JP4383633B2 - Component mounting method - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a component mounting how to automatically mounting components such as electronic components on a substrate.
[0002]
[Prior art]
The configuration of a conventional electronic component mounting apparatus will be described with reference to FIG. The electronic component mounting apparatus 30 includes a loader 39 for bringing the circuit board 31 into the facility, a component supply means 34 for supplying the taped electronic components, and a tray 38 containing the required electronic components at a predetermined supply position. The electronic component is mounted on the circuit board 31 that is positioned at a predetermined mounting position by sucking the electronic component from the component supply unit 40 having the tray feeder to be arranged, and the suction nozzle 33 from the component supply unit 34 or the component supply unit 40. A mounting head 32, a component recognition camera 36 for recognizing the suction posture of an electronic component, an XY robot 37 that freely moves the mounting head 32 on the XY plane, and an unloader that carries the circuit board 31 that has been mounted out of the equipment. 41.
[0003]
In the above configuration, the mounting head 32 is freely moved by the XY robot 37 and sucks a required electronic component from the component supply unit 34 or the component supply unit 40 by the suction nozzle 33. Next, after the suction posture of the electronic component sucked by the suction nozzle 33 is recognized by the component recognition camera 36, the electronic component is moved to a predetermined mounting position on the circuit board 31, and the electronic component is mounted while correcting the posture. The electronic component is accurately mounted at a predetermined mounting position.
[0004]
Further, in such an electronic component mounting apparatus, the electronic components are predetermined by moving the electronic components accommodated in the tray 38 of the component supply unit 40 to the predetermined supply pallet 42 by the transfer head 43. There is also a configuration in which a plurality of electronic components on the supply pallet 42 are sucked at the same time by the mounting head 32 and mounted at regular intervals at a constant pitch. In this case, if the number and arrangement pitch of electronic components that can be arranged on the supply pallet 42 are the same as the number and arrangement pitch of the suction nozzles 33 provided in the mounting head 32, these electronic components are sucked simultaneously. It was possible.
[0005]
[Problems to be solved by the invention]
However, in the conventional configuration, when the suction nozzles 33 in the mounting head 32 are increased, or when the pitch between the suction nozzles 33 is changed, the supply pallet 42 corresponds to that when the electronic parts are simultaneously picked up. There is a problem that the supply pallet 42 corresponding to the structure of the mounting head 32 mounted on the mounting apparatus must be created, and the degree of freedom as the mounting apparatus is reduced.
[0006]
In addition, when the number of suction nozzles 33 in the mounting head 32 is increased, if a supply pallet 42 having a conventional size is used, if the number of suction nozzles 33 is larger, electronic components are placed on the supply pallet 42 multiple times. Must be supplied. In this case, there is a problem that the operation of drawing and returning the supply pallet a plurality of times is required, and the component mounting efficiency is lowered.
[0007]
Further, when the pitch between the suction nozzles 33 is changed, the electronic components are arranged on the supply pallet 42 at a predetermined pitch. Therefore, there is a problem that the component mounting efficiency is lowered.
[0008]
When the supply pallet 42 is used, the supply pallet 42 is pulled out and returned regardless of the number of electronic components. Therefore, only one electronic component is arranged in the supply pallet 42. Even when not arranged, there is a problem that the same pulling and returning operations are necessary, and the component mounting efficiency is lowered.
[0009]
The present invention aims to provide the light of the conventional problems, component mounting how a plurality of components to be adsorbed and then mounted simultaneously vary the number and shape of the part to be structural or supply of mounting head It is said.
[0010]
[Means for Solving the Problems]
Component mounting method of the present invention is to provide a plurality of parts with the transport head from a component supply unit to the intermediate component supply unit, the components on the intermediate component supply unit by a plurality of suction nozzles provided on the mounting head In the component mounting method of holding by suction and mounting on the board,
With intermittent feed conveyor to the intermediate component supply unit, to correspond to the arrangement pitch of the suction nozzle in the mounting head, by setting the feed amount of the intermittent feed conveyor while supplying part in said transfer head It is intended for varying the arrangement of the components on the indexing conveyor on operation of supplying parts to the said combined feed operation of the intermittent feed conveyor intermittent feed conveyor at the transfer head, the structure of the mounting head Even if the number and shape of components to be supplied change, a plurality of components can be easily sucked and mounted at the same time without replacing the intermediate component supply body, thereby realizing efficient mounting.
[0012]
In the component mounting method of the present invention, a plurality of components are supplied from the component supply unit to the intermediate component supply body by the transfer head, and the plurality of suction nozzles provided on the mounting head are used on the intermediate component supply body. In a component mounting method for sucking and holding a component and mounting it on a substrate, an intermittent feed conveyor is used as the intermediate component supply body, and the transfer is performed according to the shape and number of the components to be sucked and held by the suction nozzle of the mounting head. By setting the feed amount of the intermittent feed conveyor while the parts are supplied by the loading head, the operation of supplying the parts onto the intermittent feed conveyor by the transfer head and the feed operation of the intermittent feed conveyor are combined. Thus, even if the shape and number of components that change the arrangement state of the components on the intermittent feed conveyor are changed, they can be simultaneously attracted and mounted.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a component mounting apparatus according to an embodiment of the present invention will be described with reference to FIGS.
[0015]
In FIG. 1, a component mounting apparatus 1 according to the present embodiment includes a pair of stages 3 and 4 for loading, adjusting, and unloading a circuit board 2 into a facility, a component supply means 5 for supplying a taped electronic component, and an electronic A component supply unit 6 provided with a tray feeder for placing a tray 7 containing components at a predetermined supply position, a transfer head 9 for taking out an electronic component from the component supply unit 6 and supplying the electronic component onto an intermittent feed conveyor 8; A pair of mounting heads 10 for mounting an electronic component at a predetermined mounting position of the circuit board 2 that is sucked by the suction nozzle 11 from the supply means 5 or the component supply unit 6 or the intermittent feed conveyor 8 and positioned at the predetermined position. And an XY robot 12 that freely moves these mounting heads 10 on the XY plane, and recognition cameras 13 and 14 that recognize the component suction posture.
[0016]
In the above configuration, the mounting head 10 is freely moved by the XY robot 12 and sucks a required electronic component from the component supply means 5, the component supply unit 6 or the intermittent feed conveyor 8 by the suction nozzle 11, and then the suction nozzle. The electronic component is attracted to the electronic component 11 by recognizing the suction posture of the electronic component attracted by the electronic component 11 by using one of the component recognition cameras 13 and 14 and correcting the posture while mounting the electronic component at a predetermined mounting position on the circuit board 2. It is mounted accurately at a predetermined mounting position.
[0017]
In the electronic component mounting apparatus of this embodiment, when mounting electronic components on the circuit board 2, the stages 3 and 4 move as shown in FIG. 2, and the stages 3 and 4 are separated and close to the electronic component mounting position. It moves to a position and is configured to be mounted by each mounting head 10.
[0018]
Hereinafter, a method of supplying electronic components using the intermittent feed conveyor 8 according to the configuration of the mounting head 10 and the shape and size of the electronic components will be described in detail with reference to FIGS.
[0019]
FIG. 3 shows a case where five suction nozzles 11 are arranged on the mounting head 10 at a pitch L1, and the component mounting efficiency of the mounting head 10 is highest in all the five suction nozzles 11. It is adsorbing and mounting parts. For this reason, while the intermittent feed conveyor 8 is fed at a predetermined pitch that is the same as the arrangement pitch of the suction nozzles 11, electronic components are sequentially supplied onto the intermittent feed conveyor 8 by the transfer head 9. Individual electronic components can be sucked at the same time and can be efficiently mounted.
[0020]
As shown in FIG. 4, when ten suction nozzles 11 are arranged on the mounting head 10 at a pitch L2, electronic components are arranged on the intermittent feed conveyor 8 at a pitch L2 as described above. By supplying in such a manner, ten electronic components can be sucked simultaneously by the mounting head 10 and can be mounted efficiently.
[0021]
Further, as shown in FIG. 5, three suction nozzles 11 (N1 to N3) are mounted on the mounting head 10, N1 and N2 are L3 pitches, N2 and N3 are Lx (Lx = K × L3, K: arbitrary When the electronic components B1 and B2 are arranged and supplied on the intermittent feed conveyor 8 at a pitch of L3, then the intermittent feed conveyor 8 is sent K times at a pitch of L3. By arranging and supplying the rear electronic component B3, the mounting head 10 can simultaneously suck these three electronic components, and can be efficiently mounted.
[0022]
In addition, as shown in FIG. 6, when five suction nozzles 11 (N1 to N5) are arranged on the mounting head 10 at a pitch L4, and on the intermittent feed conveyor 8, the electronic component B1 at a pitch L4, When B2 is arranged to interfere with each other, as shown in FIG. 7, after the first electronic component B1 is arranged on the intermittent feed conveyor 8, the intermittent feed conveyor 8 is sent by 2 × L4. By arranging the electronic component B2, the electronic components B1 and B2 can be simultaneously sucked by the suction nozzles N1 and N3.
[0023]
When three electronic components are picked up at the same time, they are picked up at the suction nozzles N1, N3 and N5 by arranging and supplying each electronic component on the intermittent feed conveyor 8 at a pitch of 2 × L4. Can do.
[0024]
Also, as shown in FIG. 8, when two electronic components are picked up simultaneously and the feed direction of the intermittent feed conveyor 8 is the arrow direction, the electronic component B1 is arranged and supplied on the intermittent feed conveyor 8, After that, if the electronic component B2 is arranged by feeding the intermittent feed conveyor 8 by 2 × L4 and the electronic components B1 and B2 are simultaneously sucked by the suction nozzles N3 and N5, the feed amount of the intermittent feed conveyor 8 can be reduced. Can be implemented efficiently.
[0025]
As described above, a plurality of electronic components can be obtained by changing the feed amount of the intermittent feed conveyor 8 in multiple stages according to the shape, size and number of the electronic components and the arrangement configuration of the suction nozzles 11 of the mounting head 10. Can be mounted simultaneously and efficiently.
[0026]
【The invention's effect】
According to the component mounting how the present invention, using the intermittent feed conveyor to the intermediate component supply unit as described above, the combination of operation and feeding operation of the intermittent feed conveyor for supplying the components on the indexing conveyor at the transfer head Since the arrangement state of the parts on the intermittent feed conveyor is variable, even if the structure of the mounting head and the number, shape, and size of parts to be supplied change, the intermediate part supply body can be replaced. Efficient mounting can be realized by easily picking up and mounting multiple parts at the same time.
[Brief description of the drawings]
FIG. 1 is a plan view showing an overall schematic configuration of a component mounting apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view showing one state at the time of mounting in the same embodiment;
FIG. 3 is an explanatory diagram of a first component simultaneous suction mode in the same embodiment;
FIG. 4 is an explanatory diagram of a second component simultaneous suction mode in the same embodiment;
FIG. 5 is an explanatory diagram of a third component simultaneous suction mode in the same embodiment;
FIG. 6 is an explanatory diagram of a problem in the case of a large component in the same embodiment.
FIG. 7 is an explanatory diagram of a fourth component simultaneous suction mode in the same embodiment;
FIG. 8 is an explanatory diagram of a fifth component simultaneous suction mode in the same embodiment;
FIG. 9 is a perspective view showing an overall schematic configuration of a conventional component mounting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Circuit board 6 Component supply part 8 Intermittent feed conveyor (intermediate component supply body)
9 Transfer head 10 Mounting head 11 Suction nozzle

Claims (2)

A plurality of components from the component supply unit supplies at the transfer head to the intermediate component supply unit, is sucked and held components on the intermediate component supply unit by a plurality of suction nozzles provided on the mounting head, mounted on the board In the component mounting method to
With intermittent feed conveyor to the intermediate component supply unit, to correspond to the arrangement pitch of the suction nozzle in the mounting head, by setting the feed amount of the intermittent feed conveyor while supplying part in said transfer head a component mounting method characterized by varying the arrangement of the components on the indexing conveyor by combining the feed operation of said at transfer head and operation of supplying the component on the indexing conveyor the intermittent feed conveyor . A plurality of components are supplied from the component supply unit to the intermediate component supply body by the transfer head, and the components on the intermediate component supply body are sucked and held by a plurality of suction nozzles provided on the mounting head and mounted on the substrate. In the component mounting method to
The intermittent feeding conveyor is used as the intermediate part supply body, and the intermittent feeding conveyor feeds the parts by the transfer head according to the shape and number of the parts to be sucked and held by the suction nozzle of the mounting head. By setting the amount, the arrangement state of the parts on the intermittent feed conveyor can be varied by combining the operation of supplying the parts onto the intermittent feed conveyor with the transfer head and the feed operation of the intermittent feed conveyor. part product implementation method shall be the feature.

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