JP4396244B2 - Electronic component mounting apparatus and tray feeder - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that transports and mounts electronic components on a substrate, and a tray feeder that supplies electronic components stored in a tray in the electronic component mounting apparatus to a component pickup position by a mounting head.

An electronic component mounting apparatus for mounting electronic components on a board is provided with a component supply unit in which a parts feeder for supplying electronic components is arranged, and the electronic components are picked up by the mounting head from the component supply unit and transferred to the substrate. Installed. When there are many types of electronic components to be mounted on the same mounting stage, multiple types of parts feeders are connected to the component supply unit. When large electronic components are included, the electronic components are flattened as parts feeders. A tray feeder for taking out electronic components from the trays stored in the array is arranged (see, for example, Patent Document 1).
JP-A-5-235589

  However, in the above-described document example, the configuration in which the tray feeder is connected to the electronic component mounting apparatus in the form of extending the tray feeder on the board conveying direction side of the electronic component mounting apparatus is employed as the form of connecting the tray feeder to the electronic component mounting apparatus. An increase in the length in the substrate transfer direction could not be avoided. For this reason, in the electronic component mounting line that requires component supply to the tray, there is a problem that the area occupied by the facilities increases and the area productivity decreases.

  Therefore, an object of the present invention is to provide an electronic component mounting apparatus and a tray feeder that can reduce the area occupied by equipment and improve the area productivity.

An electronic component mounting apparatus according to a first aspect of the present invention is an electronic component mounting apparatus that transfers and mounts an electronic component supplied by a component supply unit onto a substrate by a mounting head, and is set on the transport path for transporting the substrate. Two mounting stages, a tape feeder disposed on both sides of the mounting stage, and a tray feeder disposed on the outer side of the tape feeder in the first direction which is the transport direction of the substrate, The tray feeder holds a tray containing electronic components stored in a planar arrangement, and draws and holds the tray from the tray containing part in a second direction orthogonal to the first direction that is the substrate transport direction. and lead portions which is provided with a lifting mechanism for lifting the drawer section, an outer side portion in the first direction of the tape feeders, before The electronic parts stored in the tray are moved in the first direction to the parts picking position arranged at the same position as the parts picking position in the second direction of the tape feeder, and the second conveying part extends in the second direction. Position by part . The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein the first transport unit includes a take-out head that picks up and picks up the electronic component in the concave portion of the tray. In addition, the second transport unit includes a component holding unit that receives the electronic component from the take-out head, holds the electronic component by vacuum suction, and moves to the take-out position.

According to the present invention, the tray is pulled out in the second direction perpendicular to the substrate transport direction from the tray storage unit that stores the tray storing the electronic components in a planar arrangement, and the electronic component is taken out from the drawn tray in the second direction. By adopting a configuration for conveying from the mounting head to the component picking position by the mounting head, the increase in the length of the electronic component mounting apparatus in the substrate conveying direction can be minimized, and the area productivity can be improved.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a tray feeder used in the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 4 is a perspective view of a tray drawer table used in the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is an embodiment of the present invention. FIG. 6 is a partial plan view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 7 is an electronic component according to an embodiment of the present invention. It is operation | movement explanatory drawing of the components supply operation | movement in a mounting apparatus.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a conveyance path 2 is disposed in the X direction on a gantry 1 of the electronic component mounting apparatus. The transport path 2 transports the substrate 3 on which electronic components are mounted, and positions the substrate 3 on the two mounting stages S1 and S2 set on the transport path 2. Component supply units 4A and 4B are disposed on both sides of the mounting stages S1 and S2, respectively. A plurality of tape feeders 5 and a tray feeder 11 are arranged in the component supply unit 4A.

  The tape feeder 5 and the tray feeder 11 are both component supply means, and the tape feeder 5 pitches the carrier tape holding the electronic components, thereby the electronic components are picked up by the mounting heads 8A and 8B described below. To supply. The tray feeder 11 also has a second direction (Y) perpendicular to the first direction (X direction), which is the substrate transport direction, via the component transport mechanism 12 for electronic components stored in the tray 30 in a grid-like plane arrangement. Direction) from the mounting heads 8A and 8B. That is, the component supply unit 4A is provided with a plurality of component supply means including the tray feeder 11. Only a plurality of tape feeders 5 are arranged in the component supply unit 4B.

  The mounting stages S1 and S2 have mounting heads 8A and 8B, respectively. The mounting heads 8A and 8B are multi-type heads each including a plurality of unit mounting heads 8a, and can hold and hold a plurality of electronic components simultaneously. The mounting head 8A is moved by the Y-axis table 6A and the X-axis table 7A, and the electronic components taken out from the tape feeder 5 or the tray feeder 11 of the component supply unit 4A are transferred to the substrate 3 positioned on the mounting stages S1 and S2. Mount. The mounting head 8B is moved by the Y-axis table 6B and the X-axis table 7B, and the electronic components taken out from the tape feeder 5 of the component supply unit 4B are transferred and mounted on the substrate 3 positioned on the mounting stages S1 and S2. The mounting heads 8 </ b> A and 8 </ b> B move integrally with the substrate recognition camera 9, and the position of the substrate 3 is recognized when the substrate recognition camera 9 images the substrate 3.

  A component imaging camera 10 is disposed on a path along which the mounting heads 8A and 8B move from the respective component supply units to the mounting stage. When the mounting heads 8A and 8B holding the electronic components move above the component imaging camera 10, the held electronic components are imaged by the component imaging camera 10 and are thus held by the mounting heads 8A and 8B. The position of the electronic component is recognized.

Next, the structure of the tray feeder 11 will be described with reference to FIGS. As shown in FIG. 2, the tray feeder 11 has a structure in which a magazine housing portion 14, a drawer portion 26, and an elevating mechanism 23 are disposed in a cover 11a. The tray feeder 11 is movable by a caster 13 and is detachably set on the component supply unit 4A. The tray 30 storing electronic components is supplied to the tray feeder 11 in a state where it is mounted on the plate-like pallet 15.

  As shown in FIG. 3, the tray feeder 11 has a structure in which frames 21 and 22 are erected on a base member 20 that is supported by a caster 13 so as to be laterally movable. A magazine accommodating portion 14 is fixed to the frame 21, and two magazines 16 are accommodated in the magazine accommodating portion 14. The magazine 16 accommodates a plurality of pallets 15 mounted with trays 30 in a stacked state. The magazine accommodating portion 14 is a tray accommodating portion that accommodates a tray 30 in which electronic components are stored in a planar arrangement. Note that the illustration of the tray 30 is omitted in FIG. Disposed above the magazine housing portion 14 is a discharge portion 17 that houses electronic components that are discharged without being mounted.

  The frame 4 is provided with an elevating mechanism 23 having a motor 24 and a feed screw 25, and by driving the elevating mechanism 23, the drawer portion 26 moves up and down. Thereby, the drawer | drawing-out part 26 can be match | combined with the height of the arbitrary pallets 15 accommodated in the magazine 16 in the magazine accommodating part 14. FIG. The drawer portion 26 includes a horizontal tray drawer table 27 and a motor 28 that drives the tray drawer mechanism.

  The tray drawer mechanism will be described. As shown in FIG. 4, the tray drawer table 27 is provided with a drawer member 29 that moves in the Y direction along the pallet holding surface 27a. By driving the motor 28 with the drawer member 29 engaged with the engaging portion 15a provided at the end portion of the pallet 15, the pallet 15 with the tray 30 mounted on the upper surface is Y along the pallet holding surface 27a. Pulled in the direction.

  As a result, the pallet 15 with the tray 30 mounted can be held from the magazine 16 in the magazine housing section 14 onto the pallet holding surface 27 a by the drawer tray drawing table 27. Further, by driving the drawer member 29 in the reverse direction, the tray 30 can be returned into the magazine 16 from the pallet holding surface 27a. That is, the drawer part 26 pulls out the tray 30 from the magazine housing part 14 in the second direction (Y direction) orthogonal to the substrate transport direction and holds it.

  By raising the drawer 26 while holding the pallet 15 on which the tray 30 is mounted, the tray 30 moves to the removal height by the component conveying mechanism 12. An electronic component in the recess 30a is taken out by a nozzle 33a of a take-out head 33 described later, and is carried to a take-out position by a mounting head of the electronic component mounting apparatus by a component carrying mechanism 12 described below. At this time, the tray pulling mechanism is driven to feed the tray 30 pitch by pitch Y1 in the Y direction of the recesses 30a, so that the nozzles 33a are sequentially moved from the plurality of recesses 30a in the grid array without moving in the Y direction. Electronic components can be taken out.

  Next, the structure of the component transport mechanism 12 will be described with reference to FIG. As shown in FIG. 5, the first transport unit 12 </ b> X and the second transport unit 12 </ b> Y are arranged in an L shape and are each covered with a cover member indicated by a broken line frame. The first transport unit 12X includes a horizontal X-axis table 31 positioned in the X direction directly above the tray 30, and a moving plate 32 is disposed on a guide rail 31a disposed in the longitudinal direction on the X-axis table 31. It is slidably mounted in the X direction.

The moving plate 32 is equipped with two take-out heads 33 each having a take-out nozzle 33a at the lower end. The moving plate 32 is moved horizontally by an X drive mechanism (not shown),
Accordingly, the take-out head 33 picks up and takes out the electronic component from the tray 30 by the take-out nozzle 33a, and moves to a position just above the component delivery position to the second transport unit 12Y.

  The second transport unit 12Y includes a Y-axis table 34 disposed horizontally in the Y direction, and is mounted in parallel to the tape feeder 5 of the component supply unit 4A when set in the electronic component mounting apparatus. . A component conveying table 35 is slidably mounted in the Y direction on a guide rail 34 a disposed in the longitudinal direction on the Y-axis table 34. The component carrying table 35 is provided with two component holding portions 35a for holding electronic components by vacuum suction. The component transport table 35 is horizontally moved by a Y drive mechanism (not shown), whereby the component transport table 35 delivered from the take-out head 33 and held in the component holding portion 35a is a mounting head described below. Move to the part removal position by 8A.

  FIG. 6 shows a component take-out position in the component supply unit 4A. The arrangement pitch p <b> 2 of the two component holding portions 35 a coincides with the arrangement pitch p <b> 2 between the component suction positions 5 a of the tape feeder 5. Here, in the mounting head 8A, the unit mounting heads 8a are arranged at the same pitch as the arrangement pitch p2. Therefore, the mounting head 8A can simultaneously suck a plurality of electronic components located at the component suction position 5a of the tape feeder 5 by the plurality of unit mounting heads 8a, and simultaneously two electronic components held on the component transport table 35. Adsorption is possible.

That is, in the above configuration, the component transport mechanism 12 takes out the electronic components stored in the tray 30 by the take-out head 33 and transports the electronic components in the first direction (X direction), and the first transport unit 12X generates the electronic components. A second transport unit 12Y is provided that receives the components and transports them from the second direction (Y direction) to a component pick-up position by the mounting head 8A. That is, as shown in FIG. 6, the component takeout position is on the outer side portion in the first direction of the tape feeder 5 and is arranged at the same position as the component suction position. The first transport unit 12X extending in the first direction simultaneously takes out a plurality of electronic components from the tray 30, and the second transport unit 12Y extending in the second direction mounts the plurality of electronic components at a predetermined arrangement pitch p2. The configuration is such that the head 8A is positioned at a component removal position.

  Next, the component supply operation by the tray feeder 11 will be described with reference to FIG. In FIG. 7, detailed illustration of the pallet 15 and the like is omitted, and only the tray drawer table 27 and the tray 30 are illustrated. In FIG. 7A, the electronic components P are stored in a lattice-like planar arrangement in the tray 30, and the tray 30 is in a state of being pulled out on the tray pulling table 27 by the pulling portion 26. And in the 2nd conveyance part 12Y, the components conveyance table 35 exists in the components delivery position from the 1st conveyance part 12X.

  When the component supply operation is started, as shown in FIG. 7B, the tray 30 moves in the direction of the arrow, and the electronic component P in the first row is positioned at the component removal position by the first transport unit 12X. As shown in FIG. 7C, the take-out head 33 that takes out the electronic component P from the tray 30 moves in the X direction by the first transport unit 12X and moves onto the component transport table 35 of the second transport unit 12Y. .

  Then, the take-out head 33 that has delivered the electronic component P to the component transport table 35 moves again onto the tray 30 as shown in FIG. 7D in order to take out the electronic component P adjacent to the previously taken-out electronic component P. The component transport table 35 that has received the electronic component P from the pick-up head 33 moves in the Y direction by the second transport unit 12Y, and reaches the component pick-up position by the mounting head 8A as shown in FIG. Then, the mounting head 8A takes out these electronic components P and transfers and mounts them on the substrate 3.

As described above, in the present embodiment, in the electronic component mounting apparatus in which a plurality of types of component supply means including a tray feeder are arranged, the magazine storage unit 1 that stores the tray 30.
4, the tray 30 is pulled out in the Y direction perpendicular to the substrate transport direction, the electronic component is taken out from the drawn tray 30 and transported from the Y direction to the component pick-up position by the mounting head 8A.

  As a result, as shown in the prior art example, the length of the electronic component mounting apparatus in the board conveyance direction by connecting the tray feeder as compared to the conventional electronic component mounting apparatus connecting the tray feeder from the board conveyance direction side. Can be minimized, and area productivity can be improved.

  The electronic component mounting apparatus and the tray feeder according to the present invention have the effect of minimizing the increase in the length of the electronic component mounting apparatus in the board conveyance direction and improving the area productivity. This is useful for a versatile electronic component mounting apparatus for mounting various types on a substrate.

The top view of the electronic component mounting apparatus of one embodiment of this invention The perspective view of the tray feeder used for the electronic component mounting apparatus of one embodiment of this invention FIG. 3 is a cross-sectional view of a tray feeder used in the electronic component mounting apparatus according to the embodiment of the present invention. The perspective view of the tray drawer table used for the electronic component mounting apparatus of one embodiment of this invention The perspective view of the component conveyance mechanism used for the electronic component mounting apparatus of one embodiment of this invention The fragmentary top view of the electronic component mounting apparatus of one embodiment of this invention Operation explanatory diagram of component supply operation in electronic component mounting apparatus of one embodiment of the present invention

Explanation of symbols

3 Substrate 4A, 4B Component supply unit 5 Tape feeder 8A, 8B Mounting head 11 Tape feeder 12 Component transport mechanism 12X First transport unit 12Y Second transport unit 14 Tray storage unit 23 Lifting mechanism 26 Drawer unit 30 Tray 33 Takeout head 35 Component Transport table P Electronic component

Claims (2)

An electronic component mounting apparatus for transporting and mounting an electronic component supplied by a component supply unit onto a substrate by a mounting head, and two mounting stages set on the transport path for transporting the substrate, respectively on both sides of the mounting stage A tape feeder arranged, and a tray feeder arranged on the outer side of the tape feeder in the first direction which is the transport direction of the substrate,
The tray feeder stores a tray storing electronic components in a planar arrangement, and draws and holds the tray in a second direction orthogonal to the first direction, which is the substrate transport direction, from the tray storing unit. And a lifting mechanism for lifting and lowering the drawer,
The electronic component stored in the tray is first placed at a component take-out position that is an outer side portion in the first direction of the tape feeder and is located at the same position as the component suction position in the second direction of the tape feeder. An electronic component mounting apparatus, wherein the electronic component mounting apparatus is positioned by a first transport unit extending in a direction and a second transport unit extending in a second direction .   The first transport unit includes a take-out head that picks up and takes out electronic components in the recess of the tray by a nozzle, and the second transport unit receives the electronic components from the take-out head and holds them by vacuum suction. The electronic component mounting apparatus according to claim 1, further comprising a component holder that moves to the take-out position.

Images