mechanism 500 and the position of the through hole in the coverlay film W Measuring device 700 (not shown) to be used, and a cover lay film position for adjusting the position and posture of the cover lay film W with respect to the punching die 510 attached to the punching mechanism 500 based on the measurement result by the measuring device 700 · Equipped with posture adjustment device 800. As shown in FIG. 1, the apparatus main body 200 is configured by a substantially rectangular base. On the right side of the apparatus main body 200, a controller box 210 containing a controller (not shown) for driving and controlling each mechanism and the like by a setting program is disposed.

The cover lay film feeding device 300 has a feeding roller 310 and a torque motor 312 as shown in FIGS. The feeding roller 310 is rotatably supported on a roller support 320 extending from the apparatus main body 200. The roll-shaped cover lay film W is fed out into a sheet shape by the rotation of the torque motor 312 driven.

The cover lay film winding device 400 includes a winding roller 410 and a torque motor 412 as shown in FIGS. The take-up roller 410 is rotatably supported on a roller support 420 extending from the apparatus main body 200. The sheet-like cover lay film W is wound up in a roll shape by the rotation of the torque motor 412.

As shown in FIGS. 1 and 2, the punching mechanism 500 is disposed between the cover lay film feeding device 300 and the cover lay film winding device 400. As shown in FIG. 3 (a), the punching mechanism 500 has a first punch die 520 or a second punch die 550 (in FIG. 3 (a), the first punch die 520 is attached. The first die die 530 or the first die die 530 (Fig. 3 (a) is attached). And a die mold mounting portion 578 that can be attached and detached, and is disposed in a drilling mechanism main body 580 for mounting and fixing the drilling mechanism 500.

The punching die drive device 900 includes a servo motor 910, a drive shaft 920, a guide post 930, an elevating body 940, a pulley 950 and a belt 960. The rotation of the servo motor 910 is transmitted to the drive shaft 920 through the belt 960 and the pulley 950. The elevating body 940 is configured to be movable up and down by the rotation of the drive shaft 920.

[0063] As shown in FIG. 3, the punch die attachment portion 572 is connected to the lifting body 940 via the guide post 930, and the punch die attachment portion 572 can be raised and lowered by raising and lowering the lifting body 940. It is configured. The measurement device 700 (not shown) has two imaging devices 710 and 720. The two image pickup devices 710 and 720 are attached to an image pickup device support base 730 disposed at the top of the punching mechanism 500, as shown in FIG.

[0065] As shown in Figs. 1 and 2, the cover lay film feeding device 600 includes a cover lay film feeding clamper 610, a cover lay film feeding clamper table 612, a servo motor 614, a guide rail 616, a screw shaft 618, Cover lay film feed side guide port roller 632, cover lay film take-up side guide roller 634, pair of clampers 622, 624, frame 642 and support body 644, placed on cover lay film position and posture adjustment device 800 Has been.

[0066] The cover lay film feed clamper 610 is disposed on the cover lay film feed clamper table 612 and extends in the X-axis direction by the rotation of the screw shaft 618 driven by the servo motor 614. It is configured to be movable in the X-axis direction

[0067] The cover lay film feeding side guide roller 632 is attached to the cover lay film feeding clamper table 612 via the frame 642, and is a sheet-like cover lay film fed from the cover lay film feeding device 300. It is configured to arrange W on the drilling mechanism 500 side.

[0068] The cover lay film take-up side guide roller 634 is connected to the cover lay film feed clamper table 612 via the support 644, and the burley film W is covered with the cover lay film W. It is configured to guide to the winding device 400 side.

A pair of fixed clampers 622 and 624 are disposed on both sides of the punching mechanism 500 in the X-axis direction so as to be able to grip the force-burley film W.

[0070] As shown in FIG. 1, the cover lay film position / posture adjustment device 800 includes a first fine movement device 81.

0, having the second fine movement device 820 and the third fine movement device 830, the cover lay film feeding device 600 can be finely moved in the X-axis direction and the y-axis direction and rotated around an axis along the z-axis direction. It is configured to be movable.

As shown in FIG. 1, the first fine movement device 810 includes a servo motor (not shown), a servo motor. And a first shaft 812 and a rail 814 extending along the y-axis direction, which are arranged in the apparatus main body 200. The first fine movement device 810 is configured such that the first table 812 can be finely moved in the y-axis direction on the rail 814 by the rotation of the screw shaft driven by the servo motor.

As shown in FIG. 1, the second fine movement device 820 includes a servo motor (not shown), a screw shaft (not shown) pivotally supported by the servo motor, the second table 822, and the X-axis direction. The rail 824 extends along the first table 812 and is disposed on the first table 812. The second fine movement device 820 is configured to be finely movable in the X-axis direction on the second table 822 force S rail 824 by the rotation of the screw shaft driven by the servo motor.

[0073] The third fine movement device 830 applies rotational force to a servo motor (not shown), a screw shaft (not shown) pivotally supported by the servo motor, the third table 832, and the third table 832. The moving table 834 is provided, and is disposed on the second table 822. The third table 832 is pivotally supported by a pivot 836 on the second table 822 and is swingably disposed. The third fine movement device 830 is configured to rotate in the circumferential direction (around the z axis) about the pivot 836 by the rotation of the screw shaft driven by the servo motor.

Next, a method for punching a cover lay film according to Embodiment 1 will be described with reference to FIGS.

FIG. 4 is a view for explaining the first punching die 510 (first punching die 520 and first die die 530) used in the first embodiment. FIG. 4 (a) is a view showing a first punch mold 520, and FIG. 4 (b) is a view showing a first die mold 530. FIG.

FIG. 5 is a view for explaining the second punching die 540 (second punching die 550 and second die die 560) used in the first embodiment. FIG. 5 (a) is a view showing a second die for die 550, and FIG. 5 (b) is a view showing a second die for die 560. FIG.

[0075] FIG. 6 is a flowchart for explaining the first drilling step S110.

FIG. 7 is a flowchart for explaining the second drilling step S120. FIG. 8 is a view for explaining the first drilling step S110. FIG. 8A to FIG. 8C are diagrams showing each step in the first drilling step S110.

FIG. 9 is a view for explaining the second drilling step S120. Figure 9 (a) to Figure 9 (d) It is a figure showing each step in the 2nd punching process S120.

The cover lay film perforating method according to the first embodiment includes a first perforating step S 110 for perforating the cover lay film W using the first perforating mold 510, and a second perforating mold 540. This is a method of forming a product hole pattern in the force bar lay film W by performing the second punching step S120 for performing a punching force test on the cover lay film W using the In the cover lay film perforating method according to the first embodiment, as the cover lay film W, a long cover lay film wound in a roll shape is used.

First, the first punching die 510 used in the first punching step will be described. The first punching die 510 has a first punching die 520 and a first die die 530. As shown in FIG. 4 (a), the first punch die 520 has a plurality of first product hole punches 522 and two reference hole punches 524. In FIG. 4 (a), the area surrounded by the alternate long and short dash line in the first punch mold 520 indicates the perforable area of the first punch mold 520.

In the first die mold 530, as shown in FIG. 4 (b), a plurality of first product hole die holes 532 and reference hole punches 524 corresponding to the first product hole punches 522 are provided. Two reference hole die holes 534 corresponding to are formed. In FIG. 4B, the area surrounded by the alternate long and short dash line in the first die mold 530 indicates the perforable area of the first die mold 530.

[0079] Next, the second punching die 540 used in the second punching step will be described. The second punching die 540 (not shown) has a second punching die 550 and a second die die 560. As shown in FIG. 5 (a), the second punch die 550 has a plurality of second product hole punches 552, and two photographing holes 554 are formed. In FIG. 5 (a), the region surrounded by the alternate long and short dash line in the second punch die 550 indicates the perforable region of the second punch die 550.

[0080] As shown in FIG. 5 (b), a plurality of second product hole die holes 562 corresponding to the second product hole punches 552 are formed in the second die mold 560. An illumination hole 564 is formed. In FIG. 5 (b), the region surrounded by the alternate long and short dash line in the second die mold 560 indicates the perforable region of the second die mold 560.

As shown in FIG. 6, the first drilling step S110 includes a first moving step S111 and a first through hole forming step S112. [0082] The first moving step Sill is a step in which the perforation target area R in the cover lay film W is sent to the perforable area of the first perforation mold 510 by the cover lay film feeder 600 (FIG. 8). (See (a) and Figure 8 (b);). FIG. 8A shows a state in which the cover lay film W is being fed by the cover lay film feeding device 600. FIG. 8B shows a state when the perforation target area R in the coverlay film W is sent to the perforable area of the first perforation mold 510. Furthermore, in FIG. 8B, the broken line on the cover lay film W virtually indicates the positions of the first product hole punch 522 and the reference hole punch 524 in the first punch die 520. It is.

[0083] In the first through-hole forming step S112, a plurality of first product holes H and two reference holes H are formed in a state where the position of the cover lay film W relative to the first punching die 510 is adjusted.

1 4 This is the step to form (see Fig. 8 (c)).

In the cover lay film punching method according to Embodiment 1, the first product hole H and the reference hole H are formed over the entire long cover lay film W by the first punching step S 110.

1 4 After forming, remove the roll of cover lay film W from cover lay film take-up device 400 and set it in cover lay film unwinding device 300. Also, before performing the second drilling step S120, the first punching die 510 (first punch die 520 and first die die 530) is removed from the punching mechanism 500, and the second punching die is removed. Install mold 540 (second punch mold 550 and first die mold 560).

[0085] In the second drilling step S120, the first product hole H and the reference hole H are formed by the first drilling step S110.

1 4 In the process of forming the second product hole H (see Fig. 9 (d)) in the formed coverlay film W

Three

is there. Then, as shown in FIG. 7, the second moving step S121, the measuring step 122, the adjusting step S123, and the second through hole forming step S124 are included.

[0086] In the second moving step S121, the perforation target area R in the coverlay film W is covered.

2 This is the step of feeding to the punchable area in the second punching die 540 by the single lay film feeder 600 (see FIG. 9 (a);). In the coverlay film W, the first product hole H and the reference hole H formed by the first punching step S110 are formed. Figure 9 (a)

14

The state when the cover lay film W is being fed by the cover lay film feeder 600 is shown. A circle denoted by reference numeral 554 virtually indicates the position of the shooting hole 554. [0087] In measurement step S122, two reference holes H are imaged using two imaging devices 710 and 720.

4 is the step of measuring the positions of the two reference holes H in the coverlay film W (

Four

See Figure 9 (b). ) _{0 In} measurement step S122, the position of the two reference holes H is determined with the cover lay film W sandwiched between the second punch die 550 and the second die die 560.

Measure 4. In FIG. 9B, the broken line on the coverlay film W virtually indicates the position of the second product hole punch 552 in the second punch die 550.

The adjustment step S123 is a step of adjusting the position and posture of the cover lay film W with respect to the second punching die 540 based on the measurement result in the measurement step S122 (see FIG. 9 (c)); ). The position of the cover lay film W relative to the second punching die 540 'posture adjustment is performed by the cover lay film position / posture adjustment device 800 finely moving the cover lay film feed device 600 in the X-axis direction and the y-axis direction, and Rotate around an axis along the z-axis direction.

[0089] The second through-hole forming step S124 includes a plurality of second through holes in the cover lay film W in a state where the position and posture of the cover lay film W with respect to the second punching die 540 are adjusted by the adjusting step S123. This is the step of forming product holes H (see Fig. 9 (d)).

Three

Therefore, according to the method for punching a cover lay film according to Embodiment 1 including the steps as described above, the position of the reference hole H formed in the first punching step S110 is determined using an imaging device.

Four

Since the measurement and adjustment of the position, Z, or posture of the coverlay film w is performed based on the measurement result, if the above measurement and adjustment are performed with accuracy according to miniaturization, 1 Product holes formed in the second drilling process (second product holes H) can be formed with accuracy according to miniaturization, with respect to the product holes formed in the drilling process (first product hole H).

Three

As a result, it is possible to form a finer product hole pattern than before.

Further, according to the method for punching a cover lay film according to the first embodiment, in the first punching step S1 10, the reference hole H suitable for adjusting the position, Z, or posture of the cover lay film W is formed. Therefore, in the second drilling step S120, the force

4 4

It is possible to adjust the position and Z or posture of the film w with higher accuracy. Therefore, the product hole (second product hole H) formed in the second drilling step S120 is formed with higher positional accuracy than the product hole (first product hole H) formed in the first drilling step S110. As a result, a finer product hole pattern can be formed.

[0092] Further, according to the method for punching a coverlay film according to the first embodiment, the positions of the two reference holes H are measured in the second punching step S120.

4 4 position can be measured with higher accuracy, and the position and orientation of the cover lay film W relative to the second punching die 540 can be adjusted with higher accuracy. For this reason, the product hole (second product hole H) formed in the second drilling step can be formed with higher positional accuracy than the product hole (first product hole H) formed in the first drilling step S110. Made possible,

Three

As a result, a finer product hole pattern can be formed.

[0093] Further, according to the method for punching a cover lay film according to Embodiment 1, in the second punching step S120, the reference hole H is shot through the two shooting holes 554.

Four

This makes it possible to measure the position of the reference hole H with higher accuracy.

Four

The position / posture of the coverlay film W relative to 0 can be adjusted with higher accuracy. For this reason, the product hole (second product hole H) to be formed in the second drilling step is formed with higher accuracy than the product hole (first product hole H) to be formed in the first drilling step S110.

Three

As a result, a finer product hole pattern can be formed.

Further, according to the method for punching a coverlay film according to Embodiment 1, in the second punching step S120, the coverlay film W is formed by the second punch die 550 and the second die die 560. Cover hole fill because the reference hole H is shot with the

Four

It is possible to photograph the reference hole H without any undulations. For this reason, the reference hole H

4 The position of 4 can be measured with higher accuracy, and the position of the reference hole H is higher.

Four

It becomes possible to measure with high accuracy, and the position / posture of the coverlay film W with respect to the second punching die S540 can be adjusted with higher accuracy. As a result, the product hole (second product hole H) formed in the second drilling step can be formed with higher positional accuracy than the product hole (first product hole H) formed in the first drilling step S110. As a result

Three

Further, a fine product hole pattern can be formed.

[0095] On the other hand, according to the cover lay film punching device 100 according to the first embodiment, it is possible to perform the cover lay film punching method according to the first embodiment. The coverlay film perforating method has the effect.

In addition, according to the coverlay film punching device 100 according to the first embodiment, the punching die 510, 540 is further provided with the punching die driving device 900 that performs the punching operation by driving the servo motor 910. Therefore, it is possible to improve the controllability of the punching operation, and to improve the quality of the product hole to be formed. In addition, it is possible to improve workability when drilling.

[0097] Further, according to the cover lay film punching apparatus 100 according to the first embodiment, since it is an RTR type cover lay film punching apparatus using a long cover lay film wound in a roll shape, it is highly efficient and fine. It is possible to form a simple product hole.

[0098] As described above, according to the method for punching a cover lay film according to Embodiment 1, it is possible to form a finer product hole pattern in the cover lay film than in the prior art. Therefore, the cover lay film manufactured using the cover lay film perforating method according to the first embodiment is a cover lay film having a higher quality than the conventional one. Therefore, a flexible circuit board manufactured using such a cover lay film becomes a higher-quality flexible circuit board than before. In addition, an electronic device manufactured using such a flexible circuit board is a higher-quality electronic device than before.

[0099] [Embodiment 2]

FIG. 10 is a view for explaining the first punching die 510a and the second punching die 54Oa used in the second embodiment. FIG. 10 (a) is a view showing the first punch die 520a and the second punch die 550a, and FIG. 10 (b) is the first die die 530a and the second die die 560a. FIG.

FIG. 11 is a flowchart for explaining the method for punching a coverlay film according to the second embodiment.

FIG. 12 is a view for explaining the method for punching a cover lay film according to the second embodiment. 12 (a) to 12 (d) are diagrams showing steps in the method for punching a coverlay film according to the second embodiment. In FIGS. 12 (a) to 12 (d), the first drilling process shows the nth drilling process, and the second drilling process shows the n-1st process. It shows the degree. [0100] The cover lay film perforating method according to the second embodiment is basically the same method as the cover lay film perforating method according to the first embodiment, except that the first perforating step and the second perforating step are performed. It differs from the coverlay film punching method according to Embodiment 1 in that it is performed continuously (however, it can be said that the n-th first punching step and the n-1 second punching step are simultaneously performed). . That is, in the coverlay film punching method according to the second embodiment, as shown in FIG. 10, the coverlay film punching device is a first punching die 510a (first punching die 520a and first die die). Die 530a) and second punching die 540a (second punch die 550a and second die die 560a) are arranged along the coverlay film transport direction (x-axis direction) The cover lay film punching device 102 (not shown) attached to the punching mechanism 500a (not shown) is used, and the first punching step and the second punching step are performed as shown in FIGS. It will be carried out continuously.

As shown in FIG. 11, the method for punching a coverlay film according to Embodiment 2 includes a moving step S211, a measuring step S212, an adjusting step S213, and a through hole forming step S214.

[0102] The moving step S211 covers the perforation target areas R and R in the coverlay film W.

1 2 This is a step of feeding to the perforable area in the first perforating mold 510a and the second perforating mold 54 Oa by the single lay film feeder 600 (see FIG. 12 (a);). In the moving step S211, an area that has not been subjected to drilling is sent as a drilling target area R to a punchable area in the first drilling die 510a. In addition, the region where the plurality of first product holes H and the two reference holes H are formed in the immediately preceding through hole forming step S214 is a pair of holes.

14

Elephant region R is sent to the perforable area in second perforation mold 540. Figure 12

2

(a) shows a state when the cover lay film W is fed by the cover lay film feeding device 600. FIG. In addition, a circle denoted by reference numeral 554 in FIGS. 12 (a) to 12 (d) virtually indicates the position of the imaging hole 554.

[0103] In measurement step S212, two reference holes H are imaged using two imaging devices 710 and 720.

Four

See Figure 12 (b). ;). In FIG. 12 (b), the broken line on the cover lay film W on the second punching die 540a side indicates the second product hole punch 542a in the second punching die 540a. A position is virtually shown.

[0104] The adjustment step S213 is a step of adjusting the position and posture of the coverlay film W relative to the second punching die 540a based on the measurement result in the measurement step S212 (see FIG. 12 (c)); ). Adjustment step S213 is performed when the cover lay film position / posture adjustment device 800 finely moves the cover lay film feeding device 600 in the X-axis direction and the y-axis direction and rotates about the axis along the z-axis direction. Do.

The through hole forming step S214 is a step of forming a through hole in the cover lay film W in a state where the position / posture of the cover lay film W with respect to the second punching mold 540a is adjusted by the adjusting step S213. (See Figure 12 (d);). By performing the through hole forming step S214, a plurality of first product holes H and two reference holes H are formed in the pierceable region of the first piercing die 510a as shown in FIG. 12 (d). The second drilling mold 540a

14

A plurality of second product holes H are formed in the pierceable region.

Three

In the method for punching a coverlay film according to the second embodiment, the first punching die 510a is punched by performing the moving step S211, the measuring step S212, the adjusting step S213, and the through hole forming step S214. The first drilling step is performed in the possible region, and the second drilling step is performed in the punchable region of the second drilling die 540a.

Thus, the cover lay film perforating method according to the second embodiment is the same as the cover lay film perforating method according to the first embodiment in that the first perforating step and the second perforating step are continuously performed. However, as in the case of the cover lay film according to the first embodiment, the position of the reference hole H formed in the first punching process is measured using an imaging device, and based on the measurement result.

Four

Therefore, the position and Z of the coverlay film w or the posture is adjusted. Therefore, if the above measurement and adjustment are performed with accuracy according to the miniaturization, the product hole (first 1 Product hole formed in the second drilling process (second product hole H)

1 2

) Can be formed with an accuracy according to the miniaturization, and as a result, a product hole pattern finer than the conventional one can be formed.

[0108] Also, according to the method for punching a cover lay film according to the second embodiment, the first punching die 510a and the second punching die 540a are arranged in the coverlay film transport direction (x-axis direction). Using the coverlay film punching device 102 attached to the punching mechanism 500a in a line At the same time, the first drilling process and the second drilling process are to be carried out continuously.

Compared to the case where the first perforation process and the second perforation process are performed separately, it is possible to form a fine product hole pattern with high productivity.

[0109] The method for punching a cover lay film according to the second embodiment is basically the same method as the method for punching a cover lay film according to the first embodiment except for the points described above. Among the effects of the coverlay film perforating method according to the above, the corresponding effects remain as they are.

[0110] [Embodiment 3]

FIG. 13 is a side view for explaining the cover lay film punching device 104 according to the third embodiment.

In FIG. 13, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted. Further, in FIG. 13, illustration of a part of the left side of the cover lay film punching device 104 (for example, the cover lay film feeding device 300) is omitted.

[0111] The cover lay film punching device 104 according to the third embodiment is basically the same as the cover lay film punching device 100 according to the first embodiment. The coverlay film punching apparatus 100 according to the first embodiment is different from the coverlay film punching apparatus 100 in that it further includes a configuration for performing post-processing. That is, as shown in FIG. 13, the cover lay film punching device 104 according to the third embodiment includes a punching scrap removing device 1100 between the punching mechanism 500 and the cover lay film scraping device 400. And a half-cut device 1200.

[0112] As shown in FIG. 13, the perforated waste removing device 1100 includes two first adhesive rollers 1112 and a first perforated waste having a second adhesive roller 1114 having higher adhesiveness than the first adhesive roller 1112. It has a removal mechanism 1110, two third adhesive rollers 1122, and a second perforated waste removal mechanism 1120 having a fourth adhesive roller 1124 having higher adhesiveness than the third adhesive roller 1122.

[0113] The two first adhesive rollers 1112 are rotatably disposed in contact with the upper surface of the cover lay film W, and the second adhesive roller 1114 is in contact with the first adhesive roller 1112. It is arrange | positioned so that rotation is possible. Also, the two third adhesive rollers 1122 The fourth adhesive roller 1124 is rotatably arranged in contact with the lower surface of one lay film W, and the fourth adhesive roller 1124 is rotatably arranged in contact with the third adhesive roller 1122.

[0114] As shown in Fig. 13, half-cut device 1200 has blade type 1220 and second cover lay film feeding device 1240. The blade mold 1220 is configured to be capable of cutting only the cover lay film body Wb with respect to the cover lay film W, leaving the release paper We! The second cover / laying film feeding device 1240 is configured to be able to feed the coverlay film W intermittently.

[0115] For this reason, according to the coverlay film punching device 104 according to the third embodiment, the first adhesive roller 1112 and the third adhesive roller 1122 adsorb and remove the perforated waste adhering to the coverlay film W. Is possible. For this reason, it becomes possible to manufacture a high-quality cover film that is free of perforated scrap.

[0116] Further, according to the coverlay film punching device 104 according to the third embodiment, the second adhesive roller 1114 can remove the punching waste adsorbed by the first adhesive roller 1112, and the third adhesive roller 1122 can be removed. It becomes possible for the fourth adhesive roller 1124 to remove the perforated waste adsorbed by. For this reason, it is possible to suppress a decrease in the adsorptivity of the first adhesive roller 1112 and the third adhesive roller 1122. The second adhesive roller 1114 and the fourth adhesive roller 1124 can be replaced with new adhesive rollers if the adhesive force decreases.

[0117] Further, according to the cover lay film punching device 104 according to the third embodiment, since the half-cut device configured as described above is provided, the cover that has been half-cut using such a half-cut device is provided. Even if the cover film is attached to the base film by manually supplying the cover film main body Wb to the base film by using the lay film, the cover lay film main body Wb Can be easily peeled off, and workability can be improved.

[0118] Note that the cover lay film punching device 104 according to the third embodiment has basically the same configuration as the cover lay film punching device 100 according to the first embodiment except for the above, and therefore, the first embodiment. The coverlay film punching apparatus 100 according to the present invention has the corresponding effect as it is. The cover lay film perforating method, cover lay film, flexible circuit board, electronic device, and cover lay film perforating apparatus of the present invention have been described above based on the above embodiments. The present invention is not limited to the above-described embodiments, and can be carried out in various forms within the scope without departing from the gist thereof. For example, the following modifications are possible. is there.

[0120] (1) In the cover lay film perforating apparatus 100, 102 according to each of the above embodiments, the force generated by using a long cover lay film wound in a roll shape as the force bar lay film W It is not limited to this. Cover lay film W can be a strip (rectangular) cover lay film.

[0121] In this case, instead of the cover lay film unwinding device 300 and the cover lay film take-up device 400, the first cover lay film strength for placing the sheet-like cover lay film W and the cover lay film W Cover lay film supply loader that supplies the first cover lay film stock force to the force burley film moving device, and the second cover lay film stock force for placing the pierced force bar lay film W It is preferable to have a cover lay film recovery loader that recovers the only cover lay film W from the cover lay film moving device to the second cover lay film stock force! /.

(2) The cover lay film punching device 100, 102, 104 according to each of the above embodiments includes the first punching die 510, 510a and the second punching die 540, 540a. However, the present invention is not limited to this, and may be a cover lay film punching device that does not include the first punching die and the second punching die. In this case, prepare the first and second drilling dies separately.

(3) In the method for punching a coverlay film according to the second embodiment, the first punching die 510a and the second punching die 540a, which are configured separately, are attached to the punching mechanism 500a. However, the present invention is not limited to this, and a punching die in which the first punching die and the second punching die are integrated may be attached to the punching mechanism. .

[0124] (4) In the method for punching a coverlay film according to each of the above embodiments, the method includes a first punching step and a second punching step. However, the present invention is not limited to this. Well then Further, after the second drilling step, third, fourth,... Drilling steps may be further included. In this case, in the third, fourth,... Perforation process, the through hole formed in the previous perforation process is photographed using an imaging device to measure the position of the through hole in the coverlay film. Based on the measurement results, the third, fourth,. After adjusting the position and / or orientation of the cover lay film with respect to the perforating mold, a through-hole further to the cover lay film should be formed.

Explanation of symbols

10, 510, 510a ... 1st punch mold, 20, 520, 520a ... 1st punch mold, 22, 522, 522a ... 1st product hole punch, 24 ... Positioning hole punch, 30 , 530, 530a ... Die for first die 32, 532, 532a ... Die hole for first product hole, 34 ... Die hole for positioning hole, 40, 540, 540a ... Die for second punch, 50, 550 , 550a ... 2nd non-die, 52, 552, 5 52a ... 2nd product hole punch, 54 ... Positioning pin recess, 60, 560, 560a ... 2nd die, 62, 562, 562a ... Die hole for second product hole, 64 ··· Positioning pin, 100, 104 ··· Coverlay film punching device, 200 ··· Main body, 210 ··· Controller box, 300 ··· Coverlay film feeding device, 310 ······················································································· Third motor, 320 · 420 ·························································· • Hole for hole H, 534 ... Die hole for reference hole, 554, 5 74 ... Shooting hole, 564 ... Illumination hole, 570, 576 ... Mounting jig, 572 ... Punch mold mounting part, 578 ... Die mold mounting 580 ... Cover mechanism main body, 600 ... Cover lay Film feeding device, 610 ... Cover lay film feeding cranno, 612 ... Cover lay film feeding clamper table, 614 ... Servo motor, 616 ... Guide rail, 618 ... ··· Screw single shaft, 622, 624 ··· Clamper, 632 ··· Cover lay film unwinding side guide roller, 634 · · · Canoe lay film winding side guide roller, 642 "frame, 644 ··· support, 7 10, 720 ... Imaging device, 800 ... Coverlay film position 'attitude adjustment device, 810 ... First fine movement device, 812 ... First table, 814, 82Φ ... Rail, 820 ... Second Fine movement device, 822 ... 2nd table, 830 ... 3rd fine movement device 832 ... 3rd table, 834 ... Mover, 836 "Pivot axis, 900 ... Die driving device for drilling, 910 ... Servo motor, 920 ... Drive shaft, 930 ... Guide post, 940 ... ··· Lifting body, 950 · · · Pulley, 960 · · · Belt, 1100 · · · Drilling waste removing device, 1 110 ··· First perforation waste removal mechanism, 1112 ··· First adhesive roller, 1114 ··· Second adhesion roller, 112 0 ··· Second perforation waste removal mechanism, 1122 ··· 3rd adhesion roller, 1124 ··· · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · Second product hole, H ... reference hole, R, R

1 2 3 4 1 2

... perforation area, W ... cover lay film, Wb ... cover lay film body, We ... release paper

Claims

The scope of the claims

[1] A first punching step of forming a plurality of first through holes in the coverlay film using a first punching die having a first punching die and a first die die;

A second punching step of forming a plurality of second through holes in the cover lay film using a second punching die having a second punching die and a second die die,

In the second punching step, the first through hole is photographed using an imaging device, the position of the first through hole in the cover lay film is measured, and the second punching step is performed based on the measurement result. A method for punching a cover lay film, wherein the second through hole is formed in the cover lay film after adjusting the position and Z or the posture of the cover lay film with respect to a mold.

[2] According to the cover lay film punching method according to claim 1,

In the first punching step, a plurality of product holes and a reference hole used as a reference for adjusting the position and Z or the posture of the coverlay film in the second punching step are formed as the first through holes. A method for perforating a cover lay film.

[3] In the method for punching a coverlay film according to claim 1 or 2,

In the second punching step, the first through hole is photographed using at least two imaging devices as the imaging device.

[4] In the method for punching a cover lay film according to claim 3,

The method for punching a cover lay film, wherein the second punching die is formed with at least two shooting holes corresponding to the at least two imaging devices.

[5] In the method for punching a coverlay film according to any one of claims 1 to 4,

In the second punching step, the first through hole is photographed in a state where the cover lay film is sandwiched between the second punch die and the second die die. How to punch Rayfilm.

[6] A cover lay film produced using the method for punching a cover lay film according to any one of claims 1 to 5.

[7] A flexible circuit board manufactured using the coverlay film according to [6].

8. An electronic device manufactured using the flexible circuit board according to claim 7.

[9] a first punching die having a first punching die and a first die die, and forming a plurality of first through holes in the coverlay film;

A second punching die for forming a plurality of second through holes in a cover lay film having a second punch die and a second die die, wherein the plurality of first through holes are formed. And a drilling die mounting portion to which the first punching die and the second punching die can be attached and detached,

An imaging device that photographs the first through-hole, and a measurement device that measures the position of the first through-hole in the cover lay film based on a photographing result by the imaging device; A cover lay film punching device comprising: a cover lay film position / posture adjusting device for adjusting the position, Z or posture of the force burley film relative to the second punching die.

[10] The cover lay film punching device according to claim 9,

The cover lay film punching device, wherein the measuring device has at least two imaging devices as the imaging device.

[11] The cover lay film punching device according to any one of claims 9 and 10, wherein the second punching die has at least two shooting holes corresponding to the at least two imaging devices. A cover lay film punching device characterized by that.

[12] Claim 9 ~: L 1 !, cover the coverlay film punching device according to any of the above!

A coverlay film punching device, further comprising a punching die driving device that performs a punching operation by driving a servo motor.

[13] In the cover lay film punching device according to any one of claims 9 to 12,

An RTR type coverlay film punching device using a long coverlay film wound in a roll as the coverlay film,

A cover lay film unwinding device for unwinding the roll-shaped cover lay film into a sheet;

A cover lay film feeding device for feeding the sheet-like cover lay film fed by the cover lay film feeding device to a punching position; A cover lay film winding device for winding the sheet-like cover lay film, which has been punched by the first punching die or the second punching die, into a roll. Coverlay film punching device.

[14] In the coverlay film punching device according to claim 13,

Further comprising a perforation waste removing device disposed between the perforation position and the cover lay film winding device and capable of removing perforation waste adhering to the cover lay film;

At least one first adhesive roller rotatably disposed in contact with one surface of the coverlay film, and rotatably disposed in contact with the first adhesive roller; A first punch debris removal mechanism having a second adhesive roller having higher adhesiveness than the first adhesive roller;

At least one third adhesive roller rotatably disposed in contact with the other surface of the cover lay film, and rotatably disposed in contact with the third adhesive roller. A coverlay film punching device comprising: a second punching waste removing mechanism having a fourth adhesive roller having a stronger adhesiveness than the adhesive roller.

[15] The cover lay film punching device according to claim 13 or 14,

A half-cut device that is disposed between the punching die mounting portion and the cover lay film take-up device, and cuts the cover lay film main body of the cover lay film leaving the release paper. A coverlay film punching device characterized by the above.

[16] A force-burley film punching device used in the coverlay film punching device according to any one of claims 9 to 15,

A piercing die mounting portion to which the first piercing die and the second piercing die can be attached and detached;