JP2816190B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an electronic component mounting apparatus and a mounting method for mounting various kinds of small components such as chip components and other imposition components at predetermined positions on a substrate at high speed. In particular, the present invention relates to a method of mounting electronic components stored on a tape reel on a printed circuit board at high speed.

[Conventional technology]

Conventional devices include a device for supplying chip components as described in JP-A-61-179595, and an automatic mounting device for electronic components provided with a device for sucking chip components from the device and mounting the components on a substrate. .

Another conventional example is described in Japanese Patent Application Laid-Open No. 61-239696.

[Problems to be solved by the invention]

2. Description of the Related Art In recent years, electronic component mounting apparatuses have tended to increase the number of components mounted on one substrate and the speed of the apparatus. However, the conventional example described above has a drawback that the speeding up is limited and that it is not possible to sufficiently cope with various kinds of parts.

That is, in a rotary head type electronic component mounting machine in which a large number of suction nozzles are concentrically arranged, the average mounting time per component by the rotary head is limited to 0.2 to 0.3 seconds.

In addition, the number of types of electronic components that can be mounted on one component supply table is about 50 to 70, and if more types of electronic components are mounted on one table, the table becomes longer and the weight increases. Therefore, vibration is a problem when trying to perform high-speed movement positioning.

An object of the present invention is to obtain a mounting position and a mounting method of an electronic component that can achieve a significant increase in speed.

It is another object of the present invention to be able to sufficiently cope with the mounting of various types of components and to increase the speed.

Still another object of the present invention is to make it possible to replenish components in the component supply table without stopping the apparatus, thereby improving the operation rate.

[Means for solving the problem]

The features of the present invention for achieving the above object include a substrate support device that supports a substrate and is two-dimensionally positioned, a component supply table on which a plurality of types of electronic components are mounted, and a reciprocating motion of the component supply table. A table guiding device that guides the component supply table, a driving device that reciprocates the component supply table and positions the component supply table at a predetermined position, and a transfer device that transfers components on the component supply table to a predetermined position on a substrate on the substrate support device. In the component mounting apparatus provided with a mounting device, the table guide device is disposed before and after the substrate support device, and each of these table guide devices is provided with one or more component supply tables, and is disposed in front and behind. The electronic component mounting device is configured such that the component mounted on the component supply table on the table guide device is placed on the substrate on the substrate support device by the transfer device. Apparatus is in.

Another feature of the present invention is that an XY table for positioning and supporting a substrate is prepared, and table guide devices for guiding a component supply table reciprocally on both sides of the XY table are provided. After installing a component supply table on each of the above, after mounting the substrate on the XY table, the components from the component supply table on the one table guide device is mounted at a predetermined position on the substrate on the XY table, An electronic component mounting method for mounting a component from a component supply table on the other table guide device to a predetermined position on a substrate on the XY table.

〔Example〕

 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In the figure, reference numerals 1 and 2 denote table guide devices for reciprocally guiding a component supply table 4 on which a large number of tape feeders 3 are mounted, and are arranged in parallel on both sides of an XY table 6 for positioning and supporting a substrate 7. In this embodiment, a single table guide device is provided with a plurality of component supply tables, and each component supply table normally mounts 20 to 70 types of tape feeders having a large number of electric components. Each component supply table is provided with a driving device (not shown).
, And are individually positioned at predetermined positions.

Reference numeral 9 denotes a rotary head (transfer device) provided between the table guide device 1 and the XY table 6 and between the other table guide device 2 and the XY table 6, as shown in FIG. The rotary head 9 is configured by arranging a plurality of nozzles (12 nozzles in this embodiment) concentrically to suck electronic components from a component supply table. Reference numeral 11 denotes a carry-in conveyor (carrying means) for carrying the printed circuit board to the XY table 6, and reference numeral 12 denotes a carry-out conveyor (carrying means) for carrying out the board on the XY table. The XY table (substrate support device) 6 is for positioning a substrate two-dimensionally at a predetermined position. In addition, each rotary head 9R, 9
L can be operated individually, and the rotation speed can be changed. Reference numerals 5A and 5B denote operation boxes for operating the entire apparatus. In this embodiment, the operation boxes are provided on both sides as shown in the figure, and can be operated from either side. 13 is a substrate transfer device, 14 is a substrate stopper, 15 is a substrate guide, 16 is a suction station for sucking electronic components from a tape feeder on a component supply table,
17 is a positioning station for positioning the mounted electronic components, 18 is a positioner, 19 is a component recognition station for recognizing the orientation of the components, 20 is its recognition device, and 21 is an electronic component sucked by a nozzle on the printed circuit board 7. A mounting station for mounting, 22 is a discharging station for discharging defective suction components without mounting them on a board, 23 is a component discharging box,
24 is a nozzle switching station, 25 is a nozzle switching device, and 27 is a top plate to which the boxes 5A and 5B are fixed.

 Next, an example of the operation of the present apparatus will be described.

The substrate 7 sent from the upstream machine is transported by the carry-in conveyor 11 to the position of the substrate stopper 14.

Next, the board guide 15 on the XY table 6 rises to the same height as the carry-in conveyor 11 and stops.

The substrate stopper 14 rises, and the substrate 7 on the carry-in conveyor 11 is transferred to the substrate guide 15 by the transfer device 13. At this time, if there is a substrate already mounted on the substrate guide 15, the mounted substrate is transferred to the unloading conveyor 12 at the same time. When the transfer of the substrate 7 is completed, the substrate guide 15 moves down onto the XY table 6. Thereafter, the XY table 6 moves to the device position at a high speed.

Next, an example of the operation from component suction to mounting will be described for one nozzle.

Of the twelve nozzles in the rotary head 1, the nozzles in the suction station 16 suction the chip components from the tape feeder 3 on the component supply unit 1 by vacuum suction.

While holding the chip component (electronic component) by the nozzle, the rotary head 9 (9R) turns, and the position and the angulation are performed by the positioner 18 at the position of the positioning station 17. Next, the user moves to the component recognition station 19, and the recognition device 20 checks the chip component for suction failure and determines whether or not to mount the chip component.

Next, the chip moves to the mounting station 21 and, if determined to be mountable by the recognition station 19, mounts the chip component on the substrate 7 loaded on the XY table 6. If the recognition station 19 determines that mounting is not possible, it moves to the discharging station 22 while holding and sucking without mounting, and discharges the chip components to the component discharging box 23.

Next, the nozzle moves to the nozzle switching station 24, and when the nozzle needs to be switched, the nozzle is switched by the nozzle switching device 25.

The above operation is sequentially performed for the 12 nozzles, and the chip components are continuously mounted on the substrate.

For the rotary head 9L, refer to the rotary head
Performs the same operation as 9R. However, rotation is performed such that the timing of mounting on the substrate is shifted between the rotary heads 9R and 9L. In other words, when the mounting with the rotary head 9R is completed and the nozzle of the mounted rotary head 9R moves to the next station, the mounting with another rotary head 9L is performed.

As another example of the operation, the rotary head 9R is rotated at a high speed to perform high-speed mounting, and the rotary head 9L is rotated.
About, rotate at low speed to mount large electronic components.
Also at this time, the mounting timing of the rotary head 9R and the rotary head 9L is shifted so as not to interfere with each other as described above.

The operator operates the device using the operation box 5A or the operation box 5B.

In this case, the operation boxes 5A and 5B cannot be operated at the same time. That is, the top plate 27 to which the operation boxes 5A and 5B are fixed is made to be a slide type, and only the sliding operation box 5A or 5B can be operated, and the other operation box is only displayed. As described above, in the present embodiment, the two operation boxes are linked so that only one of them can be operated.

 Next, the usage of this embodiment will be described.

(1) For multi-product parts A different kind of tape feeder is mounted on each of the parts supply tables 4R and 4L, and both rotary heads 9R and 9L are operated to mount the chip parts on the board.

(2) When high-speed equipment is used: Tape feeders are distributed to the component supply tables 4R and 4L,
The XY table 6 moves at high speed until the rotary head 9R mounts the chip component on the substrate and mounts it with the next nozzle, mounts the chip component with the rotary head 9L, and then mounts again with the rotary head 9R. . This operation is repeated to achieve high-speed mounting.

Further, a tape feeder can be mounted only on the component supply table 4R, and a chip component can be mounted on the substrate using only the rotary head 9R. In this case, the parts supply table 4L
By stopping the rotary head 9L and mounting the tape feeder for the substrate to be produced next on the component supply table 4L, it is possible to prevent a decrease in the operation rate of the apparatus during small-quantity production.

Furthermore, according to the present invention, parts can be replenished to the other table 4L while parts are being supplied to one table 4R. Therefore, even when one table runs out of parts, the parts can be replenished without stopping the entire apparatus. Can be performed. In particular, by providing a plurality of component supply tables for each of the table guide devices 1 and 2, various types of usage can be achieved and the device operation rate can be improved.

According to this embodiment, as described above, the rotary head has two rotary heads, the rotary head 9R and the rotary head 9R.
By shifting the timing of 9L mounting, high-speed mounting of chip components becomes possible.

Further, by having two or more component supply tables, a tape feeder that is twice or more than the current size can be mounted, and it is possible to handle a wide variety of components.

In addition, since a plurality of rotary heads and component supply tables are provided and can be operated independently of each other, it is possible to set up components and the like without stopping the apparatus, thereby improving the operation rate of the apparatus.

In the above embodiment, an example in which two rotary heads are provided has been described. However, as shown in FIG. 4, only two table guide devices may be provided in parallel, and one rotary head 9 may be provided. That is, when one rotary head is used, the rotary head 9 straddles both table guides 1 and 2 so that components can be sucked from a component supply table (not shown) on both table guides 1 and 2. Use one with a large diameter. The XY table 6 for controlling the positioning of the printed circuit board is located on the upstream side (6
U) and downstream (6D), respectively, each XY table 6U, 6D
The board is mounted on the upper part, and components are simultaneously mounted on the two boards by one rotary head 9. That is,
The nozzles located on the component supply tables on both sides simultaneously pick up components from each component supply table, position the components at opposing positions on the rotary head, recognize the components, and then use the nozzles on the upstream side to attach the components to the upstream board. The component is mounted, and at the same time, the component is mounted on the downstream substrate by the downstream nozzle. Hereinafter, the same operation is repeated. Other configurations are the same as those in the above embodiment. According to such an embodiment, components can be simultaneously mounted on two substrates by one component mounting apparatus, and thus the speed of component mounting can be increased.

FIG. 5 shows still another embodiment. In this embodiment, only one rotary head 9 is provided, and this rotary head is moved to a position 9 'as shown in FIG.
In this embodiment, the number of rotary heads can be reduced to one, and it is possible to cope with diversification of parts.

In the case where two or more rotary heads are provided, the two or more rotary heads can be driven by one motor, so that the apparatus can be made more compact.

〔The invention's effect〕

According to the present invention, components are placed on a substrate on a substrate support device by a transfer device from a component supply table on a table guide device disposed before and after (on both sides) the substrate support device (XY table). With this configuration, components can be placed on the substrate on the substrate support device by the transfer device from the component supply table on one table guide device, and can also be transferred from the component supply table on the other table guide device. The mounting device can be mounted on the substrate on the substrate support device. Therefore, components can be supplied in parallel to the substrate on the substrate support device from a plurality of component supply tables provided before and after, and there is an effect that the speed of component mounting work can be significantly increased.

Further, according to the present invention, since parts can be supplied simultaneously using a plurality of parts supply tables provided before and after,
It has the effect of supplying many types of parts without enlarging one table, and the parts supply tables before and after being used simultaneously are driven individually without being integrated, so each table can be operated at high speed. Even if it is moved and positioned, large vibration can be prevented from being generated, and there is an effect that the moving speed of the table can be increased to increase the speed.

Further, according to the present invention, since a plurality of component supply tables provided before and after can be individually driven, the other table can be stopped and the components can be replenished while the components are being supplied by one table. The operation rate can be improved.

[Brief description of the drawings]

FIG. 1 is an overall perspective view showing an embodiment of the present invention, FIG. 2 is a partial cross-sectional perspective view of FIG. 1, FIG. 3 is a plan view of a main part of FIG. 1, FIG. 4 and FIG. 7 is a schematic plan view showing another embodiment of the present invention. 1,2 ... Table guiding device, 3 ... Tape feeder, 5A,
5B: Operation box, 6: XY table, 7: Printed circuit board, 8: Nozzle, 9, 9R, 9L: Rotary head (transfer device), 11: Loading conveyor, 12: Unloading conveyor, 13 ... substrate transfer device, 14 ... substrate stopper, 15 ...
Board guide, 16… Suction station, 17… Positioning station, 18… Position, 19… Component recognition station, 20… Recognition device, 21… Mounting station,
22 ... discharge station, 23 ... parts discharge box, 24 ... nozzle switching station, 25 ... nozzle switching device.

Claims (2)

(57) [Claims] 1. A substrate support device that supports a substrate and is positioned two-dimensionally, a component supply table on which a plurality of types of electronic components are mounted, and a table guide device that reciprocally guides the component supply table. A component mounting apparatus comprising: a driving device that reciprocates the component supply table and positions the component supply table at a predetermined position; and a transfer device that transfers components on the component supply table to a predetermined position on a substrate on the substrate support device. In the apparatus, the table guide device is disposed before and after the substrate support device, and each of these table guide devices is provided with one or more component supply tables, and each of the table guide devices is provided on the table guide device disposed before and after. An electronic component mounting apparatus, wherein components mounted on a component supply table are mounted on a substrate on a substrate support device by a transfer device. 2. An XY table for positioning and supporting a substrate is provided, and table guide devices for guiding a component supply table reciprocally on both sides of the XY table are provided, and each of these table guide devices is provided. After installing the component supply table and installing the substrate on the XY table, the components are mounted at a predetermined position on the substrate on the XY table from the component supply table on the one table guide device, and then the other table A method for mounting an electronic component, comprising mounting a component from a component supply table on a guide device to a predetermined position on a substrate on the XY table.