JP2001358498A - Method and apparatus for mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for the mounting of a component wherein a plurality of components can be simultaneously sucked and mounted even when the structure of a mounting head is changed, and even when the number and the shape of the components to be fed are changed. SOLUTION: In the method and the apparatus for the mounting of the component, one or the plurality of components are fed to an intermediate component feed body from a component feed part 1, the components on the feed body are sucked and held by one or a plurality of suction nozzles 11 which are installed on the mounting head 10 and the components are mounted on a board. An intermittent feed conveyor 8 is used for the feed body. An operation which feeds the components to the conveyor 8 by a transfer head is combined with the movement operation of the conveyor 8, and the arrangement state of the components on the conveyor 8 is made variable.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and apparatus for automatically mounting components such as electronic components on a substrate.

[0002]

2. Description of the Related Art The structure of a conventional electronic component mounting apparatus will be described with reference to FIG. The electronic component mounting apparatus 30 includes a loader 39 for loading the circuit board 31 into the equipment, a component supply unit 34 for supplying a taped electronic component, and a tray 38 containing required electronic components to a predetermined supply position. A component supply unit 40 having a tray feeder to be arranged, and electronic components are mounted on the circuit board 31 positioned at a predetermined mounting position by sucking electronic components from the component supply means 34 or the component supply unit 40 by the suction nozzle 33. Mounting head 32
Recognition camera 36 for recognizing the suction posture of electronic components
And X for freely moving the mounting head 32 on the XY plane.
The apparatus includes a Y robot 37 and an unloader 41 that carries the mounted circuit board 31 out of the facility.

In the above configuration, the mounting head 32 is X
The parts supply means 3 is moved freely by the Y robot 37
4 or a required electronic component is sucked by the suction nozzle 33 from the component supply unit 40. Next, after the suction posture of the electronic component sucked by the suction nozzle 33 is recognized by the component recognition camera 36, the electronic component is moved to a predetermined mounting position on the circuit board 31, and the electronic component is mounted while correcting the posture. Then, the electronic component is accurately mounted at a predetermined mounting position.

Further, in such an electronic component mounting apparatus, the electronic components accommodated in the tray 38 of the component supply section 40 are moved to a predetermined supply pallet 42 by the transfer head 43 so that the electronic components are previously stored. The mounting heads 3 are arranged at regular intervals at a predetermined fixed pitch.
In some cases, a plurality of electronic components on the supply pallet 42 are simultaneously sucked and mounted in step 2. In this case, if the number and arrangement pitch of electronic components that can be arranged on the supply pallet 42 are the same as the number and arrangement pitch of the suction nozzles 33 provided on the mounting head 32, these electronic components are simultaneously sucked. It was possible.

[0005]

However, in the above-described conventional configuration, the suction nozzle 33 of the mounting head 32 is not provided.
Is increased, or when the pitch between the suction nozzles 33 is changed, when simultaneous suction of electronic components is attempted,
The supply pallet 42 also needs to be replaced with a corresponding one, and the supply pallet 42 according to the structure of the mounting head 32 mounted on the mounting apparatus must be created.
There is a problem that the degree of freedom as a mounting device is reduced.

The suction nozzle 33 in the mounting head 32
Increases, the supply pallet 42 of the same size as before
Is used, if the number of suction nozzles 33 is larger,
Electronic components must be supplied to the supply pallet 42 multiple times. In this case, there is a problem that the operation of pulling out and returning the supply pallet a plurality of times is necessary, and the component mounting efficiency is reduced.

When the pitch between the suction nozzles 33 changes, electronic components are arranged at a predetermined pitch on the supply pallet 42, so that simultaneous suction becomes impossible, and the electronic components are sucked. Suction must be sequentially performed for each nozzle 33, and there has been a problem that component mounting efficiency is reduced.

When the supply pallet 42 is used, the supply pallet 42 is pulled out and returned regardless of the number of electronic components. Therefore, even when the maximum number of electronic components are arranged in the supply pallet 42, Even when only one device is arranged, the same pull-out and return operations are required, and there is a problem that the efficiency of component mounting is reduced.

In view of the above-mentioned conventional problems, the present invention provides a component mounting method and apparatus capable of simultaneously sucking and mounting a plurality of components even when the structure of a mounting head and the number and shape of components to be supplied change. It is intended to be.

[0010]

According to a component mounting method of the present invention, a plurality of components are supplied from a component supply section to an intermediate component supply body by a transfer head, and a plurality of suction nozzles provided on the mounting head are used. In the component mounting method in which the components on the intermediate component supply are sucked and held and mounted on the board, the intermittent feeding conveyor is used for the intermediate component supply, and the operation of supplying the components onto the intermittent feeding conveyor with the transfer head and the intermittent operation It changes the arrangement of parts on the intermittent feed conveyor by combining the feed operation of the feed conveyor, and even if the structure of the mounting head and the number and shape of the parts to be supplied change, the intermediate part feeder can be replaced. It is possible to easily pick up and mount a plurality of components at the same time without any trouble, and realize efficient mounting.

When the feed amount of the intermittent feed conveyor is set during supply of components by the transfer head according to the arrangement state of the suction nozzles in the mounting head, the arrangement state of the suction nozzles in the mounting head changes. Can be mounted simultaneously.

Further, according to the shape and the number of the components to be sucked and held by the suction nozzle of the mounting head, the feed amount of the intermittent feed conveyor during the supply of the components by the transfer head is set.
Even if the shape and number of parts are changed, they can be picked up and mounted simultaneously.

Further, the component mounting apparatus of the present invention supplies a plurality of components from a component supply section to an intermediate component supply body by a transfer head, and supplies a plurality of suction nozzles provided on the mounting head to the intermediate component supply body. In a component mounting apparatus that sucks and holds the above components and mounts them on a substrate, the intermediate component supply body is configured by an intermittent feed conveyor, and the above mounting method can be implemented to realize efficient mounting.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting apparatus according to one embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1, a component mounting apparatus 1 of the present embodiment includes a pair of stages 3 and 4 for loading, regulating, and unloading a circuit board 2 into a facility, and component supply means 5 for supplying a taped electronic component. A component supply unit 6 having a tray feeder for arranging a tray 7 containing electronic components at a predetermined supply position; and a transfer head 9 for taking out the electronic components from the component supply unit 6 and supplying the electronic components onto an intermittent feeding conveyor 8. And component supply means 5 or component supply section 6 or intermittent feed conveyor 8
A pair of mounting heads 10 for mounting electronic components at predetermined mounting positions of the circuit board 2 positioned at predetermined positions by sucking electronic components with the suction nozzles 11 and freely mounting these mounting heads 10 on the XY plane. XY robot 12 to be moved
And recognition cameras 13 and 14 for recognizing a component suction posture.

In the above configuration, the mounting head 10
The part supply means 5 is moved freely by the Y robot 12
Alternatively, a required electronic component is sucked by the suction nozzle 11 from the component supply unit 6 or the intermittent feed conveyor 8, and then the suction attitude of the electronic component sucked by the suction nozzle 11 is determined by one of the component recognition cameras 13 and 14. By mounting the electronic component at a predetermined mounting position on the circuit board 2 while recognizing and correcting the posture, the electronic component is accurately mounted at the predetermined mounting position.

In the electronic component mounting apparatus of this embodiment, when mounting electronic components on the circuit board 2, the stages 3 and 4 move as shown in FIG. It is configured to move to a position close to the position and mount with each mounting head 10.

Hereinafter, a method of supplying electronic components using the intermittent feed conveyor 8 according to the configuration of the mounting head 10 and the shape and size of the electronic components will be described in detail with reference to FIGS.

FIG. 3 shows a case where five suction nozzles 11 are arranged at a pitch L1 in the mounting head 10. The mounting head 10 has the highest component mounting efficiency.
That is, all five suction nozzles 11 suck electronic components and mount them. For this reason, while the intermittent feed conveyor 8 is fed at the same predetermined pitch as the arrangement pitch of the suction nozzles 11, the transfer head 9 sequentially supplies the electronic components onto the intermittent feed conveyor 8, so that the mounting head 10 Individual electronic components can be simultaneously sucked and efficiently mounted.

Also, as shown in FIG.
When ten suction nozzles 11 are arranged at a pitch L2 in the same manner as described above, the
By supplying the electronic components so as to be arranged at the pitch L2, ten electronic components can be simultaneously sucked by the mounting head 10 and can be efficiently mounted.

Further, as shown in FIG.
Three suction nozzles 11 (N1 to N3) are connected to N1 and N2.
Is the pitch of L3, N2 and N3 are Lx (Lx = K × L3,
(K: an arbitrary constant), the electronic components B1 and B2 are arranged and supplied on the intermittent feed conveyor 8 while being fed at the pitch of L3, and then K times intermittent feed conveyor at the pitch of L3. By arranging and supplying the electronic component B3 after sending 8, these three electronic components can be simultaneously sucked by the mounting head 10 and can be efficiently mounted.

Further, as shown in FIG.
In the case where five suction nozzles 11 (N1 to N5) are arranged at a pitch L4 and the electronic components B1 and B2 are arranged at a pitch L4 on the intermittent feed conveyor 8, they may interfere with each other. In this case, as shown in FIG. 7, after the first electronic component B1 is placed on the intermittent feed conveyor 8, the intermittent feed conveyor 8 is fed by 2 × L4 and the electronic component B2 is placed, so that the suction nozzle N1 is placed. , N3, the electronic components B1, B2 can be simultaneously sucked.

When simultaneously picking up three electronic parts, the electronic parts are arranged and supplied on the intermittent feed conveyor 8 at a pitch of 2 × L4, so that the suction nozzles N1, N3,
It can be adsorbed simultaneously with N5.

As shown in FIG. 8, when two electronic components are simultaneously picked up and the feed direction of the intermittent feed conveyor 8 is the direction of the arrow, the electronic component B1 is placed on the intermittent feed conveyor 8. And then intermittently feed conveyor 8
The electronic component B2 is arranged by sending only L4, and the suction nozzle N
3, if the electronic components B1 and B2 are simultaneously sucked at N5, the feed amount of the intermittent feed conveyor 8 can be reduced, and mounting can be performed efficiently.

As described above, by changing the feed amount of the intermittent feed conveyor 8 in multiple stages according to the shape, size and number of the electronic components and the arrangement of the suction nozzles 11 of the mounting head 10, a plurality of feeds can be obtained. The electronic components can be simultaneously sucked and mounted efficiently.

[0026]

According to the component mounting method and apparatus of the present invention, as described above, the intermittent feeding conveyor is used as the intermediate component supply body, and the operation of supplying the components onto the intermittent feeding conveyor by the transfer head and the intermittent feeding are performed. Since the arrangement of components on the intermittent feed conveyor is changed by combining the conveyor feeding operation, even if the structure of the mounting head and the number, shape and size of the components to be supplied change, the intermediate component supply A plurality of components can be easily sucked and mounted at the same time without replacing the components, and efficient mounting can be realized.

[Brief description of the drawings]

FIG. 1 is a plan view showing an overall schematic configuration of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view showing a state at the time of mounting in the embodiment.

FIG. 3 is an explanatory diagram of a first component simultaneous suction mode in the embodiment.

FIG. 4 is an explanatory diagram of a second component simultaneous suction mode in the embodiment.

FIG. 5 is an explanatory diagram of a third component simultaneous suction mode in the embodiment.

FIG. 6 is an explanatory diagram of a problem in the case of a large component in the embodiment.

FIG. 7 is an explanatory diagram of a fourth component simultaneous suction mode in the embodiment.

FIG. 8 is an explanatory diagram of a fifth component simultaneous suction mode in the embodiment.

FIG. 9 is a perspective view showing an overall schematic configuration of a conventional component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Circuit board 6 Component supply part 8 Intermittent feed conveyor (intermediate component supply body) 9 Transfer head 10 Mounting head 11 Suction nozzle

Continued on the front page (72) Inventor Hiroshi Uchiyama 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Noriaki Yoshida 1006 Okadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co. Reference) 3F061 AA04 CA01 CB05 DB04 DB06 DD01 DD03 5E313 AA02 AA11 AA15 AA23 CC04 DD12 DD14 EE02 EE03 EE05 EE24 EE25 EE37 FF06 FF24 FF28

Claims (4)

[Claims] 1. A plurality of components are supplied from a component supply unit to an intermediate component supply by a transfer head, and components on the intermediate component supply are suction-held by a plurality of suction nozzles provided on a mounting head; In the component mounting method of mounting on the board, the intermittent feed conveyor is used as the intermediate component supply body, and the operation of supplying the components on the intermittent feed conveyor with the transfer head and the feed operation of the intermittent feed conveyor are combined to perform the intermittent feed conveyor. A component mounting method characterized by changing an arrangement state of components. 2. The component mounting according to claim 1, wherein the feed amount of the intermittent feed conveyor during supply of the component by the transfer head is set in accordance with the arrangement state of the suction nozzles in the mounting head. Method. 3. An intermittent feed conveyor during supply of components by a transfer head is set in accordance with the shape and number of components to be sucked and held by a suction nozzle of a mounting head. Item 1. The component mounting method according to Item 1. 4. A plurality of components are supplied from a component supply unit to an intermediate component supply by a transfer head, and components on the intermediate component supply are suction-held by a plurality of suction nozzles provided on a mounting head; In a component mounting apparatus mounted on a substrate, an intermediate component supply body is constituted by an intermittent feed conveyor.