JP2013149778A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting apparatus capable of making components to be mounted in the next mounting cycle stand by without fail.SOLUTION: A component mounting device 1 includes: a dedicated component transfer device 4 which transfers components to be used in the current mounting cycle and mounts them on a substrate PB; and a dedicated standby component arrangement device 6 which makes components to be used in the next mounting cycle stand by. Thus, even if the component transfer device 4 is in mounting operation of the component, the standby component arrangement device 6 can perform component standby operation. Therefore, the operation ratio of the component transfer device 4 and the standby component arrangement device 6 can be improved and the mounting tact time can be shortened.

Description

  The present invention relates to a component mounting apparatus that sucks and holds a component from a component supply device by a component transfer device, and transfers and mounts the component onto a substrate that is transported by a substrate transport device.

  For example, Patent Document 1 discloses the following component mounting apparatus. This component mounting apparatus includes a plurality of component supply devices (supply units), a plurality of component transfer devices (transfer heads) corresponding to each component supply device, and a plurality of component transfer devices corresponding to each component transfer device. And a temporary stage. In this component mounting apparatus, when mounting of a component by one component transfer device is completed before mounting of a component by another component transfer device and one component transfer device waits, one component transfer device A component to be mounted in the next mounting cycle by the apparatus is temporarily placed on a temporary placement stage and waited. Thereby, the standby time of one component transfer apparatus can be used effectively, and the mounting tact time can be shortened.

JP 2001-68894 A (paragraph number 0005, FIG. 2)

  In the component mounting apparatus described in Patent Document 1, the temporary placement standby operation by one component transfer device is completed before the component mounting by one component transfer device is performed before the component mounting by another component transfer device. When you are limited. For this reason, when components are mounted by all the component transfer apparatuses, there is a possibility that the temporary placement standby operation cannot be performed, and the mounting tact time cannot be shortened.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a component mounting apparatus capable of reliably waiting for a component to be mounted in the next mounting cycle.

  In order to solve the above-described problem, the invention according to claim 1 is directed to a component supply device that includes a component storage device for each component type, and stores a component in a component mounting position. A substrate carrying device that is carried in and out, a mounting head that is moved in a horizontal plane by a driving device, and a plurality of component suction nozzles that are mounted on the mounting head. The component transfer device that repeats the mounting cycle to be transferred and mounted on the substrate, and the component transfer device that is arranged at the preparation position of the component, holds the component to be mounted on the substrate in the next mounting cycle in a standby state. A standby component holding device; and a standby component arranging device that takes the component out of the component storage device, transfers the component to the standby component holding device, and holds the component.

  The invention according to claim 2 is the component mounting apparatus according to claim 1, wherein the standby component arraying device includes the component that is mounted on the substrate by the plurality of component suction nozzles in each mounting cycle. It has a function of sucking and holding from a supply device, further reversing and transferring to the preparation position, and a function of delivering the held component to the mounting head.

  The invention according to claim 3 is the component mounting apparatus according to claim 1, wherein the mounting head on which the plurality of component suction nozzles are mounted is detachable from the component transfer device and the standby component arranging device, and The mounting head alone can hold the component by suction, and the mounting head can be mounted on the standby component holding device in a state where the component is sucked.

  The invention according to claim 4 is the component mounting apparatus according to claim 1, wherein the standby component arranging device arranges the components to be mounted on the substrate by the component suction nozzle from the component supply device to a tray. The standby component holding device includes a tray exchange device for exchanging the tray in which the components to be mounted in the current mounting cycle are arranged and the tray in which the components to be mounted in the next mounting cycle are arranged. It is.

  The invention according to claim 5 is the component mounting apparatus according to any one of claims 1 to 4, wherein the standby component arraying device includes the plurality of component suction nozzles on the substrate in each of the mounting cycles. The standby component holding device holds the component to be mounted according to at least one of the arrangement of the component suction nozzles and the mounting angle of the component when mounted on the substrate.

  According to the first aspect of the present invention, the component mounting apparatus transfers a component used for the current mounting cycle and mounted on the board, and a component used for the next mounting cycle. And a dedicated standby component arranging device for waiting. For this reason, even if the component transfer device is in the component mounting operation, the standby component arranging device can perform the component standby operation. Therefore, the operation rate of the component transfer device and the standby component arrangement device can be improved, and the mounting tact time can be shortened. By disposing at least one standby component arrangement device in one component supply device and assisting component supply to the corresponding component transfer device, the mounting tact time can be greatly reduced. The number of component transfer devices corresponding to the standby component arrangement device here may be one or plural. Further, the corresponding component transfer device referred to here may correspond to one substrate transfer device, or may correspond to a plurality of substrate transfer devices.

  According to the second aspect of the present invention, the standby component arranging device is reversed after sucking and holding the component that needs to be reversed, and delivered to the mounting head of the component transfer device. For this reason, since the component transfer apparatus can mount the reversal component on the substrate as it is, the mounting tact time when the reversal component needs to be mounted can be greatly reduced.

  According to the third aspect of the present invention, the mounting head of the component transfer device is detachable from the component transfer device and the standby component arranging device, and the component can be sucked and held even after being detached. It can be placed on the standby part holding device. For this reason, the standby component arranging device mounts the mounting head detached from the component transfer device, sucks and holds the components to be mounted on the substrate in the next mounting cycle, and places them on the standby component holding device. Can do. Therefore, the component transfer apparatus can mount the mounting head as it is and mount the sucked and held component on the substrate, so that the mounting tact time can be further shortened.

  According to the invention of claim 4, the standby part holding device exchanges the tray in which the parts to be mounted in the current mounting cycle are arranged and the tray in which the parts to be mounted in the next mounting cycle are arranged. A tray changer is provided. For this reason, the standby component arranging device can arrange in advance components that are to be mounted on a new tray in subsequent mounting cycles. Therefore, the operating rate of the standby component arranging device can be improved, and the mounting tact time can be further shortened.

  According to the fifth aspect of the present invention, the standby component arranging device holds the component in the standby component holding device according to at least one of the arrangement of the component suction nozzles and the mounting angle of the component when mounted on the substrate. ing. As a result, the component transfer device can hold the components held by the standby component holding device in a short time or at once as they are, and mount them on the substrate in the order in which the component suction nozzles are arranged. In addition, since the mounting angle of the sucked and held component on the substrate has already been set, only the suction posture needs to be corrected. Therefore, the operating rate of the component transfer device can be improved, and the mounting tact time can be further greatly reduced. In addition, in the operation program of the component transfer apparatus, data processing such as component mounting order and mounting angle can be omitted, so that a simple program can be processed at high speed.

It is a top view which shows the outline of the component mounting apparatus by embodiment of this invention. It is the schematic which looked at the principal part of the component mounting apparatus of FIG. 1 in the Y direction. (A) is a top view which shows the example of arrangement | positioning of the components hold | maintained at the standby component holding | maintenance apparatus of the component mounting apparatus of FIG. 1, (B) is a top view which shows another example of arrangement | positioning. (A) is a top view which shows the component mounting path | route by the component mounting apparatus of FIG. 1, (B) is a top view which shows the component mounting path | route by the conventional component mounting apparatus. (A) is the schematic which looked at the component mounting apparatus by 2nd Embodiment in the Y direction, (B) is the schematic which shows the adsorption | suction operation | movement of the components by the standby component arrangement | sequence apparatus of this component mounting apparatus, (C ) Is a schematic diagram showing a component reversing operation by the standby component arranging device of the component mounting apparatus, and (D) is a schematic diagram showing a component delivery operation by the standby component arranging device of the component mounting apparatus. (A) is the schematic which looked at the component mounting apparatus by 3rd Embodiment in the Y direction, (B) is the standby component arrangement | positioning apparatus of this component mounting apparatus, and each mounting head of a component transfer apparatus. Schematic showing the state transferred to the holding device, (C) is a schematic diagram showing the state where each mounting head of the standby component arranging device and the component transfer device is placed on the standby component holding device, (D) is the standby It is the schematic which shows the state which the components arrangement | positioning apparatus and the components transfer apparatus replaced and mounted the mounting head from the stand-by component holding device. It is a top view which shows the outline of the component mounting apparatus by 4th Embodiment. It is the schematic which looked at the component mounting apparatus of FIG. 7 in the Y direction. It is a top view which shows the outline of the component mounting apparatus by 5th Embodiment.

  Embodiments of a component mounting apparatus according to the present invention will be described below with reference to the drawings. In the figure, the transport direction of the substrate PB is the Y direction, the horizontal direction orthogonal to the Y direction is the X direction, and the vertical direction orthogonal to the Y direction is the Z direction.

  As shown in FIGS. 1 and 2, the component mounting apparatus 1 according to the present embodiment is disposed on the back side (upper side in FIG. 1, left side in FIG. 2) of the upper surface of the base 19, and conveys the board PB to the A substrate transfer device 2 that carries in and out of the mounting position A, and a component supply device that is disposed on the front side of the upper surface of the base 19 (lower side in FIG. 1, right side in FIG. 2) and supplies components to be mounted on the substrate PB 3, a component transfer device 4 that is disposed above the upper surface of the base 19 and sucks and transfers a component to be mounted on the substrate PB in the current mounting cycle by a standby component holding device 5 described later, and a base 19 A standby component holding device 5 which is disposed at a component preparation position B between the substrate transfer device 2 and the component supply device 3 on the upper surface and holds components to be mounted on the substrate PB in the next mounting cycle so as to be ready; A component supply device that is disposed above the upper surface of the table 19 and is held by the standby component holding device 5 3 constituted by a stand-component arrangement device 6 or the like for transporting adsorbed at.

  The substrate transfer device 2 includes a pair of guide rails 21a and 21b, a pair of conveyor belts 22a and 22b, a clamp device 23, and the like. The pair of guide rails 21a and 21b extend in the Y direction and are arranged in parallel to each other with a distance substantially the same as the width of the substrate PB. The pair of conveyor belts 22a and 22b are juxtaposed directly below the guide rails 21a and 21b. The clamp device 23 is disposed between the pair of guide rails 21a and 21b and below the mounting position. In the substrate transport apparatus 2 having such a configuration, the substrate PB is transported to the component mounting position A by the pair of conveyor belts 22a and 22b while being guided in the Y direction by the pair of guide rails 21a and 21b. The belts 22a and 22b are pushed up and clamped to be fixed in position.

  The component supply device 3 is a feeder holder portion in which a plurality of cassette-type feeders 31 (corresponding to the “component storage device” of the present invention) that accommodate and supply components of different component types are set along the Y direction. 32 etc. The feeder 31 is roughly configured by a feeder main body 31a in which a component supply reel 33 is set at the rear portion and a component pick-up location 31b provided at the front portion of the feeder main body 31a. The component supply reel 33 is wound with a carrier tape 34 in which components are arranged at a predetermined pitch and covered with a cover tape (not shown). In the component supply apparatus 3 having such a configuration, the carrier tape 34 is pulled out at a predetermined pitch by a sprocket (not shown) provided in the feeder main body 31a, the cover tape is peeled off, and the components are sequentially transferred to the component pick-up location 31b. The carrier tape 34 is wound up while being fed.

  The component transfer device 4 includes a first head holder 41 and the like that are moved in a horizontal plane by a first drive device 40 (corresponding to a “drive device” of the present invention). The first drive device 40 includes a pair of fixed rails 42a and 42b, a first head moving rail 43, and the like. The pair of fixed rails 42 a and 42 b extend in the X direction above both ends of the substrate transport apparatus 2 and are arranged in parallel to each other. The first head moving rail 43 is arranged extending in the Y direction, and both ends thereof are supported so as to be movable along the fixed rails 42a and 42b. The movement of the first head moving rail 43 is controlled by a servo motor (both not shown) via a ball screw.

  The first head holder 41 is supported so as to be movable along the first head moving rail 43. The movement of the first head holder 41 is controlled by a servo motor (both not shown) via a ball screw. The first head holder 41 rotates around a Z axis and a first recognition camera 44 capable of recognizing a component mounting position on the substrate PB and recognizing a component holding position on a holding stand 51 of a standby component holding device 5 described later. A first mounting head 45 (corresponding to the “mounting head” of the present invention) that can move up and down in the Z direction is held. The first mounting head 45 includes a first nozzle holder 47 that detachably holds a first component suction nozzle 46 (corresponding to a “component suction nozzle” of the present invention) that sucks components. A plurality of (eight in this example) are projected downward at equal angular intervals on a circumference around the rotation axis.

  The first nozzle holder 47 to which the first component suction nozzle 46 is mounted is supported so as to be able to move up and down in the Z direction from the first mounting head 45 and to rotate about the Z axis. The raising and lowering of the first nozzle holder 47 to which the first component suction nozzle 46 is mounted is controlled by a servo motor (both not shown) via a ball screw, and the first nozzle holder to which the first component suction nozzle 46 is mounted. The rotation of 47 is controlled by a servo motor (both not shown) through a gear mechanism. The first component suction nozzle 46 is formed in a substantially hollow cylindrical shape and is connected to a vacuum pump (not shown) via a three-way valve that can switch between atmospheric pressure, positive pressure, and negative pressure. It is configured to be able to hold by suction. A component recognition camera 48 capable of recognizing the suction state of the component of the first component suction nozzle 46 is attached between the component transfer device 4 and the component supply device 2.

  In the component transfer device 4 having such a configuration, a component held on a holding table 51 of a standby component holding device 5 described later is sucked by the first component suction nozzle 46 and the first head moving rail 43 and the first head moving rail 43. It is transferred to the substrate PB positioned at the component mounting position A by one head holder 41 and is mounted at the component mounting position on the substrate PB by the first component suction nozzle 46.

  The standby part holding device 5 includes a holding base 51 that holds a plurality of parts side by side so as to be ready for standby. A plurality of (in this example, eight) first component suction nozzles 46 of the component transfer device 4 are placed on the substrate PB during the next mounting cycle on the holding table 51 of the standby component holding device 5 having such a configuration. The parts sucked by a plurality of (eight in this example) second part suction nozzles 66 of the standby part arranging device 6 to be described later are placed so that the parts to be mounted can be picked up. ing.

  The arrangement of components on the holding base 51 differs depending on the suction method of the first component suction nozzle 46 of the first mounting head 45. For example, in the case of a type in which the first component suction nozzle 46 descends and sucks a component eight times when the first mounting head 45 rotates to a certain angular position, as shown in FIG. The eight parts P1 to P8 are arranged in a straight line in the Y direction (or the X direction). Further, the components P1 to P8 are arranged at an angle corresponding to the component mounting angle when the components P1 to P8 are mounted on the substrate PB. On the other hand, when the first mounting head 45 is lowered and the eight first component suction nozzles 46 suck the components at a time, as shown in FIG. The arrangement is arranged in a circle according to the arrangement of the first component suction nozzles 46. Further, the components P1 to P8 are arranged at an angle corresponding to the component mounting angle when the components P1 to P8 are mounted on the substrate PB.

  By adopting such a component arrangement, the component transfer device 4 sucks and holds the components held on the holding stand 51 of the standby component holding device 5 in a short time or at a time, and the first component suction nozzle 46 Can be mounted on the substrate PB in the order of arrangement. In addition, since the mounting angle of the component held by suction on the substrate PB has been set, only the suction posture needs to be corrected. Therefore, the operation rate of the component transfer apparatus 4 can be improved, and the mounting tact time can be further greatly reduced. Further, in the operation program of the component transfer apparatus 4, data processing such as component mounting order and mounting angle can be omitted, so that a simple program can be processed at high speed.

  The standby component arranging device 6 includes a second head holder 61 and the like that are moved in a horizontal plane by the second driving device 60. The second driving device 60 includes a pair of fixed rails 42a and 42b that also serve as the first driving device 40, a second head moving rail 63, and the like. The second head moving rail 63 is arranged extending in the Y direction, and both ends thereof are supported so as to be movable along the fixed rails 42a and 42b. The movement of the second head moving rail 63 is controlled by a servo motor (both not shown) via a ball screw.

  The second head holder 61 is supported so as to be movable along the second head moving rail 63. The movement of the second head holder 61 is controlled by a servo motor (both not shown) via a ball screw. The second head holder 61 has a second recognition camera 64 capable of recognizing a component holding position on the holding table 51 of the standby component holding device 5 and a second mounting capable of rotating around the Z axis and moving up and down in the Z direction. The head 65 is held. The second mounting head 65 has a second nozzle holder 67 that detachably holds a second component suction nozzle 66 that sucks components, and the like on a circle around the rotation axis of the second mounting head 65. A plurality (eight in this example) are provided to project downward at angular intervals. The second mounting head 65 may hold the second nozzle holder 67 that detachably holds the single second component suction nozzle 66.

  The second nozzle holder 67 on which the second component suction nozzle 66 is mounted is supported from the second mounting head 65 so as to be movable up and down in the Z direction and rotatable about the Z axis. The raising and lowering of the second nozzle holder 67 to which the second component suction nozzle 66 is mounted is controlled by a servo motor (both not shown) via a ball screw, and the second nozzle holder to which the second component suction nozzle 66 is mounted. The rotation of 67 is controlled by a servo motor (both not shown) through a gear mechanism. The second component suction nozzle 66 is formed in a substantially hollow cylindrical shape and is connected to a vacuum pump (not shown) via a three-way valve that can switch between atmospheric pressure, positive pressure, and negative pressure. It is configured to be able to hold by suction.

  In the standby component arranging device 6 having such a configuration, the components supplied to the component take-out location 31b of the feeder 31 of the component supplying device 3 are adsorbed by the second component adsorbing nozzle 66, and the second head moving rail 63 and It is transferred to the holding table 51 of the standby component holding device 5 by the second head holder 61 and placed at the component holding position on the holding table 51 by the second component suction nozzle 66.

  Next, an operation path at the time of component mounting by the first mounting head 45 of the component transfer apparatus 4 of the component mounting apparatus 1 of the present embodiment, and at the time of component mounting by the mounting head of the component transfer apparatus of the conventional component mounting apparatus. The operation path will be described with reference to FIG. It is assumed that the first mounting head 45 and the conventional mounting head start operation from above the board PB carried into the component mounting position A by the board transfer device 2.

  As shown in FIG. 4A, in the component mounting apparatus 1 according to the present embodiment, the first mounting head 45 is first moved from the substrate PB carried into the component mounting position A by the substrate transport apparatus 2 to the standby component holding apparatus 5. To the holding base 51 (route R1). Then, the eight parts P1 to P8 arranged on the circumference held on the holding table 51 of the standby part holding device 5 are sucked and held at a time by the eight first component suction nozzles 46. Next, it moves from the holding stand 51 to the component recognition camera 48 (path R2), and recognizes the suction states of the components P1 to P8. Then, the component recognition camera 48 moves to the substrate PB (path R3), and the components P1 to P8 are mounted at the component mounting positions on the substrate PB. During this mounting cycle, the standby component arranging device 6 transfers the components P1 to P8 of the next mounting cycle from the component supply device 3 onto the holding table 51 of the standby component holding device 5.

  On the other hand, as shown in FIG. 4B, in the conventional component mounting apparatus, the mounting head firstly receives a predetermined feeder 141 (main book) of the component supply apparatus 3 from the substrate PB carried into the component mounting position by the substrate transport device. In the example, it moves to the feeder 141) on the right side of the figure (route R11). And the component P1 currently supplied to the component extraction location 141a of the feeder 141 is adsorbed and hold | maintained by one component adsorption nozzle of the eight component adsorption nozzles. Furthermore, it moves to a predetermined feeder 142 (in this example, the feeder 142 adjacent to the left of the feeder 141) (path R12), and the component P2 supplied to the component extraction location 142a of the feeder 142 is replaced with the remaining seven components. Adsorption is held by one of the adsorption nozzles (path R13).

  The above operations are repeated, and the components P3 to P8 supplied to the component take-out locations 143a to 148a of the feeders 143 to 148 are sucked and held by the remaining six component suction nozzles (paths R14 to R18), respectively. Next, the part 148a of the feeder 148 is moved to the part recognition camera 48 (path R19), and the suction states of the parts P1 to P8 are recognized. Then, the component recognition camera 48 moves to the substrate PB (path R20), and the components P1 to P8 are mounted at the component mounting positions on the substrate PB.

  As is apparent from FIG. 4, the operation path (R1 to R3) at the time of component mounting of the first mounting head 45 of the component mounting apparatus 1 of the present embodiment is the operation at the time of component mounting of the mounting head of the conventional component mounting apparatus. It is shortened compared to the route (R11 to R20). Therefore, the mounting tact time of the component mounting apparatus 1 of the present embodiment can be made shorter than the mounting tact time of the conventional component mounting apparatus.

  Next, a second embodiment of the component mounting apparatus according to the present invention will be described with reference to FIG. 5 corresponding to FIG. In FIG. 5, the same components as those in FIG. In this component mounting device 70, the standby component arranging device 7 has a different configuration from the standby component arranging device 6 of the component mounting device 1 of the first embodiment. The second head holder 61 of the standby component arranging device 7 holds the second recognition camera 64 and the second mounting head 65 that are the same as the standby component arranging device 6 of the first embodiment. A reversing component suction device 71 that holds a component that needs to be reversed from the supply state is held.

  The reversing component suction device 71 includes a device main body 72, a telescopic arm 73 that can rotate around the Z axis and extend and contract in the Z direction, and a reversing component suction nozzle 74 that can turn around the X axis at the lower end of the telescopic arm 73. And a reversing component nozzle holder 75 that is detachably held. The apparatus main body 72 is attached to the second head holder 61. The telescopic arm 73 is built in the apparatus main body 72. The rotation and raising / lowering of the telescopic arm 73 are controlled by a servo motor (both not shown) via ball screws. The turning of the reversing component nozzle holder 75 to which the reversing component suction nozzle 74 is mounted is an electric motor equipped with a gear mechanism and a servo motor (both not shown) attached between the telescopic arm 73 and the reversing component nozzle holder 75. It is controlled by a hinge 76. The reverse component suction nozzle 74 is formed in a substantially hollow cylindrical shape and is connected to a vacuum pump (not shown), and is configured to suck and hold the component at the lower end of the nozzle.

  In the component mounting apparatus 70 having such a configuration, when the component supplied to the component extraction location 31b of the feeder 31 of the component supply device 3 is a component that does not need to be reversed, the component mounting device 70 is suctioned by the second component suction nozzle 66. The second head moving rail 63 and the second head holder 61 are moved to the holding table 51 of the standby component holding device 5 and are placed at the component holding position on the holding table 51 by the second component suction nozzle 66. ing.

  In addition, when the component supplied to the component pick-up location 31b of the feeder 31 of the component supply device 3 is a component FP that needs to be reversed, the telescopic arm 73 descends and is sucked by the reversing component suction nozzle 74 (FIG. 5). (See (A), (B)), and is inverted by the electric hinge 76 (see FIG. 5C). And it is moved to the 1st head holder 41 by the 2nd head moving rail 63 and the 2nd head holder 61, and is delivered to the 1st component suction nozzle 46 from the inversion component suction nozzle 74 (D of FIG. 5). )reference). In FIG. 5D, only the reverse component suction nozzle 74, the reverse component nozzle holder 75, and the electric hinge 76 of the standby component arrangement device 7 are shown.

  The reversing component suction device 71 may not be held by the second head holder 61 but may be configured to be movable in the Y direction independently above the component extraction location 31b of each feeder 31 of the component supply device 3. In this case, the parts that need to be reversed are transferred from the reversing part suction nozzle 74 to the second part suction nozzle 66, and thereafter, the second head moving rail 63 and the second head holder are the same as the parts that do not need to be reversed. 61 is moved to the holding table 51 of the standby component holding device 5, and is placed at the component holding position on the holding table 51 by the second component suction nozzle 66.

  Next, a third embodiment of the component mounting apparatus according to the present invention will be described with reference to FIG. 6 corresponding to FIG. In FIG. 6, the same components as those in FIG. In this component mounting device 80, the first mounting head 81 of the component transfer device 4, the second mounting head 82 of the standby component arranging device 6, and the holding base 83 of the standby component holding device 5 are the component mounting of the first embodiment. The configuration is different from the first mounting head 45 of the component transfer device 4 of the apparatus 1, the second mounting head 65 of the standby component arranging device 6, and the holding base 51 of the standby component holding device 5.

  The first mounting head 81 of the component transfer device 4 and the second mounting head 82 of the standby component arranging device 6 have the same configuration, and are detachably attached to the first head holder 41 and the second head holder 61. It is the composition which becomes. Since the first component suction nozzle 46 and the second component suction nozzle 66 are connected to the vacuum pump via a three-way valve, the first mounting head 81 and the second mounting head 82 are connected to the first head holder 41 and Even if it is detached from the second head holder 61, the sucked parts can be held at the lower end of each nozzle.

  The holding base 83 of the standby component holding device 5 is configured to hold the first mounting head 81 and the second mounting head 82 in a standby state. That is, the holding base 83 does not contact the first nozzle holder 47 to which the first component suction nozzle 46 is mounted and the second nozzle holder 67 to which the second component suction nozzle 66 is mounted, and does not contact the first mounting head 81. Through holes 83a and 83b capable of supporting the outer periphery of the second mounting head 82 are formed as a first mounting head holding position and a second mounting head holding position.

  In the component mounting apparatus 80 having such a configuration, the second head holder 61 sucks the component P to be mounted in the next mounting cycle supplied to the component pick-up location 31b of the feeder 31 of the component supply apparatus 3, It moves to the holding table 83 of the standby part holding device 5. On the other hand, the first head holder 41 moves to the holding table 83 of the standby component holding device 5 when the component mounting on the board PB in the current mounting cycle is completed (see FIGS. 6A and 6B).

  Then, the second head holder 61 separates the second mounting head 82 from the second head holder 61 and places it on the second mounting head holding position on the holding base 83. On the other hand, the first head holder 41 separates the first mounting head 81 from the first head holder 41 and places it on the first mounting head holding position on the holding base 83 (see FIG. 6C). Then, the first head holder 41 mounts the second mounting head 82 placed at the second mounting head holding position, moves to the substrate PB, and mounts the component P. On the other hand, the second head holder 61 is mounted with the first mounting head 81 mounted at the first mounting head holding position, and the second head holder 61 is supplied to the component take-out location 31b of the feeder 31 of the component supply device 3 one after another. The component mounted in the cycle is sucked (see FIG. 6D).

  Next, a fourth embodiment of the component mounting apparatus according to the present invention will be described with reference to FIGS. 7 and 8, which correspond to FIG. In FIG. 7, the same constituent members as those in FIG. In this component mounting device 90, the standby component holding device 9 and the second drive device 101 of the standby component arranging device 10 are the second of the standby component holding device 5 and the standby component arranging device 6 of the component mounting device 1 of the first embodiment. The configuration is different from that of the driving device 60.

  The standby component holding device 9 includes a tray replacement device 91 that replaces the tray T on which the component P to be mounted in the current mounting cycle is arranged and the tray T on which the component P to be mounted in the next mounting cycle is arranged. I have. The second driving device 101 of the standby component arranging device 10 is arranged in the tray replacing device 91 so that the components P to be mounted on the substrate PB can be arranged from the feeder 31 of the component supplying device 3 to the tray T.

  The tray exchange device 91 includes a housing 92. In the housing 92, a tray stocker 93 in which a tray T for holding components in a standby state is accommodated so as to be inserted and removed is provided so as to be movable up and down. In the upper part of the housing 92, the second drive device 101 of the standby component arranging device 10 is provided. A tray moving device 94 that moves the tray T between the tray stocker 93 and the component preparation position B is provided at the front portion of the housing 92 on the substrate PB side. Moreover, the component supply apparatus 3 is each arrange | positioned so that arrangement | positioning is possible at the housing 92 rear part and both sides.

  The second drive device 101 of the standby component arranging device 10 is different from the second drive device 60 of the standby component arranging device 6 of the first embodiment only in a pair of fixed rails 102a and 102b. . That is, the pair of fixed rails 102 a and 102 b are not used as the first driving device 40 but are provided exclusively for the second driving device 101, and extend in the X direction at both end portions of the upper portion in the housing 92 and are parallel to each other. Is arranged.

  In the component mounting device 90 having such a configuration, the component P supplied to the component take-out location 31b of the feeder 31 of the component supply device 3 is sucked by the second component suction nozzle 66, and the second head moving rail 63 and the second head moving rail 63 are used. The two-head holder 61 is moved to the uppermost tray T, and the second component suction nozzle 66 is placed at a predetermined component holding position on the uppermost tray T. When the component placement on the uppermost tray T is completed, the tray stocker 93 is lowered and the tray T is positioned at the height of the component preparation position B, and the tray T is moved to the uppermost stage of the tray stocker 93 by the tray moving device 94. To the part preparation position B.

  Then, the tray stocker 93 is raised and the predetermined storage stage is positioned at the height of the component preparation position B, and the tray T is stored in the predetermined storage stage of the tray stocker 93 from the component preparation position B by the tray moving device 94. In the same manner, the tray T on which components are placed is stored in each storage stage of the tray stocker 93 in the same manner. Then, the component P on the tray T pulled out from the tray stocker 93 to the component preparation position B at the time of component mounting is sucked by the first component suction nozzle 46 of the component mounting device 3 and the first head moving rail 43 and the first head. It is transferred to the substrate PB positioned at the component mounting position A by the head holder 41 and mounted at the component mounting position on the substrate PB by the first component suction nozzle 46.

  Next, a fifth embodiment of the component mounting apparatus according to the present invention will be described with reference to FIG. 9 corresponding to FIG. In FIG. 9, the same components as those in FIG. The component mounting apparatus 100 includes two board transfer devices 2, a component supply device 3, a component transfer device 4, a standby component holding device 5, and a standby component arranging device 6 of the component mounting device 1 of the first embodiment. It becomes the composition. In other words, the component mounting apparatus 100 inverts one component mounting apparatus 1 180 degrees, and the reversed component transport apparatus 2 of the component mounting apparatus 1 and the other component transport apparatus 2 of the one component mounting apparatus 1 Are arranged so as to face each other. In the component mounting apparatus 100 having such a configuration, component mounting such as board conveyance, component supply, component transfer, standby component holding, and standby component arrangement can be simultaneously processed on both sides of the apparatus, and the mounting tact time is greatly reduced. Is possible.

  As described above, according to the component mounting apparatus 1 of the first embodiment, the component mounting apparatus 1 transfers the components used in the current mounting cycle and mounts them on the board PB. 4 and a dedicated standby component arranging device 6 for transferring and waiting for components used in the next mounting cycle. For this reason, even if the component transfer device 4 is in the component mounting operation, the standby component arranging device 6 can perform the component standby operation. Therefore, the operation rate of the component transfer device 4 and the standby component arrangement device 6 can be improved, and the mounting tact time can be shortened.

  Further, according to the component mounting apparatus 70 of the second embodiment, the standby component arranging apparatus 7 sucks and holds the component FP that needs to be reversed and then reverses and receives the first mounting head 45 of the component transfer apparatus 4. It is supposed to pass. For this reason, since the component transfer apparatus 4 can mount the reversal component FP on the substrate PB as it is, the mounting tact time when the reversal component FP needs to be mounted can be greatly reduced.

  Further, according to the component mounting apparatus 80 of the third embodiment, the first mounting head 81 of the component transfer apparatus 4 is the first head holder 41 of the component transfer apparatus 4 and the second head of the standby component arrangement apparatus 6. The holder 61 can be attached to and detached from the holder 61, and the component P can be sucked and held even after being detached, and can be placed on the holding base 83 of the standby component holding device 5 in a state where the component P is sucked. For this reason, the second head holder 61 of the standby component arranging device 6 is mounted with the first mounting head 81 detached from the first head holder 41 of the component transfer device 4 and mounted on the substrate PB in the next mounting cycle. The parts to be sucked and held can be placed on the holding base 83 of the standby part holding device 5. Therefore, the first head holder 41 of the component transfer device 4 can mount the first mounting head 81 as it is and mount the sucked and held component on the substrate PB, thereby further reducing the mounting tact time. Can be made.

  In addition, according to the component mounting apparatus 90 of the fourth embodiment, the standby component holding apparatus 9 includes the tray T on which the components P to be mounted in the current mounting cycle are arranged and the components mounted in the next mounting cycle. A tray exchanging device 91 for exchanging the tray T on which P is arranged is provided. For this reason, the standby component arranging device 9 can arrange components P to be mounted on new trays T in subsequent mounting cycles in advance. Therefore, the operating rate of the standby component arranging device 9 can be improved, and the mounting tact time can be further shortened.

  In the first to third embodiments described above, the holding bases 51 and 83 of the standby part holding device 5 are fixed on the base 19, and the second mounting head 65 of the standby part arranging device 6 is set to X, Y, The structure is movable in the Z direction. However, the holding bases 51 and 83 are movable in the Y direction, the second mounting head 65 is movable in the X and Z directions, the holding bases 51 and 83 are movable in the Z direction, and the second mounting head 65 is A configuration that can move in the X and Y directions, or a configuration in which the holding bases 51 and 83 can move in the Y and Z directions, and the second mounting head 65 can move in the X direction may be adopted.

  In the first to fifth embodiments described above, at least one standby component arrangement device 6, 10 is arranged in one component supply device 3, and component supply assistance to the corresponding component transfer device 4 is performed. By doing so, the mounting tact time can be significantly reduced. There may be one or a plurality of component transfer devices 4 corresponding to the standby component arrangement devices 6 and 10 here. Further, the corresponding component transfer device 4 described here may correspond to one substrate transfer device 2 or may correspond to a plurality of substrate transfer devices 2.

  DESCRIPTION OF SYMBOLS 1,70,80,90,100 ... Component mounting apparatus, 2 ... Board conveyance apparatus, 3 ... Component supply apparatus, 4 ... Component transfer apparatus, 5, 9 ... Standby component holding apparatus, 6, 10 ... Standby component arrangement apparatus 41 ... first head holder, 45, 81 ... first mounting head, 46 ... first component suction nozzle, 51,83 ... holding base, 61,82 ... second head holder, 65 ... second mounting head, 66 ... Second component suction nozzle, 71... Reverse component suction device, 74... Reverse component suction nozzle, 91... Tray exchange device, PB.

Claims (5)

A component supply device provided with a component storage device for each component type, which stores the components so that the components can be taken out one by one
A board transfer device for loading and unloading the board to and from the component mounting position;
A mounting cycle including a mounting head moved in a horizontal plane by a driving device and a plurality of component suction nozzles mounted on the mounting head, and transporting and mounting the components onto the substrate carried into the component mounting position. Repetitive parts transfer equipment;
A standby component holding device that is arranged at a preparation position of the component and holds the component that the component transfer device is mounted on the substrate in a next mounting cycle in a standby state;
A component mounting apparatus comprising: a standby component arranging device that takes out the component from the component storage device, transfers the component to the standby component holding device, and holds the component. The component mounting apparatus according to claim 1,
The standby component arranging device has a function of sucking and holding the components to be mounted on the substrate by the plurality of component suction nozzles from the component supply device in each mounting cycle, and further reversing and transferring the components to the preparation position. And a component mounting apparatus having a function of delivering the held component to the mounting head. The component mounting apparatus according to claim 1,
The mounting head mounted with the plurality of component suction nozzles can be attached to and detached from the component transfer device and the standby component arraying device, and the component can be sucked and held by the mounting head alone. A component mounting apparatus in which the mounting head can be mounted in a state where the component is adsorbed. The component mounting apparatus according to claim 1,
The standby component arranging device arranges the components to be mounted on the substrate by the component suction nozzle from the component supply device to a tray,
The standby component holding device includes a tray exchange device that exchanges a tray in which the components to be mounted in the current mounting cycle are arranged and a tray in which the components to be mounted in the next mounting cycle are arranged. Feeding device. The component mounting apparatus according to any one of claims 1 to 4,
The standby component arraying device is configured to determine the component mounting angle of the component when the plurality of component suction nozzles are mounted on the substrate and the component suction nozzles are mounted on the substrate in each mounting cycle. A component mounting apparatus for holding the standby component holding apparatus in accordance with at least one of them.

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