WO2013121931A1

WO2013121931A1 - Component mounting device and component mounting method

Info

Publication number: WO2013121931A1
Application number: PCT/JP2013/052589
Authority: WO
Inventors: 智伏見; 仲田　輝男; 岡本　学
Original assignee: 株式会社日立ハイテクインスツルメンツ
Priority date: 2012-02-15
Filing date: 2013-02-05
Publication date: 2013-08-22
Also published as: JP5819745B2; JP2013168456A

Abstract

A component mounting device in which a large number of component types can be mounted at a high throughput using a single mounting unit. According to a representative embodiment of the present invention, the component mounting device has a plurality of component handover tables between the component supply unit and the printed substrate transportation path, and further has: a plurality of component extraction heads capable of moving above a region including the component supply unit and the component handover tables; and component mounting heads capable of moving above a region including the component handover tables and the printed substrate transportation path without intersecting each other, the number of the component mounting heads being identical to that of the component handover tables. Each of the component extraction heads extracts a necessary component from the component supply unit and places the component on the predetermined component handover table. Each of the component mounting heads acquires the component placed on the corresponding component handover table and mounts the component at the predetermined position on the printed substrate.

Description

Component mounting apparatus and component mounting method

The present invention relates to a technology for mounting components and the like on an object, and more particularly to a technology effective when applied to a component mounting apparatus and a component mounting method for mounting a large number of small components, such as mounting electronic components on a printed circuit board. It is.

For example, it is necessary to mount a large number of small components on a printed circuit board used for an electric product or the like, and a component mounting apparatus that mechanically mounts components on the printed circuit board or the like is usually used. This makes it possible to efficiently perform the component mounting operation with high throughput. On the other hand, in recent years, along with demands for downsizing electronic devices and the complexity of circuit configuration, miniaturization of printed circuit boards and electronic parts to be mounted on them, and a wide variety of parts are progressing. . For example, it is also required that a plurality of types of minute electronic components are mounted in units of hundreds on a printed circuit board of several centimeters square.

In response to such a request, for example, Japanese Patent Application Laid-Open No. 2001-111300 (Patent Document 1) discloses a component supply unit for supplying components and the component supplied by the component supply unit. The component holding unit, the component recognition unit for recognizing the external shape and position of the component held by the component holding unit, and the component holding unit based on the recognition result by the component recognition unit. It is equipped with a component positioning unit for positioning the component at an arbitrary position, and each unit can be exchanged and combined with an arbitrary unit according to the component or board, so that the mounting contents and mounting scale can be reduced. It is possible to provide a small and simple component mounting line that can flexibly mount components on a board That technology is described.

Furthermore, for example, in Japanese Patent No. 4457173 (Patent Document 2), a general-purpose mounting head and types of electronic circuit components that can be mounted from the general-purpose mounting head in each of the component mounting portions of a plurality of mounting units are described. A plurality of types of mounting heads, including a high-efficiency mounting head with a small but excellent mounting efficiency, can be selectively mounted, and the types of mounting heads used in each of the plurality of mounting units are in accordance with predetermined rules. A mounting head selection unit to be determined is included, and the mounting head selection unit can produce a printed circuit board to be produced by a plurality of mounting units, and the number of general-purpose mounting heads to be mounted is minimized. An electronic circuit component including a plurality of mounting units in series, each of which mounts an electronic circuit component on a circuit board by determining the type of mounting head Further techniques that have good usability wearing system is described.

JP 2001-111300 A Japanese Patent No. 4457173

Patent Document 1 and Patent Document 2 described above describe the prior art related to a component mounting apparatus that mechanically mounts a plurality of types of components on a printed circuit board or the like. However, in these component mounting apparatuses according to the prior art, for example, when it is necessary to mount a large number of types of components as in a multi-product mixed production line, it is possible to flexibly cope with the mounting unit. Setup work such as replacement and feeder replacement of the component supply unit is required, and production throughput is reduced.

In order to avoid such a setup operation, for example, a method of connecting a large number of mounting units so as to be able to provide all necessary component types can be considered. However, as the number of mounting units increases, it becomes necessary to repeat processes such as transporting and fixing printed boards between mounting units, recognizing board positions, and mounting parts, which also reduces the production throughput. On the other hand, in order to reduce the number of repetition processes, for example, it is conceivable to increase the number of feeders in the component supply unit of one mounting unit. However, as a result, the production throughput decreases due to an increase in the movement distance of each component mounting head due to an increase in one mounting unit and a decrease in the number of component mounting heads that can operate simultaneously in one mounting unit. There are challenges.

Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of mounting a large number of component types with a single mounting unit at a high throughput. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

A component mounting apparatus according to a representative embodiment of the present invention is a component mounting apparatus that mounts a plurality of types of components supplied from a component supply unit on an object fixed to an object conveyance path, A plurality of component delivery tables between the supply unit and the object conveyance path; and a plurality of component pick-up heads movable above an area including the component supply unit and each of the component delivery tables; The component delivery table has the same number of component mounting heads as the component delivery table that can move without crossing over a region including the object delivery path and the region including the object conveyance path. The necessary components are taken out from the components and placed on the predetermined component delivery table, and the component mounting heads correspond to the component extraction heads. To obtain the parts disposed on the goods delivery table, is characterized in that mounted at the predetermined position of the object.

Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

That is, according to the representative embodiment of the present invention, it is possible to mount a large number of component types with a high throughput with one mounting unit without connecting many mounting units (modules).

It is the top view which showed the outline | summary about the structural example of the component mounting apparatus which is Embodiment 1 of this invention. It is the perspective view which showed the outline | summary about the structural example of the component mounting head in Embodiment 1 of this invention. It is the bottom view which showed the outline | summary about the structural example of the component mounting head in Embodiment 1 of this invention. It is the perspective view which showed the outline | summary about the structural example of the component mounting nozzle group in Embodiment 1 of this invention. It is the perspective view which showed the outline | summary about the structural example of the components delivery table in Embodiment 1 of this invention. It is the perspective view which showed the outline | summary about the structural example of the components pick-up head in Embodiment 1 of this invention. It is the perspective view which showed the outline | summary about the structural example of the component extraction nozzle group in Embodiment 1 of this invention. It is the figure which showed the outline | summary about the structural example of the control system in Embodiment 1 of this invention. It is the flowchart which showed the outline | summary about the example of the flow of a process of the component mounting program in Embodiment 1 of this invention. It is the perspective view which showed the outline | summary about the structural example of the component mounting nozzle group in Embodiment 2 of this invention. It is the perspective view which showed the outline | summary about the structural example of the component mounting head in Embodiment 3 of this invention. It is the perspective view which showed the outline | summary about the structural example of the component mounting nozzle group in Embodiment 3 of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

<Embodiment 1>
The component mounting apparatus according to the first embodiment of the present invention is an apparatus that enables a large number of components such as a plurality of types of electronic components to be mounted on an object such as a printed board. The component mounting apparatus according to the present embodiment, as in the prior art, does not have the component mounting head directly extract components from the component supply unit and mount them on the object. And a plurality of parts delivery tables for placing the parts taken out by the parts ejection head. The parts mounting head acquires parts from the parts delivery table instead of from the parts supply section and places them on the object. It has the composition of doing.

In this way, by adding a component picking head in addition to the component mounting head, it is possible to simultaneously perform component picking and mounting operations via the component delivery table, and Since the moving distance can be made shorter than the moving distance of the component mounting head in the prior art, it is possible to perform the process from taking out the component to mounting in a short time, and to improve the production throughput.

Further, the component mounting apparatus according to the present embodiment operates a plurality of components sucked by the component mounting head at a time in addition to mounting a plurality of components sucked by the component mounting head one by one as in the prior art. It is possible to install multiple at the same time. As a result, the number of movements of the component mounting head during component mounting can be reduced compared to the prior art, and production throughput can be improved.

FIG. 1 is a top view showing an outline of a configuration example of a component mounting apparatus according to the present embodiment. FIG. 1 shows a configuration example of a portion related to a mechanism that performs a component mounting operation in the component mounting apparatus 100, and the horizontal direction in the drawing is the X-axis direction and the vertical direction is the Y-axis direction. The component mounting apparatus 100 includes, for example, a component supply unit 101, a component pickup head 102, a component pickup head X-axis drive unit 103, a component pickup head Y-axis drive unit 104, a component delivery table 105, a pickup component recognition camera 106, and a mounted component recognition. It has a camera 107, a component mounting head 108, a component mounting head Y-axis drive unit 109, a printed circuit board conveyance path 110, and an apparatus frame 111.

In the example of FIG. 1, a plurality of (four in the example of FIG. 1) component delivery tables 105 on both sides in the Y-axis direction with respect to the printed circuit board conveyance path 110 that conveys and fixes a printed circuit board on which a component is to be mounted. Are arranged along the X-axis direction, and further, a component supply unit 101 for supplying electronic components by a feeder is disposed on the outside thereof. Above each component supply unit 101, a component take-out head X-axis drive unit 103 is disposed along the X-axis direction of the component supply unit 101.

Also, a plurality of (two in the example of FIG. 1) component take-out heads along the Y-axis direction above the regions including the component supply units 101 and the component delivery table 105 on both sides of the printed circuit board conveyance path 110. A Y-axis drive unit 104 is arranged, and one component pick-up head 102 is attached to each of them. Each of the component pick-up heads 102 has a stroke that can move in the Y-axis direction above the region including the component supply unit 101 and the component delivery table 105 along the component pick-up head Y-axis drive unit 104. Also, each component take-out head Y-axis drive unit 104 (and the component take-out head 102 attached thereto) is located above the area including the component supply unit 101 and each component delivery table 105 by the component take-out head X-axis drive unit 103. Has a stroke movable in the X-axis direction.

On the other hand, above the printed circuit board conveyance path 110, a plurality of pieces are provided along the Y-axis direction (in the example of FIG. 1, the same number as four pairs of component delivery tables 105 disposed on both sides of the printed circuit board conveyance path 110). The component mounting heads Y-axis drive unit 109 are arranged, and a pair (two) of component mounting heads 108 are attached to each. Each component mounting head 108 corresponds to each component delivery table 105. Along the component mounting head Y-axis drive unit 109, the Y-axis is located above the area including the printed circuit board conveyance path 110 and the corresponding component delivery table 105. It has a stroke that can move in the direction.

In the example of FIG. 1, the number of component mounting head Y-axis driving units 109 is the same as the number of pairs of component delivery tables 105 arranged on both sides of the printed circuit board conveyance path 110 (four in the example of FIG. 1). The two component mounting heads 108 are attached to one component mounting head Y-axis driving unit 109. However, the same number of component mounting heads Y-axis driving units 109 as the component delivery table 105 are provided to provide one component mounting head. One component mounting head 108 may be attached to the Y-axis drive unit 109.

Also, for each component delivery table 105, a take-out component recognition camera 106 is arranged between the component delivery table 105 and the component supply unit 101. Further, a mounted component recognition camera 107 is disposed between the printed circuit board conveyance path 110 and each component delivery table 105.

In the example of FIG. 1, the component supply unit 101, the component take-out head 102, the component take-out head X-axis drive unit 103, the component take-out head Y-axis drive unit 104, and the components are symmetrically provided on both sides of the printed circuit board conveyance path 110 in the Y-axis direction. By arranging each part of the delivery table 105, the picked-up component recognition camera 106, and the mounted component recognition camera 107, the degree of parallelism of processing is further improved, the production throughput is improved, and the device configuration is reduced in size. However, the configuration may be such that each of these parts is provided only on one side of the printed circuit board conveyance path 110. Further, in the X-axis direction, the component take-out head Y-axis drive unit 104 has two components on each side of the printed circuit board conveyance path 110 and four component mounting heads Y-axis drive units 109. It is not restricted but can be set as appropriate according to the scale of the component mounting apparatus 100 and the like.

FIG. 2 is a perspective view showing an outline of a configuration example of the component mounting head 108 in the present embodiment. The component mounting head 108 acquires a plurality of components simultaneously from the component delivery table 105 and mounts the acquired components on a printed circuit board on the printed circuit board conveyance path 110. For example, the component mounting head base unit 201, print A board recognition camera 204 and a plurality (eight in the example of FIG. 2) of component mounting nozzle sets 205 are provided.

The component mounting head 108 is attached to the component mounting head Y-axis drive unit 109 via the component mounting head Y-axis drive unit guide 202 included in the component mounting head Y-axis drive unit 109 in the example of FIG. The component mounting head Y-axis drive unit 109 includes, for example, a component mounting head Y-axis drive unit feed screw 203, whereby the entire component mounting head 108 is printed with the component delivery table 105 via the component mounting head base unit 201. It has a stroke that can move in the Y-axis direction above the substrate transfer path 110.

FIG. 3 is a bottom view showing an outline of a configuration example of the component mounting head 108 in the present embodiment. In the present embodiment, the component mounting head 108 has a plurality of sets of two component mounting nozzle Y-axis guides 206 (two sets in the example of FIG. 3) in parallel on the bottom surface of the component mounting head base portion 201. In addition, a plurality of component mounting nozzle groups 205 are attached to each group in a row (four in each example in the example of FIG. 3). Each component mounting nozzle set 205 has a stroke that can move in the Y-axis direction along the component mounting nozzle Y-axis guide 206. The number of sets of component mounting nozzle Y-axis guides 206 (the number of rows of component mounting nozzle sets 205) and the number of component mounting nozzle groups 205 attached to each set are not limited to the illustrated example, and may be appropriately selected. Can be set. In the example of FIG. 3, the component mounting nozzle sets 205 are arranged in a row, but the arrangement shape is not particularly limited thereto.

FIG. 4 is a perspective view showing an outline of a configuration example of the component mounting nozzle set 205 in the present embodiment. The component mounting nozzle set 205 is a nozzle that acquires components placed on the component delivery table 105 by suction or the like and mounts them at a predetermined position on the printed circuit board. For example, the component mounting nozzle Y-axis drive unit 207, A component mounting nozzle Y-axis base unit 208, a component mounting nozzle X-axis drive unit 209, a component mounting nozzle X-axis base unit 210, a component mounting nozzle rotating mechanism unit 211, a component mounting nozzle vertical drive unit 212, and a component mounting nozzle main body 213 are included. .

The component mounting nozzle set 205 is supported on the bottom surface of the component mounting head 108 via the component mounting nozzle Y-axis base portion 208 and the component mounting nozzle Y-axis guide 206, as shown in FIGS. The Y-axis drive unit 207 has a stroke that can move in the Y-axis direction along the component mounting nozzle Y-axis guide 206. Further, the component mounting nozzle X-axis base unit 210 attached to the lower part of the component mounting nozzle Y-axis base unit 208 via the component mounting nozzle X-axis driving unit 209 has an X-axis along the component mounting nozzle X-axis driving unit 209. It has a stroke that can move in the direction. That is, by these movements, it is possible to finely adjust the position of the component mounting nozzle body 213 by moving it in the X-axis direction and the Y-axis direction.

Furthermore, the component mounting nozzle main body 213 is attached to the component mounting nozzle X-axis base unit 210 via the component mounting nozzle rotating mechanism unit 211 and the component mounting nozzle vertical drive unit 212. Accordingly, the component mounting nozzle body 213 can rotate on the XY plane and has a stroke that can move in the vertical direction. That is, by these movements and the like, the posture of the component held by suction or the like (for example, using air pressure or the like) is adjusted at the tip of the component mounting nozzle main body 213, and is adjusted at a predetermined position of the printed circuit board on the printed circuit board conveyance path 110. It is possible to mount a part by releasing it. The component mounting nozzle body 213 can be appropriately replaced with one having different characteristics depending on the type of component to be mounted.

As shown in the example of FIG. 4, in the present embodiment, in the component mounting nozzle set 205, a nozzle that acquires and holds a component and sucks and holds the component as a member to be mounted (component mounting member). However, the component mounting member is not limited to this, and for example, a chuck that acquires and holds the component may be used. In the example of FIG. 4, for example, the component mounting nozzle Y-axis driving unit 207 uses a rack and pinion mechanism to move the component mounting nozzle set 205 along the component mounting nozzle Y-axis guide 206. However, the present invention is not limited to this, and various known techniques such as a piezo actuator and a linear motor can be used as appropriate, including other driving units.

A conventional component mounting head is, for example, circular, and has a configuration in which a plurality of nozzles for component mounting are arranged in a circle on one component mounting head, and one component mounting head simultaneously adsorbs a plurality of components. It is possible to do. However, when these components are mounted on an object such as a printed circuit board, the components are positioned and mounted one at a time while rotating, for example, a circular component mounting head. Therefore, in order to mount all the components sucked by the component mounting head, in principle, it is necessary to repeat the movement of the component mounting head to the mounting position and the component mounting operation by the same number of times as the number of the sucked components.

On the other hand, in the present embodiment, in the component mounting head 108, a plurality of component mounting nozzle groups 205 can finely adjust the position and orientation independently of each other. It is possible to install. Therefore, compared with the conventional component mounting head, the number of movements of the component mounting head 108 can be reduced, and the production throughput can be improved.

FIG. 5 is a perspective view showing an outline of a configuration example of the component delivery table 105 in the present embodiment. The component delivery table 105 is a table having a cache function for delivering components to be mounted in one cycle between the component supply unit 101 and the printed circuit board conveyance path 110. For example, a plurality of (see FIG. In the example, there are eight component holding tables 301, a component suction hole 302, and a component holding table vertical drive unit 303.

Each component holding table 301 is held on the table by, for example, sucking (for example, using air pressure or the like) the component to be delivered through the component suction hole 302. At this time, the vertical position of the component holding table 301 can be finely adjusted by the component holding table vertical drive unit 303 according to the height and size of the component to be held.

The number of the component holding tables 301 is the same as the number of the component mounting nozzle groups 205 included in the component mounting head 108, and the arrangement and interval of the component holding tables 301 are the arrangement of the component mounting nozzle groups 205 in the component mounting head 108. And correspond to the interval. That is, the arrangement and interval of the origin positions (initial positions) of the component mounting nozzle groups 205 in the component mounting head 108 are made to coincide with each other. As a result, the component mounting head 108 can simultaneously acquire the components held on each component holding table 301 of the component delivery table 105 by each component mounting nozzle set 205.

FIG. 6 is a perspective view showing an outline of a configuration example of the component picking head 102 in the present embodiment. The component take-out head 102 takes out a plurality of necessary components from the component supply unit 101 and simultaneously arranges them on each component holding table 301 of the component delivery table 105. For example, the component take-out head base unit 304 and a plurality of ( In the example of FIG. 6, there are 8) component takeout nozzle sets 305.

The component pick-up head base unit 304 is attached to, for example, the component pick-up head Y-axis drive unit 104, whereby the entire component pick-up head 102 is connected to the component supply unit 101 and the component transfer table via the component pick-up head base unit 304. It has a stroke that can move in the Y-axis direction above the region including 105. On the other hand, as shown in FIG. 1, the component picking head Y-axis driving unit 104 has a stroke that can be moved in the X-axis direction by the component picking head X-axis driving unit 103. As a result, the component pick-up head 102 (and the component pick-up nozzle set 305 attached thereto) moves on the component supply unit 101 and further has a stroke that can be moved onto a plurality of component delivery tables 105.

The number of component extraction nozzle groups 305 that the component extraction head 102 has is the same as the number of component holding tables 301 that the component delivery table 105 has, and the arrangement and interval of the origin positions (initial positions) of the component extraction nozzle groups 305 are as follows. The arrangement and interval of each component holding table 301 in the component delivery table 105 are matched. As a result, the component take-out head 102 can simultaneously place the components taken out from the component supply unit 101 on each component holding table 301 of the component delivery table 105 by each component take-out nozzle set 305.

FIG. 7 is a perspective view showing an outline of a configuration example of the component picking nozzle set 305 in the present embodiment. The component take-out nozzle set 305 is a nozzle that takes out components supplied by the component supply unit 101 by suction or the like and places them on a predetermined component holding table 301 of the component delivery table 105. For example, the component take-out nozzle rotation mechanism unit 306, a component take-out nozzle vertical drive unit 307, and a component take-out nozzle main body 308.

The component ejection nozzle body 308 is attached to the component ejection head base unit 304 via the component ejection nozzle rotation mechanism unit 306 and the component ejection nozzle vertical drive unit 307. Accordingly, the component pick-up nozzle body 308 can rotate on the XY plane and has a stroke that can move in the vertical direction. That is, by such movement or the like, the posture of the component held by suction or the like (for example, using air pressure or the like) is adjusted at the tip of the component pick-up nozzle body 308, and the component is placed on a predetermined component holding table 301 of the component delivery table 105. Can be arranged. The component take-out nozzle body 308 can be appropriately replaced with one having different characteristics depending on the type of the component to be taken out.

In the present embodiment, as shown in the example of FIG. 7, in the component take-out nozzle set 305, a nozzle that picks up and holds a component is used as a member (component take-out member) that takes out and holds the component and arranges it. However, as in the case of the component mounting nozzle set 205 described above, the component takeout member is not limited to this, and for example, a chuck that takes out and holds the component may be used.

Further, the accuracy of positioning of the component when the component is taken out from the component supply unit 101 and placed on the component delivery table 105 is required to be higher than the accuracy when the component is obtained from the component delivery table 105 and mounted on the printed circuit board. It may not be lower than this. Instead, by increasing the moving speed and positioning speed of the part picking head 102 and the processing speed of picking up and arranging the parts, the parts can be delivered quickly and efficiently with a smaller number of part picking heads 102 than the part mounting head 108. It is intended to be placed on the table 105.

In the present embodiment, the component picking head 102 is configured as shown in FIGS. 6 and 7, and the components picked up by the component picking nozzle groups 305 can be simultaneously placed on the component delivery table 105. However, if the component can be taken out from the component supply unit 101 at a sufficient processing speed and placed on the component delivery table 105, the component pickup head 102 is the same as the component mounting head in the prior art. It is also possible to use.

FIG. 8 is a diagram showing an outline of a configuration example of a control system of the component mounting apparatus 100 according to the present embodiment. The control system 400 includes, for example, an MPU (Micro-Processing Unit) 401, a RAM (Random Access Memory) 402, a ROM (Read Only Memory) 403, an interface 404, an external storage device 405, an LCD (Liquid Crystal Display) touch panel 406, a bar, and the like. A code reader 407, a printed circuit board recognition image processing circuit 408, a printed circuit board recognition camera 204, a component recognition image processing circuit 409, a picked up component recognition camera 106, a mounted component recognition camera 107, and the like.

1 to FIG. 7 as a drive circuit and a drive unit thereof, a component supply unit drive circuit 410, a component supply unit drive unit 415, a component take-out head / nozzle drive circuit 411, and a component take-out head / nozzle drive unit. 416, a component delivery table drive circuit 412, a component delivery table drive unit 417, a component mounting head / nozzle drive circuit 413, a component mounting head / nozzle drive unit 418, a printed circuit board transport path drive circuit 414, and a printed circuit board transport path drive unit 419. Etc.

When the control system 400 is powered on, the startup program stored in the ROM 403 is executed by the MPU 401. In the startup process, each device or circuit connected to the interface 404 is first initialized, and then each driving unit operates to operate the component supply unit 101, the component pick-up head 102, the component delivery table 105, and the component mounting head 108. Each mechanism is stopped at a predetermined standby position. Thereafter, the component mounting program held in the external storage device 405 is executed by the MPU 401. The component mounting program enters a waiting state for receiving input of component supply information by the barcode reader 407 or the like, input of the type and number of printed circuit boards to be produced by the LCD touch panel 406, production start instruction, etc. Is received, the process of mounting the component on the printed circuit board is started according to the following processing flow.

FIG. 9 is a flowchart showing an outline of an example of the flow of processing of the component mounting program in the present embodiment. Here, an example of the flow of processing when a component is mounted on one printed board will be described. Therefore, in order to continuously mount components on a plurality of printed boards, a series of processes shown in the process flow of FIG. 9 is repeated as appropriate.

First, before starting the component mounting process, as an initial process, input of various setting information is received from an operator in charge of the component mounting apparatus 100 (hereinafter sometimes simply referred to as “user”), and the external storage device It is held at 405 (S01). For example, the dimensions of parts for each part model, the types of usable part ejection nozzle body 308 and part mounting nozzle body 213, and the X-axis and Y-axis directions for transporting parts by the part ejection head 102 and the part mounting head 108 Component information including information such as speed and acceleration, speed and acceleration of each vertical drive unit, imaging method of the picked-up component recognition camera 106 and mounted component recognition camera 107, and an image recognition method by the component recognition image processing circuit 409, etc. Held at 405.

In addition, a user places components to be mounted on the printed circuit board in the component supply unit 101 in advance, and the user reads the component type information attached to the component feeder supplied from the component manufacturer by the barcode reader 407, or the LCD touch panel 406. For example, information on which type of component is located at which position in the component supply unit 101 is acquired. Based on this information and the above-described component information, for each component type, the stop coordinates when each component extraction nozzle set 305 of the component extraction head 102 extracts components from the component supply unit 101 are calculated in advance, and the external storage device 405 is obtained. Save to.

In addition, for each printed circuit board model, the dimensions of the printed circuit board, the position where the printed circuit board is fixed on the printed circuit board conveyance path 110, the coordinate origin position of the printed circuit board, and the recognition mark attached to the printed circuit board from the origin of the printed circuit board. Similarly, the printed circuit board design information including information such as coordinates, part types to be mounted on the printed circuit board, mounting coordinates, and angles is also stored in the external storage device 405.

As will be described later, component mounting on the printed circuit board is performed by a component pick-up cycle in which the component pick-up head 102 picks up a specified component from the component supply unit 101 and places it on the component transfer table 105, and the component mounting head 108 has a component transfer table. 105, a component suction cycle for sucking the components on 105, and a component mounting cycle for transporting and mounting the sucked components to a specified position on the printed circuit board on the printed circuit board conveyance path 110. It is realized by repeating until it is installed.

Here, for each component mounting head 108, the model of the mounted component in each component mounting cycle, the mounting coordinates and the component orientation on the printed circuit board, the component mounting nozzle set 205 to be used, each component mounting nozzle Y-axis drive unit 207, and Information such as the driving distance of the component mounting nozzle X-axis drive unit 209 is stored in advance in the external storage device 405 as component mounting cycle information. In addition, for each component mounting head 108, the type of suction component in each component suction cycle, the movement path from the component delivery table 105 to the stop coordinates in each component mounting cycle via the mounting component recognition camera 107, etc. The information is stored in advance in the external storage device 405 as component suction cycle information.

Also, the components picked up from the component delivery table 105 in each component suction cycle by each component mounting head 108 are taken out from the component supply unit 101 in advance by the component take-out head 102 and arranged in the component delivery table 105 as described above. At this time, the order of the parts to be picked up by each of the parts picking heads 102, the picking position of the parts on the part supply unit 101, the type of the part pickup nozzle 305 to be used, the type of the part pickup nozzle body 308, and the recognition of the parts taken out from the part supply unit 101 Information such as the movement route to the parts delivery table 105 via the camera 106 is stored in the external storage device 405 in advance as part extraction cycle information.

When various setting information is held in the external storage device 405, the user inputs information such as a model via the LCD touch panel 406 as information for specifying a printed circuit board to be produced, and instructs the start of production. Production by mounting the parts is started (S02). When production is started, first, the printed circuit board design information held in the external storage device 405 in advance for the designated printed circuit board model is read and stored in the RAM 402 (S03). Next, the printed circuit board is conveyed on the printed circuit board conveyance path 110 according to the information on the fixed position of the printed circuit board defined in the read printed circuit board design information, and the printed circuit board is fixed to the designated fixed position (S04).

Thereafter, as the process of mounting the component on the printed circuit board, the above-described component pick-up cycle, component suction cycle, and component mounting cycle are executed in parallel. First, in order to start a component extraction cycle, component extraction cycle information stored in the external storage device 405 is read into the RAM 402 for each component extraction head 102 (S11), and the component supply unit 101 is based on this information. The arranged parts are sequentially picked up and taken out by the designated part take-out nozzle set 305 in the designated order (S12). When the parts picking head 102 picks up all the parts to be picked up in one part picking cycle, the parts picking head 102 is moved onto the picking up part recognition camera 106, picked up the picked up parts and picked up by the parts recognition image processing circuit 409. At this time, the component suction position, orientation such as rotation, etc. are calculated, and the result is stored in the RAM 402 (S13).

After that, it is confirmed that there is no component mounting head 108 on the component delivery table 105 designated as the transport destination of the extracted components and that there are no components that have not been mounted on the printed circuit board. The head 102 is moved onto the component delivery table 105, and the removed component is placed (S14). Specifically, for example, the component delivery table 105 (and each of the component ejection nozzle sets 305) in which the component ejection head 102 (and each component ejection nozzle set 305) is designated by the component ejection head X-axis drive unit 103 and the component ejection head Y-axis drive unit 104. Positioning in the X-axis direction / Y-axis direction is performed so as to be above the component holding table 301). Further, using the information related to the posture of the component detected in step S13, the rotation of the posture is corrected by the component pickup nozzle rotating mechanism 306 for each component picked up by each component pickup nozzle set 305.

Further, based on the height information of the target component held in the external storage device 405, each component take-out nozzle vertical drive unit 307 is driven to adjust the vertical position, and the components are simultaneously placed on the component holding table 301. Deploy. At this time, the component holding table vertical drive unit 303 may be driven in accordance with the lowering of each component take-out nozzle set 305 to absorb the impact during component placement. Further, the material of the component holding table 301 may be capable of absorbing an impact. The arranged component is fixed at the position by being sucked by the component suction hole 302. After the components are sucked by the component suction holes 302, the component holding table vertical drive unit 303 is driven so that the heights of the arranged components are substantially the same (the vertex portions of the respective components are substantially on the same plane). The height of the component holding table 301 is adjusted.

When all the parts picked up by the part picking head 102 in one part picking cycle are arranged on the part delivery table 105 (the part picking cycle is completed), it is determined whether or not all the part picking cycles are completed ( S15). If all the component pick-up cycles are not completed, the process returns to step S11 to execute the next component pick-up cycle, and repeats the processing of steps S11 to S14 until all the component pick-up cycles are completed.

On the other hand, as a process of acquiring the components arranged on the component delivery table 105 by the component extraction cycle and mounting them on the printed circuit board on the printed circuit board conveyance path 110 in parallel with the execution of the component extraction cycle by the component extraction head 102. Then, a component adsorption cycle and a component mounting cycle by each component mounting head 108 are executed. The component adsorption cycle and the component mounting cycle can be executed concurrently with the component picking cycle. However, since the component to be mounted needs to be arranged on the corresponding component delivery table 105, at least The process is started after the preceding part picking cycle is performed one or more times and the parts are arranged on the part delivery table 105.

First, in order to grasp the position of the printed circuit board fixed on the printed circuit board conveyance path 110 before the start of the component suction cycle and the component mounting cycle, the coordinate information of the recognition mark of the printed circuit board defined in the printed circuit board design information is used. The designated component mounting head 108 images the recognition mark with the printed circuit board recognition camera 204, detects the position of the recognition mark with the printed circuit board recognition image processing circuit 408, and stores the coordinate information in the RAM 402 (S21). . Thereby, the origin position of the coordinate system for arranging components on the printed circuit board is grasped.

After that, a part suction cycle is started to pick up and take out parts from the part delivery table 105. First, for each component mounting head 108, the component suction cycle information stored in the external storage device 405 is read into the RAM 402 (S22). Further, based on this information, the component mounting head 108 is moved onto the corresponding component delivery table 105 and the component mounting nozzle vertical drive unit 212 of the component mounting nozzle set 205 is driven to hold each component of the component delivery table 105. The components arranged on the table 301 are simultaneously sucked by the component mounting nozzle body 213 (S23). At this time, the component holding table vertical drive unit 303 of the component holding table 301 is driven in synchronization with the component suction by the component mounting nozzle body 213 to absorb the impact at the time of component suction, and at the same time, the component suction by the component suction hole 302 Is released.

When the component mounting head 108 sucks all the components to be sucked in one component picking cycle, the component mounting head 108 is moved onto the corresponding mounting component recognition camera 107 to pick up the picked-up component, and the component recognition image processing circuit 409 calculates the component's suction position, orientation such as rotation, and holds the result in the RAM 402 (S24).

Thereafter, the component mounting cycle information stored in the external storage device 405 is read into the RAM 402 (S25). Based on this information, the component mounting head 108 is designated on the printed circuit board by the component mounting head Y-axis drive unit 109. Move to position (S26). In parallel with this, for the component mounting head 108, the components sucked by the component mounting nozzle groups 205 specified by the component mounting cycle information are, for example, the component mounting nozzle Y-axis drive unit 207 and the component mounting nozzle X-axis drive. By driving the unit 209 and the component mounting nozzle rotating mechanism unit 211, they are respectively positioned at designated positions on the printed circuit board (S27). At this time, for example, the information on the posture of the component measured in step S24 is used to correct the shift and rotation of the component suction position.

When positioning is completed for each component mounting nozzle set 205 of the component mounting head 108, the component mounting nozzle vertical drive unit 212 is driven based on the height information of the target component held in the external storage device 405 to mount the component. The nozzle body 213 is lowered to adjust the vertical position, and components are simultaneously mounted on the printed circuit board (S28). Thus, one component mounting cycle is completed.

Here, as shown in FIGS. 2 and 3, since one component mounting head 108 has a plurality of component mounting nozzle sets 205, a plurality of components can be sucked at a time. As shown in FIG. 4, each component mounting nozzle set 205 can be simultaneously positioned at a plurality of positions on the printed circuit board by the component mounting nozzle Y-axis driving unit 207 and the component mounting nozzle X-axis driving unit 209. However, the component mounting head 108 has one component mounting head 108 that can be positioned at the same time due to restrictions on the component arrangement on the printed circuit board and the movable range of the component mounting nozzle Y-axis driving unit 207 and the component mounting nozzle X-axis driving unit 209. In some cases, it is not possible to mount all the components sucked by the component mounting nozzle groups 205 of the component mounting head 108 in a single component mounting cycle, which is smaller than the number of nozzle groups 205.

Therefore, when one component mounting cycle is completed, whether or not one component suction cycle is completed, that is, each component mounting nozzle set 205 of the component mounting head 108 is sucked in one component suction cycle. It is determined whether or not all parts have been mounted (S29). If there are unmounted components, the process returns to step S25 to execute the next component mounting cycle, and steps S25 to S28 are performed until all the remaining components sucked from the component delivery table 105 are mounted in one component suction cycle. Repeat the process.

In step S29, when one component suction cycle is completed, that is, when all components suctioned by each component mounting nozzle set 205 of the component mounting head 108 are mounted in one component suction cycle, all component suction cycles are performed. It is determined whether or not (S30). If all the component suction cycles have not been completed, the process returns to step S22 to execute the next component suction cycle, and the processes of steps S22 to S29 are repeated until all the component suction cycles are completed.

In step S30, when all the component pick-up cycles are completed (of course, all the component take-out cycles are completed in step S15), the component mounting process for one printed circuit board is completed.

In the prior art, in order to mount many types of components on a single printed circuit board, it is necessary to connect a large number of mounting units (modules) in series. Transfer between mounted units, printed circuit board holding, printed circuit board recognition Since the number of times of processing increases, there is a problem that the production throughput decreases. On the other hand, in order to be able to supply and mount many types of components with a small number of mounting units, it is necessary to make the width in the X-axis direction of the component supply unit 101 wider than that of the conventional technology.

However, in the configuration of the conventional technique, since the component mounting head needs to move directly to the component supply unit 101 and take out the component, the moving distance of the component mounting head becomes long, and the production throughput is reduced. In addition, if there are many types of components held by the component supply unit 101, there is a high possibility that the position of the component to be mounted on the printed circuit board and the position on the component supply unit 101 intersect, and a plurality of component mounting heads can be simultaneously connected. If an attempt is made to take out a component on the component supply unit 101, a collision occurs. As a result, the prior art has a problem that the waiting time for collision avoidance increases and the production throughput decreases.

On the other hand, according to the component mounting apparatus 100 of the first embodiment of the present invention, since the component picking head 102 is provided in addition to the component mounting head 108, both the component picking head 102 and the component mounting head 108 are compared with the prior art. Since the moving distance is shortened and the parts can be taken out and mounted in parallel and in a short time, the production throughput can be improved.

In the present embodiment, the component mounting heads 108 move only in the Y-axis direction on the component delivery table 105 and the printed circuit board, and do not move in the X-axis direction. do not do. On the other hand, since the component pick-up head 102 moves on the component delivery table 105 and the component supply unit 101 in the X-axis direction and the Y-axis direction, the component pick-up heads 102 may cross each other. However, since the moving distance of the component pick-up head 102 is shorter than that in the conventional technique, the waiting time for avoiding the intersection can be shortened, so that the production throughput can be improved as compared with the conventional technique.

In the prior art, although one component mounting head has a plurality of nozzles, the number of components mounted at one time is one per mounting cycle, so the number of components adsorbed by the component mounting head. It is necessary to repeat the movement of the component mounting head and the component mounting process (mounting cycle) only. On the other hand, in the present embodiment, since the plurality of component mounting nozzle sets 205 can simultaneously mount a plurality of components in a single component mounting cycle, the number of movements of the component mounting head 108 can be reduced compared to the prior art. Production throughput can be improved.

Further, since the stroke (movement distance) of the component mounting head 108, the component mounting nozzle Y-axis drive unit 207, and the component mounting nozzle X-axis drive unit 209 is shorter than the movement distances of various heads in the prior art, the movement and mounting are performed. Accuracy can be easily improved.

<Embodiment 2>
The component mounting apparatus 100 according to the second embodiment of the present invention has the same basic configuration as the component mounting apparatus 100 according to the first embodiment described above, but a plurality of component mounting nozzles mounted on the component mounting head 108. In the case of the first embodiment, the set 205 is movable in both the X-axis and Y-axis directions as shown in FIG. 4, whereas in the present embodiment, the set 205 is movable only in the X-axis direction. Is different. That is, since the component mounting head 108 itself can move in the Y-axis direction, a structure that allows the component mounting nozzle set 205 attached to the component mounting head 108 to be moved in the Y-axis direction is also omitted. Is.

FIG. 10 is a perspective view showing an outline of a configuration example of the component mounting nozzle set 205 in the present embodiment. In the Y-axis direction with respect to the component mounting head 108 by omitting the component mounting nozzle Y-axis drive unit 207 and the component mounting nozzle Y-axis guide 206 with respect to the component mounting nozzle set 205 of the first embodiment shown in FIG. The component mounting nozzle set 205 can be moved only in the X-axis direction by integrating the component mounting nozzle Y-axis base portion 208 with the component mounting head base portion 201 shown in FIG.

In the present embodiment, since the component mounting nozzle set 205 can move only in the X-axis direction, basically, the component mounting nozzle assembly 205 of the component mounting head 108 does not perform simultaneous component mounting. In one component mounting cycle, the component mounting head 108 mounts only one component by one component mounting nozzle set 205 (does not permit simultaneous mounting, but if possible only by movement in the X-axis direction. It is natural that simultaneous mounting may be performed as in the first embodiment).

In this case, in the processing flow of the component mounting process shown in FIG. 9 of the first embodiment, the component mounting cycle in steps S25 to S28 includes the number of components sucked from the component delivery table 105 by the component mounting head 108 in step S23. It is executed the same number of times. In the component mounting cycle, in step S26, the component mounting head Y-axis drive unit 109 shown in FIG. 1 is driven with respect to the target component mounting nozzle set 205 for the target component mounting position on the printed circuit board. Position in the Y-axis direction. Further, in step S27, the component mounting nozzle X-axis drive unit 209 is driven to perform positioning in the X-axis direction, and component mounting is executed in step S28.

In the above example, one component is mounted in each component mounting cycle. However, in step S25, the component mounting cycle information for all components picked up by the component mounting head 108 is read, and each component is loaded. You may make it repeat the process of step S26-step S28. The component mounting head 108 mounts one component in one component mounting cycle. Since each component mounting head 108 can operate independently and in parallel, the number of component mounting heads 108 is the same as the number of component mounting heads 108. It is possible to mount components on the printed circuit board at the same time.

In the present embodiment as well, as in the first embodiment, a plurality of components previously arranged on the component delivery table 105 by the component pick-up head 102 can be simultaneously sucked by the component mounting nozzle set 205 of the component mounting head 108. It is. In addition, since the plurality of component mounting heads 108 can operate in parallel while minimizing waiting for crossing avoidance, the production throughput can be improved as compared with the prior art.

Further, in the component mounting apparatus 100 according to the first embodiment, by omitting the component mounting nozzle Y-axis driving unit 207 (and the component mounting nozzle Y-axis guide 206) included in each component mounting nozzle set 205 of the component mounting head 108, The manufacturing cost can be reduced as compared with the component mounting apparatus 100 of the first embodiment, and the head driving speed can be improved by reducing the weight of the component mounting head 108. It is possible to suppress a decrease in production throughput due to the inability to mount components at the same time.

<Embodiment 3>
The component mounting apparatus 100 according to the third embodiment of the present invention has the same basic configuration as the component mounting apparatus 100 according to the first embodiment described above, but the component mounting head 108 is the same as that in the first embodiment. As shown in FIGS. 1 and 2, the component mounting head Y-axis drive unit 109 can move only in the Y-axis direction, but in this embodiment, it can move in both the X-axis and Y-axis directions. There is a difference.

FIG. 11 is a perspective view showing an outline of a configuration example of the component mounting head 108 in the present embodiment. For example, the component mounting head 108 further includes a component mounting head X-axis drive unit 501 and a component mounting head X-axis base unit 502 in addition to the configuration of the component mounting head 108 of the first embodiment shown in FIG. Further, unlike the configuration shown in FIG. 2, the printed circuit board recognition camera 204 is attached not to the component mounting head base unit 201 but to the component mounting head X-axis base unit 502, and instead of the component mounting nozzle set 205. And a component mounting nozzle set 503 having a different structure.

With this structure, the component mounting head 108 is driven by the component mounting head Y-axis drive unit 109 via the component mounting head Y-axis drive unit feed screw 203 as in the case of the first embodiment. It is movable along the part guide 202 in the Y-axis direction, and has a stroke that can be moved in the X-axis direction via the component mounting head X-axis base unit 502 by the component mounting head X-axis drive unit 501.

FIG. 12 is a perspective view showing an outline of a configuration example of the component mounting nozzle set 503 in the present embodiment. The component mounting nozzle set 503 is different from the component mounting nozzle set 205 of the first embodiment shown in FIG. 4 in terms of a component mounting nozzle Y-axis guide 206, a component mounting nozzle Y-axis drive unit 207, and a component mounting nozzle Y-axis. The base unit 208, the component mounting nozzle X-axis drive unit 209, and the component mounting nozzle X-axis base unit 210 are omitted, and the configuration is the same as that of the component pick-up nozzle set 305 shown in FIG. By adopting a configuration in which this is fixed to the component mounting head X-axis base portion 50 shown in FIG. 11, the component mounting nozzle set 503 itself cannot be moved in both the X-axis direction and the Y-axis direction.

In other words, in the present embodiment, the component mounting head 108 itself can move in the X-axis direction and the Y-axis direction. A structure that allows movement in the axial direction and the Y-axis direction is omitted.

In the present embodiment, since the component mounting nozzle set 503 itself cannot move in both the X-axis direction and the Y-axis direction, basically, a plurality of component mounting heads 108 have a plurality of components as in the second embodiment. Component mounting by the component mounting nozzle set 503 is not performed simultaneously, and the component mounting head 108 mounts only one component by one component mounting nozzle set 503 in one component mounting cycle.

In this case, as in the case of the second embodiment, in the component mounting process flow shown in FIG. 9, in the component mounting cycle of steps S25 to S28, the component mounting head 108 sucks from the component delivery table 105 in step S23. It is executed as many times as the number of parts selected. In the component mounting cycle, in step S26, with respect to the target component mounting nozzle set 503, the component mounting head X-axis drive unit 501 and the component mounting shown in FIG. The head Y-axis drive unit 109 is driven to perform positioning in the X-axis direction and the Y-axis direction, and component mounting is executed in step S28. In the present embodiment, since the component mounting nozzle set 503 does not have driving units in the X-axis direction and the Y-axis direction, positioning processing in the X-axis direction and the Y-axis direction is not performed in step S27, and the component mounting nozzle rotation mechanism Only the component attitude control by the unit 211 is performed.

As in the case of the second embodiment, in the present embodiment, one component is mounted in each component mounting cycle. However, in step S25, all components that are picked up by the component mounting head 108 are detected. The component mounting cycle information may be read, and the processing in steps S26 to S28 may be repeated for each component. The component mounting head 108 mounts one component in one component mounting cycle. However, since each component mounting head 108 can operate independently and in parallel, the number of component mounting heads 108 is the same as the number of component mounting heads 108. It is possible to mount components on the printed circuit board at the same time.

In the present embodiment as well, as in the first embodiment, a plurality of components previously arranged on the component delivery table 105 by the component pick-up head 102 can be simultaneously sucked by the component mounting nozzle set 503 of the component mounting head 108. It is. In addition, since the plurality of component mounting heads 108 can operate in parallel while minimizing waiting for crossing avoidance, the production throughput can be improved as compared with the prior art.

Further, in the component mounting apparatus 100 according to the first embodiment, the component mounting nozzle Y-axis drive unit 207 (and the component mounting nozzle Y-axis guide 206) included in each component mounting nozzle set 205 of the component mounting head 108, the component mounting nozzle Y-axis base. By omitting the part 208, the component mounting nozzle X-axis drive unit 209, and the component mounting nozzle X-axis base unit 210, the manufacturing cost can be reduced compared to the component mounting apparatus 100 of the first embodiment. It is possible to improve the head driving speed by reducing the weight of the component mounting head 108, and it is possible to suppress a decrease in production throughput due to the component mounting head 108 being unable to mount a plurality of components simultaneously.

As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say. For example, the examples described in the above embodiments are described in detail in order to easily understand the present invention, and are not necessarily limited to those having all the configurations described. Further, a part of a configuration in one embodiment can be replaced with a configuration in another embodiment, and a configuration in another embodiment can be added to a configuration in one embodiment. . Further, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

In addition, each of the above-described configurations, functions, processing units, processing means, and the like may be realized by hardware by designing a part or all of them with, for example, an integrated circuit. Further, each of the above-described configurations, functions, and the like may be realized by software by interpreting and executing a program that realizes each function by the processor. Information such as programs, tables, and files that realize each function is stored in a memory, hard disk, SSD (Solid State Drive) or other recording device, or IC (Integrated Circuit) card, SD memory card, DVD (Digital Versatile Disk) Etc. can be placed on a recording medium. Further, the control lines and information lines are those that are considered necessary for the explanation, and not all the control lines and information lines on the product are necessarily shown. In practice, it may be considered that almost all the components are connected to each other.

In each of the above-described embodiments, the component mounting apparatus 100 that mounts an electronic component or the like on a printed circuit board has been described as an example of the component mounting apparatus. The present invention can also be widely applied to devices for mounting and arranging parts and the like on industrially produced articles such as food processing and food processing.

The present invention is applicable to a component mounting apparatus and a component mounting method for mounting a large number of small components, such as mounting electronic components on a printed circuit board.

Claims

A component mounting apparatus for mounting a plurality of types of components supplied from a component supply unit to an object fixed to an object conveyance path,
A plurality of component delivery tables between the component supply unit and the object transport path;
Furthermore, a plurality of component pick-up heads that are movable above an area including the component supply unit and each component delivery table;
Having the same number of component mounting heads as the component transfer table, which is movable without crossing over the region including the component transfer table and the object transport path,
The component pick-up head picks up a necessary part from the component supply unit and arranges it on the predetermined component delivery table, and the component mounting head is arranged on the corresponding component delivery table by each component take-out head. A component mounting apparatus that acquires a component and mounts the component at a predetermined position of the object.
In the component mounting apparatus according to claim 1,
The component mounting head has a plurality of component mounting member sets,
The component delivery table has a plurality of component holding tables for holding components by an arrangement corresponding to the arrangement of the component mounting member groups in the component mounting head.
The component mounting head is configured to simultaneously acquire the components respectively held in the component holding tables of the corresponding component delivery table by the component mounting member groups.
In the component mounting apparatus according to claim 1 or 2,
The component mounting head is movable above a region including the component delivery table and the object conveyance path along a first direction connecting the component supply unit and the object conveyance path.
Each of the component mounting member sets of the component mounting head is movable along the first direction and a second direction orthogonal to the first direction with respect to the component mounting head.
The component mounting head moves the component mounting member group in the first direction and / or the position of the object on which the component mounting member group should mount the component acquired from the component delivery table. A component mounting apparatus, wherein the component mounting device is configured to individually move and position each of the components in the second direction and simultaneously mount the components acquired by the component mounting member groups on the object.
In the component mounting apparatus according to claim 1 or 2,
The component mounting head is movable above a region including the component delivery table and the object conveyance path along a first direction connecting the component supply unit and the object conveyance path.
Each of the component mounting member groups of the component mounting head is movable with respect to the component mounting head along a second direction orthogonal to the first direction.
In the component mounting apparatus according to claim 1 or 2,
The component mounting head includes the component delivery table and the object conveyance along a first direction connecting the component supply unit and the object conveyance path and a second direction orthogonal to the first direction. Move over the area containing the road,
Each component mounting member set of the component mounting head is attached so as not to move with respect to the component mounting head.
In the component mounting apparatus according to claim 2,
The component take-out head has a plurality of component take-out member sets by the same arrangement as the arrangement of the respective component mount member sets in the component mount head, and the components taken out from the component supply unit by the respective component take-out member sets. Are arranged simultaneously on the corresponding component holding tables of the component delivery table.
In the component mounting apparatus according to claim 2,
Each of the component holding tables of the component delivery table is individually movable in the vertical direction, and can absorb the impact when the components are arranged and / or adjust the height of the arranged components. A component mounting device characterized in that it is possible.
In the component mounting apparatus according to claim 2,
Each component mounting member group of the component mounting head is a component that is held by the component mounting member by moving a component mounting member main body that acquires, holds, and releases the component vertically and / or rotationally. A component mounting device that adjusts the position and / or posture of the device.
In the component mounting apparatus according to claim 1,
A component having a configuration including the component delivery table and the component supply unit, the component take-out head, and the component mounting head on both sides of the object conveyance path with respect to the object conveyance path. Mounting device.
A component mounting method for mounting a component on a target by a component mounting device for mounting a plurality of types of components supplied from a component supply unit on the target fixed to the target transport path,
A plurality of component pick-up heads take out a plurality of components to be mounted on the object from the component supply unit, and among a plurality of component delivery tables arranged between the component supply unit and the object conveyance path A part removing step to be arranged in a predetermined one,
A component acquisition step in which the same number of component mounting heads as the component delivery table simultaneously acquire a plurality of components arranged in the corresponding component delivery table;
Each of the component mounting heads includes a component mounting step of mounting a plurality of components acquired from the component delivery table at predetermined positions of the object,
A component mounting method, wherein the component take-out step, the component acquisition step, and the component mounting step are executed in parallel.