JP2007324623A - Method of mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To handle an electronic component provided with its connection surface directed upwardly and an electronic component provided with its connection surface directed downwardly together by one apparatus, and to mount them with high precision and high speed in such a manner that the connected surfaces face the surfaces of the substrate. <P>SOLUTION: The method of mounting an electronic component includes steps of positioning a substrate 2 on a positioning section in an X direction; transporting an electronic component 3, which is supplied while orienting upward, on one side of a Y direction orthogonal to the X direction of the positioning section, and supplying the electronic component 3 to a first component supplying position A after being reversed upside down; supplying an electronic component 4, which is supplied on the other side of the Y direction while orienting downward, to a second component supplying position B; transporting the electronic component 3 positioned on the first component supplying position A toward the Y direction by a first mounting head; and transporting the electronic component 4 supplied on the second component supplying position B toward the Y direction by a second mounting head, and mounting the electronic component 4 on an arbitrary position in the Y direction of the substrate 2. These first and second mounting steps perform the different operation of the first and second mounting head, respectively. In the second mounting head, a plurality of chip components is held, and arbitrary chip component is selectively mounted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  In the present invention, an electronic component supplied with a connection surface such as a bare IC chip facing upward and an electronic component supplied with a connection surface such as a chip component facing downward are both connected to a substrate by a single device. The present invention relates to an electronic component mounting method for mounting on a substrate in a state of facing the surface.

  As an electronic component mounting apparatus that mounts electronic components on a substrate, a plurality of mounting heads are arranged at intervals of the intermittent rotation angle on the outer periphery of a rotating body that rotates intermittently, and each mounting head is located between a supply position and a mounting position. And move the component supply unit to the supply position by moving the component supply unit, position the predetermined mounting position of the board at the mounting position, and mount the electronic component at the predetermined position on the board with the mounting head Various methods, such as a method of positioning and fixing a substrate, a method of taking a predetermined electronic component from a component supply unit with a mounting head movable in the X and Y directions, and moving to a predetermined mounting position on the substrate Things are known.

  Further, in order to mount various types of electronic components on the board, as shown in FIG. 19, the board 62 carried in from the carry-in part 61 is positioned and fixed by the positioning table 63 and carried out from the carry-out part 64 after mounting. A first component supply unit 65 and a second component supply unit 66 having different electronic component supply methods are arranged on both sides of the positioning table 63 in the direction orthogonal to the substrate conveyance direction, and the mounting head 67 is arranged. The XY table 68 is configured to be movable in the XY direction between the two component supply units 65 and 66, and any electronic components of these component supply units 65 and 66 are taken out and mounted at arbitrary positions on the board 62. Is also known (for example, see Patent Document 1).

  Further, as an electronic component mounting apparatus for mounting a bare IC chip on a substrate, the bare IC chip is supplied onto an XY table in a diced wafer state, and a predetermined bare IC chip is supplied to the first supply position on the XY table. The reverse bearer holds the predetermined bare IC chip at the first supply position by the reverse transfer means, reverses it upside down and transfers it to the second supply position, and holds it by the mounting head at the second supply position. On the other hand, the substrate is placed and fixed on a support table movable in the Y direction by the Y direction table, the mounting head is moved to the X direction position of the mounting position on the substrate by the X direction table, and the mounting position on the substrate is changed. The substrate is moved by the Y direction table so that the Y direction position matches the Y direction position of the mounting head, and the mounting positions of the bare IC chip and the substrate are aligned, and then the mounting head That is configured to implement the IC chip is known (e.g., see Patent Document 2.).

  The bare IC chip is mounted on the substrate in a clean room or the like completely separate from the electronic component mounting step. This is because bare IC chips are highly integrated and miniaturized, so the number of electrodes and fine pitch are remarkably high, and high-precision mounting is required, and the mounting environment is clean in order to prevent poor bonding due to dust. This is because there is a strong demand for conversion.

Then, after the bare IC chip is mounted on the substrate in this way to configure the electronic component, the electronic component is supplied to the electronic component mounting apparatus together with the other electronic components and mounted on the substrate of the electronic device. .
JP 2000-91385 A JP 2000-68327 A

  By the way, in recent years, as IC integration has further increased, the size of the bare IC chip has increased, and as a result, the number of electronic components mounted on one substrate has been reduced, and at the same time, it has become portable. Substrate miniaturization is progressing for mounting on equipment and the like.

  However, if the mounting of bare IC chips and mounting of other electronic components are mounted in completely separate processes as in the above conventional example, the man-hours and costs for wasteful manufacturing processes and management / transport of parts increase. There is a demand for mounting a bare IC chip and other electronic components together on a single substrate.

  Therefore, both an electronic component supplied with a connection surface facing upward like a bare IC chip in one electronic component mounting apparatus and an electronic component supplied with a connection surface facing downward like a chip component Development of an electronic component mounting apparatus that can be mounted in a mixed manner is demanded, but no device that can realize such mounting with high accuracy and high speed has been proposed.

Further, for example, supply of bare IC components disclosed in Patent Document 2 (Japanese Patent Laid-Open No. 2000-68327) as the first or second component supply unit 65, 66 of the electronic component mounting apparatus shown in FIG. Although it is conceivable to provide means (XY table and reverse transfer means), since the mounting head 67 is mounted by moving the mounting head 67 in the XY direction on the XY table 68, the mounting accuracy is increased and the mounting speed is increased. There is a problem that high speed cannot be realized.
In view of such a situation, the present invention provides an electronic component that is supplied with a connection surface such as a bare IC chip facing upward and an electronic component that is supplied with a connection surface such as a chip component facing downward. It is another object of the present invention to provide an electronic component mounting method that can be mounted with high accuracy and high speed with the connection surface facing the substrate surface.

  In order to achieve the above object, an electronic component mounting method according to the present invention includes a step of positioning a substrate in an X direction in a positioning portion, and a side in a Y direction perpendicular to the X direction with respect to the substrate positioning portion. A step of supplying an electronic component in a state where a connection surface having an electrode to be connected to an electrode of the substrate is faced upward, and receiving the electronic component supplied upward and transporting it in the Y direction and turning it upside down A reversal transfer step of supplying to the component supply position, a step of supplying to the second component supply position an electronic component supplied with the connection surface facing downward on the other side in the Y direction with respect to the substrate positioning portion, A first mounting step in which the electronic component supplied to the first component supply position is held by the first mounting head, transferred in the Y direction, and mounted at an arbitrary position in the Y direction on the substrate on the substrate positioning unit; Second component supply position A second mounting step in which the electronic component supplied to the substrate is held by the second mounting head, transferred in the Y direction, and mounted at an arbitrary position in the Y direction on the substrate on the substrate positioning portion. The second mounting step is basically performed with each operation of the first and second mounting heads. Depending on the second mounting head, a plurality of chip components are held and an arbitrary chip component is used. The first feature is to selectively implement.

  According to the basic configuration as described above, the board is positioned in the X direction by the board positioning unit, and the electronic component supplied with the connection surface facing upward is turned upside down on one side in the Y direction of the board positioning unit. The electronic component supplied to the second component supply position is supplied to the second component supply position on the other side in the Y direction of the substrate positioning portion with the connection surface facing downward. By holding the electronic components at the first and second component supply positions in the mounting heads and moving / positioning in the Y direction, the predetermined electronic components can be mounted at the predetermined mounting positions on the substrate, Therefore, the electronic component supplied with the connection surface of the bare IC chip or the like facing upward and the electronic component supplied with the connection surface of the chip component or the like facing downward are both faced to the substrate surface in one device. Can be implemented in In addition, since each mounting head only needs to be linearly moved in one direction and positioned, high-precision and high-speed mounting can be realized, and the first mounting head and the second mounting head can be independently provided. By moving and driving, one mounting head can hold the component from its component supply position at the other mounting head and complete the operation until just before the mounting operation. Can be realized. In particular, according to the configuration of the first feature, a plurality of chip components can be held and supplied by a single transfer to the second component supply position, and mounting of chip components having a relatively large number of mounting points can be efficiently performed. As a whole, the mounting efficiency can be improved.

  The electronic component mounting method of the present invention has a second feature that, in addition to the basic configuration of the above invention, the reversal transfer is performed by simultaneously holding a plurality of electronic components. According to the configuration of the second feature as described above, since the tact time for supplying the electronic component supplied upward is reversed up and down to the first component supply position, the mounting tact for each substrate is reduced. When the mounting efficiency is long and the mounting efficiency is lowered, a plurality of electronic components can be supplied by one reciprocating operation, so that the mounting efficiency can be greatly improved.

  In addition, when the first mounting head includes a plurality of heads each holding and mounting an electronic component, the plurality of electronic components can be held and mounted at a time from the first component supply position. In addition, the step of reciprocating the first mounting head between the first component supply position and the mounting position can be omitted, and higher-speed mounting can be realized.

  Further, as another configuration of the electronic component mounting method of the present invention, a step of positioning the substrate in the Y direction perpendicular to the X direction of the substrate transport direction in the positioning unit, and one side in the X direction with respect to the substrate positioning unit, A step of supplying an electronic component with a connection surface having an electrode connected to an electrode of a substrate facing upward; a first component that receives the electronic component supplied upward and transports it in the X direction; A reversal transfer step of supplying to the supply position, a step of supplying an electronic component supplied with the connection surface facing downward on the other side in the X direction with respect to the substrate positioning portion to the second component supply position, A first mounting step in which an electronic component supplied to one component supply position is held by a first mounting head, transferred in the X direction, and mounted at an arbitrary position in the X direction on the substrate positioning unit; Second component supply level A second mounting step in which the electronic component supplied to the substrate is held by the second mounting head, transferred in the X direction, and mounted at an arbitrary position in the X direction of the substrate on the substrate positioning portion. The second mounting step can obtain the same effect even when the first and second mounting heads are performed with different operations.

  Also, when the step of supplying the electronic component upward is performed on the bare IC chip with the connection surface having a plurality of protruding electrodes facing upward, the bare IC chip and the surface mounting component such as the chip component are mixedly mounted on the substrate. be able to.

  The step of supplying the electronic components upward is performed in a state where a plurality of electronic components are arranged and held in a predetermined plane region and moved in the Y direction, and the reverse transfer step is performed in the X direction of the electronic component arrangement region. If it is performed between an arbitrary position and the first component supply position, the electronic component can be supplied easily and at low cost.

  In addition, by the recognition means, the mounting head is positioned between the mounting position of the electronic component by the mounting head and the position retracted from the mounting position with the movement of the range of the substrate positioned in the substrate positioning portion in the X direction. If it is set as the structure provided with the process of recognizing both the hold | maintained electronic component and the mounting position of a board | substrate, high mounting precision can be ensured by correct | amending by a recognition result.

  In addition, the electronic component supplied with the connection surface facing downward at a side position in the X direction of the first component supply position is configured to be held and handled by the first mounting head. In addition, instead of supplying the upward component, the electronic component such as a bare IC component supplied upward is provided with a step of supplying the electronic component with the connection surface facing downward. By holding at the side position in the X direction of the component supply position, the first mounting head can be mounted in the same manner as described above.

  According to the electronic component mounting apparatus of the present invention, the board is positioned in the X direction by the board positioning means as described above, and the connection surface is directed upward by the upward component supply means on one side in the Y direction of the board positioning means. An electronic component is supplied, the electronic component is supplied to the first component supply position by the reverse transfer means, and on the other side of the substrate positioning means in the Y direction, the electronic component whose connection surface is downward is supplied by the downward component supply means. By supplying the second component supply position, holding the electronic component at the first or second component supply position by the first and second mounting heads of the mounting means, and moving and positioning in the Y direction, the substrate Since a predetermined electronic component is mounted at a predetermined mounting position, an electronic component supplied with a connection surface such as a bare IC chip facing upward and an electron supplied with a connection surface such as a chip component facing downward 1 part Both can be mounted with the connection surface facing the substrate surface in the device, and the mounting head only needs to be linearly moved in one direction for positioning, so high-precision and high-speed mounting can be realized. Further, by independently moving and driving the first mounting head and the second mounting head, the component is held from the component supply position by the other mounting head during the mounting operation by one mounting head. The operation up to immediately before the mounting operation can be completed, and higher-speed mounting can be realized.

  In particular, a plurality of chip components can be held by a single movement to the second component supply position, chip components having a relatively large number of mounting points can be mounted efficiently, and overall mounting efficiency is improved. can do.

  Further, according to another feature, in particular, because the tact of the process of supplying the electronic component supplied by the upward component supply means by reversing the upper and lower to the first component supply position by the reverse transfer means is long, When the mounting tact for each substrate becomes long and the mounting efficiency decreases, a plurality of electronic components can be supplied by one reciprocating operation, so that the mounting efficiency can be greatly improved.

  Hereinafter, an electronic component mounting apparatus according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 2A, the electronic component mounting apparatus 1 of the present embodiment includes an upward supply electronic component 3 (hereinafter simply referred to as a bare IC chip) supplied with the connection surface 3a facing the substrate 2 facing upward. As shown in FIG. 2B, the substrate 2 may be a chip component such as a capacitor element or a resistance element, or a lead-attached component in which connection leads are provided on at least a part of the four circumferences. A downward supply electronic component 4 (hereinafter, simply referred to as an electronic component 4) supplied in a state in which the connection surface 4a is directed downward is mounted on the substrate 2 in a mixed manner.

  The electronic component mounting apparatus 1 includes a main body portion 5 and component supply portions 6 and 7 disposed on both front and rear sides thereof. Each component supply part 6 and 7 is comprised as a unit couple | bonded with the main-body part 5 so that replacement | exchange is possible.

  The front-side component supply unit 6 includes a component magazine 9 that contains a plurality of semiconductor wafers 8 that are formed by arranging a large number of electronic components 3 and that are diced into individual pieces and that are supported on an expanded sheet. The magazine lifter 10 is used to position a desired semiconductor wafer 8 at a predetermined supply height position.

  The rear-side component supply unit 7 has a plurality of component supply cassettes 11 mounted with a tape-shaped component assembly that accommodates a large number of electronic components 4 on a component supply table 12 that can move left and right in the moving direction. It is configured to be mounted in parallel, and is configured to supply the electronic component 4 of an arbitrary component supply cassette 11 to the second component supply position B as shown in FIG.

  At the front part of the main body 5, an expand base 13 is installed on an X-direction table 14 as a supply table that can move in the left-right X direction, and can be moved up and down by an upper and lower cylinder 15. 2), the semiconductor wafer 8 is introduced from the component magazine 9 of the component supply unit 6 into the expanding table 13, and the expanding sheet is expanded by the expanding table 13 to separate the electronic components 3 at intervals. In addition, a desired electronic component 3 is positioned at a predetermined position in the X direction.

  Reference numeral 16 denotes a recognition camera for recognizing the electronic component 3 positioned at a predetermined X-direction position on the expand base 13, and can be moved in the Y-direction along the front-rear direction on the Y-direction table 17, as shown in FIG. It is supported by. The Y-direction table 17 is configured to move and position a moving body 17b supported by a Y-direction guide 17a so as to be movable in the Y-direction by using a moving motor 17c and a feed screw mechanism 17d. A recognition camera 16 is attached. The recognition camera 16 is configured to recognize the electronic component 3 at an arbitrary position in the Y direction among the electronic components 3 positioned at a predetermined X-direction position.

  Further, the reverse transfer means 18 is disposed from the front part to the intermediate part of the main body part 5. As shown in FIG. 3, the reverse transfer means 18 is an arbitrary electronic component in the component supply region D corresponding to the size in the Y direction of the semiconductor wafer 8 on the expand base 13 positioned at a predetermined X direction position. 3 is sucked and moved rearward in the Y direction, transferred to the first component supply position A, and the sucked electronic component 3 is inverted 180 degrees upward. In the state of the semiconductor wafer 8, the connection surface 3 a of each electronic component 3 is formed upward, and the reverse transfer means 18 sucks the connection surface 3 a of each electronic component 3 and then turns upward 180 degrees, The connection surface 3a of the electronic component 3 is directed downward, and in this state, the electronic component 3 is configured to be delivered to the mounting means 26 at the first component supply position A.

  As shown in FIGS. 5 and 6, the specific configuration of the reversing transfer means 18 includes an X-direction position adjusting mechanism 21 disposed on a moving table 20 supported by a Y-direction table 19 so as to be movable in the Y-direction. The reversing mechanism 23 is attached to the X-direction position adjusting mechanism 21 via the up-and-down moving mechanism 22, and the suction nozzle 25 for sucking and holding the electronic component 3 is attached to the reversing mechanism 23 via the θ adjusting mechanism 24. Has been.

  The Y-direction table 19 includes a Y-direction guide 19a that supports the movable table 20 so as to be movable in the Y direction, a movement motor 19b, and a feed screw mechanism 19c. The X-direction position adjusting mechanism 21 includes a movable plate 21a supported by the movable table 20 so as to be movable in the X direction, a cam 21c rotated by a motor 21b and engaged with the movable plate 21a, and a cam for the movable plate 21a. It is comprised with the spring 21d urged | biased toward 21c. The vertical movement mechanism 22 includes an elevating member (not shown) supported by the movable plate 21a so as to be movable up and down, a vertical driving cam 22a that drives the elevating member up and down, a vertical motor 22b that rotates the elevating member, and an elevating member Is configured by a spring (not shown) for biasing the cam toward the cam 22a. The reversing mechanism 23 is configured such that the reversing member 23a is reciprocally rotated by 180 ° via a pulley / belt mechanism 23c by a reversing motor 23b. The θ adjustment mechanism 24 is configured to rotate the suction nozzle 25 attached to the reversing member 23a around its axis by the θ adjustment motor 24a via the pulley / belt mechanism 24b.

  The mounting means 26 includes a first mounting head 27 that holds the electronic component 3 and mounts it on the substrate 2, a second mounting head 28 that holds the electronic component 4 and mounts it on the substrate 2, and these first mountings The head 27 and the second mounting head 28 are configured by a Y-direction guide 29 that supports the head 27 and the second mounting head 28 so as to be movable in the Y direction. The Y direction guide 29 is provided with a fixed feed screw shaft 29a.

  The first mounting head 27 includes a suction nozzle 27a for sucking and holding the electronic component 3, an elevating means 27b, a pressurizing means 27c such as a voice coil motor, a heating means 27d for heating the electronic component 3, and a feed screw shaft 29a. Drive means 27e configured to rotationally drive a nut member to be screwed by a hollow motor is provided. Further, a dispenser (not shown) for applying a sealing material to the first mounting head 27 is provided as necessary. Further, if necessary, a θ adjustment mechanism (not shown) similar to the θ adjustment mechanism 30 provided in the second mounting head 28 described later is provided.

  As shown in FIG. 7, the second mounting head 28 includes a plurality of suction nozzles 28a for sucking and holding the electronic component 4 made of chip parts, and a lower end portion of a support shaft 28c that is rotatable about a horizontal axis 28b. The support shaft 28c is supported so that it can move up and down with its upper end protruding upward, and a pressing means 28d is provided so as to press the support shaft 28c and move it downward, and further a motor 30a. And the pulley belt mechanism 30b is provided with a θ adjustment mechanism 30 for adjusting the mounting posture of the electronic component 4 by rotating the support shaft 28c around the axis. Moreover, the drive means 28e (refer FIG. 1) comprised so that the nut member screwed in the feed screw shaft 29a might be rotationally driven with a hollow motor was provided.

  The substrate 2 is moved in the X direction below the movement path in the Y direction of the mounting heads 27 and 28 at the rear of the main body 5, and the position where the electronic component is to be mounted on the substrate 2 is adjusted in the X direction by the mounting heads 27 and 28. An X-direction table 31 is disposed as a substrate positioning means for positioning at the mounting position. The X-direction table 31 is movably supported along the X-direction guide rail 31a, and is configured to move and position by a movement motor 31b and a feed screw mechanism 31c. A support base 32 for placing and fixing the substrate 2 is provided on the X-direction table 31 so as to be movable up and down.

  Thus, the first mounting head 27 and the first mounting head 27 movably supported by the Y-direction guide 29 to a predetermined mounting position within the mounting range C corresponding to the Y-direction width of the substrate 2 positioned by the X-direction table 31. By positioning the second mounting head 28, the predetermined electronic components 3 and 4 are configured to be mounted at a predetermined mounting position on the substrate 2.

  Further, the electronic components 3 and 4 held by the mounting heads 27 and 28 are recognized on the upper side between the first and second mounting heads 27 and 28 and the support base 32, and the electronic components of the board 2 are recognized on the lower side. Simultaneous recognition means 33 configured to be able to recognize both of the positions to be mounted is disposed. As shown in FIG. 8, the simultaneous recognition means 33 can be positioned at an arbitrary position within the mounting range C in the Y direction by the XY table 34, and in the X direction from the mounting position by the mounting heads 27 and 28 and the mounting position. It is supported so as to be movable between the retracted position. Reference numeral 34a denotes a Y-axis movement motor, and reference numeral 34b denotes an X-axis movement motor.

  The simultaneous recognition means 33 is configured to sequentially recognize the mounting positions of the electronic components 3, 4 and the substrate 2 by switching the optical path with a prism or the like while being positioned at the mounting position. Not to do. Of course, it may be recognized at the same time literally, but there are many cases where the configuration becomes complicated and the cost is high, which is not preferable.

  On the one side in the X direction of the X direction table 31 (right side in the figure), a loading portion 35 for carrying the substrate 2 onto the support base 32 is located on the other side in the X direction of the X direction table 31 from above the support base 32. An unloading part 36 for unloading is disposed. A partial rail 37 that can be connected to a pair of rails of the carry-in portion 35 and the carry-out portion 36 and that can be raised and lowered is provided on both front and rear sides of the support base 32. After receiving the substrate 2 on the partial rail 37, the support base 32 is provided. It is configured to be mounted and fixed on the top.

  Next, the mounting operation of the electronic components 3 and 4 on the substrate 2 in the above configuration will be described. After the substrate 2 supplied by the carry-in unit 35 is transferred onto the partial rail 37 provided on the X-direction table 31, the partial rail 37 descends and is placed and fixed on the support base 32. Thereafter, the X-direction table 31 is positioned so that the X-direction position of the mounting position of the electronic components 3, 4 on the substrate 2 coincides with the X-direction position of the first mounting head 27 or the second mounting head 28. .

  On the other hand, the semiconductor wafer 8 supplied by the component supply unit 6 and introduced onto the expansion table 13 is operated by the X-direction table 14 after the expanded sheet is expanded and the electronic components 3 are separated by the expansion table 13. Thus, the electronic component 3 to be mounted is positioned so as to be located immediately below the moving path of the suction nozzle 25 of the reverse transfer means 18. In addition, the Y direction table 17 is activated and the recognition camera 16 is positioned immediately above the electronic component 3 to be mounted, and the suitability and position of the electronic component 3 are recognized with high accuracy. The position correction is performed, and the position where the suction nozzle 25 is to be positioned in the reverse transfer means 18 and the θ correction amount of the electronic component 3 are obtained. Next, the Y-direction table 19 of the reverse transfer means 18 is operated, the suction nozzle 25 is positioned at the position of the electronic component 3 to be mounted, and the electronic component 3 is sucked and held by the suction nozzle 25 and then lifted. It is moved in the Y direction toward the first component supply position A and turned upside down, and supplied to the first component supply position A with the connection surface 3a facing downward.

  At that time, the first mounting head 27 of the mounting means 26 has moved to the first component supply position A, and after the electronic component 3 is held by the first mounting head 27, Y is driven by the driving means 27e. Driven along the direction guide 29, the first mounting head 27 is positioned at the Y-direction position of the mounting position on the substrate 2.

  At the same time, the XY table 34 is operated and the simultaneous recognition means 33 is also positioned at the mounting position of the substrate 2, and in this state, the position mark provided at the mounting position of the substrate 2 is recognized, and the first mounting head 27, the electronic component 3 held by the motor 27 is recognized and position correction is performed by the driving means 27e and the X-direction table 31 so that a predetermined positioning accuracy is ensured. Positioned with high accuracy.

  Thereafter, the suction nozzle 27a of the first mounting head 27 is lowered by the elevating means 27b and is pressurized by the pressurizing means 27c such as a voice coil motor, and the electronic component 3 is mounted. Moreover, the electronic component 3 is heated by the heating means 27d as necessary, and the electrode of the electronic component 3 and the electrode of the substrate 2 are joined by heating and pressing. In addition, when a sealing material is applied in advance to the mounting position of the substrate 2 with a dispenser (not shown), the mounting material is also heat-cured by the heating means 27d at the same time as mounting, and includes mounting up to sealing. Is completed.

  In the component supply unit 7, the component supply stand 12 is operated to position the component supply cassette 11 containing the electronic component 4 to be mounted on the substrate 2 at a position facing the second component supply position B. The electronic component 4 is supplied to the component supply position B, and the electronic component 4 is held by the second mounting head 28 and moved in the Y direction, and mounted at a predetermined mounting position on the substrate 2 in the same manner as described above. Is done. At that time, after the plurality of electronic components 4 made of chip components are held at a time by the plurality of suction nozzles 28a at the component supply position B, the second mounting head 28 moves to the mounting position on the substrate 2, and the substrate The plurality of electronic components 4 are mounted in one reciprocating step of the second mounting head 28 by selecting and mounting the predetermined electronic components 4 at respective positions on the second mounting head 28.

  By performing the mounting operation on the substrate 2 by appropriately combining the above mounting operations by the first mounting head 27 and the second mounting head 28, the required number of electronic components 3 and 4 can be mounted in a short mounting tact time. It can be mounted on the substrate 2. When the mounting on the substrate 2 is completed, the substrate 2 is unloaded for the next process by the unloading unit 36, and the next substrate 2 is loaded by the loading unit 35 and installed on the support base 32.

  As described above, according to the present embodiment, the substrate 2 is positioned in the X direction by the X direction table 31 as the substrate positioning means, and is supplied upward from the component supply unit 6 onto the expand base 13 on the front side of the main body unit 5. The electronic component 3 is supplied in the form of a semiconductor wafer 8, the semiconductor wafer 8 is positioned in the X direction by the X direction table 14, the desired electronic component 3 is sucked and held by the reverse transfer means 18, and reversed to be the first. To the component supply position A, and on the rear side of the main body 5, the downward supply electronic component 4 is supplied from the component supply unit 7 to the second component supply position B, and the first mounting head 27 of the mounting means 26 The second mounting head 28 holds the electronic components 3 and 4 at the first and second component supply positions A and B, respectively, and moves and positions them in the Y direction so that the predetermined mounting position of the substrate 2 is obtained. Predetermined electronic parts 3 and 4 It can be. Accordingly, the upward supply electronic component 3 such as a bare IC chip and the downward supply electronic component 4 such as a chip component are mixedly mounted on the substrate 2 with the connection surfaces 3a and 4a facing the surface of the substrate 2 in one apparatus. And the first and second mounting heads 27 and 28 need only be linearly moved in one direction for positioning, so that high-precision mounting can be realized at high speed. One mounting head 27 and the second mounting head 28 are independently moved and driven separately, so that one mounting head 27 or 28 is in the mounting operation and the other mounting head 28 or 27 has its component supply position A. , B and the electronic components 3 and 4 can be held and the operation up to immediately before the mounting operation can be completed, and further high-speed mounting can be realized.

  Further, a loading portion 35 is disposed on one side in the X direction of the X direction table 31 as a substrate positioning means, and a loading portion 36 is disposed on the other side, so that the substrate 2 is moved only in one direction from loading to unloading. Therefore, it can be configured compactly, and the configuration is simple and inexpensive.

  Further, when the downward supply electronic component 3 such as a bare IC chip is supplied onto the X direction table 14 as a supply table in the state of the semiconductor wafer 8 or accommodated in the tray, it is positioned in the X direction by the X direction table 14. The position in the Y direction is selected by the reversing transfer means 18 and an arbitrary electronic component 3 can be supplied, and the desired electronic component 3 can be supplied by positioning in one axial direction. Supply can be performed easily and at low cost.

  Also, both the electronic components 3 and 4 held by the first mounting head 27 and the second mounting head 28 and the mounting position of the substrate 2 are recognized with the simultaneous recognition means 33 positioned at the mounting position. Therefore, high mounting accuracy can be ensured by performing correction according to the recognition result.

  Further, since the first and second mounting heads 27 and 28 are provided with drive means 27e and 28e having a common fixed feed screw shaft 29a and separate hollow motors, the feed screw shaft 29a is shared. Therefore, the mounting heads 27 and 28 can be moved and driven by a hollow motor.

  In addition, since the first mounting head 27 includes the heating means 27d, an anisotropic conductive resin sheet, a resin or a non-conductive resin sheet, or the like is placed at the mounting position of the substrate 2 prior to mounting the electronic component 3. By disposing a bonding material such as resin, the mounting process up to the bonding and sealing of the electronic component 3 and the substrate 2 is completed by applying pressure and heat to the resin sheet or resin material when the electronic component 3 is mounted. be able to.

  Further, when the first mounting head 27 is provided with the heating means 27d and the dispenser 27e for applying the sealing material, the sealing material is applied to the mounting position prior to mounting the electronic components 3 and 4, and the electronic component 3 By heating at the time of mounting, the sealing material can be heat-cured to complete the mounting process up to sealing.

  In addition, the second mounting head 28 holds the electronic component 4 made of a chip component by each of the plurality of suction nozzles 28a and selectively mounts the arbitrary electronic component 4. Therefore, the second mounting head 28 When the head 28 is moved to the second component supply position B, a plurality of electronic components 4 are sucked and held at a time, thereby efficiently mounting a chip component having a relatively large number of mounting points and a short mounting tact. As a whole, the mounting efficiency can be improved.

  Next, another embodiment of the electronic component mounting apparatus of the present invention will be described with reference to FIGS.

  In the above embodiment, the component supply unit 6 of the upward supply electronic component 3 is on the front side on one side in the Y direction orthogonal to the X direction in the board conveyance direction, and the component supply unit 7 of the downward supply electronic component 4 is on the other side in the Y direction. The supply table of the semiconductor wafer 8 disposed on the rear side and supplied from the component supply unit 6 is constituted by the X direction table 14, the reverse transfer means 18 moves in the Y direction, and the mounting means 26 has the first and first mounting means. The two mounting heads 27 and 28 are moved in the Y direction, and the substrate positioning means is constituted by an X direction table 31.

  On the other hand, in the present embodiment, the component supply units 6 and 7 are both disposed on the left and right sides on the front side on the one side in the Y direction orthogonal to the X direction in the board transport direction. The supply table of the semiconductor wafer 8 supplied from the component supply unit 6 is composed of a Y-direction table 14A, and the reverse transfer means 18A holds an arbitrary electronic component 3 in the X direction of the semiconductor wafer 8 positioned in the Y direction. Then, it is configured to move in the X direction and reverse to be supplied to the first component supply position A. Similar to the reverse transfer means 18A, the recognition camera 16A is configured to be movable and positioned in the X direction.

  The component supply unit 7 is configured to mount a plurality of component supply cassettes 11 in parallel in the X direction. The component supply position at the tip of the component supply cassette 11 is located immediately below the movement path of the second mounting head 28 in the mounting means 26A described later, and the electronic component 4 of an arbitrary component supply cassette 11 in the component supply unit 7. The second component supply position B for supplying the electronic component 4 is set as an area having a predetermined width in the X direction.

  The mounting means 26A is configured to move and position the first mounting head 27 and the second mounting head 28 in the X direction. The first mounting head 27 sucks the electronic component 3 at the first component supply position A. The second mounting head 28 picks up the electronic component 4 at the second component supply position B which is set as a region having a predetermined width. It is configured to hold and move in the X direction and to be mounted at a predetermined position in the X direction on the substrate 2.

  The substrate 2 is carried in from the carry-in portion 35 and is fixedly supported on a support base 32 on a Y-direction table 31A as a substrate positioning means, and the mounting position of the electronic components 3 and 4 on the substrate 2 is the mounting head 27, The first and second mounting heads 27 and 28 are positioned by the Y-direction table 31A so as to be positioned immediately below the movement path 28, and can be moved and positioned in the X-direction of the mounting means 26A. The electronic parts 3 and 4 are configured to be mounted. The substrate that has been mounted is unloaded from the unloading unit 36.

  Also in the electronic component mounting apparatus having the above-described configuration, the upward supply electronic component 3 and the downward supply electronic component 4 can be mixed and mounted with high accuracy and high speed as in the above embodiment. Moreover, since both the component supply parts 6 and 7 are arrange | positioned in the front side, there exists an advantage that workability | operativity is good. Moreover, since it is not necessary to provide the component supply stand 12 in the component supply part 7 and to move left and right, there is an advantage that the configuration of the component supply part 7 is simple and compact. In addition, the component supply part 7 can also be arrange | positioned in the back side, as shown as the component supply part 70 in FIG.

  In the description of each of the above embodiments, an example in which the suction nozzle 27a, the elevating / lowering means 27b, the pressurizing means 27c, and the heating means 27d are provided as the first mounting head 27 is shown, but as shown in FIG. An ultrasonic bonding head 42 having an ultrasonic vibration generating means 41 may be attached and configured to perform ultrasonic bonding. In addition, the ultrasonic bonding head 42 may be provided with a heating means so that the sealing is simultaneously performed as described above.

  In the description of the above embodiment, the component supply unit 6 supplies the semiconductor wafer 8 by mounting the component magazine 9 containing a plurality of semiconductor wafers 8 as shown in FIG. In the example described above, a component magazine 9a containing a small-sized semiconductor wafer 8a as shown in FIG. 12B may be mounted to supply the semiconductor wafer 8a. As shown in (c), a component magazine 9b holding and holding a plurality of tray plates 44 holding one or a plurality of trays 43 in which a large number of electronic components 3 are arranged and received is mounted and the tray plate 44 is supplied. Alternatively, as shown in FIG. 12D, a large tray 45 in which a large number of electronic components 3 are arranged and accommodated may be directly supplied.

  Further, as shown in FIG. 13, the component supply unit 6 includes a plurality of component supply cassettes 46 mounted with a tape-shaped component assembly containing a large number of electronic components 3, and a plurality of stacked trays 47. The tray feeder 48 for sequentially supplying the electronic components 3 may be mounted on the X-direction moving table 49 so that the electronic component 3 can be directly supplied from the component supply unit 6 to the reverse transfer means 18.

  When the component supply unit 6 in the embodiment of FIGS. 1 to 8 is configured as shown in FIGS. 12C and 12D, the connection surface 3a of the electronic component 3 such as a bare IC component. Can be accommodated in the trays 43 and 45 and supplied, and such a supply form of the electronic component 3 is also possible.

  Referring to FIG. 14, another embodiment that can deal with such a supply form of the electronic component 3 will be described with reference to FIG. 14. In the present embodiment, the first part supply position A is located at a lateral position in the Y direction. The transfer stage 50 for holding the downward supply electronic component 3A supplied with the connection surface facing downward is disposed. In addition, the moving range of the first mounting head 27 includes the position of the transfer stage 50, and the first mounting head 27 can hold the electronic component 3 </ b> A on the transfer stage 50. Further, the trays 43 and 45 supplied from the component supply unit 6 are positioned in the X direction by an X direction table 14 as a supply table, and any electronic component 3A on the trays 43 and 45 is It is held and transferred onto the transfer stage 50 and is transferred onto the transfer stage 50 without the reversing mechanism 23 operating. Thus, the component supply means is constituted by the component supply unit 6 as shown in FIGS. 12C and 12D, the X direction table 14, and the reverse transfer means 18 that stops the reverse mechanism 23. Yes. As described above, even when a means for supplying the electronic component 3 such as a bare IC component with its connection surface facing downward is provided, the electronic component 3A is held by the transfer stage 50, so that the mounting means 26 The first mounting head 27 can be mounted in the same manner as described above.

  Similarly, in the embodiment of FIGS. 9 and 10, when the component supply unit 6 is configured as shown in FIGS. 12 (c), 12 (d), and FIG. Electronic components 3 such as components can be supplied by being accommodated in trays 43, 45, and 47 with the connection surface 3a facing downward, so that such downwardly-supplied electronic components 3A can be dealt with. For this purpose, as shown in FIG. 15, similarly to FIG. 14, the electronic component 3A supplied with the connection surface facing downward is held at the side position in the X direction of the first component supply position A. The transfer stage 50 is provided, and the first mounting head 27 of the mounting means 26A is configured to hold the electronic component 3A on the transfer stage 50, whereby the mounting means 26A holds the electronic component 3A. Can be implemented as above Kill.

  In the description of each of the above embodiments, the holding unit for the electronic component 3 in the reverse transfer unit 18 is exemplified as having the single suction nozzle 25. However, as shown in FIG. A plurality (two in the illustrated example) of suction nozzles 25a and 25b for suction and holding can also be provided. In FIG. 16, the electronic components 3 on the semiconductor wafer 8 on the expand base 13 are sequentially pushed up by the push-up pins 13a and sucked and held by the suction nozzles 25a and 25b of the reverse transfer means 18, respectively. The direction of 25b is reversed upside down, and these suction nozzles 25a, 25b are sequentially positioned at the first component supply position A, and the first mounting head 27 of the mounting means 26 is directed upward from the first component supply position A. An operation process in which the electronic component 3 is taken out and mounted on the substrate 2 is shown.

  In this way, by providing a plurality of suction nozzles 25a and 25b in the reverse transfer means 18, the electronic components 3 of the semiconductor wafer 8 are turned upside down by the reverse transfer means 18 and supplied to the first component supply position A. Since the mounting tact for each substrate 2 becomes long due to the long tact of the process to be performed, and the mounting efficiency is lowered, a plurality of electronic components 3 can be supplied by one reciprocating operation of the reverse transfer means 18. The mounting efficiency can be greatly improved.

  Further, as shown in FIG. 17, the first mounting head 27 is provided with a plurality of heads 38 a and 38 b corresponding to the plurality of suction nozzles 25 a and 25 b of the reversal transfer means 18, and at the first component supply position A. A plurality of electronic components 3 can also be delivered to the heads 38a and 38b in a lump. When the plurality of electronic components 3 are mounted on the substrate 2, the first mounting head 27 is moved to the first component. It is not necessary to reciprocate a plurality of times between the supply position A and the electronic component mounting position of the board 2, and the mounting speed can be improved accordingly.

  In the description of each of the above embodiments, the example in which the electronic components 3 and 4 are mounted on the rigid substrate 2 has been described. However, the electronic component mounting apparatus of the present invention has a substrate as shown in FIG. The present invention can also be suitably applied when the film substrate 52 is used. In FIG. 18, a film substrate 52 is applied in the form of a strip-shaped film substrate 51 in which a plurality of film substrates 52 are integrally connected. Then, a plurality of belt-like film substrates 51 are fed in parallel from the feed roll 53 to the substrate positioning means 54, and the substrate positioning means 54 sucks each film substrate 52 on which the electronic components 3 and 4 are mounted. The mounting position is fixed in the X direction, and the electronic components 3 and 4 are mounted at predetermined positions in the Y direction by the first mounting head 27 and the second mounting head 28 of the mounting means 26. The film substrate 52 on which the electronic component 3 has been mounted is configured to be recovered by sequentially winding the belt-shaped film substrate 51 around a recovery roll 55. According to such a configuration, the electronic component 3 can be efficiently mounted on the film substrate 52. Further, the present invention can be similarly applied to the electronic component mounting apparatus having the configuration shown in FIGS.

  INDUSTRIAL APPLICABILITY The present invention can be put into practical use in electronic component mounting technology, and an electronic component supplied with a connection surface such as a bare IC chip facing up and an electronic component supplied with a connection surface such as a chip component facing down are provided as one device. In both cases, mounting can be performed with high accuracy and high speed with the connection surface facing the substrate surface.

1 is a perspective view showing an overall schematic configuration of an electronic component mounting apparatus that employs an embodiment of an electronic component mounting method of the present invention. It is a perspective view which shows the upward supply electronic component and downward supply electronic component which are mounted in the same apparatus. It is the perspective view which showed the mounting process in the apparatus typically. It is a perspective view which shows the movement and positioning mechanism of the recognition camera in the same apparatus. It is a see-through | perspective perspective view which shows the whole structure of the inversion transfer means in the apparatus. It is a see-through | perspective perspective view which shows the principal part detail of the inversion transfer means in the embodiment. It is a perspective view which shows the structure of the principal part of the 2nd mounting head in the same apparatus. It is a perspective view which shows the movement and positioning mechanism of the simultaneous recognition camera in the same apparatus. It is a see-through | perspective perspective view which shows the whole schematic structure in the electronic component mounting apparatus which employ | adopted other embodiment of the electronic component mounting method of this invention. It is a top view which shows the whole schematic structure of the apparatus. It is a perspective view of the modification of the 1st mounting head in the apparatus. It is a perspective view which shows the various modifications of the supply form of the upward supply electronic component in the apparatus. It is a perspective view which shows the other structural example of the supply means of the upward supply electronic component in each said apparatus. It is the perspective view which showed typically the mounting process in another embodiment of the electronic component mounting method of this invention. It is a top view which shows the whole schematic structure of the electronic component mounting apparatus which employ | adopted further another embodiment of the electronic component mounting method of this invention. It is operation | movement explanatory drawing of the modification of the inversion transfer means in the same apparatus. It is operation | movement explanatory drawing of the modification of the inversion transfer means and the 1st mounting head in each said apparatus. It is a whole schematic perspective view of the component mounting apparatus of the example which applied the electronic component mounting method of this invention to the mounting process with respect to a film substrate. It is a top view which shows the whole schematic structure of the electronic component mounting apparatus of a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate 3 Upward supply electronic component 3A Downward supply electronic component 4 Downward supply electronic component 6 Component supply part (upward component supply means)
7 Component supply section (downward component supply means)
8 Semiconductor wafer 13 Expand base (upward component supply means)
14 X direction table (supply table)
14A Y direction table (supply table)
18, 18A Reverse transfer means 25a, 25b Adsorption nozzle (holding means)
26, 26A Mounting means 27 First mounting head 27d Heating means 27e Driving means 28 Second mounting head 28e Driving means 28a Adsorption nozzle (holding means)
29a Feed screw shaft 31 X direction table (substrate positioning means)
31A Y direction table (substrate positioning means)
33 Simultaneous recognition camera (recognition means)
35 Carry-in part 36 Carry-out part 38a, 38b Head 50 Transfer stage 51 Band-shaped film substrate 52 Film substrate 53 Feed roll 54 Substrate positioning means 55 Recovery roll A First component supply position B Second component supply position

Claims (8)

An electronic component in which the substrate is positioned in the X direction in the positioning unit, and the connection surface having an electrode connected to the electrode of the substrate is facing upward on one side in the Y direction orthogonal to the X direction with respect to the substrate positioning unit Receiving the electronic component supplied in the upward direction, transferring it in the Y direction, turning it upside down and supplying it to the first component supply position, and in the Y direction with respect to the substrate positioning portion On the other side, the step of supplying the electronic component supplied with the connection surface facing downward to the second component supply position, and the electronic component supplied to the first component supply position by the first mounting head A first mounting step of holding, transferring in the Y direction, and mounting at an arbitrary position in the Y direction of the substrate on the substrate positioning portion, and an electronic component supplied to the second component supply position to the second mounting head Hold by Y direction And a second mounting step for mounting the substrate at an arbitrary position in the Y direction of the substrate on the substrate positioning unit. These first and second mounting steps are different from each other of the first and second mounting heads. An electronic component mounting method characterized by performing an operation and holding a plurality of chip components and selectively mounting arbitrary chip components depending on the second mounting head. An electronic component in which the substrate is positioned in the X direction in the positioning unit, and the connection surface having an electrode connected to the electrode of the substrate is facing upward on one side in the Y direction orthogonal to the X direction with respect to the substrate positioning unit A step of receiving the electronic component supplied upward, transferring it in the Y direction and supplying it to the first component supply position by turning it upside down, and the other side in the Y direction with respect to the substrate positioning portion The step of transferring and supplying the electronic component supplied with the connection surface facing downward to the second component supply position and the electronic component supplied to the first component supply position by the first mounting head A first mounting step of holding, transferring in the Y direction, and mounting at an arbitrary position in the Y direction of the substrate on the substrate positioning portion, and an electronic component supplied to the second component supply position to the second mounting head Hold in the Y direction A second mounting step of transferring and mounting at an arbitrary position in the Y direction of the substrate on the substrate positioning unit. These first and second mounting steps are different operations of the first and second mounting heads. The electronic component mounting method is characterized in that the reversal transfer is performed simultaneously while holding a plurality of electronic components. The electronic component mounting method according to claim 2, wherein the first mounting head includes a plurality of heads each holding and mounting the electronic component. The step of positioning the substrate in the Y direction orthogonal to the X direction of the substrate transport direction in the positioning unit, and the connection surface having the electrode connected to the electrode of the substrate on one side of the X direction with respect to the substrate positioning unit is directed upward A step of supplying an electronic component in a state, a reverse transfer step of receiving an electronic component supplied upward and transferring it in the X direction and turning it upside down and supplying it to the first component supply position; Supplying the electronic component supplied with the connection surface facing downward on the other side in the X direction to the second component supply position, and the electronic component supplied to the first component supply position to the first A first mounting step in which the electronic component is held by the mounting head and transferred in the X direction and mounted at an arbitrary position in the X direction on the substrate positioning unit; and the electronic component supplied to the second component supply position is 2 mounting head Holding and transferring in the X direction and mounting at an arbitrary position in the X direction of the substrate on the substrate positioning portion. These first and second mounting steps include the first and second mounting steps. An electronic component mounting method, wherein the mounting head is operated with different operations. 5. The electronic component mounting method according to claim 4, wherein the step of supplying the electronic component upward is performed for a bare IC chip having a connection surface having a plurality of protruding electrodes facing upward. The step of supplying the electronic components upward is performed in a state in which a plurality of electronic components are arranged and held in a predetermined plane area and moved in the Y direction, and the reverse transfer step is performed in an arbitrary direction in the X direction of the electronic component arrangement region. 6. The electronic component mounting method according to claim 4, wherein the electronic component mounting method is performed between the position and the first component supply position. It is held by the mounting head by the positioning between the mounting position of the electronic component by the mounting head and the position retracted from the mounting position, which involves the movement of the range in the X direction of the board positioned by the board positioning portion by the recognition means. 7. The electronic component mounting method according to claim 4, further comprising a step of recognizing both the electronic component and the mounting position of the substrate. The electronic component supplied with the connection surface facing downward at a side position in the X direction of the first component supply position is held and handled by the first mounting head. The electronic component mounting method according to any one of 4 to 7.

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