JPH0730292A - Surface mounting machine - Google Patents

Abstract

PURPOSE:To minimize the time for movement of a head moving back and forth between a component supplying part and a printed board, by a system wherein the printed board is made movable in a first direction by a working station, the component supplying part in the first direction likewise and the head in a second direction crossing the first direction. CONSTITUTION:Provision is so made that a board P is movable in the direction of the axis X, by a working station 3 each of component supplying parts 12a and 12b in the direction of the axis X likewise and each of heads 20a to 20c in the direction of the axis Y respectively. These move relatively within an X-Y plane and the component supplying parts 12a and 12b supply chip components to the working station 3 respectively. Even in the case when the component supplying parts 12a and 12b are provided in extension in the direction of the axis X for mounting more kinds of chip components, the time for movement of each of the heads 20a to 20c moving back and forth between the board P and each of the component supplying parts 12a and 12b is made a necessary minimum by moving the component supplying parts 12a and 12b to positions of suction of each of the heads 20a to 20c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter configured to mount a small chip component such as an IC at a predetermined position on a printed board.

[0002]

2. Description of the Related Art Conventionally, as a mounting machine as described above, an X-axis constituent member having an X-axis and a Y-axis which are orthogonal to each other, and movably mounted along the Y-axis on a Y-axis such as a rail. A head provided with a nozzle for adsorbing and mounting a chip component on the X-axis component is provided movably along the X-axis so that the head can be moved in the XY plane. It was the mainstream. However, when considering the speeding up of the operation in each of the X and Y axes, it is natural that the mounting operation has a structure in which the operation in the X axis direction and the operation in the Y axis direction are independent of each other, and the configuration is also made. Seems simple and efficient.

Therefore, as shown in FIG. 8, the X-axis 81, Y
A mounting machine in which the shafts 80 are arranged independently of each other, the head 83 and the substrate P are independently moved along the X axis 81 and the Y axis 80, and feeders 82A and 82B are fixedly installed near the X axis 81. Is proposed. In this mounting machine, the head 83 can be moved only in the X-axis direction, and the substrate P can be moved in the Y-axis direction. During mounting work, the head 83 moves in the X-axis direction and the substrate P moves in the Y-axis direction. The movement of the two causes the both to move relative to each other in the XY plane.

[0004]

In the mounting machine described above, in order to allow a plurality of types of chip components to be picked up by a head, each of the feeders 82A and 82B holds and holds each chip component. It has a structure in which tapes are arranged side by side in the X-axis direction. Therefore, when mounting more types of chip components, it is necessary to extend the feeders 82A and 82B in the X-axis direction as the number of types of chip components increases.

However, as described above, each feeder 82
When A and 82B are extended in the X-axis direction, each feeder 82
When picking up and mounting the chip component at a position closer to the outside of the A and 82B, there is a problem that it takes a wasteful time to move the head that reciprocates between the feeders 82A and 82B and the substrate P.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a surface mounter capable of improving the efficiency of the mounting work.

[0007]

The invention according to claim 1 is
A device for mounting a chip component supplied from a component supply unit on a printed circuit board transported through a transportation line, receiving a printed circuit board from the transportation line, and providing a work station that moves while holding the printed circuit board, The component supply unit is arranged so as to supply the chip component toward the work station, and the work station and the component supply unit are movably provided in the first direction, respectively, and suck the chip component. A head for mounting this on a printed circuit board is provided movably on a plane in a second direction orthogonal to the first direction.

According to a second aspect of the present invention, a plurality of heads movable in the second direction are arranged.

According to a third aspect of the present invention, a plurality of heads that are independently movable in the second direction are arranged side by side in the first direction.

[0010]

According to the present invention, when the chip component is mounted on the printed board, the printed board is held in the work station. Then, while the component supply unit is moved in the first direction, the chip component to be adsorbed is positioned at the adsorbable position of the head, and the head is moved in the second direction to move from the component supply unit at the adsorbable position. Adsorb chip parts. At this time, since the component supply unit supplies the chip components toward the work station, even when various types of chip components can be supplied, the component supply unit is moved in the first direction, The head can always pick up chip components at the same position, and it is possible to keep the movement time of the head that reciprocates between the component supply unit and the printed circuit board to a minimum and to keep it constant. Can be increased.

At the time of mounting, the head sucking the chip component is moved in the second direction and the work station is moved in the first direction, so that the chip component is placed at a predetermined mounting position on the printed circuit board. Is implemented (claim 1).

If a plurality of heads are used, the number of chip components to be sucked and mounted per predetermined time can be increased, so that mounting efficiency can be improved (claim 2).

Furthermore, when a plurality of heads that are independently movable in the second direction are arranged side by side in the first direction, mounting is performed by shifting the cycle of suction and mounting of chip components in each head. It is possible to increase efficiency. Moreover, since each head is individually driven, the size of each head does not increase. Therefore,
Since there is no increase in inertial force when the head moves as the size of the head increases, more accurate and reliable mounting work can be performed (claim 3).

[0014]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing an example of a surface mounter according to the present invention, and FIG. 2 is a view taken in the direction of arrow A in FIG.

As shown in FIG. 1, on a base 1 of a surface mounter, a carrier line 2a for carrying a substrate P in the widthwise center thereof in the arrow direction (X-axis direction: first direction) in the figure. , 2
b is provided. Each of these transfer lines 2a, 2b
Are arranged so as to face each other at a predetermined interval in the X-axis direction, and a work station 3 for holding the substrate P at the time of mounting chip components is provided between them so as to be movable in the X-axis direction. ing. That is, a pair of fixed rails 8 extending in the X-axis direction are provided on the base 1 at predetermined intervals in the direction orthogonal to the X-axis direction (Y-axis direction: second direction).
The base 4 of the work station 3 is attached to the fixed rail 8.
Is mounted slidably, and a ball screw shaft 9 rotatably driven by a servomotor 10 fixed on the base 1 is screwed into a nut portion 7 provided in the work station 3. When the ball screw shaft 9 is rotated by the operation of the servomotor 10, the work station 3 is moved along the fixed rail 8 between the transfer line 2a and the transfer line 2b. .

In the work station 3, a pair of chucks 5 is provided at both ends of the base 4 in the Y-axis direction, and holding grooves 6 for holding the substrate P are formed on the opposing surfaces of the chucks 5, respectively. At the same time, each chuck 5 can be brought into and out of contact by a driving means (not shown).

On the outer sides of both sides of the transfer lines 2a, 2b (in the vertical direction in FIG. 1), the component supply sections 12a,
12b is provided. Each component supply unit 12a, 12b
Is provided with multiple rows of tape feeders 13a and 13b aligned in the X-axis direction.
3a and 13b are feeder supporting members 14a and 14 respectively.
supported by b. Each tape feeder 13
a and 13b are equipped with a supply tape wound around a reel, and each supply tape has an IC, a transistor,
Chip-shaped chip parts such as capacitors are housed at predetermined intervals. Then, by a feeding mechanism (not shown), the chip component is fed toward the work station 3 while the supply tape is intermittently fed as the chip component is fed.

Each of the component supply parts 12a and 12b is movable in the X-axis direction. That is, the feeder supporting members 14a and 14b are fixed rails 15a and 15 provided on the base 1 and extending in the X-axis direction.
ball screw shafts 17a, 17b, which are slidably mounted on the base plate 1b and are driven to rotate by servomotors 16a, 16b fixed on the base 1, are provided with nut portions 18a on the feeder support members 14a, 14b. 18
It is screwed to b. Then, each of the servo motors 15
When the ball screw shafts 17a and 17b are rotated by the operation of a and 15b, the above-mentioned component supply parts 12a and 12
b moves in the X-axis direction along the fixed rails 15a and 15b.

The feeder support member 14a on one side is also provided.
Is provided with a spare nozzle holding portion 18 for holding a replacement nozzle for a nozzle 21 described later, and the component supply portion 12a and the spare nozzle holding portion 18 are moved integrally in the X-axis direction. It has become so.

On the other hand, above the base 1, heads for mounting components, in the illustrated embodiment, first to third heads 20 are provided.
a to 20c are provided, and the heads 20a to 20c are movable in the Y-axis direction. That is, above the base 1, three support rods 22 extending in the Y-axis direction are provided.
Are mounted in a bridged state on a pair of frames 26 arranged at a predetermined interval in the Y-axis direction, and the heads 20a to 20c are slidably mounted on the support rods 22 and are supported by each support. Three ball screw shafts 24a to 24c, which are rotatably driven by three servo motors 23a to 23c fixed to the frame 26 corresponding to the rod 22, respectively, respectively, are the heads 20a to 2c.
0c is screwed to nut portions 25a to 25c. The heads 20a to 20c are moved along the support rod 22 by rotating the ball screw shafts 24a to 24c by the operation of the servo motors 23a to 23c.

Each of the heads 20a to 20c is provided with a nozzle 21 for adsorbing a chip component, and each nozzle 21 moves up and down (moves in the Z-axis direction) with respect to the frame of the head 20a to 20c. And nozzle center axis (R
It is possible to rotate about a shaft) and is operated by a servo motor (not shown). Further, a negative pressure from a negative pressure generation source (not shown) is supplied to each nozzle 21 via a valve member or the like, and the negative pressure supplied to each nozzle 21 is applied to the tip of each nozzle at the time of mounting. It acts so as to attract the chip components.

Further, on the base 1, between the work station 3 and the component supply section 12b on one side, three component recognition cameras 27a to 27c are provided corresponding to the movement paths of the heads 20a to 20c. 27c is provided. Each of these component recognition cameras 27a to 27c includes the above-described head 20a.
Chip heads 20a to 20c are moved by the heads 20a to 20c, the chip parts sucked by the nozzles 21 to 20c are recognized.
By moving above 7c, the chip component is recognized, and thereby the suction displacement of the chip component with respect to each nozzle 21 is detected.

By the way, the surface mounter configured as described above includes a controller (not shown) having a microcomputer as a component, and the work station 3 is provided.
To the servo motor 10, the above-mentioned component supply unit 12a,
Servo motors 16a and 16b for 12b, and servo motors 23a to 2 for the heads 20a to 20c.
3c, servo motors for the nozzles of the heads 20a to 20c, and the camera 27a to 27 for recognizing the components.
All of c and the like are electrically connected to the control device and are controlled by the control device.

Here, an example of control of the surface mounter will be described with reference to FIG.

First, when the mounting operation is started, the work station 3 is moved to the left side in the X-axis direction (left side in FIG. 1) and brought into contact with the transfer line 2a. In this state, FIG. As shown in FIG. 3, the substrate P transferred by the transfer line 2a is received and held. More specifically, the transported substrate P is held by the holding groove 6 of each chuck 5 provided in the work station 3 from the transport line 2a.
And is sent to a predetermined work position of the work station 3. The substrates P are held by the chucks 5 being moved toward each other, whereby the substrates P are held at the work station 3.

By the way, while the above work is being performed,
Each component supply unit 12a, 12b and each head 20a to 20
In c, the first and second heads 20a and 20b have already picked up the chip component, and the component recognition camera 27a,
After the confirmation of the displacement of the suction position by 27b is completed, as shown in FIG. 3A, the chip is placed in a standby state at the position in the Y-axis direction where the chip component is to be mounted, and the third head 20c moves the chip. Adsorbing parts.

Then, by moving the work station 3, the amount of correction of the suction position deviation of the chip component sucked by the first head 20a should be taken into consideration, and then the chip component sucked by the first head 20a should be mounted. When the substrate P is moved to the position in the X-axis direction, the nozzle 21 of the head 20a is rotated and lowered to mount the chip component on the substrate P. At the same time, the component supply unit 12a
The next chip component that is to be moved by the two-dot chain line in FIG.
It is arranged at a position where the head 20a of FIG. At this time, at the same time, the third head 20c moves to the position of the component recognition camera 27c, and the suction position shift of the suction chip component is recognized by the component recognition camera 27c.

When the mounting of the chip components sucked by the first head 20a is completed as described above, then, as shown in FIG.
As shown in (b), after taking into account the correction amount for the displacement of the suction position of the chip component sucked by the second head 20b, the chip component sucked by the second head 20b is to be mounted in the X-axis direction. The substrate P is moved to the position. At this time, at the same time, the first head 20a is moved to the component supply unit 12a to adsorb the chip component, and the third head 20c is to adsorb the chip component, and the chip component should be mounted. The position is set in the Y-axis direction. Then, when the movement of the substrate P is completed, the chip component sucked by the second head 20b is mounted on the substrate P. At the same time, the component supply unit 12b is moved from the position shown by the broken line in the figure to the position shown by the solid line, and the next chip component to be sucked by the second head 20b is moved to the second head 20b. Place it at a position where it can be adsorbed. At this time, at the same time, the first head 20a
Moves to the position of the component recognition camera 27a, and the suction position shift of the suction chip component is recognized by the component recognition camera 27a.

When the mounting of the chip component sucked by the second head 20b is completed, as shown in FIG. 3C, the correction amount for the displacement of the suction position of the chip component sucked by the third head 20c. In consideration of the above, the substrate P is moved to the position in the X-axis direction where the chip component sucked by the third head 20c is to be mounted. At this time, at the same time, the second head 20b moves to the component supply unit 12b to adsorb the chip component, and at the same time, the first head 20b.
In the state where a picks up the chip component, it is set at the position in the Y-axis direction where this chip component is to be mounted. Then, when the movement of the substrate P is completed, the chip component sucked by the third head 20c is mounted on the substrate P. At the same time, the component supply unit 12a
The next chip component that is moved from the position shown by the broken line to the position shown by the solid line in the figure and should be picked up by the third head 20c is placed at the position where the third head 20c can pick it up. At this time, at the same time, the second head 20b moves to the position of the component recognition camera 27b, and the suction position shift of the suction chip component is recognized by the component recognition camera 27b.

The chip components are mounted on the substrate P by sequentially repeating the suction of the chip components by the heads 20a to 20c and the mounting on the substrate P as described above.

When all the mounting of the chip parts on the substrate P is completed, then the working station 3 is moved to the right side in the X-axis direction (the right side in FIG. 1) and brought into contact with the transfer line 2a. The substrate P is delivered to the transfer line 2b by the delivery means. And this transport line 2
Due to b, the board P after the mounting is carried to the next step.

As described above, in the surface mounter having the above structure, the substrate P is moved by the work station 3 in the X-axis direction, and the component supply parts 12a and 12b are also moved in the X-axis direction.
Further, by making each of the heads 20a to 20c movable in the Y-axis direction, these heads are relatively moved in the XY plane, and moreover, the component supply parts 12a and 12b are respectively directed toward the work station 3 toward the chip component. Since it is possible to supply the chip components, it is possible to improve the efficiency of the mounting work, simplify the structure of the head portion, and perform the mounting work of the chip component accurately and surely.

That is, in the above surface mounter, a plurality of types of chip components supplied from the component supply units 12a and 12b are supplied toward the work station 3 in a state of being aligned in the X-axis direction, and each component supply unit is also supplied. Since 12a and 12b are respectively movable in the X-axis direction, in order to mount a larger number of types of chip components, the component supply units 12a and 12b
Even when 12b is extended in the X-axis direction, each component supply unit 1
2a and 12b are moved to the suction positions of the heads 20a to 20c, so that the board P and the component supply units 12a and 12b are moved.
It is possible to minimize the moving time of each head 20a to 20c that reciprocates between and. In addition, the three heads 20a to 20c that operate individually are provided, and the cycle in which the chip components are sucked and mounted on the substrate P is shifted by a fixed time for each of the heads 20a to 20c. In the surface mounter, the mounting time can be limited to the time required to move the substrate P in the X-axis direction at the time of positioning during mounting and the time required to add the mounting time of the chip component to the substrate. It is possible to avoid the loss of the reciprocating time of the heads 20a to 20c that reciprocate between P and the component supply units 12a and 12b. Therefore, extremely efficient mounting work can be performed.

Further, as described above, three heads 20a to 20c having one nozzle 21 are provided, and each head 2
Each of the heads 2a to 20c is provided with a drive source and a drive mechanism for individually operating the heads 20a to 20c.
It is possible to simplify 0a to 20c itself, and thereby to reduce the size and weight of each head 20a to 20c. Therefore, the heads 20a to 20c can be moved at high speed with a relatively small torque, so that the mounting efficiency can be improved, and the inertial force of the heads 20a to 20c generated when the heads are moved or stopped can be reduced. Since the heads 20a to 2 can be made smaller,
It is possible to position 0c more accurately,
As a result, more accurate and reliable mounting work can be performed.

The above embodiment is an example of the surface mounter according to the present invention, and other various modifications can be considered. For example, the part recognition camera 27
a, 27b, 27c on both sides of the work station 3 (see FIG. 1).
Then, they may be arranged on both sides in the Y-axis direction, and after picking up the parts, the pick-up position deviation of the chip parts may be recognized by the parts recognition cameras 27a, 27b, 27c closest to the respective part supply parts 12a or 12b. . According to this, there is an advantage that the moving time of the head for component recognition can be shortened. Further, for example, instead of the component supply units 12a and 12b of the above embodiment, as shown in FIG. 4, a plurality of component supply units 12a are provided on each side of the transfer lines 2a and 2b.
-1, 12a-2 and 12b-1, 12b-2 are provided so as to be individually movable in the X-axis direction. For example, when the number of parts to be mounted on the substrate P is large, the part supply unit 12a-1. And 12a-2, and the component supply unit 1
In the case where the components are supplied while moving 2b-1 and 12b-2 in the X-axis direction in a state of being in contact with each other in the X-axis direction, and conversely, the number of mounted components on the substrate P is small. As shown in FIG.
-2 and 12b-2 may be retracted to the side of the transport line 2a, and the components may be supplied while moving only the component supply units 12a-1 and 12b-1 in the X-axis direction. According to this, the efficiency at the time of mounting can be increased according to the boards having different specifications.

Further, in consideration of the space for installing the surface mounter, the layout, etc., as shown in FIG. 5, the structure is basically the same as that of the above embodiment, and only the transfer lines 2a and 2b are arranged in the Y-axis direction. It is also possible to mount the chip component while the substrate P transported in the Y-axis direction is moved to the work station 3 and moved in the X-axis direction. In this case, in particular, two sets of heads, work stations, and component supply units 12a, 12b are provided, and the transfer lines 2a, 2
By arranging b symmetrically, it is possible to perform the mounting work on the plurality of substrates P in parallel, and it is possible to improve the mounting efficiency more than in the above-described embodiment.

Further, in the above embodiment, one nozzle 2
Although three heads 20a to 20c provided with 1 are provided to perform the mounting work of the chip component, the number of heads may be one or two, or may be four or more. Absent. Further, the control of the surface mounter may be appropriately set in accordance with the number of heads, the moving speed of the heads, or the like, in addition to the control shown in the above embodiment, so as to obtain a desired mounting efficiency. Good.

Further, as in the embodiment shown in FIG. 6, a plurality of heads 2 that move integrally with one support rod 22.
It is also possible to configure one in which 0a and 20b are arranged.
In this apparatus, after the head 20a sucks the chip component, the component supply unit 12 is moved so that the head 20b sucks the chip component. Then, at the time of mounting, after the component recognition cameras 27a and 27b simultaneously recognize the suction position deviation of the chip components that are attracted to the heads 20a and 20b, the chip components of the head 20a and the chips of the head 20b are mounted on the substrate P. Chip components are mounted on the substrate P in the order of components. According to this device, the head 20a
By setting the movement amount of the component supply unit 12 in the X-axis direction at the time of picking up the chip component of the head and the head 20b, or the movement amount of the work station in the X-axis direction at the time of mounting the chip component to be small. , The mounting efficiency can be improved.

Further, as in the embodiment shown in FIG. 7, the head is attached to the ball screw shafts 24a and 24b which are rotatably driven by the servomotors 10a and 10b arranged on both sides of one support rod 22 so as to face each other. It is also possible to configure a structure in which 20a and 20b are movably mounted. In this device, the head 20a sucks the chip component from the component supply unit 12a, and after the component recognition camera 27a recognizes the suction position shift of the suction chip component, the chip component is mounted on a portion of the substrate P that is slightly over half on one side. To do. On the other hand, after a delay of half a cycle from the head 20a, the head 20b sucks the chip component from the component supply unit 12b, and the component recognition camera 27b recognizes the suction position shift of the suction chip component, and then the opposite of the substrate P. Chip parts are mounted on the side half-strength. At this time, the chip components can be mounted near the center line of the substrate P by either of the heads 20a and 20b. According to this apparatus, the mounting efficiency can be improved by alternately mounting the chip components by the heads 20a and 20b.

[0041]

As described above, according to the present invention, the printed circuit board can be moved by the work station in the first direction, the component supply portion can be moved in the first direction, and the head can be moved in the second direction. By doing so, these components are moved relative to each other so that the component supply units can supply the chip components to the work stations, respectively. By moving in the direction of 1, the head can always pick up chip components at the same position, and it is possible to keep the movement time of the head that reciprocates between the component supply unit and the printed circuit board to a minimum. Therefore, the mounting efficiency can be improved. In addition, the required rigidity of the head supporting portion is lower than that of a head that moves in two axial directions,
It is possible to reduce the weight and size of the head supporting portion.

Further, by using a plurality of heads, it becomes possible to increase the number of chip components that can be picked up and mounted per predetermined time, and the mounting efficiency can be further improved.

Further, by arranging a plurality of heads that are independently movable in the second direction side by side in the first direction, it is possible to prevent the heads from increasing in size and to increase the size of the heads. More accurate and reliable mounting work can be performed without causing an increase in inertial force during movement.
It is possible to further improve the mounting efficiency by shifting the cycle of picking up and mounting the chip components in each head.

Therefore, according to the surface mounter of the present invention, the efficiency of the mounting work can be improved.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a surface mounter according to the present invention.

FIG. 2 is a view on arrow A in FIG.

3A and 3B are explanatory views showing an example of control of a surface mounter according to the present invention, FIG. 3A is a view showing mounting of chip components by a first head, and FIG. 3B is a chip by a second head. FIG. 6 is a diagram showing a time of mounting a component, and FIG. 8C is a diagram showing a time of mounting a chip component by the third head.

FIG. 4 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 5 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 6 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 7 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 8 is a schematic plan view showing a conventional surface mounter.

[Explanation of symbols]

 2a, 2b Conveying line 3 Work station 12a, 12b Component supply section 20a, 20b, 20c Head P Substrate

Claims (3)

[Claims] 1. A device for mounting a chip component supplied from a component supply unit on a printed circuit board transported on a transport line, wherein the printed circuit board is received from the transport line and moved while holding the printed circuit board. A work station is provided and arranged so that the component supply unit can supply the chip component toward the work station. The work station and the component supply unit are respectively movably provided in the first direction, and the chip is provided. A surface mounter, wherein a head for adsorbing a component and mounting the component on a printed circuit board is provided movably in a second direction intersecting with the first direction on a plane. 2. The surface mounter according to claim 1, wherein a plurality of heads movable in the second direction are provided. 3. The surface mounting machine according to claim 1, wherein a plurality of heads that are independently movable in the second direction are arranged side by side in the first direction.