JP3778729B2 - Electronic component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus that takes out an electronic component from a component supply unit and mounts the electronic component on a printed board.
[0002]
[Prior art]
An example of an electronic component mounting apparatus in which a mounting head takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board can be found in Japanese Patent Application Laid-Open No. 10-2224090. In this prior art, a plurality of mounting heads are arranged on the periphery of the rotary table, and the mounting head takes out electronic components from the component supply unit by intermittent rotation of the rotary table and mounts them on a printed circuit board placed on the XY table. . Further, the component supply unit moves back and forth to position a desired component at a suction station where the mounting head stops intermittently.
[0003]
[Problems to be solved by the invention]
However, in the prior art, since each mounting head performs various operations in parallel at each stop station, high-speed mounting is possible. However, the mounting head is provided on the rotary table at a predetermined interval, and each mounting head is a component. Stations that do not require other mounting heads to stop each time mounting must also be stopped, and the rotating speed of the rotary table must be the slowest electronic component that is picked up by each mounting head. You have to match what you have to do. In addition, since the component supply unit moves and the individual units that supply components are positioned at the suction position with the component pickup position of the mounting head constant, the movement range of the component supply unit must be secured, There was also a tendency to become large.
[0004]
For this reason, an object of this invention is to enable mounting | wearing of an electronic component at high speed.
[0005]
[Means for Solving the Problems]
For this reason, the present invention is an electronic component mounting apparatus that takes out an electronic component from a component supply unit and mounts the electronic component on a printed circuit board at the component mounting unit, and passes one linear portion passing over the component supply unit and the component mounting unit. An endless track having the other straight line portion and a curved portion between the one straight line portion and the other straight line portion, and an electronic component taken out from the component supply section by individually circulating on the endless track and printed. A plurality of mounting heads to be mounted on the board, and a component recognition unit that is provided below the other linear portion in front of the component mounting unit and recognizes an electronic component held by the mounting head.
[0006]
Since this is done, the mounting head can be moved individually and will not stop even if the other heads are stopped. Furthermore, from one straight line passing on the component supply unit to the front of the component mounting unit via the curved portion Even if the acceleration of the movement of the mounting head reaching the component recognition unit provided below the other straight line portion is kept small, it can be moved at a high speed, and can be moved at a moving speed suitable for the component. The interval between can be changed according to the case.
[0007]
In the present invention, it is preferable that the printed board of the component mounting portion is placed on a moving table that moves in a direction orthogonal to the track.
[0008]
Since it did in this way, the moving mechanism of the table which mounts a printed circuit board can be simplified.
[0009]
In the present invention, it is preferable that the track is a straight line on the component supply unit, and a plurality of component supply units are arranged in the component supply unit so that the component supply direction is oriented in a direction perpendicular to the track. It is set as the structure made.
[0010]
Since it did in this way, the arrangement space | interval of a component supply unit can be narrowed without moving a component supply part, and the space of a component supply part can be made small.
[0012]
Further, the present invention preferably includes a nozzle replacement part that is detachably provided on the mounting head and replaces a suction nozzle that sucks and holds an electronic component, and the nozzle replacement part is provided below the track. is there.
Since it did in this way, when exchanging an adsorption nozzle according to the electronic component which adsorb | sucks next, the present adsorption nozzle and the adsorption nozzle which should attach a nozzle stocker in the nozzle exchange part provided in the downward direction on the said track | orbit Can be replaced.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Since it is not necessary to stop at a useless position, the speed can be increased even if the acceleration is slow.
If you pick up from a component that moves at high speed, you can move the component at your own maximum speed.
[0014]
Embodiments of the present invention will be described with reference to the drawings.
[0015]
In the electronic component mounting apparatus 1 shown in FIG. 1, a component supply unit 3 and a component mounting unit 5 are provided on a base 2. An endless track 8 that guides the movement of the mounting head 7 through these components is disposed above the component supply unit 3 and the component mounting unit 5. Since the endless track 8 is constituted by a linear motor, the plurality of mounting heads 7 can individually circulate on the endless track 8 independently.
[0016]
Conveyors 10 and 11 for conveying the printed circuit board 9 are provided on the base 2 adjacent to the component supply unit 3.
[0017]
A plurality of component supply units 12 are juxtaposed in the component supply unit 3 in the board transfer direction (hereinafter referred to as the X direction) of the transfer conveyors 10 and 11.
[0018]
Each of the component supply units 12 normally stores a large number of electronic components (not shown) of the same type and supplies the components to a predetermined supply position, and different component supply units 12 store different types of electronic components. As a whole, a large number of parts supply units 12 are gathered to supply many kinds of parts. The supply positions of the respective component supply units 12 are arranged on a straight line extending in the X direction in a state of being attached to the component supply unit 3. Since the endless track 8 is provided so as to pass over the supply position of the component supply unit 12, the endless track 8 is provided on a straight line in the X direction on the component supply unit 3. The component supply unit 3 is fixed on the base 2.
[0019]
The component supply unit 12 is arranged such that the longitudinal direction thereof coincides with the Y direction orthogonal to the X direction. Although the component supply direction is also the Y direction, the component supply direction is the direction in which the components are arranged on the tape if the electronic component is sealed in the tape, that is, the direction in which the tape is guided, In addition, if the parts are supplied in a loose state, the direction is a chute direction in which the parts are aligned and sequentially sent. Since the component supply units 12 are arranged in this way, they are arranged so that there is almost no space between the units 12 and the installation space is minimized.
[0020]
In the component mounting unit 5, the printed circuit board 9 is placed on a Y table 14 that moves in the Y direction, and the endless track 8 is provided on the component mounting unit 5 on a straight line in the X direction. Accordingly, the electronic component attracted by the mounting head 7 can be mounted at an arbitrary position on the printed circuit board 9 placed on the Y table 14. Further, the Y table 14 moves to a position where the substrate 9 can be transferred between the conveyors 10 and 11. The conveyor 10 receives the printed circuit board 9 from the upstream apparatus and supplies it to the Y table 14, and the conveyor 11 receives the printed circuit board 9 on the Y table 14 and discharges it to the downstream apparatus. To do.
[0021]
In addition, a component recognition camera 16 is provided below the endless track 8 and in front of the component mounting portion 5 so that the positional deviation of the electronic component sucked by the mounting head 7 with respect to the head 7 is recognized. The camera 16 may be one that images the electronic component by stopping the mounting head 7 in the sky, or may be one that captures while the mounting head 7 is moving. Alternatively, a line sensor that takes the image by moving the mounting head 7 may be used. There is an interval between the position where the camera 16 is arranged and the Y table 14 in which one mounting head 7 can stand by.
[0022]
A nozzle stocker 18 is disposed along the endless track 8 at a position next to the component mounting portion 3, and a suction nozzle 19 that is detachably attached to the mounting head 7 and sucks electronic components is placed on the endless track 8. Arranged along. The suction nozzle 19 can be replaced according to the type of electronic component. An interval is also provided between the nozzle stocker 18 and the Y table 14 so that one mounting head 7 can stand by. The suction nozzle 19 is also configured to rotate about the vertical axis with respect to the mounting head 7 so that the electronic component can be rotated about the vertical axis to perform angular positioning.
[0023]
The operation will be described below with the above configuration.
[0024]
First, electronic components to be picked up by the mounting head 7 according to mounting data in which the XY coordinate position to be mounted on the substrate 9, the rotation angle position about the vertical axis, and the component type to be mounted are specified for each mounting order (not shown). Adsorb. That is, the mounting head 7 is moved by the linear motor driven on the endless track 8 to a position facing the component supply unit 12 that supplies a component of a specified component type, stops, and the electronic component is moved by the lowering of the suction nozzle 19. Is vacuum-adsorbed.
[0025]
Next, the mounting head 7 holding the component is driven by a linear motor, moves on the endless track 8 and stops on the recognition camera 16. It is recognized with respect to the XY direction and the rotation angle how much the component is held with respect to the suction nozzle 19 by the imaging of the camera 16.
[0026]
Next, the mounting head 7 that has completed the component recognition moves to the component mounting unit 3, and is positioned on the endless track 8 in the X direction in consideration of the positional deviation in the XY direction to be corrected based on the recognition result. Regarding the direction, the Y table 14 is moved and positioned. Further, the suction nozzle 19 is rotated and positioned by a rotation driving mechanism (not shown) in consideration of the positional deviation in the rotation direction.
[0027]
Next, the suction nozzle 19 is lowered and the electronic component is mounted at the position indicated by the mounting data described above on the printed circuit board 9.
[0028]
Note that the mounting head 7 can move without stopping to the position facing the camera 16 after sucking the parts. Therefore, it is possible to achieve high speed without increasing the acceleration, and it is also possible to move the mounting head 7 that holds the electronic component that tends to be displaced when a large acceleration is applied. Further, such a component can be gradually decelerated with a small deceleration so that no deviation occurs. However, when traveling along a curved portion, it is necessary to set the speed so that no deviation occurs due to centrifugal force.
[0029]
As described above, even a component that easily shifts can be moved at a high speed. However, for example, a small component that does not easily shift can be immediately moved at a high speed by increasing the acceleration. . Therefore, if the parts that can increase the acceleration are taken out in the order immediately after the parts that cannot increase the acceleration, there is a case where the mounting head that moves later cannot be moved at the original speed by holding it in front. Therefore, it is preferable that the mounting data specifies a mounting order in which components are picked up in order of increasing acceleration.
[0030]
Further, if the component supply unit 12 is arranged from the right side of FIG. 1 in the mounting order, it is not necessary to wait for the mounting head 7 that travels in front of the mounting head 7 to end the suction at the time of suction. Even if the mounting order is not set in the order in which it can be moved at high speed, if it is arranged in this way, there is no need to wait at the time of adsorption.
[0031]
Also, when the electronic component to be picked up is large, the mounting head 7 that picks up this component moves so that the large component does not interfere with other heads 7 or other components so that the large head does not interfere with the other mounting heads 7 or other parts. Or stop.
[0032]
Further, when the mounting head 7 is stopped for recognition by the recognition camera 16 or when the component mounting unit 5 is mounting a component, the next mounting head 7 needs to stop and wait before that. . Since the plurality of mounting heads 7 are waiting with a minimum interval while stopping and waiting, parts can be mounted faster than when mounted on the rotary table without changing the distance. In addition, even if there is a slow mounting head 7, the other mounting heads 7 are not affected as long as they are in a range where they cannot be used. In particular, the mounting head 7 moving to the component mounting unit 5 can move the head 7 at the highest speed to mount the component.
[0033]
These operations are automatically controlled and performed by a CPU (not shown) based on a program optimized for such operations and mounting data (not shown) as described above.
[0034]
Next, when replacing the suction nozzle in accordance with the next electronic component to be sucked with respect to the mounting head 7 that has been mounted by the component mounting unit 5 and has passed through the component mounting unit 5, at a desired position of the nozzle stocker 18. The present suction nozzle 19 is removed, and the suction nozzle 19 to be attached at another position is attached.
[0035]
It should be noted that a plurality of suction nozzles 19 may be attached to the mounting head 7 and the suction nozzles 19 used may be replaced by switching them. The plurality of suction nozzles 19 may be provided, for example, on a rotating body that rotates around a vertical axis, or may be provided upright around a rotating body that rotates around a horizontal axis.
[0036]
Further, when the previous mounting head 7 is replacing the suction nozzle 19 on the nozzle stocker 18, the immediately following mounting head 7 is on standby.
[0037]
The mounting head 7 that has passed through the nozzle stocker 18 is driven and moved by the linear motor on the endless track 8 toward the component supply unit 3, and the same component suction operation as described above is continued. Even at this time, unless the previous mounting head 7 has stopped before that, it moves to the position facing the component supply unit 12 to be removed from the nozzle stocker 18 and moves at the maximum speed reached at the maximum acceleration. Can stop at maximum deceleration. These operations are also performed by CPU control (not shown).
[0038]
【The invention's effect】
As described above, according to the present invention, the mounting head can be individually moved, and is provided below the other straight line portion in front of the component mounting portion through the curved portion from the straight portion passing on the component supply portion. Even if the acceleration of the movement of the mounting head leading to the component recognition unit is kept small, it can be moved at high speed , the component mounting can be accelerated on an endless track, and it can be moved at a moving speed suitable for the component. it can.
[0039]
Further, since the printed board is placed on a moving table that moves in a direction orthogonal to the endless track, the moving mechanism of the table on which the printed board is placed can be simplified.
[0040]
In addition, the endless track is a straight line on the component supply unit, and the component supply unit has a configuration in which a plurality of component supply units are arranged with their component supply directions oriented in a direction perpendicular to the endless track. Further, it is possible to reduce the space of the component supply unit by moving the component supply unit without moving the component supply unit and by reducing the arrangement interval of the component supply units.
Further, when the suction nozzle is replaced in accordance with the next electronic component to be suctioned, the current suction nozzle and the suction nozzle to which the nozzle stocker should be attached can be replaced by the nozzle replacement portion provided below the track.
[Brief description of the drawings]
FIG. 1 is a plan view showing an electronic component mounting apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply part 5 Component mounting part 7 Mounting head 8 Endless track 9 Printed circuit board 12 Component supply unit 14 Y table (moving table)
16 Component recognition camera (recognition unit)
18 Nozzle stocker (nozzle replacement part)
19 Suction nozzle

Claims (4)

In an electronic component mounting apparatus that takes out an electronic component from a component supply unit and mounts it on a printed circuit board at the component mounting unit.
An endless track having one linear portion passing over the component supply portion, the other linear portion passing over the component mounting portion, and a curved portion between the one linear portion and the other linear portion; A plurality of mounting heads for taking out electronic components from the component supply unit by individually circling an endless track and mounting them on a printed circuit board; and the mounting head provided below the other straight line portion in front of the component mounting unit, electronic component mounting apparatus according to claim the electronic component to be held by providing the recognizing component recognition unit. The electronic component mounting apparatus according to claim 1, wherein the printed circuit board of the component mounting portion is mounted on a moving table that moves in a direction orthogonal to the track . The track is a straight line on the component supply unit, and a plurality of component supply units are arranged in the component supply unit with their component supply directions being perpendicular to the track. The electronic component mounting apparatus according to claim 1 or 2. A nozzle replacement unit that replaces a suction nozzle that is detachably provided on the mounting head and holds electronic components by suction with a suction nozzle disposed in a nozzle stocker, and the nozzle replacement unit is provided below the track. The electronic component mounting apparatus according to claim 1, 2, or 3 .

Images