JP2576209Y2 - Electronic component mounting equipment - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting a chip-shaped electronic component on a substrate.

[0002]

2. Description of the Related Art Conventionally, I
As an electronic component mounting device intended to automatically mount a large number of chip components such as capacitors, resistors, capacitors and the like at high speed and with high accuracy, the following XY moving type mounting device is well known.

[0003] A pair of guide rails are laid with a work station for mounting components therebetween, and a support for supporting the mounting work head is slidably mounted between the guide rails. The mounting work head includes a suction nozzle that suctions and holds an electronic component by, for example, an air suction method. Each support supports the mounting work head slidably in a direction perpendicular to the guide rail. In other words, the mounting work head is supported so as to be freely movable in two directions, a direction along the support (X direction) and a direction along the guide rail (Y direction).

When mounting components, the mounting work head picks up components to be mounted from a component supply unit by means of a suction nozzle, and then moves quickly in the X-Y two-dimensional direction to position on the printed circuit board positioned at the work station. And place the picked-up electronic component. After the placement of the electronic component is completed, the electronic component is returned to the component supply position again, and the process proceeds to picking up the next electronic component to be mounted. By repeating such a series of operations, various types of electronic components are mounted on the printed circuit board.

In the above-described series of operations, it is necessary to replace the suction nozzle with an optimum one as needed in order to accurately suction various electronic components having different shapes and sizes.
In this case, when the mounting work head reciprocates between the pickup position and the place position, in order to replace the suction nozzle,
Each time, it is necessary to detour the storage position of the replacement suction nozzle. Therefore, the mounting time is lengthened by the amount that the mounting work head bypasses the storage position of the suction nozzle. As a method of correcting the displacement of the suction position, a mechanical method using a chuck claw has been employed. In this method, chuck claws are arranged on all sides around the suction nozzle, and electronic components are evenly gripped by the four chuck claws to correct the suction position.
There is a drawback in the correction accuracy. In recent years, an optical method based on image recognition is often adopted so that electronic components can be mounted with high accuracy. In this method, a state in which a component is sucked by a suction nozzle is imaged by a camera, the image is processed by a computer to detect a shift in the suction position, and the mounting position is corrected based on this. This mounting position correction method based on image recognition can mount components with extremely high accuracy, but has the disadvantage that a relatively long time is required for image processing. In addition, when the mounting work head moves from the pick-up position to the place position, the mounting work head stops at the position where the image recognition camera is disposed, so that the mounting time is further increased.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has been made to optimize a holding member storage so that a mounting work head can move a minimum necessary path and mount an electronic component. It is an object of the present invention to provide an electronic component mounting apparatus that moves to a position and mounts various types of electronic components in as short a time as possible with high accuracy.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a mounting work head provided with a holding member for detachably holding an electronic component at a tip thereof, and a slidably supporting the mounting work head in a predetermined direction. Head driving means for reciprocating movement, a head support for integrally supporting the mounting work head and the head driving means, and a support driving means for moving the head support so as to be able to advance and retreat with respect to a component mounting work area. And a holding member storage device for storing the holding member in a freely movable manner, wherein the holding member storage device reciprocates the holding member storage device in parallel with the reciprocating sliding direction of the mounting work head. Device driving means, and a drive control means for calculating an optimum position of the holding member storage device in which the moving path of the mounting work head is the shortest distance and moving the holding member storage device to the optimum position. It is an gist the door.

[0008]

FIG. 1 shows an embodiment of the present invention.
This will be described in detail with reference to FIG. FIG. 1 is a plan view showing an electronic component mounting apparatus as one embodiment of the present invention.
The figure is its elevation. In FIG. 1, a board transport conveyor 2 for transporting a printed board is laid horizontally with a center on the apparatus base 1 extending in a horizontal direction (hereinafter, referred to as an X direction) in the figure. The board conveyor 2 has a pair of rails 2a, 2a laid in parallel on both sides, and a pair of conveyor belts 2b, 2b.
2b is stretched so as to be able to run on each rail 2a.
These transport belts 2b, 2b are driven by a substrate transport motor 3 arranged at an appropriate position. The printed circuit board Pb on which components are to be mounted is supported on both sides by the conveyor belts 2b and 2b, respectively, and is conveyed in the direction of arrow T from the right side in the figure while being guided by the rails 2a and 2a with the rotation.

A work station Ws for mounting electronic components is set substantially at the center on the apparatus base 1 along the traveling path of the substrate transfer conveyor 2. This work station Ws
Are defined by rails 2a, 2a on both sides, and positioning pins 4a, 4b at the front end and the rear end with respect to the substrate transport direction T, respectively. The positioning pins 4a and 4b are rotatably supported, respectively, and are rotated by driving means such as an air cylinder (not shown) so that the leading end advances into the substrate transport path. The transported printed circuit board Pb is stopped.

[0010] Fixing tables 5a and 5b are provided at the front and rear ends of the apparatus with the work station Ws interposed therebetween so as to straddle the substrate transport conveyer 2, respectively. Each fixed base 5
Reference numerals a and 5b are fixed so as to extend in a direction perpendicular to the substrate transfer direction (X direction) (hereinafter, referred to as Y direction). A pair of guide rails 6a, 6a are provided on these fixed bases 5a, 5b.
b is laid. These guide rails 6a, 6b
The fixing bases 5a and 5b are laid along the inner (work station Ws side) side surfaces so as to extend in the Y direction.

Between the pair of guide rails 6a and 6b, two movable tables 7A and 7B are slidably provided as head supports, respectively. These mobile units 7A and 7B are
As will be described later, the apparatus reciprocates in predetermined areas on the back side (upper side in the figure) and the near side (lower side in the figure). Each carriage 7A, 7B
Are slidably inserted at both ends thereof into guide rails 6a, 6b via a pair of slide bearings 8, 8, respectively.
In this case, the distance between each pair of sliding bearings 8, 8 interposed at the ends of the moving tables 7A, 7B is one of the distances D.
1 is set to be larger than the other interval D2. The reason will be described later in relation to the driving means of the movable tables 7A and 7B. X-axis ball screws 9A and 9B constituting head driving means are provided on each of the moving tables 7A and 7B along its longitudinal direction (X direction). One end of each X-axis ball screw 9 is connected to the X-axis ball screw 9 via a coupling 10 to form a servo motor 1 that constitutes a head driving unit.
1 is connected. Also, in parallel with each X-axis ball screw 9,
A guide rod 12 is laid. This guide rod 1
Reference numeral 2 slidably supports a head unit Uh provided with two mounting work heads 13 in this example. As shown in FIG. 2, a suction nozzle 13a for suctioning electronic components by air is mounted on each mounting work head 13 in a vertical direction. Each head unit Uh is composed of two mounting work heads 13, 13 movably connected by a mounting plate 14, and the mounting plate 14 is slidably mounted on the guide rod 12. The mounting plate 14 is connected to a feed base 15 which is mounted on each X-axis ball screw 9 so as to be capable of reciprocating and rectilinear movement. The feed base 15 and each X-axis ball screw 9 are connected via a nut member 16 screwed to each X-axis ball screw 9.

When the servo motor 11 is operated to rotate each X-axis ball screw 9 in both forward and reverse directions, the feed base 15 and the head unit Uh can be reciprocated linearly along the guide rod 12 integrally. In this case, the ball screw has a characteristic that the frictional resistance between the screw and the nut is small and that the backlash can be easily removed, so that the mounting work head 13 can be moved at high speed and positioned with high accuracy.

On the pair of front and rear fixing tables 5a and 5b, Y-axis driving ball screws 17a and 17b constituting support driving means are installed in parallel with the guide rails 6a and 6b, respectively. A pair of Y-axis driving ball screws 17a, 17b
Is about 3/5 from the upper area (central area) of each substrate transport conveyor 2 on the front and rear fixed tables 5a and 5b to one end.
Is laid over the area corresponding to. In this case, a pair of Y
The shaft drive ball screws 17a and 17b extend from respective central regions on the front and rear fixing tables 5a and 5b to respective ends opposite to each other. In this example, the Y-axis drive ball screw 17a installed on the front side with respect to the substrate transport direction T is
A Y-axis drive ball screw 17b installed on the rear side is extended in the front side area on the rear fixing base 5b in the rear side area on the rear side. Then, these Y-axis drive ball screws 17a,
17b, a coupling 18 is provided at each central end.
The Y-axis drive servomotors 19a and 19b, which are the components of the support driving means, are connected via a and 18b.

On the other hand, on the inner surfaces of the front and rear fixed bases 5a and 5b, a Y-axis driven member which constitutes a pair of support driving means by Y-axis driving ball screws 17a and 17b and Y-axis driving servomotors 19a and 19b, respectively. Ball screws 20a and 20b are provided. In this case, the Y-axis driven ball screw 20a installed on the front side is connected to the Y-axis driving ball screw 17b on the rear side, and the Y-axis driven ball screw 20b installed on the rear side is connected to the Y-axis driven ball screw.
The shaft drive ball screws 17a are laid so as to extend in parallel to each other. Further, toothed pulleys 21a and 21b are fixed to the front end of each of the Y-axis driven ball screw 20a and the Y-axis drive ball screw 17b which are opposed to each other on the front side of the apparatus. Below each of the toothed pulleys 21a and 21b, relay pulleys 21c and 21d in which two toothed pulleys are coaxially arranged are installed rotatably as shown in FIG. And these two toothed pulleys 21a, 21
b and the two relay pulleys 21c and 21d, the toothed belts 22a, 22b and 22c are wound around
a and 17b are connected so as to be synchronously rotatable. By diverting the drive transmission path between the two ball screws 20a and 17b downward in this way, it is possible to easily attach and detach members such as the component supply cassette 26 described later from the front side of the apparatus. Similarly, the toothed pulley 2 is provided between the Y-axis driving ball screw 17a and the Y-axis driven ball screw 20b which are opposed to each other on the rear side of the apparatus.
3a, 23b, etc., are connected so as to be synchronously rotatable by a toothed belt 24c or the like.

A Y-axis drive ball screw 1 facing the back side of the apparatus
7a and the Y-axis driven ball screw 20b are provided at both ends of the rear side moving base 7A at the Y-axis driven ball screw 20a facing in front of the apparatus.
And the Y-axis driving ball screw 17b are screwed to both ends of the front side moving base 7B via nut members 25, respectively. In this case, each Y-axis driving ball screw 17a, 17b
Is connected to the end of each of the movable tables 7A and 7B, the end of which is set to have the large interval D1 between the slide bearings 8 and 8 described above.

Accordingly, when the Y-axis drive motor 19b connected to the Y-axis drive ball screw 17b is operated, the Y-axis drive ball screw 17b connected by the toothed belts 22a to 22c is operated.
And the Y-axis driven ball screw 20a rotate synchronously, and the movable table 7B on the front side and the pair of mounting work heads 1 supported by the movable table 7B
A long head moving body HB consisting of 3, 13 and the like moves in the Y direction along the guide rails 6a, 6b. In this case, the head moving body HB is located in a region where the Y-axis driving ball screw 17b and the Y-axis driven ball screw 20a extend in opposition, that is,
It reciprocates freely about 3/5 of the area on the near side including the work station Ws above the base 1. On the other hand, in the rear head moving body HA of the apparatus, the Y-axis driving motor 19a operates and the Y-axis driving ball screw 17a and the Y-axis driven ball screw 20b rotate synchronously, so that about 3/5 of the rear side including the work station Ws. Reciprocate freely in the area. Accordingly, the moving areas of the two head moving bodies HA and HB overlap each other in the end area including the work station Ws at the center of the apparatus (the area above the substrate transport path).

By the way, it is possible to move the head moving bodies HA and HB reciprocally straightly by applying a driving force from only one side. However, in the present invention, the configuration in which the driving forces are applied from both sides as described above. Has become. The reason is as follows.

Each of the head moving bodies HA and HB supports a pair of mounting work heads 13 and 13 so as to be movable in a predetermined direction (X direction), and uses various members such as driving means as moving tables 7A and 7B.
Since it is supported on 7B, it is naturally long and heavy as a whole. If such a head moving body HA, HB is moved by applying a driving force only from one end, the moment of inertia is large. Therefore, especially when starting or stopping, the head moving body HA, HB is opposite to the driving side of each head moving body HA, HB. Vibration at the end becomes intense.
Therefore, for example, not only does the positioning accuracy of the head moving body HA itself decrease, but also its vibration is reduced by the guide rail 6.
a, 6b to the other, which also lowers the positioning accuracy of the other head moving body HB.

Therefore, in the present invention, as described above, the ball screws 17a and 20b and the ball screws 17 as driving means are respectively provided at both ends of the head moving bodies HA and HB.
b and 20a are connected, and a straight-moving driving force is applied substantially equally from both ends. Thus, even the long and heavy head moving bodies HA and HB can be smoothly moved in the Y direction without vibration and accurately positioned.

In order to more stably suppress the generation of vibrations of the head moving bodies HA and HB, in the present embodiment, the sliding bearings 8, 8 on the driving side are changed to the spacing D2 on the driven side.
It is set larger. Thereby, the head moving body H
Even when the operation timings of the ball screws 17a, 20b and 17b, 20a on both sides for driving A, HB are deviated, vibration of the head moving bodies HA, HB can be effectively suppressed. As a result, the head moving bodies HA and H
Highly accurate positioning of B can be performed stably.

Further, for example, in the case of the head moving body HB on the near side, each ball screw 20a, 17b is connected to a pair of guide rails 6a, 6 supporting both ends of the head moving body HB.
In FIG. 2B, since both are laid so as to be close to the same rear side (with respect to the substrate transport direction T), the bending moment applied by the linear driving force acting on the head moving body HB is reduced. As a result, the rigidity required for the moving table 7B and the like in the head moving body HB is reduced, and the reduction in size and weight of the apparatus can be promoted.

On the base 1, component supply units FA and FB are respectively set at positions near the ends of the bases on the back side and the near side of the board transfer conveyor 2 with the board transfer conveyor 2 interposed therebetween. Each part supply unit FA
, FB contain a number of component supply cassettes 26A, 26A, respectively.
26B are set in parallel. Component supply cassette 26
Both A and 26B are, for example, winding supply tapes in which chip components having a rectangular parallelepiped shape are embedded at equal intervals and wound around reels. The same electronic components are stored in the respective component supply cassettes 26A and 26B, respectively. By arranging a large number of component supply cassettes 26A and 26B in parallel, a large amount of various types of electronic components can be prepared. it can. In this case, the permutations and combinations of the types of electronic components (component supply cassettes) set in the component supply units FA and FB are optimally set so that components can be supplied efficiently in as short a time as possible. In this example, a component supply cassette 26B for storing large electronic components is set at the component supply position FB on the front side, and a component supply cassette 26A for storing small electronic components is set at the component supply position FA on the back side. In the case of supplying parts, the supply tape is intermittently fed out of the reel by a feed mechanism provided, and is picked up by the suction nozzle 13a of the mounting work head 13 which has descended at the pickup position Pp.

Each of the component supply positions F A,
Between the FB and the substrate transport conveyor 2, there are provided image recognition cameras 27A, 27A and suction nozzle exchangers 28A as image recognition imaging members, and similar image recognition cameras 27B, 27B and suction nozzle exchangers 28B, respectively. Is installed so as to be movable integrally.

Each of the image recognition cameras 27A to 27B captures an image of the electronic component sucked by the suction nozzle 13a of the mounting work head 13. The captured image data is sent to a central control unit (not shown). In the central control unit, the input image data is arithmetically processed by a computer to detect a deviation of the component suction position. This detection data is used for position correction when the electronic component is mounted on the printed circuit board Pb. In this example, since two mounting work heads 13, 13 are respectively provided side by side on each of the head moving bodies HA, HB, two image recognition cameras 27A, 27A, and 27B are correspondingly provided.
, 27B.

A plurality of storage pits 28a are formed in each of the suction nozzle exchangers 28A and 28B in parallel, and various kinds of suction nozzles 13a are detachably held in these storage pits 28a for exchange. Things.

To explain on the back side of the apparatus, the image recognition cameras 27A, 27A and the suction nozzle exchanger 28A are fixed on a common base 29A, and a guide bar 30A is slidable on the base 29A. The image recognition camera 27A and the suction nozzle exchanger 28A are supported so as to be integrally movable. The guide bar 30A is installed so as to extend in parallel with the X-axis ball screw 9. In parallel with the guide bar 30A, a camera moving ball screw 31A constituting the imaging member driving means is provided.
Is extended. This camera moving ball screw 31A
Is screwed into the base 29A. Further, a driving motor 3 which constitutes an imaging member driving means with one end of the camera moving ball screw 31A is provided at one end of the camera moving ball screw 31A.
2A is connected. Therefore, the camera moving ball screw 3
By rotating 1A, the image recognition camera 27A and the suction nozzle exchanger 28A can be reciprocated integrally in the X-axis direction.

Similarly, on the front side of the apparatus, a guide bar 30B and a camera moving ball screw 31B are installed so as to extend in parallel with the X-axis ball screw 9, and a drive motor 32B is connected to one end of the X-axis ball screw 9 for image recognition. Camera 27
B, 27B and the suction nozzle exchanger 28B are integrally reciprocated in the X-axis direction.

All the driving means in the above-mentioned electronic component exchanging apparatus, that is, X-axis driving motors 11, 11, Y-axis driving motors 19a, 19b, motors 3 for driving each substrate conveyor, air for raising and lowering the mounting work head 13, and air for suction. A cylinder (not shown), a component supply tape feeding mechanism, camera movement drive motors 32A and 32B, and an image processing camera 27A
To 27B are connected to a central control unit of an electronic component exchanging apparatus (not shown), and the central control unit outputs an optimal control signal based on a preset program to each drive unit, thereby shortening the electronic components efficiently. It is mounted on the printed circuit board Pb accurately in time. The basic pattern of the component mounting operation will be described below.

First, it is assumed that an electronic component is picked up by, for example, the back side mounting work head 13. The head unit Uh having the pair of mounting work heads 13 and 13 is moved by operating the Y-axis drive motor 19a and the X-axis drive motor
The component is also moved in the Y direction while being moved in the direction, and stopped above the pickup position Pp in the component supply cassette 26A for the component to be picked up. Next, the head unit Uh is lowered to simultaneously suction two target components and then raised. If two target components cannot be simultaneously picked up due to the arrangement of the component supply cassettes 26A, the head unit Uh is moved in the X direction to suck one by one.

Next, in order to detect a displacement of the suction position, the head unit Uh which has sucked the target component is moved to the camera 2 for image processing.
7A, 27A Move upward to perform image recognition of the component suction state. At this time, the image recognition cameras 27A and 27A are moved so that the head unit Uh moves on the shortest straight course and can place the picked-up part at a predetermined position on the substrate Pb.
Move 27A to the proper position. That is, as shown in FIG. 3, a straight line a connecting the pickup position Pp and the place position Ps of the electronic component to be mounted is connected to the image recognition camera 27A.
, 27A at the intersection Q with the moving course b. In this case, for example, the central control unit calculates the position of the intersection Q from the previously input position data indicating the pickup position Pp and the place position Ps, and drives the image recognition camera 27A to be located at the intersection Q. The drive of the motor 32A (see FIG. 1) may be controlled.

At the intersection Q, the image data of the component suction state captured by the image recognition camera 27A is sent to the central control unit. The central control unit processes this image data to calculate the deviation of the component suction position. Since this image processing requires a relatively long time, the head unit starts moving toward the work station Ws together with the start of the image processing when the imaging of the component suction state is completed.

Returning to FIG. 1, while the rear head unit Uh is moving toward the place position, the central control unit ends the image processing of the component suction state, and the deviation of the component suction position is detected. The central controller corrects the stop position of the head unit Uh based on the suction position shift data obtained by the image processing, and accurately stops the head unit Uh at the corrected appropriate position. That is, the head unit Uh is stopped at an appropriate correction position in consideration of the suction position deviation amount so that the suction component is positioned directly above the component place position.

While the head unit Uh on the back side moves toward the place position while performing image recognition of the component suction state as described above, the head unit Uh on the front side is
The electronic components to be mounted are picked up from the component supply cassette 26B on the front side in the same operation as the rear head unit Uh.

The printed circuit board Pb is transferred to the work station Ws with the rotation of the board transfer conveyor 2, and is positioned at a predetermined position. The head unit Uh descends immediately after stopping at the appropriate correction position, and
b Place the pick-up electronic component at the specified position on the top.

After the component placement by the rear head unit Uh is completed, the component placement by the front head unit Uh is performed. At this time, as described above,
Since the moving ranges of the head moving bodies HA and HB overlap in the central area including the work station Ws, the head moving bodies HA and HB may collide with each other. In this example, an encoder section is provided for each of the Y-axis drive motors 19a and 19b, and a pulse signal from the encoder section is counted by a central control section to grasp the positions of the head moving bodies HA and HB. Then, the Y-axis drive motors 19a and 19b are driven and controlled while confirming the relative positions of the two head moving bodies HA and HB based on the position data, and the head moving bodies HA and HB are controlled.
B is prevented from colliding on the work station Ws.

After placing the parts, the work station W
The back head unit Uh retracted from s moves to the component supply position FA again to pick up an electronic component to be newly mounted. Here, if the electronic component to be mounted next is a component requiring replacement of the suction nozzle 13a, the replacement of the suction nozzle 13a is performed. Also in this case, as shown in FIG. 3, the head unit Uh can move along the shortest straight course c from the place position Ps to the pick-up position Pp 'of a new component, as in the case of image recognition of the component suction state. Thus, the suction nozzle exchanger 28A is moved to the optimum position. That is, at the intersection R between the straight course c connecting the place position Ps and the pickup position Pp of the new part and the storage spot parallel line d of the suction nozzle exchanger 28A, the storage spot 28a1 of the suction nozzle being mounted (set in advance). Is located in the central control unit so that the drive motor 32A
(See FIG. 1). In the state shown in FIG. 3, the target storage spot 28a1 is located at the intersection (nozzle replacement position) R.
From the camera movement ball screw 3
By rotating 1A, the suction nozzle exchanger 28A is moved to the right by ΔD in the figure.

In FIG. 1, the head unit Uh positions the suction nozzle 13a on the intersection R and stops, then lowers the mounting work head 13, and moves the mounted suction nozzle 13a to the storage spot 28a1 (see FIG. 3). )) And immediately rise after inserting and removing. The attachment / detachment of the suction nozzle 13a is automatically performed by moving the head unit Uh up and down. When the removal of the suction nozzle 13a is completed, the head unit Uh is raised.
In FIG. 3, along with the lifting operation of the mounting work head,
The suction nozzle exchanger 28A is moved so that the suction nozzle to be newly mounted is located at the intersection R. Next, the mounting work head is lowered again, and a new suction nozzle is mounted. When the head unit finishes mounting the new suction nozzle, the mounting unit immediately raises the mounting work head and picks up the pickup position Pp of the next component to be mounted along the course c.
′.

In FIG. 1, the rear head unit Uh, which has returned to the new component pickup position Pp '(see FIG. 3) of the component supply position FA, starts picking up new electronic components. At this time, the front head unit Uh is carrying out the component placement on the printed circuit board Pb. Thereafter, the two head units Uh, Uh repeat the same operation, and electronic components are mounted on the printed circuit board Pb in an orderly and quick manner.

As described above, two head units Uh, Uh alternately mount electronic components on one printed circuit board Pb while correcting the mounting position from both sides by the image recognition method. The mounting time is reduced to about half as compared with the case where the head unit Uh is mounted. Accordingly, although the component mounting position deviation is corrected by image recognition, the mounting time of one electronic component increases, but the increase is substantially canceled in the total mounting time, and the mechanical operation of one head unit Uh by the chuck jaws is performed. This is almost the same as the case where the target suction position correction method is adopted. Further, the back and front image recognition cameras 27A and 27B and the suction nozzle exchangers 28A and 28A, so that the head unit Uh can move along the shortest straight course between the component pickup position and the place position. Since each of the 28Bs is moved to an appropriate position, the total mounting time is further reduced.

It should be noted that the present invention is not limited to the specific embodiment described above, and it is needless to say that various modifications can be made within the technical scope of the present invention. For example, it is also possible to adopt a configuration in which the image recognition camera and the suction nozzle exchanger are separated from each other without being integrally movable, and only the suction nozzle exchanger is reciprocated in the sliding direction (X-axis direction) of the mounting work head. Good. Further, the driving means for moving the head unit Uh is not limited to the combination of the motor and the ball screw.
Various drive transmission mechanisms such as a mechanism that converts the rotational force of the motor into linear motion by a pinion and a rack can be employed.
Further, the present invention is applicable not only to an electronic component mounting apparatus having two sets of head units but also to an electronic component mounting apparatus having only one set of head units.

[0041]

As described above in detail, according to the present invention, while the component supply area and the component mounting work area extending substantially in parallel to each other face each other, the holding member storage device is extended in each area. By providing reciprocating movement in a direction parallel to the existing direction, the holding member storage device can be moved to the moving course of the mounting work head as necessary. This eliminates the need for the mounting work head to detour to the position where the holding member storage device is disposed each time the holding member is replaced, and the moving distance of the mounting work head can be reduced to a necessary minimum. Therefore, the total mounting time is greatly reduced, and various types of electronic components can be mounted at high speed and with high accuracy.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component mounting apparatus as one embodiment of the present invention.

FIG. 2 is an elevation view showing the electronic component mounting apparatus.

FIG. 3 is an explanatory view showing a mounting operation in the electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base 2 Board conveyor 5a, 5b Fixed table 6a, 6b Guide rail 7A, 7B Moving table 8 Sliding bearing 9 X-axis ball screw 11 X-axis drive motor 12 Guide rod 13 Mounting work head 13a Suction nozzle 17a, 17b Y-axis drive Ball screw 19a, 19b Y-axis drive motor 20a, 20b Y-axis driven ball screw 21a, 21b, 23a, 23b Toothed pulley 21c, 21d Relay pulley 22a to 22c, 24c Toothed belt 25 Nut member 26A, 26B Parts supply cassette 27A, 27B Image recognition camera 28A, 28B Suction nozzle exchanger 29A, 29B Guide bar 30A, 30B Camera moving ball screw 31A, 31B Drive motor (camera) Pb Printed circuit board HA, HB Head moving body Uh Head unit Ws Work station Pp Pickup Position Ps, Ps' place position

Claims (1)

(57) [Scope of request for utility model registration] A mounting work head having a holding member for detachably holding an electronic component at a front end; head driving means for slidably supporting the mounting work head and reciprocating in a predetermined direction; A head support for supporting the head and the head driving means so as to be integrally movable; a support driving means for moving the head support so as to be able to advance and retreat with respect to a component mounting work area; An electronic component mounting apparatus having a holding member housing for housing; holding member housing driving means for reciprocating the holding member housing in parallel to a reciprocating sliding direction of the mounting work head;
An electronic component mounting apparatus, comprising: a drive control unit that calculates an optimum position of the holding member storage device in which a moving path of the mounting work head is the shortest distance and moves the holding member storage device to the optimum position.