JP5873988B2 - Parts transfer device - Google Patents

Description

  The present invention relates to a component transfer apparatus and a component transfer method for transferring components.

  2. Description of the Related Art Conventionally, a component transfer apparatus that transfers a plurality of semiconductor chips (components) attached to a wafer sheet to a substrate or a tray is known.

  For example, a component transfer apparatus described in Patent Document 1 has a transfer head provided with a plurality of nozzles for picking up components on a wafer sheet so as to be movable up and down, and a component is pushed up from below through a wafer sheet by a pin. And an ejector mechanism. The transfer head and the push-up pin of the ejector mechanism are configured to be movable in the horizontal direction (X-axis direction and Y-axis direction). Thereby, the nozzle of the transfer head can be aligned with the upper position of the component to be picked up, and the push-up pin of the ejector mechanism can be aligned with the lower position of the component. As a result, the nozzle of the transfer head can pick up the part from above, and the push-up pin of the ejector mechanism can push up the part from below.

JP 2003-174291 A

  By the way, in recent years, in order to speed up parts transfer, it is desired to increase the number of nozzles mounted on the transfer head. However, as the number of nozzles increases, the weight of the transfer head increases. When the transfer head is increased in weight, vibration is likely to occur in the support that supports the transfer head when the transfer head is accelerated, decelerated, or stopped. Therefore, when the number of nozzles of the transfer head increases, it is necessary to take measures to suppress vibration generated due to acceleration / deceleration or stop of the transfer head.

  However, like the transfer head described in Patent Document 1, vibrations caused by acceleration / deceleration or stop of a transfer head that can move in two horizontal directions of the X-axis direction and the Y-axis direction are the vibrations. The behavior is complex.

  For example, when the transfer head of the component transfer apparatus described in Patent Document 1 moves in the horizontal direction between the X-axis direction and the Y-axis direction and stops, the transfer head is supported in the X-axis direction. Vibrations in various vibration modes are generated in the X-axis table to be moved and the Y-axis table that supports the X-axis table and moves in the Y-axis direction. It is difficult to suppress such complex behavior vibrations, and the cost of the component transfer device is increased.

  Accordingly, an object of the present invention is to easily suppress vibration generated due to acceleration / deceleration or stop of the transfer head even if the number of nozzles increases and the weight of the transfer head increases. .

In order to solve the above-mentioned problem, according to the first aspect of the present invention,
A sheet moving device that moves a sheet on which a plurality of components are placed only in the first horizontal direction ;
A target moving device for moving a target on which a component picked up by the nozzle is placed only in the first horizontal direction;
A beam member lying from above the sheet moving device to above the target moving device;
A transfer head equipped with a nozzle for picking up components on the sheet from above so as to be movable up and down, and moving only in a second horizontal direction orthogonal to the first horizontal direction;
A camera that moves only in the second horizontal direction and photographs a plurality of parts on the sheet from above;
The first and second horizontal positions of the parts to be picked up are detected from the photographed image of the camera, and the first and second horizontal positions of the parts to be picked up and the nozzles are matched based on the detection result. And a control device for controlling the sheet moving device and the transfer head ,
The transfer head and the camera are provided with a component transfer apparatus in which the transfer head and the camera are guided to be separately movable in the second horizontal direction by a common guide member fixed to the beam member .

According to a second aspect of the invention,
An ejector device that includes a push-up pin that pushes up a part on a sheet to be picked up from below through the sheet and moves the push-up pin only in the second horizontal direction at the same first horizontal position as the nozzle of the transfer head. A component transfer device according to the first aspect is further provided.

According to a third aspect of the invention,
A second camera that moves only in the second horizontal direction and images the target held by the target moving device from above;
The control device detects the first and second horizontal positions of the target from the captured image of the second camera, and based on the detection result, the first and second horizontal positions of the nozzle and the target for holding the component, respectively. The component transfer apparatus according to the first or second aspect is provided that controls the transfer head and the target moving apparatus so that the directional positions coincide with each other.

According to a fourth aspect of the invention,
Second camera, the second horizontal direction by guide members, and the transfer head and the camera are guided separately movable parts move according to the first to any one of the third aspect A device is provided.

According to a fifth aspect of the present invention,
The transfer head has a plurality of nozzles arranged in the second horizontal direction,
The component transfer device according to any one of the first to fourth aspects is provided, in which a plurality of target moving devices are provided side by side in the second horizontal direction.

According to a sixth aspect of the present invention,
A first camera further includes a third camera that is disposed between the sheet moving device and the target moving device and is located at a position where the nozzle of the transfer head passes above, and that captures a part held by the nozzle from below. A component transfer apparatus according to any one of the fifth aspects is provided.

  According to the present invention, since the transfer head moves only in one horizontal direction, the behavior of vibrations generated by acceleration / deceleration and stop of the transfer head is simpler than when the transfer head moves in two horizontal directions. It becomes. As a result, even if the number of mounted nozzles increases and the transfer head becomes heavier, vibrations generated by acceleration / deceleration or stop of the transfer head can be easily suppressed.

The top view of the components transfer apparatus which concerns on one embodiment of this invention Front view of the component transfer apparatus shown in FIG. Block diagram showing the control system of the parts transfer device Enlarged view of the area around the ejector push pin Top view of the component transfer apparatus showing a state in which the transfer head is disposed above the wafer sheet

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a top view of a component transfer apparatus according to an embodiment of the present invention, and FIG. 2 is a front view. FIG. 3 shows a control system of the component transfer apparatus.

  The component transfer apparatus 10 shown in FIGS. 1 and 2 is configured to transfer a plurality of semiconductor chips (hereinafter referred to as “components”) P on a wafer sheet 12 to a target W.

  For this purpose, the component transfer apparatus 10 includes a sheet moving device 14 that moves the wafer sheet 12 on which a plurality of components P are placed, and a transfer head that includes a plurality of nozzles 16 that pick up the components P on the wafer sheet 12. 18, an ejector device 22 that pushes up a component P on the wafer sheet 12 from below by a push pin, a target moving device 24 that moves a target W on which the component P is placed, and a control device 50 that controls them. .

  The wafer sheet 12 is composed of an adhesive sheet. As shown in FIG. 1, a plurality of components P are stuck in a matrix at the center of the wafer sheet 12. The wafer sheet 12 is also held by an annular wafer ring 26 at the periphery.

  The wafer sheet moving device 14 is a device for moving a wafer sheet on which a plurality of components P are placed (attached), and includes a stage 28 on which the wafer sheet 12 is held and a stage 28 that is a first stage. And a linear motion mechanism 30 that moves only in the X-axis direction, which is the horizontal direction.

  The stage 28 of the wafer sheet moving apparatus 14 includes a wafer ring holding portion 28 b for fixing the wafer ring 26 and a tubular portion 28 a inserted through the wafer ring 26. As shown in FIG. 2, the upper end of the tubular portion 28 a of the stage 28 inserted through the wafer ring 26 comes into contact with the wafer sheet 12, so that the central portion of the wafer sheet 12 on which a plurality of components P are placed is in the horizontal direction. To be stretched. Further, as shown in FIG. 4, the tubular body 20a of the ejector device 22 is caused to enter the tubular portion 28a so as to come into contact with the lower surface of the wafer sheet 12, and a push-up pin 20 incorporated in the tubular body 20a P can be pushed up from below.

  The stage 28 also receives a wafer ring 26 holding the wafer sheet 12 on which a plurality of components P are placed from another device (not shown) (position shown in FIG. 1) and a position above the ejector device 22. It is configured to be movable only in the X-axis direction. As shown in FIGS. 1 and 2, the stage 28 is mounted on a stage base 34 that engages with a pair of rail members 32 extending in the X-axis direction so as to be movable in the X-axis direction with the ejector device 22 interposed therebetween. It is attached.

  The linear motion mechanism 30 of the wafer sheet moving device 14 is configured by a ball screw mechanism. Specifically, as shown in FIG. 1, the linear motion mechanism 30 includes a ball screw 30a extending in the X-axis direction, a nut 30b fixed to the stage base 34 and engaged with the ball screw 30a, and a ball screw. And a motor 30c that rotates the shaft 30a about its axis.

  When the motor 30c rotates the ball screw 30a, the stage base 34 moves in the X-axis direction according to the rail member 32 via the nut 30b. As a result, the wafer sheet 12 (that is, the component P) moves in the X axis direction.

  With the wafer sheet moving device 14 having such a configuration, the position in the X-axis direction of the component P placed on the wafer sheet 12 can be changed.

  The configuration of the wafer sheet moving device 14 that moves the wafer sheet 12 only in the X-axis direction is not limited to the above-described configuration. As long as the position of the wafer sheet 12 (component P) in the X-axis direction can be adjusted, the configuration of the wafer sheet moving device 14 may be any configuration.

  The transfer head 18 is a device for transferring the component P on the wafer sheet 12 to the target W, and as shown in FIG. 2, can move up and down a plurality of nozzles 16 that adsorb and hold the component (in the Z-axis direction). Ready for movement). For example, the transfer head 18 has a nozzle raising / lowering mechanism (not shown) for raising and lowering the nozzle 16 for each of the plurality of nozzles 16. The plurality of nozzles 16 are mounted on the transfer head 18 in a state of being arranged in a line in the Y-axis direction, although the reason will be described later.

  The transfer head 18 is further configured to move only in the Y-axis direction, which is a second horizontal direction orthogonal to the first horizontal direction. As shown in FIGS. 1 and 2, the transfer head 18 is supported by a beam member 40 extending in the Y-axis direction so as to be movable in the Y-axis direction.

  As shown in FIG. 5, the beam member 40 extends in the Y-axis direction so that the stage 28 of the wafer sheet moving device 14 can pass under the transfer head 18 supported by the beam member 40. Further, both ends of the beam member 40 are supported by a pair of columnar members 42 erected on the main body portion 10 b of the component transfer apparatus 10.

  Specifically, the transfer head 18 is moved in the Y-axis direction by a linear motion mechanism 44 attached to the beam member 40. In the case of the component transfer apparatus 10 of the present embodiment, the linear motion mechanism 44 is configured by a linear motor. A stator 44a of a linear motor, which is a guide member for guiding the transfer head 18 in the Y-axis direction, is fixed to the beam member 40, and a mover (moving body) 44b that is movably engaged with the stator 44a in the Y-axis direction is transferred. It is fixed to the head 18.

  With the transfer head 18 having such a configuration, the nozzle 16 can move in the Y-axis direction at a predetermined position in the X-axis direction (predetermined X-coordinate) and can move in the Z-axis direction.

  The ejector device 22 includes a push-up pin 20, and an ejector drive mechanism 46 that moves the push-up pin 20 and the cylindrical body 20a up and down (moves them in the Z-axis direction). Furthermore, the ejector device 22 includes a linear motion mechanism 48 that moves the ejector drive mechanism 46 only in the Y-axis direction.

  As shown in FIG. 4, the cylindrical body 20a of the ejector device 22 includes a contact surface 20c that contacts the lower surface of the wafer sheet 12, and a hole 20b formed in the contact surface 20c. The push-up pin 20 is a pin member extending in the Z-axis direction for pushing up the component P on the wafer sheet 12 from below through the wafer sheet 12, and is driven by the ejector drive mechanism 46 to be brought into contact with the hole 20b. Protruding from 20c. The push-up pin 20 is also disposed at the same X-axis direction position (X coordinate) as the nozzle 16 of the transfer head 18 that can move only in the Y-axis direction.

  The ejector drive mechanism 46 has a built-in drive mechanism that lowers the cylindrical body 20a to a position where collision with the stage 28 can be avoided when the stage 28 of the wafer sheet moving device 14 passes above the ejector device 22. The ejector driving mechanism 46 also raises the push-up pins 20 when the cylindrical body 20a enters the tubular portion 28a of the stage 28 and the contact surface 20c contacts the lower surface of the wafer sheet 12 to raise the wafer. A drive mechanism that pushes up the component P placed on the sheet 12 is also incorporated.

  The linear motion mechanism 48 of the ejector device 22 is configured to move the ejector drive mechanism 46 only in the Y-axis direction. For example, the linear motion mechanism 48 is configured by a ball screw mechanism.

  With the ejector device 22 having such a configuration, the push-up pin 20 can move in the Y-axis direction at the same X-axis direction position as the nozzle 16 of the transfer head 18 and can move in the Z-axis direction. .

  The target moving device 24 is a device for moving the target W to which the component P is transferred, and includes a stage 60 on which the target W is placed and a linear motion mechanism 62 that moves the stage 60 only in the X-axis direction. And a supply / recovery conveyor 64 for supplying the target W onto the stage 60 and recovering the target W from the stage 60.

  The stage 60 of the target moving device 24 is configured to hold the target W on which the component P held by the nozzle 16 of the transfer head 18 is transferred.

  The linear motion mechanism 62 is configured to move the stage 60 only in the X-axis direction. For example, the linear motion mechanism 62 is configured by a ball screw mechanism.

  The supply / recovery conveyor 64 is configured to supply, for example, a target W supplied from another device (not shown) adjacent to the component transfer device 10 before the component P is placed to the stage 60. Has been. Further, the target W on which the component P is placed is collected from the stage 60 and supplied to another device (not shown).

  In addition, a plurality of target moving devices 24 are provided in the component transfer device 10 side by side in the Y-axis direction. Specifically, the same number of target moving devices 24 as the number of nozzles 16 of the transfer head 18 are provided. Accordingly, the parts P held by the plurality of nozzles 16 of the transfer head 18 can be placed one by one on the target W held by the stage 60 of each of the plurality of target moving devices 24.

  With the target moving device 24 having such a configuration, the X-axis direction position of the target W that is the target on which the component P is placed can be changed.

  As shown in FIG. 3, the controller 50 of the component transfer apparatus 10 controls the wafer sheet moving device 14, the transfer head 18, the ejector device 22, and the target moving device 24 to control the component P on the wafer sheet 12. Is transferred to the target W.

  Specifically, the control device 50 includes the linear motion mechanism 30 of the wafer sheet moving device 14, the linear motion mechanism 44 of the transfer head 18, a nozzle lifting mechanism (not shown), the ejector driving mechanism 46 of the ejector device 22, and the linear motion mechanism 46. The moving mechanism 48, the linear moving mechanism 62 of the target moving device 24, and the supply / recovery conveyor 64 are controlled. Hereinafter, an operation performed by the control device 50 to transfer the component P from the wafer sheet 12 to the target W will be described.

  First, the control device 50 controls the wafer sheet moving device 14 so that the nozzle 16 of the transfer head 18 can pick up the component P to be transferred to the target W from the plurality of components P on the wafer sheet 12. Thus, alignment of the wafer sheet 12 is executed. Specifically, the control device 50 controls the wafer sheet moving device 14 so that the position of the pickup target component P in the X-axis direction is the same as the position of the nozzle 16 of the transfer head 18 in the X-axis direction.

  In order to make this possible, the component transfer apparatus 10 has a pickup component recognition camera 80 for detecting the X-axis direction position and the Y-axis direction position (X, Y coordinates) of the component P to be picked up. .

  As shown in FIGS. 1 and 2, the pickup component recognition camera 80 is supported by the beam member 40 so as to be movable only in the Y-axis direction so that the component P on the wafer sheet 12 can be photographed from above.

  Specifically, the pickup component recognition camera 80 moves the transfer head 18 in the Y-axis direction in a state where the X-axis direction position of the optical axis of the camera matches the X-axis direction position of the nozzle 16 of the transfer head 18. It is moved by the linear motor to be moved (linear motion mechanism 30). The pick-up component recognition camera 80 is fixed to another mover 44c different from the mover (moving body) 44b to which the transfer head 18 is fixed. That is, the pickup part recognition camera 80 and the transfer head 18 are guided in the Y-axis direction by the common stator 44a. As a result, there is no need to separately provide a guide member (a linear motor stator) for guiding the pickup part recognition camera 80 in the Y-axis direction.

  The control device 50 controls the pickup component recognition camera 80 and the wafer sheet moving device 14, and places the wafer sheet 12 below the pickup component recognition camera 80. Then, the pick-up component recognition camera 80 takes an image of the component P on the wafer sheet 12.

  The control device 50 acquires the captured image (data) of the component P captured by the pickup component recognition camera 80 and performs image processing, and the X-axis direction position and the Y-axis direction position (X, Y) of the component P to be picked up. Coordinate).

  The control unit 50 determines the attitude of the component P to be picked up, specifically, for example, the angle θ on the xy plane with the x axis being zero degrees, based on the captured image of the pickup component recognition camera 80. You may comprise so that it may detect. When the nozzle 16 is mounted on the transfer head 18 so as to be rotatable about a rotation center line extending in the Z-axis direction, the nozzle 16 is rotated by rotating the nozzle 16 based on the detected angle θ of the component P. Can hold the component P in a desired posture.

  The control device 50 calculates the X-axis direction distance (deviation amount) between the detected X-axis direction position of the component P to be picked up and the X-axis direction position of the nozzle 16, and the wafer sheet 12 is calculated by the calculated deviation amount. The (stage 28) is moved in the X-axis direction by controlling the wafer sheet moving device 14. Thereby, the parts P to be picked up coincide with the positions of the nozzles 16 in the X-axis direction.

  Next, the control device 50 matches the position in the Y-axis direction of the nozzle 16 of the transfer head 18 with the position in the Y-axis direction of the component P to be picked up detected based on the image captured by the pick-up component recognition camera 80. Then, the transfer head 18 is moved in the Y-axis direction. Further, the control device 50 controls the ejector device 22 to move the push-up pin 20 in the Y-axis direction so that the Y-axis direction position of the component P to be picked up coincides with the Y-axis direction position of the push-up pin 20. As a result, the X-axis direction position and the Y-axis direction position of the nozzle 16, the component P, and the push-up pin 20 are the same.

  Subsequently, the control device 50 pushes up the component P to be picked up through the wafer sheet 12 by controlling the ejector device 22 (ejector drive mechanism 46) to raise the push-up pin 20. At the same time, the transfer head 18 (nozzle raising / lowering mechanism) is controlled to lower the nozzle 16 so that the component P is attracted to the nozzle 16. After suction of the component P, the control device 50 raises the nozzle 16 and lowers the push-up pin 20, whereby the component P is separated from the wafer sheet 12 and is held by the nozzle 16.

  Similarly, the control device 50 causes each of the remaining nozzles 16 to pick a part P. Thereafter, the transfer head 18 is moved in the Y-axis direction toward the target moving device 24.

  The component transfer apparatus 10 according to the present embodiment is configured to inspect (check) the component P held by the plurality of nozzles 16. As shown in FIG. 2, the component P held by the nozzle 16 is located from below at a position between the wafer sheet moving device 14 and the target moving device 24 and at a position where the nozzle 16 of the transfer head 18 passes above. A check part recognition camera 82 for photographing is arranged. The check component recognition camera 82 photographs the component P from below when the component P held by the nozzle 16 of the transfer head 18 passes above. The control device 50 is configured to acquire a captured image captured by the checking component recognition camera 82 and check for an abnormality of the component P based on the acquired captured image.

  Before the transfer head 18 reaches above the target moving device 24, the control device 50 is configured to control the target moving device 24 and perform alignment of the target W. Specifically, the control device 50 determines that the target W is positioned so that the X-axis direction position of a predetermined portion of the target W on which the component P is placed matches the X-axis direction position of the nozzle 16 of the transfer head 18. The stage 60 placed is moved in the X-axis direction.

  In order to enable this, the target recognition camera 84 for detecting the X-axis direction position and the Y-axis direction position (X, Y coordinates) of a predetermined portion of the target W on which the part P is placed The transfer apparatus 10 has.

  As shown in FIGS. 1 and 2, the target recognition camera 84 is supported by the beam member 40 so as to be movable only in the Y-axis direction so that the target W on the stage 60 of the target moving device 24 can be photographed from above. Yes.

  Specifically, the target recognition camera 84 moves the transfer head 18 in the Y-axis direction in a state where the X-axis direction position of the optical axis of the camera matches the X-axis direction position of the nozzle 16 of the transfer head 18. It is moved by a linear motor (linear motion mechanism 30). Specifically, the target recognition camera 84 is fixed to another mover 44d different from the mover (moving body) 44b to which the transfer head 18 is fixed. That is, the target recognition camera 84 and the transfer head 18 are guided in the Y-axis direction by the common stator 44a. As a result, it is not necessary to separately provide a guide member (a linear motor stator) for guiding the target recognition camera 84 in the Y-axis direction.

  The control device 50 controls the target recognition camera 84 and the target moving device 24 and arranges the target W below the target recognition camera 84. Then, the target recognition camera 84 takes an image of the target W.

  The control device 50 acquires a captured image (data) of the target W captured by the target recognition camera 84 and performs image processing, and the X-axis direction position and the Y-axis of a predetermined portion of the target W on which the component P is placed. It is configured to detect the direction position (X, Y coordinates).

  The control device 50 calculates the distance (deviation amount) between the X-axis direction position of the predetermined portion of the target W on which the detected component P is placed and the X-axis direction position of the nozzle 16, and calculates the calculated deviation. The target W (stage 60) is moved in the X-axis direction by controlling the wafer sheet moving device 14 by an amount. Thereby, the parts P to be picked up coincide with the positions of the nozzles 16 in the X-axis direction.

  Next, the control device 50 detects the nozzle 16 of the transfer head 18 at a position in the Y-axis direction of a predetermined portion of the target W on which the component P is placed, which is detected based on an image captured by the target recognition camera 84. The transfer head 18 is moved in the Y-axis direction so that the positions in the Y-axis direction match. As a result, the X-axis direction position and the Y-axis direction position of the nozzle 16 that holds the part P and the predetermined portion of the target W on which the part P is placed match.

  Then, the control device 50 lowers the nozzle 16 of the transfer head 18 to place the component P held by the nozzle 16 on the target W. Thereby, the transfer of the component P from the wafer sheet 12 to the target W is completed.

  According to the present embodiment, since the transfer head 18 moves only in the Y-axis direction, the acceleration / deceleration of the transfer head 18 and the transfer head 18 are compared with the case where the transfer head 18 moves in the X-axis direction and the Y-axis direction. The behavior of vibration generated by stopping is simplified. As a result, even if the number of mounted nozzles 16 increases and the transfer head 18 becomes heavier, vibrations generated by acceleration / deceleration or stop of the transfer head 18 can be easily suppressed.

  To explain, when the transfer head 18 that moves in the Y-axis direction stops, the beam member 40 that is a support that supports the transfer head 18 and the columnar member 42 that supports the beam member 40 mainly vibrate in the Y-axis direction. . Therefore, for example, the vibration can be easily suppressed only by improving the deflection rigidity of the columnar member 42 in the Y-axis direction.

  Further, since the nozzle 16 for picking up the component P moves only in one direction in the Y-axis direction, the wafer sheet 12 on which the component P is placed, the push-up pins 20 that push up the component P, and the component P are placed. The target W to be moved can be moved only in one direction.

  To explain, in order to pick up each of the plurality of components P placed in a matrix on the wafer sheet 12 by the nozzles 16 of the transfer head 18 movable only in the Y-axis direction, the wafer sheet 12 is inevitably taken up. Need only move in the X-axis direction. That is, the wafer sheet moving device 14 that moves the wafer sheet 12 in the X-axis direction only needs to move the wafer sheet 12 only in the X-axis direction.

  Further, in order for the wafer sheet moving device 14 to move the wafer sheet 12 in the X-axis direction, the push-up pins 20 only move in the Y-axis direction, and a plurality of the pins placed on the wafer sheet 12 in a matrix form. The part P can be pushed up. Similarly, the pick-up component recognition camera 80 can also photograph a plurality of components P placed in a matrix on the wafer sheet 12 simply by moving in the Y-axis direction.

  Further, in order to place the component P held by the nozzle 16 of the transfer head 18 that can move only in the Y-axis direction on a predetermined portion of the target W, the target W inevitably moves only in the X-axis direction. It only needs to be able to move. That is, the target moving device 24 only needs to move the target W only in the X-axis direction.

  Furthermore, since the target moving device 24 moves the target W in the X-axis direction, the target recognition camera 84 can photograph the target W held on the stage 60 only by moving in the Y-axis direction. .

  Accordingly, the component P can be transferred from the wafer sheet 12 to the target W only by moving the transfer head 18 (nozzle 16), the wafer sheet 12, the push-up pins 20, and the target W only in one horizontal direction. . Therefore, the wafer sheet 12 that moves in the X-axis direction, the push-up pin 20 that moves in the Y-axis direction, the pick-up component recognition camera 80 that moves in the Y-axis direction, the target W that moves in the X-axis direction, and the movement in the Y-axis direction The vibrations generated by acceleration / deceleration or stopping of each of the target recognition cameras 84 to be controlled can be easily suppressed as compared with the case where they move in both the X-axis direction and the Y-axis direction.

  Although the present invention has been described with reference to the above-described embodiment, the present invention is not limited to the above-described embodiment.

  For example, the target W on which the component P held by the nozzle 16 of the transfer head 18 is placed may be a substrate or a lead frame that is a component of the electronic device, or a tray that accommodates the component P. Further, the component P held by each of the plurality of nozzles 16 of the transfer head 18 may be placed on one substrate or one tray.

  Further, when it is not necessary to position and place the component P with respect to the target, for example, when the component P is simply placed on the tray that is the target, the target recognition camera 84 can be omitted.

  Further, in the case of the above-described embodiment, the pickup component recognition camera 80 and the target recognition camera 84 are in a state where the X-axis direction position of the optical axis of the camera matches the X-axis direction position of the nozzle 16 of the transfer head 18. Although it is guided by a guide member (linear motor stator 44a) common to the transfer head 18, the present invention is not limited to this. For example, the pickup component recognition camera 80 and the target recognition camera 84 may be supported by another beam member different from the beam member 40 that supports the transfer head 40 so as to be movable in the Y-axis direction.

  Furthermore, in the above-described embodiment, the transfer head 18 includes a plurality of nozzles 16 arranged in a line in the Y-axis direction, but the present invention is not limited to this. For example, when two components P are mounted on one target, the plurality of nozzles 16 may be mounted on the transfer head 18 in a state of being arranged in two rows in the Y-axis direction.

  In addition, in the case of the above-described embodiment, the ejector device 22 assists in picking up the component P of the nozzle 16 of the transfer head 18 by pushing up the component P from below with the push-up pin 20. Is not limited to this. For example, the ejector device 22 is configured to irradiate ultraviolet rays between the component P and the wafer sheet 12 in order to weaken the adhesive force between the component P to be picked up by the nozzle 16 and the wafer sheet 12. May be. As a result, the nozzle 16 can easily pick up the component P from the wafer sheet 12.

  In addition, a target recognition camera 84 for detecting the X-axis direction position and the Y-axis direction position of a predetermined portion of the target W on which the component P is placed may be integrally attached to the transfer head 18. . In the case of the above-described embodiment, a mechanism for moving the transfer head 18 and a mechanism for moving the target recognition camera 84 are necessary. On the other hand, when the target recognition camera 84 is integrally attached to the transfer head 18, only one mechanism is required to move them.

  The present invention can be applied to a component transfer apparatus that transfers a plurality of components placed on a sheet to different locations.

10 Parts transfer device 12 Sheet (wafer sheet)
14 Sheet moving device (wafer sheet moving device)
16 Nozzle 18 Transfer Head 20 Push-up Pin 22 Ejector Device 24 Target Moving Device 80 Camera (Pickup Component Recognition Camera)
P parts W target

Claims (6)

A sheet moving device that moves a sheet on which a plurality of components are placed only in the first horizontal direction ;
A target moving device for moving a target on which a component picked up by the nozzle is placed only in the first horizontal direction;
A beam member lying from above the sheet moving device to above the target moving device;
A transfer head equipped with a nozzle for picking up components on the sheet from above so as to be movable up and down, and moving only in a second horizontal direction orthogonal to the first horizontal direction;
A camera that moves only in the second horizontal direction and photographs a plurality of parts on the sheet from above;
The first and second horizontal positions of the parts to be picked up are detected from the photographed image of the camera, and the first and second horizontal positions of the parts to be picked up and the nozzles are matched based on the detection result. And a control device for controlling the sheet moving device and the transfer head ,
The component transfer apparatus , wherein the transfer head and the camera are guided so as to be separately movable in the second horizontal direction by a common guide member fixed to the beam member .   An ejector device that includes a push-up pin that pushes up a part on a sheet to be picked up from below through the sheet and moves the push-up pin only in the second horizontal direction at the same first horizontal position as the nozzle of the transfer head. The component transfer apparatus according to claim 1, further comprising: A second camera that moves only in the second horizontal direction and images the target held by the target moving device from above;
The control device detects the first and second horizontal positions of the target from the captured image of the second camera, and based on the detection result, the first and second horizontal positions of the nozzle and the target for holding the component, respectively. The component transfer apparatus according to claim 1, wherein the transfer head and the target moving apparatus are controlled so that the directional positions coincide with each other. Second camera, the second horizontal direction by guide members, and the transfer head and the camera is guided movably separately component according to any one of claims 1 to 3 Utsuri戴apparatus. The transfer head has a plurality of nozzles arranged in the second horizontal direction,
The component transfer apparatus according to any one of claims 1 to 4, wherein the plurality of target moving apparatuses are provided side by side in the second horizontal direction.   The apparatus further comprises a third camera that is disposed between the sheet moving device and the target moving device and is located at a position where the nozzle of the transfer head passes above, and that captures a part held by the nozzle from below. To 5. The parts transfer device according to any one of items 5 to 5.

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