JP2009259917A - Mounting device and method of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting device capable of reducing a cycle time required for mounting a semiconductor chip. <P>SOLUTION: This mounting device is provided with: a pair of mounting tools 8 arranged, drivably in the horizontal and vertical directions, above a transport rail 1 transporting a board to be positioned at a mounting position; a pair of movable mounters 12 reciprocatively driven between a supply position for supplying and mounting a semiconductor chip and a transfer position for transferring the semiconductor chip mounted at the supply position to the mounting tools; a pair of imaging cameras 27 imaging the semiconductor chip mounted on the movable mounters when the movable mounters are positioned at the transfer position; and a control device 14 positioning the pair of mounting tools above the semiconductor chip based on the imaging of the imaging cameras and thereafter causing the mounting tools to extract the semiconductor chip from the movable mounters by driving them in the descending direction to be mounted on the board at the mounting position. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting apparatus and mounting direction for mounting electronic components on a substrate that has been transported and positioned.

  A mounting apparatus for mounting a semiconductor chip as an electronic component on a substrate such as a carrier tape or a lead frame includes a wafer stage serving as a semiconductor chip supply unit. A semiconductor wafer affixed to the adhesive sheet is held on the wafer stage. This semiconductor wafer is cut into a large number of dice-shaped semiconductor chips.

  Semiconductor chips are picked up and taken out one by one from the wafer stage. The semiconductor chip taken out from the wafer stage is mounted on the substrate. In mounting a semiconductor chip on a substrate, a method of mounting the semiconductor chip by inverting 180 degrees in the upside down direction and a method of mounting without changing the vertical direction of the semiconductor chip are known.

  In any system, it is required to shorten the tact time in order to improve productivity. In order to shorten the tact time, it is necessary to speed up the mounting of the semiconductor chip on the substrate by the mounting tool after the semiconductor chip is taken out from the supply unit and taken out.

  However, since there is a limit to the speed of taking out and mounting the semiconductor chip, there has been a limit in improving the productivity by efficiently mounting the semiconductor chip on the substrate.

Therefore, in Patent Document 1, two pick-up tools for picking up semiconductor chips from the wafer stage and two mounting tools for mounting the semiconductor chips picked up by the pick-up tool on the substrate are provided to improve the mounting speed of the semiconductor chips on the substrate. I have to.
WO2007 / 072714 A1

  As shown in Patent Document 1, if two pickup tools and two mounting tools are provided, the mounting speed can be shortened and productivity can be improved as compared with the case of one.

By the way, in Patent Document 1, when a semiconductor chip is taken out from the wafer stage by a pickup tool, the semiconductor chip is transferred to a mounting tool.
According to such a configuration, when the mounting tool mounts the semiconductor chip on the substrate, it cannot receive the semiconductor chip from the pickup tool, and when the pickup tool takes out the semiconductor chip from the wafer stage, the mounting tool picks up the pick-up tool. It is impossible to receive a semiconductor chip from.

  Therefore, the mounting tool must move to the supply position where the semiconductor chip can be received from the pick-up tool after the mounting of the semiconductor chip is completed, and then move to the mounting position where the semiconductor chip is mounted on the substrate and mount it. Therefore, a series of these operations must be performed in series, and cannot be performed in parallel.

  That is, the time for the mounting tool to move to the supply position to receive the semiconductor chip from the pickup tool and the time to move to the mounting position after receiving the semiconductor chip are included in the tact time required to mount the semiconductor chip on the substrate. As a result, the travel time of the mounting tool in the tact time becomes relatively long, and there is a limit in shortening the tact time.

  The present invention provides an electronic component mounting apparatus that improves productivity by shortening the movement time of the mounting tool when the mounting tool receives the electronic component or mounts the received electronic component on the substrate. And providing a mounting method.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
Conveying means for conveying a substrate and positioning it at a mounting position;
A pair of mounting tools provided so as to be able to be driven in the horizontal and vertical directions above the conveying means;
A supply position provided on one side of the transfer means so as to be drivable along the transfer direction of the substrate, and the electronic component mounted and supplied to the mounting tool. A pair of movable platforms that are driven back and forth between positions;
A pair of imaging means for imaging each of the electronic components placed on the movable placement body when the movable placement body is positioned at the delivery position;
Based on the imaging of the imaging means, the pair of mounting tools are positioned above the electronic components mounted on the pair of movable mounting bodies, and then driven in the downward direction from the pair of movable mounting bodies. There is provided an electronic component mounting apparatus comprising: a control unit that takes out an electronic component and mounts the electronic component on the board positioned at the mounting position.

  The electronic component supply unit, and a pair of transfer means for supplying and mounting the electronic component on the pair of movable mounting bodies that are taken out from the supply unit and positioned at the supply position. Is preferred.

  The pair of movable mounting bodies are positioned at a predetermined interval at a supply position where the electronic component is supplied and mounted, and are driven away from the supply position to place the electronic component on the mounting tool. It is preferable to be positioned at a delivery position for delivery.

This invention is a mounting method for mounting an electronic component on a substrate,
A step of conveying the substrate and positioning the mounting position where the electronic component is mounted;
A pair of movable mounting bodies that are driven between a supply position to which the electronic component is supplied and a delivery position that is spaced apart from the supply position by a larger distance, and that are positioned at the supply position. Supplying electronic components to the mounting body;
Positioning a pair of movable mounting bodies supplied with electronic components at the delivery position;
Imaging the electronic component placed on the movable placing body at the delivery position and recognizing its position;
And a step of receiving the electronic component from the pair of movable mounting bodies by the pair of mounting tools based on the position recognition of the electronic component and mounting the electronic component on the substrate.

  It is preferable that the electronic components are simultaneously mounted on different substrates by a pair of mounting heads.

  According to the present invention, the electronic component is supplied to the movable mounting body that is driven along the conveyance direction of the substrate, and the electronic component is taken out from the movable mounting body by the mounting tool and mounted on the substrate.

  Therefore, while the mounting tool is mounting the electronic component on the board, the electronic component to be mounted next can be supplied to the movable mounting body, and can be transported and waited near the mounting position by the movable mounting body. Therefore, when the mounting is completed, the next mounting can be performed with little time for moving the mounting tool.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view of the mounting device, and FIG. 2 is a front view of the mounting device. The mounting device includes a pair of transport rails 1 arranged in parallel and spaced apart from each other at a predetermined interval as transport means. . A plurality of substrates W are supplied to the transport rail 1 from a supply unit (not shown) and transported in the X direction by a chuck 2 as transport means. The X direction and the Y direction orthogonal to the X direction are indicated by arrows in FIG.

  Among a plurality of substrates W transported along the transport rail 1, two sheets positioned on the front end side in the transport direction at a mounting position where a semiconductor chip t as an electronic component is mounted on the substrate W, shown by B in FIG. 1. The substrates W are positioned at intervals of the pitch P.

  As shown in FIG. 2, a pair of mounting heads 3 are disposed above the mounting position B at a predetermined interval along the transport direction of the substrate W. The mounting head 3 includes a head body 5 that is driven by an X / Y drive source 4 in the X and Y directions, that is, in the horizontal direction. A Z movable body 6 is provided on one side of the head body 5 so as to be driven by a first Z drive source 7 (shown in FIGS. 2 and 3) such as a linear motor in the Z direction, which is the vertical direction indicated by an arrow. It has been. The Z movable body 6 is provided with a mounting tool 8, and the mounting tool 8 is driven by a θ drive source 9 in the rotation direction around an axis perpendicular to the horizontal plane. That is, the mounting tool 8 can be positioned in the X, Y, Z, and θ directions.

  As shown in FIG. 1, the linear guide body 11 is in the X direction, which is the direction in which the substrate W is conveyed, at the side of the conveyance rail 1, that is, at the portion corresponding to the mounting position B on the −X direction side of the conveyance rail 1 Are arranged horizontally along. The linear guide body 11 is provided with a pair of movable mounting bodies 12 so as to be driven along the transport direction of the substrate W.

  The pair of movable mounting bodies 12 are separately driven along the linear guide body 11 as described later by a pair of linear motors 15a and 15b whose driving is controlled by the control device 14 shown in FIG. ing.

  Although not shown in detail, the linear motors 15a and 15b are composed of a permanent magnet provided on one of the linear guide body 11 and the movable mounting body 12 and an electromagnet provided on the other, and the electromagnet is energized. By controlling the above, the movable mounting body 12 can be driven along the linear guide body 11.

  The pair of movable mounting bodies 12 is supplied with a semiconductor chip t as an electronic component taken out from the supply unit 18 by a pair of transfer mechanisms 17 as transfer means. The supply unit 18 has a wafer ring 18a mounted on an XY table (not shown) and driven in the X and Y directions.

  As shown in FIG. 2, the wafer ring 18a can be driven in the X and Y directions below the transport rail 1 and the linear guide body 11, and the upper surface thereof is a semiconductor divided into a number of semiconductor chips t. A resin sheet 19 to which the wafer T is adhered is stretched.

  A first imaging camera 20 is provided above the wafer ring 18a. The first imaging camera 20 images the semiconductor wafer T. The imaging signal of the first imaging camera 20 is converted into a digital signal by the image processing unit 28 shown in FIG. 3 and output to the control device 14, where it is image-processed. As a result, the X and Y coordinates of the semiconductor chip t held on the wafer ring 18a are recognized, and the semiconductor chip t to be picked up is positioned at the pickup position as will be described later based on the recognition. .

  The wafer ring 18a is stacked and stored at a predetermined interval in a vertical direction in a stocker (not shown), and is sequentially supplied from the stocker to the XY table.

  The pair of transfer mechanisms 17 includes a movable body 21. The movable body 21 is provided so as to be movable in the Z direction along the guide surface of the Z guide body 22, and is driven in the Z direction by a second Z drive source 21 a provided on the Z guide body 22. Yes.

  A pair of arm bodies 24 driven along the X direction and the Y direction perpendicular to the X direction by the X, X, and Y driving sources are placed along the X direction so that the distal ends of the pair of movable bodies 21 approach each other. It is extended. The arm body 24 is positioned above the wafer ring 18a, and suction nozzles 25a and 25b are provided at the tips with their axes perpendicular to each other. Therefore, the suction nozzles 25a and 25b are driven by the arm body 24 in the Y direction and the Z direction.

The pair of suction nozzles 25a and 25b picks up the semiconductor chip t held on the wafer ring 18a and supplies and places it on the pair of movable mounting bodies 12 as follows. That is, the pair of suction nozzles 25a and 25b are respectively positioned in the X and Y directions at the pickup positions for receiving the semiconductor chip t. That is, the pick-up positions of the pair of suction nozzles 25a and 25b are the same position in the Y direction and are spaced apart from each other by the interval D shown in FIG.
The semiconductor chip t is picked up at an intermediate position in the X direction in the X direction of the distance D between the pair of suction nozzles 25a and 25b.

  On the other hand, the pair of movable mounting bodies 12 are positioned at the same distance D as the pair of suction nozzles 25a and 25b, and are positioned at the same position in the Y direction as the pair of suction nozzles 25a and 25b as shown in FIG. Yes. This position of the pair of movable mounting bodies 12 is defined as a supply position S.

  Of the multiple semiconductor chips t held by the sheet 19 on the wafer ring 18a, the semiconductor chip t to be picked up is positioned at the pickup position, which is the center position in the X direction of the pair of suction nozzles 25a and 25b. The semiconductor chip t is pushed up by a push-up pin (not shown). The pushed-up semiconductor chip t moves by a distance of D / 2 in the −X direction and is sucked and held by one suction nozzle 25a positioned at the pickup position.

  One suction nozzle 25a that sucks and holds the semiconductor chip t, that is, one arm body 24 is driven above the one movable mounting body 12 that is driven in the + X direction and the + Y direction and is positioned at the supply position S. Next, one suction nozzle 25a is driven in the downward direction as shown in FIG. 4A, and the semiconductor chip t sucked and held at the tip thereof is supplied and placed on the upper surface of the movable placement body 12.

  When the semiconductor chip t is delivered to one suction nozzle 25a, the wafer ring 18a is driven in the X and Y directions, and the semiconductor chip t to be picked up next is positioned at the pickup position. The positioned semiconductor chip t is pushed up by a push-up pin (not shown) and sucked and held by the other suction nozzle 25b that has moved to that position.

  The arm body 24 provided with the other suction nozzle 25b that sucks and holds the semiconductor chip t is driven in the + X and + Y directions and is positioned at the supply position S as shown in FIG. 12 moves up. Next, the suction nozzle 25 b is driven in the downward direction, and the semiconductor chip t sucked and held at the tip is supplied and mounted on the upper surface of the movable mounting body 12.

  The pair of movable mounting bodies 12 on which the semiconductor chip t is supplied and mounted on the upper surface are driven in the X direction away from each other, that is, in the opposite direction from the distance D, and are transported as shown in FIG. At the same interval as the pitch P of the two substrates W positioned at the mounting position B of the rail 1, and at a position corresponding to the front end portion that is the starting end of the mounting of each substrate W in the Y direction. This position of the pair of movable mounting bodies 12 is referred to as a delivery position H. In FIG. 1, a pair of movable mounting bodies 12 positioned at the delivery position H are indicated by chain lines.

  The pair of movable mounting bodies 12 are positioned at the delivery position H at substantially the same position as the pair of mounting heads 3 in the Y direction.

  The semiconductor chip t placed on the upper surface of the pair of movable placement bodies 12 positioned at the delivery position H is imaged by a pair of second imaging cameras 27 as imaging means arranged above the delivery position H. Is done.

  The image pickup signal of the second image pickup camera 27 is converted into a digital signal by the image processing unit 28 shown in FIG. 3 and output to the control device 14, where it is image-processed. Thereby, the positions of X, Y and θ of the semiconductor chip t placed on the upper surface of the movable placing body 12 are recognized.

  The pair of mounting heads 3 are controlled in driving in the X and Y directions based on the position recognition of the pair of semiconductor chips t by the control device 14, and the mounting tool 8 of each mounting head 3 is mounted on the pair of movable mounting bodies 12. Positioned above the placed semiconductor chip t. Next, the mounting tool 8 is driven in the downward direction to ascend after adsorbing the semiconductor chip t mounted on the upper surface of the movable mounting body 12.

  The raised mounting tool 8 is driven in the + Y direction and positioned above the substrate W positioned at the mounting position B on the transport rail 1. Next, the mounting tool 8 is driven in the downward direction. Thereby, the semiconductor chip t sucked and held by the mounting tool 8 is mounted on the substrate W by, for example, an adhesive tape.

  As an example, a plurality of semiconductor chips t are mounted on the substrate W in a matrix as shown in FIG. That is, a plurality of semiconductor chips t are mounted on the substrate W in four rows m1 to m4 at intervals of p1 in the Y direction and in 12 columns at intervals of p2 in the X direction.

  When the semiconductor chip t is simultaneously mounted on the two substrates W by the pair of mounting tools 8, one mounting tool 8 positioned in the + X direction among the pair of mounting tools 8 is the first on the one substrate W. The semiconductor chip t is mounted at the column position indicated by a1 in the m2 row, and the other mounting tool 8 mounts the semiconductor chip t at the column position indicated by b1 in the m1 row of the other substrate W.

  When the semiconductor chip t is completely mounted at the positions of the columns a1 and b1 in the rows m2 and m1, the pair of substrates W is transported in the + X direction at a distance corresponding to the column direction interval p2. That is, the a2 and b2 rows of the substrate W on which the semiconductor chip t is mounted next are positioned so as to correspond to the pair of movable mounting bodies 12 positioned at the transfer position H in the Y direction.

  On the other hand, when the semiconductor chip t is taken out from the movable mounting body 12 in which the pair of mounting tools 8 is positioned at the delivery position H, the pair of movable mounting bodies 12 returns to the supply position S. A new semiconductor chip t picked up from the wafer ring 18 a by the suction nozzles 25 a and 25 b of the transfer mechanism 17 is supplied to the pair of movable mounting bodies 12 returned to the supply position S. Then, the pair of movable mounting bodies 12 to which the new semiconductor chip t is supplied return to the delivery position H and stand by.

  Therefore, when the pair of mounting tools 8 having the semiconductor chips t mounted on the columns of the two rows of the two substrates W return from the mounting position B to the delivery position H, a new semiconductor chip t is placed on the upper surface. Since the movable mounting body 12 is waiting, the mounting tool 8 receives the semiconductor chip t and mounts the semiconductor chip t in the next column of the m2 row and the next column of the m1 row of the substrate W. be able to.

  In this way, if the semiconductor chips t are sequentially mounted on the columns a1 to a12 of the m2 row and the columns b1 to 12 of the m1 row of the two substrates W, the pair of substrates W is in the −X direction. To return to the original position (initial position) in the X direction. Next, the semiconductor chip t is mounted on the m4 row for one substrate W located on the tip side in the X direction, and the semiconductor chip is mounted on the m3 row for the other substrate W on the rear side. Implement t.

  If two rows of semiconductor chips t are mounted on each substrate W by the pair of mounting tools 8, the front-side substrate W positioned on the + X side is sent out from the mounting position B, and the rear substrate W is mounted on the mounting position B. Is positioned at the position of the substrate W on the leading end side. Further, a new substrate W is supplied to the mounting position B, and is positioned at a predetermined interval with respect to the tip side substrate W.

  Then, as described above, the semiconductor chip t is mounted on the m2 and m4 rows with respect to the substrate W on the front end side, and m1 and m3 are mounted on the substrate W on the rear end side. The semiconductor chip t is mounted on the row. As a result, the semiconductor chips t are mounted on the front-side substrate W in four rows m1 to m4.

  When mounting of the semiconductor chip t on the substrate W is started, the semiconductor chip t is supplied to the mounting position B so that the substrate W on which the semiconductor chip t is mounted in advance in the rows m1 and m3 is on the front end side. As a result, the semiconductor chips t are mounted on the four rows m1 to m4 on the front-side substrate W that is first sent out from the mounting position B.

  In addition to the linear motors 15a and 15b, the control device 14 includes an X / Y drive source 4, a first Z drive source 7, a θ drive source 9, and a second Z drive source 21a as shown in FIG. The driving of the X / Y driving source is controlled.

  According to the mounting apparatus having such a configuration, the linear guide body 11 is provided along the X direction on the −Y side of the transport rail 1, which is one side of the transport rail 1. A pair of drives driven along the X direction between a supply position S where the semiconductor chip t is supplied from the transfer mechanism 17 and a delivery position H where the semiconductor chip t is delivered to the mounting tool 8 of the pair of mounting heads 3. The movable mounting body 12 was provided.

  Therefore, while the mounting tool 8 receives the semiconductor chip t from the pair of movable mounting bodies 12 positioned at the transfer position H and the semiconductor chip t is mounted on the substrate W, the movable mounting body 12 is supplied. Returning to the position S, receiving the supply of the semiconductor chip t from the transfer mechanism 17 and moving to the transfer position H, waiting for the mounting tool 8 to mount the semiconductor chip t on the substrate W and return to the supply position S. it can.

  In particular, when the adhesive tape is heated and cured to mount the semiconductor chip t on the substrate W, a predetermined time is required until the tape is cured. Accordingly, after the mounting tool 8 receives the semiconductor chip t from the pair of movable mounting bodies 12 and finishes mounting on the substrate W, the pair of movable mounting bodies 12 returns to the supply position S and receives a new semiconductor chip t. It has a time during which it can receive and return to the delivery position H and wait.

  As described above, the semiconductor chip t picked up by the transfer mechanism 17 from the wafer ring 18 a is not directly delivered to the mounting tool 8, but is supplied to the pair of movable mounting bodies 12 and then delivered to the mounting tool 8. .

  Therefore, the mounting of the semiconductor chip t on the substrate W by the mounting tool 8, the removal of the semiconductor chip t from the wafer ring 18 a by the transfer mechanism 17, and the transport to the delivery position H after the removal are performed in parallel. it can. As a result, the tact time required for mounting the semiconductor chip t on the substrate W can be reduced as compared with the case where these operations are performed in series.

  In addition, the pair of movable mounting bodies 12 are provided at intervals corresponding to the pair of suction nozzles 25a and 25b of the pair of transfer mechanisms 17 to which the semiconductor chip t taken out by the transfer mechanism 17 is supplied (FIG. 4A). ) And the semiconductor chip t supplied and placed at the supply position S to the pair of mounting tools 8 (see FIG. 4B). And a delivery position H (denoted by P).

  Therefore, the mounting tool 8 only moves in the Y direction between the transfer position H and the corresponding mounting position B in the Y direction, and the semiconductor chip t is placed on the substrate W positioned at the mounting position B. Can be implemented.

  That is, the mounting tool 8 can mount the semiconductor chip t on the substrate W only by moving slightly in the Y direction without moving in the X direction, so that no complicated vibration is generated due to the movement of the mounting head 8. . Accordingly, there is no need to wait for the semiconductor chip t to be taken out from the supply position S or mounted on the substrate W until the vibration associated with the movement of the mounting head 8 is attenuated. Improvements can be made.

Moreover, since the pair of movable mounting bodies 12 are provided on the linear guide body 11 disposed on the side of the transport rail 1, the mounting tool 8 is moved between the delivery position H and the mounting position B in the Y direction. In contrast, there is almost no movement.
Therefore, the tact time at the time of mounting can be shortened even when the moving distance of the mounting tool 8 in the X direction and the Y direction is small.

  The mounting of the semiconductor chip t on the substrate W is performed simultaneously by the pair of mounting tools 8. Therefore, it is possible to mount the semiconductor chip t on a single substrate W at a speed approximately twice that in the case where the semiconductor chips t are mounted one by one with the single mounting tool 8.

  In addition, since the semiconductor chip t is separately mounted on the two substrates W by the pair of mounting tools 8, the distance between the pair of mounting tools 8 depends on the pitch P along the X direction of the two substrates W. Can be bigger.

  Therefore, even if the semiconductor chip t is simultaneously mounted by the pair of mounting tools 8, the pair of mounting heads 3 provided with the mounting tool 8 can be prevented from interfering with each other.

  When the length dimension of the substrate W is shortened and the pitch P between the two substrates W is decreased, the delivery position H of the pair of movable mounting bodies 12 is also set according to the pitch P. In that case, since the distance between the pair of movable mounting bodies 12 positioned at the delivery position H is also reduced, the semiconductor chip t supplied to the movable mounting body 12 at the supply position S is supplied to the mounting tool 8. Time is also shortened. In this case, the distance between the pair of second imaging cameras 27 is set and positioned to be the same as the distance between the pair of substrates W.

  In this embodiment, when the semiconductor chip is mounted on the substrate, m2 rows are mounted on the substrate located on the front side in the transport direction, and then the substrate is returned to the −X direction to mount the semiconductor chips on the m4 row. I tried to do it.

  Instead, if the semiconductor chips are mounted at a1 of m2 rows and a1 of m4 rows, the semiconductor chips may be mounted in the order of a2 of m2 rows and a2 of m4 rows. In this case, the semiconductor chip is similarly mounted on the second substrate on the −X side from the top substrate.

The top view which shows schematic structure of the mounting apparatus of one embodiment of this invention. The front view which shows schematic structure of the mounting apparatus shown in FIG. The block diagram with a control system. (A) is explanatory drawing when a pair of movable mounting body is positioned in the supply position of a linear guide body, (b) is description when a pair of movable mounting body is positioned in the delivery position of a linear guide body. Figure. Explanatory drawing when mounting a semiconductor chip with a pair of mounting tool with respect to two board | substrates.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Conveyance rail (conveyance means), 2 ... Chuck (conveyance means), 3 ... Mounting head, 8 ... Mounting tool, 11 ... Linear guide body, 12 ... Movable mounting body, 17 ... Transfer mechanism (transfer means) , 18 ... supply section, 18a ... wafer ring, 20 ... first imaging camera, 25a, 25b ... suction nozzle, 27 ... second imaging camera (imaging means), B ... mounting position, S ... supply position, H ... Delivery position.

Claims (5)

A mounting device for mounting electronic components on a substrate,
Conveying means for conveying a substrate and positioning it at a mounting position;
A pair of mounting tools provided so as to be able to be driven in the horizontal and vertical directions above the conveying means;
A supply position provided on one side of the transfer means so as to be drivable along the transfer direction of the substrate, and the electronic component mounted and supplied to the mounting tool. A pair of movable platforms that are driven back and forth between positions;
A pair of imaging means for imaging each of the electronic components placed on the movable placement body when the movable placement body is positioned at the delivery position;
Based on the imaging of the imaging means, the pair of mounting tools are positioned above the electronic components mounted on the pair of movable mounting bodies, and then driven in the downward direction from the pair of movable mounting bodies. An electronic component mounting apparatus comprising: control means for taking out the electronic component and mounting the electronic component on the substrate positioned at the mounting position.   The electronic component supply unit, and a pair of transfer means for supplying and mounting the electronic component on the pair of movable mounting bodies that are taken out from the supply unit and positioned at the supply position. The electronic component mounting apparatus according to claim 1.   The pair of movable mounting bodies are positioned at a predetermined interval at a supply position where the electronic component is supplied and mounted, and are driven away from the supply position to place the electronic component on the mounting tool. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is positioned at a delivery position. A mounting method for mounting electronic components on a substrate,
A step of conveying the substrate and positioning the mounting position where the electronic component is mounted;
A pair of movable mounting bodies that are driven between a supply position to which the electronic component is supplied and a delivery position that is spaced apart from the supply position by a larger distance, and that are positioned at the supply position. Supplying electronic components to the mounting body;
Positioning a pair of movable mounting bodies supplied with electronic components at the delivery position;
Imaging the electronic component placed on the movable placing body at the delivery position and recognizing its position;
A step of receiving an electronic component from a pair of movable mounting bodies by a pair of mounting tools based on the position recognition of the electronic component and mounting the electronic component on the substrate.   5. The electronic component mounting method according to claim 4, wherein the electronic components are simultaneously mounted on different substrates by a pair of mounting heads.

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