JP2001319938A - Chip transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip transfer device where a posture keeping transfer system and a posture inversion transfer system can be performed in the same device. SOLUTION: A chip supply 62, a transfer head unit 82, a driving part which vertically inverts the unit and a mounted head are installed. At the time of mounting a bare chip, a wafer holder 67 is pulled out from a wafer storage elevator 66 by a chip supply 62 and an XY stage 65 sets a bare chip 61 in a pickup position. The transfer head unit 82 picks up the bare chip in a face up state. In the case of the posture keeping transfer system, the bare chip is transferred to a transfer stage 63, is placed and is transferred to a mounter head unit. In the case of the posture inversion transfer system, an absorption nozzle is vertically inverted during transfer and it is transferred to a transfer position. Then, the bare chip in a face down state is directly transferred to the mounter head unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to maintaining a posture for transferring chips from a chip supply unit such as a wafer holder or a chip tray in a face-up state in which a circuit forming surface faces upward, for example, in the case of die bonding. A transfer method and a posture reversal transfer method for transferring the supply position in the chip supply unit upside down during transfer, for example, in the case of flip chip bonding, so that the circuit forming surface faces downward in a downward direction,
The present invention relates to a chip transfer device used for selectively performing both transfer methods by the same device.

[0002]

2. Description of the Related Art Conventionally, as a chip transfer device adopting a posture maintaining transfer system, a chip transfer device in a die bonder for transferring a chip in a face-up state from a chip supply unit in its supply position and bonding it to a substrate has been known. I have. Further, as a chip transfer device adopting a posture inversion transfer method, a chip transfer device in a flip chip bonder for converting the face-up state chip upside down to a face-down state and bonding the face-down state chip to a substrate is known. Are known.

[0003] The chip transfer device in the die bonder is X
A head that horizontally moves in the axial direction and the Y-axis direction,
A collet which moves up and down with respect to the head, and a wafer is diced and one chip is vacuum-adsorbed from the wafer sheet holding a large number of chips by the raising / lowering operation of the collet, and in this state, the head is horizontally moved to the substrate. Then, the chip is bonded to the substrate by moving the collet up and down again (for example, see JP-A-7-297213).

[0004] A chip transfer device in a flip chip bonder includes a vertical shaft, an arm projecting horizontally from the vertical shaft, and a head provided downward from the tip of the arm. And the arm are connected by a pair of bevel gears meshing with each other. Then, one chip is vacuum-sucked from the wafer sheet by the elevating operation of the head, and the vertical shaft body is moved around the vertical axis for one chip.
When the head is rotated by 80 degrees, the head moves around the vertical axis to the transfer position, and at the same time, the rotational force around the vertical axis is transmitted as the rotational force that rotates the arm around the horizontal axis via the pair of bevel gears. As a result, the head is turned upside down and the chip is converted to a face-down state (for example, Japanese Patent Application Laid-Open No. 9-6410).
No. 4).

[0005]

However, in the above-described conventional chip transfer device, a die bonder must be used to bond the chip to the substrate in a face-up state, while the chip is face-down to the substrate. For bonding, it is necessary to use a flip chip bonder. In other words, it is necessary to use a dedicated chip transfer device depending on the bonding posture of the chip with respect to the substrate, that is, whether the chip is in a face-up state or a face-down state. There is a disadvantage that the subsequent wafers need to be supplied individually.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a chip transfer device capable of performing both a posture maintaining transfer system and a posture inversion transfer system by the same device. To provide.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a posture maintaining transfer system for transferring chips from a chip supply unit while maintaining a supply posture in a chip supply unit, and a method for maintaining the supply posture in the chip supply unit. As a chip transfer device that selectively executes the transfer of chips by both the transfer method and the posture inversion transfer method of transferring chips from the chip supply unit with the upside down operation, the chip is horizontally sucked from the chip supply unit and sucked. A first suction head that transfers the first suction head in the direction, a reversing drive unit that selectively drives the first suction head in a state in which the chip is sucked upside down by rotating about a horizontal axis, and a first suction head that is in a non-reverse drive state. A transfer stage for placing the sucked chip away from the first suction head,
The first suction head is turned upside down by the reversing drive unit, and the second suction head is configured to selectively suck a chip from any of the transfer stages and transfer the chip to a substrate to be mounted. Things.

According to the present invention, the chips are transferred by the attitude maintaining transfer method by sucking the chips from the chip supply unit by the first suction head, and transferring the suction head having sucked the chips as it is to the transfer stage in the horizontal direction. This can be achieved by separating the chips that have been adsorbed on the transfer stage and mounting the chips on the transfer stage. That is, the chip mounted on the transfer stage is
By suction by the suction head, it is possible to transfer the chip in the same posture as the supply posture in the chip supply unit to the substrate. As a result, if the supply posture of the chip in the chip supply section is in the face-up state, the chip can be transferred in the face-up state.

On the other hand, in the chip transfer by the posture inversion transfer method, the chip is sucked from the chip supply section by the first suction head, and the inversion drive section is operated while the suction head having sucked the chip is moved in the horizontal direction. This is made possible by doing so. That is, the first suction head rotates around the horizontal axis and is turned upside down by the operation of the reversing drive unit, and the chip attitude can be changed to a state in which the chip posture is turned upside down from that in the chip supply unit. . Then, the chip whose posture has been inverted from the first suction head in the upside-down state can be sucked by the second suction head and transferred to the substrate to be mounted. Thus, if the supply posture of the chip in the chip supply section is in the face-up state, the chip can be transferred after being converted to the face-down state.

In this manner, both the attitude maintaining transfer method and the attitude change transfer method can be selectively executed by the same apparatus.

[0011] In the above invention, as the chip supply unit,
Ejector means for pushing the chip upward from a lower position when the chip is sucked by the first suction head; a plurality of ejector pin units corresponding to the chip size as the ejector means; A configuration may be employed in which a plurality of types of ejector pin units are provided with a conversion drive unit that performs a mutual position conversion. As a result, the ejector pin unit can be converted into an appropriate ejector pin unit according to the chip size, and the chip can be more reliably peeled off from the wafer sheet. In addition, as the plurality of types of ejector pin units, those having a different number of ejector pins, such as one or a plurality of ejector pins depending on the chip size, may be used. The rotation may be about a vertical axis or a horizontal axis.

Further, as the first suction head in the above invention, a central shaft body arranged in a horizontal direction, a plurality of head portions arranged to project radially from the central shaft body, A rotation drive unit may be provided that rotates the central shaft body about the central axis to position a specific head unit selected from the plurality of head units according to the chip size downward. Thereby, it is possible to convert the chip into an appropriate specific head unit in accordance with the size of the chip supplied by the chip supply unit, and it is possible to more reliably perform suction and transfer.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a composite mounting machine to which a chip transfer device according to an embodiment of the present invention is applied.

This composite mounting machine mounts a component on a printed circuit board 3 to be mounted (substrate indicated by a two-dot chain line in FIG. 1) which is conveyed by a conveyor 2 arranged on a base 1 and stopped at a mounting position. A completed electronic component such as a semiconductor package, a transistor, and a capacitor from the supply unit 4;
This is configured as a hybrid mounter that can mount both the bare chip (chip) 61 and the bare chip.

The component supply unit 4 is disposed at one side of the conveyor 2. The component supply unit 4 includes a plurality of rows of tape feeders 4a.
a is configured to house and hold a different type or the same type of completed electronic component as described above at predetermined intervals and to take out the tape held from the reel, and to feed out the tape by a ratchet type feed mechanism, and to mount the As the components are picked up by the head unit 5, the tape is fed out intermittently.

A mounter head unit 5 including a second suction head is provided above the base 1, and the mounter head unit 5 is provided between the component supply unit 4 and a transfer stage 63 to be described later and the printed circuit board 3. With this, it is possible to move horizontally in the X-axis direction (the direction in which the conveyor 2 is disposed) and the Y-axis direction (the direction orthogonal to the X-axis on a plane).

More specifically, a pair of rails 6 extending in the Y-axis direction extend on the base 1, and a head unit support member 7 is installed on the rails 6. The head unit support member 7 is screwed with a ball screw shaft 9 via a nut portion 8, and the ball screw shaft 9 is connected to a rotation shaft of a Y-axis servomotor 10. The head unit support member 7 has a guide member 11 extending in the X-axis direction,
The mounter head unit 5 is movable along the guide member 11. When the X-axis motor 12 is driven, the mounter head unit 5 is moved in the X-axis direction via a ball screw shaft 13 (see FIG. 2) disposed in parallel with the guide member 11.

As shown in detail in FIG. 2, the mounter head unit 5 has a head unit main body 15 and a support supported by the head unit main body 15 so as to be able to move up and down in the Z-axis direction (vertical direction) as one axial direction. A frame 16 is provided as a member, and a second suction head 20 is mounted on the frame 16 for detachably adsorbing and holding the completed electronic component and the bare chip 61 on the frame 16 by vacuum adsorption. ing.

The frame 16 is moved up and down with respect to the head unit main body 15 by a vertically moving servomotor 21 fixed to the head unit main body 15. That is, when the servo motor 21 moves the frame 16 up and down, the second suction head 2
0 is raised and lowered synchronously.

More specifically, the head unit body 15
The guide part 22 and the ball screw shaft 2 extending in the vertical direction
3 is fixed, while a nut portion 24 screwed to the ball screw shaft 23 is fixed to the frame 16. The ball screw shaft 23 is connected to the rotation shaft of the servo motor 21 and the servo motor 2
When the ball screw shaft 1 is rotated forward or backward, the ball screw shaft 2 is rotated.
3 rotates at a fixed position about the Z-axis, and as a result of this rotation, the nut part 24 moves up and down along the guide part 22, so that the frame 16 is moved up and down in the Z-axis direction.

A plurality of the second suction heads 20 are arranged side by side in the X-axis direction.
0 is individually moved up and down in the Z-axis direction by an air cylinder 25 fixed to the frame 16 and rotated around an axis arranged in the Z-axis direction by a rotation servomotor (not shown). Has become.

The second suction head 20 is provided with an air passage penetrating through the piston 26 of the air cylinder 25 and the hollow shaft 27, and through this air passage, a negative pressure supply port 28 connects the second suction head 20 to the second suction head 20. By supplying the negative pressure or the positive pressure in a switchable manner, the second suction head 20 performs suction of the completed component or the like and separation of the sucked component.

Further, a suction nozzle 29 is detachably connected to the tip of the second suction head 20. The suction nozzle 29 is mounted on the other side of the conveyor 2 (see FIG. 1). The exchange station 30 can be replaced with various kinds of suction nozzles prepared according to the suction target (complete electronic components and bare chips).

In FIG. 1, reference numeral 31 denotes the second suction head 2;
This is a component recognition camera that captures an image of the component sucked at 0.

On the other hand, a space 60 between the pair of Y-axis direction rails 6, 6 for the mounter head unit 5, which is a space opposite to the component supply unit 4 with the conveyor 2 interposed therebetween, has a bare chip 61. And a chip transfer device 64 that transfers the bare chips 61 from the chip supply unit 62 to the transfer stage 63 one by one.

The chip supply unit 62 is connected to the X
The transfer stage 63 is arranged close to the end of the rail 6 on one side in the axial direction (right side in FIG. 1), and the corner position of the rail 6 and the conveyor 2 on the other side in the X-axis direction (left side in FIG. 1). The chip transfer device 64 is disposed so as to extend obliquely on the same plane as the X axis and the Y axis from the chip supply unit 62 to the transfer stage 63.

The chip supply unit 62 is provided in the X-axis direction and the Y-
The XY stage 65 includes an XY stage 65 that moves and adjusts in the axial direction, and a drawer unit 68 that pulls out the wafer holders 67 one by one from the wafer storage elevator 66 and transfers them to the XY stage 65. The wafer storage elevator 66 stores a plurality (for example, 10) of wafer holders 67 in multiple stages in the vertical direction, and is capable of moving up and down.
An arbitrary wafer holder 67 can be adjusted to a height position corresponding to the drawer unit 68. Each of the wafer holders 67 holds a large number of bare chips 61 formed by dicing a wafer on a wafer sheet 69 in a face-up state.

The drawer unit 68 includes, for example, a guide 71 extending in the Y-axis direction, and a cylinder 72 supported by the guide 71 so as to be movable in the Y-axis direction.
Connected to the rod end of this cylinder 72, the cylinder 7
2 in the X-axis direction, the engaging portion 6 of the wafer holder 67
Hook 7 removably engaged with 71 (see FIG. 4)
3 and a motor 74 for moving the cylinder 72 in the Y-axis direction by, for example, belt drive. And
The cylinder 72 is advanced by the operation of the motor 74 to be positioned at the take-out position (the position indicated by a solid line in FIG. 1). At this take-out position, the hook 73 is engaged with the wafer holder 67 by the contraction operation of the cylinder 72. When the cylinder 72 is retracted to the pulled-out position (the position shown by the one-dot chain line in FIG. 1) by the reverse rotation of the motor 74, the wafer holder 67 is drawn out and transferred to the XY stage 65.

The transfer stage 63 is used when the chip transfer device 64 is set to transfer by the attitude maintaining transfer method and the bare chip 61 is transferred from the chip supply unit 62 in a face-up state. And a transfer portion which is raised and lowered by a motor 631 is provided on the upper surface.

The above-mentioned chip transfer device 64 is moved in the oblique direction (R
), A transfer head unit 82 as a first suction head supported to be moved and guided by the guide 81, and a ball screw shaft disposed in parallel with the guide 81. 83, and a servomotor 85 fixed to the mounting portion 84 for rotating the ball screw shaft 83 at a fixed position.
The nut unit 86 screwed into the unit 3 and the transfer head unit 82 are fixed. The forward and reverse rotation of the servo motor 85 causes the transfer head unit 82 to move between the pickup position of the bare chip 61 (the position indicated by the solid line in FIG. 1) and the transfer position (the position indicated by the one-dot chain line in FIG. 1). It is possible to advance and retreat in a diagonal direction between the spaces.

As shown in detail in FIG. 3, the transfer head unit 82 includes a base 822 fixed to the nut portion 86 via a bracket 821, a lifting motor 823 held by the base 822, and The suction nozzles 824, 825, and 826 serving as a plurality of types (three types in the figure; described below as three types) corresponding to the chip sizes or types, and the three types are rotated by rotation about the horizontal axis H1. Suction nozzles 824, 825, 8
26, a posture conversion motor 827 which also serves as a rotation drive unit for exchanging nozzles and an inversion drive unit for upside down, switching between vacuum pressure for vacuum suction and positive pressure for disconnection for the suction nozzles 824, 825, 826. And a negative pressure supply 828 for performing supply and the like. The attitude changing motor 827 and the negative pressure supply 828 are integrally held by a support 829.
A guide 22 (not shown) is movably guided in a vertical direction (Z-axis direction).

The support 829 has an arm 830 projecting toward the base 822.
Is a cam 8 fixed to the operating shaft of the elevating motor 823.
31 is rotated vertically about the horizontal axis H2, and as a result, the support 829 and the support 82 are moved upward and downward.
The entirety of the suction nozzles 824, 825, 826 held at 9 is moved up and down. The suction nozzles 824, 825, 826 are individually held by three holding arms 833, 833,... Projecting radially from a rotating shaft 832 arranged along the horizontal axis H1, and the rotating shaft 832 Are rotated by receiving the rotation driving force of the attitude conversion motor 827 via a belt 834 stretched over a pair of pulleys. And
For example, when the rotation of the posture changing motor 827 is controlled by 180 degrees from the state shown in FIG.
24 rotates 180 degrees around the horizontal axis H1 and flips upside down,
When the nozzle is rotated by 60 degrees, the other suction nozzle 825 is directed downward from the suction nozzle 824, and the suction nozzle is replaced.

FIG. 4 is a partially omitted perspective view showing the arrangement in the chip supply section 62. In the figure, reference numeral 91 denotes an optical system (camera) for chip recognition, and 92 denotes an ejector.

The camera 91 and an ejector pin 931 or 941 of the ejector means 92, which will be described later, are disposed at a pickup position P vertically sandwiching the bare chip 61 to be picked up on the wafer holder 67. By adjusting the movement of the stage 65, the bare chips 61 are sequentially positioned and picked up.

As shown in FIG. 5, a plurality of types of the ejector means 92 (two in the example shown in FIG.
Ejector pin units 93, 94, a bracket 95 (see FIG. 4) for holding the two types of ejector pin units 93, 94, and the bracket 95 is driven to rotate about a horizontal axis H3. A conversion drive unit (not shown) for selectively converting the ejector pin units 93 and 94 into the pickup position P, and a push-up mechanism 96 that pushes up the ejector pins of the ejector pin unit at the pickup position. The push-up mechanism 96 rotates the push-up portion 961 via, for example, a link mechanism, and collides the push-up portion 961 with the ejector pin base end side to push up the ejector pin upward.

Each of the above ejector pin units 93 and 94
Includes ejector pins 931 or 941 and housings 923 and 942 for holding the ejector pins 931 and 941 so as to be able to move forward and backward.
The ejector pins 931 and 941 push up the wafer sheet 69 by operating the push-up mechanism 96 in a state where the back surface of the wafer sheet 69 (see FIG. 4) is vacuum-sucked through suction holes (not shown) at the front end surfaces of the 32 and 942. By pushing the bare chip 61 upward while bending, the contact portion between the wafer sheet 69 and the bare chip 61 is reduced.

One ejector pin unit 93 is provided with three ejector pins 931, 931 and 931 for a relatively large size bare chip 61, and the other ejector pin unit 94 is a relatively small size bare chip 61. One ejector pin 94 for
1 is provided. 4 shows a state in which the ejector pin unit 93 is located at the pickup position P, and FIG. 5 shows a state in which the ejector pin unit 94 is located at the pickup position P. The number of ejector pins 931 in one ejector pin unit 93 is not limited to three, and may be two or four or more.

The transfer of the bare chip 4 and the mounting on the substrate 3 will be described below. In FIG. 4, the bare chip 61 to be picked up is moved to the pickup position P by the horizontal movement of the XY stage 65 in the X-axis direction and the Y-axis direction.
In this state, if it is determined that the product is good by the chip recognition by the camera 91, the transfer head unit 82 is horizontally moved in the R-axis direction and the suction nozzle 824 is picked up between the bare chip 61 and the camera 91. The position is set to the position P. Then, the suction nozzle 824 is lowered by driving the lifting / lowering motor 823, and the bare chip 61 is vacuum-sucked by the suction nozzle 824 almost in synchronization with the pushing up of the bare chip 61 by the ejector pin 931.

Next, after the suction nozzle 824 is raised, the servo motor 8
5 (see FIG. 1) to drive the transfer head unit 82.
Is transferred to the transfer position in the R-axis direction as it is. At this transfer position, the bare chip 61 that has been sucked by the elevating operation of the suction nozzle 824 is transferred to the transfer stage 63.
Place on top. Then, the mounter head unit 5 is horizontally moved to the transfer position by the driving of the servo motors 10 and 12, and is moved up and down at the transfer position to thereby move the bare chip 6 on the transfer stage 63.
The vacuum-adsorbed bare chip 61 is transferred to the substrate 3 by the mounter head unit 5 and mounted in the face-up state. When the bare chip 61 is transferred from the transfer head unit 82 to the mounter head unit 5, the transfer stage 65 is appropriately moved up and down to adjust the vertical position.

On the other hand, in the case of the transfer by the posture inversion method, the suction nozzle 824 is rotated by 180 degrees by the drive of the posture conversion motor 827 during the transfer to the transfer position of the transfer head unit 82, and the suction is performed. The attitude of the bare chip 61 is turned upside down to be in a face-down state. When the transfer head unit 82 reaches the delivery position, the mounter head unit 5 moves to the delivery position and vacuum-adsorbs the bare chip 61 in the face-down state.
One transfer head unit 82 The bare chip 61 is transferred to the substrate 3 by the mounter head unit 5 and is mounted face down.

The mounting operation of the entire composite mounting machine is performed, for example, as follows. That is, after the printed board P to be mounted is first carried in by the conveyor 2 and stopped at a predetermined mounting work position, the component to be mounted based on the component mounting data and the like stored in advance for the printed board P is determined. It is determined. If the component to be mounted is a bare chip, the mounting of the bare chip supplied from the bare chip supply unit 62 is performed as described above. On the other hand, when the component to be mounted is a completed electronic component, the component sucked from the component supply unit 4 by the mounter head unit 5 is mounted on the printed circuit board P.

Note that the present invention is not limited to the above-described embodiment, but includes various other embodiments. For example, in the above embodiment, the upside down of the suction nozzle 824 of the transfer unit 82 is performed in the middle of the transfer from the pickup position to the transfer position. However, the present invention is not limited to this, and if the upside down is performed during the transfer. The upside-down may be performed after pickup at the pickup position or after reaching the transfer position.

[0044]

As described above, the chip transfer device of the present invention comprises a first suction head for sucking and transferring chips from a chip supply unit, and a reversing drive unit for enabling the first suction head to be turned upside down. And a transfer stage for mounting the chip separated from the first suction head in the non-reversal drive state, and selectively suction the chip from one of the first suction head and the transfer stage in a vertically inverted state. Since the apparatus has the second suction head, both the attitude maintaining transfer method and the attitude change transfer method can be executed by the same apparatus, and the mounting attitude to the substrate is in a face-up state or a face-down state. Regardless of the state, it can be shared by one device. As a result, it is possible to obtain tremendous effects such as a reduction in equipment cost, a reduction in manufacturing cost of semiconductor products, and a reduction in space of equipment.

Further, the chip supply unit is provided with ejector means for pushing up the chip, and the ejector means mutually converts the position of the plurality of ejector pin units corresponding to the chip size and the plurality of ejector pin units by rotation. With the configuration including the conversion drive unit, it is possible to convert to an appropriate ejector pin unit according to the chip size, and the chips can be more reliably peeled off from the wafer sheet.

In addition, the first suction head includes a central shaft disposed in a horizontal direction, a plurality of heads disposed so as to protrude radially from the central shaft, and the central shaft described above. A chip provided by a chip supply unit, comprising: a rotation drive unit that rotates a specific head unit selected from the plurality of head units according to a chip size by rotating the head unit around a central axis, thereby positioning the head unit downward. Can be converted into an appropriate specific head unit according to the size of the first suction head, and suction and transfer by the first suction head can be performed more reliably.

[Brief description of the drawings]

FIG. 1 is an overall plan view in a case where an embodiment of the present invention is applied to a multi-function device.

FIG. 2 is an explanatory side view of the mounter head unit with a part omitted;

FIG. 3 is a perspective view in which a transfer head unit is partially omitted.

FIG. 4 is a partially omitted perspective view showing an arrangement in a chip supply unit.

FIG. 5 is an explanatory sectional view showing an operation principle of the ejector means.

[Explanation of symbols]

Reference Signs List 20 second suction head 61 bare chip 62 chip supply unit 63 transfer stage 67 wafer holder 82 transfer head unit (first suction head) 92 ejector means 93, 94 ejector pin unit 824-826 suction nozzle 827 attitude conversion motor (reversing drive) 832 Rotating shaft (center shaft)

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E313 AA03 AA11 AA15 AA31 CC02 CC03 CC04 CC09 CD05 DD01 DD02 DD03 DD05 DD07 DD13 DD23 DD33 EE01 EE02 EE05 EE24 EE25 EE34 EE35 EE37 FF01 FF05 FF06 FF24 FF25 FA05 FA04 FA14 FA01

Claims (3)

[Claims] An attitude maintaining transfer method for transferring chips from the chip supply unit while maintaining a supply attitude in the chip supply unit, and transferring the chips from the chip supply unit with an upside down operation from the supply posture. What is claimed is: 1. A chip transfer device for selectively performing transfer of chips by both a transfer method and an attitude reversal transfer method, comprising: a first suction head for sucking chips from the chip supply unit and transferring the chips in a horizontal direction; A reversing drive unit for selectively reversing the first suction head in the up and down direction by rotation about a horizontal axis;
A transfer stage for mounting the chip sucked by the first suction head in the non-inverting drive state while separating the chip from the first suction head, and a first stage in a state where the chip is turned upside down by the inversion driving unit.
A chip transfer device, comprising: a suction head and a second suction head for selectively sucking a chip from any one of the transfer stages and transferring the chip to a substrate to be mounted. 2. The chip supply section includes ejector means for pushing up a chip from a lower position when the chip is sucked by a first suction head, and the ejector means includes a plurality of types of ejectors corresponding to chip sizes. 2. The chip transfer device according to claim 1, further comprising: a pin unit; and a conversion drive unit configured to convert the positions of the plurality of types of ejector pin units by rotation. 3. The first suction head includes a central shaft disposed in a horizontal direction, a plurality of heads disposed so as to project in a radial direction from the central shaft, and a center disposed around the central shaft. The chip according to claim 1, further comprising: a rotation drive unit configured to rotate a rotation about an axis to position a specific head unit selected from the plurality of head units according to a chip size in a downward direction. Transfer device.