JP6219838B2 - Component mounter - Google Patents

Description

  The present invention relates to a component mounter that mounts a component on a board, and more particularly, to a component mounter that includes a camera device that images an imaging target portion provided on a board.

  There are solder printing machines, component mounting machines, board inspection machines, reflow machines, etc., as equipment for producing boards with a large number of components mounted on them. It has become. Among these, in the component mounting machine, first, the substrate is transferred along the transfer path by the substrate transfer device, and is positioned and fixed at the component mounting position. Next, a fiducial mark indicating the substrate position reference is imaged by the substrate recognition camera to confirm the actual position of the substrate. Third, the component transfer device sucks the component from the component supply device and mounts it on the substrate. When the mounting of a predetermined number of components of a predetermined type is completed, the substrate is unloaded by the substrate transfer device. Thus, one cycle of component mounting is completed, and the next board is loaded. The time required from board loading to part loading after board mounting is referred to as mounting cycle time.

  An example of this type of component mounter is disclosed in Patent Document 1. The electronic component mounting apparatus of Patent Document 1 includes a component supply device, a pair of movable beams, a mounting head that moves along each beam, and a board recognition camera provided on the mounting head. The board recognition camera captures a recognition mark (fiducial mark) for position confirmation attached to the positioned circuit board. In this apparatus, after the board is carried in, first, the mounting head (component mounting head) is moved to place the board recognition camera directly above the recognition mark, and the position of the board is confirmed by imaging the recognition mark. Next, the mounting head is reciprocated between the component supply device and the substrate, and the adsorption and mounting of the components are repeated by the mounting nozzle provided at the head tip.

  The applicant of the present application discloses an electronic component mounting machine equipped with an inspection device in Patent Document 2. The apparatus of Patent Document 2 includes camera means capable of keeping the entire printed circuit board in the field of view in addition to a general component mounter configuration. The camera means is, for example, fixed to the ceiling of the mounting machine, separately from the board recognition camera (mark camera), and picks up an image for inspection after component mounting. Then, the component transfer device is configured so as to deviate from the field of view of the camera means by taking the electronic component to the component supply device, and to image the entire substrate.

JP 2010-225704 A JP 2006-319332 A

  By the way, in the conventional electronic component mounting apparatus including Patent Document 1, the board recognition camera and the mounting nozzle provided in the component mounting head cannot operate in parallel. Therefore, the mounting nozzle cannot start sucking and mounting the components until the board recognition camera has captured the fiducial mark. Here, the fiducial mark is used to align the coordinate system on the substrate with the coordinate system on the component transfer device side to cancel the influence of the substrate positioning error. In general, a plurality of fiducial marks are provided in consideration of the case where the substrate is positioned at an inclination rather than parallel to the transport path. The substrate recognition camera moves to individually capture a plurality of fiducial marks, and the time required for imaging may occupy about 10% of the mounting cycle time, which hinders improvement in substrate production efficiency.

  In addition, the electronic component mounting machine disclosed in Patent Document 2 is provided with a camera unit for inspection separately from the camera for board recognition, and it is a great merit that an inspection device that is usually a separate body is not necessary. However, the cost of the electronic component mounting machine increases due to duplication of cameras. In addition, the operation of the component transfer device may block the visual field of the camera means, and it is necessary to appropriately control the imaging timing. Further, since the camera means for keeping the entire printed circuit board within the field of view has a wider field of view than the conventional board recognition camera, it requires higher performance than the conventional one in terms of resolution and the like. Therefore, when the camera means is applied to various uses other than substrate recognition and inspection, the operation quality can be improved and the cost performance can be improved.

  As an example of improving the operation quality, it is conceivable to apply a camera device for carrying in and positioning a substrate. Conventionally, in board loading, a board passage sensor is provided at a specific position on the transport path to sense the passage of the front or rear edge of the board, and then a predetermined movement distance to the component mounting position is fixedly controlled. ing. However, there is no risk of errors in the component mounting position or troublesome positioning due to the degree of detection of the sensor or the variation in the transport state after sensing. In this case, if the front end position or rear end position of the substrate is imaged with a camera and fed back in real time, the loading and positioning can be controlled flexibly.

  The present invention has been made in view of the above-mentioned problems of the background art, can improve the production efficiency of the substrate than before, apply the camera device to various uses, improve the operation quality, and improve the cost performance. It is an issue to be solved to provide a mountable component mounting machine.

The invention of the component mounter according to claim 1 that solves the above-described problem provides a substrate transfer device that carries a board along a transfer path, positions the board at a component mounting position, and carries it out along the transfer path, and supplies a plurality of types of components. A component supply device for supplying a point, a component mounting head for picking up the component from the supply point of the component supply device and mounting it on a mounting point on a substrate that is positioned, and the component mounting head orthogonal to each other in a horizontal plane X a and component transfer device having a head driving mechanism for moving in the axial direction and the Y-axis direction, with the machine frame a mounter, not in conjunction with the movement of the component mounting head, upper or al the substrate an imaging camera capable device a double number of images, the component mounting head is moved to avoid the timing block the imaging field of view of the camera device, before the imaging target part provided on the substrate An imaging control device that causes the camera device to capture an image, and the camera device is a movable camera device in which a camera body is movable in at least one of the X-axis direction and the Y-axis direction by a camera driving mechanism. is there.

According to a second aspect of the present invention, in the first aspect, the camera driving mechanism is controlled independently from the head driving mechanism, and the camera main body is movable including above the substrate and the supply point. is there.
The invention according to claim 3 is a substrate transfer device that carries a board along a transfer path, positions the board at a component mounting position, and carries it out along the transfer path, a component supply apparatus that supplies a plurality of types of components to a supply point, The component is picked up from the supply point of the component supply apparatus, and the component mounting head to be mounted on the positioning mounting point on the substrate and the component mounting head are moved in the X axis direction and the Y axis direction orthogonal to each other in a horizontal plane. a component transfer apparatus having a head drive mechanism, a component mounting machine having a machine frame, and not in conjunction with the movement of the component mounting head, which can image the substrate above or we double the number of images An imaging control that causes the camera device to image an imaging target portion provided on the substrate, avoiding a timing when the camera device and the component mounting head move to block an imaging field of view of the camera device. Further comprising apparatus and, wherein the camera device is secured to the machine base, a stationary camera of a plurality of possible image the whole picture is divided into a plurality of images of said substrate.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the imaging target portion provided on the substrate includes a fiducial mark serving as a reference for the position of the substrate, and the component to the substrate. And a skip mark for instructing omission of the mounting operation, and at least one of a plurality of block marks provided on a plurality of block substrates of the multi-planar substrate and serving as a position reference.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the imaging target portion provided on the substrate is loaded and positioned by the substrate transfer device, and the front end position and the rear position of the substrate. Includes at least one of the end positions.

The invention according to claim 6, in any one of claims 1 to 5, the imaging target part provided on the substrate comprises at least one of the position and orientation of the components mounted on the substrate.

According to claim 7 the invention, in any one of claims 1 to 6, wherein the imaging control unit, provided in the structure for the purpose of monitoring at least one of the deformation due to deformation and long-term use due to heat of the structure The camera device is caused to image the reference position mark.

The invention according to claim 8 is the supply point according to any one of claims 1 to 7 , wherein the imaging control device monitors at least one of an arrangement state of the component supply device and a position of the supply point. The camera device is caused to image a reference position mark provided in the vicinity of.

In a ninth aspect of the present invention, in any one of the first to eighth aspects, the imaging control device monitors a width dimension between a pair of conveyor rails that are spaced apart in parallel and constitute the substrate transfer device. For the purpose, the camera device images the reference position marks respectively provided on the conveyor rail.

In the invention of the component mounting machine according to claim 1 of the present invention, without conjunction with the movement of the component mounting head, a camera apparatus capable imaging the substrate above or we double the number of images, the component mounting head is moved An imaging control device that causes the camera device to image the imaging target portion provided on the substrate while avoiding the timing of blocking the imaging field of view of the camera device, and the camera device moves in at least one of the X-axis direction and the Y-axis direction It is considered as a movable camera device. Thereby, the movement of the component mounting head and the imaging of the movable camera device can be independently operated in parallel, and the movement of the component mounting head can be controlled so as not to interfere with the imaging of the movable camera device. On the other hand, in the prior art, a series operation is performed in which a component mounting head having a substrate recognition camera and a suction nozzle is moved to first image a substrate, and then suck and mount components. Therefore, according to the present invention, the mounting cycle time can be shortened by the amount corresponding to the parallel operation as compared with the prior art, and the production efficiency of the board can be improved.

In the invention according to claim 2, the movable camera device can capture the entire image of the substrate by a plurality of imaging operations after moving . Therefore, the imaging target portion provided at an arbitrary position on the substrate can be imaged, and can be applied to a plurality of uses, so that cost performance can be improved. Furthermore, since the periphery of the substrate can be captured in the imaging field of view, the imaging can be applied to various applications, the operation quality can be improved, and the cost performance can be further improved.
In the invention according to claim 3, the plurality of fixed camera devices can capture the entire image of the substrate by dividing it into a plurality of images. Therefore, the imaging target portion provided at an arbitrary position on the substrate can be imaged, and can be applied to a plurality of uses, so that cost performance can be improved.

In the invention according to claim 4 , the imaging target portion includes at least one of a fiducial mark, a skip mark, and a plurality of block marks. Therefore, the conventional board recognition camera provided in the component mounting head can be eliminated, and the cost performance can be improved by avoiding duplication of cameras.

In the invention which concerns on Claim 5 , the imaging target part contains at least one of the front-end | tip position and rear-end position of a board | substrate when carrying in and positioning by a board | substrate conveyance apparatus. Thereby, when carrying in and positioning a board | substrate, imaging can be performed in multiple times and the present position of a board | substrate can be fed back in real time. Therefore, the position control accuracy is improved as compared with the conventional technique in which the substrate passage sensor is provided at a specific position on the transport path. Moreover, cost performance can be improved by eliminating the substrate passage sensor.

In the invention which concerns on Claim 6 , the imaging target part contains at least one of the position and attitude | position of the components with which the board | substrate was mounted | worn. Thereby, it has the inspection function of the mounted | worn components and can improve cost performance. If all the parts are taken as the imaging target part, a subsequent inspection machine can be dispensed with. If only a specific part is used as an imaging target part, it can contribute to the improvement of production efficiency by sharing the inspection work with the subsequent inspection machine. In addition, there are some components that cannot be inspected by a subsequent inspection machine. By mounting and inspecting the components after mounting the components in the component mounting machine, the operation quality of the component mounting can be improved and the product quality of the board can be improved.

In the invention which concerns on Claim 7 , an imaging control apparatus makes a camera apparatus image the reference position mark provided in the structure. By imaging the reference position mark of the structure and detecting the amount of deviation, it is possible to monitor the deformation of the structure due to heat and aging and improve the operation quality. Accordingly, the cost performance can be further improved by applying the camera device to various uses inside and outside the substrate.

In the invention according to claim 8 , the imaging control apparatus causes the camera apparatus to image the reference position mark provided in the vicinity of the supply point of the component supply apparatus. By imaging the reference position mark in the vicinity of the supply point, it is monitored whether the component supply device is placed, whether its position and posture are appropriate, whether the supply point is displaced, etc. , Can improve the operation quality. Accordingly, the cost performance can be further improved by applying the camera device to various uses inside and outside the substrate.

In the invention according to claim 9 , the imaging control apparatus causes the camera apparatus to image the reference position marks respectively provided on the pair of conveyor rails that are arranged in parallel with each other and constitute the substrate transport apparatus. By imaging the reference position mark of the conveyor rail, it is possible to monitor whether or not the width dimension between the conveyor rails is properly maintained, thereby improving the operation quality. Accordingly, the cost performance can be further improved by applying the camera device to various uses inside and outside the substrate.

It is the perspective view which showed the whole structure of the component mounting machine of 1st Embodiment. It is the perspective view which showed the center part of the component mounting machine of 1st Embodiment. It is a list of the imaging object part which a camera device picturizes in the 1st and 2nd embodiments. It is the perspective view which showed the movable camera apparatus of the component mounting machine of 2nd Embodiment. It is the perspective view which showed two fixed camera apparatuses of the component mounting machine of 3rd Embodiment.

  A component mounter 1 according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the overall configuration of the component mounter 1 of the first embodiment. FIG. 1 shows two component mounters 1 arranged side by side on a common base 90. Hereinafter, one unit will be described. The component mounting machine 1 includes a board carrier device 2, a component supply device 3, a component transfer device 4, a component camera 5, a large field of view fixed camera device 6 that is not shown in the figure, a control computer (not shown), and a machine base 91. (The reference numeral is attached only to the component mounting machine 1 on the right front side). As shown by the XYZ coordinate axes in the upper right of FIG. 1, the horizontal width direction of the component mounting machine 1 (the direction from the upper left to the lower right in FIG. 1) is the X axis direction, and the horizontal longitudinal direction of the component mounting machine 1 (FIG. 1). The direction from the upper right to the lower left of the drawing) is the Y-axis direction, and the vertical height direction is the Z-axis direction.

  The board transfer device 2 is provided in the middle of the component mounter 1 in the longitudinal direction. The substrate transfer device 2 is a so-called double conveyor type device in which the first transfer device 21 and the second transfer device 22 are arranged in parallel, and the two substrates K1 and K2 are operated in parallel to carry in the X-axis direction. Position and carry out. Each of the first and second transfer devices 21 and 22 has a pair of conveyor rails (211 and 212, 221 and 222) that are spaced apart from each other on the machine base 91 and arranged in parallel in the X-axis direction. Each conveyor rail 211, 212, 221, 222 forms a conveyance path, and a conveyor belt (not shown) is mounted so as to be capable of rotating. The conveyor belt conveys the placed substrates K1 and K2 by rotating. Each of the first and second transport devices 21 and 22 has a clamp device (not shown) that pushes up and positions the boards K1 and K2 transported to the component mounting position from the machine base 91 side.

  The width dimension (gap dimension) between the paired conveyor rails (211 and 212, 221 and 222) is adjusted in accordance with the width dimension of the substrates K1 and K2. For the purpose of monitoring the width dimension (gap dimension), a reference position mark (not shown) is provided on each of the conveyor rails 211, 212, 221, 222. This reference position mark is an imaging target portion of the large-field fixed camera device 6 described later.

  The component supply device 3 is a feeder-type device, and is provided at the front portion in the longitudinal direction of the component mounter 1 (the left front side in FIG. 1). The component supply device 3 is configured by arranging a plurality of cassette-type feeders 31 in parallel in the X-axis direction on a machine base 91. Each cassette type feeder 31 includes a main body 32 that is detachably attached to the machine base 91, a supply reel 33 that is rotatably and detachably attached to a rear portion of the main body 32 (a front side of the component mounting machine 1), and a main body 32. And a component supply unit 34 provided at the front end (near the center of the component mounter 1). The supply reel 33 is a medium for supplying parts, and a carrier tape (not shown) holding a large number of parts at regular intervals is wound around the supply reel 33. The leading end of the carrier tape is pulled out to the component supply unit 34, and different components are supplied for each carrier tape.

  Further, the vicinity of the leading end of the center in the width direction of the component supply unit 34 is a supply point for supplying components. For the purpose of monitoring the arrangement status of the cassette type feeder 31 and the position of the supply point, a reference position mark (not shown) is provided in the vicinity of the supply point of the component supply unit 34. This reference position mark is an imaging target portion of the mobile camera device 6A described in the second embodiment.

  The component transfer device 4 is a so-called XY robot type device that can move in the X-axis direction and the Y-axis direction, and supplies components from the rear part (right rear side in FIG. 1) in the longitudinal direction of the component mounting machine 1 to the front part. It is arranged over the device 3. The component transfer device 4 includes a head drive mechanism 41 (most of which is omitted in FIG. 1), a component mounting head 45, and the like. The head drive mechanism 41 drives the component mounting head 45 in the X axis direction and the Y axis direction.

  A nozzle holder 46 is provided below the component mounting head 45. The nozzle holder 46 holds a plurality of suction nozzles downward for sucking and mounting components using negative pressure. The component mounting head 45 includes an R-axis rotation drive mechanism (not shown) that rotates the nozzle holder 46 around the Z-axis, a Z-axis direction drive mechanism (not shown) that drives the selected suction nozzle up and down in the Z-axis direction, And a θ-axis rotational drive mechanism (not shown) that rotationally drives the selected suction nozzle about the Z-axis. The component mounting head 45 is not provided with a conventional board recognition camera.

  The component camera 5 is a device that captures an image of the state when the suction nozzle of the component transfer device 4 sucks the component, and is disposed on the machine base 91 near the component supply unit 34 of the component supply device 3. A control computer (not shown) is connected to the substrate transfer device 2, the component supply device 3, the component transfer device 4, the component camera 5, and the large-field fixed camera device 6 through a communication cable. The control computer obtains necessary information from each of the devices 2 to 6 and performs calculations and determinations, and issues appropriate commands to control the operations of the devices 2 to 6. In order for the operator to check the information output from the control computer and to perform necessary operations and settings, a display operation device 93 is disposed on the upper front side of the upper cover 92.

  FIG. 2 is a perspective view showing a central portion of the component mounter 1 of the first embodiment. FIG. 2 shows the substrate transfer device 2, the component transfer device 4, and the large-field fixed camera device 6. As shown in FIG. 2, the head drive mechanism 41 of the component transfer device 4 includes two Y-axis rails 421 and 422, a Y-axis direction drive mechanism, a Y-axis slider 43, and an X-axis direction drive mechanism. Has been.

  The two Y-axis rails 421 and 422 extend in the Y-axis direction and are spaced apart and arranged substantially at the same height. The Y-axis slider 43 extends in the X-axis direction, and upper end portions of both ends thereof are movably mounted on Y-axis rails 421 and 422, respectively. On one side surface of the Y-axis slider 43, two X-axis rails 441 and 442 are provided that extend in the X-axis direction and are spaced apart in parallel in the vertical direction. A component mounting head 45 is movably mounted on the X-axis rails 441 and 442. In order to drive the Y-axis slider 43 along the Y-axis rails 421 and 422, a Y-axis direction drive mechanism (not shown) is provided. In order to drive the component mounting head 45 along the X-axis rails 441 and 442, an X-axis direction drive mechanism (not shown) is provided. As the X-axis direction drive mechanism and the Y-axis direction drive mechanism, a linear motor device, a ball screw feed mechanism, or the like can be used.

  The large field of view fixed camera device 6 is fixed at a position above the head drive mechanism 41 and facing downward. The large-field fixed camera device 6 is fixed via an attachment member 61 that can adjust a fixing position, and is not limited thereto, and may be directly fixed to the lower surface of the cover 92, for example. The large-field fixed camera device 6 stores the entire image of the two substrates K1 and K2 positioned and the reference position marks of the conveyor rails 211, 212, 221, and 222 in the imaging field α. Therefore, all of these can be captured with a single image. The large-field fixed camera device 6 has a resolution that can capture an imaging target portion and a reference position mark on substrates K1 and K2, which will be described later, with sufficient definition.

  The component mounting head 45 and the Y-axis slider 43 move within the imaging field α of the large-field fixed camera device 6. At the timing when the component mounting head 45 moves to the component supply device 3 or the component camera 5, the large-field fixed camera device 6 can simultaneously capture the entire images of both substrates K1 and K2. At the timing when the component mounting head 45 mounts a component on one of the substrates (K1 or K2), a part of the imaging field of view α is blocked, so that the large-field fixed camera device 6 has the other substrate (K2 or K1). ) And a case where the whole image cannot be captured.

  In this way, the control computer controls the imaging timing in order to cause the large-field fixed camera device 6 to capture images while avoiding the timing when the component mounting head 45 moves and blocks the imaging field of view α. That is, the control computer also serves as the imaging control device of the present invention.

  Next, the operation, action, and effect of the component mounter 1 according to the first embodiment configured as described above will be described. FIG. 3 is a list of imaging target portions that are imaged by the camera devices 6 and 6A in the first and second embodiments. No. in the list. 1-4 are imaging object parts of the large-field fixed camera device 6 of the first embodiment. Reference numerals 1 to 6 denote imaging target portions of the movable camera device 6A of the second embodiment.

  No. in the list. As shown in FIG. 1, the large-field fixed camera device 6 according to the first embodiment has at least a front end position and a rear end position of the substrates K1, K2 when the substrate transport device 2 loads and positions the substrates K1, K2. One is imaged. The large-field fixed camera device 6 can feed back the current positions of the substrates K1 and K2 to the control computer in real time by performing imaging a plurality of times. Thereby, the control computer controls the substrate transport apparatus 2 with high accuracy to improve the positional accuracy, and can accurately position the substrates K1 and K2 in a short time compared to the conventional technology. The purpose of detecting the position can be achieved by imaging one of the front end position and rear end position of the substrates K1, K2. If both the front and rear positions of the substrates K1 and K2 are imaged, the lengths of the substrates K1 and K2 can be confirmed and the center position in the length direction can be accurately grasped.

  No. As shown in FIG. 2, the large-field fixed camera device 6 images the marks provided on the substrates K1 and K2 immediately after the substrate transport device 2 positions the substrates K1 and K2. Examples of the marks to be imaged include fiducial marks that serve as references for the positions of the boards K1 and K2, and skip marks that instruct the omission of mounting work of components on the boards K1 and K2. When the substrates K1 and K2 are multi-planar substrates, a plurality of block marks that are provided on a plurality of block substrates and serve as reference positions are also imaging target portions. Note that various codes such as marks and ID codes attached to the substrates K1 and K2 for purposes other than those described above can also be used as the imaging target portion.

  The control computer moves the component mounting head 45 to the component supply device 3 in advance so as not to block the imaging field of view α when the large-field fixed camera device 6 images the marks. Thereby, the imaging of the marks by the large visual field fixed camera device 6 and the suction and mounting of the components by the component mounting head 45 can be independently performed in parallel. Therefore, compared with the prior art, the mounting cycle time can be shortened by the amount corresponding to the parallel operation, and the production efficiency of the substrates K1 and K2 can be improved.

  Furthermore, no. 3, the large-field fixed camera device 6 images at least one of the position and orientation of the mounted component after the component transfer device 4 mounts the component on the substrates K1 and K2. In this case, the control computer causes the large-field fixed camera device 6 to take an image at a timing when the component mounting head 45 finishes mounting the component and moves to the component supply device 3 or the other substrate. Thereby, it is not necessary to spend extra time for imaging, and the mounting cycle time is not extended.

  No. 3, the imaging target portion may be all components or limited to specific components. If all the parts are taken as the imaging target part, a subsequent inspection machine can be dispensed with. If only a specific part is used as an imaging target part, it can contribute to the improvement of production efficiency by sharing the inspection work with the subsequent inspection machine. In addition, there are parts that cannot be inspected by a subsequent inspection machine. For example, a lower part or a part that covers a shield case that is stacked up and down in PoP mounting (Package on Package mounting) cannot be inspected by a subsequent inspection machine. In this case, in the first embodiment, after the component transfer device 4 mounts the component, the component can be imaged and inspected by the large-field fixed camera device 6. Therefore, the operation quality of component mounting can be improved and the product quality of the board can be improved.

  No. As shown in FIG. 4, the large-field fixed camera device 6 images the reference position marks provided on the conveyor rails 211, 212, 221, and 222 as imaging target portions other than the substrates K <b> 1 and K <b> 2. Thus, it is possible to improve the operation quality by monitoring whether or not the width dimension between the conveyor rails 211, 212, 221, and 222 is properly maintained.

  Imaging of the reference position marks provided on the conveyor rails 211, 212, 221, and 222 can be performed by appropriately setting the imaging timing, and it is effective when performed when the type of substrate to be produced is switched. For example, in order to perform the same imaging with a component mounting machine having a conventional configuration, the component mounting head having a board recognition camera is largely driven to the outside of the board and imaging is performed while searching for the reference position marks one by one. It is necessary to repeat, and during that time, the parts cannot be picked up and mounted. Therefore, according to the first embodiment, the width dimension between the conveyor rails 211, 212, 221, and 222 can be monitored in a much shorter time than in the prior art.

  According to the component mounter 1 of the first embodiment, imaging of marks by the large-field fixed camera device 6 and component adsorption by the component mounting head 45 can be independently performed in parallel. In addition, unlike the prior art, there is no need to move the large-field fixed camera device 6. Thereby, the mounting cycle time can be shortened and the production efficiency of the substrates K1 and K2 can be improved.

  In addition to the marks, the front and rear positions of the boards K1 and K2 when being carried and positioned, the positions and orientations of the components mounted on the boards K1 and K2, and the conveyor rails 211, 212, 221, The reference position mark provided at 222 is an imaging target portion, and an effect is produced in each. Therefore, the large-field fixed camera device 6 can be applied to various uses inside and outside the substrate to improve the operation quality and the cost performance. Further, the conventional substrate recognition camera and the substrate passage sensor can be eliminated, and the cost performance can be further improved.

  Next, regarding the component mounter according to the second embodiment having a different camera device, differences from the first embodiment will be mainly described. The component mounting machine according to the second embodiment has an overall configuration similar to that of the first embodiment, and can be configured by replacing the large visual field fixed camera device 6 with a movable camera device 6A. FIG. 4 is a perspective view showing the movable camera device 6A of the component mounter 1 of the second embodiment. The movable camera device 6A includes a camera driving mechanism, a camera holding unit 65, a camera body unit 66, and the like.

  The camera drive mechanism can be configured similarly to the head drive mechanism 41 as a whole. The camera drive mechanism includes two Y-axis rails 63 (only one is shown in FIG. 4), a Y-axis direction drive mechanism (not shown), an X-axis rail 64, and an X-axis direction drive mechanism (not shown). It consists of The two Y-axis rails 63 extend in the Y-axis direction and are spaced apart and arranged at substantially the same height. The X-axis rail 64 extends in the X-axis direction, and both ends thereof are movably mounted on the Y-axis rail 63. A camera holding unit 65 is movably mounted on the X-axis rail 64. In order to drive the X-axis rail 64 along the Y-axis rail 63, a Y-axis direction drive mechanism is provided. In order to drive the camera holding unit 65 along the X-axis rail 64, an X-axis direction drive mechanism is provided.

  A camera body 66 is fixed below the camera holding portion 65 (below the left front side in FIG. 4). The imaging field of view of the camera body 66 is wider than the width dimension of any one of the substrates K1 and K2, and can be imaged together including the reference position marks provided on the conveyor rails 211, 212, 221, and 222. However, the imaging field of view of the camera body 66 is narrower than the length of the substrates K1 and K2, and the entire image of the substrates K1 and K2 cannot be captured as a single image. The movable camera device 6A has a resolution that can image an imaging target portion provided on the substrates K1 and K2 with sufficient sharpness.

  The camera driving mechanism is controlled independently from the head driving mechanism 41 by the control computer, and the camera body 66 moves to face the imaging target unit. Further, the imaging timing of the camera body 66 is also controlled by the control computer. In the second embodiment, the control computer also serves as the imaging control device of the present invention.

  The camera body 66 is driven by a camera drive mechanism that operates according to control from the control computer, and moves in the Y-axis direction. The range of movement of the camera body 66 in the Y-axis direction includes the first substrate K1, the second substrate K2, the component supply unit 34 of the cassette type feeder 31, and the structures. The movable camera device 6A images each of the four locations described above as imaging target portions. When the first substrate K1 or the second substrate K2 is imaged, the movable camera device 6A moves in the X-axis direction (the length direction of the substrates K1 and K2), and two sheets obtained by two imaging operations. The whole image of the substrates K1 and K2 is taken with an image.

  On the other hand, an arbitrary member on the machine base 91 can be selected as the structure to be imaged. In particular, it is preferable to select a member that easily deforms due to heat generated by continuous operation or stress due to aging, for the structure to be imaged. A reference position mark is provided on the surface of the structure for the purpose of monitoring deformation. When imaging the reference position mark of the structure, the movable camera device 6A is driven by the camera driving mechanism and moves above the reference position mark to perform imaging.

  Next, the operation, action, and effect of the component mounter according to the second embodiment will be described with reference to a list of imaging target units in FIG. No. in the list. For the imaging target portions 1 to 4, the operation, action, and effect are the same as those in the first embodiment except that one substrate K1 and K2 are each captured with two images.

  No. in the list. As shown in FIG. 5, the movable camera device 6A of the second embodiment images the reference position mark provided on the structure as the imaging target portion other than the substrates K1 and K2. Thereby, the shift from the initial position of the reference position mark can be detected, and the deformation of the structure due to heat or aging can be monitored to improve the operation quality. This imaging can be performed by appropriately setting the imaging timing. For example, a fixed time interval is set through the time zone in which the component mounter 1 is operating, and after the fixed time interval has passed, It is possible to take an image using the idle time in which it is not necessary to take an image of one to four imaging target portions.

  No. As shown in FIG. 6, the movable camera device 6 </ b> A images the reference position mark provided on the cassette type feeder 31 as an imaging target portion other than the substrates K <b> 1 and K <b> 2. Thereby, it is possible to improve the operation quality by monitoring whether or not the cassette type feeder 31 is disposed, whether or not the position and posture thereof are appropriate, and whether or not the supply point is displaced. This imaging can be performed by appropriately setting the imaging timing. For example, it is effective to take an image when the cassette type feeder 31 or the supply reel 33 is replaced.

  In the component mounter of the second embodiment, the movable camera device 6A is applied to a wider variety of uses than the first embodiment. Therefore, the operation quality can be further improved, and the cost performance can be further improved.

  Next, the difference between the component mounting machine of the third embodiment and the first and second embodiments will be mainly described. The component mounting machine according to the third embodiment is a so-called single conveyor type device having a single-lane board transfer device. The component supply device, the component transfer device 4B, and the component camera of the component mounter according to the third embodiment are similar to the first and second embodiments. FIG. 5 is a perspective view showing two fixed camera devices 6B and 6C of the component mounter of the third embodiment.

  The two fixed camera devices 6B and 6C are fixedly arranged at an upper position than the head drive mechanism 41B of the component transfer device 4B and aligned in the X-axis direction facing downward. The two fixed camera devices 6B and 6C are fixed via an attachment member 67 that can adjust the position to be fixed, and are not limited to this, and may be directly fixed to the lower surface of the cover, for example. The two fixed camera devices 6B and 6C are located above the transfer path of the substrate transfer device.

The imaging field of view of the camera main bodies 68 and 69 of the fixed camera devices 6B and 6C is wider than the width dimension of the substrate on the transport path, and can be imaged together including the reference position mark provided on the conveyor rail. On the other hand, the imaging field of view of each camera main body 68 , 69 is narrower than the length dimension of the substrate, and the entire image of the substrate cannot be captured as a single image. However, the entire image of the substrate can be captured with two images of the two fixed camera devices 6B and 6C fixedly arranged in the X-axis direction.

  Also in the third embodiment, the control computer also serves as the imaging control device of the present invention, and controls the imaging timing while avoiding the timing at which the component mounting head moves to block the imaging visual field. In 3rd Embodiment, No. 1-4 in FIG. 3 is made into the imaging target part similarly to 1st Embodiment. Since the operation, action, and effect of the component mounting machine of the third embodiment are similar to those of the first embodiment except that the entire image of the board is captured by two images, description thereof is omitted.

  Note that the imaging target units of the camera devices 6, 6A, 6B, and 6C of the first to third embodiments are not limited to the six types of items described using the list in FIG. Further, in the large-field fixed camera device 6 of the first embodiment and the fixed camera devices 6B and 6C of the third embodiment, if a swing function is provided so that the direction of the imaging field of view α can be adjusted, No in FIG. . 5 and no. It is also possible to set 6 as an imaging target portion. The cost performance improves as the number of imaging target portions of the camera devices 6, 6A, 6B, and 6C increases. Various other applications and modifications are possible for the present invention.

1: Component mounting machine 2: Board transfer device 21: First transfer device 22: Second transfer device 211, 212, 221, 222: Conveyor rail 3: Component supply device 31: Cassette feeder 34: Component supply unit 4: Component Transfer device 41: Head drive mechanism 45: Component mounting head 5: Component camera 6: Large-field fixed camera device 6A: Movable camera device 6B, 6C: Fixed camera device 61, 67; Mounting member 65: Camera holding unit 66, 68 69: Camera body 90: Common base 91: Machine base 92: Cover K1, K2: Substrate α: Imaging field of view

Claims (9)

A board transfer device that carries a board along a transfer path, positions it at a component mounting position, and carries it out along the transfer path, a component supply apparatus that supplies a plurality of types of components to a supply point, and the supply point of the component supply apparatus A component mounting head that picks up the component from the mounting position and mounts the component mounting head on a positioning point on the substrate, and a head drive mechanism that moves the component mounting head in the X-axis direction and the Y-axis direction orthogonal to each other in a horizontal plane A component mounting machine equipped with a device on a machine base,
Not in conjunction with the movement of the component mounting head, an imaging camera capable device in the substrate upward or we double the number of images,
An imaging control device that causes the camera device to image an imaging target portion provided on the substrate, avoiding a timing at which the component mounting head moves and blocks an imaging field of view of the camera device;
The camera device is a component mounting machine which is a movable camera device in which a camera body is movable in at least one of the X-axis direction and the Y-axis direction by a camera drive mechanism.   2. The component mounter according to claim 1, wherein the camera driving mechanism is controlled independently from the head driving mechanism, and the camera main body is movable including above the substrate and the supply point. A board transfer device that carries a board along a transfer path, positions it at a component mounting position, and carries it out along the transfer path, a component supply apparatus that supplies a plurality of types of components to a supply point, and the supply point of the component supply apparatus A component mounting head that picks up the component from the mounting position and mounts the component mounting head on a positioning point on the substrate, and a head drive mechanism that moves the component mounting head in the X-axis direction and the Y-axis direction orthogonal to each other in a horizontal plane A component mounting machine equipped with a device on a machine base,
Not in conjunction with the movement of the component mounting head, an imaging camera capable device in the substrate upward or we double the number of images,
An imaging control device that causes the camera device to image an imaging target portion provided on the substrate, avoiding a timing at which the component mounting head moves and blocks an imaging field of view of the camera device;
The camera device is a component mounter which is a plurality of fixed camera devices fixed to the machine base and capable of capturing the entire image of the board by dividing the image into a plurality of images.   The imaging target unit provided on the board according to any one of claims 1 to 3, wherein a fiducial mark serving as a reference for the position of the board and an instruction to omit mounting the component on the board are instructed. A component mounting machine that includes at least one of a skip mark and a plurality of block marks that are provided on a plurality of block substrates of a multi-sided substrate and serve as a position reference.   5. The component according to claim 1, wherein the imaging target portion provided on the substrate includes at least one of a front end position and a rear end position of the substrate when being carried and positioned by the substrate transfer device. Mounting machine. 6. The component mounting machine according to claim 1, wherein the imaging target portion provided on the substrate includes at least one of a position and an orientation of the component mounted on the substrate.   The imaging control device according to claim 1, wherein the imaging control device uses a reference position mark provided on the structure for monitoring at least one of deformation due to heat of the structure and deformation due to aging. Component mounter that causes the device to image   8. The reference position according to claim 1, wherein the imaging control device is provided in the vicinity of the supply point for the purpose of monitoring at least one of an arrangement state of the component supply device and a position of the supply point. A component mounter that causes the camera device to image a mark.   9. The imaging control device according to claim 1, wherein the imaging control device is provided on each of the conveyor rails for the purpose of monitoring a width dimension between a pair of conveyor rails that are spaced apart in parallel and constitute the substrate transport device. 10. A component mounter that causes the camera device to image the reference position mark.

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