JPWO2008010289A1 - Coverlay film perforation method - Google Patents

Abstract

The method for punching a coverlay film of the present invention includes a first punching step of forming a plurality of first product holes H1 and two reference holes H4 in the coverlay film W using a first punching die 510, and a second punching process. A second punching step of forming a plurality of second through holes H3 in the coverlay film W using a punching die 540, and in the second punching step, two cover holes H4 are photographed to cover the film. After measuring the position of the reference hole H4 in W and adjusting the position and / or orientation of the coverlay film W with respect to the second punching mold 540 based on the measurement result, the second product hole H3 is formed in the coverlay film W. It is characterized by forming. For this reason, according to the coverlay film punching method of the present invention, the product hole H3 formed in the second punching step is formed with accuracy according to the miniaturization with respect to the product hole H1 formed in the first punching step. As a result, it is possible to form a finer product hole pattern than before.

Description

  The present invention relates to a method for punching a coverlay film, a coverlay film, a flexible circuit board, an electronic device, and a coverlay film punching device.

  In the step of forming a flexible circuit board, a surface protective film for a flexible circuit board (hereinafter referred to as a coverlay film) having a thermosetting adhesive layer on the pattern forming surface of a base film on which a conductor pattern such as copper foil is formed. )) (See, for example, Patent Document 1).

  FIG. 14 is a view for explaining the coverlay film W. FIG. FIG. 14A is a plan view schematically showing the coverlay film W, and FIG. 14B is a cross-sectional view taken along line AA in FIG. In FIG. 14, the product hole H is assumed to be circular, and is exaggerated and drawn larger than the actual size.

  In the coverlay film W, as shown in FIG. 14A, a plurality of product holes H are formed. Further, as shown in FIG. 14B, the coverlay film W has a structure in which a coverlay film body Wb and a release paper We are laminated. According to such a cover lay film W, the cover lay film main body Wb is peeled from the release paper We, and then the cover lay film main body Wb and the base film are bonded together under an appropriate positional relationship. It is possible to manufacture a flexible circuit board in which a portion necessary for connection with an external device, an electronic device, or the like is selectively exposed in the formed conductor pattern.

  By the way, the coverlay film W generally has a product hole pattern having a portion where the interval between adjacent product holes is extremely narrow (see FIG. 14B). However, it is not easy to form such a product hole of the coverlay film W by a single punching process using a punching die having a punching die and a die die. This is because it is extremely difficult to manufacture a punch pattern or a die hole pattern corresponding to a product hole pattern having a portion where the interval between adjacent product holes is extremely narrow.

  Therefore, conventionally, product holes to be formed are divided into a group of first product holes and a group of second product holes which are complementary to each other, and these first product holes and second product holes are divided into first punching molds and A method for perforating a coverlay film that is sequentially formed using a second perforation mold is known. According to the conventional method for punching a coverlay film, it is possible to form a product hole pattern in the coverlay film W having a portion where the interval between adjacent product holes is extremely narrow.

FIG. 15 is a view for explaining a first punching die 10 (first punching die 20 and first die die 30) used in a conventional method for punching a coverlay film. FIG. 15A is a plan view showing the first punch mold 20, and FIG. 15B is a plan view showing the first die mold 30.
FIG. 16 is a view for explaining a second punching die 40 (second punching die 50 and second die die 60) used in the conventional method for punching a coverlay film. 16 (a) is a plan view showing the second punch mold 50, FIG. 16 (b) is a plan view showing the second die mold 60, and FIG. 16 (c) is FIG. 16 (b). It is AA sectional drawing of).

  FIG. 17 is a view for explaining a conventional method for perforating a coverlay film. FIG. 17A is a diagram showing a perforated state of the coverlay film W after the first perforating step is performed, and FIG. 17B is a perforated state of the coverlay film W after the second perforating step is performed. FIG. 17A and 17B, the left side in the drawing is shown as the upstream side of the coverlay film W.

As shown in FIG. 15A, the first punch die 20 in the first punching die 10 has a plurality of first product hole punches 22 and two positioning hole punches 24. Among these, the first product hole punch 22 is a punch for forming the first product hole H ₁ (see FIG. 17A) in the coverlay film W, and the positioning hole punch 24 is the second punching step. ₂ is a punch for forming a positioning hole H ₂ (see FIGS. 17A and 17B) used when positioning the coverlay film W in FIG. As shown in FIG. 15B, the first die hole 30 in the first punching die 10 has a plurality of first product hole die holes 32 corresponding to the plurality of first product hole punches 22. Two positioning hole die holes 34 corresponding to the two positioning hole punches 24 are formed.

As shown in FIG. 16A, the second punch die 50 in the second punch die 40 has a plurality of second product hole punches 52, and two positioning pin recesses 54 are formed. ing. Among these, the second product hole punch 52 is a punch for forming the second product hole H ₃ (see FIG. 17B) in the coverlay film W, and the positioning pin recess 54 is a positioning pin described later. 64 (refer to FIG. 17B). The second die mold 60 in the second drilling mold 40 includes a plurality of second die holes 52 corresponding to the plurality of second product hole punches 52 as shown in FIGS. A product hole die hole 62 is formed, and two positioning pins 64 used for positioning the coverlay film W in the second punching step are provided upright.

In the conventional method for perforating a coverlay film, first, as shown in FIG. 17A, a first perforation process is performed using a first perforation mold 10, and a plurality of second layers are formed on the coverlay film W. 1 to form a product holes _{H 1} and two positioning holes _{H 2.} Next, as shown in FIG. 17B, a second punching step is performed using the second punching die 40, and a plurality of second product holes H are formed in the coverlay film W that has undergone the first punching step. ₃ is formed. For this time, in the second drilling step, the second piercing die 40 by inserting the positioning holes of H ₂ coverlay film W with respect to the positioning pins 64 provided upright on the second die mold 60 The coverlay film W is positioned.

Thus, according to drilling method of the conventional cover lay film, product holes in a state in which the product hole H ₃ of the product hole H ₁ to be drilled in the first drilling step for drilling the second drilling step is correctly aligned Can be formed.

International Publication No. 2005/100220 Pamphlet

By the way, in recent years, with the refinement of the circuit pattern in the flexible circuit board, there is a demand for forming a finer product hole pattern in the coverlay film than in the past. However, in the drilling method of the conventional cover lay film, when it is decided to form a fine product pore pattern than before coverlay film, the relative product holes H ₁ to be formed at the first perforation step it becomes difficult to form a product hole H ₃ forming a two drilling steps with an accuracy corresponding to the miniaturization, there is a problem that the result can not be formed a fine product pore pattern than before as.

  Accordingly, the present invention has been made to solve such problems, and an object of the present invention is to provide a coverlay film perforating method capable of forming a finer product hole pattern than before. The present invention also provides a cover lay film manufactured using such a method for punching a cover lay film, a flexible circuit board manufactured using the cover lay film, and an electronic manufactured using the flexible circuit board. The purpose is to provide equipment. Still another object of the present invention is to provide a coverlay film punching device that can be suitably used for such a method of punching a coverlay film.

The inventors of the present invention, for achieving the above object, than using a drilling method of the conventional cover lay film is formed by a second drilling step the product holes H ₁ to be formed at the first perforation step result of repeated extensive studies in order to determine the cause to be difficult to form a product hole H ₃ with a precision corresponding to the miniaturization, the cover for this reason, the second perforated mold in the second drilling step when positioning the lay film, the presence of the clearance occurring between the diameter of the positioning holes of H ₂ outer diameter and the cover lay film W of the second die mold positioning pin 64 provided upright on, the It was found that the coverlay film could not be aligned with high accuracy with respect to the two-piercing mold.

Accordingly, the inventors of the present invention, based on the above findings, to adjust the position and orientation of the coverlay film inserted through positioning holes of H ₂ coverlay film W on the positioning pins 64 of the second die mold 60 Instead, the position of the first through hole (first product hole or positioning reference hole) formed in the first drilling step is measured using an imaging device, and the coverlay film is measured based on the measurement result. The inventors have conceived that the above problems can be solved by adjusting the position and orientation, and have completed the present invention.

(1) That is, in the method for punching a coverlay film of the present invention, a plurality of first penetrations are made in a coverlay film using a first punching die having a first punching die and a first die die. First forming a plurality of second through holes in the coverlay film using a first punching step for forming holes and a second punching die having a second punching die and a second die die. 2 in the second drilling step, the first through-hole is photographed using an imaging device to measure the position of the first through-hole in the coverlay film, and based on the measurement result The second through hole is formed in the coverlay film after adjusting the position and / or posture of the coverlay film with respect to the second punching die.

  For this reason, according to the method for punching a coverlay film of the present invention, the position of the first through hole formed in the first punching step is measured using an imaging device, and the position of the coverlay film is based on the measurement result. If the measurement and adjustment are performed with accuracy according to the miniaturization, the product formed in the second drilling step with respect to the product hole formed in the first drilling step. It becomes possible to form the holes with accuracy according to the miniaturization, and as a result, it is possible to form a product hole pattern that is finer than before.

(2) In the method for punching a coverlay film of the present invention, in the first punching step, a plurality of product holes as the first through hole, and the position of the coverlay film in the second punching step and / or Alternatively, it is preferable to form a reference hole used as a reference for adjusting the posture.

  In the coverlay film perforating method of the present invention (the coverlay film perforating method described in (1) above), only the product hole is formed as the first through hole in the first perforating step, and the product is formed in the second perforating step. Although it is possible to adjust the position and / or orientation of the coverlay film using holes, according to the method for punching a coverlay film of the present invention (the method for punching a coverlay film described in (2) above). In the second punching step, the position and / or orientation of the coverlay film can be adjusted with higher accuracy by using a reference hole suitable for adjusting the position and / or orientation of the coverlay film than the product hole. It becomes possible. For this reason, it is possible to form the product holes formed in the second drilling step with higher positional accuracy than the product holes formed in the first drilling step, and as a result, a finer product hole pattern can be formed. It becomes possible.

(3) In the method for punching a coverlay film of the present invention, in the second punching step, it is preferable to photograph the first through hole using at least two imaging devices as the imaging device.

  By adopting such a method, it is possible to measure the positions of at least two first through holes in the second drilling step. For this reason, the position of the first through hole can be measured with higher accuracy, and the position / posture of the coverlay film with respect to the second punching die can be adjusted with higher accuracy. Thereby, it becomes possible to form the product hole formed in the second drilling step with higher positional accuracy than the product hole formed in the first drilling step, and as a result, a finer product hole pattern can be formed. It becomes possible.

(4) In the coverlay film punching method of the present invention, it is preferable that at least two shooting holes are formed in the second punching die corresponding to the at least two imaging devices.

  By adopting such a method, in the second drilling step, it is possible to photograph the first through hole through at least two photographing holes. Therefore, the position of the first through hole can be measured with higher accuracy, and the position / posture of the coverlay film with respect to the second punching die can be adjusted with higher accuracy. Thereby, it becomes possible to form the product hole formed in the second drilling step with higher positional accuracy than the product hole formed in the first drilling step, and as a result, a finer product hole pattern can be formed. It becomes possible.

(5) In the coverlay film punching method of the present invention, in the second punching step, the coverlay film is sandwiched between the second punch mold and the second die mold. It is preferable to photograph the first through hole.

  By setting it as such a method, it becomes possible to image | photograph a 1st through-hole in a 2nd punching process in a state without a wave | undulation in a coverlay film. Therefore, the position of the first through hole can be measured with higher accuracy, and the position / posture of the coverlay film with respect to the second punching die can be adjusted with higher accuracy. Thereby, it becomes possible to form the product hole formed in the second drilling step with higher positional accuracy than the product hole formed in the first drilling step, and as a result, a finer product hole pattern can be formed. It becomes possible.

(6) The coverlay film of the present invention is a coverlay film produced using the method for punching a coverlay film of the present invention.

  For this reason, the cover lay film of the present invention is manufactured using the excellent method for perforating a cover lay film as described above, and therefore, a cover lay film in which a finer product hole pattern is formed than before and Become.

(7) The flexible circuit board of this invention is a flexible circuit board manufactured using the coverlay film of this invention.

  For this reason, since the flexible circuit board of this invention is manufactured using the coverlay film in which the finer product hole pattern was formed than before, it becomes a flexible circuit board of higher quality than before.

(8) The electronic device of the present invention is an electronic device manufactured using the flexible circuit board of the present invention.

  For this reason, since the electronic device of the present invention is manufactured using a flexible circuit board with a higher quality than before, it becomes an electronic device with a higher quality than before.

(9) The cover lay film punching device of the present invention has a first punch die and a first die die, and is used for first punching for forming a plurality of first through holes in the cover lay film. A second die for forming a plurality of second through holes in a coverlay film having a mold, a second punch mold, and a second die mold, wherein the plurality of first through holes are formed; A drilling die; a drilling die mounting portion to which the first punching die and the second punching die can be attached and detached; and an imaging device for photographing the first through-hole. And a measuring device for measuring the position of the first through hole in the coverlay film based on the photographing result of the above, and the position of the coverlay film with respect to the second punching die based on the measurement result of the measuring device and / or Or position / posture adjustment of coverlay film to adjust posture Characterized in that it comprises a device.

  For this reason, according to the cover lay film punching device of the present invention, the position of the first through hole formed in the first punching step is measured using the imaging device, and the position of the cover lay film and the Since the posture can be adjusted, if the measurement and adjustment are performed with an accuracy corresponding to the miniaturization, the product hole formed in the first drilling process is formed in the second drilling process. Product holes can be formed with an accuracy according to the miniaturization, and as a result, a finer product hole pattern can be formed than before.

  In the cover lay film punching device of the present invention, the first punching die and the second punching die are preferably punching dies having different product hole forming patterns.

  By configuring in this way, the first product hole is formed using the first drilling die, and the second product hole is formed using the second drilling die. A coverlay film having a hole pattern can be manufactured.

(10) In the coverlay film punching device of the present invention, it is preferable that the measuring device has at least two imaging devices as the imaging device.

  By comprising in this way, in the 2nd drilling process, it becomes possible to measure the position of at least 2 1st through-hole. For this reason, the position of the first through hole can be measured with higher accuracy, and the position / posture of the coverlay film with respect to the second punching die can be adjusted with higher accuracy. Thereby, it becomes possible to form the product hole formed in the second drilling step with higher positional accuracy than the product hole formed in the first drilling step, and as a result, a finer product hole pattern can be formed. It becomes possible.

(11) In the coverlay film punching device of the present invention, it is preferable that the second punching die has at least two shooting holes corresponding to the at least two imaging devices.

  With this configuration, in the second drilling step, it is possible to photograph the first through hole through at least two photographing holes. Therefore, the position of the first through hole can be measured with higher accuracy, and the position / posture of the coverlay film with respect to the second punching die can be adjusted with higher accuracy. Thereby, it becomes possible to form the product hole formed in the second drilling step with higher positional accuracy than the product hole formed in the first drilling step, and as a result, a finer product hole pattern can be formed. It becomes possible.

(12) The coverlay film punching device of the present invention preferably further includes a punching die driving device that performs a punching operation by driving a servomotor.

  In the coverlay film punching apparatus of the present invention, it is of course possible to use, for example, a punching die drive device that performs a punching operation by hydraulic drive as the punching die drive device. However, as described above, by using a punching die driving device that performs a punching operation by driving a servo motor as the punching die drive device, it becomes possible to improve the controllability of the punching operation in the punching die. The product hole to be formed can be of high quality. Moreover, it becomes possible to improve workability | operativity at the time of drilling.

(13) The coverlay film punching device of the present invention is an RTR type coverlay film punching device using a long coverlay film wound in a roll shape as the coverlay film, the roll-shaped cover Coverlay film feeding device for feeding a lay film into a sheet, coverlay film feeding device for feeding the sheet-like coverlay film fed by the coverlay film feeding device to a punching position, and the first die for punching Or it is further provided with the coverlay film winding apparatus which winds up the sheet-like coverlay film by which the punching process was implemented by the said 2nd punching metal mold | die in roll shape.

  By comprising in this way, it becomes possible to form a fine product hole with high efficiency by a RTR (roll-to-roll) system.

(14) In the coverlay film punching device of the present invention, the punching scrap removing device is disposed between the punching position and the coverlay film winding device and can remove punching scraps attached to the coverlay film. The perforated dust removing device further includes at least one first adhesive roller rotatably disposed in contact with one surface of the coverlay film, and in contact with the first adhesive roller. The first punch debris removal mechanism having a second adhesive roller having a higher adhesiveness than the first adhesive roller, and rotatable in a state in contact with the other surface of the coverlay film. At least one third adhesive roller disposed on the first adhesive roller, and rotatably disposed in contact with the third adhesive roller, the adhesive being stronger than the third adhesive roller Preferably it has a second chad removal mechanism having a fourth adhesive roller having.

  By comprising in this way, the 1st adhesion roller and the 3rd adhesion roller can adsorb | suck and remove the perforation waste adhering to a cover-lay film. For this reason, it becomes possible to manufacture a high-quality coverlay film to which perforated scraps are not attached.

  Further, with this configuration, it becomes possible for the second adhesive roller to remove the perforated waste adsorbed by the first adhesive roller, and the fourth adhesive roller to remove the perforated waste adsorbed by the third adhesive roller. Is possible. For this reason, it becomes possible to suppress that the adsorptivity of a 1st adhesion roller and a 3rd adhesion roller falls. The second adhesive roller and the fourth adhesive roller can be replaced with new adhesive rollers if the adhesive force decreases.

(15) In the cover lay film punching device of the present invention, the cover lay film punching device is disposed between the punching die attaching portion and the cover lay film winding device, and covers the cover lay film leaving the release paper. It is preferable to further include a half-cut device for cutting the lay film body.

  By configuring in this way, even when the coverlay film body is manually attached to the base film and the coverlay film is pasted to the base film, the coverlay film body can be easily removed from the release paper. Therefore, it is possible to improve the workability.

(16) The coverlay film punching device of the present invention is a coverlay film punching device used in the coverlay film punching device according to any one of the above (9) to (15), wherein the first punching die And a punching die mounting portion to which the second punching die can be attached and detached, and an imaging device that takes an image of the first through-hole, and based on a result of imaging by the imaging device, the first in the coverlay film A measuring device that measures the position of one through hole, and a coverlay film position / posture adjusting device that adjusts the position and / or posture of the coverlay film with respect to the second punching die based on the measurement result of the measuring device It is characterized by providing.

  For this reason, according to the coverlay film punching device of the present invention, if the first punching die and the second punching die are separately prepared, the cover according to any one of (9) to (15) above. A lay film punching device can be configured.

It is a front view shown in order to demonstrate the coverlay film punching apparatus 100 which concerns on Embodiment 1. FIG. It is a top view shown in order to demonstrate the coverlay film punching apparatus 100 which concerns on Embodiment 1. FIG. 4 is an enlarged view of a main part schematically showing a punching mechanism 500. FIG. It is a figure shown in order to demonstrate the 1st punch metal mold | die 510 (1st punch metal mold | die 520 and 1st die metal mold | die 530) used in Embodiment 1. FIG. It is a figure shown in order to demonstrate the 2nd metal mold | die 540 (The 2nd metal mold | die 550 for 2nd punches, and the metal mold | die 560 for 2nd dies) used in Embodiment 1. FIG. It is a flowchart shown in order to demonstrate 1st drilling process S110. It is a flowchart shown in order to demonstrate 2nd drilling process S120. It is a figure shown in order to demonstrate 1st drilling process S110. It is a figure shown in order to demonstrate 2nd drilling process S120. For explaining the punching dies 510a and 540a (first punching die 520a, first die die 530a, second punching die 550a and second die die 560a) used in the second embodiment. FIG. 6 is a flowchart for explaining a coverlay film punching method according to a second embodiment. It is a figure shown in order to demonstrate the punching method of the coverlay film which concerns on Embodiment 2. FIG. It is a side view shown in order to demonstrate the coverlay film punching apparatus 104 which concerns on Embodiment 3. FIG. It is a figure shown in order to demonstrate the coverlay film W. It is a figure shown in order to demonstrate the 1st metal mold | die 10 (1st metal mold | die 20 for punches, and 1st metal mold | die 30 for 1st die | dye) used for the punching method of the conventional coverlay film. It is a figure shown in order to demonstrate the 2nd metal mold | die 40 (the 2nd metal mold | die 50 for punches, and the 2nd metal mold | die 60 for 2nd dies) used for the punching method of the conventional coverlay film. It is a figure shown in order to demonstrate the punching method of the conventional coverlay film.

  Hereinafter, a coverlay film punching method, a coverlay film, a flexible circuit board, an electronic device, and a coverlay film punching device of the present invention will be described based on the embodiments shown in the drawings.

[Embodiment 1]
First, the coverlay film punching apparatus 100 according to the first embodiment will be described with reference to FIGS.
FIG. 1 is a front view for explaining a coverlay film punching apparatus 100 according to the first embodiment. FIG. 2 is a plan view for explaining the coverlay film punching apparatus 100 according to the first embodiment. FIG. 3 is an essential part enlarged view schematically showing the punching mechanism 500. 3A is a side view of the punching mechanism 500, and FIG. 3B is a cross-sectional view taken along line AA in FIG.

  In the following description, the three directions orthogonal to each other are respectively in the x-axis direction (parallel to the paper surface in FIG. 1 and the left-right direction), the y-axis direction (direction perpendicular to the paper surface in FIG. 1), and the z-axis direction. (It is parallel to the paper surface in FIG. 1 and up and down.)

  As shown in FIGS. 1 to 3, the coverlay film punching apparatus 100 according to the first embodiment includes an apparatus main body 200 for mounting and fixing various mechanisms (described later), and a roll-shaped coverlay film W. Coverlay film unwinding device 300 for unwinding sheet, coverlay film unwinding device 400 for unwinding sheet-shaped coverlay film W unrolled from coverlay film unwinding device 300, and coverlay film W A perforation mechanism 500 for forming a through hole, a perforation mold driving device 900 for driving a perforation mold 510 in the perforation mechanism 500, and a coverlay film W fed by the coverlay film feeding device 300. Coverlay film feeding device 600 for feeding to the punching position in 500, The position of the coverlay film W with respect to the punching mold 510 attached to the punching mechanism 500 based on the measurement device 700 (not shown) for measuring the position of the through hole in the film W and the measurement result by the measuring device 700 And a coverlay film position / posture adjusting device 800 for adjusting the posture.

  As shown in FIG. 1, the apparatus main body 200 is configured by a substantially rectangular base. On the right side of the apparatus main body 200, a controller box 210 containing a controller (not shown) that drives and controls each mechanism and the like according to a setting program is disposed.

  As shown in FIGS. 1 and 2, the cover lay film feeding device 300 includes a feeding roller 310 and a torque motor 312. The feeding roller 310 is rotatably supported by a roller support 320 extending from the apparatus main body 200. And it is comprised so that the roll-shaped cover-lay film W may be let out in a sheet form by rotation by the drive of the torque motor 312.

  The cover lay film winding device 400 includes a winding roller 410 and a torque motor 412 as shown in FIGS. The take-up roller 410 is rotatably supported on a roller support 420 extending from the apparatus main body 200. And it is comprised so that the sheet-like cover-lay film W may be wound up in roll shape by rotation by the drive of the torque motor 412.

  As shown in FIGS. 1 and 2, the punching mechanism 500 is disposed between the coverlay film feeding device 300 and the coverlay film winding device 400. As shown in FIG. 3A, the punching mechanism 500 is attached with a first punch die 520 or a second punch die 550 (in FIG. 3A, the first punch die 520 is attached. .) And a first die die 530 or a second die die 560 (in FIG. 3A, the first die die 530 is attached). .) Is attachable to and detachable from the die mounting portion 578, and is disposed in the punching mechanism main body 580 for mounting and fixing the punching mechanism 500.

  The punching die drive device 900 includes a servo motor 910, a drive shaft 920, a guide post 930, an elevating body 940, a pulley 950 and a belt 960. The rotation of the servo motor 910 is transmitted to the drive shaft 920 via the belt 960 and the pulley 950. The elevating body 940 is configured to be movable up and down by the rotation of the drive shaft 920.

  As shown in FIG. 3, the punch die attachment portion 572 is connected to the lifting body 940 via a guide post 930, and the punch die attachment portion 572 can be raised and lowered by raising and lowering the elevation body 940. ing.

  The measuring device 700 (not shown) has two imaging devices 710 and 720. As shown in FIG. 3A, the two imaging devices 710 and 720 are attached to an imaging device support base 730 disposed on the upper portion of the punching mechanism 500.

  As shown in FIGS. 1 and 2, the coverlay film feeding device 600 includes a coverlay film feeding clamper 610, a coverlay film feeding clamper table 612, a servo motor 614, a guide rail 616, a screw shaft 618, and a coverlay film feeding. A side guide roller 632, a coverlay film winding side guide roller 634, a pair of clampers 622 and 624, a frame 642 and a support 644 are mounted on the coverlay film position / posture adjusting device 800.

  The cover lay film feed clamper 610 is disposed on the cover lay film feed clamper table 612 and rotates on the guide rail 616 extending in the x axis direction by the rotation of the screw shaft 618 driven by the servo motor 614. It is configured to be movable.

  The coverlay film feed-out side guide roller 632 is attached to the coverlay film feed clamper table 612 via the frame 642, and punches the sheet-like coverlay film W fed out from the coverlay film feed-out device 300. It is configured to guide to the side.

  The cover lay film winding side guide roller 634 is connected to the cover lay film feed clamper table 612 via the support 644, and the cover lay film W punched by the punching mechanism 500 is covered with the cover lay film winding device 400 side. It is comprised so that it may guide.

  A pair of fixed clampers 622 and 624 are arranged on both sides in the x-axis direction of the punching mechanism 500 so as to be able to grip the coverlay film W.

  As shown in FIG. 1, the cover lay film position / posture adjustment device 800 includes a first fine movement device 810, a second fine movement device 820, and a third fine movement device 830. And is configured to be finely movable in the y-axis direction and rotatable about an axis along the z-axis direction.

  As shown in FIG. 1, the first fine movement device 810 includes a servo motor (not shown), a screw shaft (not shown) pivotally supported by the servo motor, the first table 812, and the y-axis direction. It has a rail 814 that extends, and is disposed in the apparatus main body 200. The first fine movement device 810 is configured such that the first table 812 can be finely moved in the y-axis direction on the rail 814 by the rotation of the screw shaft driven by the servo motor.

  As shown in FIG. 1, the second fine movement device 820 includes a servo motor (not shown), a screw shaft (not shown) pivotally supported by the servo motor, the second table 822, and the x-axis direction. The rail 824 extends and is disposed on the first table 812. The second fine movement device 820 is configured such that the second table 822 can be finely moved in the x-axis direction on the rail 824 by the rotation of the screw shaft driven by the servo motor.

  The third fine movement device 830 includes a servo motor (not shown), a screw shaft (not shown) pivotally supported by the servo motor, a third table 832, and a mover 834 that applies torque to the third table 832. And disposed on the second table 822. The third table 832 is pivotally supported by a pivot 836 on the second table 822 and is swingably disposed. The third fine movement device 830 is configured to rotate in the circumferential direction (around the z-axis) with the pivot 836 as the rotation center by the rotation of the screw shaft driven by the servo motor.

Next, a method for punching a coverlay film according to Embodiment 1 will be described with reference to FIGS.
FIG. 4 is a view for explaining the first punching die 510 (first punching die 520 and first die die 530) used in the first embodiment. FIG. 4A is a view showing a first punch mold 520, and FIG. 4B is a view showing a first die mold 530. As shown in FIG.
FIG. 5 is a view for explaining the second punching die 540 (second punching die 550 and second die die 560) used in the first embodiment. 5A is a view showing a second punch mold 550, and FIG. 5B is a view showing a second die mold 560. As shown in FIG.

FIG. 6 is a flowchart for explaining the first drilling step S110.
FIG. 7 is a flowchart for explaining the second drilling step S120.
FIG. 8 is a view for explaining the first drilling step S110. FIG. 8A to FIG. 8C are diagrams showing each step in the first drilling step S110.
FIG. 9 is a diagram for explaining the second drilling step S120. FIG. 9A to FIG. 9D are diagrams showing each step in the second drilling step S120.

  The coverlay film perforating method according to the first embodiment includes a first perforating step S110 for perforating the coverlay film W using the first perforating mold 510 and a cover using the second perforating mold 540. This is a method for forming a product hole pattern in the cover lay film W by performing the second punching step S120 for punching the lay film W. In the coverlay film perforating method according to Embodiment 1, as the coverlay film W, a long coverlay film wound in a roll shape is used.

  First, the first punching die 510 used in the first punching step will be described. The first punching die 510 has a first punching die 520 and a first die die 530. As shown in FIG. 4A, the first punch die 520 has a plurality of first product hole punches 522 and two reference hole punches 524. In FIG. 4A, the region surrounded by the alternate long and short dash line in the first punch die 520 indicates a perforable region of the first punch die 520.

  As shown in FIG. 4B, the first die mold 530 includes a plurality of first product hole die holes 532 corresponding to the first product hole punches 522 and 2 corresponding to the reference hole punches 524. Two reference hole die holes 534 are formed. In FIG. 4B, the region surrounded by the alternate long and short dash line in the first die mold 530 indicates the perforable region of the first die mold 530.

  Next, the second punching die 540 used in the second punching step will be described. The second punching die 540 (not shown) has a second punching die 550 and a second die die 560. As shown in FIG. 5A, the second punch die 550 has a plurality of second product hole punches 552, and two photographing holes 554 are formed. In FIG. 5A, the region surrounded by the alternate long and short dash line in the second punch die 550 indicates the perforable region of the second punch die 550.

  As shown in FIG. 5B, a plurality of second product hole die holes 562 corresponding to the second product hole punches 552 are formed in the second die mold 560, and two illumination holes 564 are formed. Is formed. In FIG. 5B, the region surrounded by the alternate long and short dash line in the second die mold 560 indicates a perforable region of the second die mold 560.

  As shown in FIG. 6, the first drilling step S110 includes a first moving step S111 and a first through hole forming step S112.

First moving step S111 is a step of sending a drilled region R ₁ of the cover lay film W by a cover lay film feeding device 600 to the perforated area of the first perforation die 510 (FIGS. 8 (a) and 8 (See (b).) FIG. 8A shows a state where the cover lay film W is being fed by the cover lay film feeding device 600. FIG. 8B shows a state when the perforation target area R ₁ in the coverlay film W is sent to the perforable area of the first perforation mold 510. Furthermore, in FIG. 8B, the broken line on the coverlay film W virtually indicates the positions of the first product hole punch 522 and the reference hole punch 524 in the first punch die 520. .

The first through hole forming step S112, in a state where the position and orientation of the cover lay film W with respect to the first perforation die 510 is adjusted to form a plurality of first product holes H ₁ and two reference holes H ₄ Step (see FIG. 8C).

In the drilling method of the coverlay film according to the first embodiment, the first piercing step S110, after forming the first product holes H ₁ and the reference hole H ₄ throughout coverlay film W of a long roll-like cover The lay film W is removed from the cover lay film winding device 400 and set in the cover lay film feeding device 300. Further, before performing the second drilling step S120, the first punching die 510 (the first punching die 520 and the first die die 530) is removed from the punching mechanism 500, and the second punching die is removed. 540 (second punch die 550 and first die die 560) is attached.

Second perforation step S120 is a second product hole _{H 3} (see FIG. 9 (d).) Coverlay film W by the first perforation step S110 first product holes _{H 1} and the reference hole _{H 4} are formed It is a process to do. And as shown in FIG. 7, 2nd movement step S121, measurement step 122, adjustment step S123, and 2nd through-hole formation step S124 are included.

Second moving step S121 is a step of sending a drilled region _{R 2} of the cover lay film W by a cover lay film feeding device 600 to the perforated region in the second perforated mold 540 (see Fig. 9 (a).) . The coverlay film W, the first product holes H ₁ and the reference hole H ₄ formed by the first drilling step S110 is formed. 9A shows a state where the coverlay film W is being fed by the coverlay film feeding device 600. FIG. A circle denoted by reference numeral 554 virtually indicates the position of the shooting hole 554.

The measurement step S122 is a step of photographing the two reference holes H ₄ using the two imaging devices 710 and 720 and measuring the positions of the two reference holes H ₄ in the coverlay film W (FIG. 9B). reference.). In the measurement step S122, while holding the cover lay film W by the second punch die 550 and second die mold 560, to measure the position of the two reference holes H _4. In FIG. 9B, the broken line on the coverlay film W virtually indicates the position of the second product hole punch 552 in the second punch die 550.

  The adjustment step S123 is a step of adjusting the position and posture of the coverlay film W with respect to the second punching die 540 based on the measurement result in the measurement step S122 (see FIG. 9C). The position / posture adjustment of the coverlay film W with respect to the second punching die 540 is performed by the coverlay film position / posture adjustment device 800 finely moving the coverlay film feeding device 600 in the x-axis direction and the y-axis direction, and z This is done by rotating around an axis along the axial direction.

The second through hole forming step S124 is a second product hole H ₃ more coverlay film W in a state where the position and orientation are adjusted coverlay film W by adjusting the step S123 for the second piercing die 540 (See FIG. 9D).

Therefore, including the above steps, performed according to the drilling method of the coverlay film according to Embodiment 1, the position of the reference hole H ₄ formed in the first drilling step S110 measured using an imaging device, the Since the position and / or orientation of the coverlay film W is adjusted based on the measurement result, the product hole formed in the first drilling step is to be performed with the accuracy according to the miniaturization. The product hole (second product hole H ₃ ) formed in the second drilling step can be formed with respect to the (first product hole H ₁ ) with an accuracy corresponding to the miniaturization, and as a result, it is finer than before. A product hole pattern can be formed.

Furthermore, according to drilling method of the coverlay film according to the first embodiment, and the forming the reference hole H ₄ suitable for adjusting the position and / or orientation of the first perforation step S110 the coverlay film W Therefore, it is possible to further adjust with high precision the position and / or orientation of the cover lay film W with a reference hole H ₄ in the second drilling step S120. For this reason, the product hole (second product hole H ₃ ) formed in the second drilling step S120 is formed with higher positional accuracy than the product hole (first product hole H ₁ ) formed in the first drilling step S110. As a result, a finer product hole pattern can be formed.

Furthermore, according to drilling method of the coverlay film according to the first embodiment, in the second drilling step S120 because it is decided to measure the positions of two reference holes H _4, higher the position of the reference hole H ₄ precision Thus, the position / posture of the coverlay film W with respect to the second punching die 540 can be adjusted with higher accuracy. Therefore, the product hole (second product hole H ₃ ) formed in the second drilling step is formed with higher positional accuracy than the product hole (first product hole H ₁ ) formed in the first drilling step S110. As a result, a finer product hole pattern can be formed.

Furthermore, according to drilling method of the coverlay film according to the first embodiment, since in the second drilling step S120 that the to shoot reference hole H ₄ through two imaging holes 554, the position of the reference hole H ₄ It becomes possible to measure with higher accuracy, and the position / posture of the coverlay film W with respect to the second punching die 540 can be adjusted with higher accuracy. Therefore, the product hole (second product hole H ₃ ) formed in the second drilling step is formed with higher positional accuracy than the product hole (first product hole H ₁ ) formed in the first drilling step S110. As a result, a finer product hole pattern can be formed.

Further, according to the method for punching a coverlay film according to the first embodiment, in the second punching step S120, the coverlay film W is sandwiched between the second punch die 550 and the second die die 560. since you are able to shoot a reference hole H _4, it is possible to photograph the reference hole H ₄ in the absence of waviness in the cover lay film. Therefore, it is possible to measure with higher precision the position of the reference hole H _4, it is possible to measure with higher precision the position of the reference hole H _4, coverlay film to the second perforated mold S540 It becomes possible to adjust the position / posture of W with higher accuracy. Thereby, the product hole (second product hole H ₃ ) formed in the second drilling step is formed with higher positional accuracy than the product hole (first product hole H ₁ ) formed in the first drilling step S110. As a result, a finer product hole pattern can be formed.

  On the other hand, according to the coverlay film perforating apparatus 100 according to the first embodiment, the coverlay film perforating method according to the first embodiment can be performed. Has the effect of having.

  Further, the coverlay film punching apparatus 100 according to the first embodiment further includes the punching mold driving device 900 that performs the punching operation by driving the servo motor 910. Therefore, the punching operation in the punching molds 510 and 540 is performed. Controllability can be improved, and the product holes to be formed can be made high quality. Moreover, it becomes possible to improve workability | operativity at the time of drilling.

  In addition, according to the coverlay film punching apparatus 100 according to the first embodiment, since it is an RTR type coverlay film punching apparatus using a long coverlay film wound in a roll shape, a highly efficient and fine product hole Can be formed.

  As described above, according to the method for punching a coverlay film according to Embodiment 1, it is possible to form a finer product hole pattern on the coverlay film than before. Therefore, the coverlay film manufactured using the method for punching a coverlay film according to Embodiment 1 is a coverlay film with a higher quality than conventional. Therefore, the flexible circuit board manufactured using such a cover-lay film becomes a higher-quality flexible circuit board than before. In addition, an electronic device manufactured using such a flexible circuit board is a higher-quality electronic device than before.

[Embodiment 2]
FIG. 10 is a view for explaining the first punching die 510a and the second punching die 540a used in the second embodiment. FIG. 10A is a diagram showing a first punch die 520a and a second punch die 550a, and FIG. 10B is a diagram showing a first die die 530a and a second die die 560a. FIG.
FIG. 11 is a flowchart for explaining a coverlay film perforating method according to the second embodiment.
FIG. 12 is a view for explaining the method for punching a coverlay film according to the second embodiment. FIG. 12A to FIG. 12D are diagrams illustrating steps in the method for punching a coverlay film according to the second embodiment. In FIG. 12A to FIG. 12D, the first drilling process shows the n-th hole process, and the second drilling process shows the n-1th process.

  The coverlay film perforating method according to the second embodiment is basically the same method as the coverlay film perforating method according to the first embodiment, but the first perforating step and the second perforating step are continuously performed. (However, it can be said that the n-th first perforation step and the n-1 second perforation step are simultaneously performed). That is, in the coverlay film punching method according to the second embodiment, as shown in FIG. 10, the coverlay film punching device is a first punching die 510a (first punching die 520a and first die die). In a state where the mold 530a) and the second punching mold 540a (second punching mold 550a and second die mold 560a) are arranged along the transport direction (x-axis direction) of the coverlay film The coverlay film punching device 102 (not shown) attached to the punching mechanism 500a (not shown) is used, and the first punching step and the second punching step are continuously performed as shown in FIGS. We are going to carry out.

  As shown in FIG. 11, the method for punching a coverlay film according to the second embodiment includes a moving step S211, a measuring step S212, an adjusting step S213, and a through hole forming step S214.

The moving step S211 is a step of sending the perforation target areas R ₁ and R ₂ in the coverlay film W to the perforable area in the first perforation mold 510a and the second perforation mold 540a by the coverlay film feeding device 600. Yes (see FIG. 12A). In the moving step S211, the area where drilling is not subjected is transmitted to the perforated region of the first perforation die 510a as drilled region R _1. A region where a plurality of first product holes H ₁ and two reference holes H ₄ are formed in the through hole forming step S214 the immediately preceding feeding the perforated region in the second perforated mold 540 as drilled region R ₂ It is done. FIG. 12A shows a state where the cover lay film W is being fed by the cover lay film feeding device 600. In addition, a circle denoted by reference numeral 554 in FIGS. 12A to 12D virtually indicates the position of the shooting hole 554.

Measuring step S212, using the two imaging devices 710 and 720 by photographing the two reference holes _{H 4,} a step of measuring the positions of two reference holes _{H 4} in the cover lay film W (FIG. 12 (b) reference.). In FIG. 12B, the broken line on the cover lay film W on the second punching die 540a side virtually indicates the position of the second product hole punch 542a in the second punching die 540a. It is.

  The adjustment step S213 is a step of adjusting the position and posture of the coverlay film W with respect to the second punching die 540a based on the measurement result in the measurement step S212 (see FIG. 12C). In the adjustment step S213, the cover lay film position / posture adjusting device 800 finely moves the cover lay film feeding device 600 in the x-axis direction and the y-axis direction and rotates around the axis along the z-axis direction. Do.

The through-hole forming step S214 is a step of forming a through-hole in the coverlay film W in a state where the position / posture of the coverlay film W with respect to the second punching die 540a is adjusted by the adjusting step S213 (FIG. 12 ( See d).). By carrying out the through hole forming step S214, the 12 (d), the first product holes H ₁ and two reference holes H ₄ in the pierceable region of the first perforation die 510a of plurality of is formed, the pierceable region of the second perforation die 540a is a plurality of second products hole H ₃ is formed.

  In the method for punching a coverlay film according to the second embodiment, by performing the moving step S211, the measuring step S212, the adjusting step S213, and the through hole forming step S214, in the punchable region of the first punching die 510a. The first drilling step is performed, and the second drilling step is performed in the punchable region of the second punching die 540a.

As described above, the coverlay film perforating method according to the second embodiment is different from the coverlay film perforating method according to the first embodiment in that the first perforating step and the second perforating step are continuously performed. , as in the case of a cover lay film according to the first embodiment, the position of the first perforation step reference hole H ₄ formed by measured using an imaging device, the position of the cover lay film W on the basis of the measurement result In addition, since the posture is adjusted, if the measurement and the adjustment are performed with accuracy according to the miniaturization, the product hole (first product hole H ₁ ) formed in the first drilling step is used. The product hole (second product hole H ₂ ) formed in the second drilling step can be formed with accuracy according to the miniaturization, and as a result, a product hole pattern that is finer than before can be formed. .

  Further, according to the method for punching a coverlay film according to the second embodiment, the first punching die 510a and the second punching die 540a are arranged along the transport direction (x-axis direction) of the coverlay film. Since the coverlay film punching device 102 attached to the punching mechanism 500a in the state is used and the first punching step and the second punching step are continuously performed, the first punching step and the second punching step are separately performed. Compared with the case where it implements in this, it becomes possible to form a fine product hole pattern with high productivity.

  Note that the coverlay film perforating method according to the second embodiment is basically the same method as the coverlay film perforating method according to the first embodiment except for the points described above. It has the corresponding effect as it is among the effects of the film perforation method.

[Embodiment 3]
FIG. 13 is a side view illustrating the coverlay film punching device 104 according to the third embodiment.
In FIG. 13, the same members as those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof is omitted. Further, in FIG. 13, illustration of a part of the left side of the coverlay film punching device 104 (for example, the coverlay film feeding device 300) is omitted.

  The coverlay film perforating apparatus 104 according to the third embodiment basically has the same configuration as the coverlay film perforating apparatus 100 according to the first embodiment, but the post-processing after the through-hole is formed in the coverlay film W. The coverlay film punching apparatus 100 according to the first embodiment is different from the coverlay film punching apparatus 100 in that it further includes a configuration for implementing the above. In other words, as shown in FIG. 13, the coverlay film punching device 104 according to the third embodiment includes a punching scrap removing device 1100 and a half-cutting device between the punching mechanism 500 and the coverlay film winding device 400. 1200.

  As shown in FIG. 13, the perforated waste removing device 1100 includes two first adhesive rollers 1112 and a first perforated waste removing mechanism 1110 having a second adhesive roller 1114 having higher adhesiveness than the first adhesive roller 1112, A second perforated waste removing mechanism 1120 having two third adhesive rollers 1122 and a fourth adhesive roller 1124 having higher adhesiveness than the third adhesive roller 1122.

  The two first adhesive rollers 1112 are rotatably arranged in contact with the upper surface of the cover lay film W, and the second adhesive roller 1114 is rotatable in contact with the first adhesive roller 1112. It is arranged. The two third adhesive rollers 1122 are rotatably arranged in contact with the lower surface of the coverlay film W, and the fourth adhesive roller 1124 is in contact with the third adhesive roller 1122. It is rotatably arranged.

  As shown in FIG. 13, the half-cut device 1200 includes a blade mold 1220 and a second coverlay film feeding device 1240. The blade mold 1220 is configured to be capable of cutting only the coverlay film main body Wb with respect to the coverlay film W, leaving the release paper We. The second cover lay film feeding device 1240 is configured to be able to feed the cover lay film W intermittently.

  For this reason, according to the coverlay film punching device 104 according to the third embodiment, the first adhesive roller 1112 and the third adhesive roller 1122 can adsorb and remove the perforated waste adhering to the coverlay film W. . For this reason, it becomes possible to manufacture a high-quality coverlay film to which perforated scraps are not attached.

  Further, according to the coverlay film punching device 104 according to the third embodiment, the second sticking roller 1114 can remove the punching waste adsorbed by the first adhesive roller 1112, and the punching sucked by the third adhesive roller 1122. The fourth adhesive roller 1124 can remove the waste. For this reason, it becomes possible to suppress that the adsorptivity of the 1st adhesion roller 1112 and the 3rd adhesion roller 1122 falls. The second adhesive roller 1114 and the fourth adhesive roller 1124 can be replaced with new adhesive rollers if the adhesive force decreases.

  Moreover, according to the coverlay film punching apparatus 104 according to the third embodiment, since the half-cut apparatus configured as described above is provided, a coverlay film that has been half-cut using such a half-cut apparatus is used. Thus, even when the coverlay film main body Wb is manually supplied to the base film and the coverlay film is bonded to the base film, the coverlay film main body Wb is easily peeled from the release paper We. This makes it possible to improve workability.

  Since the coverlay film punching device 104 according to the third embodiment has basically the same configuration as the coverlay film punching device 100 according to the first embodiment except for the above, the coverlay film punching device 104 according to the first embodiment. Of the effects possessed by the film punching apparatus 100, the corresponding effects are provided as they are.

  The coverlay film perforation method, coverlay film, flexible circuit board, electronic device, and coverlay film perforation apparatus of the present invention have been described based on the above embodiments, but the present invention is not limited to the above embodiments. The present invention is not limited to this, and can be implemented in various modes without departing from the scope of the invention. For example, the following modifications are possible.

(1) In the coverlay film punching apparatuses 100 and 102 according to the above embodiments, a long coverlay film wound in a roll shape is used as the coverlay film W, but the present invention is limited to this. Is not to be done. As the coverlay film W, a strip-like (rectangular) coverlay film may be used.

  In this case, instead of the cover lay film feeding device 300 and the cover lay film winding device 400, a first cover lay film stocker for placing the sheet-like cover lay film W, and the cover lay film W as the first cover. A cover lay film supply loader for supplying the cover lay film moving device from the lay film stocker, a second cover lay film stocker for placing the cover lay film W after perforation processing, and a cover lay film W after perforation processing It is preferable to provide a coverlay film recovery loader that recovers from the coverlay film moving device to the second coverlay film stocker.

(2) The coverlay film perforating apparatus 100, 102, 104 according to each of the above embodiments includes the first perforating mold 510, 510a and the second perforating mold 540, 540a. The invention is not limited to this, and may be a coverlay film punching device that does not include the first punching die and the second punching die. In this case, a first punching die and a second punching die may be prepared separately.

(3) In the method for perforating a coverlay film according to the second embodiment, the first perforation mold 510a and the second perforation mold 540a configured separately are attached to the perforation mechanism 500a. However, the present invention is not limited to this, and a punching die in which the first punching die and the second punching die are integrated may be attached to the punching mechanism.

(4) In the method for punching a coverlay film according to each of the above embodiments, the method includes a first punching step and a second punching step, but the present invention is not limited to this. After the two drilling steps, third, fourth,... Drilling steps may be further included. In this case, in the third, fourth,... Perforation process, the through hole formed in the previous perforation process is photographed using an imaging device, and the position of the through hole in the coverlay film is measured. Based on the measurement results, the third, fourth,. After adjusting the position and / or posture of the coverlay film relative to the perforating mold, a further through hole may be formed in the coverlay film.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,510,510a ... 1st punch metal mold | die, 20,520,520a ... 1st punch metal mold | die, 22,522,522a ... 1st product hole punch, 24 ... Positioning hole punch, 30,530, 530a ... first die die, 32, 532, 532a ... first product hole die hole, 34 ... positioning hole die hole, 40, 540, 540a ... second punch die, 50, 550, 550a ... Second punch mold, 52, 552, 552a ... second product hole punch, 54 ... positioning pin recess, 60, 560, 560a ... second die mold, 62, 562, 562a ... second product hole Die hole, 64 ... positioning pin, 100, 104 ... coverlay film punching device, 200 ... main body, 210 ... controller box, 300 ... coverlay film feeding device, 310 ... feeding 312, 412 ... torque motor, 320, 420 ... roller support, 400 ... coverlay film winding device, 410 ... winding roller, 500 ... punching mechanism, 524 ... punch for reference hole, 534 ... for reference hole Die hole, 554, 574 ... Shooting hole, 564 ... Illumination hole, 570, 576 ... Mounting jig, 572 ... Punch mold mounting part, 578 ... Die mold mounting part, 580 ... Drilling mechanism main body, 600 ... Coverlay film feeding device, 610: Coverlay film feeding clamper, 612 ... Coverlay film feeding clamper table, 614 ... Servo motor, 616 ... Guide rail, 618 ... Screw shaft, 622, 624 ... Clamper, 632 ... Coverlay film Feeding side guide roller, 634 .. Coverlay film winding side Id roller, 642 ... frame, 644 ... support, 710, 720 ... imaging device, 800 ... coverlay film position / posture adjustment device, 810 ... first fine movement device, 812 ... first table, 814, 824 ... rail, 820 ... Second fine movement device, 822 ... second table, 830 ... third fine movement device, 832 ... third table, 834 ... moving element, 836 ... pivot, 900 ... punching mold drive device, 910 ... servo motor, 920 ... drive Shaft, 930 ... guide post, 940 ... lifting body, 950 ... pulley, 960 ... belt, 1100 ... perforated dust removing device, 1110 ... first perforated waste removing mechanism, 1112 ... first adhesive roller, 1114 ... second adhesive roller, DESCRIPTION OF SYMBOLS 1120 ... 2nd perforation waste removal mechanism, 1122 ... 3rd adhesion roller, 1124 ... 4th adhesion roller, 1200 ... Half-cut apparatus, 122 0 ... cutting die, 1240 ... second coverlay film feeding apparatus, H ... product bore, H 1 _... first product bore, H 2 _... positioning hole, H 3 _... second product aperture, H 4 _... reference hole, _{R 1} , R ₂ ... area to be perforated, W ... coverlay film, Wb ... coverlay film body, We ... release paper

  The present invention relates to a coverlay film perforating method and a coverlay film perforating apparatus.

  Accordingly, the present invention has been made to solve such problems, and an object of the present invention is to provide a coverlay film perforating method capable of forming a finer product hole pattern than before. Another object of the present invention is to provide a coverlay film punching device that can be suitably used for such a method of punching a coverlay film.

Claims (16)

A first punching step of forming a plurality of first through holes in the coverlay film using a first punching die having a first punching die and a first die die;
A second punching step of forming a plurality of second through holes in the coverlay film using a second punching die having a second punching die and a second die die,
In the second punching step, the first through hole is photographed using an imaging device, the position of the first through hole in the coverlay film is measured, and the second punching gold is based on the measurement result. A method for perforating a coverlay film, wherein the second through hole is formed in the coverlay film after adjusting the position and / or orientation of the coverlay film with respect to a mold. The method for punching a coverlay film according to claim 1,
In the first punching step, a plurality of product holes and a reference hole used as a reference for adjusting the position and / or posture of the coverlay film in the second punching step are formed as the first through holes. A method for perforating a coverlay film. In the method for perforating a coverlay film according to claim 1 or 2,
In the second punching step, the first through hole is photographed by using at least two imaging devices as the imaging device. The method for punching a coverlay film according to claim 3,
The method for punching a coverlay film, wherein the second punching die has at least two shooting holes corresponding to the at least two imaging devices. In the perforation method of the coverlay film according to any one of claims 1 to 4,
In the second punching step, the first through hole is photographed in a state where the cover lay film is sandwiched between the second punch die and the second die die. Drilling method.   A coverlay film manufactured using the method for punching a coverlay film according to claim 1.   The flexible circuit board manufactured using the coverlay film of Claim 6.   An electronic device manufactured using the flexible circuit board according to claim 7. A first punching die for forming a plurality of first through holes in the coverlay film, the first punching die and the first die die;
A second punch mold for forming a plurality of second through holes in a coverlay film having a second punch mold and a second die mold, wherein the plurality of first through holes are formed. When,
A piercing die mounting portion to which the first piercing die and the second piercing die can be attached and detached;
An imaging device that photographs the first through-hole, and a measurement device that measures the position of the first through-hole in the coverlay film based on a photographing result by the imaging device;
Coverlay film perforation comprising: a coverlay film position / posture adjustment device that adjusts the position and / or posture of the coverlay film with respect to the second punching die based on the measurement result of the measurement device apparatus. The coverlay film punching device according to claim 9,
The measurement apparatus has at least two image pickup devices as the image pickup device. In the coverlay film punching device according to claim 9 or 10,
The coverlay film punching device, wherein the second punching die has at least two shooting holes corresponding to the at least two imaging devices. In the coverlay film punching device according to any one of claims 9 to 11,
A coverlay film punching device, further comprising a punching die driving device that performs a punching operation by driving a servo motor. In the coverlay film punching device according to any one of claims 9 to 12,
An RTR type coverlay film punching device using a long coverlay film wound in a roll as the coverlay film,
A coverlay film feeding device for feeding the roll-shaped coverlay film into a sheet;
A coverlay film feeding device for feeding the sheet-like coverlay film fed by the coverlay film feeding device to a punching position;
And a coverlay film winding device for winding the sheet-like coverlay film that has been punched by the first punching die or the second punching die into a roll shape. Coverlay film punching device. The coverlay film punching device according to claim 13,
Further comprising a perforation waste removing device disposed between the perforation position and the coverlay film winding device and capable of removing perforation waste adhering to the coverlay film;
The perforated waste removing device is
At least one first adhesive roller rotatably disposed in contact with one surface of the coverlay film, and rotatably disposed in contact with the first adhesive roller, the first A first perforated waste removal mechanism having a second adhesive roller having a higher adhesiveness than the adhesive roller;
At least one third adhesive roller rotatably disposed in contact with the other surface of the coverlay film, and rotatably disposed in contact with the third adhesive roller; A coverlay film punching device comprising: a second punching dust removing mechanism having a fourth adhesive roller having higher adhesiveness than the adhesive roller. The coverlay film punching device according to claim 13 or 14,
A half-cut device that is disposed between the punching die mounting portion and the coverlay film winding device and that cuts the coverlay film body of the coverlay film while leaving a release paper. A coverlay film punching device. A coverlay film punching device used in the coverlay film punching device according to any one of claims 9 to 15,
A piercing die mounting portion to which the first piercing die and the second piercing die can be attached and detached;
An imaging device that photographs the first through-hole, and a measurement device that measures the position of the first through-hole in the coverlay film based on a photographing result by the imaging device;
Coverlay film perforation comprising: a coverlay film position / posture adjustment device that adjusts the position and / or posture of the coverlay film with respect to the second punching die based on the measurement result of the measurement device apparatus.