EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.
(First Embodiment)
Hereinafter, with reference to FIGS. 1-7, the structure of the mounting apparatus 100 which concerns on 1st Embodiment of this invention is demonstrated. In addition, in order to clarify a directional relationship, XYZ rectangular coordinate axis was shown suitably. The X axis direction is a direction parallel to the horizontal plane, the Y axis direction is a direction orthogonal to the X axis direction on the horizontal plane, and the Z axis direction is a direction orthogonal to the X axis and the Y axis, respectively.
The mounter 100 draws bare chips from the diced wafer W, mounts (mounts) the printed circuit board P on the printed circuit board P, and mounts package components supplied by the component supply apparatus 160 to the printed circuit board ( It is a so-called composite mounting machine which can be mounted on P). In addition, the printed board P is an example of the "substrate" of this invention.
As shown in Figs. 1 and 2, the mounting apparatus 100 includes a base 1, a conveyor 2 for carrying in and taking out the printed board P at a predetermined mounting work position, and a chip component. The chip component supply part 3 for supplying is provided. 2 and 4, the mounting apparatus 100 includes a mounting portion 4 and a wafer storage portion 170 for mounting a component (bare chip or chip component) on the printed circuit board P. As shown in FIG. Wafer holding table 5 for supporting the wafer W drawn out from the wafer and take-out device 6 for taking out a bare chip from the wafer W supported on the wafer holding table 5 and passing it to the mounting portion 4. And a thrusting device 7 that thrusts the bare chip from below when the bare chip is taken out by the take-out device 6, and the bare chip is picked up before the pulling-out operation of the bare chip by the taking-out device 6. And a movable camera 8 for component position recognition. In addition, a bare chip is an example of the "wafer component" of this invention.
The conveyor 2 includes a conveyor main body extending in the X direction for carrying the printed board P and a positioning mechanism (not shown) for lifting and positioning the printed board P on the conveyor main body. The conveyor conveys the printed board P in the X-axis direction from the right side to the left side of FIG. 1 in a substantially horizontal posture, and positions and fixes the printed board P to a predetermined mounting work position. In 1st Embodiment, the position (position of the printed circuit board P in a figure) separated by predetermined space | interval in the X-axis direction on the conveyance path | route by the conveyor 2, respectively becomes a mounting working position. In addition, in the following description, the position of the conveyance direction upstream of the printed circuit board P is called the 1st working position S1 among the mounting work positions, and the position of the downstream side is called 2nd working position S2.
The chip component supply part 3 is provided in the both ends immediately before the mounting apparatus 100. As shown in FIG. The chip component supply part 3 is provided in order to supply chip components, such as a transistor, a resistor, and a capacitor. In the chip component supply part 3, the component supply apparatus 160, such as the tape feeder 161, is arrange | positioned side by side over the conveyor 2, for example. Each tape feeder 161 includes a reel in which a tape holding chip components such as a transistor is wound at predetermined intervals, a holding member for holding the reel, and a tape feeder at a component feed position at the tip of the tape feeder while drawing the tape from the reel. And a parts dispensing mechanism for dispensing. The tape feeder 161 is configured to perform the discharging operation of the chip component in cooperation with the mounting device 100 in a state of being attached to the chip component supply part 3. That is, the mounting part 4 of the mounting apparatus 100 is comprised so that a chip component may be picked up at a component supply position, and the next chip component may be taken out to a component supply position according to this pick-up. The chip component supply unit 3 may also provide a tray (not shown) in which a large package component such as a semiconductor package is stacked in place of the tape feeder 161. In this case, the package part is picked up directly from the tray by the mounting part 4.
The mounting part 4 mounts a bare chip or a chip component on the printed circuit board P, and the two head units which can move to a horizontal direction (XY direction) in the upper position of the conveyor 2, respectively (made First head unit 41, second head unit 42], and drive means for driving them separately.
The first head unit 41 is movable only within this region, using the upstream region mainly including the first work position S1 on the base 1 as the movable region, and on the other hand, the second head unit 42. The movable area can be moved only within this area using the downstream area mainly including the second work position S2 on the base 1 as the movable area. These 1st head unit 41 and the 2nd head unit 42 have the following structures (The structure of the 2nd head unit 42 is demonstrated in parentheses).
As shown in Fig. 3, the first head unit 41 (second head unit 42) includes two parts mounting heads 41a and one camera 41b [two parts mounting] arranged in the X-axis direction. A head 42a and one camera 42b. In addition, the component mounting heads 41a and 42a are an example of the "mounting head" of this invention.
The first head unit 41 (the second head unit 42) sucks the chip components supplied by the tape feeder 161 by these component mounting heads 41a and 42a onto the printed board P. In addition to the mounting, the bare chip drawn out from the wafer W by the take-out device 6 is absorbed by the component mounting heads 41a and 42a and mounted on the printed board P. Thereby, both chip components, such as a transistor and a capacitor, and a bare chip (bare chip) are mounted on the printed board P. As shown in FIG. In addition, the first head unit 41 (second head unit 42) has a physical mark (marked) on the printed board P by the cameras 41b and 42b prior to mounting the parts on the printed board P. fiducial mark (not shown) is imaged. The image signal is output from the cameras 41b and 42b to the late control apparatus 11, and the positional shift of the printed board P is recognized based on this image, and the positional shift correction is performed at the time of mounting.
The driving means of the first head unit 41 and the second head unit 42 support members 43 for movably supporting the first head unit 41 and the second head unit 42 in the X-axis direction, respectively. 44, fixed rails 45 and 46 provided on the ceiling 100a of the mounter 100 so as to independently support the support members 43 and 44 so as to be movable in the Y-axis direction, and the support members 43 and A moving mechanism (not shown) consisting of a linear motor for moving the first head unit 41 and the second head unit 42 in the X-axis direction with respect to 44, and the supporting members 43 and 44 are respectively fixed rails. A moving mechanism (not shown) consisting of a linear motor for individually moving along the 45 and 46 in the Y-axis direction is included.
Moreover, the fixed cameras 9 and 10 for component recognition are provided in the movable area of the 1st head unit 41 and the 2nd head unit 42 as the base 1, respectively. The fixed cameras 9 and 10 are cameras provided with imaging elements, such as CCD and CMOS, for example. The fixed cameras 9 and 10 capture images of the components adsorbed by the component mounting head 41a of the first head unit 41 and the component mounting head 42a of the second head unit 42 from the lower side. This image signal is output to the control apparatus 11 mentioned later.
In addition, as shown in FIG. 1, it is possible to detachably fix the wafer storage portion 170 in which the wafer W is accommodated in the central portion immediately in front of the mounter 100. Here, the wafer accommodating portion 170 accommodates a plurality of diced wafers W, as shown in FIG. 4. The wafer accommodating portion 170 includes a rack that accommodates a substantially annular holder Wh (see FIG. 1) in which the wafer W is held (up and down) in multiple stages up and down, and drive means for driving the rack up and down. The wafer accommodating part 170 arrange | positions the desired wafer W in the predetermined | prescribed entrance height position which can enter and exit with respect to the wafer holding table 5 as a rack moves up and down. In addition, the wafer holding table 5 is provided with the access mechanism (not shown) of the wafer W. As shown in FIG. This access mechanism is configured to be movable back and forth (Y direction) with respect to the wafer holding table 5, and has an arm provided with a holder holding mechanism at its tip. The access mechanism uses the arm to hold the wafer W (holder Wh) in the rack disposed at the entrance height position with the wafer holding table 5 disposed at the wafer receiving position (see Fig. 2). It is possible to take out from the 170 onto the wafer holding table 5 and to accommodate (return) the wafer W on the wafer holding table 5 in the rack.
Each wafer W accommodated in the wafer accommodating part 170 has a film-shaped wafer sheet so that the bare chip is in a face-up state (a state in which the circuit formation surface (mounting surface for the printed circuit board P) is upward). It is attached to and held by the holder Wh through this wafer sheet.
The wafer holding table 5 has a circular opening in the center, and can hold the holder Wh so that the opening of the holder Wh holding the wafer W and the opening of the wafer holding table 5 overlap with each other. Thereby, the bare chip is thrust by the thrusting apparatus 7 mentioned later from below the wafer holding table 5 in the state in which the wafer W (wafer holder Wh) was hold | maintained in the wafer holding table 5. It is possible to do
The wafer holding table 5 can move the base 1 on the base 1 in the Y direction between the part extraction work position (the position shown in FIG. 1) and the wafer receiving position (the position shown in FIG. 2) near the wafer storage portion 170. It is composed. Specifically, the wafer holding table 5 is movably supported by a pair of fixed rails 51 provided on the base 1 so as to extend in the Y-axis direction, and fixed rails 51 by predetermined driving means. Is moved along. The drive means extends in parallel with the fixed rail 51 and is screwed and inserted into the nut portion of the wafer holding table 5, and a drive motor for rotationally driving the ball screw shaft 52 ( 53). In addition, as shown in FIG. 3, the wafer holding table 5 moves between the part taking out work position and the wafer receiving position past the lower position of the conveyor 2.
The thrusting device 7 lifts the bare chip while peeling it from the wafer sheet by thrusting the bare chip to be taken out from the lower side of the wafer W on the wafer holding table 5 arranged at the component take-out working position. will be.
As shown in Figs. 3 and 4, the thrusting device 7 includes a pair of small diameter thrusting rods (first thrusting rods 71a) each having a thrusting pin (not shown) incorporated therein. ), Referred to as a second thrusting rod 71b. This thrusting device 7 is driven by a predetermined driving means and moves in the X direction with respect to the base 1. That is, on the base 1, a fixed rail 72 which extends in the X-axis direction and the thrusting device 7 is movably supported, and extends in parallel with the fixed rail 72, and the thrusting device 7 Ball screw shaft other than the drawing which is screw-inserted into the nut part of (), and the drive motor (not shown) for rotationally driving this are provided, and the thrust apparatus 7 is driven by the drive of the said ball screw shaft by the said drive motor. Move along the fixed rail 72. In this way, the thrusting device 7 is configured to be movable in the X direction, so that the thrusting device 7 is arbitrary with respect to the wafer W supported on the wafer holding table 5 which is movable only in the Y direction. It is possible to thrust bare chips.
The first thrusting rod 71a and the second thrusting rod 71b of the thrusting device 7 extend in the vertical direction, and are lifted and driven individually by actuators (air cylinders and the like) not shown, respectively. That is, the first thrusting rod 71a or the second thrusting rod (with the first thrusting rod 71a or the second thrusting rod 71b disposed inside the opening of the wafer holding table 5 ( 71b) is driven up to a position almost in contact with the lower side of the wafer sheet, and then positioned at the X direction position of the desired bare chip, and then thrusts from the first thrusting rod 71a or the second thrusting rod 7b. The sting pins are driven up by a drive motor (not shown) to thrust the bare chip. Further, the first thrusting rod 71a and the second thrusting rod 71b can change the thickness of the thrusting pin and the like according to the size of the thrusting target. For example, by mounting thrusting pins having different diameters to the first thrusting rod 71a and the second thrusting rod 71b, the first thrusting rod 71a or the second thrusting rod due to the part size or the like. It is possible to use 71b separately.
The first thrusting rod 71a and the second thrusting rod 71b are capable of lifting and lowering to a height position in two stages. In other words, when the wafer holding table 5 is moved between the component withdrawal working position (see FIG. 1) and the wafer receiving position near the wafer storage unit 170 (see FIG. 2), the interference with the wafer holding table 5 is prevented. Thrusting atmosphere located near the lower surface of the wafer W inside the opening portion of the holder Wh with the lowest position for avoiding and the wafer holding table 5 located at the part extraction operation position (see FIG. 1). It is possible to drive up and down between the positions, and the thrust pin is located above the upper surface of the wafer holding table 5 and the position embedded in the first thrusting rod 71a or the second thrusting rod 71b in the standby position. Lifting operation is possible between component thrusting positions.
The take-out apparatus 6 sucks the bare chip thrusted by the thrusting apparatus 7, and delivers it to the 1st head unit 41 and the 2nd head unit 42. As shown in FIG.
The drawing device 6 is moved in the horizontal direction (XY direction) at a position above the component drawing operation position by a predetermined driving means. This drive means has the following structures.
That is, a pair of expensive fixed rails 61 are arranged at a predetermined interval in the X-axis direction and extend parallel to each other in the Y-axis direction, and both ends of the fixed rails 61 are located at the component extraction work position. A frame member 62 extending in the X-axis direction movably supported thereon and a nut member disposed at a position proximate to the fixed rail 61 and extending in the Y-axis direction and on both ends of the frame member 62 (not shown). A pair of ball screw shafts 63 screwed into and inserted into each other, and a pair of frame drive motors 64 for rotationally driving the ball screw shafts 63 are provided.
The frame member 62 is provided with a first rail (not shown) fixed to the front side thereof and extending in the X-axis direction, and a second rail (not shown) fixed to the rear side and extending in the X-axis direction. The take-out apparatus 6 is supported by the 1st rail so that a movement is possible, and the camera 8 is supported by the 2nd rail so that a movement is possible, respectively. And ball screw shaft (not shown) extended in the X-axis direction to the frame member 62 and screw-inserted into the nut member (not shown) of the extraction apparatus 6, and the drive motor which rotationally drives this ball screw shaft ( 65, a ball screw shaft (not shown) extending in the X-axis direction and screwed into a nut member (not shown) of the camera 8, and a drive motor 66 for rotationally driving the ball screw shaft. have. That is, the frame member 62 is moved along the fixed rail 61 by the operation of each frame drive motor 64, and the take-out device 6 and the camera 8 are moved in accordance with the movement of the frame member 62. It moves in the Y-axis direction integrally.
In addition, the drawing device 6 is moved in the X-axis direction at the position immediately in front of the Y-direction of the frame member 62 by the operation of the drive motor 65, and the frame member ( The camera 8 is moved in the X-axis direction at the position on the rear side in the Y-direction of 62). Thereby, the extraction apparatus 6 and the camera 8 are each independently movable in a horizontal direction (XY direction) in the upper position of a component extraction work position.
The movable area in the XY direction of the extraction apparatus 6 and the movable area in the XY direction of the 1st head unit 41 and the 2nd head unit 42 overlap partly. As a result, transfer of the bare chips from the take-out device 6 to the first head unit 41 and the second head unit 42 can be performed as described later. In addition, as shown in FIG. 3, the take-out apparatus 6, the camera 8, and the above driving means thereof are located below the first head unit 41 and the second head unit 42 and their driving means. It is located. Therefore, as described above, the movable regions such as the take-out apparatus 6 and the movable regions of the first head unit 41 and the second head unit 42 are partially overlapped, but the take-out apparatus 6 and the first are as described above. The head unit 41 and the second head unit 42 do not interfere with each other.
The extraction apparatus 6 is provided with a pair of wafer heads (called the 1st wafer head 6a and the 2nd wafer head 6b). In addition, the 1st wafer head 6a and the 2nd wafer head 6b are an example of the "drawing head" of this invention.
The first wafer head 6a and the second wafer head 6b are drum heads each having a pair of nozzles 6e extending vertically. In detail, as shown in FIG. 4, the frame members 6c of the take-out apparatus 6 are arranged at predetermined intervals in the X direction, and each of the frame members 6c can be lifted with respect to the frame members 6c by driving a drive motor other than the drawing. Two bracket members 6d are provided, and the first wafer head 6a and the second wafer head 6b are disposed inside these bracket members 6d, and the first wafer head 6a and The second wafer head 6b is supported by each bracket member 6d in a state rotatable around an axis parallel to the X axis, respectively.
Each pair of nozzles 6e of the first wafer head 6a and the second wafer head 6b are provided at positions opposite to each other up and down, and the other nozzle 6e when one nozzle 6e faces directly below. ) Is installed facing up. The first wafer head 6a and the second wafer head 6b are rotationally driven (i.e., vertically reversed) by the drive motors 6f provided on the outside of the both bracket members 6d, respectively. The position of the nozzle 6e is alternately changed. That is, in the extraction apparatus 6, the 1st wafer head 6a and the 2nd wafer head 6b are arrange | positioned adjacent to each other, and the drive motor 6f carries out a pair of wafer heads 6a and 6b. It is arrange | positioned outside in between. In addition, the drive motor 6f is an example of the "drive apparatus" of the present invention.
In addition, as shown in FIG. 6, the interval D1 (arrangement interval in the X-axis direction) between the nozzle 6e of the first wafer head 6a and the second wafer head 6b is determined by the first head unit 41. The distance D2 of the component mounting head 41a mounted to the ()) and the space | interval D2 of the component mounting head 42a mounted to the 2nd head unit 42 are equally spaced. Accordingly, the two component mounting heads 41a or the second head unit 42 of the first head unit 41 from the two wafer heads (the first wafer head 6a and the second wafer head 6b). It is possible to receive two bare chips simultaneously for the two component mounting heads 42a.
The camera 8 is a camera provided with imaging elements, such as CCD and CMOS, for example. The camera 8 captures the bare chip to be taken out before outputting the bare chip from the wafer W and outputs the image signal to the control device 11. In addition, when the take-out apparatus 6 receives a part from the head unit, the take-out apparatus 6 is moved to the position (part receiving position Y1) closest to the conveyor 2. At this time, as shown in FIG. 5, the Y-direction position of the thrusting apparatus 7 is determined so that the Y-direction position Y2 of the camera 8 and the Y-direction position of the thrusting apparatus 7 may overlap. Accordingly, after the imaging of the next component is performed in parallel with the receiving operation of the component, the amount of movement of the take-out storage 6 from the delivery to the head unit of the component to the withdrawal of the next component is at least minimized when the next component is taken out. It can be set from the position Y1 to the position Y2.
7 shows a control system of the mounter 100 in a block diagram. As shown in FIG. 7, this mounting apparatus 100 is equipped with the control apparatus 11 which consists of CPU, various memory, HDD, etc. As shown in FIG. The control device 11 includes the above-described drive motors (drive motor 53, frame drive motor 64, drive motor 65, drive motor 66, drive motor 6f, other drive motors, And a control valve driving solenoid in the air circuit of each lifting air cylinder of the thrusting rods 71a, 71b], the camera 8, the fixed cameras 9, 10, and the like, are electrically connected to each other. Therefore, the operation of each part is collectively controlled by the control apparatus 11. In addition, an input device other than the drawing is electrically connected to the control device 11, and various types of information input by the operator are input based on the operation of the input device, and the position detection of the encoder or the like other than the drawing embedded in each drive motor is detected. The output signal from the means is also input.
As the functional element, the control device 11 includes an axis control unit 11a for controlling the driving solenoids of the drive motors and the control valves, the cameras (fixed cameras 9 and 10, the cameras 41b, 42b, etc.), an image processing unit 11b that performs predetermined processing on the image signal, an I / O processing unit 11c that controls input of signals and outputs of various control signals from sensors other than the drawings, and an external device. Communication control unit 11d for controlling communication with the communication unit; a storage unit 11e for storing various programs such as packaged programs and various data; and main operation unit 11f for controlling them collectively and executing various arithmetic processes. It includes.
And this control apparatus 11 controls each drive motor etc. based on a predetermined program, and the conveyor 2, the wafer holding table 5, the drawing-out apparatus 6, the thrusting apparatus 7, and the 1st head The unit 41 and the second head unit 42 and the like are controlled. As a result, the wafer W may enter and exit the wafer storage unit 170, the bare chip may be taken out of the wafer W, and the component may be mounted by the first head unit 41 and the second head unit 42. A series of operations (part mounting operations) are executed.
Next, with reference to FIG. 8, the control of the component mounting operation by this control apparatus 11 is demonstrated.
First, in step S1, the control device 11 controls the conveyor 2 to carry the printed board P into the mounting apparatus 100. In addition, in step S2, the control apparatus 11 fixes the conveyor 2, and fixes the printed circuit board P in the state arrange | positioned at the 1st working position S1 and the 2nd working position S2.
Thereafter, in step S3, the control device 11 pulls out the wafer W from the wafer storage portion 170 by controlling the wafer holding table 5. Specifically, by driving the drive motor 53, the wafer holding table 5 is moved to the wafer receiving position (see FIG. 2). Then, the wafer W (holder Wh) is taken out from the wafer storage section 170 onto the wafer holding table 5 by an access mechanism not shown. Then, the wafer W drawn out in step S4 is fixed to the wafer holding table 5. Thereafter, the wafer holding table 5 is controlled to be placed at the component extraction work position (see FIG. 1).
At this time, the control device 11 is a center thrust pin of the first thrusting rod 71a of the thrusting device 7 in the Y direction position of the bare chip to be pulled out of the bare chips in the wafer W; The wafer holding table 5 is moved to coincide with the Y-direction position of the central thrusting pin of the second thrusting rod 71b.
When the wafer W is placed at the component take-out work position, in step S5, the control device 11 controls the camera 8 to image the bare chip to be taken out. Specifically, the frame member 62 is moved in the Y-axis direction by driving the frame drive motor 64, and the camera 8 is moved in the X-axis direction by driving the drive motor 66. Thereby, the camera 8 is arrange | positioned in the upper position of the bare chip | tip used as a drawing object (adsorption object). The bare chip is picked up by the camera 8. The control apparatus 11 calculates the position (position shift) of the bare chip based on this image data. In this case, the control device 11 picks up the plurality of bare chips to the camera 8 at once or continuously as necessary.
Subsequently, in step S6, the control apparatus 11 controls the thrusting apparatus 7, the extraction apparatus 6, and the wafer holding table 5 based on the imaging result by the camera 8, and thrusting The thrusting pin of the apparatus 7, the nozzle 6e of the extraction apparatus 6, and the bare chip | tip which are to be taken out are moved to the same position on an XY plane. Specifically, the thrusting device 7 is moved in the X axis direction, and the drive motor 53 is driven to move the wafer holding table 5 in the Y axis direction. Thereby, the 1st thrusting rod 71a or the 2nd thrusting rod 71b of the thrusting apparatus 7 is moved so that the center thrusting pin may become the downward position of the bare chip | tip which will be taken out. In addition, the frame drive motor 64 is driven to move the frame member 62 in the Y-axis direction, and the drive motor 65 is driven to move the take-out device 6 in the X-axis direction, respectively. Thereby, the 1st wafer head 6a or the 2nd wafer head 6b is moved to the upper position of a bare chip | tip.
Then, the control device 11 lifts (drives) the thrust pin from the first thrusting rod 71a or the second thrusting rod 71b according to the size of the part, and then pushes the bare chip from the lower side thereof. Sting At this time, a negative pressure is generated on the distal end surface of the thrusting rod 71a or 71b, and the thrust rod 71a or 71b is sucked from the center of the distal end surface of the thrusting rod 71a or 71b. Thrust the sting pins. On the other hand, by lowering and thrusting the first wafer head 6a or the second wafer head 6b, the bare chip separated from the wafer sheet is adsorbed by the negative pressure at the tip of the nozzle 6e. As a result, the bare chip is taken out from the wafer (W). The extraction of the bare chips from the above wafers W is sequentially performed for each of the first wafer head 6a and the second wafer head 6b, and the bare chips are adsorbed and held by the respective nozzles 6e.
Subsequently, in step S7, the control device 11 receives the bare chip from the drawing device 6 to the head unit. Specifically, the control device 11 controls the takeout device 6 to move the takeout device 6 to a predetermined part delivery position (position closest to the conveyor 2) and to control the mounting unit 4. As a result, the first head unit 41 (or the second head unit 42) is moved to the parts delivery position. Thereby, the take-out apparatus 6 and the 1st head unit 41 (or 2nd head unit 42) are arrange | positioned up and down in the parts delivery position.
The control device 11 controls the two drive motors 6f during the movement until the take-out device 6 and the first head unit 41 (or the second head unit 42) are arranged in the parts delivery position. The first wafer head 6a and the second wafer head 6b are rotated. As a result, the bare chips adsorbed by the nozzles 6e are inverted (reversed in the face down state), and each component mounting head 41a (or the second head unit 42) of the first head unit 41 is inverted. Of the two component mounting heads 41a of the first head unit 41 (or the two component mounting heads of the second head unit 42) by lowering the respective component mounting heads 42a of Head 42a]. In this way, the transfer of the bare chips from the drawing device 6 to the first head unit 41 (or the second head unit 42) is performed by collecting two bare chip portions simultaneously.
Subsequently, in step S8, the control apparatus 11 moves the 1st head unit 41 above the fixed camera 9 (in the case of the 2nd head unit 42, the fixed camera 10), The bare chip adsorbed to the component mounting head is imaged by the fixed camera, and the adsorption shift of the bare chip to the respective component mounting heads is calculated based on the image data.
Subsequently, in step S9, the control apparatus 11 is a printed circuit board fixed to the conveyor 2 by the cameras 41b and 42b of the 1st head unit 41 (2nd head unit 42). Recognizes a physical mark (not shown) attached to (P). Thereby, the control apparatus 11 recognizes the position shift with respect to the conveyor 2 of the printed board P. As shown in FIG.
And in step S10, the control apparatus 11 prints the 1st head unit 41 (2nd head unit 42) based on the adsorption shift of a bare chip | tip, and the position shift of the printed board P. (P) Move to the corrected position upward. Then, the bare chip is mounted on the printed board P by lowering the component mounting head at a predetermined mounting position.
After that, in step S11, the control device 11 determines whether or not mounting of all bare chips has been completed. If the bare chip to be mounted still remains, the flow returns to step S5 to continue the mounting operation.
In addition, when mounting of all bare chips is completed, in step S12, the control apparatus 11 controls the conveyor 2, and releases the fixing of the printed board P. FIG. And the control apparatus 11 carries out the printed board P out of the mounting apparatus 100 by controlling the conveyor 2 in step S13.
As mentioned above, although the control of the component mounting operation | movement by the control apparatus 11 was demonstrated, the control shown in this flowchart is a control example of the most basic component mounting operation in the case of mounting only a bare chip | tip. That is, in order to produce the printed board P more efficiently in the production of the actual printed board P, the control device 11 moves in and out of the wafer W by the wafer holding table 5, and the takeout device 6. ) And a part of a plurality of operations such as a pulling operation of the bare chip by the thrusting device 7 and a mounting operation of the head unit. For example, in this first embodiment, when the bare chip is received from the drawing device 6 to the head units 41 and 42 or when the bare chip is mounted on the printed circuit board P by the head unit, Imaging by the camera 8 is performed in parallel. When the bare chips are sequentially mounted on the plurality of printed boards P, the process returns from step S13 to step S1 and the next printed board P is transported to carry out step S2. When bare chips remain in the wafer W on the table 5, steps S3 and S4 are skipped.
In the first embodiment, as described above, the wafer components adsorbed to the first wafer head 6a and the second wafer head 6b are respectively mounted on the two component mounting heads 41a of the first head unit 41. Alternatively, the two component mounting heads 42a of the second head unit 42 can be received at the same time, thereby allowing two wafer components to be received at once. As a result, it is possible to suppress that the total time required for the handover operation of the plurality of wafer parts increases as compared with the case where the handover operation of the wafer components to the component mounting head 41a or 42a is performed for each wafer component.
In addition, in 1st Embodiment, as mentioned above, the space | interval D1 (henceforth space | interval D1) of each center of 1st wafer head 6a and 2nd wafer head 6b is 1st head unit. A distance D2 (hereinafter referred to as a gap D2) of each center between the two component mounting heads 41a of the 41 or between two component mounting heads 42a of the second head unit 42. Are equal to the spacing D2 (hereinafter referred to as spacing D2) of the centers. In this way, the wafer components can be easily and simultaneously received from the two wafer heads 6a and 6b to the two component mounting heads 41a or 42a.
In addition, in the first embodiment, two wafer heads 6a and 6b are arranged adjacent to each other with respect to the take-out device 6, and two drive motors 6f are disposed between the two wafer heads 6a and 6b. It is placed outside. Therefore, since there is no drive motor between the two wafer heads 6a and 6b, the distance between the two wafer heads 6a and 6b can be made small, so that the gap between the two wafer heads 6a and 6b and the head unit The spacing between the mounting heads can be easily made the same.
In addition, in the first embodiment, as described above, the wafer holding table 5 that is movable in the Y direction with respect to the base 1, the thrusting device 7 that is movable in the X direction with respect to the base 1, and The withdrawal device 6 which is movable in the X direction with respect to the base 1 is provided so that the bare chip and thrusting device 7 and the withdrawal device 6 which are to be taken out without moving the wafer holding table 5 in the X direction. ) Can be aligned. That is, since it is not necessary to move the wafer holding table 5 with a relatively large planar area with respect to the thrusting apparatus 7 and the extraction apparatus 6, it can suppress that an apparatus grows in an X direction.
In addition, in 1st Embodiment, as mentioned above, the thrusting apparatus 7 and the extraction apparatus 6 are comprised by being comprised so that the extraction apparatus 6 can move relatively to an XY direction with respect to the thrusting apparatus 7. Unlike the case where it is fixed, it becomes possible to fine-adjust the position of the thrusting apparatus 7 and the extraction apparatus 6. Therefore, according to 1st Embodiment, it is possible to control the position shift of the thrusting apparatus 7 and the extraction apparatus 6 at the time of component extraction, and it can suppress that the adsorption defect of a component arises by this. have.
In the first embodiment, the wafer holding table 5 is configured to be movable in the Y direction, and the camera 8 is also configured to be movable in the Y direction. As a result, when the bare chip and the camera 8 are positioned to perform the imaging of the bare chip to be pulled out, the wafer holding table 5 and the camera 8 are moved so as to approach each other to perform the alignment. Can be. Therefore, according to this first embodiment, the wafer imaging camera is fixed in the Y direction so that only the wafer holding table 5 is moved to perform the alignment in a short time compared with the case where the camera 8 and the bare chip are aligned. Can be.
In addition, in the first embodiment, as described above, the takeout device 6 is configured to be movable in the Y direction, while the thrusting device 7 is fixedly installed in the Y direction. Therefore, according to this first embodiment, the configuration is inexpensive compared to the configuration in which both the takeout apparatus 6 and the thrusting apparatus 7 are movable in the Y direction, and the thrusting apparatus 7 and the takeout for pulling out the bare chip are taken out. Positioning of the apparatus 6 in the Y direction can be performed.
In addition, in 1st Embodiment, as mentioned above, the printed circuit board P by the head unit 41, 42 in parallel with the transfer from the extraction device 6 of the bare chip to the head units 41, 42, or It is possible to perform imaging with the camera 8 of the bare chip held after being held on the wafer holding table 5 and mounted in parallel with the mounting of the bare chip. The total time required for mounting the parts or passing the wafer parts can be shortened.
(Modification of 1st Embodiment)
In the said 1st Embodiment, although the example which installed the 1st head unit 41 and the 2nd head unit 42 corresponding to 1st working position S1 and 2nd working position S2, respectively was demonstrated, Like the mounting machine 200 which is the modification of 1st Embodiment shown in FIG. 9, 1st work position S1 by the one head unit 202 supported so that the movement to the frame member 201 extended in a X direction is possible. ) And the printed board P at the second work position S2 may be performed. In addition, the head unit 202 has the same configuration as the head unit 41 or 42.
In addition, in the said 1st Embodiment, although the extracting apparatus 6 is installed so that a movement to a Y direction is possible, while the thrusting apparatus 7 is fixedly installed in a Y direction, the extracting apparatus 6 is fixed in a Y direction. The thrusting device 7 may be installed to be movable in the Y direction. As a result, the thrusting device 7 and the taking-out device 6 can be aligned with each other in the Y-direction by moving the thrusting device 7 in the Y-direction, and the extraction device 6 is fixed in the Y-direction. By installing this, the apparatus can be made cheaper than the configuration in which both the takeout apparatus 6 and the thrusting apparatus 7 can move in the Y direction. Moreover, you may comprise so that both the take-out apparatus 6 and the thrusting apparatus 7 can move to a Y direction. According to this configuration, it is possible to employ various movement methods with respect to the take-out device 6 and the thrusting device 7 in relation to the movement in the Y direction of the wafer holding table 5, and as a result, the extraction efficiency of the bare chip can be improved. It becomes possible to improve.
(Second Embodiment)
Next, with reference to FIG. 10 and FIG. 11, the mounting apparatus 300 which concerns on 2nd Embodiment of this invention is demonstrated. In this 2nd Embodiment, unlike the said 1st Embodiment, the example which provided two drawing devices is demonstrated.
In 2nd Embodiment, as shown in FIG. 10, two drawing devices (the 1st drawing device 301 and the 2nd drawing device 302) are provided. The structure of each of the 1st drawing device 301 and the 2nd drawing device 302 is the same as that of the drawing device 6 of the said 1st Embodiment. Both the first drawing device 301 and the second drawing device 302 are fixed to the front side of the frame member 62 and are movably supported by a fixed rail other than the drawing extending in the X-axis direction, along the fixed rail. Go to individual. The drive means of the 1st drawing-out apparatus 301 and the 2nd drawing-out apparatus 302 has the following structures.
The ball screw shaft (not shown) extended in the X-axis direction is provided in the frame member 62. This ball screw shaft is fixed to the frame member 62. Meanwhile, a first nut member (not shown) in which the ball screw shaft is screw-inserted into the first take-out device 301 and a first nut member connected to the first nut member in a state where the ball screw shaft penetrates the inside thereof. In a state in which a hollow motor (not shown) is provided, and a second nut member (not shown) in which the ball screw shaft is screwed into the second take-out device 302 and the ball screw shaft penetrates inside. A second hollow motor (not shown) connected to the second nut member is provided. That is, when the first nut member is driven to rotate by the first hollow motor, the first drawing device 301 is moved in the X-axis direction at the position immediately in front of the frame member 62, and the first hollow member is moved by the second hollow motor. As the 2nd nut member is driven to rotate, the 2nd drawing-out apparatus 302 moves to an X-axis direction in the position just before the frame member 62. As shown in FIG. Thereby, the 1st drawing apparatus 301 and the 2nd drawing apparatus 302 are movable in a horizontal direction (XY direction) in the upper position of a component extraction work position.
In addition, in the second embodiment, one head unit 304 is supported by the frame member 303 extending in the X direction so as to be movable in the X direction. The frame member 303 is configured to be movable in the Y direction. The mounting is carried out in the first work position S1 and the second work position S2 by one head unit 304.
As shown in FIG. 11, the head unit 304 has four component mounting heads 304a and a camera 304b. The spacing D3 (hereinafter referred to as the spacing D3) of each center between the component mounting heads 304a where the head units 304 are adjacent to each other is the spacing between the wafer heads of the first drawing device 301 ( It is equal to the distance D1 between the wafer head of D1) and the second drawing device 302. In addition, the component mounting head 304a is an example of the "mounting head" of this invention.
As a transfer operation of the wafer component of 2nd Embodiment, after carrying out two wafer components to the two component mounting heads 304a of the head unit 304 simultaneously by the 1st extraction apparatus 301, The two take-out apparatuses 302 simultaneously carry over two wafer components to the remaining two component mounting heads 304a of the head unit 304. In addition, the other structure of the 1st drawing-out apparatus 301 and the 2nd drawing-out apparatus 302 is the same as that of the drawing-out apparatus 6 of 1st Embodiment, and is the same as that of the mounting apparatus 300 of 2nd Embodiment. The external configuration is the same as in the first embodiment.
In addition, the effect of 2nd Embodiment is the same as that of the said 1st Embodiment.
(Modification of 2nd Embodiment)
In the second embodiment, one head unit 304 is provided, and the first take-out device 301 and the second take-out device 302 carry out a wafer component transfer operation on one head unit 304 in sequence. An example was explained. Here, when two head units (the first head unit 41 and the second head unit 42) are provided as in the first embodiment, the first drawing device 301 and the second drawing device 302 are provided. It is also possible to simultaneously receive four wafer components at a time by carrying out a transfer operation on each of the first head unit 41 and the second head unit 42.
(Third Embodiment)
Next, the mounting apparatus 400 by 3rd Embodiment of this invention is demonstrated with reference to FIG. 12, FIG. 13, and FIG. In the third embodiment, an example in which two drawing devices having one wafer head are provided is provided unlike the first embodiment in which one drawing device 6 having two wafer heads is provided.
In 3rd Embodiment, as shown in FIG. 12 and FIG. 13, two drawing apparatuses (the 1st drawing apparatus 401 and the 2nd drawing apparatus 402) are provided. Both the first drawing device 401 and the second drawing device 402 are movably supported by a fixed rail extending in the X-axis direction just in front of the frame member 62. Similarly to the second embodiment, the first drawing device 401 and the second drawing device 402 can move on the fixed rail of the frame member 62 in the X axis direction independently of each other by a mechanism using a hollow motor. .
In addition, the 1st drawing apparatus 401 and the 2nd drawing apparatus 402 have one wafer head 401a, 402a, respectively.
In detail, the wafer head 401a is a drum head provided with a pair of nozzles 401d extending up and down. The frame member 401b of the first drawing device 401 is provided with a bracket member 401c that can be lifted and lowered relative to the frame member 401b, and the wafer head 401a is rotatable around an axis parallel to the X axis. It is supported by the bracket member 401c in a state. The wafer head 401a is disposed on the side of the second drawing device 402 with respect to the bracket member 401c, and the wafer head 401a is driven by the driving motor 401e provided on the opposite side of the bracket member 401c. By rotating, the position of the pair of nozzles 401d is alternately changed.
The wafer head 402a is also a drum-type head having a pair of nozzles 402d extending up and down like the wafer head 401a, and can be lifted and lowered to the frame member 402b of the second drawing device 402. The bracket member 402c provided is supported in a state rotatable around an axis parallel to the X axis. The wafer head 402a is disposed on the first take-out device 401 side with respect to the bracket member 402c, and the wafer head 402a is driven by the drive motor 402e provided on the opposite side to the bracket member 402c. By rotation, the positions of the pair of nozzles 402d are alternately changed. That is, the wafer head 402a of the second drawing device 402 is disposed to face the wafer head 401a of the first drawing device 401, and the drive motor 401e of the first drawing device 401 is disposed. And the drive motor 402e of the second drawing device 402 is disposed outside with the wafer heads 402a and 401a interposed therebetween. The other structure of the mounting apparatus 400 of 3rd Embodiment is the same as that of the said 1st Embodiment. In addition, the wafer heads 401a and 402a are an example of the "drawing head" of this invention.
In the third embodiment, similarly to the first embodiment, two head units of the first head unit 420 and the second head unit 421 are provided. The structure of these 1st head unit 420 and the 2nd head unit 421 is the same as that of the head unit 304 of 2nd Embodiment, and each head mounting part 420a of each head unit 420,421 is each And 421a and cameras 421b and 421b. In the above example, each center interval D5 (hereinafter referred to as interval D5) between the component mounting heads 420a where the first head unit 420 is adjacent to each other is the same. The same applies to the second head unit 421.
In the drawing operation and the handing operation of the third embodiment, first, the wafer head 401a of the first drawing device 401 and the wafer head 402a of the second drawing device 402 take out wafer components (bare chips) separately. do. Thereafter, at least one of the first drawing device 401 or the second drawing device 402 moves so that the first drawing device 401 and the second drawing device 402 move to a predetermined delivery position. Here, in 3rd Embodiment, as shown in FIG. 13, the control apparatus (not shown) is the wafer head 401a of the 1st drawing-out apparatus 401, and the wafer head (of the 2nd drawing-out apparatus 402) in a delivery position. Each center spacing of the nozzle 401d and the center spacing D4 of the nozzle 402d, hereinafter simply referred to as a spacing D4, is defined by the component mounting head 420a of the first head unit 420. The first take-out device 401 and the second take-out device 402 are controlled to be equal to the distance D5 or the distance D5 of the component mounting head 421a of the second head unit 421.
Thereafter, similarly to the first embodiment, two components of the first head unit 420 from the wafer head 401a of the first drawing device 401 and the wafer head 402a of the second drawing device 402. Wafer components are simultaneously delivered to the two component mounting heads 421a of the mounting head 420a or the second head unit 421.
In the third embodiment, as described above, when the wafer parts are received from the first extraction unit 401 and the second extraction unit 402 to the first head unit 420 or the second head unit 421. The gap between the wafer head 401a of the first drawing device 401 and the wafer head 402a of the second drawing device 402 is the gap between the two component mounting heads 420a of the first head unit 420. At least one of the first take-out device 401 and the second take-out device 402 is set to be equal to the distance D5 between D5 or the two component mounting heads 421a of the second head unit 421. Move it. In such a configuration, the wafer parts of the respective wafer heads are transferred to the head unit using the wafer head 401a of the first drawing device 401 and the wafer head 402a of the second drawing device 402 which are movable independently of each other. Two parts mounting heads adjacent to any one of the four parts mounting heads may be received simultaneously.
In addition, as shown in FIG. 14, in 3rd Embodiment, the wafer component of the 1st head unit 420 or the 2nd head unit 421 from the 1st extraction apparatus 401 and the 2nd extraction apparatus 402 is carried out. When receiving, the distance D4 between the wafer head 401a of the first drawing device 401 and the wafer head 402a of the second drawing device 402 is two heads for mounting the parts of the first head unit 420. It is necessary to make it equal to 2 times or 3 times (integer times) of the space | interval D5 between 420a or the space D5 between two component mounting heads 421a of the 2nd head unit 421, as needed. At least one of the first drawing device 401 and the second drawing device 402 may be moved. According to this, the wafers held by the wafer heads 401a and 402a are held using the wafer head 401a of the first drawing device 401 and the wafer head 402a of the second drawing device 402 which are movable independently of each other. The component can be simultaneously delivered to any two of the four component mounting heads 420a of the first head unit 420 or to any two of the four component mounting heads 421a of the second head unit 421. Can be. In addition, the other effect of 3rd Embodiment is the same as that of the said 1st Embodiment.
In addition, the embodiment disclosed this time should be considered in all respects as an illustration and not restrictive. The scope of the present invention is shown not by the description of the above embodiments but by the claims, and includes all changes within the meaning and range equivalent to the scope of the claims.
For example, in the said 1st-3rd embodiment, although the example which installed two or four component mounting heads as the head unit of the mounting part 4 was shown, this invention is not limited to this, The head unit has three head units. Alternatively, five or more component mounting heads may be provided. Moreover, the extraction apparatus may also be provided with three or more extraction heads.
In this case, in the first embodiment, for example, three or more component mounting heads 41a and 42a are arranged at equal intervals D2 in the first head unit 41 (or the second head unit 42). After installation, the first wafer head 6a and the second wafer head 6b of the take-out apparatus 6 are arranged so that these intervals D1 are a constant multiple of the intervals D2 of the component mounting heads 41a and 42a. Install. According to this, two component mounting heads 41a and 42a adjacent to each other, or two component mounting heads 41a spaced apart from each other with one to a plurality of component mounting heads 41a and 42a therebetween. The wafer parts can be simultaneously delivered to the 42a. This point is the same also in the case where three or more component mounting heads are provided in the head units 202 and 304 in the second embodiment.
In addition, although the example which makes the bare chip adsorb | suck to the head units 41 and 42 through the extraction apparatus 6 was shown in the said 1st Embodiment, this invention adds to this and the nozzle of the head units 41 and 42 is shown. Since 41a, 42a is comprised so that the wafer W on the wafer holding table 5 can be accessed, the head unit 41, 42 may be able to adsorb | suck a bare chip directly, without going through the take-out apparatus 6. As shown in FIG. That is, according to the kind of the bare chip, the operation | movement which mounts on the printed circuit board P by attracting and holding | maintaining a bare chip by the head unit 41 and 42 in the face-down state through the take-out apparatus 6, and the take-out apparatus 6 The bare chip may be sucked and held directly in the face-down state without passing through), so that the operation of mounting on the printed board P can be selectively performed. The same is applied to the second and third embodiments.
In this case, when making the movable range of the head unit Y direction to the vicinity of the conveyor 2 like the said 1st-3rd embodiment, a thrusting apparatus is installed in the vicinity of the conveyor 2, or a thrusting apparatus is conveyed. It is necessary to comprise so that a movement to a Y direction is possible so that movement to the vicinity of (2) is possible. Further, even when the thrusting device is fixed in the Y direction from the component withdrawal work position as in the first embodiment, the head unit can be directly moved without passing through the withdrawal device by extending the movable range in the Y direction of the head unit to the component withdrawal work position. It becomes possible to adsorb bare chips.
In addition, in the said 1st Embodiment, as shown in FIG. 5, when the take-out apparatus 6 receives components to the head units 41 and 42, the position Y2 and thrust of the camera 8 in the Y direction are thrust. Although the thrusting apparatus 7 was arrange | positioned (fixed in the Y direction) so that the position of the apparatus 7 in the Y direction may overlap, this invention is not limited to this. That is, the thrusting apparatus 7 is arrange | positioned between the position Y1 of the Y direction of the take-out apparatus 6 at the time of receiving parts, and the position Y2 of the Y direction of the camera 8 at that time (it fixes in the Y direction). You may do it. In this case, the imaging of the next part is performed in parallel with the handing operation of the part, and then in the Y direction so that the take-out device 6 and the wafer holding table 5 (the part to be pulled out) approach each other when the next part is taken out. It can be moved and positioned above the thrusting apparatus 7. This can further shorten the time from the receipt of the parts to the head units 41 and 42 to the withdrawal of the next part. Moreover, when the moving speed of the take-out apparatus 6 in the Y direction and the moving speed of the wafer holding table 5 are the same, the thrusting apparatus 7 is arrange | positioned between the position Y1 and the position Y2 (Y direction). To be fixed). When the moving speed of the take-out device 6 in the Y direction is smaller than the moving speed of the wafer holding table 5, the thrusting device 7 is moved from the position Y1 to the position Y2 in accordance with the speed difference. To Y1).
In addition, although the said 1st Embodiment showed the example which used the ball screw to drive the wafer holding table 5, the extraction apparatus 6, the thrusting apparatus 7, the component position recognition camera 8, etc., This invention is not limited to this, You may use other drive mechanisms, such as a linear motor. In addition, although the head unit 41 and 42 showed the example which drived using the linear motor, this invention is not limited to this, You may drive using a ball screw. The same applies to the second and third embodiments.
Moreover, although the said 1st Embodiment showed the example in which two wafer heads 6a and 6b and two drive motors 6f corresponding to these were provided in one take-out apparatus 6, this invention does not support this. It is not limited. That is, two (plural) wafer heads 6a and 6b may be driven upside down by one drive motor. Also in this case, it is preferable to arrange | position the drive motor outside the two wafer heads 6a and 6b. The same applies to the second embodiment.
In addition, in the said 1st Embodiment, although the example which comprised the wafer holding table 5 to be movable only to the Y direction, and the takeout apparatus 6 and the thrusting apparatus 7 so that the movement to the X direction was demonstrated, The present invention is not limited to this, and the wafer holding table 5 may be movable in the XY direction. In this case, for example, even when the thrusting device 7 is fixed in the XY direction (when the drawing device 6 is fixed), the wafer holding table 5 is moved in the X direction and the Y direction so that The wafer component can be moved out to the extraction position to be fitted by the wafer heads 6a and 6b and the thrusting apparatus 7 of the extraction apparatus 6 to perform the extraction operation. The same applies to the second and third embodiments.
In addition, in the said 3rd Embodiment, although the example which provided one wafer head 401a (401b) in each of the 1st drawing device 401 and the 2nd drawing device 402 was shown, this invention is not limited to this. A plurality of wafer heads may be provided in the first drawing device 401 and the second drawing device 402, respectively.
The present invention described above is summarized as follows.
The mounting apparatus according to one aspect of the present invention is thrusted by a thrusting apparatus having a base, a wafer holding table capable of holding wafer components, a mechanism for thrusting wafer components held on the wafer holding table from below, and a thrusting apparatus. A head unit having a plurality of extraction heads for adsorbing the wafered wafer components, and a plurality of mounting heads for receiving the wafer components from the extraction heads and for mounting the wafer components on a substrate, each of the plurality of mounting heads This is to simultaneously receive the wafer components adsorbed by the plurality of extraction heads, respectively.
In the mounting apparatus according to this aspect, as described above, the plurality of mounting heads can simultaneously receive the wafer components respectively adsorbed to the plurality of extraction heads, and therefore, the plurality of wafer components can be received at once. . Therefore, it is possible to suppress that the total time required for the handover operation of the plurality of wafer parts increases as compared with the case where the handover operation of the wafer components to the mounting head is performed for each wafer component.
In the mounting apparatus according to the above aspect, the arrangement interval between the respective extraction heads of the plurality of extraction heads is preferably at least between each mounting head of the plurality of mounting heads of the head unit at the time of receiving the wafer parts from the extraction head to the head unit. It is equal to the array interval of. In such a configuration, the wafer components can be easily and simultaneously delivered from the plurality of drawing heads to the plurality of mounting heads.
In this case, a drawing device having a plurality of drawing heads is preferably provided, wherein an arrangement interval between the drawing heads of the plurality of drawing heads that the drawing device has is arranged between each mounting head of the plurality of mounting heads of the head unit. Same as interval. In such a configuration, the wafer components can be easily and simultaneously delivered from the plurality of extraction heads of the extraction apparatus to the plurality of mounting heads.
In addition, the extraction head has a nozzle for adsorbing the wafer components, and is reversed up and down to invert the wafer components adsorbed by the nozzle upwards, and the mounting head is pulled out by adsorbing the wafer components adsorbed to the nozzle and inverted upward. In the case where the wafer component is to be received from the head, and in the configuration in which the extraction apparatus has a plurality of extraction heads, the extraction apparatus preferably includes two extraction heads as a plurality of extraction heads, Has a driving device for vertically inverting the two, the two extraction heads are arranged adjacent to each other, and the driving device is arranged outside the two extraction heads. In such a configuration, the gap between the two extraction heads can be made smaller as there is no drive device between the two extraction heads, so that the interval between the two extraction heads of the extraction device and the mounting head of the head unit can be easily made. The same can be done.
Moreover, in the structure in which the said extraction apparatus has a some extraction head, Preferably, the extraction apparatus has the 1st extraction apparatus which has one or more extraction heads, and is movable in a horizontal plane, and has one or more extraction heads, A second drawing device movable in a horizontal plane independently of the first drawing device, wherein at least one of the first drawing device and the second drawing device is separated from the drawing head of the first drawing device and the drawing head of the second drawing device; Upon receipt of the wafer parts to the head unit, the distance between the extraction head of the first extraction device and the extraction head of the second extraction device moves so as to be equal to the arrangement interval of the plurality of mounting heads of the head unit. In such a configuration, the wafer parts of the respective extraction heads can be simultaneously delivered to the plurality of mounting heads of the head unit by using the extraction heads of the first extraction apparatus and the extraction heads of the second extraction apparatus that are movable independently of each other.
In the configuration in which the take-out device has a plurality of take-out heads, preferably, the wafer holding table is movable in the X-direction at which the substrate is conveyed relative to the base and in the Y-direction orthogonal in the horizontal plane, and the thrusting device is the base. It is at least movable in the X direction with respect to the drawing device, and the extraction device is movable in at least the X direction with respect to the base. In such a configuration, the thrusting device and the extraction device can be aligned by removing the thrusting device and the extraction device in the X direction without moving the wafer holding table in the X direction. As a result, it is not necessary to move the wafer holding table having a relatively large planar area in the X direction, so that the device can be prevented from growing in the X direction in the horizontal plane.
In the mounting apparatus according to the above aspect, the wafer holding table is preferably movable in the X direction in which the substrate is conveyed with respect to the base and in the Y direction orthogonal in the X direction and the horizontal plane. With this arrangement, the wafer holding table can be moved in the X and Y directions to move the wafer component to be taken out to the extraction position sandwiched by the extraction head and the thrusting apparatus of the extraction apparatus.
