JP2012028587A - Mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting machine capable of suppressing an increase in total time required for the delivery operation of multiple wafer components.SOLUTION: A mounting machine 100 comprises: two wafer heads 6a and 6b which attract wafer components, and which are vertically reversible; and a head unit 41 having two component mounting heads 41a which receive the wafer components from the two wafer heads 6a and 6b, and which mount the wafer components on a printed circuit board P. The two component mounting heads 41a can simultaneously receive the wafer components attracted by the two wafer heads 6a and 6b, respectively.

Description

  The present invention relates to a mounting machine, and more particularly, to a mounting machine having a pick-up head that can pick up a wafer part pushed up by a pushing-up device and can be turned upside down.

  2. Description of the Related Art Conventionally, there has been known a mounting machine that includes a take-out head that can pick up a wafer part pushed up by a push-up device and can be turned upside down (for example, see Patent Documents 1 and 2).

  In Patent Document 1, a flip table (wafer part) is held, a holding table (wafer holding table) that can move in the XY directions, a sheet peeling mechanism (push-up device) disposed below the holding table, There is disclosed a mounting machine including an extraction head that sucks a flip chip and a mounting head that receives the flip chip from the extraction head and mounts the flip chip on a substrate. In Patent Document 1, one take-out head is provided. For this reason, in the above-mentioned Patent Document 1, after one flip chip is taken out from the holding table, its components are delivered to the mounting head, and thereafter, the next flip chip is taken out from the holding table and delivered to the mounting head. it is conceivable that.

  In Patent Document 2, a component supply table (wafer holding table) that holds wafer components and is movable in the X and Y directions, a component take-in unit (extraction device) having an extraction nozzle that adsorbs the wafer components, and components There is disclosed a mounting machine including a mounting unit (head unit) having a mounting nozzle that receives a wafer part from a capturing unit and mounts it on a substrate. Similarly to Patent Document 1, the above Patent Document 2 is also provided with one take-out nozzle. After one wafer part is taken out from the part supply table, the part is delivered to the mounting nozzle, and then the next wafer part part. It is thought that it is being taken out from the supply table and delivered to the mounting nozzle.

Japanese Patent No. 4016982 JP 2004-103923 A

  However, in the above-mentioned Patent Document 1, since the operation of taking out the flip chip from the holding table and the operation of transferring the flip chip to the mounting head are performed for each flip chip, the operation of transferring a plurality of flip chips (wafer parts) is performed. There is a problem that the total time required for the process increases.

  Also in the above-mentioned Patent Document 2, since the operation of taking out wafer components from the component supply table and the operation of transferring the wafer components to the mounting nozzle are performed for each wafer component, a plurality of wafer components are transferred. There is a problem that the total time required increases.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to suppress an increase in the total time required for the transfer operation of a plurality of wafer parts. It is to provide a possible mounting machine.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, a mounting machine according to one aspect of the present invention includes a base, a wafer holding table capable of holding a wafer part, and a mechanism for pushing up the wafer part held on the wafer holding table from below. A pick-up device, a plurality of pick-up heads that suck up the wafer parts pushed up by the push-up device, and that can be turned upside down, and a plurality of mounting heads that receive the wafer parts from the pick-up head and mount the wafer parts on the substrate. And a plurality of mounting heads that can simultaneously receive wafer components adsorbed by the plurality of take-out heads.

  In the mounting machine according to the one aspect, as described above, by configuring the plurality of mounting heads so that the plurality of mounting heads can simultaneously receive the wafer components adsorbed by the plurality of take-out heads, Delivery can be done at once. As a result, it is possible to suppress an increase in the total time required for the delivery operation of a plurality of wafer components, compared to the case where the delivery operation of the wafer components to the mounting head is performed for each wafer component.

  In the mounting machine according to the above aspect, preferably, at least when the wafer part is transferred from the take-out head to the head unit, the intervals between the plurality of take-out heads are the same as the intervals between the plurality of mount heads in the head unit. If comprised in this way, a wafer component can be easily simultaneously delivered from several pick-out heads to several mounting heads.

  In this case, preferably, the apparatus further includes an extraction device having a plurality of extraction heads, and the interval between the plurality of extraction heads provided in the extraction device is configured to be the same as the interval between the plurality of mounting heads of the head unit. Has been. If comprised in this way, a wafer component can be easily simultaneously delivered to several mounting heads from several pick-up heads of the pick-up apparatus.

  In the configuration in which the take-out device has a plurality of take-out heads, preferably, the take-out device has two take-out heads and a drive device provided for rotationally driving the take-out heads upside down. The two extraction heads are arranged adjacent to each other, and the drive device is arranged outside the two extraction heads. If comprised in this way, since there is no drive device between two extraction heads, since the space | interval of two extraction heads can be made small, the space | interval of two extraction heads of an extraction device and mounting of a head unit are possible. The distance between the heads can be easily made equal.

  In the configuration in which the intervals between the plurality of extraction heads are the same as the intervals between the plurality of mounting heads when the wafer part is delivered, preferably the extraction device has at least one extraction head and is movable in a horizontal plane. A first take-out device, and a second take-out device having at least one take-out head and movable in a horizontal plane independently of the first take-out device, the take-out head and the second take-out device of the first take-out device When the wafer parts are transferred from the take-out head to the head unit, the interval between the take-out head of the first take-out device and the take-out head of the second take-out device is the same as the intervals between the plurality of mounting heads of the head unit. At least one of the first take-out device and the second take-out device is configured to move. If comprised in this way, the wafer component of each take-out head can be used as a plurality of mounting heads of the head unit by using the take-out head of the first take-out device and the take-out head of the second take-out device that can move independently from each other. Can be delivered at the same time.

  In the mounting machine according to the one aspect described above, preferably, the wafer holding table is configured to be movable in the Y direction orthogonal to the X direction in which the substrate is transported with respect to the base in the horizontal plane. The take-out device is configured to be movable at least in the X direction with respect to the base. If comprised in this way, even if it does not move a wafer holding table to a X direction, by moving a pushing-up apparatus and a taking-out apparatus to a X direction, alignment of the components to be picked up and a pushing-out apparatus and a taking-out apparatus is carried out. It can be performed. Thereby, since it is not necessary to move the wafer holding table having a relatively large plane area in the X direction, it is possible to prevent the apparatus from becoming large in the X direction in the horizontal plane.

  In the mounting machine according to the above aspect, the wafer holding table is preferably configured to be movable in the X direction in which the substrate is transported with respect to the base and the Y direction orthogonal to the X direction in the horizontal plane. . According to this structure, the wafer holding table is moved in the X direction and the Y direction, whereby the wafer part to be taken out is moved to the take-out position sandwiched between the take-out head of the take-out device and the push-up device, and the take-out operation is performed. It can be carried out.

It is a top view which shows the whole structure of the mounting machine by 1st Embodiment of this invention (a wafer holding table is a component extraction operation position). It is a top view which shows the whole structure (the wafer holding table is a wafer receiving position) of the mounting machine by 1st Embodiment of this invention. It is a front view which shows the whole structure of the mounting machine by 1st Embodiment of this invention. It is a perspective view which shows the main components of the mounting machine by 1st Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by 1st Embodiment of this invention. It is a front view which shows the delivery state of the wafer components of the mounting machine by 1st Embodiment of this invention. It is a block diagram which shows the control system of the mounting machine by 1st Embodiment of this invention. It is a flowchart for demonstrating mounting operation | movement of the mounting machine by 1st Embodiment of this invention. It is a top view which shows the whole structure of the mounting machine by the modification of 1st Embodiment of this invention. It is a top view which shows the whole structure of the mounting machine by 2nd Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by 2nd Embodiment of this invention. It is a top view which shows the whole structure of the mounting machine by 3rd Embodiment of this invention. It is a side view which shows the delivery state of the wafer components of the mounting machine by 3rd Embodiment of this invention. It is a side view which shows the other delivery state of the wafer component of the mounting machine by 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
Hereinafter, the structure of the mounting machine 100 according to the first embodiment of the present invention will be described with reference to FIGS. In order to clarify the directional relationship, XYZ rectangular coordinate axes are appropriately shown in the drawing. The X-axis direction is a direction parallel to the horizontal plane, the Y-axis direction is a direction orthogonal to the X-axis direction on the horizontal plane, and the Z-axis direction is a direction orthogonal to the X-axis and the Y-axis.

  The mounting machine 100 can take out a bare chip from the diced wafer W and mount (mount) it on the printed circuit board P, and can mount a package component or the like supplied by the component supply device 160 on the printed circuit board P. This is a so-called composite type mounting machine.

  As shown in FIGS. 1 and 2, the mounting machine 100 includes a base 1, a conveyor 2 for loading and unloading a printed board P to and from a predetermined mounting work position, and chip components for supplying chip components. And a supply unit 3. As shown in FIGS. 2 and 4, the mounting machine 100 includes a mounting unit 4 for mounting a component (bare chip or chip component) on the printed circuit board P, and a wafer W pulled out from the wafer storage unit 170. Wafer holding table 5 to be supported, take-out device 6 for taking out the bare chip from wafer W supported by wafer holding table 5 and delivering it to mounting portion 4, and pushing up the bare chip from below when the take-out device 6 takes out the bare chip A device 7 and a movable camera 8 for recognizing a component position for imaging the bare chip before the take-out operation of the bare chip by the take-out device 6 are included. The bare chip is an example of the “wafer part” in the present invention.

  The conveyor 2 includes a conveyor main body that extends in the X direction that conveys the printed circuit board P, and a positioning mechanism (not shown) that lifts and positions the printed circuit board P on the conveyor main body. The conveyor conveys the printed board P from the right side to the left side in FIG. 1 in the X-axis direction in a substantially horizontal posture, and positions and fixes the printed board P at a predetermined mounting work position. In the first embodiment, the positions (positions of the printed circuit board P in the drawing) that are separated by a predetermined interval in the X-axis direction on the conveyance path by the conveyor 2 are set as the mounting work positions. In the following description, a position on the upstream side in the transport direction of the printed circuit board P among the mounting work positions is referred to as a first work position S1, and a position on the downstream side is referred to as a second work position S2.

  The chip component supply unit 3 is provided at both ends on the front side of the mounting machine 100. The chip component supply unit 3 is provided to supply chip components such as transistors, resistors, and capacitors. In the chip component supply unit 3, for example, a component supply device 160 such as a tape feeder 161 is arranged along the conveyor 2. Each tape feeder 161 includes a reel on which a tape holding a chip component such as a transistor is wound, a holding member that holds the reel, and a chip component at a component supply position at the tip of the tape feeder while pulling out the tape from the reel. And a parts feeding mechanism for feeding The tape feeder 161 is configured to perform a chip component feeding operation in conjunction with the mounting machine 100 while being attached to the chip component supply unit 3. That is, the mounting part 4 of the mounting machine 100 is configured to pick up a chip component at the component supply position and to feed the next chip component to the component supply position along with this pickup. Note that the chip component supply unit 3 may be provided with a tray (not shown) on which a large package component such as a semiconductor package is placed instead of the tape feeder 161. In this case, the package part is picked up directly from the tray by the mounting unit 4.

  The mounting unit 4 mounts a bare chip or a chip component on the printed circuit board P, and has two head units (first head unit) that can move in the horizontal direction (XY direction) above the conveyor 2. 41, the second head unit 42) and driving means for individually driving them.

  The first head unit 41 can be moved only within this area, with the upstream area on the base 1 mainly including the first work position S1 as a movable area. On the other hand, the second head unit 42 is A downstream area on the table 1 that mainly includes the second work position S2 is set as a movable area and can move only within this area. The first head unit 41 (second head unit 42) includes two component mounting heads 41a and one camera 41b (two component mounting heads 42a and one camera 42b) arranged in the X-axis direction. The component mounting heads 41a and 42a are examples of the “mounting head” in the present invention.

  The first head unit 41 (second head unit 42) mounts the chip component supplied by the tape feeder 161 on the printed circuit board P by adsorbing the chip component by the component mounting head 41a (42a). The bare chip taken out from the wafer W is sucked by the component mounting head 41a (42a) and mounted on the printed board P. As a result, both chip components such as transistors and capacitors and bare chips (bare chips) are mounted on the printed circuit board P. Further, the first head unit 41 (second head unit 42) has a fiducial mark (not shown) attached to the printed circuit board P by the camera 41b (42b) prior to mounting of the components on the printed circuit board P. By recognizing, the positional deviation of the printed circuit board P is recognized, and the positional deviation is corrected at the time of mounting.

  As shown in FIG. 3, the driving means of the first head units 41 and 42 includes support members 43 and 44 that support the first head unit 41 and the second head unit 42 so as to be movable in the X-axis direction, and a mounting machine. Fixed rails 45 and 46 which are provided on the ceiling 100a of the 100 and support the support members 43 and 44 separately so as to be movable in the Y-axis direction, and the first head unit 41 and the second head unit with respect to the support members 43 and 44 And a linear motor for moving the support members 43 and 44 separately in the Y-axis direction along the fixed rails 45 and 46, respectively. And a moving mechanism (not shown).

  Also, fixed cameras 9 and 10 for component recognition are installed on the base 1 and in the movable regions of the first head unit 41 and the second head unit 42, respectively. The fixed cameras 9 and 10 are cameras including an image sensor such as a CCD or a CMOS. The fixed cameras 9 and 10 take images of components sucked by the component mounting head 41a of the first head unit 41 and the component mounting head 42a of the second head unit 42 from below, and the image signals will be described later. This is output to the control device 11.

  Further, as shown in FIG. 1, a wafer storage part 170 in which the wafer W is stored can be detachably fixed to the central part on the front side of the mounting machine 100. Here, as shown in FIG. 4, the wafer storage unit 170 stores a plurality of diced wafers W. The wafer storage unit 170 includes a rack for storing a substantially annular holder Wh on which the wafer W is held in a plurality of upper and lower stages, and driving means for driving the rack up and down. The wafer storage unit 170 is arranged at a predetermined loading / unloading height position where a desired wafer W can be loaded / unloaded with respect to the wafer holding table 5 by raising / lowering the rack. Further, the wafer holding table 5 includes a wafer W loading / unloading mechanism (not shown). This loading / unloading mechanism is an arm that is configured to be movable back and forth (Y direction) with respect to the wafer holding table 5 and has a holder gripping mechanism at the tip. The loading / unloading mechanism moves the wafer W (holder Wh) in the rack disposed at the loading / unloading height position from the wafer storage unit 170 to the wafer holding table with the wafer holding table 5 disposed at the wafer receiving position (see FIG. 2). The wafer W on the wafer holding table 5 can be accommodated (returned) in the rack.

  Each wafer W accommodated in the wafer accommodating portion 170 is stuck on a film-like wafer sheet so that the bare chip is face-up state (circuit formation surface (mounting surface with respect to the printed circuit board P) is upward). It is held by a holder Wh through this wafer sheet.

  The wafer holding table 5 has a circular opening at the center, and can hold the holder Wh so that the opening of the holder Wh that holds the wafer W and the opening of the wafer holding table 5 overlap. . Accordingly, it is possible to push up the bare chip from below the wafer holding table 5 by the push-up device 7 to be described later while the wafer W (holder Wh) is held on the wafer holding table 5.

  The wafer holding table 5 is configured to be movable in the Y direction on the base 1 between a component picking work position (see FIG. 1) and a wafer receiving position (see FIG. 2). Specifically, the wafer holding table 5 is movably supported by a pair of fixed rails 51 provided on the base 1 so as to extend in the Y-axis direction, and along the fixed rails 51 by a predetermined driving means. Moved. The drive means includes a ball screw shaft 52 extending in parallel with the fixed rail 51 and screwed into the nut portion of the wafer holding table 5, and a drive motor 53 for driving the ball screw shaft 52 to rotate. As shown in FIG. 3, the wafer holding table 5 passes through a position below the conveyor 2 and is located between a predetermined part picking work position (see FIG. 1) and a wafer receiving position (see FIG. 2) near the wafer storage unit 170. Move between.

  The push-up device 7 lifts the bare chip to be picked up from the lower side of the wafer W on the wafer holding table 5 arranged at the component picking work position, thereby lifting the bare chip from the wafer sheet. It is.

  The thrust device 7 includes a thrust head 71 including a pair of small-diameter thrust rods (referred to as a first thrust rod 71a and a second thrust rod 71b) each incorporating a thrust pin (not shown). It includes a fixed rail 72 that supports the base 1 so as to be movable in the X-axis direction, and drive means for moving the push-up head 71 along the fixed rail 72. The drive means includes a ball screw shaft (not shown) that extends in parallel with the fixed rail 72 and is screwed into the push-up head 71, and a push-up head drive motor (not shown) for rotationally driving the shaft. . By configuring the push-up device 7 to be movable in the X direction, the push-up head 71 can push up an arbitrary bare chip with respect to the wafer W supported on the wafer holding table 5 movable only in the Y direction. It is possible.

  The first push-up rod 71a and the second push-up rod 71b of the push-up head 71 extend in the vertical direction and are individually driven up and down by an actuator (such as an air cylinder) not shown. That is, in a state where the first push-up rod 71a or the second push-up rod 71b is arranged inside the opening of the wafer holding table 5, the first push-up rod 71a or the second push-up rod 71b is the wafer sheet. After being driven up to a substantially contacting position on the lower side and then positioned at the desired position in the XY direction of the bare chip, a push-up pin is driven by a drive motor (not shown) from the first push-up rod 71a or the second push-up rod 71b. ) To lift the bare chip. The first push-up rod 71a and the second push-up rod 71b can change the thickness of the push-up pin in accordance with the size of the part to be pushed up. For example, by attaching different push-up pins to the first push-up rod 71a and the second push-up rod 71b, the first push-up rod 71a or the second push-up rod 71b can be used properly depending on the size of the parts. Can be used.

  The first push-up rod 71a and the second push-up rod 71b can be driven up and down to a two-stage height position. That is, in order to avoid interference with the wafer holding table 5 when the wafer holding table 5 is moved between the part picking work position (see FIG. 1) and the wafer receiving position in the vicinity of the wafer storage unit 170 (see FIG. 2). Up and down between the lowermost position and the push-up standby position located in the vicinity of the lower surface of the wafer W inside the opening of the holder Wh with the wafer holding table 5 positioned at the component picking work position (see FIG. 1). The push-up pins can be driven, and the push-up pin has a position built into the first push-up rod 71a or the second push-up rod 71b at the standby position and a component push-up position positioned above the upper surface of the wafer holding table 5. Can be driven up and down.

  The take-out device 6 sucks the bare chip pushed up by the push-up device 7 and delivers it to the first head unit 41 and the second head unit 42.

  The take-out device 6 is moved in the horizontal direction (XY direction) at a position above the part take-out work position by a predetermined driving means. This driving means has the following configuration.

  That is, a pair of elevated fixed rails 61 arranged at predetermined intervals in the X-axis direction and extending in parallel with each other in the Y-axis direction, and both ends thereof are movably supported on the fixed rails 61 at the part extraction work position. A pair of frame members 62 extending in the X-axis direction and a pair of screws disposed in positions close to the fixed rail 61 and extending in the Y-axis direction and screwed into nut members (not shown) at both ends of the frame member 62. A ball screw shaft 63 and a pair of frame drive motors 64 that rotationally drive the ball screw shaft 63 are provided.

  The frame member 62 is provided with a first rail (not shown) fixed to the front side and extending in the X-axis direction, and a second rail (not shown) fixed to the rear side and extending in the X-axis direction. Yes. The take-out device 6 is movably supported on the first rail, and the camera 8 is movably supported on the second rail. A ball screw shaft (not shown) extending in the X-axis direction and screwed into the nut member (not shown) of the take-out device 6 is inserted into the frame member 62, and a drive motor 65 that rotationally drives the ball screw shaft. A ball screw shaft (not shown) that extends in the X-axis direction and is screwed into a nut member (not shown) of the camera 8 and a drive motor 66 that rotationally drives the ball screw shaft are provided. That is, the frame member 62 is moved along the fixed rail 61 by the operation of each frame drive motor 64, and the take-out device 6 and the camera 8 are integrally moved in the Y-axis direction as the frame member 62 moves.

  The take-out device 6 is moved in the X-axis direction at a position on the front side in the Y direction of the frame member 62 by the operation of the drive motor 65, and the camera is moved at the position on the rear side in the Y direction of the frame member 62 by the operation of the drive motor 66. 8 is moved in the X-axis direction. As a result, the take-out device 6 and the camera 8 can be independently moved in the horizontal direction (XY direction) at a position above the part take-out work position.

  The movable area in the XY direction of the take-out device 6 and the movable areas in the XY direction of the first head unit 41 and the second head unit 42 partially overlap. As a result, the bare chip can be delivered from the take-out device 6 to the first head unit 41 and the second head unit 42 as will be described later. As shown in FIG. 3, the take-out device 6, the camera 8, and the driving means described above are positioned below the first head unit 41, the second head unit 42, and the driving means. Accordingly, the movable area of the take-out device 6 and the movable areas of the first head unit 41 and the second head unit 42 partially overlap as described above, but the take-out apparatus 6, the first head unit 41, and the second head. The units 42 do not interfere with each other.

  The take-out device 6 includes a pair of wafer heads (referred to as a first wafer head 6a and a second wafer head 6b). The first wafer head 6a and the second wafer head 6b are examples of the “takeout head” in the present invention.

  The first wafer head 6a and the second wafer head 6b are drum type heads. That is, the first wafer head 6a and the second wafer head 6b can be rotated about an axis parallel to the X-axis direction, and can be moved in the vertical direction (lifted / lowered). A bracket member 6d that is supported by the member 6c so as to be movable up and down, and a pair of nozzles 6e that are supported by the bracket member 6d so as to be rotatable about the X axis and that are provided inside the bracket members 6d. Have.

  The pair of nozzles 6e of the first wafer head 6a are provided at positions that are exactly upside down, and are provided so that the nozzle 6e on the other side faces directly above when the nozzle 6e on one side faces directly below. . The drive motors 6f provided on the outer sides of both bracket members 6d are rotationally driven, whereby the positions of the pair of nozzles 6e are alternately switched. In the take-out device 6, the first wafer head 6a and the second wafer head 6b are disposed adjacent to each other, and the drive motor 6f is disposed outside with the pair of wafer heads interposed therebetween. The drive motor 6f is an example of the “drive device” in the present invention.

  Further, by driving a drive motor (not shown), the bracket member 6d is moved up and down with respect to the frame member 6c, and the entire first wafer head 6a including the nozzle 6e is moved up and down. The second wafer head 6b has the same configuration. As shown in FIG. 6, the distance D1 (the distance in the X-axis direction) between the nozzles 6e of the first wafer head 6a and the second wafer head 6b is a component mounting head 41a mounted on the first head unit 41. The distance D2 is equal to the distance D2 between the component mounting heads 42a mounted on the second head unit 42. As a result, the two component mounting heads 41a of the first head unit 41 or the two component mounting heads 42a of the second head unit 42 from the two wafer heads (the first wafer head 6a and the second wafer head 6b). At the same time, two bare chips can be delivered.

  The camera 8 is a camera including an image sensor such as a CCD or a CMOS. Prior to the removal of the bare chip from the wafer W, the camera 8 images the bare chip to be extracted and outputs the image signal to the control device 11. When the take-out device 6 delivers a component to the head unit, the take-out device 6 is moved to a position closest to the conveyor 2 (component delivery position Y1). At this time, as shown in FIG. 5, the position of the thrusting device 7 in the Y direction is determined so that the position Y2 of the camera 8 in the Y direction and the position of the thrusting device 7 in the Y direction overlap. As a result, after the next part is imaged in parallel with the part delivery operation, when the next part is taken out, the take-out device from the delivery of the part to the head unit until the next part is taken out. 6 can be minimized (from position Y1 to position Y2).

  FIG. 7 shows a control system of the mounting machine 100 in a block diagram. As shown in FIG. 7, the mounting machine 100 includes a control device 11 including a CPU, various memories, an HDD, and the like. The control device 11 includes the above-described drive motors and the like (drive motor 53, frame drive motor 64, drive motor 65, drive motor 66, drive motor 6f, other drive motors, and air for raising and lowering the first push-up rod 71a. The control valve drive solenoid in the air circuit to the cylinder and the second thrust rod 71a ascending / descending air cylinder), the camera 8, the fixed cameras 9 and 10 and the like are electrically connected to each other. It is controlled by the control device 11 in a centralized manner. Further, an input device (not shown) is electrically connected to the control device 11, and various types of information by the operator are input based on the operation of the input device, and are not shown. An output signal from position detection means such as an encoder is also input.

  As a functional element, the control device 11 includes a shaft control unit 11a that controls driving of the driving motors and driving solenoids of the control valves, and cameras (fixed cameras 9 and 10, cameras 41b and 42b, etc.). An image processing unit 11b that performs predetermined processing on an image signal, an I / O processing unit 11c that controls input of signals from a sensor (not shown), output of various control signals, and the like, and communication that controls communication with an external device It includes a control unit 11d, a storage unit 11e that stores various programs such as mounting programs and various data, and a main calculation unit 11f that performs overall control and executes various calculation processes.

  The control device 11 controls each drive motor and the like based on a predetermined program, whereby the conveyor 2, the wafer holding table 5, the take-out device 6, the push-up device 7, the first head unit 41, and the first head unit 41 2 The head unit 42 and the like are controlled. Thus, a series of operations (component mounting operation) such as loading / unloading of the wafer W into / from the wafer storage unit 170, removal of the bare chip from the wafer W, and mounting of components by the first head unit 41 and the second head unit 42 are executed.

  Next, the control of the component mounting operation by the control device 11 will be described with reference to FIG.

  First, in step S <b> 1, the control device 11 carries the printed board P into the mounting machine 100 by controlling the conveyor 2. And in step S2, the control apparatus 11 fixes the printed circuit board P in the state arrange | positioned in 1st work position S1 and 2nd work position S2 by controlling the conveyor 2. FIG.

  Thereafter, in step S <b> 3, the control device 11 pulls out the wafer W from the wafer storage unit 170 by controlling the wafer holding table 5. Specifically, the drive motor 53 is driven to move the wafer holding table 5 to the wafer receiving position (see FIG. 2). Then, the wafer W (holder Wh) is pulled out from the wafer storage unit 170 onto the wafer holding table 5 by a loading / unloading mechanism (not shown). In step S 4, the pulled wafer W is fixed to the wafer holding table 5. Thereafter, the wafer holding table 5 is controlled so as to be placed at the part picking work position (see FIG. 1).

  At this time, the control device 11 has a push-up pin at the center of the first push-up rod 71a of the push-up head 71 in which the Y-direction position of the bare chip to be taken out of the bare chips in the wafer W is movable in the X direction, Then, the wafer holding table 5 is moved so as to coincide with the Y-direction position of the push-up pin at the center of the second push-up rod 71b.

  When the wafer W is placed at the component extraction work position, in step S5, the control device 11 controls the camera 8 to image the bare chip to be extracted. Specifically, the frame drive motor 64 is driven to move the frame member 62 in the Y-axis direction, and the drive motor 66 is driven to move the camera 8 in the X-axis direction. As a result, the camera 8 is arranged at a position above the bare chip to be taken out (sucking target). Then, the bare chip is imaged by the camera 8. The control device 11 obtains the position (position shift) of the bare chip based on this image data. In this case, the control device 11 causes the camera 8 to image a plurality of bare chips at once or continuously as necessary.

  Next, the control device 11 controls the push-up device 7, the take-out device 6 and the wafer holding table 5 on the basis of the imaging result by the camera 8, and the push-up pin of the push-up head 71, the nozzle 6 e of the take-out device 6, The bare chip to be taken out is moved to the same position on the XY plane. Specifically, the push-up head 71 is moved in the X-axis direction, and the drive motor 53 is driven to move the wafer holding table 5 in the Y-axis direction. As a result, the first push-up rod 71a or the second push-up rod 71b of the push-up head 71 is moved so that the center push-up pin is positioned below the bare chip to be taken out. The frame drive motor 64 is driven to move the frame member 62 in the Y-axis direction, and the drive motor 65 is driven to move the take-out device 6 in the X-axis direction. Thus, the first wafer head 6a or the second wafer head 6b is moved to a position above the bare chip.

  The control device 11 pushes up the bare chip from the lower side by raising (driving) the push-up pin from the first push-up rod 71a or the second push-up rod 71b according to the size of the component. At this time, a negative pressure is generated on the front end surface of the push-up rod 71a or 71b to suck and hold the wafer sheet to which the bare chip is attached, and the push-up pin is inserted from the center of the front end surface of the push-up rod 71a or 71b. Push up. On the other hand, the first wafer head 6a or the second wafer head 6b is lowered and the bare chip peeled off from the wafer sheet by being pushed up is adsorbed by the negative pressure at the tip of the nozzle 6e. Thereby, the bare chip is taken out from the wafer W. The above-described removal of the bare chip from the wafer W is sequentially performed for each of the first wafer head 6a and the second wafer head 6b, and the bare chip is sucked and held by each nozzle 6e.

  Next, in step S7, the control device 11 delivers the bare chip from the take-out device 6 to the head unit. Specifically, the control device 11 controls the take-out device 6 to move the take-out device 6 to a predetermined component delivery position (position closest to the conveyor 2) and to control the mounting unit 4 to The one head unit 41 (or the second head unit 42) is moved to the component delivery position. Accordingly, the take-out device 6 and the first head unit 41 (or the second head unit 42) are arranged vertically at the component delivery position.

  During the movement until the take-out device 6 and the first head unit 41 (second head unit 42) are arranged at the component delivery position, the control device 11 controls the first drive head 6a and the first wafer head 6a by controlling both drive motors 6f. The second wafer head 6b is rotated. As a result, the bare chip adsorbed by each nozzle 6e is reversed (reversed to the face-down state), and then the two heads 41a or the second head unit 42 in which the first head unit 41 descends the bare chip. It is adsorbed by the two component mounting heads 42a lowered. As a result, the delivery of bare chips from the take-out device 6 to the first head unit 41 (second head unit 42) is performed simultaneously for two bare chips.

  Next, in step S8, the control device 11 moves the first head unit 41 above the fixed camera 9 (the fixed camera 10 in the case of the second head unit 42), and removes the bare chip adsorbed by each component mounting head. While making a fixed camera image, the adsorption | suction deviation | shift of the bare chip with respect to each component mounting head is calculated based on the image data.

  Next, in step S <b> 9, the control device 11 uses the camera 41 b (42 b) of the first head unit 41 (second head unit 42) to perform the fiducial attached to the printed circuit board P fixed to the conveyor 2. Recognizes a mark (not shown). Thereby, the control apparatus 11 recognizes the position shift with respect to the conveyor 2 of the printed circuit board P. FIG.

  In step S <b> 10, the control device 11 moves the first head unit 41 (second head unit 42) to the corrected position above the printed circuit board P based on the bare chip suction displacement and the printed circuit board P displacement. Then, the bare chip is mounted on the printed circuit board P by lowering the component mounting head at a predetermined mounting position.

  Thereafter, in step S11, the control device 11 determines whether or not all bare chips have been mounted. If the bare chip to be mounted still remains, the process returns to step S5 to continue the mounting operation.

  Further, when all the bare chips have been mounted, the control device 11 releases the fixation of the printed circuit board P by controlling the conveyor 2 in step S12. In step S <b> 13, the control device 11 carries the printed circuit board P out of the mounting machine 100 by controlling the conveyor 2.

  Although the control of the component mounting operation by the control device 11 has been described above, the control shown in this flowchart is the most basic control example of the component mounting operation when only the bare chip is mounted. That is, at the time of actual production of the printed circuit board P, in order to produce the printed circuit board P more efficiently, the control device 11 performs the wafer W loading / unloading operation by the wafer holding table 5 and the bare chip by the unloading device 6 and the push-up device 7. A part of a plurality of operations such as a take-out operation and a head unit mounting operation are executed in parallel. In particular, in the first embodiment, when the bare chip is delivered from the take-out device 6 to the head unit, or when the bare chip is mounted on the printed circuit board P by the head unit, the next mounting component is imaged by the camera 8 in parallel. Is going. Further, when the bare chips are sequentially mounted on the plurality of printed circuit boards P, the process returns from step S13 to step S1 and the next printed circuit board P is loaded and step S2 is performed. Steps S3 and S4 are skipped if there is a bare chip remaining.

  In the first embodiment, as described above, the wafer components adsorbed by the first wafer head 6a and the second wafer head 6b are used as the two component mounting heads 41a of the first head unit 41 or the second head unit 42, respectively. By configuring so that the two component mounting heads 42a can receive at the same time, two wafer components can be transferred at a time. This suppresses an increase in the total time required for the delivery operation of a plurality of wafer components, compared to the case where the delivery operation of the wafer components to the component mounting head 41a or 42a is performed for each wafer component. can do.

  In the first embodiment, as described above, the distance D1 between the centers of the first wafer head 6a and the second wafer head 6b (hereinafter simply referred to as the distance D1) is defined as the two components of the first head unit 41. The distance D2 between the centers of the mounting heads 41a (hereinafter simply referred to as the distance D2) or the distance D2 between the centers of the two component mounting heads 42a of the second head unit 42 (hereinafter simply referred to as the distance D2). I have to. With this configuration, wafer components can be easily and simultaneously delivered from the two wafer heads 6a and 6b to the two component mounting heads 41a or the component mounting head 42a.

  Further, in the first embodiment, the take-out device 6 has two wafer heads 6a and 6b arranged adjacent to each other, and two drive motors 6f are disposed outside the two wafer heads 6a and wafer head 6b. It is comprised so that it may arrange | position. As a result, since there is no drive motor between the two wafer heads 6a and 6b, the distance between the two wafer heads 6a and 6b can be reduced, so the two wafer heads 6a and 6b. The distance between each other and the distance between the mounting heads of the head unit can be easily made equal.

  In the first embodiment, as described above, the wafer holding table 5 movable in the Y direction with respect to the base 1, the push-up device 7 movable in the X direction with respect to the base 1, and the base By providing the take-out device 6 movable in the X direction with respect to the table 1, the push-up device 7 and the take-out device 6 can be moved in the X direction without moving the wafer holding table 5 in the X direction. The alignment of the bare chip to be taken out with the push-up device 7 and the take-out device 6 can be performed. Thereby, since it is not necessary to move the wafer holding table 5 having a relatively large plane area in the X direction with respect to the push-up device 7 and the take-out device 6, it is possible to suppress the apparatus from becoming large in the X direction. it can.

  Further, in the first embodiment, as described above, the take-up device 7 and the take-out device 6 are fixed by configuring the take-out device 6 to be movable relative to the push-up device 7 in the Y direction. Unlike the case, the positions of the push-up device 7 and the take-out device 6 can be finely adjusted. Thereby, since position shift with the pushing-up apparatus 7 and the taking-out apparatus 6 at the time of picking up a component can be suppressed, it can suppress that the adsorption | suction defect of components arises.

  In the first embodiment, the wafer holding table 5 is configured to be movable in the Y direction, and the camera 8 is configured to be movable in the Y direction. Accordingly, when the camera 8 and the bare chip to be taken out are aligned in order to take an image of the bare chip to be taken out, both the wafer holding table 5 and the camera 8 are moved so as to approach each other. It can be performed. Thus, as compared with the case where only the wafer holding table 5 is moved and the camera 8 and the bare chip to be taken out are aligned as in the case where the wafer imaging camera is fixed in the Y direction, the position can be shortened. Can be combined.

  In the first embodiment, as described above, the take-out device 6 is configured to be movable in the Y direction, and the push-up device 7 is fixed in the Y direction. By configuring in this way, by moving the take-out device 6 in the Y direction, it is possible to align the push-up device 7 and the take-out device 6 for performing the take-out operation.

  In the first embodiment, as described above, in parallel with the delivery from the bare chip take-out device 6 to the head unit, or in parallel with the mounting of the bare chip on the printed circuit board P by the head unit, the wafer holding table By performing imaging of the bare chip to be mounted next held by the camera 8 with the camera 8, the total time required for imaging of the next wafer part and mounting of the previous part or delivery of the wafer part can be shortened.

(Modification of the first embodiment)
In the first embodiment, the example in which one first head unit 41 and one second head unit 42 corresponding to the first work position S1 and the second work position S2 are provided is described. Like the mounting machine 200 according to the modified example of the first embodiment, the first work position S1 and the second work position S2 are associated with each other by one head unit 202 that is movably supported by the frame member 201 extending in the X direction. Also good.

  In the first embodiment, the take-out device 6 is configured to be movable in the Y direction, and the push-up device 7 is fixed in the Y direction. However, the take-out device 6 is fixed in the Y direction, and the push-up device is fixed. 7 may be configured to be movable in the Y direction. Thus, by moving the push-up device 7 in the Y direction, the push-up device 7 for performing the take-out operation can be aligned with the take-out device 6, and by fixing the take-out device 6 in the Y direction The device can be made inexpensive. Further, both the take-out device 6 and the push-up device 7 may be configured to be movable in the Y direction. Efficiency can be improved by various ways of moving the wafer holding table 5 in the Y direction.

(Second Embodiment)
Next, a mounting machine 300 according to the second embodiment of the present invention will be described with reference to FIGS. 10 and 11. In the second embodiment, unlike the first embodiment, an example in which two take-out devices are provided will be described.

  In the second embodiment, as shown in FIG. 10, two take-out devices (a first take-out device 301 and a second take-out device 302) are provided. Each structure of the 1st extraction apparatus 301 and the 2nd extraction apparatus 302 is the same as that of the extraction apparatus 6 of the said 1st Embodiment. Both the first take-out device 301 and the second take-out device 302 are supported by a fixed rail that is fixed to the front side of the frame member 62 and extends in the X-axis direction.

  Then, a ball screw shaft (not shown) extending in the X-axis direction and a first screw screwed to the ball screw shaft and fixed to the first take-out device 301 and fixed in the axial direction are attached to the frame member 62. A nut member (not shown) and a ball screw shaft pass therethrough, the first nut member is driven to rotate, and the first hollow motor (not shown) attached to the first take-out device 301 is screwed onto the ball screw shaft. And a second nut member (not shown) which is rotatably attached to the second take-out device 302 and fixed in the axial direction, and the ball screw shaft penetrates and the second nut member is driven to rotate, and 2 is provided with a second hollow motor (not shown) attached to the take-out device 301. That is, the first hollow motor is actuated to move the first take-out device 301 in the X-axis direction at a position on the near side of the frame member 62, and the second hollow motor is actuated on the position on the near side of the frame member 62. The second extraction device 302 is moved in the X-axis direction. Thereby, the 1st taking-out apparatus 301 and the 2nd taking-out apparatus 302 can move to a horizontal direction (XY direction) in the upper position of a component taking-out operation position.

  In the second embodiment, one head unit 304 is supported by a frame member 303 extending in the X direction so as to be movable in the X direction. The frame member 303 is configured to be movable in the Y direction. The mounting of the first work position S1 and the second work position S2 is performed by one head unit 304.

  As shown in FIG. 11, the head unit 304 has four component mounting heads 304a and a camera 304b. The distance D3 between the centers of the component mounting heads 304a adjacent to each other in the head unit 304 (hereinafter simply referred to as the distance D3) is the distance D1 between the wafer heads of the first extraction device 301 and the wafer head of the second extraction device 302. It is equal to the distance D1 between them. The component mounting head 304a is an example of the “mounting head” in the present invention.

  As the wafer component delivery operation of the second embodiment, for example, the first take-out device 301 simultaneously delivers two wafer components to the two component mounting heads 304a of the head unit 304, and then performs the second take-out device. In step 302, the two wafer components are simultaneously transferred to the remaining two component mounting heads 304a of the head unit 304. Other configurations of the mounting machine 300 of the second embodiment are the same as those of the first embodiment.

  The effect of the second embodiment is the same as that of the first embodiment.

(Modification of the second embodiment)
In the second embodiment, one head unit 304 is provided, and the example in which the first take-out device 301 and the second take-out device 302 perform the wafer part transfer operation in order to one head unit 304 has been described. . Here, when two head units (the first head unit 41 and the second head unit 42) are provided as in the first embodiment, the first take-out device 301 and the second take-out device 302 can By performing a delivery operation to each of the first head unit 41 and the second head unit 42, it is possible to deliver four wafer parts at the same time.

(Third embodiment)
Next, a mounting machine 400 according to a third embodiment of the present invention will be described with reference to FIG. 12, FIG. 13, and FIG. In the third embodiment, an example will be described in which two extraction devices each having one wafer head are provided, unlike the first embodiment in which one extraction device 6 having two wafer heads is provided.

  In the third embodiment, as shown in FIGS. 12 and 13, two take-out devices (a first take-out device 401 and a second take-out device 402) are provided. Both the first take-out device 401 and the second take-out device 402 are movably supported by a fixed rail extending in the X-axis direction on the front side of the frame member 62. The first take-out device 401 and the second take-out device 402 can move in the X-axis direction on the fixed rail of the frame member 62 independently of each other by a mechanism using a hollow motor similar to that of the second embodiment.

  Further, each of the first take-out device 401 and the second take-out device 402 has one wafer head 401a and 402a. The wafer head 401a of the first take-out device 401 can rotate around an axis parallel to the X-axis direction and can be moved in the vertical direction (lifted / lowered) so that the frame member 401b of the first take-out device 401 can be moved. Bracket member 401c supported to be movable up and down, and a pair of nozzles for component suction provided on bracket member 401c so as to be rotatable about the X axis and provided on the second take-out device 402 side with respect to bracket member 401c. 401d. The drive motor 401e provided on the opposite side of the second extraction device 402 with respect to the bracket member 401c is rotationally driven, whereby the positions of the pair of nozzles 401d are alternately switched.

  Further, the wafer head 402 a of the second extraction device 402 has the same configuration as that of the first extraction device 401. The second take-out device 402 includes a frame member 402b, a bracket member 402c, a nozzle 402d, and a drive motor 402e. The wafer head 401a and the wafer head 402a are examples of the “takeout head” in the present invention.

  The wafer head 402a of the second extraction device 402 is disposed so as to face the wafer head 401a of the first extraction device 401. The drive motor 401e of the first take-out device 401 and the drive motor 402e of the second take-out device 402 are disposed on the outside with the wafer heads 402a and 401a interposed therebetween. Other configurations of the mounting machine 400 of the third embodiment are the same as those of the first embodiment.

  As the take-out operation and delivery operation of the third embodiment, first, the wafer head 401a of the first take-out device 401 and the wafer head 402a of the second take-out device 402 individually take out wafer components (bare chips). Thereafter, when at least one of the first take-out device 401 or the second take-out device 402 moves, the first take-out device 401 and the second take-out device 402 move to a predetermined delivery position. Here, in the third embodiment, as shown in FIG. 13, the control device (not shown) allows each of the wafer head 401 a of the first take-out device 401 and the wafer head 402 a of the second take-out device 402 at the transfer position. The distance between the centers (the distance D4 between the centers of the nozzle 401d and the nozzle 402d, hereinafter simply referred to as the distance D4) is the distance between the centers of the component mounting head 420a of the first head unit 420 or the component mounting of the second head unit 421. The first take-out device 401 and the second take-out device 402 are arranged so as to be equal to the distance D5 (hereinafter simply referred to as the distance D5) between the centers of the heads 421a.

  Thereafter, as in the first embodiment, the two component mounting heads 420a or the second head unit of the first head unit 420 from the wafer head 401a of the first extraction device 401 and the wafer head 402a of the second extraction device 402 are used. Wafer components are simultaneously delivered to the two component mounting heads 421a of 421.

  In the third embodiment, as described above, the wafer head of the first extraction device 401 is transferred when the wafer parts are transferred from the first extraction device 401 and the second extraction device 402 to the first head unit 420 or the second head unit 421. The distance between 401a and the wafer head 402a of the second take-out device 402 is the same as the distance between the two component mounting heads 420a of the first head unit 420 or the distance between the two component mounting heads 421a of the second head unit 421. At least one of the first take-out device 401 and the second take-out device 402 is moved so that With this configuration, the wafer head 401a of the first take-out device 401 and the wafer head 402a of the second take-out device 402, which are movable independently of each other, are used to transfer the wafer components of each wafer head to the head unit. Any one of the four component mounting heads can be simultaneously transferred to any two adjacent component mounting heads.

  As shown in FIG. 14, in the third embodiment, when the wafer parts are transferred from the first take-out device 401 and the second take-out device 402 to the first head unit 420 or the second head unit 421, the first take-out device is used. The distance D4 between the wafer head 401a of 401 and the wafer head 402a of the second take-out device 402 is the distance between the two component mounting heads 420a of the first head unit 420 or the two component mounting heads 421a of the second head unit 421. At least one of the first take-out device 401 and the second take-out device 402 is moved so as to be equal to twice (integer multiple) the distance D5 between them. As a result, the wafer head 401a of the first take-out device 401 and the wafer head 402a of the second take-out device 402, which can move independently from each other, are used to mount the wafer parts of the respective wafer heads on the four components of the head unit. Any one of the heads can be simultaneously transferred to two component mounting heads whose interval is twice (integer multiple) D5.

  The remaining effects of the third embodiment are similar to those of the aforementioned first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to third embodiments, the example in which two or four heads for component mounting of the head unit are provided has been described. However, the present invention is not limited thereto, and three or five or more heads may be provided. Good. Further, three or more extraction heads of the extraction device may be provided.

  In this case, in the first or second embodiment, the distance D1 between the first wafer head 6a and the second wafer head 6b of the take-out device 6 (301, 302) is equal to that of the head unit 41 (42, 202, 304). The three or more component mounting heads 41a (42a, 304a) arranged at the same interval D2 (D3) are set to be equal to an integral multiple of the interval D2 (D3). Accordingly, the wafer components of the respective wafer heads can be simultaneously delivered to two adjacent component mounting heads or two component mounting heads having one or more other component mounting heads interposed therebetween. .

  In the first to third embodiments, the example in which the bare chip is adsorbed to the head unit via the take-out device has been described. However, in addition to this, the nozzle of the head unit is connected to the wafer W on the wafer holding table. The head unit may be configured to be capable of directly sucking the bare chip without going through the take-out device. In other words, corresponding to the type of bare chip, the bare chip can be sucked and mounted on the head unit in a face-down state via the take-out device, or the bare chip can be sucked and mounted directly in the face-up state without going through the take-out device. The mounting may be performed by one or a plurality of mounting machines 100 to 400.

  In this case, when the movable range in the Y direction of the head unit is extended to the vicinity of the conveyor 2 as in the first to third embodiments, a push-up device is installed in the vicinity of the conveyor 2 or the push-up is performed. The apparatus needs to be configured to be movable in the Y direction so as to be movable in the vicinity of the conveyor 2. In addition, even when the lifting device is fixed in the Y direction at the component extraction work position as in the first embodiment, the head unit can be expanded by extending the movable range of the head unit in the Y direction to the component extraction operation position. However, the bare chip can be directly adsorbed without using the take-out device.

  Further, in the first embodiment, as shown in FIG. 5, when the take-out device 6 delivers parts to the head unit, the position Y2 of the camera 8 in the Y direction and the position of the push-up device 7 in the Y direction are determined. Although the push-up device 7 is disposed so as to overlap (fixed in the Y direction), the present invention is not limited to this. That is, the push-up device 7 may be arranged (fixed in the Y direction) between the position Y1 in the Y direction of the take-out device at the time of parts delivery and the position Y2 in the Y direction of the moving camera at that time. In this case, after the next part is imaged in parallel with the part delivery operation, the take-out device and the wafer holding table (part to be taken out) are brought close to each other when the next part is taken out. Can be moved in the Y direction and aligned above the thrusting device. As a result, the time from delivery of a part to the head unit to removal of the next part can be further shortened. When the moving speed of the take-out device in the Y direction is equal to the moving speed of the wafer holding table, the push-up device is arranged in the middle between the position Y1 and the position Y2 (fixed in the Y direction). When the moving speed of the extracting device in the Y direction is smaller than the moving speed of the wafer holding table, the push-up device is moved closer to the position Y1 than the middle between the position Y1 and the position Y2 according to the speed difference.

  Further, in the first to third embodiments, the example in which the wafer holding table, the take-out device, the push-up device, the camera for recognizing the component position, etc. are driven using the ball screw is shown, but the present invention is not limited to this. Alternatively, other drive mechanisms such as a linear motor may be used. Further, although an example in which the head unit is driven using a linear motor has been shown, the present invention is not limited to this, and the head unit may be driven using a ball screw.

  In the first and second embodiments, an example in which two wafer heads and two drive motors corresponding to the two wafer heads are provided in one take-out device has been described. However, the present invention is not limited to this. I can't. That is, two (a plurality) wafer heads may be driven upside down by one drive motor. In this case as well, it is preferable to dispose the drive motor outside the two wafer heads.

  In the first to third embodiments, the example in which the wafer holding table 5 is movable only in the Y direction and the take-out device and the push-up device 7 are movable in the X direction has been described. The invention is not limited to this, and the wafer holding table may be movable in the XY directions. In this case, for example, even when the push-up device is fixed in the X and Y directions (when the extraction position is fixed), the wafer holding table is moved in the X and Y directions so that the wafer part to be extracted can be moved. The take-out operation can be performed by moving to the take-out position sandwiched between the take-out head of the take-out device and the push-up device.

  In the third embodiment, an example in which one wafer head is provided in each of the first extraction device and the second extraction device has been described. However, the present invention is not limited to this, and the first extraction device and the second extraction device are provided. Each may be provided with a plurality of wafer heads.

DESCRIPTION OF SYMBOLS 1 Base 2 Conveyor 4 Mounting part 5 Wafer holding table 6 Take-out apparatus 6a 1st wafer head (take-out head)
6b Second wafer head (take-out head)
6f Drive motor (drive device)
7 Push-up device 41 First head unit (head unit)
41a Component mounting head (mounting head)
42 Second head unit (head unit)
42a Component mounting head (mounting head)
202 Head unit 301, 401 First take-out device (take-out device)
302, 402 Second take-out device (take-out device)
304 Head unit 304a Component mounting head 401a Wafer head (takeout head)
402a Wafer head (take-out head)
100, 200, 300, 400 Mounting machine P Printed circuit board (board)

Claims (7)

The base,
A wafer holding table capable of holding wafer parts;
A thrusting device having a mechanism for thrusting a wafer part held on the wafer holding table from below;
A plurality of pick-up heads that suck up the wafer parts pushed up by the push-up device and can be turned upside down,
A head unit having a plurality of mounting heads for receiving the wafer component from the take-out head and mounting the wafer component on a substrate;
A mounting machine configured such that the plurality of mounting heads can simultaneously receive the wafer parts adsorbed by the plurality of take-out heads.   2. The mounting according to claim 1, wherein the interval between the plurality of extraction heads is the same as the interval between the plurality of mounting heads of the head unit at least when the wafer part is transferred from the extraction head to the head unit. Machine. And further comprising a take-out device having the plurality of take-out heads,
The mounting machine according to claim 2, wherein an interval between the plurality of extraction heads provided in the extraction device is configured to be the same as an interval between the plurality of mounting heads of the head unit. The take-out device has two take-out heads and a drive device provided for rotationally driving the take-out head for upside down,
The mounting machine according to claim 3, wherein the two take-out heads are arranged adjacent to each other, and the driving device is arranged outside the two take-out heads. The take-out device has at least one take-out head, and has a first take-out device movable in a horizontal plane, and has at least one take-out head, and moves in a horizontal plane independently of the first take-out device. A second take-out device possible,
The distance between the take-out head of the first take-out device and the take-out head of the second take-out device when the wafer part is transferred from the take-out head of the first take-out device and the take-out head of the second take-out device to the head unit. 5. The structure according to claim 2, wherein at least one of the first take-out device and the second take-out device is moved so that the distance between the plurality of mounting heads of the head unit is the same. The mounting machine according to item 1. The wafer holding table is configured to be movable in the Y direction orthogonal to the X direction in which the substrate is transported with respect to the base in a horizontal plane,
The push-up device is configured to be movable at least in the X direction with respect to the base.
The mounting apparatus according to claim 1, wherein the take-out device is configured to be movable at least in the X direction with respect to the base.   The said wafer holding table is comprised so that a movement to the X direction in which the said board | substrate is conveyed with respect to the said base and the Y direction orthogonal to the said X direction in a horizontal surface is possible. The mounting machine according to item 1.

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