CN208490040U - A kind of encapsulated equipment of upper PIN for pcb board - Google Patents
A kind of encapsulated equipment of upper PIN for pcb board Download PDFInfo
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- CN208490040U CN208490040U CN201820570461.6U CN201820570461U CN208490040U CN 208490040 U CN208490040 U CN 208490040U CN 201820570461 U CN201820570461 U CN 201820570461U CN 208490040 U CN208490040 U CN 208490040U
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- pin
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Abstract
A kind of encapsulated equipment of upper PIN for pcb board, it include: to be connected between equipment base and equipment rack by conveying mechanism, elevating mechanism, feed mechanism, pre-locating mechanism, robot smelting tool, plant pin mechanism, the encapsulation mechanism being located on equipment rack and the receiving mechanism being located on equipment base；Feed mechanism by elevating mechanism chock plate and pcb board heap fold be moved to pre-locating mechanism complete pre-determined bit lamination, pre-determined bit lamination is moved to by robot smelting tool plants pin mechanism implantation pin, the aluminium foil of elevating mechanism is superimposed upon on pre-determined bit lamination by subsequent robot smelting tool, PIN lamination process in completion, subsequent plates are sent to encapsulation mechanism by conveying mechanism and carry out encapsulated process, complete rewinding process finally by receiving mechanism.The utility model automates the encapsulated process machineryization of the upper PIN of pcb board, solves a series of disadvantages of manual work, can not shut down feeding, greatly enhances the quality of production efficiency and product.
Description
Technical field
The utility model relates to electronics manufacture field more particularly to a kind of encapsulated equipment of upper PIN for pcb board, mainly
Single dual platen before edging drills later and multi-layer board technique occasion are cut out applied to pcb board printing industry.
Background technique
It in the encapsulated technique of upper PIN of pcb board, generally comprises the steps: boring two holes PIN, on plate with two PIN
Chock plate and pcb board are superimposed then in two holes PIN fixed position of implantation pin, then in pcb board one by hole positioning
Face is superimposed one layer of aluminium foil again, will be together with three-piece chock plate, pcb board and aluminium foil inclusion with adhesive tape after superposition is neat: pad
Plank+PCB plate (multiple)+aluminium foil+adhesive tape.
The current encapsulated technique of upper PIN realizes full-automation not yet, by the way that set PIN lamination feeding is positioned manually；Manually
Cooperate semiautomatic machine sized by different model pcb board；Hand fit's semiautomatic machine is implanted into pin；Hand fit half is certainly
Movement machine is encapsulated；Artificial lamination blanking.This operation mode has the disadvantage in that
1. current semiautomatic machine, which needs artificial frequent operation to adjust, adapts to production model large labor intensity, it is easy fatigue.
2. be easy to causeing safety accident as worker operation is improper.
3. high labor cost, low efficiency.
There is sweat that PCB is easy to cause to aoxidize 4. human body frequently contacts pcb board manpower, makes the reduction of pcb board quality, the proportion of goods damageds
It is high.
5. manually set PIN uncertain factor is more, set is inaccurate, blast hole when causing to be implanted into PIN pin.
6. manual operation is encapsulated, it is easy glue, it is unstable.
Utility model content
The utility model is intended to provide a kind of encapsulated equipment of upper PIN for pcb board, solves people as stated in the background art
Work operation mode bring one or more disadvantage.
The utility model is realized in this way:
A kind of encapsulated equipment of upper PIN for pcb board, including equipment base and equipment rack, the equipment base with set
It is connected between standby host frame by conveying mechanism, elevating mechanism, the feeder for being used to place plate being respectively provided on equipment base
Structure, robot smelting tool, plants pin mechanism, and the encapsulation mechanism and collecting machine that are respectively provided on equipment rack at pre-locating mechanism
Structure；The feed mechanism by elevating mechanism chock plate and pcb board heap fold and be moved to pre-locating mechanism to complete pre-determined bit folded
Plate, pre-determined bit lamination is moved to by the robot smelting tool plants pin mechanism implantation pin, and then the robot smelting tool will lifting
The aluminium foil of mechanism is superimposed upon on pre-determined bit lamination, and PIN lamination process in completion, subsequent plates are sent by conveying mechanism to encapsulated
Mechanism carries out encapsulated process, completes rewinding process finally by receiving mechanism.
As the further improvement of utility model, the elevating mechanism includes the first elevating mechanism, the second elevating mechanism, institute
Stating feed mechanism includes the first feed mechanism, the second feed mechanism, and the pre-locating mechanism includes the first pre-locating mechanism, second
Pre-locating mechanism；The side of the equipment base is equipped with the first elevating mechanism, the first feed mechanism and the first pre-locating mechanism, institute
The other side for stating equipment base is equipped with the second elevating mechanism, the second feed mechanism and the second pre-locating mechanism；The robot smelting
Tool, plant pin mechanism and conveying mechanism are each provided among equipment base；The plant pin mechanism, conveying mechanism and encapsulation mechanism successively connect
It connects, the receiving mechanism is located at the equipment rack top and is in the top of the encapsulation mechanism.
As the further improvement of utility model, the feed mechanism includes feeding manipulator, traversing mould group, the feeding
Manipulator can be rotated along XYZ three-dimensional motion and along R axis, to adjust the position of the plate；The traversing mould group is two
And the horizontal middle part for being laid on the equipment base, the feeding manipulator are completed X-axis by traversing mould group and are moved respectively.
As the further improvement of utility model, the pre-locating mechanism includes positioning pin needle mould group and four sides clappers mould
Group, the lamination for being preset with the hole PIN carry out the set hole PIN pre-determined bit by positioning pin needle mould group, and the lamination for being not provided with the hole PIN passes through
Four have the final say pre-determined bit when mould group of having the final say carries out four.
As the further improvement of utility model, the plant pin mechanism includes repositioning pin mould group, drilling die group and pressure
PIN sells mould group, and the lamination for being preset with the hole PIN carries out the set hole PIN positioning again by repositioning pin mould group, is not provided with the hole PIN
Lamination by drilling die group carry out bore the hole PIN；The lamination for being preset with the hole PIN and the lamination for being not provided with the hole PIN pass through pressure PIN
Pin mould group carries out implantation pin.
As the further improvement of utility model, the encapsulation mechanism includes center turntable, and the conveying mechanism is in
The connection of heart turntable, center turntable two sides are equipped with rubber coating machine, and the center turntable completes the two of plate in rubber coating machine
It after side is encapsulated, is rotated by 90 ° or 270 °, the two other side that the rubber coating machine completes plate is encapsulated.
For compared with prior art, the beneficial effects of the utility model are: the utility model is encapsulated by the upper PIN of pcb board
Technique is improved to do mechanization operation mode from artificial or semiautomatic working, solves a series of disadvantages of manual work, can not
Feeding is shut down, the quality of production efficiency and product is greatly enhanced.
Detailed description of the invention
Fig. 1 is a kind of top view of encapsulated equipment of upper PIN for pcb board.
Fig. 2 is a kind of main view of encapsulated equipment of upper PIN for pcb board.
Fig. 3 is a kind of front view of encapsulated equipment of upper PIN for pcb board.
Fig. 4 is the main view of the equipment base part of the utility model.
Fig. 5 is the structural schematic diagram of the plant pin mechanism of the utility model.
Fig. 6 is the main view of the equipment rack part of the utility model.
Detailed description of the invention: 1- equipment base, 2- equipment rack, 3- conveying mechanism, 4-PCB plate lifting platform, the lifting of 5- chock plate
Platform, 6- aluminium foil lifting platform, 7- feed mechanism, 71- feeding manipulator, the traversing mould group of 72-, 8- pre-locating mechanism, 81- position pin
Mould group, tetra- side 82- clappers mould group, 9- robot smelting tool, 10- plant pin mechanism, and 101- repositions pin mould group, 102- drilling die
Group, 103- press PIN to sell mould group, 104- empty avoiding mould group, 11- encapsulation mechanism, the center 111- turntable, 112- rubber coating machine, 12- receipts
Expect mechanism, 13-CCD vision positioning mechanism.
Specific embodiment
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, with reference to the accompanying drawing and specifically
The present invention will be further described for embodiment.
Embodiment 1
A kind of encapsulated equipment of upper PIN for pcb board as shown in Figs. 1-5, including equipment base 1 and equipment rack 2, institute
It states and is connected between equipment base 1 and equipment rack 2 by conveying mechanism 3.
It further include being respectively provided at (going up and down including the pcb board for placing pcb board on equipment base 1 for placing plate
Platform 4, for placing the chock plate lifting platform 5 of chock plate, for placing the aluminium foil lifting platform 6 of aluminium foil, elevating mechanism passes through liter
Drop machine carries out up and down motion control) elevating mechanism, feed mechanism 7, pre-locating mechanism 8, robot smelting tool 9, plant pin mechanism
10, and the encapsulation mechanism 11 and receiving mechanism 12 that are respectively provided on equipment rack 2.
The operational process of above-mentioned each mechanism is: the feed mechanism 7 by elevating mechanism chock plate and pcb board heap fold
It is moved to pre-locating mechanism 8 and completes pre-determined bit lamination, pre-determined bit lamination is moved to plant pin mechanism 10 and planted by the robot smelting tool 9
Enter pin, then the aluminium foil of elevating mechanism is superimposed upon on pre-determined bit lamination by the robot smelting tool 9, PIN lamination in completion
Process, subsequent plates are sent to encapsulation mechanism 11 by conveying mechanism 3 and carry out encapsulated process, complete to receive finally by receiving mechanism 12
Material process.
By adopting the above technical scheme, the utility model is by the encapsulated technique of upper PIN of pcb board from artificial or semi-automatic work
Industry is improved to do mechanization operation mode, solves a series of disadvantages of manual work, can not shut down feeding, largely mention
The high quality of production efficiency and product.
Further, the elevating mechanism includes the first elevating mechanism, the second elevating mechanism, and the feed mechanism 7 includes
First feed mechanism, the second feed mechanism, the pre-locating mechanism 8 include the first pre-locating mechanism, the second pre-locating mechanism；
The side of the equipment base 1 is equipped with the first elevating mechanism, the first feed mechanism and the first pre-locating mechanism, the equipment base
1 other side is equipped with the second elevating mechanism, the second feed mechanism and the second pre-locating mechanism；The robot smelting tool 9 plants pin machine
Structure 10 and conveying mechanism 3 are each provided among equipment base 1；The plant pin mechanism 10, conveying mechanism 3 and encapsulation mechanism 11 successively connect
It connects, the receiving mechanism 12 is located at 2 top of equipment rack and is in the top of the encapsulation mechanism 11.Using this technology
The bilateral feeding of equipment base may be implemented in scheme, equipment, and production efficiency is higher, and entirely upper PIN rubber-wrapping structure is compact, and reduction is set
Standby volume shortens the moving displacement of feed mechanism, robot smelting tool.
Embodiment 2
On the basis of embodiment 1, the feed mechanism is advanced optimized.
The feed mechanism 7 includes feeding manipulator 71, traversing mould group 72, and the feeding manipulator 71 can be along XYZ tri-
Maintenance and operation is dynamic and along the rotation of R axis (R axis uses rotating electric machine, and YZ axis uses cylinder), to adjust the position of the plate；It is described
Traversing mould group 72 is two and the horizontal middle part for being laid on the equipment base 1, the feeding manipulator 71 pass through traversing respectively
Mould group 72 completes X-axis movement.
Preferably, the feeding manipulator 71 is equipped with sucker group.
Feeding by adopting the above technical scheme is mechanical, plate position can be adjusted flexibly, and pass through sucker according to lamination needs
Group firmly draws plate, prevents plate from damaging.
Embodiment 3
On the basis of embodiment 1, the pre-locating mechanism is advanced optimized.
The pre-locating mechanism 8 includes positioning pin needle mould group 81 and four sides clappers mould group 82, and the lamination for being preset with the hole PIN is logical
It crosses positioning pin needle mould group 81 and carries out the set hole PIN pre-determined bit, the lamination for being not provided with the hole PIN passes through four when mould group 82 of having the final say carries out four
Clappers pre-determined bit.
Positioning pin needle mould group include two removable adjustment centers away from positioning pin, the positioning pin and embodiment 2
The hole PIN socket in the lamination of middle adjustment good position, completes pre-determined bit.
Four sides clappers mould group include eight removable adjustment centers away from baffle, adjust in the baffle and embodiment 2
Four sides of the lamination of position, which are had the final say, to be aligned, and pre-determined bit is completed.
In addition, further including CCD vision positioning mechanism 13, the feeding manipulator 71 in embodiment 2 will first be preset with the hole PIN
Plate heap fold, be moved to the top of CCD vision positioning mechanism 13, CCD vision positioning mechanism 13 takes pictures to the hole PIN, on
Material manipulator 71 adjusts the position of lamination by result of taking pictures.
By adopting the above technical scheme, take pictures by CCD vision positioning mechanism 13 and adjust position, positioning is more accurate,
Prevent blast hole occur when being implanted into pin in the later period；Then by positioning pin needle mould group and four sides clappers mould group, two kinds are completed not
The pre-determined bit of the plate (be such as preset with the multi-layer board in the hole PIN, and be not provided with single doubling plate in the hole PIN) of same type, for below
Implantation pin lay a solid foundation.
Embodiment 4
On the basis of embodiment 1, plant pin mechanism is advanced optimized.
The plant pin mechanism 10 includes that repositioning pin mould group 101, drilling die group 102 and pressure PIN sell mould group 103, is preset
There is the lamination in the hole PIN to carry out the positioning of the set hole PIN, the lamination for being not provided with the hole PIN again by repositioning pin mould group 101 and passes through brill
Casement group 102 carries out boring the hole PIN；The lamination for being preset with the hole PIN and the lamination for being not provided with the hole PIN pass through pressure PIN pin mould group
103 carry out implantation pin.
It preferably, further include empty avoiding mould group 104, repositioning pin mould group 101, drilling die group 102 and pressure PIN sell mould group
103 are each provided in empty avoiding mould group.Described two empty avoiding mould groups avoid horizontally outward when plate is placed in, horizontal after plate merging
It comes closer.
In addition, the repositioning pin component need the use of time rise jack up complete set the hole PIN, do not need using
When decline withdraw, do not interfere drilling process.The drilling die group rises drilling when needed, while empty avoiding mould group pushes auxiliary
The punching of drilling die group.
It adopts this technical solution, cooperates the pre-locating mechanism 8 of embodiment 3, the utility model can carry out two kinds not simultaneously
The upper PIN of the pcb board of same type works, and equipment can record information (type of such as pcb board, ruler by program controls portions in advance
It is very little), mechanization production can be automatically performed by the utility model.
Embodiment 5
On the basis of embodiment 1, encapsulation mechanism 11 is advanced optimized.
The encapsulation mechanism 11 includes center turntable 111, and the conveying mechanism 3 is connect with center turntable 111, described
Turntable 111 two sides in center are equipped with rubber coating machine 112, and the center turntable 111 wraps on two sides that rubber coating machine 112 completes plate
It after glue, is rotated by 90 ° or 270 °, the two other side that the rubber coating machine 112 completes plate is encapsulated, and so far, four sides of plate are encapsulated
It completes.
It adopts this technical solution, rubber coating machine can be existing encapsulated equipment, and rubber coating machine is integrated into whole equipment, is made
Whole equipment integration, procedure.
Embodiment 6
Further, it is also possible on receiving mechanism setting can multiaxial motion manipulator, complete the work of flexible lamination, such as hand over
Wrong lamination, it is therefore an objective to avoid the pin of protrusion mutually.Counter can also be set on rewinding platform, counted, rewinding,
Lamination.
Following process flow may be implemented in the technical solution of 1-6 in conjunction with the embodiments, the utility model: 1. pass through device program
Control section, canned message.
--- bilateral CCD aligns set PIN lamination in advance --- the robot 2. plate for being preset with the hole PIN: bilateral feeding
--- --- stacked on aluminium foil --- four sides are encapsulated --- counts lamination rewinding to implantation pin to the smelting tool clamping secondary set PIN of lamination.
3. for the plate for being not provided with the hole PIN, bilateral feeding --- the pre- contraposition lamination of four sides clappers --- robot smelting tool
Clamping lamination drilling, --- --- stacked on aluminium foil --- four sides are encapsulated --- counts lamination rewinding to implantation pin.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (6)
1. a kind of encapsulated equipment of upper PIN for pcb board, which is characterized in that including equipment base and equipment rack, the equipment
It is connected between pedestal and equipment rack by conveying mechanism, the elevator for being used to place plate being respectively provided on equipment base
Structure, feed mechanism, pre-locating mechanism, robot smelting tool, plant pin mechanism, and the encapsulation mechanism that is respectively provided on equipment rack with
And receiving mechanism；The feed mechanism by elevating mechanism chock plate and pcb board heap fold be moved to pre-locating mechanism complete
It is pre-positioned lamination, pre-determined bit lamination is moved to by the robot smelting tool plants pin mechanism implantation pin, the subsequent robot smelting
The aluminium foil of elevating mechanism is superimposed upon on pre-determined bit lamination by tool, and PIN lamination process, subsequent plates pass through conveying mechanism in completion
It send to encapsulation mechanism and carries out encapsulated process, complete rewinding process finally by receiving mechanism.
2. the upper PIN encapsulated equipment according to claim 1 for pcb board, which is characterized in that the elevating mechanism includes
First elevating mechanism, the second elevating mechanism, the feed mechanism includes the first feed mechanism, the second feed mechanism, described predetermined
Position mechanism includes the first pre-locating mechanism, the second pre-locating mechanism；The side of the equipment base is equipped with the first elevating mechanism, the
The other side of one feed mechanism and the first pre-locating mechanism, the equipment base is equipped with the second elevating mechanism, the second feed mechanism
With the second pre-locating mechanism；The robot smelting tool, plant pin mechanism and conveying mechanism are each provided among equipment base；The plant pin
Mechanism, conveying mechanism and encapsulation mechanism are sequentially connected, and the receiving mechanism is located at the equipment rack top and is in the packet
The top of gluing mechanism.
3. the upper PIN encapsulated equipment according to claim 1 for pcb board, which is characterized in that the feed mechanism includes
Feeding manipulator, traversing mould group, the feeding manipulator can be rotated along XYZ three-dimensional motion and along R axis, to adjust the plate
The position of material；The traversing mould group is two and level is laid on the middle part of the equipment base, the feeding manipulator respectively
X-axis movement is completed by traversing mould group.
4. the upper PIN encapsulated equipment according to claim 1 for pcb board, which is characterized in that the pre-locating mechanism packet
Positioning pin needle mould group and four sides clappers mould group are included, the lamination for being preset with the hole PIN carries out the set hole PIN by positioning pin needle mould group and makes a reservation for
Position is not provided with the lamination in the hole PIN and has the final say when mould group of having the final say carries out four pre-determined bit by four.
5. the upper PIN encapsulated equipment according to claim 4 for pcb board, which is characterized in that the plant pin mechanism includes
It repositions pin mould group, drilling die group and pressure PIN and sells mould group, the lamination for being preset with the hole PIN is carried out by repositioning pin mould group
The set hole PIN positioning again, the lamination for being not provided with the hole PIN carry out boring the hole PIN by drilling die group；Be preset with the hole PIN lamination and
The lamination for being not provided with the hole PIN passes through pressure PIN pin mould group and carries out implantation pin.
6. the upper PIN encapsulated equipment according to claim 1 for pcb board, which is characterized in that the encapsulation mechanism includes
Center turntable, the conveying mechanism are connect with center turntable, and center turntable two sides are equipped with rubber coating machine, the center
It after turntable is encapsulated on two sides that rubber coating machine completes plate, is rotated by 90 ° or 270 °, the rubber coating machine completes other the two of plate
Side is encapsulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820570461.6U CN208490040U (en) | 2018-04-20 | 2018-04-20 | A kind of encapsulated equipment of upper PIN for pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820570461.6U CN208490040U (en) | 2018-04-20 | 2018-04-20 | A kind of encapsulated equipment of upper PIN for pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208490040U true CN208490040U (en) | 2019-02-12 |
Family
ID=65252215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820570461.6U Active CN208490040U (en) | 2018-04-20 | 2018-04-20 | A kind of encapsulated equipment of upper PIN for pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208490040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109484839A (en) * | 2018-11-01 | 2019-03-19 | 深圳市克鲁斯机器人科技有限公司 | A kind of automatically upper PIN rubber coating machine |
-
2018
- 2018-04-20 CN CN201820570461.6U patent/CN208490040U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109484839A (en) * | 2018-11-01 | 2019-03-19 | 深圳市克鲁斯机器人科技有限公司 | A kind of automatically upper PIN rubber coating machine |
| CN109484839B (en) * | 2018-11-01 | 2024-01-12 | 深圳市克鲁斯机器人科技有限公司 | Full-automatic PIN rubber coating machine of going up |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 First Floor D of Building C, Junxing Industrial Zone B, Oyster Road, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Power Flying Intelligent Equipment Co., Ltd. Address before: 518000 First Floor D of Building C, Junxing Industrial Zone B, Oyster Road, Fuyong Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN POWERFLY AUTOMATION EQUIPMENT CO., LTD. |