JP2012186505A - Component supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component supply device capable of suppressing mainly increase in size of a drive source and the whole device, and preventing occurrence of unnecessary vibration when components are supplied.SOLUTION: A first servomotor 32 and a second servomotor 36 which function as drive sources are fixed to a fixed member 22 which does not operate, so weight of operating members such as a pickup nozzle 12 and a rotary support member 20 can be reduced. Consequently, power needed to move the operating members such as the pickup nozzle 12 and the rotary support member 20 may be small, so the servo motors 32 and 36 which are small can be employed.

Description

  The present invention relates to a component supply apparatus that supplies electronic components to a mounting head.

  The conventional component supply apparatus is provided with a suction head in the vicinity of the outer peripheral edge, and moves an arbitrary chip component from a chip component assembly carried under the suction head by moving a rotating shaft positioned substantially horizontally in the vertical direction. Pickup reversing unit provided with a rotating face plate for picking up and rotating chip parts by intermittent rotation, a pickup moving part for moving the rotation axis of the rotating face plate in the vertical direction, and provided above the pickup position and reversed 2. Description of the Related Art There is known a conveyance unit that conveys a chip component to the next process and an inspection unit that inspects and determines the quality of the chip component (see Patent Document 1 below).

  According to this component supply apparatus, the chip component is picked up by the suction head, and the rotation axis of the rotating face plate moves in the vertical direction (upward). Then, the rotating shaft of the rotating face plate is rotated 180 degrees, and the chip component is turned upside down. Further, the suction nozzle of the transport unit is lowered, and the chip component that is turned upside down is sucked by the suction nozzle. Thereafter, the rotation axis of the rotating face plate moves in the vertical direction (downward), and the next chip component is picked up by the suction head. These steps are repeated, and the chip component is picked up and conveyed to the downstream step.

JP 2006-108193 A

  By the way, in the series of steps described above, the rotation of the rotating shaft of the rotating face plate is realized by using the rotating shaft as a driving shaft of a motor (rotational drive motor). That is, the pickup reversing unit includes a rotation drive motor that drives the rotation shaft, and the rotation drive motor is moved by the pickup moving unit together with the suction head. For this reason, the weight of the object moved by the pickup moving unit, that is, the pickup reversing unit is increased. Further, as the weight of the pickup reversing unit increases, the power on the pickup moving unit side also increases, so that the motor (vertical drive motor) serving as the power source for the vertical movement of the rotary shaft increases. As a result, there arises a problem that the entire component supply device is increased in size, and another problem that unnecessary vibration is generated due to the use of a large vertical drive motor occurs. In particular, the occurrence of unnecessary vibrations has a great influence on the mounting accuracy of chip components, and therefore must be thoroughly eliminated.

  In addition, since the vertical movement of the pickup moving unit is realized by a configuration in which the rotating shaft and the moving lever rotate around the support shaft, the suction head moves so as to draw a predetermined arc when moving up and down. become. For this reason, when the suction head is moved downward in an attempt to suck the chip component onto the suction head, the position is shifted in the horizontal direction, resulting in a problem that the position accuracy of the suction head with respect to the chip component is lowered. Similarly, when the suction head is moved upward, the positional accuracy of the transport unit with respect to the suction nozzle decreases.

  In particular, if the weight of the pickup reversing unit increases, the inertial force of the big-up reversing unit increases, so even if a large vertical drive motor is used, it is difficult to move the pickup reversing unit up and down at high speed and with high accuracy. Become. As described above, when the chip component is picked up by the suction head and when the chip component is sucked from the suction head to the suction nozzle, it becomes difficult to control the position, and the mounting accuracy of the chip component is lowered in the downstream mounting process. Problems arise. In particular, the smaller the chip component, the more difficult it is to control the position of the chip component, and the mounting accuracy of the chip component is reduced. In addition, when the position accuracy of the conveyance unit with respect to the suction nozzle is reduced, a large load is applied from the suction nozzle to the chip component when the chip component is picked up by the suction nozzle, so that the chip component may be cracked. Further, if the chip component is made of a material having a low material strength, or if the chip component is thin, the strength of the chip component itself is lowered and the chip component is easily damaged.

  In view of the above circumstances, an object of the present invention is to provide a component supply device capable of suppressing the increase in size of the drive source and the entire device and preventing occurrence of unnecessary vibration when supplying components. To do.

  In addition, the present invention provides a component supply apparatus that prevents a component from being damaged when picking up the component or mounting the component, and can increase the positional accuracy (mounting accuracy) of the component. With the goal.

  The present invention includes a first component suction portion that sucks a component, a rotation support portion that rotatably supports the first component suction portion, and moves the first component suction portion and the rotation support portion along a linear direction. A linear drive unit that rotates, a rotation drive unit that rotates the first component suction unit around an axis of the rotation support unit to change the posture of the component that is sucked by the first component suction unit, and the rotation support unit A fixed portion that supports the movable portion along the linear direction, a first drive source that is provided in the fixed portion and that drives the linear drive portion, and drives the rotary drive portion that is provided in the fixed portion. A component supply device having a second drive source and a second component adsorption unit that adsorbs the component whose posture has been changed by the rotation drive unit, wherein a plurality of the first component adsorption units are provided, One or a plurality of the second component suction portions are provided. And a component push-out portion that is provided so as to be movable along the linear direction and pushes out the component sucked by the first component suction portion to the first component suction portion side is provided movably along the linear direction. A linear movement of the component extrusion unit, a linear movement of the first component adsorption unit and a linear movement of the second component adsorption unit, and a linear movement of the component extrusion unit, The linear movement of the one component suction portion and the linear movement of the second component suction portion are synchronized by the control portion, and the component is pushed out by the component push-out portion and sucked by one of the first component suction portions. The first suction step and the second suction step in which the component sucked by the other first component suction portion is sucked by the second component suction portion are performed simultaneously.

  According to this invention, the linear drive unit is driven by the first drive source, and the first component suction unit and the rotation support unit move downward. Then, the component is adsorbed to the first component adsorption unit. After the component is adsorbed to the first component adsorption unit, the linear drive unit is driven by the first drive source, and the first component adsorption unit and the rotation support unit move upward. Thereafter, the rotation drive unit is driven by the second drive source, and the first component suction unit is rotated about a predetermined axis by the rotation support unit. Thereby, the posture of the component sucked by the first component suction portion is changed. Thereafter, the component whose posture has been changed is sucked by the second component sucking unit. In addition, the component adsorbed by the second component adsorbing portion is mounted on a circuit board or the like in a downstream mounting process.

  Here, since the first drive source and the second drive source are fixed to the fixed portion, the weight of the first component suction portion and the rotation support portion can be reduced. As a result, the power required to move the first component suction portion is small, and each drive source can be miniaturized. Moreover, the whole component supply apparatus can be reduced in size by reducing each drive source in size. In addition, by reducing the size of each drive source, it is possible to reduce the occurrence of unnecessary vibration during driving, so that the mounting accuracy of the component when the component is mounted can be improved.

  Further, by reducing the weight of the first component suction portion and the rotation support portion, the inertial force generated in the first component suction portion and the rotation support portion is reduced. Thereby, a 1st components adsorption | suction part and a rotation support part can be moved at high speed and with high precision by a small drive source. As a result, the position control of the first component suction portion and the rotation support portion is facilitated, and the component mounting accuracy can be increased.

  Further, by increasing the positional accuracy of the first component suction portion and the rotation support portion, the load acting on the component when sucking the component to the first component suction portion is reduced. Thereby, it can prevent that a crack etc. generate | occur | produce in components. In particular, even if the component is made of a material having a low material strength, or the component is thin and the strength of the component itself is low, the component can be prevented from being damaged.

  Further, the linear movement of the component pushing portion, the linear movement of the first component sucking portion, and the linear movement of the second component sucking portion are synchronized by the control portion, and the component sucked by the first component sucking portion is It is pushed out to the one-part suction part side. The component pushed out by the component extruding unit toward the first component adsorption unit is adsorbed by the first component adsorption unit, and at the same time, the component adsorbed by the other first component adsorption unit is adsorbed by the second component adsorption unit. Is done.

  In this way, the linear movement of the component extrusion unit, the linear movement of the first component adsorption unit, and the linear movement of the second component adsorption unit are synchronized by the control unit, and the component is pushed out by the component extrusion unit and one of the first component adsorption is performed. The first suction step to be sucked by the part and the second suction step for sucking the component sucked by the other first component suction part to the second component suction part are performed simultaneously. Thereby, compared with the case where a 1st adsorption | suction process and a 2nd adsorption | suction process are separately performed at a different timing, the time until a 2nd component adsorption | suction part is made to adsorb | suck a component can be shortened. As a result, the supply capability of the components is improved, and the components can be efficiently mounted in the downstream mounting process. Further, by shortening the time until the component is attracted to the second component attracting unit, this shortened time can be used as the time for executing another process. In particular, when a component is picked up by the first component suction portion, the load applied to the component when the component is picked up by the first component suction portion is reduced by reducing the moving speed of the first component suction portion relative to the component. be able to. As a result, it is possible to prevent the component from being damaged and improve the quality of the component.

  The linear drive unit is a linear drive mechanism that converts the drive force of the first drive source into a linear motion, and the drive force from the first drive source is converted into a linear motion by the linear drive mechanism and the linear drive mechanism. It is preferable that the first component suction portion and the rotation support portion move in a linear direction.

  According to this configuration, the driving force from the first drive source is converted into a linear motion by the linear drive mechanism, and the first component suction unit and the rotation support unit move in the linear direction. For this reason, the 1st component adsorption | suction part can contact components from the orthogonal | vertical direction with respect to the adsorption surface of components. Thereby, when the 1st component adsorption | suction part contacts components, it can prevent that the 1st component adsorption | suction part shifts in a horizontal direction with respect to components. Further, by preventing the displacement of the first component suction portion with respect to the component, it is possible to prevent the displacement of the second component suction portion with respect to the component. As a result, the component mounting accuracy can be improved.

  A component supply unit that supports the component sucked by the first component suction unit; and a component position recognition unit that recognizes a position of the component supported by the component supply unit. It is preferable that the position of the component supported by the component supply unit is corrected based on the result recognized by the recognition unit.

  According to this configuration, the position of the component supported by the component supply unit is recognized by the component position recognition unit, and the position of the component supported by the component supply unit is corrected based on the recognition result by the component position recognition unit. As described above, by controlling the position so that the component is positioned at the optimum site in the stage before being sucked by the first component suction portion, the position accuracy of the component with respect to the first component suction portion can be improved. The components can be adsorbed simply by moving the first component adsorbing portion in the linear direction. In addition, by holding the second component suction unit at the position where the first component suction unit has been rotated 180 degrees, the second component suction unit is simply moved in the linear direction so that the first component suction unit is attracted to the first component suction unit. The part thus made can be adsorbed to the second part adsorbing part. Thereby, the movement distance of the 1st component adsorption | suction part and the 2nd component adsorption | suction part when adsorb | sucking components by the 1st component adsorption | suction part and the 2nd component adsorption | suction part can be made into the shortest distance. As a result, the time required for the component adsorption process can be shortened, and the component adsorption capability and mounting capability can be improved.

  Further, it is preferable that the component is adsorbed by the second component adsorbing unit at a position where the first component adsorbing unit is rotated 90 degrees or 270 degrees from the position adsorbed by the first component adsorbing unit.

  According to this configuration, the component is adsorbed by the second component adsorbing unit at a position where the first component adsorbing unit is rotated 90 degrees or 270 degrees from the position adsorbed by the first component adsorbing unit. As a result, the component can be adsorbed to the second component adsorbing unit in a state where the orientation of the component is changed by 90 degrees or 270 degrees. In this way, the posture of the component can be freely changed by appropriately rotating the first component suction portion. As a result, the posture of the component can always be changed to a posture that is optimal for the suction processing of the second component suction portion, so that another mechanism and process are not required, and the number of parts and the steps can be reduced.

  Further, it is preferable that a component support portion is provided at a position where the first component suction portion is rotated 90 degrees or 270 degrees from a position where the component is sucked to the first component suction portion.

  According to this configuration, since the component support portion is provided at a position where the first component suction portion is rotated 90 degrees or 270 degrees from the position where the component is attracted to the first component suction portion, the component is second When the component is picked up by the component suction portion, it is possible to prevent the component from being displaced with respect to the second component suction portion. Thereby, the adsorption | suction accuracy of the components by the 2nd component adsorption | suction part and the mounting accuracy of components can be improved.

  Furthermore, it is preferable that the component support portion is provided at a position retracted from the rotation locus of the first component suction portion.

  According to this configuration, since the component support portion is provided at a fixed position that is retracted from the rotation locus of the first component suction portion, the component support portion interferes when the first component suction portion rotates. There is nothing. This eliminates the step of releasing one of the first component suction portion and the component support portion so that the first component suction portion and the component support portion do not contact when the first component suction portion rotates. As a result, the work time associated with the increase in the number of processes can be saved, so that the component supply capability can be improved.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a drive source and the whole apparatus enlarge, and can prevent that an unnecessary vibration generate | occur | produces when supplying components.

  In addition, when picking up a component by the component suction unit or mounting the component, the component is prevented from coming into contact with the component suction unit and being damaged, and the positional accuracy of the component suction unit with respect to the component (component mounting accuracy) ) Can be increased.

It is a block diagram of the components supply apparatus which concerns on 1st Embodiment of this invention. It is the block diagram which showed a part of control system of the components supply apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing when a component is mounted in a circuit board by the 2nd component adsorption | suction part which comprises the component supply apparatus which concerns on 1st Embodiment of this invention. The description which showed the state of the component when the component adsorbed by the 1st component adsorption | suction part of the component supply apparatus which concerns on 1st Embodiment of this invention rotates 90 degree clockwise, and is adsorb | sucked by the 2nd component adsorption | suction part. FIG. (A) is the description which showed the state of the stage before the component adsorption | suction process by the 1st component adsorption | suction part of the component supply apparatus which concerns on 2nd Embodiment of this invention, and the component adsorption | suction process by a 2nd component adsorption | suction part are performed. FIG. 7B is a diagram illustrating a state in which the component suction process by the first component suction unit and the component suction process by the second component suction unit of the component supply apparatus according to the second embodiment of the present invention are performed simultaneously. FIG. It is the block diagram which showed a part of control system of the components supply apparatus which concerns on 2nd Embodiment of this invention. It is a block diagram of the components supply apparatus which concerns on 3rd Embodiment of this invention. It is explanatory drawing which showed the state when the components adsorbed by the 1st component adsorption | suction part of the component supply apparatus which concerns on 3rd Embodiment of this invention are adsorbed by the 2nd component adsorption | suction part. It is a block diagram of the modification of the components supply apparatus of this invention. It is explanatory drawing which shows a part of adsorption | suction process of the electronic component to the mounting head which comprises the modification of the components supply apparatus of this invention.

  Next, the component supply apparatus according to the first embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the component supply apparatus 10 includes four pickup nozzles (first component suction units) 12. Each pickup nozzle 12 has a component suction surface 14 on which an electronic component (component) D is sucked. Each pickup nozzle 12 is attached to the disk portion 18 of the rotating shaft 16 so that each component suction surface 14 faces radially outward. Further, the pickup nozzles 12 are arranged so as to be equidistant from each other. For this reason, the opening angle between the adjacent pickup nozzles 12 is 90 degrees. The rotary shaft 16 is rotatably supported by a rotation support member (rotation support portion) 20 via a bearing or the like. Thereby, each pickup nozzle 12 rotates around the axis of the rotary shaft 16 by rotating the rotary shaft 16. Further, on the outer peripheral surface of the rotating shaft 16, a rotating shaft pulley (not shown) on which a later-described timing belt (rotation driving unit) 24 is hung is provided.

  In addition, a suction hole is formed in the component suction surface 14 of the pickup nozzle 12 so that the electronic component D can be suctioned to the component suction surface 14 by sucking air with a pump (not shown). In addition, the drive of a pump is controlled by the below-mentioned controller 40 (a control part, refer FIG. 2).

  The rotation support member 20 is attached to a fixed member (fixed portion) 22 so as to be movable in the vertical direction (the arrow Z direction in FIG. 1). That is, a rail portion 26 extending in the vertical direction is formed on the fixing member 22, and a guide portion 28 that engages with the rail portion 26 and moves along the extending direction of the rail portion 26 is formed on the rotation support member 20. Is formed. The rotation support member 20 can move in the vertical direction as the guide portion 28 moves along the rail portion 26. Since the fixing member 22 is fixed to an arbitrary part of the component supply device 10, the rotation support member 20 moves (relatively moves) with respect to the fixing member 22. A rack portion (linear drive portion, linear drive mechanism) 30 that meshes with a pinion gear (linear drive portion, linear drive mechanism) 34 described later is formed on the end face of the guide portion 28 of the rotation support member 20.

  A first servo motor (first drive source) 32 is attached to the fixed member 22. A pinion gear 34 is attached to the rotation shaft of the first servo motor 32. The pinion gear 34 meshes with the rack portion 30, and the rotational driving force of the first servo motor 32 is transmitted to the rotation support member 20 through the pinion gear 34. Thereby, when the 1st servomotor 32 rotates, the rotation support member 20 becomes movable along an up-down direction. Thus, the component supply apparatus includes a linear drive mechanism that converts the rotational driving force of the first servomotor 32 into a linear motion. The first servo motor 32 functions as a first drive source for moving the rotation support member 20 up and down.

  Further, a second servo motor (second drive source) 36 is attached to the fixing member 22. A fixed pulley (rotary drive unit) 38 is attached to the rotation shaft of the second servomotor 36. The timing belt 24 is stretched around the outer peripheral surfaces of the fixed pulley 38 and the rotary shaft pulley. As a result, the rotational driving force of the second servomotor 36 is transmitted to the rotary shaft 16 via the timing belt 24. For this reason, when the 2nd servomotor 36 rotates, the rotating shaft 16 and each pick-up nozzle 12 rotate. The second servo motor 36 functions as a second drive source for rotating the rotary shaft 16 and each pickup nozzle 12.

  Here, since the first servo motor 32 and the second servo motor 36 are fixed by the fixing member 22, the first servo motor 32 and the second servo motor 36 do not move with the vertical movement of the rotation support member 20 and the rotational movement of each pickup nozzle 12. In other words, since the first servo motor 32 and the second servo motor 36 are not included in the mechanism that moves together with each pickup nozzle 12 and the rotation support member 20, the mechanism that moves together with each pickup nozzle 12 and rotation support member 20 is reduced in weight. can do.

  As shown in FIG. 2, the drive control of the first servo motor 32 and the second servo motor 36 is executed by the controller 40.

  As shown in FIG. 1, the component supply apparatus 10 includes a single mounting head (second component suction unit) 42. The mounting head 42 sucks the electronic component D sucked by each pickup nozzle 12 and mounts the electronic component D on the circuit board H (see FIG. 3). The mounting head 42 includes a cylindrical suction nozzle portion 44 and a head main body portion 46 that is accommodated so that the suction nozzle portion 44 can be expanded and contracted. The mounting head 42 is configured to be movable in the vertical direction and the horizontal direction by the head driving mechanism 48. Here, the head drive mechanism 48 is composed of an actuator capable of linear drive along the vertical and horizontal directions by a servo motor and a ball screw. The head drive mechanism 48 is driven and controlled by the controller 40, and the movement of the mounting head 42 is realized by the head drive mechanism 48 that is driven and controlled by the controller 40.

  Further, the mounting head 42 is formed with a component suction surface 50 on which the electronic component D is sucked, and the component suction surface 50 of the mounting head 42 is formed with a suction hole. Thus, the electronic component D can be attracted to the component attracting surface 50. The drive of the pump is controlled by the controller 40.

  Further, the mounting head 42 may have a configuration in which the suction nozzle portion 44 is fixed to the head main body portion 46 as it is without expanding and contracting. In this case, the vertical movement of the mounting head 42 is realized by the suction nozzle portion 44 moving in the vertical direction together with the head main body portion 46. Further, as the structure of the mounting head 42, a plurality of arrangements may be arranged on a straight line or on a circumference (rotary) instead of a single one. As shown in FIG. 9, the head drive mechanism 48 in the case of the mounting heads 42 arranged in a series (four in FIG. 9) on the circumference (rotary) of the head main body 46 includes a servo motor and a ball screw. It is composed of an actuator capable of curve driving along the vertical and horizontal directions.

  A prism (component position recognition unit) 52 is disposed in the vicinity of the rotation center of the disk unit 18 and above an XY stage (component supply unit) 56 described later. A camera (part position recognition unit) 54 that functions as an image processing device is disposed at a position in the horizontal direction of the prism 52. The prism 52 and the camera 54 are provided separately from the pickup nozzles 12 and the rotating shaft 16. The position and orientation of the electronic component D are recognized by the camera 54 through the prism 52. The prism 52 and the camera 54 are provided at positions that do not interfere with the rotation operations of the pickup nozzles 12 and the rotary shaft 16 even when the rotary shaft 16 rotates. Further, the position and orientation of the component recognized by the camera 54 are transmitted to the controller 40 as position data of the electronic component D.

  Further, the component supply apparatus 10 includes an XY stage 56 on which a plurality of electronic components D are placed. The XY stage 56 is configured to be movable in the X direction (see FIG. 1) and the Y direction (see FIG. 1) by a stage drive mechanism 58 composed of a servo motor and a ball screw. A component tray is placed on the upper surface of the XY stage 56 in addition to an electronic component such as a semiconductor wafer. When a component tray is placed on the XY stage 56, it can be fixed by a clamp. The drive control of the stage drive mechanism 58 is executed by the controller 40.

  Next, the operation and effect of the component supply device 10 of the first embodiment will be described.

  As shown in FIG. 1, the camera 54 recognizes the position and orientation of the electronic component D on the XY stage 56, and the position data is transmitted from the camera 54 to the controller 40. When the position data is received by the controller 40, the controller 40 moves the XY stage 56 so that the electronic component D is positioned directly below the pickup nozzle 12. In this way, the electronic component D on the XY stage 56 is adjusted so as to be in an optimal position for suction by the pickup nozzle 12. The position and posture of the electronic component D described above are executed so that the electronic component D is recognized from between the adjacent pickup nozzles 12.

  Next, if the electronic component D is positioned directly below the pickup nozzle 12, the component suction surface 14 of the pickup nozzle 12 positioned directly above the electronic component D is rotated so as to be parallel to the upper surface of the electronic component D. Position control of the shaft 16 is executed. Specifically, the position control of the rotating shaft 16 is executed by driving the second servo motor 36 to rotate the stationary pulley 38 and the timing belt 24 and transmitting this rotational force to the rotating shaft pulley. The

  Next, when the position control of the rotating shaft 16 is executed and the component suction surface 14 of the pickup nozzle 12 positioned directly above the electronic component D becomes parallel to the upper surface of the electronic component D, the first servo motor 32 is operated. Are driven by being controlled by the controller 40. When the first servo motor 32 is driven, the pinion gear 34 rotates and the rotational driving force of the first servo motor 32 is transmitted to the rack portion 30. As a result, the pickup nozzle 12 moves downward together with the rotation support member 20. At this time, the pickup nozzle 12 positioned immediately above the electronic component D moves downward in a state where the component suction surface 14 is parallel to the upper surface of the electronic component D.

  Next, when the electronic component D comes into contact with the component suction surface 14 of the pickup nozzle 12, the electronic component D is sucked into the component suction surface 14 by the air suction force (vacuum suction) and held by the pickup nozzle 12. Then, the second servo motor 36 is driven by the controller 40 and the fixed pulley 38 rotates. When the stationary pulley 38 rotates, the rotating shaft 16 rotates via the timing belt 24, and the electronic components D are sequentially sucked by the above operation on the component suction surface 14 of the pickup nozzle 12 where the components are not sucked. In this way, the electronic component D is sucked to the component suction surfaces 14 of all the pickup nozzles 12.

  Next, when the electronic component D is attracted to the component attracting surfaces 14 of all the pickup nozzles 12, the first servo motor 32 rotates in the reverse direction, and the rotation support member 20 moves upward, Return to height.

  Next, the rotary shaft 16 and the disk portion 18 rotate so that the pickup nozzle 12 and the mounting head 42 are positioned on the same axis. In other words, the rotation shaft 16 is rotationally controlled by the second servomotor 36 so that the lower surface of the electronic component D sucked by the pickup nozzle 12 and the component suction surface 50 of the mounting head 42 are parallel. As the pickup nozzle 12 and the rotation shaft 16 rotate, the posture of the electronic component D attracted to the pickup nozzle 12 is sequentially changed.

  Next, in a state where the lower surface of the electronic component D sucked by the pickup nozzle 12 and the component suction surface 50 of the mounting head 42 are parallel (the electronic component D is reversed), the rotation support member 20 is the first servo motor. The suction nozzle portion 44 moves downward with respect to the head main body portion 46 while moving upward by driving 32. If the suction nozzle unit 44 does not expand or contract with respect to the head main body 46, the suction nozzle unit 44 moves downward together with the head main body 46.

  Here, as shown in FIG. 4, the pickup nozzle 12 is rotated counterclockwise (in the direction of arrow S in FIG. 4) 90 degrees clockwise (in the direction of arrow S in FIG. 4) from the position where the pickup nozzle 12 attracts the electronic component D. You may comprise so that the electronic component D may be adsorb | sucked by the adsorption | suction nozzle part 44 in the state rotated by 270 degree | times to the opposite direction. According to this configuration, the side surface of the electronic component D can be attracted to the suction nozzle portion 44. As described above, the position of the electronic component D can be freely changed, and the suction portion of the electronic component D can be changed depending on the application of the electronic component D sucked by the suction nozzle portion 44.

  The lower surface of the electronic component D sucked by the pickup nozzle 12 and the component suction surface 50 of the suction nozzle portion 44 come into contact with each other, and the electronic component D is brought into contact with the component suction surface 50 of the suction nozzle portion 44 by an air suction force (vacuum suction force). And is held by the mounting head 42. Then, the suction nozzle portion 44 moves upward with respect to the head main body portion 46. If the suction nozzle unit 44 does not expand or contract with respect to the head main body 46, the suction nozzle unit 44 moves upward together with the head main body 46.

  Next, as shown in FIG. 3, the mounting head 42 is moved by the head driving mechanism 48, and the electronic component D is mounted on the upper surface of the circuit board H or the like.

  As described above, according to the component supply apparatus 10 of the first embodiment, since the first servo motor 32 and the second servo motor 36 are fixed to the fixed member 22, the weights of the pickup nozzle 12 and the rotation support member 20. Can be reduced in weight. As a result, the power required to move the pickup nozzle 12 and the rotation support member 20 is small, and the servo motors 32 and 36 are small in size and small in output. In addition, by reducing the size of each servo motor 32, 36, the entire component supply apparatus 10 can be reduced in size. Further, by reducing the size of each servo motor 32, 36, it is possible to reduce the occurrence of unnecessary vibration during driving, so that the mounting accuracy of the electronic component D when the electronic component D is mounted can be improved. .

  Further, by reducing the weight of the pickup nozzle 12 and the rotation support member 20, inertia force generated in the pickup nozzle 12 and the rotation support member 20 is reduced. Accordingly, the pickup nozzle 12 and the rotation support member 20 can be moved at high speed and with high accuracy by a small servo motor. As a result, the position control of the pickup nozzle 12 and the rotation support member 20 can be executed easily and accurately, and the mounting accuracy of the electronic component D can be increased.

  Further, by increasing the positional accuracy of the pickup nozzle 12 and the rotation support member 20, the load (impact force) acting on the electronic component D when the electronic component D is attracted to the pickup nozzle 12 is reduced. Thereby, it is possible to prevent the electronic component D from being cracked. In particular, the electronic component D can be prevented from being damaged even when the electronic component D is made of a material having a low material strength or the component is thin and the strength of the electronic component D itself is low.

  Here, when the electronic component D is attracted by the pickup nozzle 12, the rotational driving force of the first servo motor 32 is transmitted to the rotation support member 20 via the pinion gear 34 and the rack portion 30. When the rotational driving force of the first servo motor 32 is transmitted to the rotation support member, the pickup nozzle 12 and the rotation support member 20 move in the vertical direction. Thus, the rotational driving force of the first servo motor 32 is converted into a linear motion by the linear driving mechanism, and the pickup nozzle 12 and the rotation support member 20 move in the vertical direction. For this reason, the pickup nozzle 12 comes into contact with the electronic component D from the direction perpendicular to the upper surface of the electronic component D. Thereby, it is possible to prevent the pickup nozzle 12 from being displaced in the horizontal direction with respect to the electronic component D when the pickup nozzle 12 contacts the electronic component D. Further, by preventing the displacement of the pickup nozzle 12 with respect to the electronic component D, it is possible to prevent the displacement of the suction nozzle portion 44 of the mounting head 42 with respect to the electronic component D. As a result, the mounting accuracy of the electronic component D can be increased in the downstream mounting process.

  Further, the position of the electronic component D supported by the XY table 56 is recognized by the prism 52 and the camera 54, and the position of the electronic component D supported by the XY table 56 is determined as the optimum position for the pickup work based on the recognition result. It is corrected so that As described above, the position accuracy of the electronic component D with respect to the pickup nozzle 12 can be improved by controlling the position so that the electronic component D is positioned at the optimum position before being picked up by the pickup nozzle 12. The electronic component D can be adsorbed only by moving the pickup nozzle 12 and the rotation support member 20 downward. Further, by holding the suction nozzle portion 44 of the mounting head 42 at a position where the pickup nozzle 12 is rotated 180 degrees (90 degrees or 270 degrees), the suction nozzle portion 44 of the mounting head 42 is moved in the vertical direction. The electronic component D sucked by the pickup nozzle 12 can be sucked by the suction nozzle portion 44 only by moving. Thereby, the movement distance of the pickup nozzle 12 and the suction nozzle portion 44 when the electronic component D is sucked by the pickup nozzle 12 and the suction nozzle portion 44 can be made the shortest distance. As a result, the time required for the electronic component D suction process can be shortened, and the suction capability and mounting capability of the electronic component D can be improved.

Next, a component supply apparatus according to a second embodiment of the present invention will be described.
In addition, about the structure which overlaps with the structure of the component supply apparatus which concerns on 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted suitably.

  As shown in FIGS. 5 and 6, the component supply apparatus of the second embodiment is provided with a push-up pin (component push-up portion) 60 that pushes up the electronic component D placed on a dicing sheet (not shown). Yes. This push-up pin 60 is configured to be movable in the vertical direction by a pin drive mechanism 62. The pin driving mechanism 62 is driven and controlled by the controller 40. Specifically, the pin drive mechanism 62 is capable of moving up and down by a servo motor, a cam, and the like, and includes a suction pod portion (not shown) for adsorbing and fixing a dicing sheet.

  Here, the controller 40 includes a pickup adsorption process (first adsorption step) in which the electronic component D is pushed up by the push-up pin 60 and is adsorbed by the pickup nozzle 12, and the electronic component D that is adsorbed by the other pickup nozzle 12. The up-and-down movement of the push-up pin 60 and the up-and-down movement of the pickup nozzle 12 (rotation support member 20) are performed so that the transfer suction process (second suction process) sucked by the suction nozzle portion 44 of the mounting head 42 is performed simultaneously. The vertical movement of the suction nozzle portion 44 (mounting head 42) is controlled in synchronization. Specifically, the operation files of the push-up pin 60, the pickup nozzle 12 (rotation support member 20), and the suction nozzle unit 44 (mounting head 42) are calculated by the controller 40 so that the relative operation profiles are optimized. To be controlled. The driving method of the push-up pin 42, the pickup nozzle 12 (the rotation support member 20), and the suction nozzle unit 44 is as described above.

  Specifically, in FIG. 5A, the component suction surface 14 of any pickup nozzle 12 contacts the upper surface of the electronic component D located above the push-up pin 60, and 180 The component suction surface 50 of the suction nozzle portion 44 of the mounting head 42 is in contact with the lower surface of the electronic component D sucked by the component suction surface 14 of the other pickup nozzle 12 at the opposite position.

  Then, as shown in FIG. 5B, the push-up pin 60 moves upward and pushes up the electronic component D upward from the dicing sheet. At the same time, each pickup nozzle 12 and the rotation support member 20 move upward. Moving. At this time, the upper surface of the pushed-up electronic component D is sucked by the component suction surface 14 of the pickup nozzle 12 facing the pushed-up electronic component D, and at the same time, another pickup nozzle 12 is put on the suction nozzle portion 44 of the mounting head 42. The other electronic component D adsorbed on is adsorbed. Thereafter, the suction nozzle portion 44 of the mounting head 42 moves upward while the other electronic component D is sucked.

  According to the second embodiment, the upward movement of the push-up pin 60, the upward movement of each pickup nozzle 12 and the rotation support member 20, and the upward movement of the suction nozzle portion 44 of the mounting head 42 are controlled by the controller. 40, the electronic component D is pushed up by the push-up pin 60 and sucked by any pickup nozzle 12, and the electronic component D sucked by another pickup nozzle 12 is mounted on the mounting head. The second suction step to be sucked by the 42 suction nozzle portions 44 is performed simultaneously. Thereby, compared with the case where a 1st adsorption | suction process and a 2nd adsorption | suction process are separately performed at a different timing, the time until the electronic component D is adsorbed to the adsorption nozzle part 44 of the mounting head 42 can be shortened. . As a result, the supply capability of the electronic component D is improved, and the electronic component D can be efficiently mounted in the downstream mounting process.

  Further, by shortening the time until the electronic component D is attracted to the suction nozzle portion 44 of the mounting head 42, the shortened time can be used as time for performing another process. In particular, when the electronic component D is attracted by the pickup nozzle 12, the electronic speed is reduced when the electronic component D is attracted by the pickup nozzle 12 by reducing the moving speed of the downward movement of the pickup nozzle 12 relative to the electronic component D. The load (impact force) exerted on the part D can be reduced. As a result, the electronic component D can be prevented from being damaged and the quality of the electronic component D can be improved.

  In particular, as shown in FIGS. 9 and 10, in the case of a mounting head 42 having multiple (for example, four) suction nozzle portions 44, an electronic component D is transferred from a plurality of pickup nozzles 12 to each suction nozzle portion 44. Nozzles 44 are successively delivered, and the pickup nozzle 44 that has received the electronic component D moves and performs the mounting process, and in synchronization with this, the pickup nozzle that has delivered the electronic component D and has not been suctioned The next electronic component D can be adsorbed to 12. Accordingly, the next electronic component D can be picked up by the pickup nozzle 12 simultaneously with the mounting process of the electronic component D by the suction nozzle portion 44. Then, the electronic component D is delivered from the pickup nozzle 12 that has attracted the next electronic component D to the non-adsorptive suction nozzle portion 44, and is not attracted simultaneously with the mounting process by the suction nozzle portion 44 that has received the electronic component D. The next pickup process of the electronic component D by the pickup nozzle 12 becomes possible. By repeating this, three processing steps of pick-up processing of the electronic component D by the pickup nozzle 12, delivery processing of the electronic component D from the pickup nozzle 12 to the suction nozzle portion 44, and mounting processing of the electronic component D by the suction nozzle portion 44 are performed. Can be executed smoothly in a short time.

Next, a component supply apparatus according to a third embodiment of the present invention will be described.
In addition, about the structure which overlaps with the structure of the component supply apparatus which concerns on 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted suitably.

  As shown in FIGS. 7 and 8, the component supply apparatus according to the third embodiment starts from the state where the upper surface of the electronic component D on the XY table 56 and the component suction surface 14 of the pickup nozzle 12 face each other in parallel. A delivery stage (component support part) 64 is provided at a position where 12 is rotated 270 degrees clockwise (90 degrees counterclockwise).

  The delivery stage 64 is provided at a position retracted from the rotation trajectory of each pickup nozzle 12, in other words, at a position where it does not contact each pickup nozzle 12 when each pickup nozzle 12 rotates. A predetermined clearance C is provided between the pickup nozzle 12 and the end face of the delivery stage 64 that faces the pickup nozzle 12. Further, the driving method of the pickup nozzle 12 (rotation support member 20) and the suction nozzle portion 44 is as described above.

  According to the third embodiment, the electronic component D supported by the XY table 56 is sucked by the pickup nozzle 12, and the upper surface of the electronic component D on the XY table 56 and the component suction surface 14 of the pickup nozzle 12 face each other in parallel. From this state, the pickup nozzle 12 rotates clockwise by 270 degrees. As a result, the electronic component D is positioned on the upper surface of the delivery stage 64 and the side surface of the electronic component D is in an upward state (posture).

  Next, the mounting head 42 is driven by the head drive mechanism 48, and the side surface of the electronic component D is sucked to the component suction surface 50 of the suction nozzle portion 44. At this time, a predetermined load (impact force) is applied to the side surface of the electronic component D from the suction nozzle portion 44 of the mounting head 42, but the opposite side surface of the electronic component D is supported by the delivery stage 64. The electronic component D is firmly sandwiched between the mounting head 42 and the delivery stage 64 from above and below. Thereby, even when a predetermined load (impact force) is applied to the electronic component D from the suction nozzle portion 44 of the mounting head 42, it is possible to prevent the electronic component D from being displaced. When the side surface of the electronic component D is attracted to the component suction surface 50 of the suction nozzle portion 44, the mounting head 42 is driven by the head driving mechanism 48, and the downstream mounting process is executed.

  As described above, the electronic component D sucked by each pickup nozzle 12 is sucked by the pickup nozzle 12 in addition to being sucked by the suction nozzle portion 44 of the mounting head 42 while being rotated (reversed) by 180 degrees. It is also possible to suck the electronic component D onto the suction nozzle portion 44 of the mounting head 42 in a state where the electronic component D is rotated 270 degrees. Accordingly, the posture of the electronic component D can be appropriately changed without providing another mechanism depending on the content of the processing after the electronic component D is sucked to the suction nozzle portion 44 of the mounting head 42. As a result, the number of components of the component supply device can be reduced to prevent an increase in size, and an increase in manufacturing cost can also be prevented. Further, by reducing the number of parts of the parts supply device, each processing step can be reduced, and the supply capacity and supply efficiency of the parts can be increased.

  In particular, when the electronic component D is attracted by the suction nozzle portion 44 of the mounting head 42, the electronic component D is supported from below by the delivery stage 64, so that the electronic component D is loaded by the load acting from the suction nozzle portion 44 of the mounting head 42. Misalignment can be prevented. Thereby, since the electronic component D is adsorbed by the adsorption nozzle portion 44 of the mounting head 42 without being displaced, the mounting accuracy of the electronic component D in the downstream mounting process can be increased. Further, when the electronic component D is sucked by the suction nozzle portion 44 of the mounting head 42, the electronic component D is supported by the delivery stage 64 even if the electronic component D is detached from the suction nozzle portion 44 due to some inconvenience. . For this reason, it is possible to prevent the electronic component D from being greatly dropped and damaged in the downward direction.

  Further, since the delivery stage 64 is provided at a position retracted from the rotation trajectory of each pickup nozzle 12, the delivery stage 64 does not interfere when each pickup nozzle 12 rotates. This eliminates the step of releasing one of the pickup nozzles 12 or the delivery stage 64 so that the pickup nozzles 12 and the delivery stage 64 do not come into contact with each other when the pickup nozzle 12 rotates. As a result, the working time associated with the increase in the number of processes can be saved, so that the supply capability of the electronic component D can be improved.

  In the third embodiment, the pickup stage 12 is rotated 270 degrees clockwise from the state in which the upper surface of the electronic component D on the XY table 56 and the component suction surface 14 of the pickup nozzle 12 face each other in parallel. Although the structure provided at the position rotated (90 degrees counterclockwise) is shown, the present invention is not limited to this position. For example, the delivery stage 64 is connected to the upper surface of the electronic component D on the XY table 56 and the component of the pickup nozzle 12. The pickup nozzle 12 may be provided at a position rotated 90 degrees clockwise (270 degrees counterclockwise) from the state where the suction surface 14 faces in parallel. The position of the delivery stage 64 is not particularly limited and can be adjusted as appropriate in relation to the posture of the electronic component D.

10 Component supply device 12 Pickup nozzle (first component adsorption unit)
20 Rotation support member (Rotation support part)
22 Fixing member (fixing part)
24 Timing belt (rotary drive)
30 rack part (linear drive part, linear drive mechanism)
32 1st servo motor (1st drive source)
34 Pinion gear (linear drive unit, linear drive mechanism)
36 Second servo motor (second drive source)
38 Fixed pulley (rotary drive)
40 Controller (control unit)
42 Mounting head (second component suction part)
52 Prism (component position recognition unit)
54 Camera (part position recognition unit)
56 XY table (component supply unit)
60 Push-up pin (part push-up)
64 Delivery stage (part support part)
D Electronic parts (parts)

Claims (6)

A first component suction portion for sucking components;
A rotation support portion for rotatably supporting the first component suction portion;
A linear drive unit that moves the first component suction unit and the rotation support unit along a linear direction;
A rotation drive unit configured to rotate the first component adsorption unit around an axis of the rotation support unit to change the posture of the component adsorbed by the first component adsorption unit;
A fixing portion that supports the rotation support portion so as to be movable along the linear direction;
A first drive source provided in the fixed portion and driving the linear drive portion;
A second drive source that is provided in the fixed part and drives the rotation drive part;
A second component suction unit that sucks the component whose posture has been changed by the rotation drive unit;
A component supply device comprising:
A plurality of the first component suction portions are provided,
One or a plurality of the second component suction portions are provided, and provided so as to be movable along the linear direction,
The component push-out unit that pushes out the component sucked by the first component suction unit to the first component suction unit side is provided movably along the linear direction,
A controller that synchronizes the linear movement of the component extruding unit, the linear movement of the first component adsorbing unit, and the linear movement of the second component adsorbing unit, and
The linear movement of the component extruding part, the linear movement of the first part adsorbing part, and the linear movement of the second component adsorbing part are synchronized by the control part, and the part is pushed out by the part extruding part and The first suction step to be sucked by the first component suction portion and the second suction step to suck the component sucked by the other first component suction portion to the second component suction portion are executed simultaneously. A component supply device characterized by being made. The linear drive unit is a linear drive mechanism that converts the drive force of the first drive source into a linear motion,
2. The component according to claim 1, wherein a driving force from the first driving source is converted into a linear motion by the linear driving mechanism, and the first component suction unit and the rotation support unit move in a linear direction. Feeding device. A component supply unit for supporting the component sucked by the first component suction unit;
A component position recognition unit for recognizing the position of the component supported by the component supply unit;
Have
The component supply apparatus according to claim 1, wherein the position of the component supported by the component supply unit is corrected based on a result recognized by the component position recognition unit.   The component is adsorbed by the second component adsorbing unit at a position where the first component adsorbing unit is rotated 90 degrees or 270 degrees from the position adsorbed by the first component adsorbing unit. Item 2. The component supply apparatus according to Item 1.   5. The component according to claim 4, further comprising: a component support portion at a position where the first component suction portion is rotated 90 degrees or 270 degrees from a position where the component is sucked by the first component suction portion. Feeding device.   The component supply apparatus according to claim 5, wherein the component support portion is provided at a fixed position that is retracted from a rotation locus of the first component suction portion.

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