JP3245409B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device capable of more easily and accurately performing a work by mounting a small gantry inside an XY gantry.

[0002]

2. Description of the Related Art Generally, in a conventional semiconductor device, when a pattern of an electronic component to be mounted is recognized by image processing,
It is configured to determine the mounting position on the printed circuit board and mount.

A specific conventional semiconductor device is known as shown in FIG. That is, the surface mounting apparatus 1 shown in FIG. 5 includes an XY-axis frame 2, a head unit 3 movably supported in the XY directions by the XY-axis frame 2, a component supply unit 4, a positioning unit 5, and a printed board 6. Is included in the conveyor 7 for conveying the. Here, the XY axis frame 2 includes an X axis frame 2b and a Y axis frame 2a.

Hereinafter, the operation of mounting the electronic component 8 on the printed circuit board 6 moved on the conveyor 7 in the conventional semiconductor device configured as described above will be described. First,
When the XY-axis frame 2 is driven and controlled by a driving unit (not shown), the head unit 3 is moved onto one electronic component 8 to be mounted among various components on the component supply unit 4. Next, the suction nozzle 3 of the head unit 3
a is operated by the suction means connected to the suction nozzle 3.
a holds the electronic component 8 by vacuum suction. At this time, the suction nozzle 3a grasps and supports the electronic component 8 in a direction in which the electronic component 8 is mounted on the printed circuit board 6.

In such a state, as the XY-axis frame 2 is driven and controlled by the driving means, the head unit 3 moves on the positioning unit 5. On the other hand, the electronic component 8 is arranged and designed so as to be located within the field of the imaging means in the mounting direction.

Next, the position on the printed circuit board 6 where the head unit 3 is conveyed to the mounting position by the conveyor 7, that is,
It moves to the position determined by the positioning unit 5. Therefore, the electronic component 8 held by the suction nozzle 3a of the head unit 3 is mounted on the printed board 6.

The suction nozzle 3a of the head 3 releases the gripped state of the vacuum-sucked electronic component 8 when the suction means connected to the suction nozzle 3a is stopped, and the electronic component 8 is moved by the operation described above. 6 will be implemented.

[0008]

As described above, in the conventional semiconductor device, only a plurality of suction nozzles are mounted on the XY-axis frame. However, the operation of mounting the components suctioned by the nozzles on a printed circuit board is required. It is not performed at once, but is performed individually by moving the XY axis frame. For this reason, the operation of mounting each component on a printed circuit board must be repeated each time, and thus there is a disadvantage that productivity is reduced.

In addition, when the movement of the XY-axis frame is not precise, the mounting speed is reduced, and when the size of the XY-axis frame is increased, the movement speed and the precision cannot be satisfied simultaneously. .

[0010] In order to solve such a problem, an object of the present invention is to accurately or simultaneously hold an electronic component using a plurality of gantry, and to simultaneously or simultaneously hold the held electronic component. It is an object of the present invention to provide a semiconductor device which can be individually mounted on a printed circuit board to increase a mounting speed. It is another object of the present invention to improve accuracy by mounting components in a way that moves a small gantry in a predetermined working area using an XY gantry in a working area at a long distance. A semiconductor device is provided.

[0011]

In order to achieve the above object, a semiconductor device according to the present invention comprises an X-axis frame and a Y-axis frame which are selectively movable independently and integrally in a predetermined direction.
An axis frame, a main drive unit attached to at least one of the X-axis frame and the Y-axis frame, and driving the X-axis frame and the Y-axis frame; and one of the X-axis frame and the Y-axis frame. At least one moving means attached and movable in a predetermined direction, auxiliary driving means for driving the moving means in a predetermined direction, and at least one head and vision part respectively attached to the moving means; And a component supply unit for supplying a component to the head.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the semiconductor device according to the present invention will be described below in detail with reference to the accompanying drawings. As shown in FIG. 1, FIG. 2 (a) and FIG. 2 (b), a semiconductor device according to the present invention has a pair of Y-axis frames 22a separated by a predetermined distance and opposed to these Y-axis frames 22a. At least one X-axis frame 22b attached and movable in a predetermined direction, main driving means 22c for independently driving the X-axis frame 22b in a predetermined direction with respect to the Y-axis frame 22a, X axis frame 22b
At least one small XY gantry 30 that is attached to one side and is movable in a predetermined direction; auxiliary driving means 32 for driving the small XY gantry 30; Attached to the site,
It comprises at least two heads 72 for picking and placing electronic components, head driving means 78 for driving the respective heads, and a component supply unit 40 for supplying components to the heads.

The semiconductor device according to the present invention includes a component supply section 40 mounted on an upper side of a feeder base 52, a conveyor 54 for transporting a printed circuit board (printed circuit board) (not shown), and an electronic component. And a vision camera 56 for confirming the mounted and released state of the camera.

The Y-axis frame 22a is mounted on an upper portion of the base frame 50. Main driving means for independently driving the X-axis frame 22b is provided at predetermined portions of the Y-axis frame 22a and the X-axis frame 22b. 22
c is attached. A linear motor is used as the main drive unit 22c. The linear motor is a moving magnet type (Mov
moving coil type and moving coil type in which the coil moves (Moving coil type)
Any one of the above may be used, but a moving magnet type may be applied here.

One side of the X-axis frame 22b is as shown in FIGS. 2 (a) and 2 (b). That is, the connecting plate 60 provided with the auxiliary driving means 32 for individually or integrally operating the moving means of the vision section 56a and the head 72 of the small XY gantry 30 is connected by the connecting member 62. I have.

The small XY gantry 30 includes a vision unit 56a that functions as a mover.
And a connecting plate 60 having an auxiliary driving means 32 serving as a stator. It is preferable to use a small CCD camera as the vision unit 56a.

As the auxiliary driving means 32, any one of a surface motor, a linear motor, a step motor, a rotary motor, and a means for converting a rotary motion into a linear motion may be used. The connecting member 62 is installed so as to be independently movable in a predetermined direction by a main driving unit 22c attached to the X-axis frame 22b.

The small XY gantry 30 is mounted below the connecting plate 60 and further includes a Y 'frame 30a and an X' frame 30b. As shown in FIGS. 2 (a) and 2 (b), the Y 'frame 30a and the X' frame 30b have their internal areas arbitrarily divided into 4 and the like as shown in FIGS. Minutes, 6
It can be used by being divided into various forms such as equal size.

Although the shape of the small XY gantry 30 can be variously configured such as a circle, a square, a triangle, and a rhombus, it is easy to work according to the form of a printed circuit board (printed circuit board). As it is, it is preferable to configure it in a square shape. The small XY gantry 30 can be configured to move independently with respect to the X-axis frame 22b, or can move together with the X-axis frame 22b in accordance with the movement of the X-axis frame 22b. It can be configured so that the movement can be selectively performed.

The number of the small XY gantry 30 can be at least one according to a user's request.
That is, the number of the X-axis frames 22b and the size of the small XY gantry 30 can be increased or decreased according to the size of the XY gantry 30 so that the user can use the XY gantry 30 with a smaller number. On one side of the X 'frame 30b, a head mounting portion 70 and a vision mounting portion 71 which can move independently in a predetermined direction are mounted. A head moving means 80 for moving the plurality of heads 72 in a predetermined direction is attached to a lower portion of the head mounting portion 70, and a vision portion 56a is moved to a predetermined direction below the vision mounting portion 71. Vision moving means 81 is attached.

When a surface motor is used as the auxiliary driving means 32, a plurality of heads 72 and a vision section 56 are provided below the auxiliary driving means 32, as shown in FIG.
a are movably mounted independently of each other.

When the plurality of heads 72 are to be moved to a predetermined distance (ie, to predetermined points x and y), the small XY gantry 30 is first moved by x and then moved to the next y. The electronic component can be gripped and released while independently moving one or a predetermined number of the heads 72). At this time, the vision unit 56a
It is confirmed whether or not the component gripping and releasing operation of No. 2 is performed correctly.

FIG. 4 is a sectional view showing the operation of individually moving only a part of the vision section 56a and the head 72. As shown in FIG. 4, auxiliary brackets 53 and 73 are connected to the vision unit 56a and the head 72 side for individual driving.

The auxiliary brackets 53 and 73 are formed with a guide portion 93 having a predetermined shape (here, a cross shape).
An X "-Y" moving member 94 that can move in a predetermined direction is attached to the lower side of the guide portion 93. When a predetermined driving means is connected to the X "-Y" moving member 94, only the X "-Y" moving member 94 can be individually moved. Therefore, the X ″ −Y ″
The vision unit 56a and the head 72 connected to the moving member 94 can be moved individually from each other.

Hereinafter, the operation and effect of the semiconductor device of the present invention configured as described above will be described. As shown in FIGS. 1 to 3, the small XY gantry 30 installed on one side of the X-axis frame 22b by the connecting member 62 is provided with auxiliary driving means at predetermined portions of the Y 'frame 30a and the X' frame 30b. 32 is attached, so that it can move in a predetermined direction. The Y 'frame 30a and the X' frame 30b
The vision section 56a and the head 72 are attached to the inside of the predetermined section so that the vision section 56a and the head 72 are respectively mounted so as to meet a user's request.
a and the head 72 can be moved independently or integrally with each other. Also, the number of the vision part 56a and the number of heads 72 can be appropriately selected so that the user matches the working conditions.

Hereinafter, a case where a surface motor is used as the auxiliary driving means 32 will be described with reference to an example. When a surface motor is used, the vision unit 56a and the plurality of heads 72 are independently X,
Driving in the Y direction or two degrees of freedom, component supply unit (not shown)
Can be mounted on a printed circuit board (not shown) on the conveyor 54 by gripping the electronic components supplied from the printer (a nozzle attached to a predetermined portion of the head 72 is not shown for reference).

The head mounting section 70 is freely movable in a predetermined direction in accordance with the movement of the plurality of heads 72. That is, the plurality of heads 72 can grip the electronic component from the component supply unit and independently or integrally mount it on the printed circuit board. In addition, compensation is performed so that the position of the electronic component is first moved to the first point to be moved by the XY gantry, and is again moved in the predetermined direction by the small XY gantry to reach the second point. (Ie,
When trying to move to a predetermined point (x ', y'), the first
It moves to the point (x ', y') first and moves to the second point (x ', y') again. Here, y ′ = y + δ. And δ is the amount to be moved by the small gantry,
This is determined by the mechanistic relationship between the XY gantry and the small XY gantry).

On the other hand, it is preferable to use a linear motor, a rack and pinion, or the like as the head moving means 80 attached to the lower part of the head mounting section 70. The head moving means 80 is attached so that the head 72 can be moved independently or integrally in a predetermined direction.

The vision section 56a and the head 72 are
It is configured so that it moves together when performing a normal operation, but can move individually when performing a specific operation. That is, as shown in FIG. 4, the guide portion 93 having a predetermined shape (here, a cross shape) and the X "-Y" moving member 94 are attached to the auxiliary brackets 53 and 73, so that the vision portion 56a and the head 72 are attached. Can move separately.

The individually moving vision unit 56a
And the head 72 are attached, so that electronic components can be mounted /
First to move first to position to release
The user moves to the point, moves in a predetermined direction again, and reaches the second point. If the position does not match, the error can be reduced by moving to the third point again. That is, when trying to move to the predetermined point (x ", y"), the user first moves to the first point (x ', y'), and again moves to the second point (x ", y").
y "), and finally to the third point (x", y "), where x" = x '+ δ and y "= y' + δ, thus compensating for δ. .

Since the semiconductor device according to the present invention has a function of compensating the mounting position at least twice after gripping the component, the electronic component can be more accurately mounted on the circuit board. It is advantageous that the present invention is advantageously applied to a semiconductor device for a specific component which can satisfy a condition meeting a demand of a consumer.

[0031]

As described above, since the semiconductor device according to the present invention uses a small XY gantry, there is an effect that the time for mounting components can be reduced and the time for the entire operation can be reduced.

Further, in the semiconductor device according to the present invention, since the mounting position of the electronic component is mounted by driving a precise small gantry when mounting the electronic component, the operation can be performed more accurately and the occurrence of defects can be reduced. There is.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a semiconductor device according to the present invention.

FIGS. 2 (a) and (b) are diagrams showing the connection relationship of a small XY gantry according to the present invention for each embodiment.

FIG. 3 is a diagram showing a case where a surface motor is applied to a small XY gantry according to the present invention.

FIG. 4 is a diagram showing a case where a vision unit and a part of a head individually move in the small XY gantry according to the present invention.

FIG. 5 is a schematic perspective view of a conventional semiconductor device.

[Explanation of symbols]

 1: Semiconductor device 2: XY axis frame 3: Head section 4: Component supply section 5: Positioning section 7, 54: Conveyor 22a: Y axis frame 22b: X axis frame 22c: Driving means 30: Small XY gantry 32: Auxiliary driving means 40: Component feeder 50: Base frame 60: Connecting plate 70: Head mounting part 72: Head 78: Head driving means

Continuation of front page (56) References JP-A-11-54994 (JP, A) JP-A-9-307288 (JP, A) JP-A-9-307286 (JP, A) JP-A-10-93293 (JP) JP-A-10-107495 (JP, A) JP-A-9-199897 (JP, A) JP-A-5-13997 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB (Name) H05K 13/04

Claims (9)

(57) [Claims] A pair of Y-axis frames spaced apart from each other by a predetermined distance; at least one X-axis frame attached to the Y-axis frame and movable in a predetermined direction; Main driving means for driving the axis frame independently in a predetermined direction with respect to the Y axis frame; and at least one small XY attached to one side of the X axis frame and movable in a predetermined direction. A gantry; auxiliary driving means for driving the small XY gantry;
At least two heads for picking and placing electronic components, head driving means for driving the heads in predetermined directions, and a component supply unit for supplying components to the heads. Characteristic semiconductor device. 2. The semiconductor device according to claim 1, wherein said main driving means is a linear motor. 3. The semiconductor device according to claim 1, wherein the small XY gantry is configured to be independently movable with respect to an X-axis frame. 4. The semiconductor device according to claim 1, wherein the small XY gantry is configured to be movable together with an X-axis frame in accordance with the movement of the X-axis frame. 5. The small XY gantry moves independently with respect to the X-axis frame, moves according to the movement of the X-axis frame, or moves independently with respect to the X-axis frame. The semiconductor device according to claim 1, wherein the semiconductor device is configured to be selectively movable. 6. The auxiliary driving means includes a surface, a linear motor, a step motor, a rotary motor,
6. The semiconductor device according to claim 1, wherein the semiconductor device is one of means for converting a rotary motion into a linear motion. 7. The head according to claim 1, wherein the at least one first head is movable in a vertical direction, and at least one first head is freely movable independently in a predetermined direction with respect to the first head.
2. A head comprising: a plurality of second heads.
7. The semiconductor device according to any one of items 6 to 6. 8. The apparatus according to claim 1, wherein the first head moves first to a first point to be moved, and the second head sequentially moves to a second point to be moved. The semiconductor device according to claim 7, wherein: 9. The semiconductor device according to claim 8, wherein a head moving means is attached to a predetermined portion of said second head.