JP4672541B2 - Component transfer device and surface mounter - Google Patents

Description

  The present invention relates to a component transfer device suitable for a surface mounter and the like configured to suck and convey an electronic component such as an IC, and a surface mounter including the component transfer device. .

  2. Description of the Related Art Conventionally, a surface mounting machine in which a component is taken out from a component supply unit by a movable head having a component suction nozzle at the tip, and the component is transported and mounted on a substrate such as a printed circuit board is generally known. (For example, Patent Document 1).

In this type of surface mounter, component feeders such as a tape feeder that supplies chip components using a tape as a carrier and a tray feeder that supplies package components such as QFP arranged on a tray are arranged in the component supply unit. At the time of picking up the components, after the head moves above them, the lifting and lowering operation is performed to pick up and pick up the components.
JP-A-11-103195

  By the way, supply parts by tray feeders are required to supply thicker (higher) parts with the recent diversification of mounted parts, and the following problems arise. . That is, when removing a part from the tray feeder, in order to avoid interference with other parts in the tray or partition walls in the tray, the suction part is sufficiently lifted with respect to the tray after the part is sucked. It is required to move in the horizontal direction from the above, but when taking out such a tall component as described above, it is necessary to raise and lower the head by that much, so for a board that mounts many tall components The tact time is delayed as much as the head is frequently required to be moved up and down.

  It is also conceivable that a part having a length higher than the head lifting stroke cannot be physically removed from the tray.

  The present invention enables a component mounted in a tray to be quickly removed and transferred to a target position in a surface mounter or the like, and a longer component can be removed from the tray. The purpose is to increase the degree of freedom regarding the types of parts.

In order to solve the above-described problems, the present invention includes a tray that includes an upper end surface and a concave portion for storing a component that is recessed downward from the upper end surface, and that holds the tray in which the component is stored at a predetermined height position. a holding portion, and a movable big one liftable head in a horizontal direction with respect to the tray holding unit includes a function of adsorbing the component, the component in the recess in the tray elevating of the head A component transfer apparatus that adsorbs and transfers to a target position, and includes a lifting and lowering unit that lifts and lowers the tray holding unit, and a tray lifting and lowering control unit that lifts and lowers the tray by driving and controlling the lifting and lowering unit. The raising / lowering control means (1) raises the tray from the predetermined height position during the lowering operation of the head for picking up the components, and (2) after raising the components, during the raising operation of the head. Lower the tray (3) The movement of the tray is switched from descending to ascending at the timing when the lower end of the attracting component comes out above the upper end surface of the tray as the head ascends after the component is attracted. Return to the vertical position (Claim 1).

According to this configuration, since the head and the tray move relatively in the direction of approaching each other at the time of picking up the components, compared with the case where only the head is lowered with respect to the tray and the components are taken out, The head can access the parts more quickly. On the other hand, after the component suction, in order to relatively move in a direction in which the head and the tray are spaced apart from each other, as compared with the case where only the head relative to the tray of the elevator, it is possible to take out from the fast component from the tray . In addition, since the substantial lifting stroke of the head with respect to the tray is increased, it is possible to easily take out a tall component from the tray.

In this case, after the component suction by the head, a head control means for the lower end of the suction part controls driving the head to move the head in a horizontal direction at a timing out above the upper surface of the tray (Claim 2 ).

  According to this configuration, it is possible to transfer the component to the target position as soon as possible after removing the component from the tray. In addition, in the case where components are sequentially removed from the tray while moving a plurality of heads integrally, it is possible to move to the operation of removing the next component as soon as possible after removing the component from the tray. .

On the other hand, the surface mounting machine according to the present invention is a surface mounting machine in which the component transfer device as described above is incorporated, and the tray of the component transfer device is used as a mounting head. A component is sucked from the tray held by the holding unit, and the component is mounted on the substrate set at the mounting work position as the target position (claim 3 ).

According to this surface mounter, the component is taken out from the tray and mounted on the substrate by the component transfer apparatus as described above. Therefore, a series of component mounting operations including removal of components from the tray is performed more quickly than when the components are removed from the tray and mounted on the substrate while raising and lowering only the head relative to the fixedly arranged tray. It becomes possible. In addition, since it is possible to take out a component having a higher length, it is possible to increase the degree of freedom regarding the type of mounted component.
In this case, the elevating / lowering control means takes the tray as a position where the height of the upper surface of the component housed in the tray is equal to the height of the mounted surface of the board set at the mounting work position. It is preferable that the door is moved up and down (claim 4).

  According to the component transfer apparatus of the present invention, for example, both the head and the tray move toward each other when the components are sucked, and both the head and the tray move away from each other after the components are sucked. On the other hand, it is possible to take out the component from the tray and transfer it to the target position more quickly than in the case of taking out the component by raising and lowering only the head. In addition, when both the head and the tray are moved away from each other after the components are attracted, the substantial lifting stroke of the head with respect to the tray becomes large. Can be taken out from. Therefore, according to the surface mounter according to the present invention in which such a component transfer apparatus is incorporated, a series of component mounting operations including taking out components from the tray can be performed more quickly. In addition, since it is possible to take out a component having a higher length, it is possible to increase the degree of freedom related to the type of mounted component.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter according to the present invention (a surface mounter incorporating a component transfer device according to the present invention), FIG. 1 is a perspective view, and FIG. 2 is a front view. Each figure shows a surface mounter.

  In these drawings, a substrate transporting conveyor 2 is disposed on a base 1 of a surface mounting machine (hereinafter abbreviated as a mounting machine). A printed circuit board P (hereinafter abbreviated as a board P) is disposed on the conveyor 2. ) Is transported, stopped at a predetermined mounting work position, and held by a substrate holding means (not shown). In the following description, the direction of the conveyor 2 is assumed to be the X-axis direction, the direction orthogonal to this on the horizontal plane is assumed to be the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis is assumed to be the Z-axis direction.

  On both sides of the conveyor 2, component supply units 4 and 5 for supplying components to be mounted on the substrate P are provided. Of these component supply units 4 and 5, a plurality of tape feeders 4 a are arranged in the X-axis direction in the component supply unit 4 located on the front side of the apparatus. Each tape feeder 4a is loaded with a tape that holds and holds small chip components such as ICs, transistors, capacitors, etc. wound around a reel, and the tape is fed from the reel to a component take-out portion at the tip of the feeder. The components are picked up by a head unit 6 which will be described later while intermittently feeding out.

  On the other hand, a tray feeder 5a is disposed in the component supply unit 5 located on the rear side of the apparatus. In the tray feeder 5a, a plurality of trays storing large-sized components such as QFP, BGA and other packaged electronic components or mounted connectors in a matrix are stored in the upper and lower multi-stages. The components stored in the tray are picked up by the head unit 6 while being pulled out. The specific configuration of the tray feeder 5a will be described in detail later.

  Above the base 1, a component mounting head unit 6 is further provided.

  The head unit 6 is movable in the X-axis direction and the Y-axis direction within a certain region so that the components can be sucked from the component supply units 4 and 5 and mounted on the substrate P. That is, the support member 11 of the head unit 6 is movably disposed on the rail 7 in the Y-axis direction on the base 1, and the head unit 6 is mounted on the support member 11 and the guide member 14 in the X-axis direction. It is supported so that it can move along. Then, a support member 11 is screwed and attached to a ball screw (not shown) driven by the Y-axis servo motor 9, whereby the support member 11 is moved in the Y-axis direction, while the X-axis servo motor 15 The head unit 6 is screwed and attached to the ball screw 13 to be driven, whereby the head unit 6 is configured to move in the X-axis direction.

  The head unit 6 is mounted with a plurality of mounting heads 20 for adsorbing components and mounting them on the substrate P. In this embodiment, six shaft-shaped mounting heads 20 are arranged in the X-axis direction. It is mounted in a line.

  These mounting heads 20 are connected to an elevating mechanism using a Z-axis servomotor 22 (see FIG. 4) as a drive source and connected to a rotating mechanism using an R-axis servomotor 24 (see FIG. 4) as a drive source. By these mechanisms, the head unit 6 is driven in the vertical direction (Z-axis direction) and around its own axis (R-axis direction), respectively.

  Further, a nozzle 21 for sucking components is provided at the tip of each mounting head 20. Each nozzle 21 is connected to a negative pressure supply means via a valve or the like not shown in the drawing, and when taking out the parts from each of the feeders 4a and 5a, the negative pressure is supplied to the tip of the nozzle 21 to thereby remove the parts. Adsorption is performed. The nozzle 21 is detachably attached to the mounting head 20, and other nozzles 21 having different tip shapes and sizes housed in nozzle stations (not shown) on the base 1 as required. Are automatically replaced.

  On the base 1, a component recognition camera 17 is further provided for recognizing an image of the suction state of the component by each mounting head 20. The component recognition camera 17 is provided in each of the component supply units 4 and 5 and immediately on the side of the conveyor 2. After the component suction, the head unit 6 is disposed at a predetermined imaging position above the component recognition camera 17. When this is done, the suction component by each mounting head 21 is imaged from below.

  FIG. 3 schematically shows a specific configuration of the tray feeder 5a. In this figure, the tray feeder 5 a has a tray storage box 30 and a loading / unloading device 32 for loading and unloading the tray T with respect to the tray storage box 30.

  The tray storage box 30 is provided with a plurality of upper and lower tray support portions for supporting the tray T storing components such as QFP so that the tray T can be pulled out, and the pallet 31 is supported on each tray support portion so that it can be pulled out to the conveyor 2 side. In addition, the tray T is placed on the pallets 31. The tray T is formed with a plurality of component storage recesses Tu (see FIG. 7A) in a matrix, and the components are stored in the component storage recesses Tu independently of each other.

  The loading / unloading device 32 includes a pulling mechanism 33a (corresponding to a tray holding portion according to the present invention) for pulling out the tray from the tray storage box 30, and an elevating mechanism 33b for moving the pulling mechanism 33a relative to the tray storage box 30. And.

  The drawer mechanism 33a includes a clamp 34 for grasping and pulling out the pallet 31, a pallet receiver 35 for receiving the pallet 31 being pulled out, and a table 36 for supporting them. The clamp 34 is supported so as to be movable in the Y-axis direction along a rail (not shown) fixed on the table 36, and is connected to an endless drive belt 38, and is a servo motor fixed on the table 36. The clamp 34 is configured to move back and forth in the Y-axis direction along the rail when the belt 38 revolves by driving 39 (referred to as a drawer motor 39). Although not shown in detail, the clamp 34 has a pair of clamp arms that can be opened and closed. By holding a hook (not shown) of the pallet 31 by these clamp arms, the pallet 31 can be taken in and out. It is configured to grip.

  On the other hand, the elevating mechanism 33b corresponds to the elevating means according to the present invention, and elevates and lowers the drawer mechanism 33a with respect to the base 1.

  The elevating mechanism 33b includes a guide column 41 that guides the table 36 in the Z-axis direction, a ball screw 42 that is provided in parallel to the guide column 41, and a servo motor 44 that rotates the ball screw 42 (called an elevating motor 44). The table 36 is slidably attached to the guide column 41, and a nut portion 46 provided on the table 36 is screwed to the ball screw 42. In other words, when the ball screw 42 is rotationally driven by the elevating motor 44, the elevating mechanism 33b moves up and down along the guide column 41 along with this rotation.

  With the above-described configuration, during the mounting operation, the tray T storing the mounted components is pulled out from the tray storage box 30 to the conveyor 2 side integrally with the pallet 31 by the drawing mechanism 33a, and the tray T is further moved by the operation of the lifting mechanism 33b. The head unit 6 is moved to a predetermined height position, thereby picking up the parts stored in the tray T.

  The mounting machine has a controller 50 as shown in FIG. 4 that controls the overall operation of the mounting machine.

  The controller 50 includes a CPU that executes logical operations, a ROM that stores various programs that control the CPU, a RAM that temporarily stores various data, an HDD, and the like. , Main control means 51, component related information storage means 52, image processing means 53, motor control means 54, external input / output means 55, and the like.

  The main control means 51 performs overall control of driving of the head unit 6 and the like in order to proceed with the mounting work according to a program stored in advance, and performs various arithmetic processes associated with the work. In particular, when taking out components from the tray feeder 5a, as will be described in detail later, after mounting the components, the mounting head 20 is raised, while the tray T (pallet 31) is lowered in parallel with this increase. The servomotors 44 and the like are driven and controlled via the motor control means 54. In the present embodiment, the main control means 51, the motor control means 54, and the like correspond to the head control means and the tray lifting / lowering control means according to the present invention.

  The component-related information storage means 52 stores various data related to the mounted component such as the shape, size, and supply form of the component, and information related to the tray T for supplying QFP and the like, for example, the depth of the concave portion Tu for storing the component. The main control means 51, when taking out the components from the tray feeder 5a, controls the mounting head 20 and the elevating mechanism 33b with the elevating stroke, speed, etc. suitable for the target components based on these information. Drive control.

  The image processing unit 53 performs predetermined image processing on an image captured by the component recognition camera 17, and the main control unit 51 recognizes the suction state of the component with respect to the mounting head 20 based on the image data. In addition, a correction amount related to the mounting position is calculated.

  The motor control means 54 drives and controls the X-axis, Y-axis, R-axis, and Z-axis servomotors 15, 9, 22, and 24 and operates the tray feeder 5 a to operate each mounting head 20. Accordingly, the drawer motor 39 and the lifting motor 44 are driven and controlled. Although not shown, each motor has a built-in rotational position information detecting means such as an encoder, and the motor control means 54 controls each motor based on information detected by the rotational position information detecting means. .

  The external input / output means 55 transmits and receives various signals to and from various devices attached to the mounting machine.

  Next, component mounting operation control by the controller 50 will be described with reference to the flowchart (main routine) of FIG.

  When the production of the substrate P is started, first, the conveyor 2 is driven to carry the substrate P into the apparatus from a loader (not shown) and positioned at the mounting work position (step S1).

  Then, the head unit 6 is moved to the component supply units 4 and 5, and components are taken out by the mounting heads 20 (step S2). Specifically, the head unit 6 is moved above the component supply units 4 and 5 and the predetermined mounting head 20 to which the component is to be sucked is moved up and down to suck the component from the tape feeder 4a or the tray feeder 5a. Let me pick you up. At this time, with respect to the tray feeder 5a, by pulling out the pallet 31 from the tray storage box 30 by driving the loading / unloading device 32, components can be adsorbed by the mounting head 20 in advance as shown by a two-dot chain line in FIG. The tray T is arranged at a position where The specific control of the component take-out operation will be described in detail later.

  When the suction of the components by all the mounting heads 20 is completed, the head unit 6 is moved above the component recognition camera 17 to pick up the picked-up components by the mounting heads 20, and the pick-up of each component is performed based on the image pickup result. The state is recognized (step S3).

  Next, after moving the head unit 6 onto the substrate P and disposing it above the first component mounting point, the suction component is mounted on the substrate P by moving the mounting head 20 up and down (step S4). When the first component is mounted in this way, the head unit 6 is moved to the next mounting point, so that the components attracted to each mounting head 20 are sequentially mounted on the substrate P. At this time, the suction component is accurately mounted on the mounting point by correcting the target movement position of the head unit 6 based on the recognition result in step S3.

  When the mounting of the suction components of each mounting head 20 is thus completed, it is determined whether or not all the components have been mounted on the board P (step S5). If NO is determined here, the process returns to step S2, the head unit 6 is moved to the component supply units 4 and 5, and each process of component suction, component recognition, and component mounting is repeatedly executed.

  On the other hand, when it is judged as YES at Step S5, conveyor 2 is driven and board P is carried out of the apparatus (Step S6). Thus, a series of component mounting processes for the board P is completed.

  FIG. 6 shows control in the case of taking out a component from the tray feeder 5a among the control of the component mounting processing control, specifically, the control of the component suction processing (step S2).

  First, the head unit 6 is moved above the tray T (pallet 31) pulled out from the tray storage box 30, and the mounting head 20 that performs component suction is positioned above the target component storage recess Tu (see FIG. Step S11). At this time, the tray T has a predetermined reference height position (hereinafter simply referred to as a reference position), for example, as shown in FIG. The substrate P is positioned so as to have a height substantially equal to the mounting surface of the substrate P (indicated by the symbol L in the figure).

  Returning to FIG. 6, the mounting head 20 is then lowered, the tip of the nozzle 21 is brought into contact with the component in the tray T, and the component is adsorbed. The mounting head 20 is stopped (steps S12 and S13).

  Thereafter, the mounting head 20 is raised, and the raising / lowering mechanism 33b is driven almost simultaneously with this to lower the tray T (step S14), thereby pulling the component upward from the component housing recess Tu. When the component is completely removed from the tray T, that is, when the lower surface of the component reaches above the upper end of the tray T (step S15) and there is no possibility of interference between the component and the tray T, the lifting mechanism 33b is driven. The tray T is raised by switching (step S16), and it is determined whether or not further parts are to be taken out from the tray T (step S17).

  If YES is determined here, the process proceeds to step S11 to move the head unit 6 above the next component housing recess Tu. If NO is determined, the process of the subroutine is terminated.

  FIG. 7 shows the operations of the mounting head 20 and the tray T based on the above-described control. This figure schematically shows the operation in the case where components are continuously taken out from the tray T.

  First, the mounting head 20 is lowered with respect to the tray T set at the reference position, and the components stored in the component storing recess Tu are sucked by the nozzle 21 (FIG. 7A).

  Thereafter, the mounting head 20 is raised, and at the same time, the tray T is lowered, whereby the component is taken out from the component housing recess Tu (FIG. 7B). That is, parts are removed from the tray T quickly by simultaneously moving the mounting head 20 and the tray T in the direction away from each other (opposite direction).

  Then, when the lower surface of the component is pulled upward from the upper end of the tray T, the movement of the tray T is switched to an increase at that timing, and the head unit 6 starts moving in the horizontal direction to suck the next component (see FIG. 7 (c)). When the tray T is reset to the reference position in this way, the component is picked up by the next mounting head 20 almost simultaneously (FIG. 7D).

  In the mounting machine according to the present invention as described above, large components such as QFP are supplied using the tray feeder 5a. After the components are attracted, the mounting head 20 and the tray T are moved away from each other as described above. As a result, it is possible to take out components from the tray T more quickly than in the conventional apparatus of this type in which the tray is fixedly arranged and only the mounting head is moved up and down. Therefore, it is possible to perform the mounting operation when mounting on the substrate P while taking out the components from the tray T more quickly, and accordingly, the tact time can be shortened as compared with the conventional apparatus.

  In particular, in the mounting machine of the above embodiment, when the lower surface of the component is positioned above the upper end of the tray T, the head unit 6 is moved in the horizontal direction at that timing. Compared with the case where the head unit 6 is moved in the horizontal direction after the 20 and the tray T are completely reset to the original positions, the next operation (adsorption of the next part or mounting of the adsorbed part) is quickly performed. Can do. Therefore, there is an advantage that the tact time can be effectively shortened.

  Further, in the mounting machine of the above embodiment, after the components are attracted, the mounting head 20 and the tray T are moved away from each other and the components are taken out from the tray T. The vertical stroke of the mounting head 20 becomes large. Therefore, even a component having a relatively high length (dimension in the take-out direction) can be taken out without providing a large lifting stroke of the actual mounting head 20. That is, the actual mounting stroke of the mounting head 20 (that is, the lifting stroke with respect to the head unit 6), which is a component having a longer height and cannot be taken out by a conventional device, is the mounting machine of the above embodiment. Accordingly, the mounting head 20 and the tray T can be removed without difficulty because they are moved in directions away from each other. In particular, in the above embodiment, the loading / unloading device 32 (lifting mechanism 33b) for loading and unloading the tray T with respect to the tray storage box 30 also serves as a means for lifting and lowering the tray T, compared to the size of the parts. The tray T can be moved sufficiently large in the Z-axis direction. For this reason, it is possible to take out a part having a considerably high length that cannot be handled only by the lifting stroke of the mounting head 20 from the tray T without difficulty, and as a result, the degree of freedom of the parts that can be mounted can be increased.

  The mounting machine described above is an example of a preferred embodiment of the surface mounting machine according to the present invention, and the specific configuration thereof can be appropriately changed without departing from the gist of the present invention. For example, the following configuration may be adopted.

  (1) In the mounting machine of the above-described embodiment, the tray T is lowered while the mounting head 20 is being lifted after the component is picked up. However, before the component is picked up, that is, while the mounting head 20 is being lowered. You may make it raise T. Specifically, as shown in FIG. 8, after the mounting head 20 is first placed on the tray T set at the reference position (FIG. 8A), the mounting head 20 is lowered, At the same time, the tray T is raised, so that the components stored in the component storing recess Tu are sucked by the nozzle 21 (FIG. 8B). Thereafter, the mounting head 20 is raised, and at the same time, the tray T is lowered, thereby taking out the component from the component storing recess Tu (FIG. 8C). When the component is pulled out until the lower surface of the component is positioned above the upper end of the tray T, the tray T is switched to the upper position at that timing, and the head unit 6 is moved in the horizontal direction to suck the next component. As a result, when the tray T is reset to the reference position, the next mounting head 20 is arranged above the next component housing recess Tu (FIG. 8D) substantially simultaneously. In this way, compared with the case where only the mounting head 20 is lowered with respect to the tray T and the components are taken out, it becomes possible to access the components in the component storage recess Tu more quickly. It becomes possible to take out components from the tray T even more quickly, and the tact time can be further reduced accordingly.

  (2) Since the mounting machine of the above embodiment includes the tray feeder 5a having the tray storage boxes 30 for storing the trays T in multiple upper and lower stages, the tray feeder 5a can be used as a means for raising and lowering the tray T when taking out components. The loading / unloading device 32 is also used. Of course, when the tray T is set on the base 1 alone without the tray storage box 30, a dedicated mechanism for raising and lowering the tray T is used. May be provided.

  (3) In the above embodiment, the surface mounter has been described as an application example of the component transfer apparatus according to the present invention (that is, the component transfer apparatus according to the present invention is configured by the mounting head 20, the tray feeder 5a, etc.). However, the component transfer device according to the present invention is naturally applicable to other devices.

  For example, the present invention can also be applied to a component supply device externally attached to a surface mounter, and FIG. 9 schematically shows an example of such a component supply device in a plan view. In addition, the code | symbol 1, 2, and P in the figure have each shown the base, the conveyor, and the board | substrate of the surface mounting machine similarly to the said embodiment.

  The component supply device TF shown in this figure has a tray storage box 60 and a loading / unloading device 62 (only a part of which is shown) configured similarly to the tray storage box 30 and the loading / unloading device 32 of the tray feeder 5a described above. Further, a take-out mechanism 64 for picking up components from the tray T pulled out by the take-out device 62 and a transport device 66 for further transporting the components taken out from the tray T to the mounting machine are provided.

  The take-out mechanism 64 includes a support member 68 that can move in the Y-axis direction along the rail 67, a head unit 69 that can move in the X-axis direction along the support member 68, and a head unit 69 that can be moved up and down. The suction head 70 is moved to an arbitrary position on the tray T by the operation of the support member 68 and the head unit 69 driven by a servo motor (not shown). A component is sucked and picked up from the storage recess Tu. On the other hand, the transport device 66 has a transport rail 72 in the X-axis direction that extends to a position where the end reaches the mounting machine, and a table 74 that moves along the rail 72 by driving a servo motor (not shown). .

  That is, the component supply device TF pulls out the tray T (pallet 61) stored in the tray storage box 60 by the loading / unloading device 62 and arranges it at a predetermined height position. It is configured to be taken out along with the raising / lowering operation of the suction head 70 and transferred onto the table 74 of the transport device 66, and further to move the table 74 to supply the component to the mounting machine side. When the components are picked up by the suction head 70 as described above, first, the suction head 70 is lowered to suck the components in the tray T, and then the suction head 70 is lifted, and at the same time, the tray T The suction head 70 and the taking in / out device 62 are driven and controlled so as to lower the position.

  According to such a component supply device TF, after the component suction, the suction head 70 and the tray T are moved away from each other, so that the component is quickly taken out from the tray T as in the mounting machine of the above embodiment. be able to. Therefore, it becomes possible to transfer the components from the tray T to the table 74 more quickly, and accordingly, the components can be efficiently supplied to the mounting machine. The component supply device TF may also raise the tray T during the lowering operation of the suction head 70 for component suction. According to this, the component is transferred from the tray T to the table 74. This can be done even more quickly.

It is a perspective view which shows the surface mounting machine (surface mounting machine with which the component transfer apparatus which concerns on this invention is mounted) which concerns on this invention. It is a front view of the surface mounter mainly showing the configuration around the head unit. It is a cross-sectional schematic diagram which shows the structure of a tray feeder. It is a block diagram which shows the structure of the controller of a surface mounter. It is a flowchart (main routine) which shows an example of mounting operation control by a controller. It is a flowchart (subroutine) which shows an example of mounting operation control by a controller. (A)-(d) is a schematic diagram which shows the adsorption | suction operation | movement of the components based on control of a controller. (A)-(d) is a schematic diagram which shows the modification of the adsorption | suction operation | movement of the components based on control of a controller. It is a top view which shows the other application example of the components transfer apparatus which concerns on this invention.

Explanation of symbols

4a Tape feeder 5a Tray feeder 6 Head unit 20 Mounting head 21 Nozzle 30 Tray storage box 31 Pallet 32 Loading / unloading device 33a Drawer mechanism 33b Elevating mechanism P Printed circuit board T Tray Tu Recess for storing parts

Claims (4)

It has an upper end surface and a concave portion for storing components recessed downward from the upper end surface, and has a tray holding portion for holding a tray storing the components in the concave portion at a predetermined height position, and a function of sucking the components. and a movable big one liftable head in a horizontal direction with respect to the tray holding unit, component transfer for transferring the parts in recesses in the tray with the lifting adsorbed to the target position of the head Mounting device,
And elevating means for elevating the tray holding unit, and a tray elevation control means for elevating the tray by driving and controlling the lifting means,
The lift control means (1) raises the tray from the predetermined height position during the lowering operation of the head for picking up the components, and (2) the tray during the raising operation of the head after picking up the components. (3) At the timing when the lower end portion of the suction component comes out above the upper end surface of the tray in accordance with the raising operation of the head after the component suction, the movement of the tray is switched from the lowering to the rising state. Returning to the predetermined height position, the component transfer apparatus characterized by the above-mentioned . The component transfer apparatus according to claim 1,
After the component is picked up by the head, there is provided a head control means for driving and controlling the head so as to move the head in the horizontal direction at a timing when the lower end portion of the sucked component comes out above the upper end surface of the tray. A parts transfer device. A surface mounter in which the component transfer device according to claim 1 or 2 is incorporated,
The component transfer device head is used as a mounting head, and the component is sucked from the tray held by the tray holding unit by the mounting head, and the component is set as a target position on the substrate set at the mounting work position. A surface mounter configured to be mounted on the surface. In the surface mounting machine according to claim 3,
The raising / lowering control means raises and lowers the tray with the position where the height of the upper surface of the component housed in the tray and the height of the mounted surface of the substrate set at the mounting work position are equal to the predetermined height position. A surface mounting machine characterized by that.

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