JP6039742B2 - Electronic circuit component mounting method and electronic circuit component mounting system - Google Patents

Description

  The present invention relates to an electronic circuit component mounting method and an electronic circuit component mounting system, and more particularly to mounting of an electronic circuit component on a plurality of circuit substrates by a mounting head holding a plurality of suction nozzles.

  Patent Document 1 below describes a method of mounting electronic circuit components on a multi-sided substrate using a mounting head that holds a plurality of suction nozzles. A multi-sided board is a combination of a plurality of sub-boards, and is divided into sub-boards after mounting electronic circuit components, and each of the plurality of sub-boards is made into one circuit board. At the time of mounting, the entire multi-sided substrate is transferred as a single circuit board by the transfer device and held by the substrate holding device. Electronic circuit components are mounted in the same pattern on the plurality of sub-boards of the multi-sided board. An example is described in which three types of electronic circuit components are mounted on one sub-board and two types are mounted one by one, and one type is mounted by four. They are mounted at positions corresponding to each other. Mounting is performed for each type of electronic circuit component. When four electronic circuit components of the same type are mounted, the mounting head holds four suction nozzles of the same type, and all of the suction nozzles receive electronic circuit components from the component supply device. It is taken out and moved to the multi-sided board and mounted on the sub board. In this case, the four electronic circuit components respectively held by the four suction nozzles are mounted together on one sub-board, or mounted on the mounting positions corresponding to each other on the four sub-boards. In any case, a plurality of electronic circuit components of the same type are collectively taken out from the component supply device, transported, and mounted, so that the mounting head is used as compared with the case where the components are taken out, transported, and mounted one by one. The number of times electronic circuit components are conveyed from the component supply device to the circuit board can be reduced, and the mounting efficiency is improved.

JP 2007-306040 A

However, the method described in Patent Document 1 still has room for improvement. For example, in this method, when an electronic circuit component is mounted, it is possible to improve the mounting efficiency with respect to a sub-board of a multi-sided board, which is a single circuit board, but not with respect to a plurality of multi-sided boards. There is room for improvement.
The present invention has been made under the circumstances described above, and an object thereof is to improve the mounting of electronic circuit components on a plurality of circuit substrates by a mounting head holding a plurality of suction nozzles.

In order to solve the above problems, an electronic circuit component mounting method of the present invention includes:
One or more mounting heads holding a plurality of suction nozzles allow a plurality of electronic circuit components to be received from a component supply device, and the plurality of electronic circuit components are separately separated by a substrate conveyor device comprising a conveyor having one or more lanes. A method of mounting on a plurality of circuit substrates that are transported and separately held in one or more substrate holding devices,
A circuit in which each of the one or more mounting heads receives a plurality of electronic circuit components from the component supply device, and each of the one or more mounting heads is held by the one or more base material holding devices. Each of the one or more mounting heads mounted with the plurality of electronic circuit components is moved to the base material, and each of the one or more mounting heads is mounted with the received plurality of electronic circuit components on the circuit base material. Repeatedly moving to the component supply device, after mounting all the electronic circuit components to be mounted on one of the plurality of circuit substrates and finishing the mounting operation on the circuit substrate, Assuming that the mounting operation of the electronic circuit component to another one of the plurality of circuit substrates is started,
An electronic circuit component to be mounted on one of the plurality of circuit substrates when the mounting operation is switched from one of the plurality of circuit substrates to another; and the plurality of circuit substrates An electronic circuit component to be mounted on the other one of the plurality of mounting heads, and the mounting head receives one of the one or more circuit substrates and the plurality of circuit substrates. A plurality of electronic circuit components received by the mounting head are mounted on another one of the circuit substrates.
For example, (i) a printed wiring board on which an electronic circuit component is not yet mounted, (ii) an electronic circuit component is mounted on and electrically connected to one surface, and an electronic circuit is mounted on the other surface. Includes printed circuit boards without circuit components, (iii) base material on which a bare chip is mounted and constituting a substrate with a chip, (iv) base material on which an electronic circuit component having a ball grid array is mounted “Circuit board” is a general term for printed wiring boards and printed circuit boards.

In order to solve the above problems, an electronic circuit component mounting system according to the present invention includes:
A component supply device for supplying a plurality of electronic circuit components;
A substrate conveyor device for separately conveying a plurality of circuit substrates by a conveyor of one or more lanes;
One or more substrate holding devices for separately holding a plurality of circuit substrates conveyed by the substrate conveyor device;
One or more mounting heads holding a plurality of suction nozzles receive a plurality of electronic circuit components from the component supply device, and a plurality of circuit substrates are separately held by the one or more substrate holding devices . A mounting device to be mounted on each;
A control device for controlling the component supply device, the substrate conveyor device and the mounting device,
The control device, with respect to the mounting device,
A circuit in which each of the one or more mounting heads receives a plurality of electronic circuit components from the component supply device, and each of the one or more mounting heads is held by the one or more base material holding devices. Each of the one or more mounting heads mounted with the plurality of electronic circuit components is moved to the base material, and each of the one or more mounting heads is mounted with the received plurality of electronic circuit components on the circuit base material. Repeatedly moving to the component supply device , mounting all electronic circuit components to be mounted on one of the plurality of circuit substrates, and finishing the mounting operation on the circuit substrate, then the plurality of sheets In addition to performing control to start the mounting operation of the electronic circuit component to another one of the circuit substrates,
When the mounting operation is switched from one of the plurality of circuit substrates to another, an electronic circuit component to be mounted on one of the plurality of circuit substrates, and the plurality of circuit substrates An electronic circuit component to be mounted on another one is received by one of the one or more mounting heads, and the mounting head causes one of the plurality of circuit substrates and the plurality of circuits to be received. Control is performed so that a plurality of electronic circuit components received by the mounting head is mounted on another one of the substrates.

According to the method of the present invention, electronic circuit components to be mounted on two or more circuit substrates that are transported and held separately are taken out and transported together. Compared to the case where the sheet is taken out and transported, the number of times the electronic head is transported from the component supply device to the substrate holding device by the mounting head can be reduced. Thereby, the energy consumption required for conveyance can be reduced and energy saving can be achieved. Also, the mounting efficiency can be improved.
Further, a switching device (for example, a kind of electromagnetic control valve) provided between the negative pressure source and a valve provided for each of the plurality of suction nozzles or each of the plurality of suction nozzles for switching supply / cutoff of the negative pressure. (Which is constituted by an electromagnetic on-off valve) can be reduced, and the energy required for the switching can be reduced to save energy. The same applies to the case where positive pressure is supplied from the positive pressure source to the suction nozzle and the electronic circuit components are actively released.

  In the electronic circuit component mounting system according to the present invention, the electronic circuit component mounting method according to the present invention is implemented, and it is possible to efficiently mount the electronic circuit component on the circuit substrate while obtaining an energy consumption reduction effect and the like. .

Aspects of the Invention

  In the following, the invention which is recognized as being claimable in the present application (hereinafter, referred to as “claimable invention”. The claimable invention is a subordinate concept invention of the present invention which is the invention described in the claims) And may include inventions of a superordinate concept of the present invention or other concepts). As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, the prior art, the common general technical knowledge, and the like. An aspect in which a constituent element is added and an aspect in which the constituent element is deleted from the aspect of each section can be an aspect of the claimable invention.

  The various aspects of the claimable invention described above correspond to the claims.

(1) One or more mounting heads holding a plurality of suction nozzles allow a plurality of electronic circuit components to be received from a component supply device, and the plurality of electronic circuit components are composed of a conveyor having one or more lanes. Are separately transported by a method of mounting on a plurality of circuit substrates that are separately held by one or more substrate holding devices,
A plurality of electronic circuit components to be mounted on two or more of the plurality of circuit substrates are held by the plurality of suction nozzles of the mounting head from the component supply device, and the plurality of the plurality of electronic circuit components that are held The electronic circuit parts are transported together, a part of the plurality of electronic circuit parts is attached to one of the two or more circuit substrates, and another part is attached to another circuit substrate. An electronic circuit component mounting method comprising:

(2) The same kind of electronic circuit components as the plurality of electronic circuit components are mounted on the one circuit board as the plurality of electronic circuit components more than the number of the plurality of suction nozzles of the one mounting head. The electronic circuit component mounting method described.

  The present invention can also be applied to mounting electronic circuit components of different types. However, it is easy to apply when repeatedly mounting the same kind of electronic circuit components. For example, as will be described later, when performing mounting error recovery, it is particularly desirable that the electronic circuit components to be mounted are of the same type.

  In order to mount a set number of electronic circuit components on a single circuit board, it is necessary to carry the electronic circuit parts twice or more by the mounting head, and it is necessary to take out, carry and mount the electronic circuit parts. If it is performed in units of one sheet, the mounting head is operated with a suction nozzle that does not hold electronic circuit components, and waste is likely to occur. On the other hand, according to the method described in this section, the vacant suction nozzle can hold the electronic circuit component to be mounted on another circuit substrate, and the number of conveyances can be reduced.

(3) The electronic circuit component mounting method according to item (1), wherein the plurality of electronic circuit components is one type of electronic circuit component.

  The number of electronic circuit components mounted on one circuit substrate may be more or less than or equal to the number of suction nozzles. When the number of electronic circuit components mounted on a single circuit board is smaller than the number of suction nozzles, and even when the number is larger than the number of suction nozzles, as in the last mounting of a single circuit board When the number of electronic circuit components transported at one time is smaller than the number of suction nozzles, a plurality of electronic circuit components can be transported together. Even when the number of electronic circuit components and the number of suction nozzles are the same, for example, when it is necessary to recover mounting mistakes and it is necessary to transport electronic circuit components more than once for one circuit substrate It is effective to convey a plurality of electronic circuit components together.

(4) A multi-lane conveyor extending in parallel with each other is used as the substrate conveyor device, and the one or more mounting heads are commonly used for mounting electronic circuit components on a circuit substrate conveyed by the multi-lane conveyor. And at least one of the one or more mounting heads, the electronic circuit component to be mounted on the circuit base material transported by one lane among the plurality of lanes and the circuit base material transported by another one lane The electronic circuit component mounting method according to any one of (1) to (3), wherein the electronic circuit component to be mounted is held together.

  According to this method, the circuit substrate conveyed by another one-lane conveyor is another one circuit substrate, and the circuit substrate conveyed by the one-lane conveyor of the plurality of lanes The mounting of the electronic circuit component may be performed in parallel with the mounting of the electronic circuit component by the one or more mounting heads or following the completion of the mounting of the electronic circuit component on the circuit substrate.

  From the viewpoint of improving the efficiency of installation work while suppressing an increase in equipment costs, it is effective to share one installation head for a two-lane conveyor, for example, in which case (1) to (3) Applying the invention according to any one of the above is one aspect of the invention of this section. However, in terms of energy saving, for example, when two mounting heads are shared by a two-lane conveyor, the items (1) to (3) The effect can also be obtained by applying the invention according to any one of the items). At least one of the two mounting heads holds and transports the electronic circuit component mounted on another circuit substrate together.

(5) An electronic circuit component to be mounted on a circuit substrate conveyed by the one lane conveyor to the one mounting head and an electronic circuit to be mounted on a circuit substrate conveyed by the other one lane conveyor. The components are held together at a time when the mounting operation of these electronic circuit components straddles the circuit substrate transported by the one-lane conveyor and the circuit substrate transported by the other one-lane conveyor. The electronic circuit component mounting method according to item (4).

  Depending on the circumstances such as the supply of parts, the number and distribution of mounting locations, and the like, during the mounting work on two circuit substrates transported by a conveyor of one lane and another conveyor of one lane, those 2 In some cases, it is effective to hold electronic circuit components to be mounted on one circuit substrate together in one mounting head. However, the case described in this section is universally effective.

(6) A one-lane conveyor is used as the base material conveyor device, and two mounting heads are used as the mounting heads for mounting electronic circuit components on a circuit base material conveyed by the one-lane conveyor. At least one of the two mounting heads has another circuit board conveyed by the same one lane conveyor as one or more electronic circuit components to be mounted on one circuit substrate conveyed by the one lane conveyor. The electronic circuit component mounting method according to any one of (1) to (3), wherein one or more electronic circuit components to be mounted on the material are held together.

  In the method described in this section, another circuit substrate conveyed by the same one-lane conveyor is another circuit substrate.

  By mounting electronic circuit components alternately on the two mounting heads, when one electronic circuit component is mounted, the other can take out the electronic circuit component from the component supply device, and the electronic circuit component can be efficiently operated. Can be installed. In addition, the electronic circuit components to be mounted on the two circuit substrates are transported together by at least one mounting head, thereby saving energy.

(7) A single-lane conveyor is used as the substrate conveyor device, a single mounting head is used as the mounting head, and a single circuit board transported by the single-lane conveyor to the single mounting head. One or more electronic circuit components to be mounted on a material and one or more electronic circuit components to be mounted on another circuit substrate conveyed by the same one-lane conveyor are held together (1) Item 4. The electronic circuit component mounting method according to any one of Items (3) to (3).

(8) One or more electronic circuit components to be mounted on the one circuit substrate and one or more electronic circuit components to be mounted on the other circuit substrate on the one mounting head. (6) or (7) is the time when the mounting operation of the electronic circuit components straddles the one circuit substrate and the another circuit substrate. Electronic circuit component mounting method.

  If the number of electronic circuit components to be mounted on one circuit substrate is less than the number of suction nozzles immediately before mounting of the electronic circuit component on another circuit substrate, By holding electronic circuit components on a larger number of suction nozzles and mounting them on another sheet, it is possible to reduce the number of times the component is transported by the mounting head.

(9) When a mounting error occurs in at least one of the electronic circuit components to be mounted on the one circuit board, another electronic circuit component that replaces the at least one electronic circuit component is replaced with the other one. Any one of the items (1) to (8), wherein the electronic circuit component to be mounted on one circuit board is held by the one mounting head, and recovery is performed so that the circuit board is mounted on the one circuit board. The electronic circuit component mounting method described in 1.

  The aspect described in this section is one of typical application examples of the claimable invention together with the aspects described in the above paragraphs (5) and (8).

(10) When it is necessary to stop the mounting operation after the mounting operation on the one circuit substrate, the mounting is performed on the plurality of suction nozzles of the one mounting head on the one circuit substrate. The electronic circuit component mounting method according to any one of (1) to (9), wherein electronic circuit components other than the electronic circuit component to be held are not held.

  The case where it is necessary to stop the mounting operation after the completion of the mounting operation on the one circuit substrate is, for example, the last circuit substrate of the set number of circuit substrates, after the completion of the mounting operation on the circuit substrate Is a case in which a setup change or the like is necessary and subsequent mounting work for another type of circuit base material is not performed, or when a stop command for a circuit component mounting machine is issued by an operator.

  If the electronic circuit components are held by all the suction nozzles even when the mounting operation is stopped, the electronic circuit components other than the electronic circuit components mounted on one circuit substrate are not mounted and are held by the mounting head. If the electronic circuit component is not mounted on the circuit base material on which the electronic circuit component is mounted next, the electronic circuit component is abandoned. In particular, if the electronic circuit component is not reused, it is wasted. For this reason, wasteful generation is avoided by not holding the electronic circuit components when the work is stopped.

(11) The electronic circuit component mounting method according to any one of (1) to (10), wherein each of the plurality of circuit base materials is a multi-faced base material in which a plurality of child base materials are integrated.

  The plurality of child bases may have the same or different circuit patterns (electronic circuit component mounting patterns).

  The effect of the present invention can be obtained when electronic circuit components are mounted on a plurality of multi-sided substrates.

(12) When a part of the plurality of sub-bases is a mounting prohibition base that is prohibited from being mounted, the plurality of sub-bases are held together by the plurality of suction nozzles of the one mounting head. A part of the plurality of electronic circuit components is attached to the child base material in front of the attachment prohibitor base material, and another part of the electronic circuit components is attached to the child base material after the attachment prohibition child base material. The electronic circuit component mounting method according to (11), wherein the electronic circuit component is mounted.

  For example, a normal electronic circuit cannot be formed even if an electronic circuit component is mounted, such as when cream-like solder is not properly applied to the electrode, or the electrode or circuit formation is missing or abnormal. Prohibited in case. According to the invention of this section, it is avoided that the electronic circuit component is mounted on the mounting prohibitor base material and is wasted.

(13) The two or more circuit substrates are two circuit substrates, and only when the second circuit substrate is already waiting, the plurality of suction nozzles of the one mounting head The electronic circuit component mounting method according to any one of (1) to (12), wherein electronic circuit components to be mounted on the two circuit substrates are held together.

  If the circuit substrate is not on standby, the type of the circuit substrate on which the next electronic circuit component is mounted changes, or the mounting operation is stopped, etc. The electronic circuit component for the second circuit substrate It may be wasted even if it is held. Next, if an electronic circuit component is mounted, energy saving can be achieved, but priority is given to eliminating the possibility of being wasted.

  When the conveyor is 1 lane, the second circuit board is kept on the upstream side of the conveyor. When the conveyor is multi-lane, the second circuit board is actually mounted with electronic circuit components. It is made to stand by in the conveyor different from the conveyor which conveys the circuit board currently being conveyed, or the upstream of the other conveyor.

(14) When applying a temporary fixing agent to at least one of the electronic circuit components and mounting the electronic circuit component with the temporary fixing agent, only when the next circuit substrate is already on standby, The electronic circuit component according to any one of (1) to (12), wherein the plurality of suction nozzles of one mounting head hold electronic circuit components to be mounted on the two or more circuit substrates. Wearing method.

  The feature described in item (13) is to avoid wasting the second electronic circuit component held by the mounting head when the second circuit substrate does not arrive at the component mounting position. In general, in the aspect described in this section, the elapsed time from the application of the temporary fixing agent becomes longer, the applied temporary fixing agent is dried, and the electronic circuit component becomes unusable, Since there is a high possibility of being wasted, it is particularly effective in avoiding the situation.

  The characteristics described in this section can also be applied when the temporary fixing agent or the adhesive is applied to at least one of the mounting parts of the electronic circuit component of the circuit base material. Only when the circuit base material to which the temporary fixing agent or the like is applied is waiting, the plurality of suction nozzles hold electronic circuit components to be mounted on two or more circuit base materials.

(15) a component supply device for supplying a plurality of electronic circuit components;
A substrate conveyor device for separately conveying a plurality of circuit substrates by a conveyor of one or more lanes;
A mounting device that receives a plurality of electronic circuit components from the component supply device by one or more mounting heads holding a plurality of suction nozzles and mounts each of the plurality of circuit substrates conveyed by the substrate conveyor device. When,
A control device that controls the component supply device, the substrate conveyor device, and the mounting device, and the control device includes:
A plurality of electronic circuit components to be mounted on two or more of the plurality of circuit substrates are held by the plurality of suction nozzles of the mounting head from the component supply device, and the plurality of the plurality of electronic circuit components that are held The electronic circuit parts are transported together, a part of the plurality of electronic circuit parts is attached to one of the two or more circuit substrates, and another part is attached to another circuit substrate. An electronic circuit component mounting system including a mounting control unit.

  The component supply device may be a device that supplies electronic circuit components by a component feeder or tray that is a kind of component supply tool, or a device that supplies chips by a wafer. Examples of the component feeder include a tape feeder, a bulk feeder, and a stick feeder.

It is a perspective view which shows the electronic circuit component mounting line containing multiple mounting modules as an electronic circuit component mounting system which is embodiment of the claimable invention. It is a perspective view which shows a part of said several mounting module. FIG. 3 (a) is a rear view (partial cross section) showing a part of the substrate conveyor device of the mounting module, and FIG. 3 (b) is a cross-sectional view taken along line AA in FIG. 3 (a). It is a perspective view which shows the mounting apparatus of the said mounting module. It is a perspective view which shows the mounting head of the said mounting apparatus. It is a perspective view which removes the cover and shows the mounting head. It is a block diagram which shows notionally the control apparatus which controls the said mounting module. It is a graph which shows the sequence list memorize | stored in RAM of the control computer which comprises the main body of the said control apparatus. FIG. 9A is a chart for explaining the mounting of the electronic circuit components on the circuit board according to the sequence list, and FIG. 9B is a chart for explaining the mounting of the electronic circuit parts on the conventional circuit board. is there. It is a table | surface explaining the recovery when a mounting mistake generate | occur | produces during mounting | wearing of the electronic circuit component to the circuit board according to the said sequence list. It is a flowchart which shows the component mounting routine memorize | stored in RAM of the said control computer. It is a flowchart which shows the first time mounting step in the said component mounting routine. It is a table | surface which shows the sequence list used for the mounting | wearing to the circuit board of an electronic circuit component in the electronic circuit component mounting system which is another embodiment. FIG. 14 is a table for explaining mounting of electronic circuit components on a circuit board according to the sequence list shown in FIG. 13. FIG. 14 is a table for explaining recovery when a mounting error occurs during mounting of an electronic circuit component on a circuit board according to the sequence list shown in FIG. 13. It is a figure explaining mounting | wearing of the electronic circuit component to a multi-sided board | substrate. It is a top view which shows roughly the electronic circuit component mounting system which is another embodiment. It is a top view which shows roughly the electronic circuit component mounting system which is another embodiment.

  Hereinafter, several embodiments of the claimable invention will be described with reference to the drawings. In addition to the following embodiment, the claimable invention can be implemented in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section.

  FIG. 1 shows the appearance of an electronic circuit component mounting line (hereinafter abbreviated as a mounting line). This mounting line is configured by a plurality of mounting modules 10 being arranged and fixed in a row adjacent to each other on a common base 12. Each of the plurality of mounting modules 10 is an electronic circuit component mounting system that is a kind of a circuit board working system, and shares the mounting of the electronic circuit components on the circuit board and performs them in parallel.

The mounting module 10 is described in detail in, for example, Japanese Patent Application Laid-Open No. 2004-104075, and parts other than the part relating to the claimable invention will be briefly described.
As shown in FIG. 2, each mounting module 10 includes a module main body 18, a substrate conveyor device 20 as a base material conveyor device, a substrate holding device 22 as a base material holding device, a component supply device 24, a mounting device 26, and a reference mark imaging. The apparatus 28 (refer FIG. 4), the components imaging device 30, the flux application | coating apparatus 32, and the control apparatus 34 are provided.

  The module main body 18 includes a bed 36 that is long in the front-rear direction. The substrate conveyor apparatus 20 includes two conveyors 40 and 42, and is provided at the center of the bed 36 in the front-rear direction of the mounting module 14, and the circuit board 44 is parallel to the direction in which the plurality of mounting modules 14 are arranged. , Transport in the horizontal direction. In the present embodiment, the conveyance direction of the circuit board 44 is the X-axis direction, and the direction orthogonal to the X-axis direction in a horizontal plane is the Y-axis direction. The front-rear direction of the mounting module 14 is parallel to the Y-axis direction.

  As shown in FIG. 3, the conveyors 40 and 42 are belt conveyors in this embodiment, and are provided in parallel to each other. Each of the conveyors 40 and 42 includes a pair of endless conveyor belts 50 and a belt rotating device 52 that rotates each conveyor belt 50. Each of the two belt circulators 52 of the conveyor belts 40 and 42 shares an electric motor 54 as a driving source, and a pair of conveyor belts 50 are circulated at the same time. The supported circuit board 44 is conveyed with the component mounting surface, which is the work surface, in a horizontal posture. The substrate conveyor apparatus 20 includes a two-lane conveyor, and at least one of the conveyors 40 and 42 is used to convey the circuit board 44.

  As shown for the conveyor 40 in FIG. 3, each of the conveyors 40 and 42 is provided with a substrate carry-in sensor 56 at a position upstream from the upstream end in the substrate transport direction. The substrate carry-in sensor 56 is constituted by, for example, a transmissive photoelectric sensor that is a photoelectric sensor that is a kind of a non-contact sensor, and includes a light emitting unit 57 and a light receiving unit 58 provided in the width direction of the conveyor 40. An ON signal is emitted by receiving light 58, and an OFF signal is emitted by preventing light reception. The width direction of the conveyor 40 is a direction orthogonal to the substrate conveyance direction in a horizontal plane that is a plane parallel to the mounting surface of the circuit board 44 conveyed by the conveyor 40, and is parallel to the Y-axis direction. Further, the transfer width (the interval between the pair of conveyor belts 50) is changed by a width changing device (not shown) in accordance with the width of the circuit board to be transferred.

  The substrate holding device 22 is provided for each of the two conveyors 40 and 42. In this embodiment, as shown in FIG. 3, the substrate support device 60 and a pair of clamp members 62 (one clamp member 62 is shown in FIG. 3). The circuit board 44 is held in a posture in which the mounted surface is horizontal. The substrate support device 60 includes a plurality of support pins 64 that are support members and a support base 66 that is a support member that supports the support pins 64, and is lifted and lowered by a substrate support device lifting device 68 (see FIG. 7). The substrate 44 is supported from below. Each of the pair of clamp members 62 clamps both side edges parallel to the conveyance direction of the circuit board 44.

  As shown in FIG. 2, the component supply device 24 is provided on one side in the Y-axis direction with respect to the substrate conveyor device 20 of the bed 36 and on the front side of the mounting module 10. The component supply device 24 supplies electronic circuit components by a tape feeder (hereinafter abbreviated as “feeder”) 70 which is a kind of component feeder, for example, and a plurality of feeders 70 and feeder support to which these feeders 70 are attached. Base (not shown). Each of the plurality of feeders 70 supplies a large number of electronic circuit components of the same type while being held by a tape, and is attached to the feeder support base in a state where the respective component supply units are aligned along the X-axis direction.

  As shown in FIGS. 2 and 4, the mounting device 26 includes a mounting head 80 that is a working head and a head moving device 82 that moves the mounting head 80. As shown in FIG. 4, the head moving device 82 includes an X-axis direction moving device 84 and a Y-axis direction moving device 86. The Y-axis direction moving device 86 includes a linear motor 90 provided on a crown 88 constituting the module main body 18 so as to straddle the component supply unit of the component supply device 24 and the two substrate holding devices 22, and serves as a movable member. The Y-axis slide 92 is moved to an arbitrary position in the Y-axis direction. The X-axis direction moving device 84 is provided on the Y-axis slide 92 and is moved in the X-axis direction with respect to the Y-axis slide 92 and is relatively moved in the X-axis direction with respect to each other. And an X-axis slide moving device 98 for moving the slides 94 and 96 in the X-axis direction (only the moving device 98 for moving the second X-axis slide 96 is shown in FIG. 4). . Each of the two X-axis slide moving devices includes, for example, an electric motor 99 (see FIG. 7) as a drive source and a feed screw mechanism including a feed screw and a nut. Move to any position in the direction. A ball screw is suitable as the feed screw, and an electric motor capable of controlling the rotation angle, such as a servo motor, is suitable as the electric motor 99.

  The mounting head 80 is detachably mounted on the second X-axis slide 96 and is moved by a head moving device 82 in a mounting work area that is a moving area straddling the component supply unit of the component supply apparatus 24 and the two substrate holding apparatuses 22. It can be moved to any position. The mounting head 80 is configured to hold electronic circuit components by a suction nozzle 100 which is a kind of component holder, and holds the suction nozzle 100 and has a different number of nozzle holders constituting the component holder holding portion. A plurality of types of mounting heads 80 are prepared and selectively attached to the second X-axis slide 96 according to the type of the circuit board 44 on which the electronic circuit components are mounted.

  For example, the mounting head 80 shown in FIG. 5 includes a plurality of nozzle holders 102, for example, three or more, for example, 12 in the illustrated example, and can hold up to 12 suction nozzles 100. As shown in FIG. 6, the mounting head 80 has a rotating body 112 provided on the head body 110 so as to be rotatable around a vertical rotation axis, and an electric motor such as a servo motor as a drive source. The rotary head includes a rotating body rotating device 114 that rotates an arbitrary angle in both reverse directions. In the rotating body 112, the nozzle holder 102 is placed on the rotating axis of the rotating body 112 at an appropriate interval on one circumference centered on the rotating axis, and at 12 positions equidistant from the mounting head 80 shown in the figure. The suction nozzle 100 is detachably held at the projecting end portion from the rotating body 112 and is provided so as to be relatively movable in a parallel direction and rotatable about its own axis.

  The twelve nozzle holders 102 are swung around the rotation axis of the rotating body 112 by the rotation of the rotating body 112 and sequentially moved to a component suction mounting position that is one of the twelve stop positions. It is moved up and down by a lifting device 116 provided at a position corresponding to the component suction mounting position 110. The nozzle holder 102 is further rotated around its own axis by a holder rotating device 118 provided in the head main body 110. The elevating device 116 and the holder rotating device 118 are driven by an electric motor such as a servo motor, and the nozzle holder 102 is lowered to an arbitrary position and rotated at an arbitrary angle in both forward and reverse directions.

  Although not shown, the head main body 110 is further provided with a valve switching device that switches a valve provided for each of the twelve nozzle holders 102 to allow supply of negative pressure and positive pressure to the suction nozzle 100, respectively. , Is designed to be blocked. A negative pressure and a positive pressure are supplied to the mounting head 80 from a negative pressure source and a positive pressure source (not shown) via the second X-axis slide 96, and an electromagnetic control valve (not shown) provided in the head body 110 is supplied. By the control, the supply to the valve is allowed or cut off.

  As shown in FIG. 4, the reference mark imaging device 28 is mounted on the second X-axis slide 96, moved together with the mounting head 80 by the head moving device 82, and provided on the mounting surface of the circuit board 44. (Not shown) is imaged. A plurality of reference marks, for example, two, are provided in a diagonal direction. The reference mark imaging device 28 is constituted by, for example, a CCD camera or a CMOS camera. The head moving device 82 also serves as a reference mark imaging device moving device.

  As shown in FIG. 2, the component imaging device 30 and the flux application device 32 are provided with their positions fixed at a portion of the bed 36 between the component supply device 24 and the substrate conveyor device 20. In the present embodiment, the component imaging device 30 is configured such that the suction nozzles 100 are held by all the nozzle holders 102 of the mounting head 80 and the electronic circuit components held by all the suction nozzles 100 can be simultaneously imaged. ing.

  The flux application device 32 includes a flux container 124. The flux container 124 contains a flux that is a kind of temporary fixing agent. For example, the flux is applied to a ball or flip chip electrode which is an electrode of BGA (Ball Grid Alley 1), and temporarily fixed to a circuit board. The flux container 124 includes a housing recess 126 opened upward. When the electrode is in contact with the bottom surface of the housing recess 126, the flux is applied at a depth at which the flux is applied with an appropriate thickness. Contained.

  As shown in FIG. 7, the control device 34 is mainly composed of a control computer 130, and controls drive sources and the like of various devices constituting the mounting module 10, such as the electric motor 54, via a drive circuit 132. To do. Further, the input / output interface of the control computer 130 is connected to an image processing computer 134 and a board carry-in sensor 56 for processing data obtained by imaging of the reference mark imaging device 28 and the component imaging device 30 and other attachments. A control device 34 of the module 10 and a line control device 136 that controls the entire mounting line are connected via a communication cable 138. The RAM of the control computer 130 stores various data and programs necessary for mounting electronic circuit components on the circuit board, such as the sequence list shown in FIG. 8 and the component mounting routine shown in the flowchart of FIG. .

  The sequence list includes the position of the component mounting portion of the circuit board 44, the type of electronic circuit component to be mounted, the mounting posture, the mounting position on the feeder support base of the feeder 70 that supplies the electronic circuit component, and the type of suction nozzle 100 to be used. Are arranged in the order of mounting in association with each other. The position of the component mounting part is an xy coordinate plane set on the mounting surface of the circuit board 44, and is set by a coordinate value on the coordinate plane with one of the two reference marks as the origin. The xy coordinate plane indicates that the x axis and the y axis are parallel to the X axis and the Y axis of the XY coordinate plane set in the mounting module 10 in a state where the circuit board 44 is held by the board holding device 22. Scheduled and set. FIG. 8 shows a portion of the sequence list in which the mounting order, the electronic circuit component type, and the suction nozzle 100 type are associated with each other. The type of the suction nozzle 100 is represented by the diameter of the suction tube.

  Although illustration is omitted, a shuttle conveyor is provided adjacent to the upstream side of the most upstream mounting module 10, and the circuit board 44 is selectively carried into the conveyors 40 and 42 by the movable conveyor.

  According to the mounting module 10 of the mounting line configured as described above, the electronic circuit component can be mounted on the circuit board in various manners, but the electronic circuit component mounted on the single circuit board 44. There are cases where there are few types of electronic circuit components to be mounted in one mounting module 10, and there are cases where there is only one type. For example, when producing parts and module boards for communication and memory, the number of parts to be mounted is small, and a large number of light-emitting diodes are mounted on a single circuit board, so that displays such as televisions, computers, etc. When manufacturing a light source such as a backlight of an instrument panel display of a vehicle, a backlight of a vehicle, a front light, or a general lighting device, a large number of similar electronic circuit components are mounted on a single circuit board. In this case, electronic circuit components of the same type are mounted on the circuit board 44 in all the mounting modules 10. Hereinafter, mounting of one type of electronic circuit component on the circuit board 44 in one mounting module 10 will be described. For simplicity, five electronic circuit components are mounted on the circuit board 44 for each mounting module 10, and the mounting head 80 includes four suction nozzles 100 of the same type having the same suction tube diameter. Shall be retained. Further, since the types of electronic circuit components mounted on the circuit board 44 are the same, the four suction nozzles 100 receive electronic circuit components from the same feeder 70.

  Furthermore, the case where the conveyors 40 and 42 are used for conveying the circuit board 44 will be described as an example. The circuit boards 44 are alternately carried into the conveyors 40 and 42 and stopped at a preset component mounting position. Then, while the electronic circuit components are being mounted on the circuit board 44 held on one side, the circuit board 44 is carried to the other side and stopped, and held by the board holding device 22 to capture the reference mark and electronic It is made to wait in preparation for mounting | wearing of circuit components. The circuit board 44 that has been carried into the conveyor and held by the board holding device 22 and is actually mounted with the electronic circuit components is loaded into the current component mounting board 44 and another conveyor, and then the electronic circuit components are mounted. The circuit board 44 is referred to as a next component mounting board 44 and is hereinafter referred to as a current board 44 and a next board 44, respectively.

  Since the types of the circuit boards 44 conveyed by the conveyors 40 and 42 are the same, the coordinate values on the xy coordinate plane of the component mounting part are the same for the circuit boards 44 on which the electronic circuit components are mounted. However, the circuit boards 44 in the conveyors 40 and 42 have different positions on the XY coordinate plane of the mounting module 10 and the movement positions of the mounting heads 80 are different. Therefore, the sequence list is created for the circuit board 44 on which the electronic circuit components are mounted on each of the conveyors 40 and 42, and the xy coordinate values of the component mounting portions of each sequence list are the reference obtained by imaging by the reference mark imaging device 28. Coordinate conversion is performed to a position on the XY coordinate plane based on the position of the mark on the XY coordinate plane. At this time, the position errors in the X-axis and Y-axis directions of the component mounting part calculated based on the position errors of the two reference marks are corrected together. The fiducial mark imaging device 28 is moved to the fiducial mark target position set for each of the conveyors 40 and 42 (the position of the fiducial mark having no misalignment), and two of the circuit boards 44 held by the substrate holding device 22. Each reference mark is imaged. In the mounting module 10, there is one component supply device 24, and the same electronic circuit component is mounted on the circuit board 44 conveyed by any of the conveyors 40 and 42, and there is only one type. It is assumed that the electronic circuit components mounted on the 44 are also supplied by the same feeder 70. When there is no electronic circuit component in one feeder 70, the electronic circuit component is supplied by another feeder 70 mounted on the feeder support base.

An outline of mounting of electronic circuit components on the circuit board 44 will be described with reference to FIG.
As illustrated in FIG. 9A, the mounting head 80 receives electronic circuit components in all of the four suction nozzles 100 in the component supply device 24. After the four suction nozzles 100 suck the electronic circuit components, the mounting head 80 is moved to the conveyor of the conveyors 40 and 42 where the circuit board 44 is held, and the four electronic circuit components are conveyed together. The electronic circuit components are mounted on the circuit board 44 in the order set in the sequence list in each of the four suction nozzles 100. This is the first component suction, transport, and mounting of the mounting head 80 (hereinafter referred to as a suction mounting operation). Since the number of suction nozzles 100 is 4, the number of electronic circuit components set is 5, and the circuit board 44 has one mounting portion where no electronic circuit components are yet mounted, the mounting head 80 supplies components. The electronic circuit component is sucked by the suction nozzle 100 by being moved to the device 24. At this time, the number of electronic circuit components to be mounted on the current substrate 44 is one, but all of the four suction nozzles 100 hold the electronic circuit components, and the three electronic circuit components to be mounted on the next substrate 44 together. To be held.

  Then, the mounting head 80 is moved to the current substrate 44, and after mounting one of the held four electronic circuit components on the current substrate 44, the next substrate held by the substrate holding device 22 on another conveyor. The remaining three electronic circuit components that are moved and moved to 44 are mounted. This is the second suction mounting operation of the mounting head 80, and the electronic circuit component is mounted across the end and the start of the mounting of the electronic circuit component on the two circuit boards 44. The next board 44 becomes the current board 44, but it is necessary to mount two electronic circuit components on the current board 44, and the mounting head 80 is moved to the component supply device 24, and four suctions are made. All of the nozzles 100 hold electronic circuit components, and two of them are mounted on the current substrate 44. This is the third suction mounting operation of the mounting head 80, and three mounting operations of the mounting head 80 are performed in order to mount five electronic circuit components on the two circuit boards 44, respectively. After the two electronic circuit components are mounted on the current substrate 44 in the third suction mounting operation, the two electronic circuit components remaining on the mounting head 80 are mounted on the next third circuit substrate 44. . Also for the third and subsequent circuit boards 44, a predetermined number of electronic circuit components are mounted on the two circuit boards 44 by three suction mounting operations.

On the other hand, in the conventional case where the suction mounting operation of the mounting head 80 is performed with one circuit board as one unit, as shown in the table of FIG. The number of electronic circuit components that are not yet mounted, in this case, only one electronic circuit component is sucked, and the mounting head 80 is moved to the current substrate 44 to mount the one electronic circuit component. . The same applies to the next board 44, and a total of four suction mounting operations are required to mount five electronic circuit components on each of the two circuit boards 44. According to this embodiment, the suction mounting operation is performed. You only need one less.

  The effect of reducing the number of suction mounting operations can also be obtained when recovery is performed. In the present embodiment, the recovery is performed when there is a mistake in the suction of the electronic circuit component by the suction nozzle 100, and as a result, a mounting mistake in which the electronic circuit component is not mounted on the circuit board 44 occurs. For the component mounting part of the circuit board 44 on which no component is mounted, the electronic circuit component is sucked and mounted again. For example, the suction mistake means that the electronic circuit component is not picked up, or has been picked up, but the electronic circuit component is standing, or the electronic nozzle is displaced from the suction nozzle 100 so that it cannot be corrected. It is.

  In this embodiment, (I) when the electronic circuit component is held only for the current substrate 44 by the mounting head 80, recovery is performed in the suction mounting operation performed after the suction mounting operation in which a mounting error has occurred. Done. Electronic circuit components are held only for the current substrate 44 because the number of unmounted components, that is, the number of electronic circuit components that are not yet mounted on the current substrate 44, is the number of all the suction nozzles 100 that the mounting head 80 can hold. If the number is greater than or equal to the number, or the number of unmounted devices is smaller than the total number of suction nozzles, the electronic circuit component is not held for the next substrate 44. The number of unmounted devices includes the number of electronic circuit components that are not mounted due to mounting errors. The electronic circuit components held by the mounting head 80 are mounted on the current board 44, and the mounting head 80 has a remainder of the electronic circuit parts in a state where the mounting of the set number of electronic circuit components on the current board 44 is completed. When the remaining electronic circuit components are mounted on the next substrate 44, the number of unmounted devices on the next substrate 44, which is the current substrate 44, is larger than the total number of suction nozzles, and the mounting head 80 is used only for the current substrate 44. Think of holding.

  (II) The number of unmounted electronic circuit components is smaller than the number of all the suction nozzles 100 that can be held by the mounting head 80, but the electronic circuit components are held by all the suction nozzles 100. When a mistake occurs with respect to the attachment, recovery is performed in the suction attachment operation in which the attachment mistake has occurred. The unmounted number includes the number of electronic circuit components that are not mounted due to a mounting error. In this case, of the electronic circuit components sucked by all the suction nozzles 100, when the number of unmounted parts is mounted on the current board 44, the remaining electronic circuits not mounted on the circuit board 44 are mounted on the mounting head 80. There are parts. The types of all the electronic circuit components mounted on the circuit board 44 are the same, and all the suction nozzles 100 hold the same type of electronic circuit components, and the remaining electronic circuit components are present on both the current board 44 and the next board 44. It is an undetermined suction component that can be mounted and has not been determined to be used, and can be used for recovery.

  For example, in the case of the above (I), as shown in the table of FIG. 10A, when recovery is necessary in the state where the first suction mounting operation is performed on the circuit board 44, Assuming that there is one component mounting part that needs to be recovered (hereinafter referred to as a recovery part), one of the four electronic circuit components sucked during the second suction mounting operation is the circuit board 44. Attached to the recovery site. When recovery is performed at the time of the suction mounting operation next to the suction mounting operation in which a mounting error has occurred, in this embodiment, the recovery mounting is performed at the beginning of the next suction mounting operation. Therefore, the types of the five electronic circuit components mounted on the circuit board 44 in the mounting module 10 are the same, and the four suction nozzles 100 of the mounting head 80 are set in advance regardless of whether recovery is performed or not. The electronic circuit components of the same type can be adsorbed in order, but at the time of mounting, the mounting order of the electronic circuit components set in the sequence list is shifted by the number of electronic circuit components that have been recovery mounted (here, one). After the second suction nozzle, the electronic circuit component is mounted from the continuation of the first suction mounting operation. Contrary to this embodiment, recovery mounting is performed after mounting an electronic circuit component (in this embodiment, one electronic circuit component) to all component mounting sites other than the recovery site of the next suction mounting operation to be performed. If a single circuit board 44 is subjected to suction mounting operations a plurality of times and one or a plurality of mounting mistakes occur during the plurality of suction mounting operations, recovery is finally performed. It may be performed collectively.

  Also, in the case of the above (II), as shown in the table of FIG. 10B, when a mounting error occurs in the second suction mounting operation, the electronic circuit component scheduled for the current board 44 After completion of the mounting, recovery mounting is performed (the example shown in FIG. 10B is an example in which a mounting error occurs in the last electronic circuit component among the electronic circuit components scheduled to be mounted. It is supposed to be performed immediately after the mounting mistake occurs), and the undetermined suction component is mounted on the recovery site. In any case, if recovery parts are mounted on the current board 44, the number of electronic circuit parts to be mounted on the next board 44 is reduced correspondingly. However, as shown in FIGS. In the example shown, the suction mounting operation for the two circuit boards 44 is three times.

The above operation will be described based on the component mounting routine shown in FIG.
In this component mounting routine, as described with reference to FIGS. 9 and 10, when the mounting head 80 performs the suction mounting operation of the electronic circuit component including recovery and the flux is applied to the electronic circuit component. When the next board 44 is not waiting and when the circuit board 44 is the last one, the suction mounting operation is performed only for the unmounted part of the current board 44. The last is the last one of the plurality of circuit boards 44 on which electronic circuit components are continuously mounted. The standby means that the current board 44 is held by the board holding device 22. The next substrate 44 is carried into another conveyor different from the existing conveyor, or it is not carried in, but is located upstream of the conveyor.

  In step 1 of the component mounting routine (hereinafter abbreviated as S1; the same applies to other steps), initial mounting is performed. The first mounting is component mounting by the first suction mounting operation performed on the first circuit board 44 among the plurality of circuit boards 44. In this suction mounting operation, as shown in FIG. 12, the circuit board 44 is taken out from the component supply device 24 by the four suction nozzles 100 based on the detection of the carry-in of the circuit board 44 to the conveyor 40, for example, the conveyor 40. An electronic circuit component is imaged by the component imaging device 30, the imaging data is subjected to image processing, and an electronic circuit component holding position error and an adsorption error are detected by the adsorption nozzle 100 (S 52 and S 53). The holding position error includes a position error in the X-axis direction and a Y-axis direction and a rotational position error (position error around the axis of the electronic circuit component). In the present embodiment, the signal of the board carry-in sensor 56 changes from OFF to ON, and the upstream end in the board carrying direction of the circuit board 44 is detected, whereby the carry-in of the circuit board 44 to the conveyor 40 is detected. Is done.

  Thereafter, in S54, it is determined whether or not the flux is applied to the electronic circuit component. This determination is made based on the type of electronic circuit component. If the electronic circuit component is a BGA or flip chip, and flux is applied to the electrodes, the mounting head 80 is moved above the flux container 124 to apply the flux (S55). The four suction nozzles 100 are sequentially moved and lowered to the component suction mounting position, and flux is applied to the electrodes of the electronic circuit component.

  Then, the reference mark imaging device 28 is moved to the current substrate 44 held by the substrate holding device 22 of the conveyor 40 to image the reference mark (S56, S57), and the electronic circuit component is mounted on the current substrate 44. Performed (S58). The imaging of the reference mark is performed in a state where the holding of the circuit board 44 by the board holding device 22 is completed. Completion of this holding can be recognized by the control status of the substrate support device 60 and the like by the control computer 130. Further, based on the position of the reference mark obtained by imaging, coordinate conversion is performed on the component mounting part coordinates set in the sequence list, and the mounting is performed in the order set in the sequence list. At the time of mounting, the holding position error of the electronic circuit component by the suction nozzle 100 and the rotational position error of the circuit board 44 obtained based on the imaging of the two reference marks are corrected. Then, the setting of the flag F indicates that the first suction mounting operation has been performed on the first circuit board 44 (S59). Therefore, when S51 is executed next, the determination result is YES and S52 to S59 are skipped.

  After the initial mounting, S2 of the component mounting routine shown in FIG. 11 is executed, and it is determined whether or not the number of unmounted components is equal to or greater than the number of all the suction nozzles 100 that can be held by the mounting head 80. If there is a mounting mistake, the number of electronic circuit components that are not mounted is included in the unmounted number. Here, if no mounting error occurs and recovery is not required, the number of unmounted devices is 1, the determination result of S2 is NO, S3 is executed, and the current substrate 44 is the last circuit substrate 44. It is determined whether or not. As will be described later, when all the electronic circuit components set for one circuit board 44 have been mounted, the number of circuit boards 44 that have been mounted is counted by the counter when the mounting is completed. If the count value C is one less than the set number, the current board 44 is the last circuit board 44.

  If the circuit board 44 is not the last one, S4 is executed, and if flux is applied to the electronic circuit component, it is determined in S5 whether or not the next board 44 is waiting in the conveyor. . Here, the number of unmounted parts is smaller than the number of nozzles, and the current board 44 is not the last circuit board, and all the suction nozzles 100 of the mounting head 80 hold the electronic circuit components. The electronic circuit components remaining on the head 80 are mounted on the next substrate 44. Therefore, despite the fact that the flux is applied, there is no next substrate 44, and the situation where the electronic circuit component to which the flux is applied is not mounted on the circuit substrate 44 and left unattended is prevented. In the present embodiment, the determination of S5 is made based on whether or not the next substrate 44 is carried in by the substrate carry-in sensor 56.

  If the next substrate 44 is waiting in the conveyor, S6 to S9 are executed in the same manner as S53 to S55 and S58, the mounting head 80 performs the second suction mounting operation, and four suction nozzles. All 100 are received electronic circuit components, one of which is mounted on the current board 44. The same type of electronic circuit components are mounted on the current substrate 44 and the next substrate 44, and the four suction nozzles 100 receive electronic circuit components from the same feeder 70. Therefore, the electronic circuit components held by the suction nozzles 100 are the current substrate 44. The four suction nozzles 100 take out the electronic circuit components in a preset order regardless of which of the next substrate 44 is mounted.

  Then, in S10, it is determined whether or not the mounting of the electronic circuit components on the current board 44 is completed. The presence or absence of a suction error can be determined by imaging the electronic circuit component by the component imaging device 30, and the suction nozzle 100 having the suction error does not perform the mounting operation of the electronic circuit component. Therefore, if the mounting operation by the suction nozzle 100 is performed on all of the component mounting portions set on the circuit board 44, the set number of electronic circuit components are mounted. The mounting is performed according to the order set in the sequence list, and which suction nozzle 100 mounts the electronic circuit component in which mounting site is determined by the component receiving order of the suction nozzle 100 and the mounting order of the component mounting site, A component mounting part that needs to be recovered is identified from the suction nozzle 100 that does not perform the mounting operation, and is stored in a recovery part memory that is provided in the RAM and constitutes a storage unit.

  If the mounting of the set number of electronic circuit components on the current board 44 is completed, S11 is executed, the count value C of the counter is incremented by 1, and the number of circuit boards 44 on which the component mounting is completed is counted. In addition, sequence switching is performed. As described above, the contents of the sequence lists created for the circuit boards 44 on which the electronic circuit components are respectively mounted on the two conveyors 40 and 42 are the same, and here, for reference mark imaging of the reference mark imaging device 28. The reference mark target position is set to a position set on the conveyor side on which the next substrate 44 is conveyed.

  Three electronic circuit components remain in the mounting head 80, the determination result in S12a is YES, S12b is executed, and it is confirmed whether or not the holding of the next substrate 44 by the substrate holding device 22 has been completed. . When the holding is completed, S13 is executed, the reference mark imaging device 28 is moved to the next substrate 44, the reference mark is imaged, coordinate conversion for the position of the component mounting site based on the imaging result, and the mounting head 80 is performed. The three remaining electronic circuit components are mounted on the next substrate 44. This mounting is performed according to the sequence list in which the coordinate conversion has been performed on the position of the component mounting site, and is performed in the order set in the sequence list. After execution of S13, execution of the routine returns to S1. The next substrate 44 becomes the current substrate 44. Next, S51 and S2 to S9 are executed, so that the mounting head 80 performs the third suction mounting operation, and the four electronic circuit components held by the mounting head 80 are obtained. Two of them are mounted on the unmounted portion of the second current board 44 (the circuit board 44 that was the next board 44 first). Then, S10 to S13 are executed, and the two electronic circuit components remaining in the mounting head 80 are mounted on the next substrate 44 (third current substrate 44). The circuit board 44 on which the mounting of the electronic circuit component is completed is carried out of the mounting module 10, and then the circuit board 44 on which the electronic circuit component is mounted is carried in.

  If the next board 44 is not kept waiting in the conveyor when the electronic circuit component is mounted on the current board 44, S16 is executed to determine whether the next board 44 is waiting on the upstream side of the conveyor. Is called. This determination is made for the most upstream mounting module 10 based on whether or not the movable conveyor of the shuttle conveyor is located at a position corresponding to the conveyor that conveys the next substrate 44. This can be understood by supplying information from the line control device 136 to the control computer 130. With respect to the mounting modules 10 other than the most upstream mounting module 10, the determination is made based on whether or not the circuit board 44 is on the corresponding conveyor of the mounting module 10 adjacent on the upstream side. This determination is also performed by supplying information from the line control device 136. If the next substrate 44 is waiting on the upstream side of the conveyor, S17 to S24 are executed in the same manner as S6 and S8 to S13.

  If the next substrate 44 is not waiting on the upstream side of the conveyor, S27 to S31 are executed. In this case, the mounting head 80 holds only the number of electronic circuit components equal to the number of unmounted devices on the current substrate 44 and only mounts the electronic circuit components on the current substrate 44. When the mounting of the electronic circuit components on the current board 44 is completed, the number of boards on which components are mounted is counted and the sequence is switched, and the flag F is reset. As a result, when the circuit board 44 is next carried into one of the conveyors 40 and 42 and electronic circuit components are mounted, the mounting head 80 starts the suction mounting operation based on the detection of the circuit board 44 being loaded. .

  As the electronic circuit components are mounted on the circuit board 44, the mounting of the electronic circuit components on the current board 44 is completed, and the sequence is switched to the next board 44. There are cases where there is no remaining. In this case, since the number of non-mounted nozzles is larger than the number of nozzles, S2 is YES, and the steps from S32 are executed. S32 to S34 are executed in the same manner as S53 to S55. Then, in S35, it is determined whether or not the reference mark has been imaged. Here, since the reference mark has not been imaged yet, the determination result in S35 is NO and S37 is executed, and the reference mark is imaged, coordinate conversion, and electronic circuit component mounting are performed. In this mounting, four electronic circuit components are mounted on the current board 44, and mounting of the electronic circuit components is not completed, so the determination result in S38 is NO.

  If the determination result of S2 is YES when the electronic circuit component is already mounted on the circuit board 44, the reference mark has already been imaged, and the determination result of S35 is YES. S36 is executed. If the mounting of the electronic circuit component on the current substrate 44 is completed by mounting the electronic circuit component, the number of the mounted circuit boards 44 is counted in S39, and if it is not the last circuit substrate 44, the sequence is switched. (S40, S41). If it is the last circuit board 44, the count value C is cleared, the flag F is reset, and the execution of the routine ends (S42).

  If the current board 44 is the last one with the number of electronic circuit components not mounted on the current board 44 being less than the number of nozzles, S43 to S48 are executed. In this case, since there is no next substrate 44, only the number of suction nozzles 100 equal to the number of unmounted devices are sucked and mounted on the current substrate 44. When the mounting of the electronic circuit components on the current board 44 is completed, the count value C is cleared and the flag F is reset.

A case where a mounting mistake occurs and recovery is performed will be described.
For example, if there is a mounting mistake during the first suction mounting operation by the mounting head 80 on the first circuit board 44, the number of unmounted parts including the number of electronic circuit components that need to be recovered is less than the number of nozzles. Then, the steps after S3 are executed, the second suction mounting operation is performed on the current board 44, and when the remaining electronic circuit components are mounted on the current board 44 in S9, first, the current board 44 is loaded. Electronic circuit components are attached to the recovery site. Unless the circuit board 44 is the last one, all of the four suction nozzles 100 hold the electronic circuit parts, and the electronic circuit parts to be attached to the recovery site and the electronic circuit to be attached to the next board 44 The parts are held and transported together, and recovery is performed. Thereafter, electronic circuit components are mounted on the remaining component mounting sites in accordance with the sequence list. The same applies to S19. If the mounting of the electronic circuit component on the current substrate 44 is completed by mounting the electronic circuit component including the recovery of S9 or S19, S11 to S13 or S21 to S24 are executed, and the electronic circuit component remaining in the mounting head 80 is removed. It is mounted on the next substrate 44.

  Even if the recovery is performed, a mounting error may occur and the mounting of the electronic circuit component on the current board 44 may not be completed. In this case, the determination result in S10 (S20) is NO. S10 (S20) is executed when S2 is NO, and when the number of unmounted parts including the number of recovery is smaller than the number of all the suction nozzles 110, electronic circuit components remain in the mounting head 80. The electronic circuit component is mounted on the recovery site due to the mounting error that has occurred (S14, S15, S25, S26). The number of recovery is plural, which is larger than the number of electronic circuit components remaining in the mounting nozzle 80. Even if recovery mounting is performed in S15 and S26, mounting is not completed and electronic circuit components remain in the mounting head 80. If the situation does not occur, the determination result in S14 (S25) is NO, and the recovery mounting is performed in the suction mounting operation by the execution of the next step S2 and subsequent steps. The same applies when a mounting error does not occur during the previous suction mounting operation on the current substrate 44 and a mounting error occurs during the suction mounting operation in a state where the number of unmounted devices is smaller than the number of suction nozzles.

When the next board 44 is not waiting, or when the current board 44 is the last one and the mounting head 80 holds only the number of unmounted electronic circuit components, mounting of the electronic circuit components including recovery is performed. If the mounting error occurs and the mounting of the electronic circuit components on the current board 44 is not completed, S30 or S47 becomes NO, and the number of electronic circuit components equal to the number of unmounted devices is again sucked and mounted. (S27 to S29, S43 to S46).
If the number of unmounted components including the number of electronic circuit components that need to be recovered is equal to or greater than the number of nozzles, recovery is performed when the electronic circuit components are mounted on the current substrate 44 in S36.

  As is apparent from the above description, in the present embodiment, the portion of the control computer 130 that executes S6, S9, S13, S17, S19, and S24 constitutes the mounting control unit, and S6, S9, S17, and S19 are the same. The recovery control unit is configured to hold the electronic circuit components mounted on the recovery site together with the electronic circuit components mounted on the next substrate 44 on the mounting head 80 and mount the electronic circuit components on the recovery site.

  When only one of the two conveyors 40 and 42 is used, and the electronic circuit component is mounted on the circuit board that is transported and held by the board holding device 22, the current board and the next board are in the same lane. In this case, the electronic circuit component is mounted. Therefore, after the installation of the set number of electronic circuit components on the current board is completed, the current board is unloaded and the next board is loaded and held by the board holding device 22, and imaging of the reference mark and electronic circuit parts Installation is performed. In this case, one sequence list is created, and coordinate conversion is performed for each circuit board with respect to the xy coordinates of the component mounting portion set in the list, and the sequence list is used for mounting electronic circuit components. As long as the circuit board 44 is not the last one, all the suction nozzles 100 hold the electronic circuit components, and the mounting operation of the electronic circuit components is performed on the current board 44 and the next board 44 conveyed by the same conveyor. And the next circuit board 44, the electronic circuit components mounted on them are held together. Recovery is also performed in the same manner as when the conveyors 40 and 42 are used.

  The case where the types of the plurality of electronic circuit components mounted on the circuit board are the same in one electronic circuit component mounting machine has been described. However, even when a plurality of types of electronic circuit components are mounted, suction mounting of the mounting head is performed. The effect of reducing the number of operations can be obtained. The embodiment will be described with reference to FIGS. In the present embodiment, two conveyors are used for transporting the circuit board. In the present embodiment, a sequence list is created as illustrated in FIG. There are two types of electronic circuit components. Nine electronic circuit components are mounted on the circuit board, one type of suction nozzle can suck two types of electronic circuit components, and the mounting head has four suction nozzles. Shall be retained.

  As shown in FIG. 14, the four suction nozzles hold the electronic circuit components in the mounting order, and mount the electronic circuit components on the current substrate. If the number of unmounted components on the current board is less than the number of nozzles, the electronic circuit components to be mounted on the next board are suctioned by other than the suction nozzle holding the electronic circuit parts to be mounted on the current board according to the sequence list for the next board. The nozzle is held in the order of mounting. In order to mount the electronic circuit component set in the sequence list shown in FIG. 13 on the circuit board, conventionally, the suction mounting operation is required three times for one circuit board, and six times for the two circuit boards. In contrast, the suction mounting operation is five times in this embodiment.

  If a mounting error occurs, recovery is performed at the time of the suction mounting operation performed next to the suction mounting operation of the time when the mounting error occurs. Even if the number of unmounted units is smaller than the total number of suction nozzles that can be held by the mounting head, there are multiple types of electronic circuit components that are mounted on the circuit board. This is because there is no undetermined suction component. For example, as shown in FIG. 15 (a), if a mounting error occurs in the third electronic circuit component a mounted on the current board during the first suction mounting operation, the second suction mounting operation is performed. First, the electronic circuit component a is held by the suction nozzle. Thereby, the mounting order of the electronic circuit components set in the sequence list is shifted by one, and after the second suction nozzle, the electronic circuit components are held and mounted from the continuation of the first suction mounting operation. Further, if a mounting error has occurred in the electronic circuit component b that is mounted on the current board fourth during the second suction mounting operation, the mounting error is recovered during the third suction mounting operation. Then, by the fifth suction mounting operation, mounting of all the electronic circuit components set for the second circuit board is completed.

Further, as shown in FIG. 15B, when a mounting error occurs in the first (third) electronic circuit component b to be mounted on the current board, which is the first in the third suction mounting operation, the remaining Since the electronic circuit component held by the three suction nozzles is the electronic circuit component a to be mounted on the next substrate, the electronic circuit component actually held by the mounting head cannot be recovered. Therefore, the electronic circuit component a is transported by a conveyor different from the conveyor that transports the current substrate, and is mounted on the next substrate held by the substrate holding device. An electronic board for carrying out recovery mounting together with electronic circuit parts a and b mounted on the next board at the time of the next (fourth) suction mounting operation is not yet carried out, and the current board on which mounting of the electronic circuit parts has not been completed yet. The circuit component b is attracted and mounted on the current board. As a result, the mounting of the electronic circuit component on the current board is completed, and it is carried out.
When a plurality of types of electronic circuit components are mounted on the circuit board, different types of suction nozzles may be used depending on the type of electronic circuit components, and in this case, the number of suction mounting operations can be reduced.

  When one conveyor is used for transporting the circuit board, as shown in FIG. 15 (b), the mounting head is mounted on the current board while holding the electronic circuit components for the next board. When an error occurs in the electronic circuit component, for example, the mounting head is moved to the component supply device while holding the electronic circuit component for the next board, and the electronic suction circuit nozzle is mounted again after the electronic circuit component is mounted. The electronic circuit parts are sucked and recovery mounting is performed. Then, after unloading the current board on which the mounting of the electronic circuit component is completed, the next board is carried in, and the electronic circuit component for the next board held by the mounting head is mounted.

The circuit substrate may be a multi-sided substrate.
A multi-chamfer substrate 150 as a multi-chamfer base material illustrated in FIG. 16A includes a plurality of, for example, six sub-substrates 152. The reference marks 154 and the wiring patterns are similarly formed on these child boards 152, and the electronic circuit components are mounted in the preset order on the six child boards 152. Finally, if the number of unmounted boards 152 on which the electronic circuit components are mounted is less than the maximum number of suction nozzles held by the mounting head, the electronic circuit components to be mounted on the last board 152 are held. The suction nozzles other than the suction nozzle that holds the electronic circuit components to be mounted on the sub board 152 of the next multi-sided board 150 are mounted.

In some cases, the mounting operation is prohibited for some of the six sub-boards 152. For example, as shown in FIG. 16B, the prohibition of the mounting work is represented by a skip determination mark 156 provided on the edge of the multi-sided board 150. The skip determination marks 156 are provided in the same number as the sub-boards 152 and constitute a mounting prohibition display unit. The skip determination mark 156 corresponding to the mounting prohibition child board 152 is colored by an operator so as to be distinguished from other skip determination marks 156. The coloring is performed in a color that has a high contrast between the colored skip determination mark 156 and the uncolored skip determination mark 156 and is distinguished based on the image captured by the reference mark imaging device. After the multi-sided substrate 150 is held by the substrate holding device, the reference mark imaging device is moved to image all the skip determination marks 156, and the presence / absence of the mounting prohibitor substrate 152 is determined based on the imaging result. . If there is the mounting prohibition board 152, a part of the electronic circuit components held by the plurality of suction nozzles of the mounting head is mounted on the child board 152 in front of the mounting prohibition board 152, and the mounting prohibition board 152 is skipped. The remaining part is attached to the child board 152 after the attachment prohibition child board 152. When the mounting prohibition sub-board 152 is the last sub-board, the mounting head performs an electronic circuit component suction mounting operation using the sub-board 152 immediately before the mounting prohibition sub-board 152 as the last sub-board.

  In the electronic circuit component mounting system, as schematically shown in FIG. 17, the substrate conveyor device 170 may include a one-lane conveyor 172, and the mounting device 174 may include two mounting heads 176. The two mounting heads 176 are independently moved in the X-axis direction and the Y-axis direction by a head moving device (not shown). One component supply device 178 may be provided on each side of the direction orthogonal to the conveying direction of the conveyor 172, or may be provided on only one side.

  If the number of electronic circuit components not mounted on the circuit board 180 on which electronic circuit components are actually mounted is smaller than the number of suction nozzles 182, the mounting head 176 that performs the suction mounting operation at that time is not mounted. The other electronic circuit components to be mounted on the circuit board 180 to which the electronic circuit components are to be mounted next. And mounted on the next circuit substrate 180. In the present mounting system, there is one sequence list. When an electronic circuit component is mounted across the two circuit boards 180 by the mounting head 176, the electronic circuit component is mounted on the next circuit board 180. The data is used back to the beginning of the sequence list. However, the target position at which the fiducial mark imaging device images the fiducial mark is common to all circuit boards, but coordinate conversion based on the fiducial mark imaging of the coordinate values of the component mounting parts in the sequence list is performed for each circuit board. Done.

  In the electronic circuit component mounting system, as schematically shown in FIG. 18, the substrate conveyor device 200 may include a one-lane conveyor 202, and the mounting device 204 may include one mounting head 206. For example, the component supply device 208 is provided on one side in the width direction of the conveyor 202, but may be provided on both sides. The mounting head 206 is transported by the conveyor 202 when, for example, one circuit board 210 transported by the conveyor 202 in one lane is less than the number of suction nozzles 212, and then the electronic circuit components are transported. One or more electronic circuit components to be mounted on the circuit board 210 to be mounted can be held together.

  Note that mounting errors include not only suction errors, but also errors that occur during transportation of electronic circuit components after imaging of electronic circuit components by the component imaging device, and errors that occur during mounting operations. May be. In this case, for example, the component mounting part of the circuit substrate is imaged by the imaging device before the suction nozzle performs the mounting operation on the component mounting part, and the imaging is performed again after the mounting operation. For example, if the electronic circuit component is not imaged by two imagings, it can be seen that the electronic circuit component may have fallen after the imaging by the component imaging device. Even if an image is picked up, it is possible to recognize the occurrence of a mounting mistake due to its posture, orientation, displacement with respect to the electrode, etc., and to perform recovery.

20: Substrate conveyor device 40, 42: Conveyor 80: Mounting head 100: Suction nozzle

Claims (5)

One or more mounting heads holding a plurality of suction nozzles allow a plurality of electronic circuit components to be received from a component supply device, and the plurality of electronic circuit components are separately separated by a substrate conveyor device comprising a conveyor having one or more lanes. A method of mounting on a plurality of circuit substrates that are transported and separately held in one or more substrate holding devices,
A circuit in which each of the one or more mounting heads receives a plurality of electronic circuit components from the component supply device, and each of the one or more mounting heads is held by the one or more base material holding devices. Each of the one or more mounting heads mounted with the plurality of electronic circuit components is moved to the base material, and each of the one or more mounting heads is mounted with the received plurality of electronic circuit components on the circuit base material. Repeatedly moving to the component supply device, after mounting all the electronic circuit components to be mounted on one of the plurality of circuit substrates and finishing the mounting operation on the circuit substrate, Assuming that the mounting operation of the electronic circuit component to another one of the plurality of circuit substrates is started,
An electronic circuit component to be mounted on one of the plurality of circuit substrates when the mounting operation is switched from one of the plurality of circuit substrates to another; and the plurality of circuit substrates An electronic circuit component to be mounted on the other one of the plurality of mounting heads, and the mounting head receives one of the one or more circuit substrates and the plurality of circuit substrates. An electronic circuit component mounting method comprising mounting a plurality of electronic circuit components received by the mounting head on another one of circuit substrates.   The electronic circuit component mounting method according to claim 1, wherein the plurality of electronic circuit components is one type of electronic circuit component.   A plurality of lane conveyors extending in parallel to each other are used as the substrate conveyor device, and from the mounting operation to the circuit substrate conveyed in one lane among the plurality of lanes, the circuit substrate conveyed in another lane An electronic circuit component to be mounted on a circuit base material transported in one of the plurality of lanes and an electronic circuit component to be mounted on a circuit base material transported in the other lane when switching to mounting work Is received by one of the one or more mounting heads, and the circuit substrate transported in one lane of the plurality of lanes and the circuit transported in the other one lane by the mounting head. The electronic circuit component mounting method according to claim 1, wherein a plurality of electronic circuit components received by the mounting head are mounted on the base material.   The electronic circuit component mounting method according to claim 1, wherein a one-lane conveyor is used as the base material conveyor device. A component supply device for supplying a plurality of electronic circuit components;
A substrate conveyor device for separately conveying a plurality of circuit substrates by a conveyor of one or more lanes;
One or more substrate holding devices for separately holding a plurality of circuit substrates conveyed by the substrate conveyor device;
One or more mounting heads holding a plurality of suction nozzles receive a plurality of electronic circuit components from the component supply device, and a plurality of circuit substrates are separately held by the one or more substrate holding devices . A mounting device to be mounted on each;
A control device for controlling the component supply device, the substrate conveyor device and the mounting device,
The control device, with respect to the mounting device,
A circuit in which each of the one or more mounting heads receives a plurality of electronic circuit components from the component supply device, and each of the one or more mounting heads is held by the one or more base material holding devices. Each of the one or more mounting heads mounted with the plurality of electronic circuit components is moved to the base material, and each of the one or more mounting heads is mounted with the received plurality of electronic circuit components on the circuit base material. Repeatedly moving to the component supply device , mounting all electronic circuit components to be mounted on one of the plurality of circuit substrates, and finishing the mounting operation on the circuit substrate, then the plurality of sheets In addition to performing control to start the mounting operation of the electronic circuit component to another one of the circuit substrates,
An electronic circuit component to be mounted on one of the plurality of circuit substrates when the mounting operation is switched from one of the plurality of circuit substrates to another; and the plurality of circuit substrates An electronic circuit component to be mounted on the other one of the plurality of mounting heads, and the mounting head receives one of the one or more circuit substrates and the plurality of circuit substrates. An electronic circuit component mounting system, characterized in that control is performed so as to mount a plurality of electronic circuit components received by the mounting head on another one of the circuit substrates.

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