JP2005347317A - Component supplying apparatus and mounting machine having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component supplying apparatus that can reliably pick up electronic components and can stably supply them to a mounting machine body. <P>SOLUTION: The component supplying apparatus supplies the electronic components to the mounting machine body 10 for mounting the electronic components on a substrate. The component supplying apparatus comprises an accommodation section 60 for accommodating a component tray 51 for accommodating the electronic components; a component leading mechanism 70 for leading the component tray 51 from the accommodation section 60 to a pickup region; and a component transfer mechanism 80 for transferring the electronic components in a component tray at the pickup region to a component supply position for passing the electronic components to the mounting machine body 10. The component transfer mechanism 80 comprises a transfer head 851 for picking up the electronic components from the component tray 51 at the pickup region; and a transfer head travel mechanism for moving the transfer head 851 that has picked up the electronic components to a component supply position. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component supply device such as a tray feeder for supplying an electronic component to a mounting machine body for mounting the electronic component on a substrate to be mounted, and a mounting machine including the same.

  2. Description of the Related Art Conventionally, as a device that supplies components to a mounting machine that mounts electronic components on a printed circuit board, a component supply device that can arrange component trays that hold electronic components in a plurality of upper and lower stages is generally known.

  For example, the component supply apparatus disclosed in Patent Document 1 is provided with a transfer shuttle unit (guide rail) that communicates with the mounting machine body, and a component receiver (shuttle) is provided on the guide rail so as to run freely. The component supply device mounts the electronic component by sucking and holding the electronic component in the component tray by the transfer head, transferring it onto the shuttle, and running the shuttle along the guide rail toward the mounting machine body. It is supplied to a predetermined position of the machine body.

In such a component supply apparatus, in order to stabilize the electronic components on the shuttle, for example, the shuttle is provided with suction holding means by air suction or the like, and the lower surface of the electronic component is sucked by the suction holding means to It is common to employ a configuration that holds the battery in a stable state on the shuttle.
JP-A-3-133802 (Fig. 1-3)

  However, in the above-described conventional component supply apparatus, since the electronic component placed on the shuttle adsorbs and holds the lower surface, for example, an odd-shaped electronic component may not adsorb the lower surface side properly. The electronic component cannot be securely held on the shuttle, and the electronic component may not be stably supplied to the mounting machine body.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a component supply device that can reliably pick up an electronic component and stably supply the electronic component to a mounting machine body and a mounting machine including the component supplying device. And

  The present invention provides the following means.

[1] A component supply apparatus for supplying an electronic component to a mounting machine main body for mounting the electronic component on a substrate to be mounted,
A storage section for storing a component tray storing electronic components;
A component derivation mechanism for deriving a component tray from the storage unit to the pickup area;
A component transfer mechanism for transferring the electronic components in the component tray in the pickup area to a component supply position that can be delivered to the mounting machine body, and
The component transfer mechanism includes:
A transfer head for picking up electronic components from a component tray in the pickup area;
And a transfer head moving mechanism for moving the transfer head picked up an electronic component to the component supply position.

  [2] The component supply apparatus according to [1], wherein a component mounting table on which an electronic component can be mounted is provided at the component supply position.

  [3] The component supply apparatus according to item 1 or 2, wherein the transfer head is configured to suck and pick up an electronic component by air suction.

  [4] The component supply apparatus according to any one of [1] to [3], wherein a plurality of transfer heads of the component transfer mechanism are provided.

  [5] The component supply device according to item 4, wherein a component mounting table on which a plurality of electronic components can be mounted is provided at the component supply position.

  [6] The component supply apparatus according to any one of [1] to [4], wherein a plurality of the component transfer mechanisms are provided.

  [7] The component supply apparatus according to [6], wherein a plurality of component mounting tables on which electronic components can be mounted are provided corresponding to the plurality of component transfer mechanisms.

  [8] The component supply apparatus according to [2], [5], or [7], wherein the component mounting table is configured to be sucked and held by air suction while an electronic component is mounted.

[9] The component supply device according to any one of 1 to 8 above,
A mounting machine comprising: a mounting machine main body for mounting an electronic component supplied from the component supply device on a substrate to be mounted.

  According to the component supply apparatus according to the invention [1], the electronic component is picked up by the transfer head from the component tray led to the pickup area, and the transfer head is transferred to the mounting machine body side. Thus, the electronic component can be transferred from the component tray to the mounting machine main body side in a state where only the upper surface side of the electronic component is picked up. As described above, the electronic component can be transferred only by the upper surface adsorption, so that the electronic component can be securely held even if it is an irregular electronic component that cannot pick up the lower surface, for example. Electronic components can be supplied stably.

  According to the component supply apparatus according to the invention [2], immediately after the electronic component picked up and transferred by the transfer head is transferred to the component mounting table, it is possible to return to the pickup region and start the next transfer operation. Parts can be transferred efficiently.

  According to the component supply device of the invention [3], the electronic component can be reliably picked up by the transfer head.

  According to the component supply apparatus according to the invention [4], since a plurality of electronic components can be transferred at a time by a plurality of transfer heads, the components can be transferred more efficiently.

  According to the component supply device according to the invention [5], since a plurality of electronic components can be mounted on the component mounting table and a plurality of electronic components can be supplied to the mounting machine main body at a time, the supply of electronic components is efficient. Can be done well.

  According to the component supply device according to the invention [6], the plurality of component transfer mechanisms can be freely driven as necessary, so that a plurality of electronic components can be transferred through a plurality of independent paths. The electronic parts can be supplied more efficiently.

  According to the component supply apparatus according to the invention [7], electronic components transferred by a plurality of transfer heads can be reliably transferred to the component mounting table without delay, and electronic components can be supplied more efficiently. Can do.

  According to the component supply apparatus of the invention [8], the electronic component can be reliably held on the component mounting table, and the stability of the electronic component on the mounting table can be improved.

  According to the mounting machine according to the invention [9], the same effects as those of the inventions 1 to 8 can be obtained.

  FIG. 1 is a plan view of a mounting machine according to an embodiment of the present invention. FIG. 2 is a perspective view schematically showing the mounting machine. FIG. 3 is a front sectional view schematically showing the mounting machine. As shown in these drawings, the mounting machine includes a mounting machine main body 10 and a component supply device 50 that are arranged along the conveyance line X1 of a printed board P as a mounting board.

  The mounting machine main body 10 is arranged along the conveyance line X1 on the base 11, and conveys the printed circuit board P, and a component supply unit arranged on one side (front side) of both sides of the conveyor 20. 30 and a mounting head unit 40 provided above the base 11.

  The component supply unit 30 includes a plurality of rows of tape feeders 31 suitable for supplying relatively small chip components.

  Each tape feeder 31 is detachably mounted with a reel on which a tape on which small chip components such as ICs, transistors, capacitors and the like are stored and held at predetermined intervals is wound, and the tape is fed from the reel to the tape feeder. The chip parts that are intermittently fed to the tip end side of 31 and stored in the tape can be picked up by the head unit 40.

  The head unit 40 includes a component supply unit 30 and a mounting position on the printed circuit board P (mounting head operating region M1) so that components can be picked up from the component supply unit 30 and mounted on the printed circuit board P. Can be moved. Specifically, the head unit 40 is supported by a head unit support member 42 extending in the X-axis direction (a direction parallel to the transport line X1) so as to be movable in the X-axis direction. In FIG. 2, the guide rails 43, 43 extending in the Y-axis direction (the direction orthogonal to the X-axis direction in the horizontal plane) are supported so as to be movable in the Y-axis direction. The head unit 40 is driven in the X-axis direction by the X-axis driving means, and the head unit support member 42 is driven in the Y-axis direction by the Y-axis driving means.

  The head unit 40 is mounted with a plurality of heads 41 arranged in the X-axis direction for attracting electronic components and mounting them on the substrate P. Each head 41 is driven in the vertical direction (Z-axis direction) by a Z-axis drive means (not shown) and is driven in the rotation direction (R-axis direction) by a rotation drive mechanism as an R-axis drive means. It has become. A suction nozzle 41a is provided at the tip of each head 41, and a negative pressure is supplied from a negative pressure supply means (not shown) to the suction nozzle 41a at the time of component suction, and the electronic component is sucked by suction force due to the negative pressure. It can be done.

  Next, the component supply device 50 will be described.

  FIG. 4 is a plan view showing the configuration of the component supply device 50. As shown in FIGS. 1 to 4, the component supply device 50 arranged side by side along the transport line X <b> 1 with respect to the mounting machine body 10 is called a tray feeder, and is a QFP (quad flat package) or the like. A relatively large electronic component is stocked in a state of being held in a component tray, which will be described later, and the electronic component is appropriately supplied from the tray to the mounting machine body 10 side.

  The component supply device 50 is stored below the transport line X1, a storage unit 60 provided on one side (front side) of the transport line X1, a component transfer mechanism 80 provided on the other side (rear side) of the transport line X1, and the transport line X1. The drawer mechanism 70 provided between the part 60 and the component transfer mechanism 80 is provided as a basic component. Then, as will be described in detail below, the pallet 52 stored in the storage unit 60 is pulled out by the pulling mechanism 70, and electronic components are taken out from the pulled pallet 52 by the component transfer mechanism 80 and mounted on the mounting machine body 10 side. To be transported.

  As shown in FIG. 5, the storage unit 60 has a total of four compartments 60a, two vertically and horizontally, and a plurality of pallet supporters 61 on both side walls of each chamber 60a at predetermined intervals along the vertical direction. , 61 are provided. Each pallet support portion 61 can hold a pallet 52, which will be described in detail later, in a horizontal state, and a plurality of pallets 52 are stored in a plurality of upper and lower tiers in two rows in the horizontal direction (X axis direction) in the storage portion 60. It is configured so that it can be placed.

  The storage section 60 is open on the rear side, and the pallet 52 supported by the pallet support section 61 is pulled out by the pulling mechanism 70 from the opening section on the rear side.

  As shown in FIG. 2, an opening 62 opened forward is provided on the front side of the storage section 60 corresponding to each compartment 60 a, and each pallet support in each compartment 60 a is supported through this opening 62. The pallet 52 can be stored in the part 61. Further, the front opening 62 in the storage section 60 is provided with an opening / closing door 63 that can freely open and close the opening 62.

  Here, the component tray and the pallet 52 will be described. As shown in FIG. 11, the component tray 51 accommodates and holds a plurality of electronic components Q such as QFP, and a plurality of component accommodating portions 511 each capable of holding the electronic components Q are arranged in a matrix. Is provided. The pallet 52 is configured so that one or a plurality of component trays 51 can be placed, and can be fixed in a position where the component tray 51 is placed.

  Further, the pallet 52 is provided with a gripping portion 521 at an end portion (tip portion) on the drawer side.

  As shown in FIGS. 4 and 6, two drawer mechanisms 70 are provided corresponding to the two rows of pallets 52 and 52 stored in the storage unit 60. In the present embodiment, the drawing mechanism 70 constitutes a component derivation mechanism, a tray derivation mechanism, or a pallet derivation mechanism.

  Each drawing mechanism 70 includes a pallet receiving frame 701 as a pallet receiving member arranged along a direction (pallet drawing direction) perpendicular to the transport line X1, and a pair of left and right rails are provided on both sides of the receiving frame 701. 71, 71 are provided.

  As shown in FIGS. 6 to 8, the rails 71, 71 have a plurality of support rollers 72 that support both sides of the lower surface of the pallet 52 and side rollers 73, 74 that guide both sides of the pallet 52. It is provided at predetermined intervals along the length direction (pallet drawing direction). When the pallet 52 is pulled out from the storage unit 60, the pallet 52 is configured such that the lower surface of the pallet 52 is supported by the support rollers 72 and the outer surfaces on both sides are guided by the side rollers 73 and 74 and moved in the pull-out direction. .

  Between the rails 71 and 71 in the pallet receiving frame 701 of the drawer mechanism 70, an intermediate rail 75 extending in the pallet drawer direction (Y-axis direction) is provided. The intermediate rail 75 is provided with a clamp mechanism 76 that is slidable along the rail length direction. The clamp mechanism 76 is provided with a clamp 761 capable of gripping the grip portion 521 of the pallet 52, and is configured to be driven by a clamp drive mechanism (not shown).

  A clamp mechanism moving belt 753 is rotatably spanned between both ends of the intermediate rail 75 in the pull-out mechanism 70. Further, the drawing-side end portion of the belt 753 is linked to a driving means 754 such as a servo motor via a power transmission mechanism, and the belt 753 is configured to rotate by driving of the driving means 754.

  In this embodiment, the intermediate rail 75, the moving belt 753, the driving means 754, the power transmission mechanism, and the like constitute a clamp moving mechanism.

  Further, the clamp mechanism 76 is fixed to the belt 753, and the clamp mechanism 76 is configured to reciprocate along the drawing direction of the pallet 52 as the belt 753 rotates.

  Each drawer mechanism 70 is provided so as to be movable up and down in the vertical direction, and is configured to move up and down in the vertical direction when driven by a driving means 791 (see FIGS. 4 and 6) such as a motor of the lifting mechanism 79. Yes. And by this raising / lowering mechanism, the both-sides rails 71 and 71 of the drawer mechanism 70 can be moved to the height position corresponding to the desired pallet support part 61, when the drawer mechanism 70 raises / lowers.

  In the present embodiment, two drawer mechanisms 70 and lift mechanisms 79 are provided corresponding to the two rows of pallets 52 and 52 housed in the housing portion 60, and are independent from each other for each row. And can be driven.

  On the other hand, FIGS. 7 to 10 are views showing the component transfer mechanism 80. As shown in these figures, the component transfer mechanisms 80 and 80 are provided corresponding to the two drawing mechanisms 70 and 70, respectively. The component transfer mechanisms 80, 80 include one arm 81 that is used in common between both mechanisms 80, 80, head units 85, 85 and component mounting tables 86, 86 provided in the component transfer mechanisms 80, 80, respectively. I have.

  The arm 81 is disposed along the transport line X1 on the other side (rear side) of the transport line X1. This arm 81 crosses above both rails 71, 71 in the drawer mechanism 70, and the tip side (the end opposite to the board conveyance direction) is disposed below the component supply position described later.

  Head units 85 and 85 are attached to the arm 81 on the front side and the rear side so as to be slidable in the arm length direction (X-axis direction).

  The arm 81 is provided with upper and lower head unit moving belts 811 and 811 so as to span between both ends thereof, so that the belts 811 and 811 rotate and move along the arm length direction. It is configured. One end of the arm 81 is provided with drive means 812 and 812 such as a servo motor (see FIG. 4), and the drive means 812 and 812 are linked to the head unit moving belts 811 and 811 via a power transmission mechanism. ing. The belts 811 and 811 are configured to rotate by driving of the driving means 812 and 812.

  Of the two upper and lower belts 811, 811, the front-side head unit 85 is fixed to the upper belt 811, and the rear-side head unit 85 is fixed to the lower belt 811. The drive units 812 and 812 are driven to rotate and move the belts 811 and 811, so that the head units 85 and 85 reciprocate along the arm 81.

  In the present embodiment, the arm 81, the head unit moving belt 811, the driving means 812, and the like constitute a head unit moving mechanism, that is, a transfer head moving mechanism.

  Each of the head units 85 and 85 is provided with two transfer heads 851 and 851 side by side in the arm length direction (X-axis direction) via the lifting support mechanisms 852 and 852. Each head 851 is provided with a suction nozzle 90. At the time of component suction, the head 851 descends and the suction nozzle 90 advances a small amount downward, and negative pressure is applied to the suction nozzle 90 from a negative pressure supply means (not shown). The electronic component Q can be sucked by the suction force generated by the negative pressure.

  As shown in FIG. 3, one end of cable ducts 80 a and 80 a in which a power transmission cable and an air suction tube for performing power transmission and air suction to the head unit 85 are accommodated are connected to the head units 85 and 85. At the same time, the other end is connected to a predetermined location.

  A column frame 861 for supporting the component mounting tables 86 and 86 is provided at the tip of the arm 81 along the vertical direction. The support frame 861 has an installation portion 865 at the lower end. The installation portion 865 is installed on the mounting machine body 10 base 11 and is arranged vertically along the vertical direction (Z-axis direction). ing. Corresponding to the head units 85 and 85 before and after the arm, the component frame 861 and 86 on which two electronic components Q can be mounted are supported on the support frame 861 so as to be vertically movable. Further, raising and lowering belts 862 and 862 are provided between the upper and lower sides of the support frame 861 corresponding to the parts mounting tables 86 and 86 before and after the arm, respectively. The belts 862 and 862 are connected to the driving means 863 and 863, respectively. It is configured to rotate by driving.

  The component mounting tables 86 and 86 are fixed to the lifting belts 862 and 862, and the component mounting tables 86 and 86 are moved up and down as the belts 862 and 862 are driven by the driving means 863 and 863. It is configured. In the present embodiment, the support frame 861, the lifting belt 862, the driving means 863, and the like constitute a mounting table lifting mechanism.

  As shown in FIG. 10, each component mounting table 86, 86 is provided with two suction portions 864, 864 at the component mounting position on the upper surface thereof, and when the electronic components are mounted, the suction portions 863, 863 are not shown. The negative pressure is supplied from the negative pressure supply means to the suction portions 864 and 864, and the electronic component Q can be sucked and held by the suction force of the negative pressure.

  As described above, two head units 85 and 85 and two component mounting tables 86 and 86 are provided, and each head unit 85 and 85 and each component mounting table 86 and 86 can be driven independently of each other. It is configured as follows.

  In the component transfer mechanisms 80 and 80 having the above-described configuration, the head units 85 and 85 move along the arm 81, so that the upper region of the both-side rails 71 and 71 (pickup region and component extraction region) in the pull-out mechanism 70. The component mounting tables 86 and 86 in the lowered state are configured to reciprocate between the above. In the present embodiment, as shown in FIGS. 1 and 3, a range (area) in which the head units 85 and 85 reciprocate is configured as an operating area M2 of the transfer head.

  Further, the operating area M2 of the transfer head is arranged below the area where the mounting head unit 40 of the mounting machine body 10 operates (the operating area M1 of the mounting head), and the operating areas M1 and M2 overlap each other. It is set not to.

  Further, the component mounting table 86 in the raised state is arranged in the operation area M1 of the mounting head, and the electronic component Q mounted on the mounting table 86 can be sucked (pick up) by the mounting head 41. Yes. Here, in the present embodiment, the component supply position is configured by the position of the component mounting table 86 in the raised state.

  In the component supply apparatus 50 described above, two drawer mechanisms 70 and 70 and lift mechanisms 70 and 79 that are independently driven with respect to the pallets 52 and 52 stored in two rows in the storage unit 60 in the horizontal direction. The component transfer mechanisms 80, 80 are arranged, whereby two independent electronic component supply paths are formed from the storage unit 60 to the mounting machine body 10.

  Next, the operation of the mounting machine will be described focusing on the operation until the electronic component Q is supplied from the component supply device 50 to the mounting machine body 10. In the component supply apparatus 50, two component supply paths are formed as described above. However, since each component supply path performs substantially the same operation, two component supply paths are used in the following description. The parts supply route will be described collectively.

  First, in the component supply device 50, a large number of pallets 52 are stored in a plurality of upper and lower stages in two horizontal rows in the storage unit 60. Note that a component tray 51 in which electronic components are stored and held in a matrix is placed on the pallet 52 in a fixed position.

  From this state, when the drawer mechanism 70 is moved up and down by driving the lifting mechanism 79, the both-side rails 71 of the drawer mechanism 70 are moved to the height position of the predetermined pallet 52 to be pulled out, and the leading ends of the both-side rails 71 are moved. It is arranged opposite to both sides of a predetermined pallet 52.

  Subsequently, the clamp mechanism 76 in the drawer mechanism 70 moves to the pallet 52 side along the intermediate rail 75, and the grip portion 521 of the pallet 52 is gripped by the clamp 761 of the clamp mechanism 76.

  After the clamp 761 is gripped in this way, the clamp mechanism 76 moves in the pull-out direction along the intermediate rail 75, whereby the pallet 52 is pulled out from the storage portion 60 onto the both-side rails 71, 71, and the rails 71, 71 It moves along 71.

  When the pallet 52 is moved to the predetermined position by the clamp mechanism 76, the drawer mechanism 70 is lifted by the drive of the lifting mechanism 79 as necessary, so that the electronic component Q in the component tray 51 is transferred to the pallet 52 by the component transfer. The transfer head 851 of the mechanism 80 moves to a pickup area (pickup area).

  Next, as shown in FIG. 8, the head unit 85 moves to the pickup area along the arm 81, and the two transfer heads 851 and 851 in the head unit 85 are held on the predetermined tray 2 held on the component tray 51 of the pallet 52. It is arranged at a position corresponding to one electronic component. At this time, the alignment of the transfer heads 851 and 851 with respect to the electronic components Q and Q in the Y-axis direction is performed by moving the pallet 52 in the loading / unloading direction by the drawing mechanism 70, and the alignment in the X-axis direction is needless to say. This is performed by moving the head unit 85 along the arm 81.

  Thereafter, the nozzles 90 and 90 of the transfer heads 851 and 851 advance and simultaneously hold and hold the corresponding two electronic components Q and Q, respectively.

  With the electronic components Q and Q held by the heads 851 and 851, the head unit 85 moves to the mounting machine body 10 side along the arm 81 as shown in FIG. 9, and the head unit 85 is lowered. It is arranged above the mounting table 86.

  Next, when the nozzles 90, 90 of the head unit 85 advance and release the suction, the electronic components Q, Q are transferred to the component mounting table 86, and simultaneously with the transfer, the suction portion of the component mounting table 86 is transferred. Electronic parts Q and Q are sucked and held by 864 and 864, respectively.

  Subsequently, as shown in FIG. 10, the head unit 85 moves to the pickup area along the arm 81 to transfer the next electronic component Q, while the component mounting table 86 holds the electronic components Q and Q by suction. Rise in state. As a result, the electronic components Q and Q of the component mounting table 86 are arranged in the operating region M1 (component supply position) of the mounting head 41 in the mounting machine body 10.

  Thereafter, the head unit 40 of the mounting machine body 10 moves up to the raised component mounting table 86. Subsequently, the suction to the electronic components Q and Q by the component mounting table 86 is released, and the electronic components Q and Q are sucked and held by the suction nozzles 41a of the predetermined heads 41 in the head unit 40.

  The electronic component Q held by the mounting head 41 moves to above the printed circuit board P arranged on the conveyor 20 and is mounted at a predetermined position on the printed circuit board P.

  After the electronic component is delivered to the mounting head 41, the component mounting table 86 descends, returns to the operation area M <b> 2 of the transfer head 851, and waits until the next electronic component is transferred by the transfer head 851.

  In this way, an electronic component is appropriately supplied from the component supply device 50 to the mounting machine body 10, and the electronic component is mounted on the printed circuit board P by the mounting machine body 10 and supplied from the tape feeder 31 as described above. Small electronic components are mounted by the mounting head 41.

  When the mounting of the electronic components on the printed circuit board P is completed, the printed circuit board P is moved by a predetermined amount along the transport line X1 by the conveyor 20, and the next unprinted printed circuit board P is arranged at the mounting position of the mounting machine body 10. Is done.

  On the other hand, when all the electronic components are supplied from the pallet 52 in the pickup area to the mounter body 10 in the component supply device 50, the pallet 52 is returned to the predetermined pallet support portion 61 of the storage unit 60. That is, the drawer mechanism 70 is lowered by driving the lifting mechanism 79 as necessary, and the pallet 52 is disposed at a height position corresponding to the predetermined pallet support portion 61. Subsequently, the clamp mechanism 76 moves in the direction opposite to the drawing direction, and the pallet 52 is pushed into the predetermined pallet support portion 61. Thereafter, gripping of the pallet gripping portion 521 by the clamp 761 of the clamp mechanism 76 is released. In this way, the pallet 52 on which the empty tray 51 is placed is returned to the storage unit 60.

  Here, the component supply apparatus of this embodiment can supply electronic components freely by two independent component supply paths. Therefore, the supply of the electronic component through one component supply path and the supply of the electronic component through the other component supply path can be performed alternately at different times, and can be performed in parallel. It can also be done separately. In the present embodiment, if necessary, different types of electronic components may be stored in one pallet 52 and the other pallet 52, or different types of electronic components may be stored in one pallet 52. You may make it leave.

  As described above, according to the present embodiment, the electronic component is sucked and picked up by the transfer head 851 from the component tray 51 drawn to the pickup area, and the transfer head 851 is moved along the arm 81 to the mounting machine body 10. Therefore, the electronic component can be transferred from the component tray 51 to the mounting machine body 10 side while only the upper surface side of the electronic component is sucked. As described above, since the electronic component can be transferred only by the upper surface suction, for example, all types of electronic components can be securely held as compared with the case where the lower surface side of the electronic component is sucked and held. The electronic component can be stably supplied to the mounting machine body 10.

  In the present embodiment, since the transfer head 851 is transferred to the mounting machine main body 10 while the electronic component is picked up from the component tray 51 by the transfer head 851, the shuttle will be described in detail below. Like a transfer-type component supply device, it is possible to prevent excessive pressing of the transfer head against the electronic component. That is, the shuttle transfer type component supply apparatus transfers electronic components from the component tray to the shuttle and moves the shuttle to the mounting machine main body side. In this shuttle transfer type component supply apparatus, when an electronic component is transferred from the component tray to the shuttle, the electronic component in the component tray is sucked by air suction by the suction nozzle of the transfer head, and the transfer head is shuttled. It is moved to the top, the suction is released, and the electronic component is transferred onto the shuttle. However, since the height position of the shuttle is fixed, when an electronic component is transferred from the nozzle of the transfer head onto the shuttle, for example, when an electronic component having a large height is employed, The height dimension of the electronic component is larger than the dimension between the nozzle of the transfer head and the shuttle, and a transfer process (hard landing) is performed in which the electronic component is excessively pressed against the shuttle by the nozzle of the transfer head. Become.

  On the other hand, in the present embodiment, since the transfer head 851 is transferred from the component tray 51 to the mounting machine body 10 side while being picked up by the transfer head 851, the electronic components in the tray are It can be transferred directly to the mounting machine main body 10 side without being transferred to the shuttle. For this reason, it is possible to prevent the electronic component from being pressed by the suction nozzle when the electronic component is transferred to the shuttle.

  In this embodiment, since the component mounting table 86 is provided at the component supply position, the electronic component is transferred from the transfer head to the mounting table 86 when the electronic component is transferred from the transfer head 851 to the component mounting table 86. The transfer process by the transfer head 851 is completed. For this reason, the transfer head 851 can return to the pickup area immediately after the electronic component is transferred to the component mounting table 86 and can start the next transfer operation, and can efficiently transfer the component.

  In this embodiment, since the component mounting table 86 is provided so as to be movable up and down, when an electronic component is transferred from the transfer head 851 to the component mounting table 86, the component mounting table 86 is matched to the height dimension of the electronic component. The vertical position of the mounting table 86 can be adjusted, and even when an electronic component having a large height is adopted, the nozzle 90 of the transfer head 851 prevents the electronic component from being pressed against the component mounting table 86. In addition, electronic components can be smoothly transferred to the component mounting table 86, and so-called soft landing can be performed. Further, even when the electronic component on the component mounting table 86 is picked up by the mounting head 41 of the mounting machine body 10, the electronic component mounting by the nozzle of the mounting head 41 is performed by appropriately adjusting the vertical position of the component mounting table 86. The pressing to the mounting table 86 can be prevented.

  In the component supply device 50 of the present embodiment, since the pallets 52 can be stored in two rows in the storage unit 60 in the horizontal direction, the storage rate of the pallets 52 can be improved and the storage amount can be increased. For this reason, the pallet replacement work during use of the apparatus can be reduced, and the work load can be reduced correspondingly, and the lowering of the operation efficiency due to the pallet replacement can also be prevented.

  Further, two drawing mechanisms 70, two lifting mechanisms 79, and two component transfer mechanisms 80 are provided corresponding to two rows of pallets 52 to form two component supply paths. Components can be supplied to the mounting machine body 10 side, and the component supply efficiency can be improved.

  In particular, the component supply apparatus 50 of the present embodiment employs a double-row drawing system in which two pallets 52, 52 arranged in parallel are pulled out in parallel to the pickup area by two drawing mechanisms 70, 70. Therefore, when supplying two types of electronic components from the component supply device 50 to the mounting machine body 10, the component supply efficiency can be further improved. That is, in the single-row drawer type component supply apparatus in which only one pallet is pulled out, when supplying two types of electronic components, the pallet holding the first type of electronic components is pulled out from the storage unit, After removing the first type of electronic component from the pallet, return the pallet containing the first type of electronic component to the storage unit, and further pull out the pallet holding the second type of electronic component from the storage unit, It is necessary to take out the second type of electronic component. As described above, since the pallet loading / unloading operation is required during the first type of component extraction processing and the second type of component extraction processing, there is a risk that work efficiency may be reduced.

  On the other hand, in the present embodiment, the pallet 52 containing the first type of electronic component is stored in, for example, one side of the storage unit 60, and the second type of electronic component is stored in the other side. 52, the two kinds of pallets 52, 52 are pulled out together by the two drawer mechanisms 70, and the first electronic component is taken out from the pallet 52 on one side, and then the pallet is put in and out. The second electronic component can be taken out from the pallet 52 on the other side immediately. Thus, when changing the kind of electronic component, since the operation of putting in and out the pallet 52 is unnecessary, the component supply efficiency can be further improved.

  Moreover, in the present embodiment, since the two component transfer mechanisms 80 and 80 are provided in correspondence with the two drawing mechanisms 70 and 70, the first type of electronic component supply processing and the second type of electronic The component supply process can be performed in parallel, and the component supply efficiency can be further improved.

  Furthermore, in this embodiment, since the two transfer heads 851 are provided in the head unit 85 in the component transfer mechanism 80, two electronic components are transferred one at a time by one component transfer mechanism 80. The component supply efficiency can be further improved.

  Further, in the present embodiment, the drawing mechanism 70 of the component supply device 50 is disposed below the transfer line X1, and the drawing area (pallet) of the pallet 52 extending from the storage unit 60 to the pickup area is provided below the substrate transfer conveyor 20. Since the lead-out area) is set, the dead space under the conveyor can be effectively used as the pallet drawing area, and the installation space can be reduced and the apparatus can be downsized. In the present embodiment, the pallet extraction area and the pickup area may partially or entirely overlap, or the areas may not overlap.

  Further, in this embodiment, since the pallet storage opening 62 of the component supply device 50 is formed on the front side (front side), the pallet 52 can be inserted and removed efficiently and smoothly from the front work passage or the like. it can.

  In the present embodiment, as shown in FIG. 3, the working area M1 of the mounting head 41 is set above the working area M2 of the transfer head 851, and the working areas M1 and M2 are set so as not to overlap. Therefore, it is possible to reliably prevent the transfer head 851 from interfering with the mounting head 41.

  FIG. 12 is a plan view showing a mounting machine according to a first modification of the present invention. As shown in the figure, the mounting machine according to this embodiment includes two mounting machine bodies 10A and 10B and one component supply device 50. That is, along the transport line X1, one mounting machine body 10A, the component supply device 50, and the other mounting machine body 10B are arranged in this order.

  The component supply device 50 includes arms 81a and 81b in two component transfer mechanisms 80 and 80, respectively. One arm 81a is disposed so as to extend toward the one mounting machine body 10A, and the other arm 81b is disposed so as to extend toward the other mounting machine body 10B. Furthermore, each arm 81a, 81b is provided with one head unit 85, 85 similar to the above. In the component supply apparatus 50 according to the first modification, the other configuration is the same as that in the above embodiment.

  Also, one mounting machine body 10A can pick up electronic components supplied via one arm 81a by a mounting head, and the other mounting machine body 10B receives electronic components supplied via the other arm 81b. It is configured to be picked up by the mounting head.

  In the mounting machine configured as described above, one of the pallets 52 (for example, the right row) among the pallets 52 stored in multiple rows in the storage unit 60 in two horizontal directions is pulled out to the pickup area by the one pulling mechanism 70. Then, it is supplied to one mounting machine main body 10A side by one component transfer mechanism 80. The other predetermined pallet 52 (for example, the left row) is pulled out to the pickup area by the other pulling mechanism 70 and supplied to the other mounting machine main body 10B by the other component transfer mechanism 80.

  The electronic component thus supplied to one mounting machine main body 10A is picked up by the mounting head and mounted on one printed circuit board P in one mounting machine main body 10A, and on the other mounting machine main body 10B. The supplied electronic component is picked up by the mounting head and mounted on the other printed circuit board P in the other mounting machine main body 10B.

  FIG. 13 is a side sectional view showing a component supply apparatus as a second modification of the present invention. As shown in the figure, the component supply device 50 adjusts the height position of the drawer mechanism 70 with respect to a predetermined pallet 52 by raising and lowering the storage section 60 without raising and lowering the drawer mechanism 70. It is. That is, the component supply device 80 is fixed in the housing 55 in a state where the drawer mechanism 70 such as the pallet receiving frame 701 and the rail 71 is disposed at a predetermined height position.

  Further, the storage unit 60 is supported by the housing 55 of the component supply device 50 so as to be movable up and down, and is configured such that the storage unit 60 is moved up and down by a lift driving means including a ball screw 601 and a motor 602.

  In this component supply device 60, the storage unit 60 is moved up and down with respect to the drawer mechanism 70, and a predetermined pallet 52 to be pulled out is arranged so as to correspond to the drawer mechanism 70, and the pallet 52 is removed from the storage unit 60. Pull out.

  Other configurations are the same as those in the above embodiment.

  FIG. 14 is a view showing a mounting machine according to a third modification of the present invention. As shown in the figure, the mounting machine main body 110 of this mounting machine is configured such that the head unit 140 can move only in the Y-axis direction. That is, the mounting machine main body 110 includes a conveyor 20 that conveys the printed circuit board P, a component supply unit 130 that includes a plurality of tape feeders 31 arranged on the front side of the conveyor 20, a mounting head unit 140, and the substrate P. A substrate moving mechanism 100 that moves in the Y-axis direction is provided.

  The head unit 140 is supported by a guide rail 143 extending in the Y-axis direction so as to be movable in the Y-axis direction. The head unit 140 is driven in the Y-axis direction by Y-axis driving means.

  Further, the head unit 140 is mounted with a plurality of heads 141... For adsorbing electronic components and mounting them on the substrate P side by side in the Y-axis direction.

  The substrate moving mechanism 100 includes a ball screw 101 disposed along the X-axis direction on the lower surface of the substrate P, a movable member 102 screwed to the ball screw 101, and a ball screw 101 that rotates to move the movable member. And a motor 103 that moves the motor 102 along the X-axis direction. At the time of mounting, the lower surface of the printed board P is supported and fixed by the movable member 102, and the printed board P is moved in the X-axis direction as the movable member 102 moves.

  Further, the component supply device 50 is configured such that one transfer head 851 is provided in the head unit 85 of the component transfer mechanism 80, and one electronic component is supplied by one reciprocal transfer of the head unit 85. In the figure, reference numeral 145 denotes a camera for monitoring the electronic component suction state by the head unit 140.

  Other configurations are substantially the same as those in the above embodiment.

  In this mounter, the electronic component Q supplied to the component supply position by the component supply device 50 is picked up by the head 141 of the mounter body 110 and mounted on the printed circuit board P. During this mounting, the head unit 140 moves in the Y-axis direction along the guide rail 143, and the printed board P moves in the X-axis direction by the board moving mechanism 100, so that the head 141 of the head unit 140 is moved. The printed circuit board P is disposed at a predetermined mounting position, and an electronic component is mounted at that position.

  FIG. 15 is a view showing a mounting machine as a fourth modification of the present invention. As shown in the figure, this mounting machine is significantly different from the above embodiment in that the component supply device 150 is arranged along the Y-axis direction with respect to the mounting machine body 10.

  The component supply device 150 is disposed further on the rear side of the mounting machine body 10. This component supply apparatus 150 includes a storage unit 160 capable of storing pallets 52 in two horizontal rows in the horizontal direction, and drawing mechanisms 170 and 170 for pulling out the pallets 52 and 52 from the storage unit 160 to each pickup column. Component transfer mechanisms 180 and 180 that pick up electronic components from the pallets 52 and 52 in the pickup area and transfer them to the mounting machine body 10 are provided as basic components.

  In the drawing mechanism 170, a ball screw 175 that rotates by driving a motor 178 is provided between the rails 71, 71, and the clamp mechanism 76 is configured to reciprocate in the drawing direction by the rotation of the ball screw 175. In the drawer mechanism 170, since the configuration other than this is substantially the same as that of the above-described embodiment, the same portions are denoted by the same or corresponding reference numerals, and the duplicate description is omitted.

  Similarly to the above-described embodiment, the component transfer mechanisms 180 and 180 are independently provided on the arm 81 and the arm 81 arranged along the Y-axis direction between the pickup area and the mounter body 10. The head units 85 and 85 which can run freely, and the component mounting bases 86 and 86 which can be moved up and down respectively corresponding to the head units 85 and 85 on the mounting machine body side of the arm 81 are provided.

  In the mounting machine having this configuration, the pallet 52 is pulled out from the storage unit 160 by the pulling mechanism 170, and electronic components are picked up from the pallet 52 by the head unit 85. Subsequently, the head unit 85 moves to the component mounting table 86, the electronic component is mounted on the table, and the component mounting table 86 is raised, so that the electronic component can be delivered to the mounting machine body 10. Move to the supply position.

  The electronic component thus supplied to the component supply position is picked up by the head of the mounting machine body 10 and mounted on the printed circuit board P.

  FIG. 16 is a view showing a component transfer mechanism of a component supply apparatus applied to a mounting machine as a fifth modification of the present invention. As shown in the figure, the component transfer mechanism 80 in this component supply apparatus does not have a component mounting table at the component supply position, and delivers the electronic component Q directly from the transfer head 851 to the mounting head 41 of the mounting machine body. It is. That is, in this component transfer mechanism 80, the head 851 of the head unit 85 provided on the arm 81 is rotatably mounted around a horizontal axis such as the Y-axis direction and is driven by a rotation driving means (not shown). Is configured to rotate.

  In this component supply apparatus, the transfer head 851 picks up the electronic component P in the pickup area, moves to the mounting machine body side along the arm 81, and then the transfer head 851 rotates 180 ° around the horizontal axis, The electronic component Q is placed upside down. Then, the electronic component Q is delivered from the transfer head 851 to the mounting head 81 of the mounting machine body by sucking and holding the lower surface of the electronic component Q turned upside down by the mounting head 41.

  In the above-described embodiment, the storage unit of the component supply device is configured so that the pallets are stored in two rows in the horizontal direction. However, the present invention is not limited to this, and the present invention is not limited to this. You may comprise so that it may accommodate in a row | line | column or 3 or more rows.

  In the above embodiment, the case where two drawer mechanisms and two component transfer mechanisms are provided has been described as an example. However, the present invention is not limited thereto, and the present invention includes one or three or more drawer mechanisms and component transfer mechanisms. You may make it provide one by one.

  Furthermore, in the above embodiment, the case where one component tray is arranged on one pallet has been described as an example. However, the present invention is not limited to this, and the present invention is one in which two or more component trays are arranged on one pallet. It can also be applied to.

  In the present embodiment, the transfer head of the component supply device is moved only in the X-axis direction. However, the present invention is not limited thereto, and the present invention supports, for example, the arm so as to be movable in the Y-axis direction. The transfer head can also be configured to move in the Y-axis direction.

  In the above embodiment, the operating area of the transfer head is set below the operating area of the mounting head. However, the present invention is not limited to this, and in the present invention, the operating area of the transfer head is the operating area of the mounting head. May be set upward.

It is a top view of the mounting machine concerning one Embodiment of this invention. It is a perspective view showing the mounting machine of an embodiment roughly. It is front sectional drawing which shows the mounting machine of embodiment schematically. It is a top view which shows the structure of the components supply apparatus of embodiment. It is front sectional drawing which shows the accommodating part of the components supply apparatus of embodiment. It is a front view which shows the drawer mechanism of the components supply apparatus of embodiment. It is a front view which shows the components transfer mechanism of the components supply apparatus of embodiment. It is a front view which expands and shows the head unit of the components transfer mechanism of embodiment. It is a front view which shows the component mounting base periphery of the component transfer mechanism of embodiment in a mounting base fall state. It is a front view which shows the components mounting base periphery of the components transfer mechanism of embodiment in a mounting base raise state. It is a top view which shows the pallet applied to the component supply apparatus of embodiment. It is a top view which shows the mounting machine concerning the 1st modification of this invention. It is side surface sectional drawing which shows the components supply apparatus of the mounting machine concerning the 2nd modification of this invention. It is a top view which shows the mounting machine main body of the mounting machine concerning the 3rd modification of this invention. It is a top view which shows the mounting machine concerning the 4th modification of this invention. It is a front view which shows the head unit in the components supply apparatus of the mounting machine concerning the 5th modification of this invention, Comprising: The same figure (a) is a front view which shows the state which has arrange | positioned the transfer head downward, The same figure (b). FIG. 4 is a front view showing a state in which the transfer head is inverted and arranged upward.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mounting machine main body 41 Mounting head 50 Component supply apparatus 52 Pallet 60 Storage part 70 Drawer mechanism (component derivation mechanism)
80 Component transfer mechanism 86 Component mounting table 851 Transfer head P Printed circuit board (substrate to be mounted)
Q Electronic parts

Claims (9)

A component supply apparatus for supplying an electronic component to a mounting machine body for mounting the electronic component on a substrate to be mounted,
A storage section for storing a component tray storing electronic components;
A component derivation mechanism for deriving a component tray from the storage unit to the pickup area;
A component transfer mechanism for transferring the electronic components in the component tray in the pickup area to a component supply position that can be delivered to the mounting machine body, and
The component transfer mechanism includes:
A transfer head for picking up electronic components from a component tray in the pickup area;
And a transfer head moving mechanism for moving the transfer head picked up an electronic component to the component supply position.   The component supply apparatus according to claim 1, wherein a component mounting table on which an electronic component can be mounted is provided at the component supply position.   The component supply device according to claim 1, wherein the transfer head is configured to adsorb and pick up an electronic component by air suction.   The component supply apparatus according to claim 1, wherein a plurality of transfer heads of the component transfer mechanism are provided.   The component supply apparatus according to claim 4, wherein a component mounting table on which a plurality of electronic components can be mounted is provided at the component supply position.   The component supply apparatus according to claim 1, wherein a plurality of the component transfer mechanisms are provided.   The component supply apparatus according to claim 6, wherein a plurality of component mounting tables on which electronic components can be mounted are provided corresponding to the plurality of component transfer mechanisms.   The component supply apparatus according to claim 2, 5 or 7, wherein the component mounting table is configured to be sucked and held by air suction while an electronic component is mounted. The component supply device according to any one of claims 1 to 8,
A mounting machine comprising: a mounting machine main body for mounting an electronic component supplied from the component supply device on a substrate to be mounted.