JP5781642B2 - Bonding equipment - Google Patents

Description

  The present invention relates to a bonding apparatus.

  In the manufacture of semiconductor devices, a chip bonding technique in which a wafer on which a large number of elements are fabricated is diced and separated into individual semiconductor chips, which are bonded one by one to a predetermined position such as a lead frame. Is adopted. A die bonder (pickup device) is used for this chip bonding (Patent Document 1 and Patent Document 2).

  As shown in FIG. 6, such a die bonder includes a bonding arm (not shown) having a suction collet 3 that sucks the semiconductor chip 1 of the supply unit 2 and a confirmation camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. And a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

  The supply unit 2 includes a semiconductor wafer 6 (see FIG. 7), and the semiconductor wafer 6 is divided into a large number of semiconductor chips 1. That is, the wafer 6 is attached to an adhesive sheet 7 (dicing sheet) (see FIG. 7), and the dicing sheet 7 is held by an annular frame. Then, the wafer 6 on the dicing sheet 7 is divided into pieces using a circular blade (dicing saw) or the like to form the chip 1. Further, the bonding arm holding the suction collet 3 can be moved between the pickup position and the bonding position via the conveying means.

  Further, the suction collet 3 is vacuum-sucked through the suction hole opened in the lower end surface thereof, and the chip 1 is adsorbed on the lower end surface of the suction collet 3. When this vacuum suction (evacuation) is released, the chip 1 is detached from the suction collet 3.

  Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed with a confirmation camera disposed above the supply unit 2, and the suction collet 3 is positioned above the chip 1 to be picked up, and then sucked as indicated by an arrow A. The collet 3 is lowered and the chip 1 is picked up. Thereafter, the adsorption collet 3 is raised as indicated by an arrow B.

  Next, the island portion 5 of the lead frame 4 to be bonded is observed with a confirmation camera disposed above the bonding position, and the suction collet 3 is moved in the direction of arrow C, and the island portion 5 is Then, the suction collet 3 is moved downward as indicated by an arrow D, and the chip 1 is supplied to the island portion 5. At this time, an adhesive is applied to the island portion 5 in advance, and the chip 1 is bonded to the island portion 5. In addition, after the chip is supplied to the island portion 5, the suction collet 3 is raised as indicated by the arrow E and then returned to the standby position above the pip-up position as indicated by the arrow F.

  That is, the suction collet 3 is sequentially moved as indicated by arrows A, B, C, D, E, and F, so that the chip 1 positioned based on the observation by the pickup confirmation camera is picked up by the suction collet 3. The chip 1 is mounted on the island portion 5.

  Incidentally, what is shown in FIG. 6 is a so-called single system with one arm per head, but conventionally, it can be called a multi-system, for example, a rotary mounter type, corresponding to various parts. There are a modular mounter and an intermediate stage type having an intermediate stage.

  The rotary mounter type includes a rotating body and a plurality of suction collets and the like at a predetermined pitch along the circumferential direction on the rotating body. For this reason, by rotating the rotating body around the central axis at a predetermined pitch, the pickup operation can be performed with one suction collet and the mounting operation can be performed with the other suction collet.

  The modular mounter is compact and can process a large number of chips at a time.

  In the intermediate stage type, an intermediate stage is arranged between the pickup position and the bonding position. In this case, it is necessary to provide two single-type bonding apparatuses having one arm per head. For this reason, the chip picked up at the pick-up position by one bonding apparatus is transferred to the intermediate stage, the chip at the intermediate stage is picked up by the other bonding apparatus, and this chip is transported to the bonding position position for bonding. is there.

JP 2000-68296 A JP 2006-73631 A

  In order to improve the number of production per unit time, the apparatus as shown in FIG. 6 needs to move the suction collet between the pickup position and the bonding position at a high speed. For this purpose, an actuator capable of high acceleration / deceleration is required. However, in such a case, the motor as a drive source is increased in size, vibrations are generated, and high acceleration / deceleration is limited.

  In addition, when a rotary mounter is used, it has a large number of heads (adsorption collets), and the rotating body becomes large, and the rotation speed cannot be increased so much, and it is difficult to adjust angular acceleration and angular velocity. . That is, in the rotary mounter, since the components can be sucked and mounted simultaneously by the rotary head, the mounting speed is high, but the apparatus becomes very large and installation work is difficult. In addition, the modular mounter is compact, but the mounting speed is slow. Furthermore, the overall mechanism is complicated, and there is a problem in controllability.

  The intermediate stage type needs to be equipped with two single-type bonding apparatuses with one arm per head, which increases the cost. In addition, since it is necessary to re-pick up on the intermediate stage, that is, there is a re-gripping, there is a possibility that the bonding accuracy may be lowered, and the work time is long.

  Therefore, in view of such a situation, the present invention intends to provide a bonding apparatus capable of performing a highly efficient bonding operation without increasing the conveyance speed of the suction collet.

The bonding apparatus of the present invention is provided with one supply member arrangement position where a chip supply member having a chip to be picked up is arranged and a pair of bonded member arrangement positions where a member to be bonded to which a chip is bonded is arranged. In the bonding apparatus, at least a pair of suction collets for picking up a chip and the first suction collet are transported to the supply member placement position, and the second suction collet is moved to one of the bonding member placement positions. A transport unit configured to transport the first suction collet to the other bonding target member placement position in a state of transporting the second suction collet to the supply member placement position;
And a vertical movement means for moving the suction collet up and down, and the conveying means rotates and conveys the pair of suction collets in one horizontal plane, and the position of the pair of bonded members is the rotation trajectory of the pair of collets Disposed at a position spaced apart by a predetermined amount, and the supply member disposition position is within the rotation path, and is disposed at an intermediate position between the pair of bonded member disposition positions.
The first suction collet can be sucked by the first suction collet in a state where the first suction collet is transported to the supply member arrangement position by the rotational transport of the transport means, and the member to be bonded from the second suction collet The bonding operation to the arrangement position is possible, and the second adsorption collet can adsorb the chip in the state where the second adsorption collet is conveyed to the supply member arrangement position by the rotation conveyance of the conveyance means. The bonding operation from the first suction collet to the bonding member arrangement position is possible.

  According to the bonding apparatus of the present invention, if the first suction collet is lowered by the vertical movement means while the first suction collet is conveyed to the supply member arrangement position, the chip is sucked to the first suction collet. can do. Further, if the suction collet is raised by the vertical movement means after the chip is sucked, the chip can be picked up from the supply member arrangement position. If the second suction collet is lowered by the vertically moving means in a state where the second suction collet is conveyed to one of the bonding target member arrangement positions, the chip adsorbed on the second suction collet is removed from the bonding target member. When the suction of the second suction collet is released and the second suction collet is raised, the bonding operation of the chip to the bonding member placement position is completed.

  If the suction collet is lowered by the vertically moving means in a state where the second suction collet is conveyed to the supply member arrangement position, the chip can be sucked to the second suction collet. Further, after the chip is sucked, the chip can be picked up from the supply member arrangement position by raising the second suction collet by the vertical movement means. If the first suction collet is lowered by the vertical movement means in a state where the first suction collet is conveyed to the other bonding member arrangement position, the chip adsorbed on the first suction collet is removed from the bonding target member. When the suction of the first suction collet is released and the first suction collet is raised, the bonding operation of the chip to the bonding member placement position is completed.

  That is, in a state where the first suction collet is conveyed to the supply member arrangement position, the second adsorption collet is conveyed to one bonding member arrangement position, and the second adsorption collet is conveyed to the supply member arrangement position. In this state, the first suction collet is conveyed to the other bonding member arrangement position, so that when the pickup operation is performed with the first suction collet, the bonding operation is performed with the second suction collet. When the pickup operation is performed with the second suction collet, the bonding operation can be performed with the first suction collet. Further, in between the transport of the pair of suction collets, the chip can be sucked by any one of the suction collets. Can be reduced.

  The conveying means for rotating and conveying the pair of adsorption collets in one horizontal plane is HYPERLINK "http://www.weblio.jp/content/%E4%B8%80%E5%AE%9A" \ o " Constant meaning "constant HYPERLINK" http://www.weblio.jp/content/%E8%A7%92%E5%BA%A6 "\ o" meaning of angle "HYPERLINK" http: //www.weblio .jp / content /% E6% 8F% BA% E5% 8B% 95 "\ o" The meaning of rocking "rocking HYPERLINK" http://www.weblio.jp/content/%E5%9B%9E%E8 % BB% A2% E9% 81% 8B% E5% 8B% 95 "\ o" Meaning of rotational motion "Consists of a drive mechanism such as a rotary actuator that performs rotational motion.

  It is preferable that the first suction collet and the second suction collet are mechanically connected to move the suction collet between the supply member placement position and the bonding member placement position at the same timing and stroke. By setting in this way, it is only necessary to have one drive source such as a motor in the conveying means for conveying the suction collet between the supply member arrangement position and the bonding member arrangement position. Further, the transport operation of the two suction collets is not shifted.

  A third adsorption collet is arranged in the vicinity of the first adsorption collet, a fourth adsorption collet is arranged in the vicinity of the second adsorption collet, and the first and third adsorption collets are arranged as supply members. In a state where the second and fourth suction collets are transported to one of the bonding member placement positions in the state of being transported to the position, the first and second suction collets are transported to the supply member placement position. It is also possible to set so that the third suction collet is transported to the other bonded member arrangement position.

  In the present invention, when the pickup operation is performed with the first suction collet, the bonding operation can be performed with the second suction collet, and when the pickup operation is performed with the second suction collet. Since the bonding operation can be performed with the first suction collet, a highly efficient bonding operation can be performed without increasing the conveyance speed of the suction collet.

  That is, compared with the conventional one-arm / one-head type, if the number of times the head (suction collet) is conveyed (moved) is the same, the number of productions (the number of processing) is doubled, and the same number of productions. If so, it is not necessary to increase the transport speed of the head, and an increase in the size of the drive source can be avoided.

  Further, even if the bonding member replacement operation is performed at one of the bonding member arrangement positions, the bonding operation to the bonding member at the other bonding member arrangement position can be performed. For this reason, it is not necessary to stop the whole production process, it can be continued as a production process, and it is excellent in productivity.

  The conveying means can be easily configured with an existing mechanism, and the configuration can be simplified and the cost can be reduced. In the case where the first adsorbing collet and the second adsorbing collet are mechanically coupled so that the movement of the first adsorbing collet is the same timing and the same stroke, a single driving source such as a motor in the conveying means can be configured and stable. Control and cost reduction can be achieved, and contact (collision) between the suction collets does not occur, and a stable bonding operation can be performed over a long period of time.

  When the third adsorption collet is disposed in the vicinity of the first adsorption collet and the fourth adsorption collet is disposed in the vicinity of the second adsorption collet, the productivity can be further improved. .

It is a simplified diagram explaining a bonding method for a reference example. It is a simplified diagram of the bonding apparatus of the reference example. It is a simplified top view of the bonding apparatus which shows embodiment of this invention. FIG. 4 is a view taken in the direction of arrow A in FIG. 3. It is a simplified diagram of a bonding apparatus showing another reference example of the present invention. It is a simplified diagram showing a conventional bonding method. It is a simplified perspective view which shows a chip | tip.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 2 shows a reference example of a bonding apparatus. This bonding apparatus bonds one supply member arrangement position P where a chip supply member 12 (for example, a wafer) having a chip 11 to be picked up is arranged, to the chip 11. A pair of member-to-be-bonded positions Q1 and Q2 on which a member to be bonded 10 (substrate on which a chip is mounted) is disposed are provided. The wafer is adhered on a wafer sheet (adhesive sheet) stretched on a metal ring (wafer ring), and is divided (divided) into a large number of chips 11 by a dicing process.

  The bonding apparatus includes a pair of suction collets 15 and 16 for picking up the chip 11, transport means 17 for reciprocating the suction collets 15 and 16 along the same horizontal axis, and upper and lower for moving the suction collets 15 and 16 up and down. Moving means 18.

  The transport means 17 can be constituted by various mechanisms such as a cylinder mechanism, a ball screw mechanism, a linear motor mechanism, etc., and an XY axis stage, a robot arm that can move in the XY directions, or the like can be used. The transport means 17 in this case includes a support base 20 and a moving body 22 that is guided by guide members 21 and 21 attached to the support base 20 and reciprocates in the X-axis direction of FIG. . For this reason, the guide members 21 and 21 can be configured by guide rails (straight guides), and a slider guided along the guide rails is provided on the moving body 22.

  Therefore, in this bonding apparatus, the first suction collet 15 and the second suction collet 16 are mechanically connected so that the movements are the same timing and the same stroke. Further, the vertical movement means 18 can also be constituted by various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear motor mechanism.

  The suction collets 15 and 16 are formed with suction suction holes 15b and 16b (see FIG. 1) for opening at lower end surfaces (suction surfaces) 15a and 16a, and a vacuum generator (not shown) is connected to the suction holes. ing. By driving the vacuum generator, air in the suction holes 15b and 16b is sucked, the chip 11 is sucked by vacuum, and the chip 11 is sucked to the lower end surfaces 15a and 16a of the suction collets 15 and 16. When the vacuum suction (evacuation) is released, the chip 11 is detached from the suction collets 15 and 16. As the vacuum generator, for example, an ejector type that controls the opening and closing of high-pressure air and discharges it from the nozzle to the diffuser to generate a negative pressure in the diffusion chamber can be adopted.

  In the supply member arrangement position P, as shown in FIG. 1, push-up means M that pushes up the chip 11 is provided. That is, the supply member arrangement position P includes a stage 25 that receives the adhesive sheet 13 and a push-up pin 26 that is disposed on the stage 25 (see FIG. 2). In this case, the stage 25 does not move up and down, and the push-up pin 26 moves up and down by a vertical movement mechanism (not shown). The stage 25 can be composed of an XY stage that can be driven along the X-axis direction and the Y-axis direction orthogonal to the X-axis direction. The vertical movement mechanism of the push-up pin 26 can be configured by a ball screw mechanism having a screw shaft and a ball nut screwed to the screw shaft, a cylinder mechanism, a linear motor mechanism, or the like.

  By the way, the vertical movement mechanism of the transport means 17, the vertical movement means 18, the push-up means M, the suction switching of the suction collets 15 and 16, the drive of the stage 25, and the like are controlled by a control means (microcomputer) (not shown). The The control means is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The ROM stores programs executed by the CPU and data.

  Next, a method of bonding the chip 11 to the substrate using the bonding apparatus configured as shown in FIG. 2 will be described with reference to FIG. In this case, a chip supply member 12 (for example, a wafer) having a chip 11 to be piped up is arranged at the supply member arrangement position P. Further, the member to be bonded 10 (substrate on which the chip is mounted) is placed at the bonding member arrangement positions Q1 and Q2 that are opposite to each other by 180 ° across the supply member arrangement position P and at the same distance from the supply member arrangement position P. Is placed.

  The first suction collet 15 is moved in the direction of arrow C or arrow F, and is positioned above the chip 11 to be picked up. At this time, the second suction collet 16 is in a state corresponding to one of the bonded member arrangement positions Q1. In this state, at the supply member arrangement position P, the chip 11 is picked up by the first suction collet 15 while the chip 11 is positioned by the confirmation camera arranged above the supply member arrangement position P. Do. If the chip 11 is attracted to the second suction collet 15 at the bonding member placement position Q1, the bonding operation for mounting the chip 11 on the substrate 10 on the bonding member placement position Q1 is performed. This is performed in a state in which the bonding position (mounting position of the substrate 10) is confirmed by a confirmation camera arranged above Q2. In addition, when the chip | tip 11 is not adsorb | sucked by the 2nd adsorption collet 15, bonding operation is not performed.

  In the pick-up operation, the push-up pin 26 is raised so that the chip 11 to be picked up is lifted from the stage 25 by a predetermined amount. In this state, the suction collet 15 is lowered as indicated by an arrow D, and the chip 11 is sucked onto the suction surface 15 a of the suction collet 15. If adsorbed, the adsorbing collet 15 is raised as shown by arrow E. Thereby, the pickup operation at the supply member arrangement position P is completed.

  Further, when the bonding operation for mounting the chip 11 on the substrate 10 on the bonding member arrangement position Q1 is performed, the second suction collet 16 is lowered as indicated by the arrow A, and the chip 11 is supplied to the island portion of the substrate 10. To do. And after supplying the chip | tip 11 to an island part, the adsorption | suction collet 16 is raised like the arrow B. FIG. As a result, the bonding operation at the bonding member arrangement position Q1 is completed.

  After that, both the suction collets 15 and 16 are moved in the direction of arrow F, and the first suction collet 15 is moved onto the other bonding member placement position Q2. By this movement, the second suction collet 16 is positioned on the supply member arrangement position P.

  In this state, the first suction collet 15 performs the bonding operation at the other bonded member placement position Q2, and the second suction collet 16 performs the pickup operation at the supply member placement position P.

  That is, the push-up pin 26 is raised so that the chip 11 to be picked up is lifted from the stage 25 by a predetermined amount. In this state, the suction collet 16 is lowered as indicated by an arrow D, and the chip 11 is sucked onto the suction surface 16 a of the suction collet 16. If adsorbed, the adsorbing collet 16 is raised as indicated by an arrow E. Thereby, the pickup operation at the supply member arrangement position P is completed.

  Further, when the bonding operation for mounting the chip 11 on the substrate 10 on the bonding member arrangement position Q2 is performed, the first suction collet 15 is lowered as indicated by the arrow A, and the chip 11 is supplied to the island portion of the substrate 10. To do. And after supplying the chip | tip 11 to an island part, the adsorption | suction collet 15 is raised like the arrow B. FIG. This completes the bonding operation at the bonding member arrangement position Q2.

  Thereafter, the first suction collet 15 and the second suction collet 16 are moved in the direction of the arrow C, the first suction collet 15 is made to correspond to the supply member placement position P, and the second member is placed at the bonding member placement position Q1. The adsorption collet 16 is made to correspond. By performing the above steps, the chip 11 can be bonded to the substrates 10 and 10 arranged at the bonding member arrangement positions Q1 and Q2.

  According to the bonding apparatus, when the pickup operation is performed by the first suction collet 15, the bonding operation can be performed by the second suction collet 16, and the pickup operation is performed by the second suction collet 16. Since the bonding operation can be performed with the first suction collet 15 when performing the above, a highly efficient bonding operation can be performed without increasing the conveyance speed of the suction collets 15 and 16.

  That is, compared with the conventional one-arm / one-head type, if the number of times of transporting (moving) the heads (suction collets 15 and 16) is the same, the number of production (number of processing) is doubled and the same. If the number is the number of production, it is not necessary to increase the transport speed of the suction collets 15 and 16, and the drive source can be prevented from being enlarged.

  Moreover, even if the bonding member 10 is replaced at any one of the bonding member arrangement positions Q1, the bonding operation to the bonding member 10 at the other bonding member arrangement position Q2 can be performed. For this reason, it is not necessary to stop the whole production process, it can be continued as a production process, and it is excellent in productivity.

  Since the conveying means 17 performs reciprocating conveyance along a single horizontal axis through the pair of suction collets 15 and 16, the conveying means 17 can be an existing cylinder mechanism, ball screw mechanism, linear motor mechanism, or the like. It can be composed of a drive mechanism. Therefore, the configuration can be simplified and the cost can be reduced. Further, in the bonding apparatus, the first suction collet 15 and the second suction collet 16 are mechanically connected so that the movements are at the same timing and the same stroke. A single drive source can be configured, stable control and cost reduction can be achieved, and contact (collision) between the suction collets 15 and 16 does not occur, and stable bonding work can be performed over a long period of time. Can do.

  In the bonding apparatus shown in FIGS. 1 and 2, the conveying means 17 reciprocates and conveys the pair of suction collets 15 and 16 along one horizontal axis. In the bonding apparatus according to the present invention, the conveying means 17 performs a rotational conveyance of the pair of suction collets 15 and 16 in one horizontal plane.

  The bonding apparatus shown in FIGS. 3 and 4 includes a rotating shaft member 30 and a pair of arms 31 and 32 extending in the radial direction from the rotating shaft member 30. The suction collets 15 and 16 are attached to the distal ends of the arms 31 and 32 via the vertical movement means 18.

  The rotating shaft member 30 rotates (rotates) within a predetermined range via a driving mechanism (not shown) (for example, a rotary actuator having a servo motor). The arms 31 and 32 are provided in the same horizontal plane and form a predetermined constant angle θ1.

  At this time, the supply member arrangement position P and the pair of bonded member arrangement positions Q1 and Q2 sandwiching the supply member arrangement position P are separated by a predetermined angle θ (2θ1) along the orbit of the suction collets 15 and 16. It is arranged. For this reason, when the arms 31 and 32 are rotated and the vertical movement means 18 having the first suction collet 15 is positioned at the other bonded member arrangement position Q2, the vertical movement means having the second suction collet 16 is provided. When the vertical movement means 19 having the first suction collet 15 is located at the supply member arrangement position P, the vertical movement means 19 having the second suction collet 16 is moved to one of the objects to be moved. It is located at the bonding member arrangement position Q1.

  For this reason, also in the bonding apparatus shown in FIGS. 3 and 4, the first suction collet 15 and the second suction collet 16 are mechanically coupled so that the movements thereof have the same timing and the same stroke.

  Next, a bonding method using the bonding apparatus shown in FIGS. 3 and 4 will be described. First, as shown by a solid line in FIG. 3, the vertical movement means 18 is located at the other bonded member arrangement position Q <b> 2 and the vertical movement means 19 is located at the supply member arrangement position P. In this state, if the chip 11 is adsorbed to the first suction collet 15 at the bonding member arrangement position Q2, the bonding operation at the bonding member arrangement position Q2 is performed. The pickup operation by the suction collet 16 is performed.

  Further, from the state shown by the solid line, the arms 31 and 32 are integrally rotated around the rotary shaft member 30 in the direction of arrow G so that the vertical movement means 18 is located at the supply member arrangement position P, and the vertical movement means. It can be in the state where 19 is located in the to-be-bonded member arrangement position Q1. In this state, if the chip 11 is adsorbed to the second suction collet 16 at the bonding member arrangement position Q1, a bonding operation is performed at the bonding member arrangement position Q1, and at the supply member arrangement position P, The pickup operation by the first suction collet 15 is performed.

  The pickup operation by the suction collets 15 and 16 is the same as the operation shown in FIG. 1, and the bonding operation by the suction collets 15 and 16 is the same as the operation shown in FIG. Further, in a state where the first suction collet 15 is located at the supply member arrangement position P and the second suction collet 16 is located at the bonding member arrangement position Q1, the arms 31 and 32 are integrally moved in the direction of the arrow H. By rotating about the rotating shaft member 30, the first suction collet 15 is positioned at the bonding member placement position Q2, and the second suction collet 16 is located at the supply member placement position P. it can.

  For this reason, the chip 11 is bonded to the substrates 10 and 10 arranged at the bonding member arrangement positions Q1 and Q2 by repeatedly rotating (rotating) the arms 31 and 32 in the directions of the arrows G and H together. be able to.

  Therefore, even in the bonding apparatus shown in FIGS. 3 and 4, the bonding operation can be performed by the second suction collet 16 when the pickup operation is performed by the first suction collet 15. When the pickup operation is performed by the second suction collet 16, the bonding operation can be performed by the first suction collet 15. For this reason, there can exist an effect similarly to the bonding apparatus shown in the said FIG. 1 and FIG.

  In the bonding apparatus shown in FIG. 3 and FIG. 4, the pair of suction collets 15 and 16 are rotated and transported in one horizontal plane. HYPERLINK "http://www.weblio.jp/content/ % E4% B8% 80% E5% AE% 9A "\ o" Constant meaning "Constant HYPERLINK" http://www.weblio.jp/content/%E8%A7%92%E5%BA%A6 "\ o "Meaning of angle" HYPERLINK "http://www.weblio.jp/content/%E6%8F%BA%E5%8B%95" \ o "Meaning of rocking" Rocking HYPERLINK "http: // www.weblio.jp/content/%E5%9B%9E%E8%BB%A2%E9%81%8B%E5%8B%95 "\ o" Meaning of rotary motion "Driving rotary actuators that perform rotary motion It can consist of a mechanism. For this reason, even this conveying means 17 can be easily configured by an existing mechanism, and the configuration can be simplified and the cost can be reduced. Further, since the first suction collet 15 and the second suction collet 16 are mechanically coupled so that the movements have the same timing and the same stroke, the bonding apparatus shown in FIG. 1 and FIG. The effect can be produced similarly.

  Next, in FIG. 5, two suction collets 35 and 36 are further attached to the moving body 22. That is, the third adsorption collet 35 is disposed in the vicinity of the first adsorption collet 15, and the fourth adsorption collet 36 is disposed in the vicinity of the second adsorption collet 16. The third suction collet 35 and the fourth suction collet 36 can be moved up and down by the vertical movement means 18, respectively.

  In this case, the first and third suction collets 15 and 35 are conveyed to the supply member arrangement position P, and the second and fourth adsorption collets 16 and 36 are conveyed to one of the bonding member arrangement positions Q1. Thus, the first and third suction collets 15 and 35 are conveyed to the other bonding member arrangement position while the second and fourth adsorption collets 16 and 36 are conveyed to the supply member arrangement position P. .

  Therefore, in the state where the first and third suction collets 15 and 35 are located at the supply member arrangement position P, the pickup operation by the first and third suction collets 15 and 35 can be performed, and the second and second suction collets 15 and 35 can be performed. In the state where the four suction collets 16 and 36 are located at the supply member arrangement position P, the pickup operation by the second and fourth suction collets 16 and 36 can be performed. In the state where the first and third suction collets 15 and 35 are located at the bonding member arrangement position Q1, the first and third suction collets 15 and 35 can perform the bonding operation, and the second and second suction collets 15 and 35 can perform the bonding operation. In a state where the four suction collets 16 and 36 are located at the bonding member arrangement position Q2, the first and third suction collets 15 and 35 can perform the bonding operation.

  When the pickup operation is performed by the first and third suction collets 15 and 35, the pickup operation is performed by the second and fourth suction collets 16 and 36. When the bonding operation is performed by the second and fourth suction collets 16 and 36, the X-axis direction (conveying direction) of each of the suction collets 15, 16, 35, and 36, respectively. It is preferred to make adjustments along.

  Even if the adjustment along the X-axis direction (conveying direction) is performed by sliding the moving body 22 in the X-axis direction, each of the suction collets 15, 16, 35, 36 is in the X-axis direction with respect to the moving body 22. It may be possible to slide along. In addition, only one of the first suction collet 15 and the third suction collet 35 can be slid along the X-axis direction with respect to the moving body 22, and the second suction collet 15 and the fourth suction collet 15 Only one of the suction collets 36 may be slidable along the X-axis direction with respect to the moving body 22.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above embodiment, and various modifications are possible. For example, as shown in FIGS. The third suction collet 35 is disposed in the vicinity of the first suction collet 15, and the fourth suction collet 36 is disposed in the vicinity of the second suction collet 16. It may be what was done.

  Further, as shown in FIGS. 1 and 2, even if the pair of suction collets 15 and 16 are reciprocally conveyed along one horizontal axis, as shown in FIGS. Even if the suction collet is rotated and conveyed within one horizontal plane, the pitch between the supply member arrangement position P and the bonding member arrangement positions Q1 and Q2 can be arbitrarily changed. In particular, in the case shown in FIGS. 3 and 4, the pitch between the supply member arrangement position P and the bonding member arrangement positions Q1 and Q2 can be changed by changing the angle formed by the arm and the length of the arm. it can.

  In the above-described embodiment, the first suction collet 15 and the second suction collet 16 are mechanically connected to each other, and the suction collets 15 and 16 between the supply member placement position P and the bonding member placement positions Q1 and Q2 are used. Although the movements are the same timing and the same stroke, they may be independent without being mechanically connected. In this case, the movement of the first adsorption collet 16 and the second adsorption collet 16 may be synchronized or may not be synchronized.

  Using at least a pair of suction collets, a chip is picked up from a chip supply member arranged at one supply member arrangement position, and the picked-up chip is bonded to a bonding member arranged at a pair of bonding member arrangement positions. Is. The chip 11 may be an IC chip, an LED chip, or another chip component (chip resistor, chip capacitor, chip inductor, etc.).

11 Chip 12 Chip supply member 15, 16, 35, 36 Adsorption collet 17 Conveying means 18 Vertical movement means P Supply member arrangement position Q1, Q2 Bonded member arrangement position

Claims (3)

A bonding apparatus provided with one supply member arrangement position where a chip supply member having a chip to be picked up is arranged and a pair of bonding member arrangement positions where a member to be bonded to which a chip is bonded is arranged ,
At least a pair of suction collets to pick up chips,
In a state where the first suction collet is conveyed to the supply member arrangement position, the second adsorption collet is conveyed to one bonding member arrangement position, and the second adsorption collet is conveyed to the supply member arrangement position. Conveying means for conveying the first suction collet to the other bonding member arrangement position;
A vertical movement means for moving the suction collet up and down;
The transport means performs the rotational transport of the pair of adsorption collets in one horizontal plane,
The pair of bonded member disposition positions are disposed at positions separated from each other by a predetermined amount in the rotation trajectory of the pair of collets, and the supply member disposition position is in the rotation trajectory, and the pair of bonding member disposition positions Arranged in the middle of
The first suction collet can be sucked by the first suction collet in a state where the first suction collet is transported to the supply member arrangement position by the rotational transport of the transport means, and the member to be bonded from the second suction collet The bonding operation to the arrangement position is possible, and the second adsorption collet can be adsorbed by the second adsorption collet while the second adsorption collet is conveyed to the supply member arrangement position by the rotation conveyance of the conveyance means. A bonding apparatus capable of performing a bonding operation from the first suction collet to the position of the member to be bonded.   The first suction collet and the second suction collet are mechanically connected, and the movement of the suction collet between the supply member arrangement position and the bonding member arrangement position is set to the same timing and the same stroke. The bonding apparatus according to claim 1.   A third adsorption collet is arranged in the vicinity of the first adsorption collet, a fourth adsorption collet is arranged in the vicinity of the second adsorption collet, and the first and third adsorption collets are arranged as supply members. In a state where the second and fourth suction collets are transported to one of the bonding member placement positions in the state of being transported to the position, the first and second suction collets are transported to the supply member placement position. 3. The bonding apparatus according to claim 1, wherein the third suction collet is transported to the other bonding member arrangement position. 4.

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