JP2012023230A - Mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting machine which suppresses the increase of the machine size in an X direction.SOLUTION: A mounting machine 100 includes a base 1, a wafer holding table 5 which holds a bare chip and moves in a Y direction relative to the base 1, a push-up unit 7 having a mechanism which pushes up the bare chip held on the wafer holding table 5 from below and moves in at least an X direction relative to the base 1, a take out unit 6 having a mechanism which suctions the bare chip pushed up by the push-up unit 7 and moves in at least the X direction relative to the base 1, and a head unit which receives the bare chip from the take out unit 6 and mounts the bare chip on a printed substrate P.

Description

  The present invention relates to a mounting machine, and more particularly to a mounting machine provided with a wafer holding table capable of holding a wafer component.

  2. Description of the Related Art Conventionally, a mounting machine including a wafer holding table that can hold a wafer component is known (see, for example, Patent Documents 1 and 2).

  In Patent Document 1, a flip table (wafer part) is held, a holding table (wafer holding table) that can move in the XY directions, a sheet peeling mechanism (push-up device) disposed below the holding table, A mounting machine is disclosed that includes a take-out head (take-out device) that sucks a flip chip and a head unit that receives the flip chip from the take-out head and mounts it on a substrate. In Patent Document 1, the positions of the sheet peeling mechanism and the take-out head in the XY plane are considered to be fixed. In the above-mentioned Patent Document 1, when picking up a flip chip from the holding table, the holding table is moved in the XY directions so that the flip chip to be picked up is positioned at the pickup position (the position of the sheet peeling mechanism and the take-out head). It is operating.

  In Patent Document 2, a component supply table (wafer holding table) that holds wafer components and is movable in the X and Y directions, a component fetching unit (takeout device) that sucks wafer components, and a wafer from the component fetching unit to the wafer are disclosed. A mounting machine including a mounting unit (head unit) that receives components and mounts them on a substrate is disclosed. In the above Patent Document 2, as in the above Patent Document 1, when taking out a wafer part from the parts supply table, the part supply table is moved in the XY directions so that the wafer part to be taken out is positioned at the take-out position. It is operating.

Japanese Patent No. 4016982 JP 2004-103923 A

  However, in Patent Document 1, the wafer holding table (holding table) is moved in the X and Y directions in the horizontal plane to pick up the wafer component (flip chip), the take-out device (take-out head), and the push-up device (sheet peeling mechanism). Since the wafer holding table having a relatively large plane area can be moved not only in the Y direction but also in the X direction in the horizontal plane, the apparatus becomes large in the X direction. There is a point.

  Also in Patent Document 2, the wafer holding table (component supply table) having a relatively large flat area is moved in the XY directions so that the wafer component to be taken out is positioned at the take-out position and the take-out operation is performed. Therefore, there is a problem that the apparatus becomes large in the X direction.

  The present invention has been made to solve the above-described problems, and one object of the present invention is a mounting machine capable of suppressing the apparatus from becoming large in the X direction in a horizontal plane. Is to provide.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, a mounting machine according to one aspect of the present invention is configured to be capable of holding a base and wafer parts, and is capable of moving in the Y direction in a horizontal plane with respect to the base. A push-up device having a holding table, a mechanism for pushing up wafer components held by the wafer holding table from below, and movable at least in the X direction perpendicular to the Y direction in the horizontal plane with respect to the base, and the push-up device A pick-up device having a mechanism for sucking the wafer component pushed up by the head and capable of moving at least in the X direction with respect to the base; a head unit for receiving the wafer component from the pick-up device and mounting the wafer component on the substrate; It has.

  In the mounting machine according to this aspect, as described above, the wafer holding table movable in the Y direction in the horizontal plane with respect to the base, and at least in the X direction orthogonal to the Y direction in the horizontal plane with respect to the base. By providing a movable push-up device and a take-out device that can move at least in the X direction relative to the base, the push-up device and the pick-up device can be moved in the X direction without moving the wafer holding table in the X direction. By moving to the position, it is possible to align the parts to be taken out with the push-up device and the take-out device. Thereby, since it is not necessary to move the wafer holding table having a relatively large plane area in the X direction, it is possible to prevent the apparatus from becoming large in the X direction in the horizontal plane.

  In the mounting machine according to the one aspect described above, preferably, either one of the push-up device and the take-out device is movable in the Y direction, and one of the push-up device and the take-out device is fixed in the Y direction. . If comprised in this way, the apparatus of the side fixed can be made cheap. Further, the take-up device is configured to be movable in the Y direction in the horizontal plane with respect to the push-up device, and unlike the case where the push-up device and the take-out device are fixed, the push-up device and the take-out device are configured. The position with the device can be finely adjusted. Thereby, since the position shift of the pushing-up device and the take-out device at the time of taking out the components can be suppressed, it is possible to suppress the occurrence of defective suction of the components.

  In the mounting machine according to the one aspect described above, preferably, an imaging device having a mechanism for imaging a wafer part held on the wafer holding table and movable in at least the X direction with respect to the base, and the base A first support member movable in the Y direction, and the imaging device and the take-out device are attached to the first support member movable in the Y direction so as to be movable in the X direction. However, it is configured to be movable in the X direction and the Y direction. If comprised in this way, an imaging device and a taking-out apparatus can be easily moved to XY direction using one support member.

  In the mounting machine according to the one aspect described above, preferably, the mounting apparatus further includes an imaging device that has a mechanism for imaging the wafer component held on the wafer holding table and is movable at least in the X direction with respect to the base. In parallel with the delivery from the wafer part take-out device to the head unit, or in parallel with the mounting of the wafer part on the substrate by the head unit, the next wafer part to be mounted held on the wafer holding table is imaged. It is configured as follows. With this configuration, the total time required for imaging the next wafer part and mounting the previous part or delivering the wafer part can be shortened.

  In the mounting machine according to the one aspect described above, preferably, an imaging device having a mechanism for imaging a wafer part held on the wafer holding table and movable in at least the X direction with respect to the base, and the base A second support member movable in the Y direction along a predetermined rail, and the take-out device is attached to the second support member movable in the Y direction so as to be movable in the X direction. The base is configured to be movable in the X direction and the Y direction. If comprised in this way, since an extraction apparatus can be moved from the position of an imaging device, the delivery operation | movement of the components from an extraction device to a mounting head and the imaging operation of the components by an imaging device can be performed in parallel. it can.

  In this case, preferably, a third support member that is movable in the Y direction along a predetermined rail with respect to the base is further provided, and the imaging device is in the X direction with respect to the third support member that is movable in the Y direction. It is configured to be movable in the X direction and the Y direction with respect to the base. If comprised in this way, since an imaging device and a taking-out apparatus can be moved independently to a X direction and a Y direction, the delivery operation | movement of the components from a taking-out apparatus to a mounting head, and the imaging operation of the components by an imaging device Can be performed more reliably and easily in parallel.

  In the mounting machine according to the one aspect, preferably, the mounting machine further includes a conveyor that extends in the X direction and conveys the substrate, and the take-out device is attached to the conveyor so as to be movable in the X direction with respect to the base. The apparatus is configured to be movable in the X direction and the Y direction with respect to the base. With this configuration, even when the take-out device is fixed in the Y direction because the take-out device is attached to a fixedly installed conveyor, the take-out operation can be performed by moving the push-up device in the Y direction. The push-up device and the take-out device can be aligned.

  In the mounting machine according to the above aspect, preferably, the mounting machine further includes a conveyor that extends in the X direction and conveys the substrate, and the take-out device is a conveyor that is movable in the X direction at a predetermined position in the Y direction with respect to the base. The push-up device is configured to be movable in the X direction with respect to the base at a predetermined position in the Y direction, and the relative position in the Y direction between the take-out device and the push-up device is It is configured to be manually adjustable. If comprised in this way, since the position of the Y direction of a pushing-up apparatus and a taking-out apparatus is the same, it is not necessary to align the pushing-up apparatus and taking-out apparatus for performing taking-out operation. Further, when the Y-direction positions of the push-up device and the take-out device are shifted due to the passage of time or the like, it can be manually adjusted so as to be the same.

  In the mounting machine according to the above aspect, the head unit preferably includes a first head unit movable in the X direction and the Y direction, and a first head unit movable in the X direction and the Y direction independently of the first head unit. The take-out device includes a first take-out device corresponding to the first head unit and a second take-out device corresponding to the second head unit. With this configuration, the number of wafer parts delivered can be increased by the two head units and the two take-out devices, so that the time required for delivering the wafer parts can be shortened.

It is a top view which shows the whole structure of the mounting machine by 1st Embodiment of this invention (a wafer holding table is a component extraction operation position). It is a top view which shows the whole structure (the wafer holding table is a wafer receiving position) of the mounting machine by 1st Embodiment of this invention. It is a front view which shows the whole structure of the mounting machine by 1st Embodiment of this invention. It is a perspective view which shows the main components of the mounting machine by 1st Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by 1st Embodiment of this invention. It is a front view which shows the delivery state of the wafer components of the mounting machine by 1st Embodiment of this invention. It is a block diagram which shows the control system of the mounting machine by 1st Embodiment of this invention. It is a flowchart for demonstrating mounting operation | movement of the mounting machine by 1st Embodiment of this invention. It is a top view which shows the whole structure of the mounting machine by the modification of 1st Embodiment of this invention. It is a top view which shows the whole structure of the mounting machine by 2nd Embodiment of this invention. It is a top view which shows the whole structure of the mounting machine by 3rd Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by 3rd Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by the modification of 3rd Embodiment of this invention. It is a top view which shows the whole structure of the mounting machine by 4th Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by 4th Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by 5th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
Hereinafter, the structure of the mounting machine 100 according to the first embodiment of the present invention will be described with reference to FIGS. In order to clarify the directional relationship, XYZ rectangular coordinate axes are appropriately shown in the drawing. The X-axis direction is a direction parallel to the horizontal plane, the Y-axis direction is a direction orthogonal to the X-axis direction on the horizontal plane, and the Z-axis direction is a direction orthogonal to the X-axis and the Y-axis.

  The mounting machine 100 can take out a bare chip from the diced wafer W and mount (mount) it on the printed circuit board P, and can mount a package component or the like supplied by the component supply device 160 on the printed circuit board P. This is a so-called composite type mounting machine.

  As shown in FIGS. 1 and 2, the mounting machine 100 includes a base 1, a conveyor 2 for loading and unloading a printed board P to and from a predetermined mounting work position, and chip components for supplying chip components. And a supply unit 3. As shown in FIGS. 2 and 4, the mounting machine 100 includes a mounting unit 4 for mounting a component (bare chip or chip component) on the printed circuit board P, and a wafer W pulled out from the wafer storage unit 170. Wafer holding table 5 to be supported, take-out device 6 for taking out the bare chip from wafer W supported by wafer holding table 5 and delivering it to mounting portion 4, and pushing up the bare chip from below when the take-out device 6 takes out the bare chip A device 7 and a movable camera 8 for recognizing a component position for imaging the bare chip before the take-out operation of the bare chip by the take-out device 6 are included. The bare chip is an example of the “wafer part” in the present invention. The camera 8 is an example of the “imaging device” in the present invention.

  The conveyor 2 includes a conveyor main body that extends in the X direction that conveys the printed circuit board P, and a positioning mechanism (not shown) that lifts and positions the printed circuit board P on the conveyor main body. The conveyor conveys the printed board P from the right side to the left side in FIG. 1 in the X-axis direction in a substantially horizontal posture, and positions and fixes the printed board P at a predetermined mounting work position. In the first embodiment, the positions (positions of the printed circuit board P in the drawing) that are separated by a predetermined interval in the X-axis direction on the conveyance path by the conveyor 2 are set as the mounting work positions. In the following description, a position on the upstream side in the transport direction of the printed circuit board P among the mounting work positions is referred to as a first work position S1, and a position on the downstream side is referred to as a second work position S2.

  The chip component supply unit 3 is provided at both ends on the front side of the mounting machine 100. The chip component supply unit 3 is provided to supply chip components such as transistors, resistors, and capacitors. In the chip component supply unit 3, for example, a component supply device 160 such as a tape feeder 161 is arranged along the conveyor 2. Each tape feeder 161 includes a reel on which a tape holding a chip component such as a transistor is wound, a holding member that holds the reel, and a chip component at a component supply position at the tip of the tape feeder while pulling out the tape from the reel. And a parts feeding mechanism for feeding The tape feeder 161 is configured to perform a chip component feeding operation in conjunction with the mounting machine 100 while being attached to the chip component supply unit 3. That is, the mounting part 4 of the mounting machine 100 is configured to pick up a chip component at the component supply position and to feed the next chip component to the component supply position along with this pickup. Note that the chip component supply unit 3 may be provided with a tray (not shown) on which a large package component such as a semiconductor package is placed instead of the tape feeder 161. In this case, the package part is picked up directly from the tray by the mounting unit 4.

  The mounting unit 4 mounts a bare chip or a chip component on the printed circuit board P, and has two head units (first head unit) that can move in the horizontal direction (XY direction) above the conveyor 2. 41, the second head unit 42) and driving means for individually driving them.

  The first head unit 41 can be moved only within this area, with the upstream area on the base 1 mainly including the first work position S1 as a movable area. On the other hand, the second head unit 42 is A downstream area on the table 1 that mainly includes the second work position S2 is set as a movable area and can move only within this area. The first head unit 41 (second head unit 42) includes two component mounting heads 41a and one camera 41b (two component mounting heads 42a and one camera 42b) arranged in the X-axis direction.

  The first head unit 41 (second head unit 42) mounts the chip component supplied by the tape feeder 161 on the printed circuit board P by adsorbing the chip component by the component mounting head 41a (42a). The bare chip taken out from the wafer W is sucked by the component mounting head 41a (42a) and mounted on the printed board P. As a result, both chip components such as transistors and capacitors and bare chips (bare chips) are mounted on the printed circuit board P. Further, the first head unit 41 (second head unit 42) has a fiducial mark (not shown) attached to the printed circuit board P by the camera 41b (42b) prior to mounting of the components on the printed circuit board P. By recognizing, the positional deviation of the printed circuit board P is recognized, and the positional deviation is corrected at the time of mounting.

  As shown in FIG. 3, the driving means of the first head units 41 and 42 includes support members 43 and 44 that support the first head unit 41 and the second head unit 42 so as to be movable in the X-axis direction, and a mounting machine. Fixed rails 45 and 46 which are provided on the ceiling 100a of the 100 and support the support members 43 and 44 separately so as to be movable in the Y-axis direction, and the first head unit 41 and the second head unit with respect to the support members 43 and 44 And a linear motor for moving the support members 43 and 44 separately in the Y-axis direction along the fixed rails 45 and 46, respectively. And a moving mechanism (not shown).

  Also, fixed cameras 9 and 10 for component recognition are installed on the base 1 and in the movable regions of the first head unit 41 and the second head unit 42, respectively. The fixed cameras 9 and 10 are cameras including an image sensor such as a CCD or a CMOS. The fixed cameras 9 and 10 take images of components sucked by the component mounting head 41a of the first head unit 41 and the component mounting head 42a of the second head unit 42 from below, and the image signals will be described later. This is output to the control device 11.

  Further, as shown in FIG. 1, a wafer storage part 170 in which the wafer W is stored can be detachably fixed to the central part on the front side of the mounting machine 100. Here, as shown in FIG. 4, the wafer storage unit 170 stores a plurality of diced wafers W. The wafer storage unit 170 includes a rack for storing a substantially annular holder Wh on which the wafer W is held in a plurality of upper and lower stages, and driving means for driving the rack up and down. The wafer storage unit 170 is arranged at a predetermined loading / unloading height position where a desired wafer W can be loaded / unloaded with respect to the wafer holding table 5 by raising / lowering the rack. Further, the wafer holding table 5 includes a wafer W loading / unloading mechanism (not shown). This loading / unloading mechanism is an arm that is configured to be movable back and forth (Y direction) with respect to the wafer holding table 5 and has a holder gripping mechanism at the tip. The loading / unloading mechanism moves the wafer W (holder Wh) in the rack disposed at the loading / unloading height position from the wafer storage unit 170 to the wafer holding table with the wafer holding table 5 disposed at the wafer receiving position (see FIG. 2). The wafer W on the wafer holding table 5 can be accommodated (returned) in the rack.

  Each wafer W accommodated in the wafer accommodating portion 170 is stuck on a film-like wafer sheet so that the bare chip is face-up state (circuit formation surface (mounting surface with respect to the printed circuit board P) is upward). It is held by a holder Wh through this wafer sheet.

  The wafer holding table 5 has a circular opening at the center, and can hold the holder Wh so that the opening of the holder Wh that holds the wafer W and the opening of the wafer holding table 5 overlap. . Accordingly, it is possible to push up the bare chip from below the wafer holding table 5 by the push-up device 7 to be described later while the wafer W (holder Wh) is held on the wafer holding table 5.

  The wafer holding table 5 is configured to be movable in the Y direction on the base 1 between a component picking work position (see FIG. 1) and a wafer receiving position (see FIG. 2). Specifically, the wafer holding table 5 is movably supported by a pair of fixed rails 51 provided on the base 1 so as to extend in the Y-axis direction, and along the fixed rails 51 by a predetermined driving means. Moved. The drive means includes a ball screw shaft 52 extending in parallel with the fixed rail 51 and screwed into the nut portion of the wafer holding table 5, and a drive motor 53 for driving the ball screw shaft 52 to rotate. As shown in FIG. 3, the wafer holding table 5 passes through a position below the conveyor 2 and is located between a predetermined part picking work position (see FIG. 1) and a wafer receiving position (see FIG. 2) near the wafer storage unit 170. Move between.

  The push-up device 7 lifts the bare chip to be picked up from the lower side of the wafer W on the wafer holding table 5 arranged at the component picking work position, thereby lifting the bare chip from the wafer sheet. It is.

  The thrust device 7 includes a thrust head 71 including a pair of small-diameter thrust rods (referred to as a first thrust rod 71a and a second thrust rod 71b) each incorporating a thrust pin (not shown). It includes a fixed rail 72 that supports the base 1 so as to be movable in the X-axis direction, and drive means for moving the push-up head 71 along the fixed rail 72. The drive means includes a ball screw shaft (not shown) that extends in parallel with the fixed rail 72 and is screwed into the push-up head 71, and a push-up head drive motor (not shown) for rotationally driving the shaft. . By configuring the push-up device 7 to be movable in the X direction, the push-up head 71 can push up an arbitrary bare chip with respect to the wafer W supported on the wafer holding table 5 movable only in the Y direction. It is possible.

  The first push-up rod 71a and the second push-up rod 71b of the push-up head 71 extend in the vertical direction and are individually driven up and down by an actuator (such as an air cylinder) not shown. That is, in a state where the first push-up rod 71a or the second push-up rod 71b is arranged inside the opening of the wafer holding table 5, the first push-up rod 71a or the second push-up rod 71b is the wafer sheet. After being driven up to a substantially contacting position on the lower side and then positioned at the desired position in the XY direction of the bare chip, a push-up pin is driven by a drive motor (not shown) from the first push-up rod 71a or the second push-up rod 71b. ) To lift the bare chip. The first push-up rod 71a and the second push-up rod 71b can change the thickness of the push-up pin in accordance with the size of the part to be pushed up. For example, by attaching different push-up pins to the first push-up rod 71a and the second push-up rod 71b, the first push-up rod 71a or the second push-up rod 71b can be used properly depending on the size of the parts. Can be used.

  The first push-up rod 71a and the second push-up rod 71b can be driven up and down to a two-stage height position. That is, in order to avoid interference with the wafer holding table 5 when the wafer holding table 5 is moved between the part picking work position (see FIG. 1) and the wafer receiving position in the vicinity of the wafer storage unit 170 (see FIG. 2). Up and down between the lowermost position and the push-up standby position located in the vicinity of the lower surface of the wafer W inside the opening of the holder Wh with the wafer holding table 5 positioned at the component picking work position (see FIG. 1). The push-up pins can be driven, and the push-up pin has a position built into the first push-up rod 71a or the second push-up rod 71b at the standby position and a component push-up position positioned above the upper surface of the wafer holding table 5. Can be driven up and down.

  The take-out device 6 sucks the bare chip pushed up by the push-up device 7 and delivers it to the first head unit 41 and the second head unit 42.

  The take-out device 6 is moved in the horizontal direction (XY direction) at a position above the part take-out work position by a predetermined driving means. This driving means has the following configuration.

  That is, a pair of elevated fixed rails 61 arranged at predetermined intervals in the X-axis direction and extending in parallel with each other in the Y-axis direction, and both ends thereof are movably supported on the fixed rails 61 at the part extraction work position. A pair of frame members 62 extending in the X-axis direction and a pair of screws disposed in positions close to the fixed rail 61 and extending in the Y-axis direction and screwed into nut members (not shown) at both ends of the frame member 62. A ball screw shaft 63 and a pair of frame drive motors 64 that rotationally drive the ball screw shaft 63 are provided.

  The frame member 62 is provided with a first rail (not shown) fixed to the front side and extending in the X-axis direction, and a second rail (not shown) fixed to the rear side and extending in the X-axis direction. Yes. The take-out device 6 is movably supported on the first rail, and the camera 8 is movably supported on the second rail. A ball screw shaft (not shown) extending in the X-axis direction and screwed into the nut member (not shown) of the take-out device 6 is inserted into the frame member 62, and a drive motor 65 that rotationally drives the ball screw shaft. A ball screw shaft (not shown) that extends in the X-axis direction and is screwed into a nut member (not shown) of the camera 8 and a drive motor 66 that rotationally drives the ball screw shaft are provided. That is, the frame member 62 is moved along the fixed rail 61 by the operation of each frame drive motor 64, and the take-out device 6 and the camera 8 are integrally moved in the Y-axis direction as the frame member 62 moves. The frame member 62 is an example of the “first support member” in the present invention.

  The take-out device 6 is moved in the X-axis direction at a position on the front side in the Y direction of the frame member 62 by the operation of the drive motor 65, and the camera is moved at the position on the rear side in the Y direction of the frame member 62 by the operation of the drive motor 66. 8 is moved in the X-axis direction. As a result, the take-out device 6 and the camera 8 can be independently moved in the horizontal direction (XY direction) at a position above the part take-out work position.

  The movable area in the XY direction of the take-out device 6 and the movable areas in the XY direction of the first head unit 41 and the second head unit 42 partially overlap. As a result, the bare chip can be delivered from the take-out device 6 to the first head unit 41 and the second head unit 42 as will be described later. As shown in FIG. 3, the take-out device 6, the camera 8, and the driving means described above are positioned below the first head unit 41, the second head unit 42, and the driving means. Accordingly, the movable area of the take-out device 6 and the movable areas of the first head unit 41 and the second head unit 42 partially overlap as described above, but the take-out apparatus 6, the first head unit 41, and the second head. The units 42 do not interfere with each other.

  The take-out device 6 includes a pair of wafer heads (referred to as a first wafer head 6a and a second wafer head 6b).

  The first wafer head 6a and the second wafer head 6b are drum type heads. That is, the first wafer head 6a and the second wafer head 6b can be rotated about an axis parallel to the X-axis direction, and can be moved in the vertical direction (lifted / lowered). A bracket member 6d that is supported by the member 6c so as to be movable up and down, and a pair of nozzles 6e that are supported by the bracket member 6d so as to be rotatable about the X axis and that are provided inside the bracket members 6d. Have.

  The pair of nozzles 6e of the first wafer head 6a are provided at positions that are exactly upside down, and are provided so that the nozzle 6e on the other side faces directly above when the nozzle 6e on one side faces directly below. . The drive motors 6f (shown in FIGS. 4 and 6 and not shown in the other figures) provided on the outer sides of the bracket members 6d are rotationally driven, whereby the positions of the pair of nozzles 6e are alternately switched. Further, by driving a drive motor (not shown), the bracket member 6d is moved up and down with respect to the frame member 6c, and the entire first wafer head 6a including the nozzle 6e is moved up and down. The second wafer head 6b has the same configuration. As shown in FIG. 6, the distance D1 (the distance in the X-axis direction) between the nozzles 6e of the first wafer head 6a and the second wafer head 6b is a component mounting head 41a mounted on the first head unit 41. The distance D2 is equal to the distance D2 between the component mounting heads 42a mounted on the second head unit 42. As a result, the two component mounting heads 41a of the first head unit 41 or the two component mounting heads 42a of the second head unit 42 from the two wafer heads (the first wafer head 6a and the second wafer head 6b). At the same time, two bare chips can be delivered.

  The camera 8 is a camera including an image sensor such as a CCD or a CMOS. Prior to the removal of the bare chip from the wafer W, the camera 8 images the bare chip to be extracted and outputs the image signal to the control device 11. When the take-out device 6 delivers a component to the head unit, the take-out device 6 is moved to a position closest to the conveyor 2 (component delivery position Y1). At this time, as shown in FIG. 5, the position of the thrusting device 7 in the Y direction is determined so that the position Y2 of the camera 8 in the Y direction and the position of the thrusting device 7 in the Y direction overlap. As a result, after the next part is imaged in parallel with the part delivery operation, when the next part is taken out, the take-out device from the delivery of the part to the head unit until the next part is taken out. 6 can be minimized (from position Y1 to position Y2).

  FIG. 7 shows a control system of the mounting machine 100 in a block diagram. As shown in FIG. 7, the mounting machine 100 includes a control device 11 including a CPU, various memories, an HDD, and the like. The control device 11 includes the above-described drive motors and the like (drive motor 53, frame drive motor 64, drive motor 65, drive motor 66, drive motor 6f, other drive motors, and air for raising and lowering the first push-up rod 71a. The control valve drive solenoid in the air circuit to the cylinder and the second thrust rod 71a ascending / descending air cylinder), the camera 8, the fixed cameras 9 and 10 and the like are electrically connected to each other. It is controlled by the control device 11 in a centralized manner. Further, an input device (not shown) is electrically connected to the control device 11, and various types of information by the operator are input based on the operation of the input device, and are not shown. An output signal from position detection means such as an encoder is also input.

  As a functional element, the control device 11 includes a shaft control unit 11a that controls driving of the driving motors and driving solenoids of the control valves, and cameras (fixed cameras 9 and 10, cameras 41b and 42b, etc.). An image processing unit 11b that performs predetermined processing on an image signal, an I / O processing unit 11c that controls input of signals from a sensor (not shown), output of various control signals, and the like, and communication that controls communication with an external device It includes a control unit 11d, a storage unit 11e that stores various programs such as mounting programs and various data, and a main calculation unit 11f that performs overall control and executes various calculation processes.

  The control device 11 controls each drive motor and the like based on a predetermined program, whereby the conveyor 2, the wafer holding table 5, the take-out device 6, the push-up device 7, the first head unit 41, and the first head unit 41 2 The head unit 42 and the like are controlled. Thus, a series of operations (component mounting operation) such as loading / unloading of the wafer W into / from the wafer storage unit 170, removal of the bare chip from the wafer W, and mounting of components by the first head unit 41 and the second head unit 42 are executed.

  Next, the control of the component mounting operation by the control device 11 will be described with reference to FIG.

  First, in step S <b> 1, the control device 11 carries the printed board P into the mounting machine 100 by controlling the conveyor 2. And in step S2, the control apparatus 11 fixes the printed circuit board P in the state arrange | positioned in 1st work position S1 and 2nd work position S2 by controlling the conveyor 2. FIG.

  Thereafter, in step S <b> 3, the control device 11 pulls out the wafer W from the wafer storage unit 170 by controlling the wafer holding table 5. Specifically, the drive motor 53 is driven to move the wafer holding table 5 to the wafer receiving position (see FIG. 2). Then, the wafer W (holder Wh) is pulled out from the wafer storage unit 170 onto the wafer holding table 5 by a loading / unloading mechanism (not shown). In step S 4, the pulled wafer W is fixed to the wafer holding table 5. Thereafter, the wafer holding table 5 is controlled so as to be placed at the part picking work position (see FIG. 1).

  At this time, the control device 11 includes a push-up pin at the center of the first push-up rod 71a of the push-up head 71 in which the Y-direction position of the bare chip to be taken out of the bare chips in the wafer W can move in the X direction, and The wafer holding table 5 is moved so as to coincide with the position of the push-up pin at the center of the second push-up rod 71b in the Y direction.

  When the wafer W is placed at the component extraction work position, in step S5, the control device 11 controls the camera 8 to image the bare chip to be extracted. Specifically, the frame drive motor 64 is driven to move the frame member 62 in the Y-axis direction, and the drive motor 66 is driven to move the camera 8 in the X-axis direction. As a result, the camera 8 is arranged at a position above the bare chip to be taken out (sucking target). Then, the bare chip is imaged by the camera 8. The control device 11 obtains the position (position shift) of the bare chip based on this image data. In this case, the control device 11 causes the camera 8 to image a plurality of bare chips at once or continuously as necessary.

  Next, the control device 11 controls the push-up device 7, the take-out device 6 and the wafer holding table 5 on the basis of the imaging result by the camera 8, and the push-up pin of the push-up head 71, the nozzle 6 e of the take-out device 6, The bare chip to be taken out is moved to the same position on the XY plane. Specifically, the push-up head 71 is moved in the X-axis direction, and the drive motor 53 is driven to move the wafer holding table 5 in the Y-axis direction. As a result, the first push-up rod 71a or the second push-up rod 71b of the push-up head 71 is moved so that the center push-up pin is positioned below the bare chip to be taken out. The frame drive motor 64 is driven to move the frame member 62 in the Y-axis direction, and the drive motor 65 is driven to move the take-out device 6 in the X-axis direction. Thus, the first wafer head 6a or the second wafer head 6b is moved to a position above the bare chip.

  The control device 11 pushes up the bare chip from the lower side by raising (driving) the push-up pin from the first push-up rod 71a or the second push-up rod 71b according to the size of the component. At this time, a negative pressure is generated on the front end surface of the push-up rod 71a or 71b to suck and hold the wafer sheet to which the bare chip is attached, and the push-up pin is inserted from the center of the front end surface of the push-up rod 71a or 71b. Push up. On the other hand, the first wafer head 6a or the second wafer head 6b is lowered and the bare chip peeled off from the wafer sheet by being pushed up is adsorbed by the negative pressure at the tip of the nozzle 6e. Thereby, the bare chip is taken out from the wafer W. The bare chip is taken out from the wafer W as described above for each of the first wafer head 6a and the second wafer head 6b, and the bare chip is sucked and held by each nozzle 6e.

  Next, in step S7, the control device 11 delivers the bare chip from the take-out device 6 to the head unit. Specifically, the control device 11 controls the take-out device 6 to move the take-out device 6 to a predetermined component delivery position (position closest to the conveyor 2) and to control the mounting unit 4 to The one head unit 41 (or the second head unit 42) is moved to the component delivery position. Accordingly, the take-out device 6 and the first head unit 41 (or the second head unit 42) are arranged vertically at the component delivery position.

  During the movement until the take-out device 6 and the first head unit 41 (second head unit 42) are arranged at the component delivery position, the control device 11 rotates the first wafer head 6a and the second wafer head 6b, As a result, the bare chip adsorbed by each nozzle 6e is reversed (reversed to the face-down state), and then the two heads 41a or the second head unit 42 in which the first head unit 41 descends the bare chip. It is adsorbed by the two component mounting heads 42a lowered. As a result, the bare chip is delivered from the take-out device 6 to the first head unit 41 (second head unit 42).

  Next, in step S8, the control device 11 moves the first head unit 41 above the fixed camera 9 (the fixed camera 10 in the case of the second head unit 42), and removes the bare chip adsorbed by each component mounting head. While making a fixed camera image, the adsorption | suction deviation | shift of the bare chip with respect to each component mounting head is calculated based on the image data.

  Next, in step S <b> 9, the control device 11 uses the camera 41 b (42 b) of the first head unit 41 (second head unit 42) to perform the fiducial attached to the printed circuit board P fixed to the conveyor 2. Recognizes a mark (not shown). Thereby, the control apparatus 11 recognizes the position shift with respect to the conveyor 2 of the printed circuit board P. FIG.

  In step S <b> 10, the control device 11 moves the first head unit 41 (second head unit 42) to the corrected position above the printed circuit board P based on the bare chip suction displacement and the printed circuit board P displacement. Then, the bare chip is mounted on the printed circuit board P by lowering the component mounting head at a predetermined mounting position.

  Thereafter, in step S11, the control device 11 determines whether or not all bare chips have been mounted. If the bare chip to be mounted still remains, the process returns to step S5 to continue the mounting operation.

  Further, when all the bare chips have been mounted, the control device 11 releases the fixation of the printed circuit board P by controlling the conveyor 2 in step S12. In step S <b> 13, the control device 11 carries the printed circuit board P out of the mounting machine 100 by controlling the conveyor 2.

  Although the control of the component mounting operation by the control device 11 has been described above, the control shown in this flowchart is the most basic control example of the component mounting operation when only the bare chip is mounted. That is, at the time of actual production of the printed circuit board P, in order to produce the printed circuit board P more efficiently, the control device 11 performs the wafer W loading / unloading operation by the wafer holding table 5 and the bare chip by the unloading device 6 and the push-up device 7. A part of a plurality of operations such as a take-out operation and a head unit mounting operation are executed in parallel. In particular, in the first embodiment, when the bare chip is delivered from the take-out device 6 to the head unit, or when the bare chip is mounted on the printed circuit board P by the head unit, the next mounting component is imaged by the camera 8 in parallel. Is going. Further, when the bare chips are sequentially mounted on the plurality of printed circuit boards P, the process returns from step S13 to step S1 and the next printed circuit board P is loaded and step S2 is performed. Steps S3 and S4 are skipped if there is a bare chip remaining.

  In the first embodiment, as described above, the wafer holding table 5 movable in the Y direction with respect to the base 1, the push-up device 7 movable in the X direction with respect to the base 1, and the base 1 By providing the take-out device 6 movable in the X direction, the take-up device 7 and the take-out device 6 can be moved in the X direction without moving the wafer holding table 5 in the X direction. The target bare chip can be aligned with the push-up device 7 and the take-out device 6. Thereby, since it is not necessary to move the wafer holding table 5 having a relatively large plane area in the X direction with respect to the push-up device 7 and the take-out device 6, it is possible to suppress the apparatus from becoming large in the X direction. it can.

  Further, in the first embodiment, as described above, the take-up device 7 and the take-out device 6 are fixed by configuring the take-out device 6 to be movable relative to the push-up device 7 in the Y direction. Unlike the case, the positions of the push-up device 7 and the take-out device 6 can be finely adjusted. Thereby, since position shift with the pushing-up apparatus 7 and the taking-out apparatus 6 at the time of picking up a component can be suppressed, it can suppress that the adsorption | suction defect of components arises.

  In the first embodiment, the wafer holding table 5 is configured to be movable in the Y direction, and the camera 8 is configured to be movable in the Y direction. Accordingly, when the camera 8 and the bare chip to be taken out are aligned in order to take an image of the bare chip to be taken out, both the wafer holding table 5 and the camera 8 are moved so as to approach each other. It can be performed. Thus, as compared with the case where only the wafer holding table 5 is moved and the camera 8 and the bare chip to be taken out are aligned as in the case where the wafer imaging camera is fixed in the Y direction, the position can be shortened. Can be combined.

In the first embodiment, as described above, the take-out device 6 is configured to be movable in the Y direction, and the push-up device 7 is fixed in the Y direction. By configuring in this way, by moving the take-out device 6 in the Y direction, it is possible to align the push-up device 7 and the take-out device 6 for performing the take-out operation.
Further, by fixing the push-up device 7 in the Y direction, the device can be made inexpensive.

  In the first embodiment, as described above, the camera 8 and the take-out device 6 are attached to the base 1 by attaching the camera 8 and the take-out device 6 to the frame member 62 that can move in the Y direction. It is configured to be movable in the direction. With this configuration, the camera 8 and the take-out device 6 can be easily moved in the XY directions using the single frame member 62.

  In the first embodiment, as described above, in parallel with the delivery from the bare chip take-out device 6 to the head unit, or in parallel with the mounting of the bare chip on the printed circuit board P by the head unit, the wafer holding table By performing imaging of the bare chip to be mounted next held by the camera 8 with the camera 8, the total time required for imaging of the next wafer part and mounting of the previous part or delivery of the wafer part can be shortened.

(Modification of the first embodiment)
In the first embodiment, the example in which one first head unit 41 and one second head unit 42 corresponding to the first work position S1 and the second work position S2 are provided is described. Like the mounting machine 200 according to the modified example of the first embodiment, the first work position S1 and the second work position S2 are associated with each other by one head unit 202 that is movably supported by the frame member 201 extending in the X direction. Also good.

  In the first embodiment, the take-out device 6 is configured to be movable in the Y direction, and the push-up device 7 is fixed in the Y direction. However, the take-out device 6 is fixed in the Y direction, and the push-up device is fixed. 7 may be configured to be movable in the Y direction. Thus, by moving the push-up device 7 in the Y direction, the push-up device 7 for performing the take-out operation can be aligned with the take-out device 6, and by fixing the take-out device 6 in the Y direction The device can be made inexpensive. Further, both the take-out device 6 and the push-up device 7 may be configured to be movable in the Y direction. Efficiency can be improved by various ways of moving the wafer holding table 5 in the Y direction.

(Second Embodiment)
Next, a mounting machine 300 according to the second embodiment of the present invention will be described with reference to FIG. In the second embodiment, unlike the first embodiment, an example in which two take-out devices are provided will be described.

  In the second embodiment, as shown in FIG. 10, two take-out devices (a first take-out device 301 and a second take-out device 302) are provided. Both the first take-out device 301 and the second take-out device 302 are supported by a fixed rail that is fixed to the front side of the frame member 62 and extends in the X-axis direction.

  Then, a ball screw shaft (not shown) extending in the X-axis direction and a first screw screwed to the ball screw shaft and fixed to the first take-out device 301 and fixed in the axial direction are attached to the frame member 62. A nut member (not shown) and a ball screw shaft pass therethrough, the first nut member is driven to rotate, and the first hollow motor (not shown) attached to the first take-out device 301 is screwed onto the ball screw shaft. And a second nut member (not shown) which is rotatably attached to the second take-out device 302 and fixed in the axial direction, and the ball screw shaft penetrates and the second nut member is driven to rotate, and 2 is provided with a second hollow motor (not shown) attached to the take-out device 301. That is, the first hollow motor is actuated to move the first take-out device 301 in the X-axis direction at a position on the near side of the frame member 62, and the second hollow motor is actuated on the position on the near side of the frame member 62. The second extraction device 302 is moved in the X-axis direction. Thereby, the 1st taking-out apparatus 301 and the 2nd taking-out apparatus 302 can move to a horizontal direction (XY direction) in the upper position of a component taking-out operation position.

  The first take-out device 301 delivers a bare chip to the first head unit 41, and the second take-out device 302 delivers a bare chip to the second head unit 42. Other configurations of the mounting machine of the second embodiment are the same as those of the first embodiment.

  In the second embodiment, as described above, by providing the first take-out device 301 corresponding to the first head unit 41 and the second take-out device 302 corresponding to the second head unit 42, two head units and 2 Since the number of wafer parts delivered can be increased by one take-out device, the time required for delivery of the wafer parts can be shortened.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

(Third embodiment)
Next, a mounting machine 400 according to a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, unlike the first embodiment, an example in which the component position recognition camera 401 and the take-out device 402 are configured to be movable independently in the Y direction will be described.

  In the third embodiment, as shown in FIGS. 11 and 12, the camera 401 and the take-out device 402 are supported by separate frame members (frame member 403 and frame member 404), respectively. Specifically, a frame member 403 extending in the X-axis direction and a frame member 404 extending in the X-axis direction are movably supported on a pair of elevated fixed rails 61 extending in the Y-axis direction. Also, a ball screw shaft 405 that is disposed at a position close to one fixed rail 61 and extends in the Y-axis direction and is screwed into a nut portion of the frame member 403, and a frame that rotationally drives the ball screw shaft 405 A ball screw shaft 407 that is disposed near the drive motor 406 and the other fixed rail 61, extends in the Y-axis direction, and is screwed into a nut portion of the frame member 404, and rotates the ball screw shaft 407. A frame drive motor 408 for driving is provided. The ball screw shaft 405 is not screwed with the frame member 404, and the ball screw shaft 407 is not screwed with the frame member 403. Accordingly, only the frame member 403 can be moved in the Y direction by driving the frame drive motor 406, and only the frame member 404 can be moved in the Y direction by driving the frame drive motor 408. The frame member 403 and the frame member 404 are examples of the “third support member” and the “second support member” in the present invention, respectively. The camera 401 is an example of the “imaging device” in the present invention.

  The frame member 403 includes a ball screw shaft (not shown) that extends in the X-axis direction and is screwed into the camera 401, and a drive motor 409 that rotationally drives the ball screw shaft. The frame member 404 is provided with a ball screw shaft (not shown) that extends in the X-axis direction and is screwed into the take-out device 402, and a drive motor 410 that rotationally drives the ball screw shaft. As a result, the camera 401 and the take-out device 402 can move independently in the horizontal direction (XY direction) above the part take-out work position.

  In the third embodiment, after the bare chip is recognized by the camera 401, when the bare chip is taken out by the take-out device 402, the take-out device 402 needs to be moved onto the bare chip to be taken out after the camera 401 escapes in the Y direction. . Other configurations of the mounting machine 400 of the third embodiment are the same as those of the first embodiment.

  In the third embodiment, since the camera 401 and the take-out device 402 can be independently moved in the XY directions, a component delivery operation from the take-out device 402 to the head unit and a component imaging operation by the camera 401 are performed. Can easily be done in parallel.

  The remaining effects of the third embodiment are similar to those of the aforementioned first embodiment.

(Modification of the third embodiment)
In the third embodiment, the example in which the height positions of the camera 401, the frame member 403, the take-out device 402, and the frame member 404 overlap is described. However, as in the modification of the third embodiment shown in FIG. You may arrange | position so that the height position of the frame member 403 may not overlap with the height position of the taking-out apparatus 402 and the frame member 404. FIG. In this case, after the bare chip is recognized by the camera 401, when the bare chip is taken out by the take-out device 402, the take-out device 402 can be moved onto the bare chip to be taken out without missing the camera 401 in the Y direction. Furthermore, since the frame member 403 can be fixed to the base 1 and the camera 401 can be fixed in the Y direction, the ball screw shaft 405 and the frame drive motor 406 are not required, and the cost can be reduced.

(Fourth embodiment)
Next, with reference to FIGS. 14 and 15, a mounting machine 500 according to a fourth embodiment of the present invention will be described. In the fourth embodiment, unlike the third embodiment, an example in which the take-out device 501 is fixed in the Y direction and the push-up device 502 is movable in the Y direction will be described.

  In the fourth embodiment, as shown in FIGS. 14 and 15, the part position recognition camera 503 is movable in the XY direction, while the take-out device 501 is attached to the conveyor 2 so as to be movable in the X direction. ing. Specifically, the frame member 504 is movably supported on a pair of fixed rails 61 extending in the Y-axis direction and extends in the X-axis direction, and is disposed at a position close to each fixed rail 61 and extends in the Y-axis direction. In addition, a pair of ball screw shafts 63 that are screwed into nut portions of the frame member 62 and a pair of frame drive motors 64 that rotationally drive the ball screw shafts 63 are provided. The frame member 504 is provided with a ball screw shaft (not shown) that extends in the X-axis direction and is screwed into the camera 503, and a drive motor 505 that rotationally drives the ball screw shaft. The camera 503 can be moved in the XY directions by driving the frame drive motor 64 and the drive motor 505. The camera 503 is an example of the “imaging device” in the present invention.

  A ball screw shaft (not shown) that extends in the X-axis direction and is screwed into the take-out device 501 and a drive motor (not shown) that rotationally drives the ball screw shaft are provided on the side surface of the conveyor 2. It has been. With this configuration, the take-out device 501 is fixed in the Y direction and movable in the X direction.

  In the fourth embodiment, the push-up device 502 is configured to be movable in the XY directions on the base 1. Specifically, as shown in FIG. 15, a fixed rail 507 that extends on the base 1 in the Y direction, extends in the X direction, and supports the frame member 506 so as to be movable in the Y direction, and the frame member 506 is fixed rail. Drive means for moving in the Y direction along 507, a fixed rail (not shown) for supporting the thrust device 502 so as to be movable in the X-axis direction on the frame member 506, and the thrust device 502 as a fixed rail Drive means for moving in the X direction along. These drive means include a ball screw shaft (not shown) that extends in parallel with the fixed rail and is screwed into the frame member or the push-up head, and a push-up head drive motor (not shown) for rotationally driving them. Including.

  The effect of the fourth embodiment is the same as that of the first embodiment.

(Fifth embodiment)
Next, a mounting machine according to a fifth embodiment of the present invention will be described with reference to FIG. In the fifth embodiment, unlike the third embodiment, an example in which the take-out device 601 and the push-up device 602 are fixed in the Y direction will be described.

  In the fifth embodiment, as in the fourth embodiment, the take-out device 601 is attached to the conveyor 2 so as to be fixed in the Y direction (the same position as the position Y1 in the first embodiment) and moved in the X direction. It is configured to be possible. Further, the push-up device 602 is attached to the base 1 below the take-out device 601 (position Y1). As with the first embodiment, the push-up device 602 is configured to be fixed in the Y direction and movable in the X direction.

  In the fifth embodiment, at least one of the positions in the Y direction of the take-out device 601 and the push-up device 602 can be manually finely adjusted.

  In the fifth embodiment, as described above, the push-up device 602 and the take-out device 601 are fixed at the same position in the Y direction. Therefore, the push-up device 602 and the take-out device 601 for performing the take-out operation are used. There is no need to align the position. Further, when the Y-direction positions of the push-up device 602 and the take-out device 601 are shifted due to the passage of time or the like, it can be manually adjusted to be the same.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to fifth embodiments, an example in which one push-up device is provided has been described. However, the present invention is not limited to this, and two push-up devices may be provided.

  In the first to fifth embodiments, the example in which the bare chip is adsorbed to the head unit via the take-out device has been described. However, the present invention is not limited to this, and the nozzle of the head unit is a wafer on the wafer holding table. By being configured to be accessible up to W, the head unit may be configured to be able to directly attract the bare chip without going through the take-out device. In other words, in accordance with the type of bare chip, the bare chip is mounted on the head unit in a face-down state via the take-out device, or the bare chip is directly attached in the face-up state and mounted without using the take-out device. .

  In this case, when the movable range in the Y direction of the head unit is extended to the vicinity of the conveyor 2 as in the first to fifth embodiments, the push-up device is installed in the vicinity of the conveyor 2 or the push-up is performed. The apparatus needs to be configured to be movable in the Y direction so as to be movable in the vicinity of the conveyor 2. In addition, even when the lifting device is fixed in the Y direction at the component extraction work position as in the first embodiment, the head unit can be expanded by extending the movable range of the head unit in the Y direction to the component extraction operation position. However, the bare chip can be directly adsorbed without using the take-out device.

  Moreover, in the said 3rd Embodiment and its modification, the example which supported the frame member 403 and the frame member 404 so that a movement was possible to the same fixed rail was shown, but this invention is not limited to this, The frame member 403 and The frame member 404 may be movably supported on a separate fixed rail.

  Further, in the first embodiment, as shown in FIG. 5, when the take-out device 6 delivers parts to the head unit, the position Y2 of the camera 8 in the Y direction and the position of the push-up device 7 in the Y direction are determined. Although the push-up device 7 is disposed so as to overlap (fixed in the Y direction), the present invention is not limited to this. That is, the push-up device 7 may be arranged (fixed in the Y direction) between the position Y1 in the Y direction of the take-out device when parts are delivered and the position Y2 in the Y direction of the camera 8 at that time. In this case, after the next part is imaged in parallel with the part delivery operation, the take-out device and the wafer holding table (part to be taken out) are brought close to each other when the next part is taken out. Can be moved in the Y direction and aligned above the thrusting device. As a result, the time from delivery of a part to the head unit to removal of the next part can be further shortened. When the moving speed of the take-out device in the Y direction is equal to the moving speed of the wafer holding table, the push-up device is arranged in the middle between the position Y1 and the position Y2 (fixed in the Y direction). When the moving speed of the extracting device in the Y direction is smaller than the moving speed of the wafer holding table, the push-up device is moved closer to the position Y1 than the middle between the position Y1 and the position Y2 according to the speed difference.

  Moreover, although the said 4th Embodiment and 5th Embodiment demonstrated the example which fixed the taking-out apparatus to the conveyor 2, this invention is not restricted to this, You may be fixed to the base 1 grade | etc.,. In order to reduce the amount of movement of the head unit in the Y direction when receiving parts, the position in the Y direction for fixing the take-out device is preferably in the vicinity of the conveyor 2.

  In the first to fifth embodiments, the example in which the wafer holding table, the take-out device, the push-up device, the camera for recognizing the component position, and the like are driven using the ball screw is shown, but the present invention is not limited to this. Alternatively, other drive mechanisms such as a linear motor may be used. Further, although an example in which the head unit is driven using a linear motor has been shown, the present invention is not limited to this, and the head unit may be driven using a ball screw.

DESCRIPTION OF SYMBOLS 1 Base 2 Conveyor 4 Mounting part 5 Wafer holding table 6,402,501,601, Unloading device 7,502,602 Pushing device 8,401,503 Camera (imaging device)
41 First head unit (mounting head)
42 Second head unit (mounting head)
62 Frame member (first support member)
202 Head unit 403 Frame member (second support member)
404 Frame member (third support member)
301 First take-out device (take-out device)
302 Second take-out device (take-out device)
100, 200, 300, 400, 500 Mounting machine P Printed circuit board (board)

Claims (9)

The base,
A wafer holding table configured to hold wafer parts and movable in the Y direction in a horizontal plane with respect to the base;
A push-up device having a mechanism for pushing up a wafer part held by the wafer holding table from below, and capable of moving at least in the X direction perpendicular to the Y direction in a horizontal plane with respect to the base;
A take-out device having a mechanism for adsorbing the wafer component pushed up by the push-up device and movable in at least the X direction with respect to the base;
A mounting machine comprising: a head unit that receives the wafer component from the take-out device and mounts the wafer component on a substrate.   2. The mounting according to claim 1, wherein one of the push-up device and the take-out device is movable in the Y direction, and the other of the push-up device and the take-out device is fixed in the Y direction. Machine. An imaging device having a mechanism for imaging a wafer part held on the wafer holding table and movable in at least the X direction with respect to the base;
A first support member movable in the Y direction with respect to the base,
The imaging device and the take-out device are attached to the first support member movable in the Y direction so as to be movable in the X direction, whereby the X direction and the Y direction with respect to the base. The mounting machine according to claim 1, wherein the mounting machine is configured to be movable in a direction. A mechanism for imaging a wafer part held on the wafer holding table, further comprising an imaging device movable in at least the X direction with respect to the base;
The imaging device is held on the wafer holding table in parallel with the delivery of the wafer component from the take-out device to the head unit or in parallel with the mounting of the wafer component on the substrate by the head unit. The mounting machine according to claim 1, wherein the mounting machine is configured to image the wafer part to be mounted next. An imaging device having a mechanism for imaging a wafer part held on the wafer holding table and movable in at least the X direction with respect to the base;
A second support member movable in the Y direction along a predetermined rail with respect to the base;
The take-out device is movable in the X direction and the Y direction with respect to the base by being attached to the second support member movable in the Y direction so as to be movable in the X direction. The mounting machine according to claim 1, wherein the mounting machine is configured as follows. A third support member movable in the Y direction along the predetermined rail with respect to the base;
The imaging device is movable in the X direction and the Y direction with respect to the base by being attached to the third support member movable in the Y direction so as to be movable in the X direction. The mounting machine according to claim 5, which is configured as follows. Further comprising a conveyor that extends in the X direction and conveys the substrate;
The take-out device is attached to the conveyor so as to be movable in the X direction with respect to the base.
The mounting device according to claim 1, wherein the push-up device is configured to be movable in the X direction and the Y direction with respect to the base. Further comprising a conveyor that extends in the X direction and conveys the substrate;
The take-out device is attached to the conveyor so as to be movable in the X direction at a predetermined position in the Y direction with respect to the base.
The push-up device is configured to be movable in the X direction with respect to the base at a predetermined position in the Y direction,
The mounting machine according to claim 1, wherein a relative position in the Y direction between the take-out device and the push-up device is configured to be manually adjustable. The head unit includes a first head unit movable in the X direction and the Y direction, and a second head unit movable in the X direction and the Y direction independently of the first head unit. ,
The mounting apparatus according to claim 1, wherein the take-out device includes a first take-out device corresponding to the first head unit and a second take-out device corresponding to the second head unit. .

Images