JP5750574B2 - Component mounting apparatus and method for controlling movement of working means in component mounting apparatus - Google Patents

Description

  The present invention relates to a component mounting apparatus that performs a component mounting operation by a working means by moving the working means in the vertical direction and the horizontal direction, and a movement control method for the working means in the component mounting apparatus.

  The component mounting apparatus causes the working means to perform the component mounting work by moving the working means (suction nozzle) attached to the mounting head in the vertical direction and the horizontal direction. As such a component mounting apparatus, for example, in a module manufacturing line of a liquid crystal panel, a provisional pressure bonding apparatus for mounting an electronic component such as a drive circuit on a terminal at an end of a panel substrate is known. The temporary crimping apparatus is a process in which the working means positioned immediately above the component suction position for sucking the electronic component is moved down to suck the electronic component at the component suction position, and the working means that sucked the electronic component is placed above the panel substrate. A step of moving the working means moved above the panel substrate to attach the electronic component to the panel substrate, and a working means having the electronic component attached to the panel substrate for adsorbing the next electronic component. Then, a series of operations consisting of a step of moving to a position just above the component suction position is repeatedly executed to temporarily press the electronic component to the panel substrate.

  In the temporary crimping apparatus, a rotating brush for removing burrs from the lower surface of the electronic component is provided between the component suction position and the panel substrate by the working means, and the electronic component is deburred by the rotating brush. Although it is mounted on the panel board later, the working means is positioned immediately above the component suction position (second position) from the mounting position (first position) of the electronic component on the panel board to suck the next electronic component. When moving the working means linearly from the first position toward the second position, the working means interferes with the rotating brush. For this reason, the work means that has finished mounting the electronic components on the panel substrate is set to a height higher than the maximum height of the rotating brush that is an interference object, without going straight from the first position to the second position. It is necessary to move the target height horizontally so as to pass over the rotating brush toward the second position.

  In this case, the control means for controlling the movement of the working means is a vertical movement profile in which the working means starts to move upward from the first position and then gradually decreases the speed of upward movement and approaches the target height. Then, it starts moving in the horizontal direction when it rises to a height where it can avoid the interference, and after reaching the target height, it maintains the target height (moves horizontally) with a horizontal movement profile. The movement control is performed. In this case, the working means moves from the upward movement to the horizontal movement while drawing an arch-like movement locus (for example, see Patent Document 1).

JP 2011-233634 A

  However, as described above, when the working means is moved along the arch-shaped movement trajectory so as to pass above the interference object in the horizontal direction, the horizontal movement of the working means is started after the upward movement speed starts to be reduced. For this reason, there is a problem in that the time required for the movement of the working means per time becomes long and the tact improvement is hindered.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a component mounting apparatus capable of improving the tact by shortening the time required to move the working means, and a method for controlling the movement of the working means in the component mounting apparatus. To do.

  The component mounting apparatus according to claim 1 is a component mounting apparatus including a working unit and a control unit that causes the working unit to perform a component mounting operation by moving the working unit in the vertical direction and the horizontal direction. The means moves the working means from the first position to the second position. When the working means is linearly moved from the first position to the second position, there is an interference that interferes with the working means. Therefore, when a target height that is set to be higher than the maximum height of the interference object is passed through the interference object by horizontal movement, a reference height that is lower than the target height is set, and the operation means Starts moving up from the first position, then decelerates after moving up above the reference height without reducing the moving up speed, and then moves down after the working means once exceeds the target height. And then move up and down to maintain the target height. After the profile and work unit starts to move upward from the first position, moving the working means in the horizontal direction movement profile of starting the movement in the horizontal direction when it reaches the reference height.

  The movement control method of the working means in the component mounting apparatus according to claim 2 is such that the component mounting apparatus that performs the component mounting work by the working means by moving the working means in the vertical direction and the horizontal direction moves the working means to the first position. When the working means is moved from the first position to the second position in a straight line when moving from the first position to the second position, there is an interfering object that interferes with the working means. A method for controlling the movement of a working means in a component mounting apparatus in a case where a target height set to a height higher than the height is horizontally moved above an interference object, and a reference height lower than the target height is set. And after the work means starts to move up from the first position, the work means decelerates after moving up beyond the reference height without reducing the speed of the up movement, and the work means once sets the target height. After that, move down After the vertical movement profile and the working means for maintaining the target height starts moving upward from the first position, the horizontal direction starts moving in the horizontal direction when reaching the reference height And a step of moving the working means with the created vertical movement profile and horizontal movement profile.

  In the present invention, when the working means is moved from the first position to the second position, if the working means is linearly moved from the first position to the second position, there is an interference that interferes with the working means. When the target height, which is set higher than the maximum height of the interference object, is passed horizontally above the interference object by horizontal movement, a reference height lower than the target height is set, and the operation means After starting the upward movement from the position 1, the speed is increased after exceeding the reference height without reducing the upward movement speed, and then decelerating. After the working means once exceeds the target height, it moves downward and then the target height. Create a horizontal movement profile that starts moving in the horizontal direction when the reference height is reached after the movement profile in the vertical direction and the working means start moving upward from the first position. Transfer work means with the created travel profile. Since the movement in the horizontal direction is started without waiting for the deceleration of the upward movement speed of the working means, the movement of the working means is more than the case where the working means is moved along a conventional arch-shaped movement trajectory. The tact time can be improved by shortening the time required. This is particularly effective when working on large panels with many parts mounted.

The perspective view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The top view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The side view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The partial expanded front view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The partial expanded side view of the temporary crimping | compression-bonding apparatus in one embodiment of this invention The block diagram which shows the control system of the temporary crimping | compression-bonding apparatus in one embodiment of this invention (A) (b) The figure explaining the operation | movement procedure in which the temporary crimping | compression-bonding apparatus in one embodiment of this invention mounts an electronic component on a panel board | substrate. (A) (b) The figure explaining the operation | movement procedure in which the temporary crimping | compression-bonding apparatus in one embodiment of this invention mounts an electronic component on a panel board | substrate. (A) (b) The figure explaining the operation | movement procedure in which the temporary crimping | compression-bonding apparatus in one embodiment of this invention mounts an electronic component on a panel board | substrate. (A) (b) The figure explaining the operation | movement procedure in which the temporary crimping | compression-bonding apparatus in one embodiment of this invention mounts an electronic component on a panel board | substrate. (A) (b) The vertical movement profile and the horizontal movement profile of the suction nozzle when the electronic component is mounted on the panel substrate by the temporary crimping apparatus according to the embodiment of the present invention are shown together with the upward displacement of the suction nozzle. Graph

  Embodiments of the present invention will be described below with reference to the drawings. A temporary crimping apparatus 1 as a component mounting apparatus shown in FIGS. 1, 2, and 3 includes a panel positioning unit 12 that positions a panel substrate 2 and a component supply unit 13 that supplies an electronic component 3 on a base 11. And a component mounting portion 14 that sucks the electronic component 3 supplied from the component supply portion 13 and mounts it on the terminal 2a of the panel substrate 2 positioned by the panel positioning portion 12, and includes one long side and one side of the panel substrate 2. Is a device for performing a temporary crimping operation to mount an electronic component 3 such as a drive circuit on each of a plurality of terminals 2a provided at the end of each of the short sides. It constitutes the module manufacturing line of the panel manufacturing system. Hereinafter, for convenience of explanation, the left-right direction of the base 11 viewed from the operator OP is the X-axis direction, the front-rear direction of the base 11 viewed from the operator OP is the Y-axis direction, and the vertical direction of the base 11 is the Z-axis direction. . Further, the right side of the base 11 viewed from the operator OP is referred to as the right side, and the left side is referred to as the left side. The front side of the base 11 viewed from the operator OP is referred to as the front, and the back side is referred to as the rear.

  In FIG. 3, the panel positioning portion 12 is provided so as to be movable relative to the base 11 in the X-axis direction and movable relative to the X-axis table 21 in the Y-axis direction. A Y-axis table 22, a θ table 23 provided so as to be rotatable around the Z-axis (within a horizontal plane) with respect to the Y-axis table 22, and a panel support table 24 provided on the upper surface of the θ table 23 are provided. .

  1 and 4, the component supply unit 13 includes left and right tape transport units 31 that transport the tape TP on which the electronic component 3 is placed, and left and right punches the electronic component 3 from the tape TP transported by the left and right tape transport units 31. The component punching unit 32 and the left and right component moving units 33 that receive and move the electronic component 3 punched by each component punching unit 32 are provided.

  1 and 4, the left and right tape transport units 31 respectively include a tape supply reel 31a for supplying (feeding out) the tape TP, and a tape take-up reel 31b for winding the tape TP supplied from the tape supply reel 31a. The cover tape take-up reel 31c is formed by removing the cover tape CP from the tape TP supplied from the tape supply reel 31a. In each tape transport section 31, the tape supply reel 31a, the tape take-up reel 31b, and the cover tape take-up reel 31c rotate synchronously, thereby supplying the tape TP from the tape supply reel 31a and using the tape take-up reel 31b. The tape TP is taken up and the cover tape CP is taken up from the tape TP by the cover tape take-up reel 31c, and a part of the tape TP from which the cover tape CP has been peeled is conveyed in the horizontal plane direction (X-axis direction). Is done.

  3 and 4, the left and right component punching portions 32 include a fixed lower mold 32 a and an upper mold 32 b that is raised and lowered with respect to the lower mold 32 a. Between the lower mold 32a and the upper mold 32b, the tape TP conveyed in the horizontal plane direction by the tape conveyance unit 31 passes, and the upper mold 32b is lowered with respect to the lower mold 32a. Thus, the electronic component 3 can be punched from the tape TP.

  1, 2, and 3, each component moving unit 33 includes an X-axis guide 33 a that is common to the left and right component moving units 33 provided on the base 11 so as to extend in the X-axis direction, and an X-axis guide 33 a. Provided on the X-axis table 33c, a Y-axis table 33b provided so as to be relatively movable in the Y-axis direction, an X-axis table 33c provided so as to be movable in the X-axis direction relative to the Y-axis table 33b, and the X-axis table 33c. The transfer head 33d is provided.

  3 and 4, the transfer head 33d is rotatably provided around the Z axis (within a horizontal plane) with respect to the X axis table 33c, and an index table 33e driven by a table drive motor 33m, and an index A plurality of component placement portions 33f provided in a circular arrangement on the table 33e are provided. The transfer head 33d moves in the horizontal plane by the movement of the Y-axis table 33b in the X-axis direction with respect to the X-axis guide 33a and the movement of the X-axis table 33c in the Y-axis direction with respect to the Y-axis table 33b. The electronic component 3 is continuously supplied to the mounting head 43 by rotating around the Z axis with respect to the table 33c.

  Each component placement portion 33f of the transfer head 33d is individually movable up and down with respect to the index table 33e, and is a component suction position where the electronic component 3 is sucked by a suction nozzle 44 described later. Each component placement portion 33f is positioned below the lower mold 32a when the electronic component 3 is punched from the tape TP by the component punching portion 32, and the electronic component 3 punched by the component punching portion 32 is placed thereon. (Refer to the component placement portion 33f indicated by a broken line in FIG. 3). Since the component moving unit 33 includes a plurality of component placement units 33f on the index table 33e, the index table 33e is rotated around the Z axis so that the component placement units 33f are sequentially placed below the lower mold 32a. By positioning, a plurality of electronic components 3 continuously punched from the tape TP can be received one after another.

  1 and 3, the component mounting portion 14 extends in the lateral direction (X-axis direction) of the base 11 by being spanned between the pair of left and right support posts 41 a erected on the base 11 and the pair of support posts 41 a. The portal frame 41 composed of the lateral members 41b, the X-axis moving body 42 provided so as to be movable in the X-axis direction along the lateral members 41b of the portal frame 41, and the Y-axis direction with respect to the X-axis moving body 42 A mounting head 43 provided movably, a suction nozzle 44 as a working means provided movably in the Z-axis direction with respect to the mounting head 43, and provided below a moving region in the X-axis direction of the mounting head 43. A backup unit 45 and a camera 46 and a rotating brush 47 provided in the backup unit 45 are provided.

  The X-axis moving body 42 moves in the X-axis direction with respect to the portal frame 41 (lateral member 41b) by the operation of an X-axis moving body moving motor (not shown), and the mounting head 43 is operated by the mounting head moving motor (not shown). Accordingly, the suction nozzle 44 moves in the Z-axis direction with respect to the mounting head 43 by the operation of a suction nozzle lifting / lowering motor (not shown) built in the mounting head 43. That is, the suction nozzle 44 can be moved in the vertical direction and the horizontal direction (in a horizontal plane) by the operations of the X-axis moving body moving motor, the mounting head moving motor, and the suction nozzle lifting motor.

  3 and 5, the backup unit 45 is movable in the X-axis direction along the X-axis member 45a and the X-axis member 45a provided between the panel positioning unit 12 and the component supply unit 13 so as to extend in the X-axis direction. And a backup stage 45c (see also FIG. 1) provided to project rearward from the upper portion of the slider 45b in the Y-axis direction.

  3 and 5, the camera 46 is supported in a state where the imaging field of view is directed upward by a camera support 46a attached to a lower portion of the slider 45b (below the backup stage 45c) provided in the backup portion 45. The backup stage 45c is provided with a through hole 45e (FIG. 5) extending in the vertical direction, and the camera 46 is provided on the terminal 2a of the panel substrate 2 positioned by the panel positioning portion 12 through the through hole 45e. The terminal side mark (not shown) and the component side mark (not shown) provided on the electronic component 3 sucked by the suction nozzle 44 can be imaged from below.

  3 and 5, the rotary brush 47 is provided so as to be rotatable about a horizontal axis (X axis) with respect to the rotary brush base 47a provided at the end of the backup stage 45c of the backup unit 45. It is rotationally driven by a brush drive motor 47m built in the base 47a.

  Positioning operation of the panel substrate 2 by the panel positioning unit 12 (movement operation of the X-axis table 21 constituting the panel positioning unit 12 in the X-axis direction with respect to the base 11, Y-axis table 22 in the Y-axis direction with respect to the X-axis table 21 Of the θ table 23 and the rotation operation of the θ table 23 about the Z-axis with respect to the Y-axis table 22) is performed by the controller 50 (FIG. 6) provided in the temporary crimping apparatus 1. This is done by performing the operation control of 6).

  The transport operation of the tape TP by the left and right tape transport units 31 constituting the component supply unit 13 is performed when the control device 50 controls the operation of a tape transport mechanism 52 (FIG. 6) including an actuator (not shown). In the punching operation of the electronic component 3 from the tape TP by the left and right component punching units 32 constituting the component supply unit 13, the control device 50 controls the operation of the punching unit drive mechanism 53 (FIG. 6) including an actuator (not shown). Is made by Further, the electronic component 3 is moved by the left and right component moving units 33 constituting the component supply unit 13 (the Y-axis table 33b is moved in the Y-axis direction with respect to the X-axis guide 33a, the Y-axis table 33b of the X-axis table 33c is moved). The movement of the index table 33e in the X-axis direction and the rotation of the index table 33e around the Z-axis with respect to the X-axis table 33c) are performed by the control unit 50 including the above-described actuator including the table drive motor 33m. This is done by performing the operation control of FIG.

  Movement operation of the mounting head 43 in the component mounting portion 14 (movement operation of the X-axis moving body 42 in the X-axis direction relative to the lateral member 41b of the portal frame 41 and movement of the mounting head 43 relative to the X-axis moving body 42 in the Y-axis direction) The movement of the suction nozzle 44 with respect to the mounting head 43 in the vertical direction is performed by the control device 50 including the above-mentioned X-axis moving body moving motor, mounting head moving motor, suction nozzle lifting motor and the like. This is done by controlling the operation of the mechanism 55 (FIG. 6).

  The electronic device 3 is adsorbed and released by the adsorbing nozzle 44 by the operation control of an adsorbing operation control mechanism 56 (FIG. 6) including an air supply source, a solenoid valve, and a vacuum ejector (not shown). This is done by supplying a vacuum pressure into the nozzle 44 or stopping the supply of the vacuum pressure into the suction nozzle 44.

  In FIG. 6, the imaging operation by the camera 46 constituting the component mounting unit 14 is performed by the control device 50, and the image data obtained by the imaging operation of the camera 46 is sent to the control device 50 and the image recognition unit 50a performs image recognition. Made. The rotating operation of the rotating brush 47 is performed by the control device 50 controlling the operation of the brush drive motor 47m described above.

  Next, an operation procedure for mounting the electronic component 3 on the panel substrate 2 by the control device 50 of the temporary pressure bonding apparatus 1 will be described. When the electronic component 3 is mounted on the terminal 2a of the panel substrate 2 placed on the panel support table 24 of the panel positioning unit 12, the control device 50 operates the component moving unit 33 and the backup unit 45. The component mounting portion 33f on which the electronic component 3 is mounted and the backup stage 45c are positioned in front of the terminal 2a on the panel substrate 2 on which the electronic component 3 is to be mounted. Then, after the suction nozzle 44 is moved directly above the component placement portion 33f, the suction nozzle 44 is moved down to attract the electronic component 3 on the component placement portion 33f (FIG. 7A).

  When the suction nozzle 44 attracts the electronic component 3, the control device 50 moves in the horizontal direction while drawing an arch-shaped movement trajectory after the suction nozzle 44 moves upward, and thereby the electronic component sucked by the suction nozzle 44. 3 is in contact with the upper surface of the rotating brush 47 (the rotating brush 47 is previously rotated) (FIG. 7B). Thus, “burrs” generated on the lower surface of the electronic component 3 when the electronic component 3 is punched by the component punching portion 32 are removed.

  When the suction nozzle 44 is moved along the arched movement locus as described above, the control device 50 gradually decreases the upward movement speed after the suction nozzle 44 starts to move upward from the suction position of the electronic component 3. The vertical movement profile approaching the height Hb (FIG. 7B) of the upper surface of the rotary brush 47 and the horizontal movement is started when the upward movement speed is sufficiently reduced. After reaching the height Hb of the upper surface, the suction nozzle 44 is controlled to move with a horizontal movement profile that maintains the height Hb (moves horizontally).

  When the removal of the “burrs” of the electronic component 3 by the rotating brush 47 is completed, the control device 50 moves the suction nozzle 44 so that the sucked electronic component 3 is positioned immediately above the camera 46. Then, the suction nozzle 44 is lowered, and a component side mark (not shown) provided on the electronic component 3 sucked by the suction nozzle 44 is passed through the through-hole 45e provided in the backup stage 45c. The image is picked up by 46, and the image recognition unit 50a recognizes the image (FIG. 8A).

  After the imaging of the component side mark and the image recognition by the camera 46 by the camera 46, the control device 50 moves the suction nozzle 44 directly above (FIG. 8B) and operates the panel positioning unit 12 to operate the panel substrate 2. Is advanced forward so that a portion of the lower surface of the panel substrate 2 directly below the terminal 2a to which the electronic component 3 is mounted is supported by the backup stage 45c. Then, a terminal side mark (not shown) provided on the terminal 2a to be mounted is imaged by the camera 46 through the through hole 45e provided in the backup stage 45c and the panel substrate 2, and the image recognition unit 50a. In FIG. 9, image recognition is performed (FIG. 9A).

  The control device 50 moves the panel positioning unit 12 and the suction nozzle 44 so that the component-side mark and the terminal-side mark are aligned vertically when the terminal-side mark is imaged and recognized. Then, the suction nozzle 44 is moved down so that the electronic component 3 is pressed against the backup stage 45c together with the panel substrate 2, and the electronic component 3 is mounted on the terminal 2a of the panel substrate 2 (FIG. 9B).

  When the mounting of the electronic component 3 to the terminal 2a of the panel substrate 2 is completed, the control device 50 operates the panel positioning unit 12 to move the panel substrate 2 backward, and operates the component moving unit 33 and the backup unit 45. Then, the component mounting portion 33f on which the electronic component 3 is mounted and the backup stage 45c are positioned in front of the terminal 2a on the panel substrate 2 on which the electronic component 3 is next mounted. Then, in order to suck the electronic component 3 to be mounted next by the suction nozzle 44, the component mounting on which the electronic component 3 to be mounted next is mounted from the position on the panel substrate 2 where the mounting of the electronic component 3 is completed. The position is moved to a position immediately above the placement portion 33f (FIG. 10A), and the suction nozzle 44 is moved downward to suck the electronic component 3 on the component placement portion 33f (FIG. 10B).

  The controller 50 repeatedly performs the suction of the electronic component 3 by the suction nozzle 44 and the mounting on the panel substrate 2 as described above, and mounts the electronic component 3 on all the terminals 2a on the long side of the panel substrate 2. Then, the θ table 23 is rotated around the Z axis to rotate the entire panel substrate 2 by 90 degrees, and this time, the electronic component 3 is mounted on the terminal 2 a on the short side of the panel substrate 2.

  When the electronic device 3 is mounted on the terminals 2a on the long side and the short side of the panel substrate 2 by the suction nozzle 44, the control device 50 attaches the panel substrate 2 to the downstream side of the temporary crimping device 1 by a panel carry-out device (not shown). It is carried out to an apparatus (this crimping apparatus not shown).

  By the way, as described above, in order to move the suction nozzle 44 from the mounting position of the electronic component 3 to the position directly above the component placement portion 33f for the suction of the electronic component 3 to be mounted next on the panel substrate 2, the electronic component When the suction nozzle 44 is linearly moved from the mounting position 3 to a position immediately above the component placement portion 33f, an interference (rotation) that interferes with the suction nozzle 44 in its path J (FIG. 10A). Since the brush 47) exists, the control device 50 sets a target height Hm that is higher than the maximum height of the interference (the height Hb of the upper surface of the rotating brush 47), and the suction nozzle 44 sets the target height Hm. In a state where the target height Hm is maintained, it passes above the interference object in the horizontal direction so as to reach a position directly above the component placement portion 33f.

  FIG. 11A shows the upper and lower positions of the suction nozzle 44 when the suction nozzle 44 is moved from the mounting position (first position P1) of the electronic component 3 to the position directly above the component placement portion 33f (second position P2). It is the graph which showed the movement profile of a direction and a horizontal direction with the upward displacement of the suction nozzle 44. FIG. As shown in this graph, when the controller 50 moves the suction nozzle 44 from the first position P1 to the second position P2, first, a reference height HK lower than the target height Hm (see FIG. 10 (a) and FIG. 11 (a)) are set (reference height setting step). Since this reference height HK is a reference height for starting the movement in the horizontal direction as will be described later, even if the suction nozzle 44 starts to move in the horizontal direction from there, the interference with the interference object is ensured. The height should be surely avoided. Here, the reference height HK is set as the height Hb of the upper surface of the rotating brush 47.

  When the control device 50 sets the reference height HK, the suction nozzle 44 starts to move upward from the first position P1 and then moves upward (overshoot) beyond the reference height HK without reducing the upward movement speed. ) And then the suction nozzle 44 moves down from the first position P1 and moves up and down from the first position P1. After starting, a horizontal movement profile is created that starts moving in the horizontal direction when the reference height HK is reached (movement profile creation step), and the created vertical movement profile and horizontal movement profile are created. The suction nozzle 44 is moved by (Suction nozzle moving step).

  FIG. 11B shows the vertical direction of the suction nozzle 44 when the control device 50 moves the suction nozzle 44 from the first position P1 to the second position P2 along the conventional arch-shaped movement locus. It is the graph which showed the movement profile of the horizontal direction with the upward displacement of the suction nozzle 44. FIG. In this case, the vertical movement profile is such that, after the suction nozzle 44 starts to move upward from the first P1, the reference height HK (on the upper surface of the rotating brush 47) that serves as a reference for starting the horizontal movement of the suction nozzle 44. Before exceeding the height Hb), the upward movement speed is reduced to reach the target height Hm, and the horizontal movement profile is the position where the suction nozzle 44 starts to move upward and reaches the reference height HK. After the movement in the horizontal direction is started and the suction nozzle 44 reaches the target height Hm, the target height Hm is maintained.

  As can be seen from a comparison between FIG. 11A and FIG. 11B, a movement method (first movement method) in which the suction nozzle 44 is moved along a movement locus overshooting the target height Hm as in the present embodiment. ), The suction nozzle 44 reaches the reference height HK, unlike the case of the movement method (second movement method) in which the suction nozzle 44 is moved along the arch-shaped movement trajectory so as not to exceed the target height Hm. Therefore, the start of the movement of the suction nozzle 44 in the horizontal direction can be advanced accordingly, and therefore the end of the movement to the final second position P2 can be accelerated (in FIG. 11). Time indicated ΔT).

  Thus, in the temporary pressure bonding apparatus 1 as the component mounting apparatus and the movement control method of the suction nozzle 44 (working means) in the temporary pressure bonding apparatus 1 in the present embodiment, the suction nozzle 44 is moved from the first position P1 to the second position. In moving to the position P2, when the suction nozzle 44 is linearly moved from the first position P1 to the second position P2, there is an interference (rotating brush 47) that interferes with the suction nozzle 44, so the suction nozzle 44 is moved. When the target height Hm set to a height higher than the maximum height of the interferent is passed over the interferer by horizontal movement, a reference height HK lower than the target height Hm is set, and the suction nozzle 44 is After starting the upward movement from the first position P1, the speed is increased after exceeding the reference height HK without decreasing the upward movement speed, and then the suction nozzle 44 once decreases after the target height Hm is exceeded. And then The vertical movement profile that maintains the altitude Hm and the horizontal movement that starts moving in the horizontal direction when the suction nozzle 44 reaches the reference height HK after starting the upward movement from the first position P1. The suction nozzle 44 is moved with the created movement profile by using the created profile, and the movement in the horizontal direction is started without waiting for the deceleration of the upward movement speed of the suction nozzle 44. It is possible to shorten the time required to move the suction nozzle 44 and improve the tact time compared with the case where the suction nozzle 44 is moved along a conventional arch-shaped movement locus.

  Since the suction nozzle 44 moves down after exceeding the target height Hm and then maintains the target height Hm, the suction nozzle 44 is moved to the interference object before the suction nozzle 44 finally reaches the target height Hm. However, in this case, since the suction nozzle 44 is at a position higher than the target height Hm, the suction nozzle 44 does not interfere with the interference object. There is no particular problem.

  Further, in combination with the present invention, when the suction nozzle 44 moves downward after overshoot and reaches the target height Hm, the horizontal movement of the suction nozzle 44 is completed. If it is moved, the tact can be further improved.

  In the above-described embodiment, the reference height HK that is a reference for starting the movement of the suction nozzle 44 in the horizontal direction is set lower than the target height Hm. However, depending on the situation, the target height It is also possible to set the height Hm itself or a height higher than the target height Hm.

  Further, in the above-described embodiment, when the suction nozzle 44 is moved so that the suction nozzle 44 that sucks the electronic component 3 is brought into contact with the upper surface of the rotary brush 47 by horizontal movement, the suction nozzle 44 is moved in an arch shape. However, the height Hb of the upper surface of the rotating brush 47 is set as the target height Hm, and the reference height HK is set to a height lower than the height Hb of the upper surface of the rotating brush 47. The electronic nozzle 3 may be moved in contact with the upper surface of the rotating brush 47 by moving the suction nozzle 44 along a movement locus allowing overshoot.

  Provided are a component mounting apparatus and a method for controlling movement of a working means in a component mounting apparatus, which can improve the tact time by shortening the time required to move the working means.

1 Temporary crimping equipment (component mounting equipment)
44 Suction nozzle (working means)
47 Rotating brush (interference)
50 Control device (control means)
P1 1st position P2 2nd position Hb Height of upper surface of rotating brush (maximum height of interference)
Hm Target height HK Reference height

Claims (2)

A component mounting apparatus comprising: a working unit; and a control unit that moves the working unit in a vertical direction and a horizontal direction to cause the working unit to perform a component mounting operation.
The control means moves the working means from the first position to the second position, and when the working means is linearly moved from the first position to the second position, there is an interference that interferes with the working means. Therefore, when passing the target height that is higher than the maximum height of the interfering object by the horizontal movement above the interfering object, set the reference height lower than the target height, After the means starts to move upward from the first position, it decelerates after it has moved above the reference height without reducing the speed of upward movement, and after the working means has once exceeded the target height, The movement profile in the vertical direction that moves and then maintains the target height and the working means start moving upward from the first position, and then start moving in the horizontal direction when the reference height is reached. Move working means with horizontal movement profile Component mounting apparatus for causing. A component mounting apparatus that moves a working unit in a vertical direction and a horizontal direction to perform a component mounting operation by the working unit moves the working unit from the first position to the second position. When the working means is moved to the position 2 in a straight line, there is an interfering object that interferes with the working means. Therefore, the target height set to a height higher than the maximum height of the interfering object is moved horizontally by moving the working means horizontally. A method for controlling the movement of the working means in the component mounting apparatus when passing above,
Setting a reference height lower than the target height;
After the working means starts to move up from the first position and then decelerates after moving up beyond the reference height without reducing the speed of uplift, and after the working means once exceeds the target height The vertical movement profile that maintains the target height after moving down and the working means starts moving upward from the first position and then starts moving in the horizontal direction when reaching the reference height. Creating a horizontal movement profile to
A method for controlling movement of a working means in a component mounting apparatus, comprising: moving the working means in accordance with the created vertical movement profile and horizontal movement profile.

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