JP3165289B2 - Surface mounting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounter configured to mount a chip-like chip component such as an IC at a predetermined position on a printed circuit board.

[0002]

2. Description of the Related Art Conventionally, as a mounting machine as described above, an X-axis and a Y-axis are orthogonal to each other, and an X-axis component member is movably mounted along a Y-axis on a Y-axis such as a rail. A head provided with a nozzle for adsorbing and mounting a chip component on the X-axis component member is provided movably along the X-axis so that the head is moved in an XY plane. It was mainstream. However, in consideration of speeding up the operation in each of the X and Y axes, it is natural to adopt a structure in which the operation in the X axis direction and the operation in the Y axis direction are made independent in the mounting work. Seems simple and efficient.

[0003] Therefore, as shown in FIG.
A mounting machine in which the shafts 80 are arranged independently of each other, the head 83 and the substrate P are moved independently along the X-axis 81 and the Y-axis 80, respectively, and feeders 82A and 82B are fixed near the X-axis 81. Has been proposed. In this mounting machine, the head 83 can be moved only in the X-axis direction, and the substrate P can be moved in the Y-axis direction. During the mounting operation, the head 83 can be moved in the X-axis direction and the substrate P can be moved in the Y-axis direction. Is moved relative to each other in the XY plane.

[0004]

By the way, in the above-described mounting machine, in order to enable a plurality of types of chip components to be sucked by the head, each of the feeders 82A and 82B mounts and holds each chip component. It has a structure in which tapes are juxtaposed in the X-axis direction. Therefore, when mounting more types of chip components, it is necessary to extend the feeders 82A and 82B in the X-axis direction with the increase in the types of chip components.

However, each of the feeders 82
A and 82B extend in the X-axis direction.
When the chip components are sucked and mounted at positions closer to the outside of A and 82B, there is a problem that it takes a wasteful time to move the head reciprocating between the feeders 82A and 82B and the substrate P.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a surface mounter capable of improving the efficiency of mounting work.

[0007]

SUMMARY OF THE INVENTION The present invention is an apparatus for mounting a chip component supplied from a component supply unit on a printed circuit board conveyed on a conveying line. A work station is provided which moves while holding the work station.On both outer sides of the work station, a pair of component supply units are arranged so as to be able to supply chip components toward the work station, and A plurality of heads for chip component suction which are independently movable in a first direction and are independently movable in a second direction intersecting on the horizontal plane with the first direction. During the mounting operation of one of the plurality of heads, a head different from the one head sucks a chip component to be mounted next time. The two component supply units are arranged at the component mounting position in the second direction in a state in which the two chip components are mounted at a position where the next chip component mounted by the one head during the mounting operation can be picked up by the head. Each head and each component supply unit are configured such that one component supply unit capable of supplying the chip component among the units moves in the first direction.

[0008]

According to the present invention, when mounting a chip component on a printed circuit board, the printed circuit board is held in the work station. The component supply unit moves in the first direction to position the chip component at a position where the component can be sucked by one head, and the one head moves in the second direction to move the chip component from the component supply unit to the chip. Suction parts. At this time, since the component supply unit is configured to supply the chip components toward the work station, even when supplying various types of chip components, the component supply unit moves in the first direction. The head can always pick up the chip component at the same position, so that the moving time of the head reciprocating between the component supply unit and the printed circuit board can be kept minimum and constant. In addition, during the mounting operation by one head, the component supply unit moves in the first direction to arrange the next chip component (the next chip component mounted by the head) at a position where the component can be sucked by the head. After the mounting is completed, the components are picked up by the head immediately, so that the components are efficiently sucked. At this time, the provision of the pair of component supply units allows the component supply unit on the other side to be moved even when the chip component is being suctioned by any one of the heads on the component supply unit on one side. Accordingly, the component supply unit can be reliably positioned at a position where the component can be sucked by the head.

During mounting, the chip component is positioned with respect to the printed circuit board by moving the head sucking the chip component in the second direction and the work station in the first direction. During the mounting operation by one head, a head different from the one head is placed at the component mounting position in the second direction in a state in which a chip component to be mounted next is sucked, so that mounting by the one head is performed. After the operation is completed, the work station moves in the first direction, thereby quickly positioning the next component (the component to be mounted next) and the printed circuit board, and efficiently mounting the chip component by each head. Will be done.

Further, each head is driven independently and independently, so that each head is not enlarged. Therefore,
Since there is no increase in the inertial force at the time of moving the head due to the enlargement of the head, more accurate and reliable mounting work can be performed.

[0011]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing an example of a surface mounter according to the present invention, and FIG. 2 is a view taken in the direction of arrow A in FIG.

As shown in FIG. 1, a transport line 2a for transporting a substrate P at the center in the width direction on the base 1 of the surface mounter in the direction indicated by the arrow (X-axis direction: first direction). , 2
b is provided. Each of these transport lines 2a, 2b
Are arranged opposite to each other at a predetermined interval in the X-axis direction, and a work station 3 for holding the substrate P when mounting chip components is provided movably in the X-axis direction therebetween. ing. That is, a pair of fixed rails 8 extending in the X-axis direction are provided on the base 1 at predetermined intervals in a direction orthogonal to the X-axis direction (Y-axis direction: second direction),
The fixed rail 8 is attached to the base 4 of the work station 3.
Are slidably mounted, and a ball screw shaft 9 that is rotationally driven by a servomotor 10 fixed on the base 1 is screwed into a nut portion 7 provided in the work station 3. Then, the servo motor 1
When the ball screw shaft 9 is rotated by the operation of “0”, the work station 3 moves between the transport line 2 a and the transport line 2 b along the fixed rail 8.

The work station 3 is provided with a pair of chucks 5 at both ends in the Y-axis direction of the base 4, and holding grooves 6 for holding the substrate P are formed on opposing surfaces of the chucks 5. At the same time, the chucks 5 can be brought into and out of contact by driving means (not shown).

The component supply units 12a, 12b are located on the outer sides of both sides of the transport lines 2a, 2b (vertically in FIG. 1).
12b is provided. Each component supply unit 12a, 12b
Are provided with a large number of rows of tape feeders 13a and 13b arranged in the X-axis direction.
3a and 13b are feeder supporting members 14a and 14 respectively.
b. Each of the above tape feeders 13
Each of the supply tapes a and 13b is provided with a supply tape wound on a reel.
Chip-like chip components such as capacitors are stored at predetermined intervals. Then, the chip component is supplied toward the work station 3 while the supply tape is intermittently fed out as the chip component is supplied by a feeding mechanism (not shown).

Each of the component supply units 12a and 12b is movably supported in the X-axis direction. That is, the feeder support members 14a and 14b are fixed to the fixed rail 15 provided on the base 1 and extending in the X-axis direction.
a and 15b, which are slidably mounted on the base 1 and have ball screw shafts 17a and 17b, which are rotationally driven by servo motors 16a and 16b, provided on the feeder support members 14a and 14b. 18
a, 18b. The operation of the servo motors 15a, 15b causes the ball screw shafts 17a, 1
7b rotates, the component supply unit 12
a, 12b along the fixed rails 15a, 15b,
Each moves in the X-axis direction.

Also, one side of the feeder support member 14a
Is provided with a spare nozzle holding portion 18 for holding a replacement nozzle for the nozzle 21 described later, and the component supply portion 12a and the spare nozzle holding portion 18 move integrally in the X-axis direction. It has become.

On the other hand, above the base 1, a component mounting head, in the illustrated embodiment, first to third heads 20.
a to 20c are provided, and each of the heads 20a to 20c is movable in the Y-axis direction. That is, three support rods 22 extending in the Y-axis direction are provided above the base 1.
Are mounted in a bridge state on a pair of frames 26 arranged at predetermined intervals in the Y-axis direction, and the heads 20a to 20c are slidably mounted on these support rods 22, respectively. Three ball screw shafts 24a to 24c, which are rotationally driven by three servo motors 23a to 23c fixed to the frame 26 corresponding to the support rod 22, respectively correspond to the heads 20a to 24c.
It is screwed into nut portions 25a to 25c provided on 20c. When the ball screw shafts 24a to 24c are rotated by the operation of the servo motors 23a to 23c, the heads 20a to 20c move along the support rods 22, respectively.

Each of the heads 20a to 20c is provided with one nozzle 21 for sucking chip components, and each nozzle 21 moves up and down (moves in the Z-axis direction) with respect to the frame of the heads 20a to 20c. And the nozzle center axis (R
Axes) can be rotated, and are operated by a servo motor (not shown). Further, a negative pressure from a negative pressure source (not shown) is supplied to each nozzle 21 via a valve member or the like. At the time of mounting, the supplied negative pressure is applied to the tip of each nozzle. It works to adsorb chip components.

On the base 1, between the work station 3 and the component supply section 12b on one side, three component recognition cameras 27a to 27c correspond to the movement paths of the heads 20a to 20c. 27c is provided. Each of these component recognition cameras 27a to 27c is
20c for recognizing the chip components sucked by the nozzles 21. The movement of the heads 20a to 20c allows the chip components to be recognized by the respective component recognition cameras 27a to 27c.
Recognize chip components by moving above 7c,
In this way, it is possible to detect, for example, a suction shift of the chip component with respect to each nozzle 21.

Although not shown, the surface mounting machine having the above-described structure includes a control device having a microcomputer as a component, and the work station 3
, The above-described component supply units 12a,
Servo motors 16a and 16b for the heads 12b, and servo motors 23a to 23b for the heads 20a to 20c.
3c, servo motors for the nozzles of the heads 20a to 20c and the component recognition cameras 27a to 27
All of c and the like are electrically connected to the control device, and are collectively controlled by the control device.

Here, an example of the control of the surface mounting machine will be described with reference to FIG.

First, when the mounting operation is started, the work station 3 is moved leftward in the X-axis direction (left side in FIG. 1) and brought into contact with the transport line 2a. As shown in (1), a substrate P transported along the transport line 2a is received and held. More specifically, the transferred substrate P is transferred from the transfer line 2 a to the holding groove 6 of each chuck 5 provided in the work station 3.
And is sent to a predetermined work position of the work station 3. Then, the substrates P are held by the chucks 5 moving toward each other, whereby the substrates P are held by the work station 3.

By the way, while the above operation is being performed,
Each component supply unit 12a, 12b and each head 20a-20
3C, the first and second heads 20a and 20b have already picked up the chip components and the component recognition cameras 27a and 27b.
After the confirmation of the suction position deviation by 27b is completed, as shown in FIG. 3A, a standby state is established at a position in the Y-axis direction where the chip component is to be mounted, and the third head 20c is mounted on the chip. Parts are being picked up.

By moving the work station 3, the chip components adsorbed on the first head 20a should be mounted after taking into account the correction amount of the positional deviation of the chip components adsorbed on the first head 20a. When the substrate P is moved to the position in the X-axis direction, the nozzle 21 of the head 20a rotates and descends, and mounts the chip component on the substrate P. Also,
At the same time, the component supply unit 12a moves, for example, as indicated by a two-dot chain line in FIG.
The next chip component to be sucked is arranged at a position where the first head 20a can be sucked. At this time, the third head 20c is simultaneously moved to the position of the component recognizing camera 27c, and the position shift of the suction chip component is recognized by the component recognizing camera 27c.

When the mounting of the chip components adsorbed on the first head 20a is completed as described above, then, FIG.
As shown in (b), the X-axis direction in which the chip component to be mounted on the second head 20b is to be mounted after taking into account the correction amount for the displacement of the suction position of the chip component to be mounted on the second head 20b. Is moved to the position. At this time, at the same time, the first head 20a moves to the component supply unit 12a to suck the chip component, and the chip component should be mounted while the third head 20c sucks the chip component. It is set at a position in the Y-axis direction. When the movement of the substrate P is completed, the chip components adsorbed by the second head 20b are mounted on the substrate P. At the same time, the component supply unit 12b moves from, for example, the position indicated by the broken line to the position indicated by the solid line in the figure, and sends the next chip component to be sucked by the second head 20b to the second head 20b. Is placed at a position where it can be adsorbed. At this time, the first head 20a is simultaneously moved to the position of the component recognizing camera 27a, and the component recognizing camera 27a recognizes the positional deviation of the suction chip component.

When the mounting of the chip component adsorbed on the second head 20b is completed, as shown in FIG. 3C, the correction amount for the positional deviation of the chip component adsorbed on the third head 20c is corrected. Is added, the substrate P is moved to a position in the X-axis direction where the chip component adsorbed by the third head 20c is to be mounted. At this time, at the same time, the second head 20b moves to the component supply section 12b to suck the chip component, and the first head 20b
In a state in which the chip component a is sucked, the chip component is set at a position in the Y-axis direction where the chip component is to be mounted. When the movement of the substrate P is completed, the chip components adsorbed by the third head 20c are mounted on the substrate P. At the same time, the component supply unit 12a
Moving from the position shown by the broken line to the position shown by the solid line in FIG.
The next chip component to be sucked by the third head 20c is arranged at a position where the third head 20c can suck.
At this time, the second head 20b moves to the position of the component recognition camera 27b at the same time, and the displacement of the suction chip component is recognized by the component recognition camera 27b.

The chip components are mounted on the substrate P by sequentially repeating the suction of the chip components by the respective heads 20a to 20c and the mounting on the substrate P as described above.

When the mounting of all the chip components on the board P is completed, the work station 3 is moved rightward in the X-axis direction (right side in FIG. 1) and brought into contact with the transport line 2a. The substrate P is sent to the transport line 2b by the sending means. And, this transport line 2b
As a result, the substrate P after the completion of mounting is transported to the next step.

As described above, in the surface mounter having the above-described structure, the board P is moved in the X-axis direction by the work station 3, and the component supply units 12a and 12b are moved in the X-axis direction.
Further, by making each of the heads 20a to 20c movable in the Y-axis direction, the heads 20a to 20c are relatively moved in the XY plane, and the component supply units 12a and 12b are respectively moved toward the work station 3 by the chip components. In this configuration, the efficiency of the mounting operation can be increased, and the structure of the head portion can be simplified to perform the accurate and reliable mounting operation of the chip component.

That is, in the surface mounter, a plurality of types of chip components supplied from the component supply units 12a and 12b are supplied to the work station 3 in a state of being arranged in the X-axis direction. Since each of the components 12a and 12b is movable in the X-axis direction, the component supply units 12a and 1b are mounted to mount more types of chip components.
2b is extended in the X-axis direction, the
The moving time of each of the heads 20a to 20c reciprocating between the substrate P and each of the component supply units 12a and 12b is minimized by moving the heads a and 12b to the suction positions of the heads 20a to 20c. Can be. Further, three heads 20a to 20c which operate individually are provided, and each head 2a to 20c is provided.
In the surface mounter of the above-described embodiment in which the cycle of sucking the chip component and mounting it on the board P is performed by shifting the cycle by a fixed time every 0a to 20c, the mounting time is set at the time of positioning during mounting. Each head 20a that reciprocates between the substrate P and each of the component supply units 12a and 12b can be suppressed to a time obtained by adding the time for moving in the X-axis direction and the mounting time of the chip component to this time. It is possible to avoid a round trip time loss of up to 20c. Therefore, an extremely efficient mounting operation can be performed.

Further, as described above, three heads 20a to 20c having one nozzle 21 are provided.
Each of the heads 20a to 20c is provided with a driving source and a driving mechanism for each of
The heads 0a to 20c themselves can be simplified, whereby the size and weight of each of the heads 20a to 20c can be reduced. Therefore, each of the heads 20a to 20c can be moved at a high speed with a relatively small torque, so that the mounting efficiency can be increased, and the inertia of the heads 20a to 20c generated when the heads are moved or stopped can be reduced. Each of the heads 20a-2
0c can be positioned more accurately.
As a result, more accurate and reliable mounting work can be performed.

The above embodiment shows an example of the surface mounter according to the present invention, and various other modifications can be considered. For example, the component recognition camera 27
a, 27b, 27c on both sides of the work station 3 (FIG. 1).
In this case, the components may be arranged on both sides in the Y-axis direction, and after the components are sucked, the chip component suction positions may be recognized by the nearest component recognition cameras 27a, 27b, and 27c of each of the component supply units 12a or 12b. . According to this, there is an advantage that the moving time of the head for component recognition can be reduced. Further, for example, instead of the component supply units 12a and 12b of the above embodiment, as shown in FIG. 4, a plurality of sets of the component supply units 12a are provided on both sides of the transport lines 2a and 2b.
-1 and 12a-2 and 12b-1 and 12b-2, and these are individually movably provided in the X-axis direction. For example, when the number of components to be mounted on the substrate P is large, the component supply unit 12a-1 And 12a-2, and the component supply unit 1
In the case where the components are supplied while moving in the X-axis direction integrally with the 2b-1 and 12b-2 in contact with each other in the X-axis direction, and conversely, when the number of components mounted on the substrate P is small. As shown in FIG.
-2 and 12b-2 may be retracted to the side of the transport line 2a, respectively, and component supply may be performed while moving only the component supply units 12a-1 and 12b-1 in the X-axis direction. According to this, it is possible to increase the efficiency at the time of mounting according to substrates having different specifications.

In consideration of the space for mounting the surface mounter, the layout, and the like, as shown in FIG. 5, the configuration is basically the same as that of the above embodiment, and only the transport lines 2a and 2b are in the Y-axis direction. The substrate P conveyed in the Y-axis direction may be moved to the work station 3 and moved in the X-axis direction to mount chip components. In this case, in particular, two sets of heads, work stations and component supply units 12a, 12b are provided, and the transfer lines 2a, 2
By disposing them symmetrically with respect to b, mounting work on a plurality of substrates P can be performed in parallel, and mounting efficiency can be improved more than in the above-described embodiment.

Further, in the above embodiment, one nozzle 2
Although three heads 20a to 20c each having 1 are provided for mounting the chip components, the number of heads may be one, two, or four or more. Absent. Also, the control of the surface mounter may be appropriately set so as to obtain a desired mounting efficiency according to the number of heads or the moving speed of the head, in addition to the control described in the above embodiment. Good.

As shown in FIG. 6, a plurality of heads 20a, 2
0b may be arranged. In this apparatus, after the head 20a sucks the chip component, the component supply unit 12 is moved to suck the chip component by the head 20b. At the time of mounting, each head 20 is simultaneously controlled by the component recognition cameras 27a and 27b.
After recognizing the displacement of the suction position of the chip component adsorbed on the a and 20b, the chip component of the head 20a on the substrate P,
The chip components are mounted on the substrate P in the order of the chip components of the head 20b. According to this device, the head 20a and the head 2
X of the component supply unit 12 at the time of picking up the chip component 0b
Mounting efficiency can be increased by reducing the amount of movement in the axial direction or by setting the amount of movement of the work station in the X-axis direction during mounting of chip components to be small.

Further, as in the embodiment shown in FIG. 7, heads are mounted on ball screw shafts 24a and 24b which are rotationally driven by servo motors 10a and 10b disposed on both sides of one support rod 22. It is also possible to configure a structure in which the movable members 20a and 20b are movably mounted. In this device, after the head 20a sucks the chip component from the component supply unit 12a and recognizes a shift in the suction position of the suction chip component by the component recognition camera 27a, the chip component is mounted on a portion of the substrate P that is slightly more than half on one side. I do. On the other hand, a half cycle later than the head 20a, the head 20b sucks the chip component from the component supply unit 12b, and recognizes the shift of the suction chip component by the component recognition camera 27b. Chip components are mounted on a little over half of the side. At this time, the mounting of the chip components near the center line of the substrate P can be performed by any of the heads 20a and 20b. According to this device, mounting efficiency can be increased by alternately mounting chip components by the heads 20a and 20b.

[0038]

As described above, according to the present invention, since the component supply unit is configured to supply chip components to the work station, the component supply unit can be supplied even when various types of chip components are supplied. Is moved in the first direction, the suction of the chip component by each head can always be performed at the same position (the same position in the second direction).
Therefore, the moving time of the head reciprocating between the component supply unit and the printed board can be kept to a minimum. In addition, during the mounting operation by the head, the component supply unit is moved to arrange the next chip component at a position where the component can be sucked by the head.
The removal of parts by the head can be performed immediately.
Therefore, the suction of the chip component by the head can be performed very efficiently.

On the other hand, during the mounting operation by one head, another head that has picked up the chip component to be mounted next is placed at the component mounting position in the second direction, and after the mounting operation by the one head is completed. Can move to the mounting operation of the next chip component simply by moving the work station in the first direction, so that the mounting of the chip component by each head can be performed efficiently.

Therefore, the operation of picking up and mounting components by the head can be performed with less wasteful and efficient operation.
Thereby, mounting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a surface mounter according to the present invention.

FIG. 2 is a view taken in the direction of arrow A in FIG.

FIGS. 3A and 3B are explanatory diagrams illustrating an example of control of the surface mounter according to the present invention, wherein FIG. 3A illustrates a state in which chip components are mounted by a first head, and FIG. FIG. 7C is a diagram illustrating a state where the component is mounted, and FIG. 7C is a diagram illustrating a state where the chip component is mounted by the third head.

FIG. 4 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 5 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 6 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 7 is a schematic plan view showing another example of the surface mounter according to the present invention.

FIG. 8 is a schematic plan view showing a conventional surface mounter.

[Explanation of symbols]

 2a, 2b Transport line 3 Work station 12a, 12b Component supply unit 20a, 20b, 20c Head P substrate

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-100840 (JP, A) JP-A-3-227595 (JP, A) JP-A-58-138091 (JP, A) JP-A-1- 317000 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04

Claims (1)

(57) [Claims] 1. An apparatus for mounting a chip component supplied from a component supply unit on a printed circuit board transported on a transport line, receiving the printed circuit board from the transport line, and moving while holding the printed circuit board. the work station
Together provided, both outer sides of the work station
To give to supply the chip components toward the working station
They are arranged a pair of the component supply section as that, and while the work <br/> industry station and each of the component feeding unit is provided movably in a first direction in independently, a first direction movable independently in a second direction intersecting with the horizontal plane
A plurality of heads for chip component suction are provided.
During the mounting operation by one of the number of heads,
Chip components to be mounted next time by another head other than one head
Component mounting position in the second direction in a state in which
At the same time as the above head during the mounting operation.
The next chip component to be mounted is picked up by the head.
In order to arrange the parts in the possible positions,
One component supply unit capable of supplying the
Each head and each component supply unit so as to move in the direction
Surface mounter, characterized in that There are configured.