WO2008010289A1 - Procédé de perforation de film de revêtement - Google Patents

Procédé de perforation de film de revêtement Download PDF

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Publication number
WO2008010289A1
WO2008010289A1 PCT/JP2006/314433 JP2006314433W WO2008010289A1 WO 2008010289 A1 WO2008010289 A1 WO 2008010289A1 JP 2006314433 W JP2006314433 W JP 2006314433W WO 2008010289 A1 WO2008010289 A1 WO 2008010289A1
Authority
WO
WIPO (PCT)
Prior art keywords
punching
cover lay
die
film
lay film
Prior art date
Application number
PCT/JP2006/314433
Other languages
English (en)
Japanese (ja)
Inventor
Kazuhiko Kato
Original Assignee
Beac Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beac Co., Ltd. filed Critical Beac Co., Ltd.
Priority to JP2008525767A priority Critical patent/JP4993397B2/ja
Priority to PCT/JP2006/314433 priority patent/WO2008010289A1/fr
Publication of WO2008010289A1 publication Critical patent/WO2008010289A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D5/007—Control means comprising cameras, vision or image processing systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D11/00—Combinations of several similar cutting apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Definitions

  • the present invention relates to a method for punching a cover lay film, a cover lay film, a flexible circuit board, an electronic device, and a cover lay film punching device.
  • a surface protection film for a flexible circuit board (hereinafter referred to as a cover) having a thermosetting adhesive layer on the pattern forming surface of a base film on which a conductor pattern such as copper foil is formed.
  • a cover a surface protection film for a flexible circuit board having a thermosetting adhesive layer on the pattern forming surface of a base film on which a conductor pattern such as copper foil is formed.
  • FIG. 14 is a diagram for explaining the cover lay film W. As shown in FIG. 14 (a) is a plan view schematically showing the cover lay film W, and FIG. 14 (b) is a cross-sectional view taken along line AA in FIG. 14 (a). In FIG. 14, the product hole H is assumed to be circular, and is exaggerated and drawn larger than the actual size.
  • the coverlay film W As shown in FIG. 14 (a), a plurality of product holes H are formed. Further, as shown in FIG. 14 (b), the cover lay film W has a structure in which the cover lay film body Wb and the release paper We are laminated. According to such a cover lay film W, the cover lay film main body Wb is peeled from the release paper We, and then the cover lay film main body Wb and the base film are bonded together under an appropriate positional relationship to the base film. It is possible to manufacture a flexible circuit board in which a portion necessary for connection with an external device, an electronic device, etc. is selectively exposed in the formed conductor pattern.
  • the coverlay film W generally has a product hole pattern having a portion in which the interval between adjacent product holes is extremely narrow (see FIG. 14 (b);).
  • the reason for this is that the punch pattern corresponding to the product hole pattern having a part where the interval between adjacent product holes is extremely narrow. This is because it is extremely difficult to produce a die hole pattern.
  • the product holes to be formed are divided into a first product hole group and a second product hole group complementary to each other, and these first product hole and second product hole are used for the first drilling.
  • a method for punching a coverlay film that is sequentially formed using a die and a second punching die.
  • the conventional method for perforating a cover lay film it is possible to form a product hole pattern on the cover lay film W having a portion where the distance between adjacent product holes is extremely narrow.
  • FIG. 15 is a view for explaining a first punching die 10 (first punch die 20 and first die die 30) used in the conventional method for punching a cover lay film. is there.
  • FIG. 15 (a) is a plan view showing the first punch mold 20, and
  • FIG. 15 (b) is a plan view showing the first die 30.
  • FIG. 15 (a) is a plan view showing the first punch mold 20
  • FIG. 15 (b) is a plan view showing the first die 30.
  • FIG. 16 is a view for explaining the second punching die 40 (second punch die 50 and second die die 60) used in the conventional method for punching a coverlay film.
  • 16 (a) is a plan view showing the second punch mold 50
  • FIG. 16 (b) is a plan view showing the second die mold 60
  • FIG. 16 (c) is a plan view of FIG. FIG.
  • FIG. 17 is a view for explaining a conventional method for punching a cover lay film.
  • Fig. 17 (a) is a diagram showing the perforated state of the cover lay film W after the first perforating step is performed
  • Fig. 17 (b) is the perforated state of the cover lay film W after the second perforating step.
  • the first punch die 20 in the first punch die 10 has a plurality of first product hole punches 22 and two positioning hole punches 24 as shown in FIG. 15 (a).
  • the first product hole punch 22 is a punch for forming the first product hole H (see FIG. 17A) in the coverlay film W
  • the positioning hole punch 24 is the second punching step.
  • the positioning hole H used when positioning the coverlay film W at V (Fig. 17 (a) and
  • the first die die 30 in the first punch die 10 has a plurality of first product hole die holes corresponding to the plurality of first product hole punches 22. 2 corresponding to 32 and 2 positioning hole punches 24 A die hole 34 for positioning holes is formed.
  • the second punch die 50 in the second punch die 40 has a plurality of second product hole punches 52, and two positioning pin recesses 54. Is formed.
  • the second product hole punch 52 is the second product hole H in the coverlay film W (
  • the positioning pin recess 54 is a recess provided corresponding to a positioning pin 64 described later (see FIG. 17 (b);).
  • the second die mold 60 in the second drilling mold 40 includes a plurality of second die holes 52 corresponding to the plurality of second product hole punches 52.
  • a die hole 62 for product hole is formed, and two positioning pins 64 used for positioning the coverlay film W are erected during the second drilling process.
  • the second perforation process is performed using the second perforation mold 40 to form a plurality of second product holes H in the cover lay film W that has undergone the first perforation process.
  • the second drilling step is performed using the second perforation mold 40 to form a plurality of second product holes H in the cover lay film W that has undergone the first perforation process.
  • the cover lay fill for the second die 40 is inserted by inserting the positioning hole H of the cover lay film W into the positioning pin 64 erected on the second die die 60.
  • the product hole H to be punched in the first punching step and the product hole H to be punched in the second punching step are correctly aligned.
  • Patent Document 1 International Publication No. 2005Z100220 Pamphlet
  • the present invention has been made to solve such a problem, and provides a method for punching a coverlay film that can form a finer product hole pattern than before.
  • the present invention is a cover lay film manufactured using such a method for punching a cover lay film, a flexible circuit board manufactured using the cover lay film, and manufactured using the flexible circuit board.
  • the purpose is to provide electronic equipment.
  • an object of the present invention is to provide a cover lay film punching device that can be suitably used in such a method for punching a cover lay film.
  • the inventor of the present invention uses the conventional method for punching a cover lay film, so that the second punching step is performed on the product hole H formed in the first punching step. Investigate why it is difficult to form product holes H with high precision according to miniaturization
  • the inventor of the present invention passes the positioning hole H of the coverlay film W through the positioning pin 64 of the second die mold 60, and the position of the coverlay film.
  • the method for punching a cover lay film of the present invention uses a first punch die having a first punch die and a first die die. 1st penetration A plurality of second through holes are formed in the coverlay film using a first punching step for forming a hole, and a second punching die having a second punching die and a second die die. A second perforation step, wherein in the second perforation step, the first through hole is photographed using an imaging device to measure the position of the first through hole in the cover lay film, and the measurement result The second through hole is formed in the cover lay film after adjusting the position and Z or the posture of the cover lay film with respect to the second punching die.
  • the position of the first through hole formed in the first punching step is measured using an imaging device, and the cover is based on the measurement result.
  • the second perforation is made for the product hole formed in the first perforation process.
  • Product holes to be formed in the process can be formed with an accuracy corresponding to the miniaturization, and as a result, a product hole pattern that is finer than before can be formed.
  • the cover lay film perforating method of the present invention in the first perforation step, only the product hole is formed as the first through hole, and the second perforation is performed.
  • the method for punching the cover lay film of the present invention the method for punching the force burley film described in (2) above)
  • the position and Z or orientation of the cover lay film can be determined with higher accuracy by using the reference hole suitable for adjusting the position and Z or orientation of the cover lay film than the product hole. It becomes possible to adjust. For this reason, it is possible to form the product hole formed in the second drilling process with higher positional accuracy than the product hole formed in the first drilling process, resulting in the formation of a finer product hole pattern. It becomes possible to do.
  • the second punching die has at least two shooting holes corresponding to the at least two imaging devices. I like it! /
  • the second drilling step it is possible to photograph the first through hole through at least two photographing holes. Therefore, the position of the first through hole can be measured with higher accuracy, and the position and posture of the cover lay film with respect to the second punching die can be adjusted with higher accuracy. .
  • This makes it possible to form the product holes formed in the second drilling step with higher positioning accuracy than the product holes formed in the first drilling step, and as a result, form a finer product hole pattern. It becomes possible.
  • the cover lay film is formed by the second punch die and the second die die. It is preferable that the first through hole is photographed in a sandwiched state.
  • the cover lay film of the present invention is a cover lay film manufactured using the method for punching a cover lay film of the present invention.
  • the cover lay film of the present invention is manufactured by using the excellent method for perforating a cover lay film as described above, and thus a finer product hole pattern is formed than before. It becomes a cover lay film.
  • the flexible circuit board of the present invention is a flexible circuit board manufactured using the cover lay film of the present invention.
  • the flexible circuit board of the present invention is manufactured using a coverlay film in which a finer product hole pattern is formed than in the prior art. Become.
  • the electronic device of the present invention is an electronic device manufactured using the flexible circuit board of the present invention.
  • the electronic device of the present invention is manufactured using a flexible circuit board with a higher quality than before, and thus becomes an electronic device with a higher quality than before.
  • a cover lay film punching device of the present invention includes a first punch die and a first die die, and a first for forming a plurality of first through holes in the cover lay film.
  • a cover lay film having a punching mold, a second punch mold, and a second die mold, wherein the plurality of first through holes are formed.
  • the position of the first through hole formed in the first punching step is measured using the imaging device, and the cover is based on the measurement result. Since it is possible to adjust the position and Z or posture of the lay film, If the adjustment is performed with the accuracy corresponding to the miniaturization, the product hole formed in the second drilling process can be formed with the accuracy according to the miniaturization with respect to the product hole formed in the first drilling process. As a result, it is possible to form a finer product hole pattern than before.
  • the first punching die and the second punching die are preferably punching dies having different product hole forming patterns.
  • the first product hole is formed using the first drilling die, and the second product hole is formed using the second drilling die. It is also possible to produce a coverlay film having a fine product hole pattern.
  • the measuring device has at least two imaging devices as the imaging device.
  • the positions of at least two first through holes can be measured. Therefore, the position of the first through hole can be measured with higher accuracy, and the position and orientation of the cover lay film with respect to the second punching die can be adjusted with higher accuracy.
  • This makes it possible to form the product holes formed in the second drilling process with higher positional accuracy than the product holes formed in the first drilling process, and as a result, a finer product hole pattern can be formed. It becomes possible.
  • the second punching die may have at least two shooting holes corresponding to the at least two imaging devices. preferable.
  • the cover lay film punching device of the present invention preferably further includes a punching die driving device that performs a punching operation by driving a servo motor.
  • a punching die driving device that performs a punching operation by hydraulic drive can be used as the punching die driving device.
  • the punching die driving device that performs the punching operation by the servo motor drive as the punching die drive device, the controllability of the punching operation in the punching die is improved. This makes it possible to improve the quality of product holes to be formed. In addition, it is possible to improve workability when drilling.
  • an RTR type cover lay film punching device using a long cover lay film wound as a roll as the cover lay film, A force for feeding the roll-shaped cover lay film into a sheet shape, a bar lay film feeding device, a cover lay film feeding device for feeding the sheet-like cover lay film fed by the cover lay film feeding device to a punching position, and And a cover lay film winding device for winding the sheet-like cover lay film, which has been punched by the first punching die or the second punching die, into a roll.
  • a perforated waste removing device wherein the perforated waste removing device includes at least one first adhesive roller rotatably disposed in contact with one surface of the force barley film, and the first adhesive roller.
  • the perforated waste removing device includes at least one first adhesive roller rotatably disposed in contact with one surface of the force barley film, and the first adhesive roller.
  • a first punch debris removal mechanism having a second adhesive roller that is rotatably arranged in contact with the adhesive roller and has a higher adhesiveness than the first adhesive roller; and the other surface of the cover lay film
  • at least one third adhesive roller rotatably disposed in contact with the roller, and rotatably disposed in contact with the third adhesive roller and stronger adhesive than the third adhesive roller. 4th viscosity with It is preferable to have a second perforated waste removal mechanism having a landing roller.
  • the first adhesive roller and the third adhesive roller can remove the perforated dust adhering to the coverlay film by suction. For this reason, it is possible to manufacture a high-quality cover lay film with no perforated scrap attached.
  • the second adhesive roller it becomes possible for the second adhesive roller to remove the perforated dust adsorbed by the first adhesive roller, and the fourth adhesive roller adsorbs the perforated waste adsorbed by the third adhesive roller.
  • the roller can be removed. For this reason, it is possible to suppress a decrease in the adsorptivity of the first adhesive roller and the third adhesive roller.
  • the second adhesive roller and the fourth adhesive roller can be replaced with new adhesive rollers if the adhesive force decreases.
  • the cover lay film punching device is disposed between the punching die attaching portion and the cover lay film winding device. It is preferable to further include a half-cut device for cutting the cover lay film main body.
  • a cover lay film punching device is the cover lay film punching device used in the cover lay film punching device according to any one of (9) to (15) above, A drilling die mounting portion to which the mold for die and the second punching die can be attached and detached, and an imaging device for photographing the first through hole, and based on the result of photographing by the imaging device, A measuring device that measures the position of the first through-hole in the cover lay film, and a cover that adjusts the position and Z or the posture of the cover lay film with respect to the second punching mold based on the measurement result of the measuring device.
  • a lay film position / posture adjustment device is provided.
  • FIG. 1 is a front view for explaining a cover lay film punching device 100 according to a first embodiment.
  • FIG. 2 is a plan view for explaining the cover lay film punching apparatus 100 according to the first embodiment.
  • FIG. 3 is an enlarged view of an essential part schematically showing a punching mechanism 500.
  • FIG. 4 is a view for explaining a first punching die 510 (first punch die 520 and first die die 530) used in the first embodiment.
  • FIG. 5 is a view for explaining a second punching die 540 (second punching die 550 and second die die 560) used in the first embodiment.
  • FIG. 6 is a flowchart for explaining the first drilling step S110.
  • FIG. 7 is a flowchart for explaining the second drilling step S 120.
  • FIG. 8 is a view for explaining the first drilling step S110.
  • FIG. 9 is a view for explaining the second drilling step S 120.
  • Drilling dies 510a, 540a used in Embodiment 2 (first punch die 520a, first die die 530a, second punch die 550a, and second die die 560a) It is a figure shown in order to explain.
  • FIG. 11 is a flow chart for explaining the method for punching a coverlay film according to the second embodiment.
  • FIG. 12 is a view for explaining a method for punching a coverlay film according to the second embodiment.
  • FIG. 13 is a side view for explaining a cover lay film punching device 104 according to a third embodiment.
  • FIG. 14 is a view for explaining a cover lay film W.
  • FIG. 15 is a view for explaining a first punch die 10 (first punch die 20 and first die die 30) used in the conventional method for punching a coverlay film.
  • FIG. 16 is a view for explaining a second punch die 40 (second punch die 50 and second die die 60) used in a conventional coverlay film punching method.
  • FIG. 17 is a view for explaining a conventional method for punching a cover lay film.
  • FIG. 1 is a front view for explaining a cover lay film punching apparatus 100 according to Embodiment 1.
  • FIG. FIG. 2 is a plan view for explaining the coverlay film punching apparatus 100 according to the first embodiment.
  • FIG. 3 is an enlarged view of an essential part schematically showing the punching mechanism 500. As shown in FIG. 3 (a) is a side view of the punching mechanism 500, and FIG. 3 (b) is a cross-sectional view taken along the line AA in FIG. 3 (a).
  • the coverlay film punching device 100 is mounted with various mechanisms (described later).
  • Cover lay film unwinding device 300 that unwinds cover lay film W into a sheet shape
  • cover lay film take-up device 400 that winds sheet-like cover lay film W unwound from cover lay film unwinding device 300
  • Coverlay film feed device 600 that feeds the covered cover film W to the punching position in the punching mechanism 500 and the position of the through hole in the coverlay film W Measuring device 700 (not shown) to be used, and a cover lay film position for adjusting the position and posture of the cover lay film W with respect to the punching die 510 attached to the punching mechanism 500 based on the measurement result by the measuring device 700 ⁇ Equipped with posture adjustment device 800.
  • the apparatus main body 200 is configured by a substantially rectangular base.
  • a controller box 210 containing a controller (not shown) for driving and controlling each mechanism and the like by a setting program is disposed.
  • the cover lay film feeding device 300 has a feeding roller 310 and a torque motor 312 as shown in FIGS.
  • the feeding roller 310 is rotatably supported on a roller support 320 extending from the apparatus main body 200.
  • the roll-shaped cover lay film W is fed out into a sheet shape by the rotation of the torque motor 312 driven.
  • the cover lay film winding device 400 includes a winding roller 410 and a torque motor 412 as shown in FIGS.
  • the take-up roller 410 is rotatably supported on a roller support 420 extending from the apparatus main body 200.
  • the sheet-like cover lay film W is wound up in a roll shape by the rotation of the torque motor 412.
  • the punching mechanism 500 is disposed between the cover lay film feeding device 300 and the cover lay film winding device 400.
  • the punching mechanism 500 has a first punch die 520 or a second punch die 550 (in FIG. 3 (a), the first punch die 520 is attached.
  • the first die die 530 or the first die die 530 (Fig. 3 (a) is attached).
  • a die mold mounting portion 578 that can be attached and detached, and is disposed in a drilling mechanism main body 580 for mounting and fixing the drilling mechanism 500.
  • the punching die drive device 900 includes a servo motor 910, a drive shaft 920, a guide post 930, an elevating body 940, a pulley 950 and a belt 960.
  • the rotation of the servo motor 910 is transmitted to the drive shaft 920 through the belt 960 and the pulley 950.
  • the elevating body 940 is configured to be movable up and down by the rotation of the drive shaft 920.
  • the punch die attachment portion 572 is connected to the lifting body 940 via the guide post 930, and the punch die attachment portion 572 can be raised and lowered by raising and lowering the lifting body 940. It is configured.
  • the measurement device 700 (not shown) has two imaging devices 710 and 720. The two image pickup devices 710 and 720 are attached to an image pickup device support base 730 disposed at the top of the punching mechanism 500, as shown in FIG.
  • the cover lay film feeding device 600 includes a cover lay film feeding clamper 610, a cover lay film feeding clamper table 612, a servo motor 614, a guide rail 616, a screw shaft 618, Cover lay film feed side guide port roller 632, cover lay film take-up side guide roller 634, pair of clampers 622, 624, frame 642 and support body 644, placed on cover lay film position and posture adjustment device 800 Has been.
  • the cover lay film feed clamper 610 is disposed on the cover lay film feed clamper table 612 and extends in the X-axis direction by the rotation of the screw shaft 618 driven by the servo motor 614. It is configured to be movable in the X-axis direction
  • the cover lay film feeding side guide roller 632 is attached to the cover lay film feeding clamper table 612 via the frame 642, and is a sheet-like cover lay film fed from the cover lay film feeding device 300. It is configured to arrange W on the drilling mechanism 500 side.
  • the cover lay film take-up side guide roller 634 is connected to the cover lay film feed clamper table 612 via the support 644, and the burley film W is covered with the cover lay film W. It is configured to guide to the winding device 400 side.
  • a pair of fixed clampers 622 and 624 are disposed on both sides of the punching mechanism 500 in the X-axis direction so as to be able to grip the force-burley film W.
  • the cover lay film position / posture adjustment device 800 includes a first fine movement device 81.
  • the cover lay film feeding device 600 can be finely moved in the X-axis direction and the y-axis direction and rotated around an axis along the z-axis direction. It is configured to be movable.
  • the first fine movement device 810 includes a servo motor (not shown), a servo motor. And a first shaft 812 and a rail 814 extending along the y-axis direction, which are arranged in the apparatus main body 200.
  • the first fine movement device 810 is configured such that the first table 812 can be finely moved in the y-axis direction on the rail 814 by the rotation of the screw shaft driven by the servo motor.
  • the second fine movement device 820 includes a servo motor (not shown), a screw shaft (not shown) pivotally supported by the servo motor, the second table 822, and the X-axis direction.
  • the rail 824 extends along the first table 812 and is disposed on the first table 812.
  • the second fine movement device 820 is configured to be finely movable in the X-axis direction on the second table 822 force S rail 824 by the rotation of the screw shaft driven by the servo motor.
  • the third fine movement device 830 applies rotational force to a servo motor (not shown), a screw shaft (not shown) pivotally supported by the servo motor, the third table 832, and the third table 832.
  • the moving table 834 is provided, and is disposed on the second table 822.
  • the third table 832 is pivotally supported by a pivot 836 on the second table 822 and is swingably disposed.
  • the third fine movement device 830 is configured to rotate in the circumferential direction (around the z axis) about the pivot 836 by the rotation of the screw shaft driven by the servo motor.
  • FIG. 4 is a view for explaining the first punching die 510 (first punching die 520 and first die die 530) used in the first embodiment.
  • FIG. 4 (a) is a view showing a first punch mold 520
  • FIG. 4 (b) is a view showing a first die mold 530.
  • FIG. 4 (a) is a view showing a first punch mold 520
  • FIG. 4 (b) is a view showing a first die mold 530.
  • FIG. 5 is a view for explaining the second punching die 540 (second punching die 550 and second die die 560) used in the first embodiment.
  • FIG. 5 (a) is a view showing a second die for die 550
  • FIG. 5 (b) is a view showing a second die for die 560.
  • FIG. 5 (a) is a view showing a second die for die 550
  • FIG. 5 (b) is a view showing a second die for die 560.
  • FIG. 6 is a flowchart for explaining the first drilling step S110.
  • FIG. 7 is a flowchart for explaining the second drilling step S120.
  • FIG. 8 is a view for explaining the first drilling step S110.
  • FIG. 8A to FIG. 8C are diagrams showing each step in the first drilling step S110.
  • FIG. 9 is a view for explaining the second drilling step S120.
  • Figure 9 (a) to Figure 9 (d) It is a figure showing each step in the 2nd punching process S120.
  • the cover lay film perforating method according to the first embodiment includes a first perforating step S 110 for perforating the cover lay film W using the first perforating mold 510, and a second perforating mold 540.
  • This is a method of forming a product hole pattern in the force bar lay film W by performing the second punching step S120 for performing a punching force test on the cover lay film W using the
  • a long cover lay film wound in a roll shape is used as the cover lay film W.
  • the first punching die 510 used in the first punching step will be described.
  • the first punching die 510 has a first punching die 520 and a first die die 530.
  • the first punch die 520 has a plurality of first product hole punches 522 and two reference hole punches 524.
  • the area surrounded by the alternate long and short dash line in the first punch mold 520 indicates the perforable area of the first punch mold 520.
  • first die mold 530 As shown in FIG. 4 (b), a plurality of first product hole die holes 532 and reference hole punches 524 corresponding to the first product hole punches 522 are provided. Two reference hole die holes 534 corresponding to are formed.
  • the area surrounded by the alternate long and short dash line in the first die mold 530 indicates the perforable area of the first die mold 530.
  • the second punching die 540 (not shown) has a second punching die 550 and a second die die 560. As shown in FIG. 5 (a), the second punch die 550 has a plurality of second product hole punches 552, and two photographing holes 554 are formed. In FIG. 5 (a), the region surrounded by the alternate long and short dash line in the second punch die 550 indicates the perforable region of the second punch die 550.
  • a plurality of second product hole die holes 562 corresponding to the second product hole punches 552 are formed in the second die mold 560.
  • An illumination hole 564 is formed.
  • the region surrounded by the alternate long and short dash line in the second die mold 560 indicates the perforable region of the second die mold 560.
  • the first drilling step S110 includes a first moving step S111 and a first through hole forming step S112.
  • the first moving step Sill is a step in which the perforation target area R in the cover lay film W is sent to the perforable area of the first perforation mold 510 by the cover lay film feeder 600 (FIG. 8). (See (a) and Figure 8 (b);).
  • FIG. 8A shows a state in which the cover lay film W is being fed by the cover lay film feeding device 600.
  • FIG. 8B shows a state when the perforation target area R in the coverlay film W is sent to the perforable area of the first perforation mold 510.
  • the broken line on the cover lay film W virtually indicates the positions of the first product hole punch 522 and the reference hole punch 524 in the first punch die 520. It is.
  • a plurality of first product holes H and two reference holes H are formed in a state where the position of the cover lay film W relative to the first punching die 510 is adjusted.
  • the first product hole H and the reference hole H are formed over the entire long cover lay film W by the first punching step S 110.
  • the first product hole H and the reference hole H are formed by the first drilling step S110.
  • the second moving step S121, the measuring step 122, the adjusting step S123, and the second through hole forming step S124 are included.
  • the perforation target area R in the coverlay film W is covered.
  • the adjustment step S123 is a step of adjusting the position and posture of the cover lay film W with respect to the second punching die 540 based on the measurement result in the measurement step S122 (see FIG. 9 (c)); ).
  • the position of the cover lay film W relative to the second punching die 540 'posture adjustment is performed by the cover lay film position / posture adjustment device 800 finely moving the cover lay film feed device 600 in the X-axis direction and the y-axis direction, and Rotate around an axis along the z-axis direction.
  • the second through-hole forming step S124 includes a plurality of second through holes in the cover lay film W in a state where the position and posture of the cover lay film W with respect to the second punching die 540 are adjusted by the adjusting step S123. This is the step of forming product holes H (see Fig. 9 (d)).
  • the position of the reference hole H formed in the first punching step S110 is determined using an imaging device.
  • Second product holes H can be formed with accuracy according to miniaturization, with respect to the product holes formed in the drilling process (first product hole H).
  • the reference hole H suitable for adjusting the position, Z, or posture of the cover lay film W is formed. Therefore, in the second drilling step S120, the force
  • the product hole (second product hole H) formed in the second drilling step S120 is formed with higher positional accuracy than the product hole (first product hole H) formed in the first drilling step S110. As a result, a finer product hole pattern can be formed.
  • the positions of the two reference holes H are measured in the second punching step S120.
  • the product hole (second product hole H) formed in the second drilling step can be formed with higher positional accuracy than the product hole (first product hole H) formed in the first drilling step S110.
  • the reference hole H is shot through the two shooting holes 554.
  • the position / posture of the coverlay film W relative to 0 can be adjusted with higher accuracy. For this reason, the product hole (second product hole H) to be formed in the second drilling step is formed with higher accuracy than the product hole (first product hole H) to be formed in the first drilling step S110.
  • the coverlay film W is formed by the second punch die 550 and the second die die 560. Cover hole fill because the reference hole H is shot with the
  • the position of 4 can be measured with higher accuracy, and the position of the reference hole H is higher.
  • the product hole (second product hole H) formed in the second drilling step can be formed with higher positional accuracy than the product hole (first product hole H) formed in the first drilling step S110.
  • a fine product hole pattern can be formed.
  • cover lay film punching device 100 according to the first embodiment, it is possible to perform the cover lay film punching method according to the first embodiment.
  • the coverlay film perforating method has the effect.
  • the punching die 510, 540 is further provided with the punching die driving device 900 that performs the punching operation by driving the servo motor 910. Therefore, it is possible to improve the controllability of the punching operation, and to improve the quality of the product hole to be formed. In addition, it is possible to improve workability when drilling.
  • cover lay film punching apparatus 100 since it is an RTR type cover lay film punching apparatus using a long cover lay film wound in a roll shape, it is highly efficient and fine. It is possible to form a simple product hole.
  • the cover lay film manufactured using the cover lay film perforating method according to the first embodiment is a cover lay film having a higher quality than the conventional one. Therefore, a flexible circuit board manufactured using such a cover lay film becomes a higher-quality flexible circuit board than before. In addition, an electronic device manufactured using such a flexible circuit board is a higher-quality electronic device than before.
  • FIG. 10 is a view for explaining the first punching die 510a and the second punching die 54Oa used in the second embodiment.
  • FIG. 10 (a) is a view showing the first punch die 520a and the second punch die 550a
  • FIG. 10 (b) is the first die die 530a and the second die die 560a.
  • FIG. 11 is a flowchart for explaining the method for punching a coverlay film according to the second embodiment.
  • FIG. 12 is a view for explaining the method for punching a cover lay film according to the second embodiment.
  • 12 (a) to 12 (d) are diagrams showing steps in the method for punching a coverlay film according to the second embodiment.
  • the first drilling process shows the nth drilling process
  • the second drilling process shows the n-1st process. It shows the degree.
  • the cover lay film perforating method according to the second embodiment is basically the same method as the cover lay film perforating method according to the first embodiment, except that the first perforating step and the second perforating step are performed.
  • the coverlay film punching device is a first punching die 510a (first punching die 520a and first die die).
  • Die 530a) and second punching die 540a are arranged along the coverlay film transport direction (x-axis direction)
  • the cover lay film punching device 102 (not shown) attached to the punching mechanism 500a (not shown) is used, and the first punching step and the second punching step are performed as shown in FIGS. It will be carried out continuously.
  • the method for punching a coverlay film according to Embodiment 2 includes a moving step S211, a measuring step S212, an adjusting step S213, and a through hole forming step S214.
  • the moving step S211 covers the perforation target areas R and R in the coverlay film W.
  • the moving step S211 an area that has not been subjected to drilling is sent as a drilling target area R to a punchable area in the first drilling die 510a.
  • the region where the plurality of first product holes H and the two reference holes H are formed in the immediately preceding through hole forming step S214 is a pair of holes.
  • FIG. 554 in FIGS. 12 (a) to 12 (d) virtually indicates the position of the imaging hole 554.
  • the adjustment step S213 is a step of adjusting the position and posture of the coverlay film W relative to the second punching die 540a based on the measurement result in the measurement step S212 (see FIG. 12 (c)); ). Adjustment step S213 is performed when the cover lay film position / posture adjustment device 800 finely moves the cover lay film feeding device 600 in the X-axis direction and the y-axis direction and rotates about the axis along the z-axis direction. Do.
  • the through hole forming step S214 is a step of forming a through hole in the cover lay film W in a state where the position / posture of the cover lay film W with respect to the second punching mold 540a is adjusted by the adjusting step S213. (See Figure 12 (d);). By performing the through hole forming step S214, a plurality of first product holes H and two reference holes H are formed in the pierceable region of the first piercing die 510a as shown in FIG. 12 (d).
  • a plurality of second product holes H are formed in the pierceable region.
  • the first punching die 510a is punched by performing the moving step S211, the measuring step S212, the adjusting step S213, and the through hole forming step S214.
  • the first drilling step is performed in the possible region
  • the second drilling step is performed in the punchable region of the second drilling die 540a.
  • the cover lay film perforating method according to the second embodiment is the same as the cover lay film perforating method according to the first embodiment in that the first perforating step and the second perforating step are continuously performed.
  • the position of the reference hole H formed in the first punching process is measured using an imaging device, and based on the measurement result.
  • the first punching die 510a and the second punching die 540a are arranged in the coverlay film transport direction (x-axis direction).
  • the coverlay film punching device 102 attached to the punching mechanism 500a in a line At the same time, the first drilling process and the second drilling process are to be carried out continuously.
  • the method for punching a cover lay film according to the second embodiment is basically the same method as the method for punching a cover lay film according to the first embodiment except for the points described above. Among the effects of the coverlay film perforating method according to the above, the corresponding effects remain as they are.
  • FIG. 13 is a side view for explaining the cover lay film punching device 104 according to the third embodiment.
  • FIG. 13 the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted. Further, in FIG. 13, illustration of a part of the left side of the cover lay film punching device 104 (for example, the cover lay film feeding device 300) is omitted.
  • the cover lay film punching device 104 according to the third embodiment is basically the same as the cover lay film punching device 100 according to the first embodiment.
  • the coverlay film punching apparatus 100 according to the first embodiment is different from the coverlay film punching apparatus 100 in that it further includes a configuration for performing post-processing. That is, as shown in FIG. 13, the cover lay film punching device 104 according to the third embodiment includes a punching scrap removing device 1100 between the punching mechanism 500 and the cover lay film scraping device 400. And a half-cut device 1200.
  • the perforated waste removing device 1100 includes two first adhesive rollers 1112 and a first perforated waste having a second adhesive roller 1114 having higher adhesiveness than the first adhesive roller 1112. It has a removal mechanism 1110, two third adhesive rollers 1122, and a second perforated waste removal mechanism 1120 having a fourth adhesive roller 1124 having higher adhesiveness than the third adhesive roller 1122.
  • the two first adhesive rollers 1112 are rotatably disposed in contact with the upper surface of the cover lay film W, and the second adhesive roller 1114 is in contact with the first adhesive roller 1112. It is arrange
  • half-cut device 1200 has blade type 1220 and second cover lay film feeding device 1240.
  • the blade mold 1220 is configured to be capable of cutting only the cover lay film body Wb with respect to the cover lay film W, leaving the release paper We!
  • the second cover / laying film feeding device 1240 is configured to be able to feed the coverlay film W intermittently.
  • the coverlay film punching device 104 According to the coverlay film punching device 104 according to the third embodiment, the first adhesive roller 1112 and the third adhesive roller 1122 adsorb and remove the perforated waste adhering to the coverlay film W. Is possible. For this reason, it becomes possible to manufacture a high-quality cover film that is free of perforated scrap.
  • the second adhesive roller 1114 can remove the punching waste adsorbed by the first adhesive roller 1112, and the third adhesive roller 1122 can be removed. It becomes possible for the fourth adhesive roller 1124 to remove the perforated waste adsorbed by. For this reason, it is possible to suppress a decrease in the adsorptivity of the first adhesive roller 1112 and the third adhesive roller 1122.
  • the second adhesive roller 1114 and the fourth adhesive roller 1124 can be replaced with new adhesive rollers if the adhesive force decreases.
  • the cover lay film punching device 104 since the half-cut device configured as described above is provided, the cover that has been half-cut using such a half-cut device is provided. Even if the cover film is attached to the base film by manually supplying the cover film main body Wb to the base film by using the lay film, the cover lay film main body Wb Can be easily peeled off, and workability can be improved.
  • cover lay film punching device 104 has basically the same configuration as the cover lay film punching device 100 according to the first embodiment except for the above, and therefore, the first embodiment.
  • the coverlay film punching apparatus 100 according to the present invention has the corresponding effect as it is.
  • the cover lay film perforating method, cover lay film, flexible circuit board, electronic device, and cover lay film perforating apparatus of the present invention have been described above based on the above embodiments.
  • the present invention is not limited to the above-described embodiments, and can be carried out in various forms within the scope without departing from the gist thereof. For example, the following modifications are possible. is there.
  • cover lay film W can be a strip (rectangular) cover lay film.
  • the first cover lay film strength for placing the sheet-like cover lay film W and the cover lay film W Cover lay film supply loader that supplies the first cover lay film stock force to the force burley film moving device, and the second cover lay film stock force for placing the pierced force bar lay film W It is preferable to have a cover lay film recovery loader that recovers the only cover lay film W from the cover lay film moving device to the second cover lay film stock force! /.
  • the cover lay film punching device 100, 102, 104 includes the first punching die 510, 510a and the second punching die 540, 540a.
  • the present invention is not limited to this, and may be a cover lay film punching device that does not include the first punching die and the second punching die. In this case, prepare the first and second drilling dies separately.
  • the first punching die 510a and the second punching die 540a which are configured separately, are attached to the punching mechanism 500a.
  • the present invention is not limited to this, and a punching die in which the first punching die and the second punching die are integrated may be attached to the punching mechanism. .
  • the method includes a first punching step and a second punching step.
  • the present invention is not limited to this.
  • third, fourth,... Drilling steps may be further included.
  • the through hole formed in the previous perforation process is photographed using an imaging device to measure the position of the through hole in the coverlay film. Based on the measurement results, the third, fourth,. After adjusting the position and / or orientation of the cover lay film with respect to the perforating mold, a through-hole further to the cover lay film should be formed.
  • Die hole for second product hole 64 ⁇ Positioning pin, 100, 104 ⁇ Coverlay film punching device, 200 ⁇ Main body, 210 ⁇ Controller box, 300 ⁇ Coverlay film feeding device, 310 ⁇ Third motor, 320 ⁇ 420 ⁇ • Hole for hole H, 534 ... Die hole for reference hole, 554, 5 74 ... Shooting hole, 564 ... Illumination hole, 570, 576 ... Mounting jig, 572 ... Punch mold mounting part, 578 ... Die mold mounting 580 ... Cover mechanism main body, 600 ... Cover lay Film feeding device, 610 ... Cover lay film feeding cranno, 612 ... Cover lay film feeding clamper table, 614 ... Servo motor, 616 ... Guide rail, 618 ...

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control Of Cutting Processes (AREA)

Abstract

La présente invention concerne un procédé de perforation d'un film de revêtement, caractérisé en ce qu'il comprend une première étape de perforation créant plusieurs premiers orifices de produit (H1) et deux orifices de référence (H4) dans le film de revêtement (W) au moyen d'une première matrice métallique de perforation (510) et une seconde étape créant plusieurs seconds orifices traversants (H3) dans le film de revêtement (W) au moyen d'une seconde matrice métallique de perforation (540). À la seconde étape de perforation, les deux orifices de référence (H4) sont photographiés pour ainsi mesurer les positions des orifices de référence (H4) dans le film de revêtement (W), puis la position ou la posture du film de revêtement (W) par rapport à la seconde matrice métallique de perforation (540) est régulée sur la base de la mesure des résultats. Par la suite, des seconds orifices de produit (H3) sont formés dans le film de revêtement (W). En conséquence, ce procédé de perforation de film de revêtement réalise la formation des orifices du produit (H3) constitués à la seconde étape de perforation sur les orifices du produit (H1) constitués à la première étape de perforation avec une précision correspondant à la miniaturisation et, en conséquence, forme un motif d'orifice du produit plus fin que ce qui existe actuellement.
PCT/JP2006/314433 2006-07-20 2006-07-20 Procédé de perforation de film de revêtement WO2008010289A1 (fr)

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JP2008525767A JP4993397B2 (ja) 2006-07-20 2006-07-20 カバーレイフィルムの穿孔方法
PCT/JP2006/314433 WO2008010289A1 (fr) 2006-07-20 2006-07-20 Procédé de perforation de film de revêtement

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Cited By (4)

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JP2010115718A (ja) * 2008-11-11 2010-05-27 Midori Hokuyo Kk シート穿孔装置及びシート穿孔方法
CN110582385A (zh) * 2017-04-05 2019-12-17 速特系统技术股份公司 带有全景摄像头的切割机
CN112829004A (zh) * 2020-12-29 2021-05-25 安捷利（番禺）电子实业有限公司 一种自动冲切覆盖膜装置
JP7506394B2 (ja) 2020-04-13 2024-06-26 相模ピーシーアイ株式会社 積層体仮キャリアの製造方法

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JPH068199A (ja) * 1992-06-30 1994-01-18 Diafoil Co Ltd テープの穿孔方法
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CN110582385A (zh) * 2017-04-05 2019-12-17 速特系统技术股份公司 带有全景摄像头的切割机
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CN112829004A (zh) * 2020-12-29 2021-05-25 安捷利（番禺）电子实业有限公司 一种自动冲切覆盖膜装置

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