JP5005436B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting electronic components on a substrate.

Conventionally, by driving a movable head unit mounted with a component suction head, a printed circuit board (PWB) or the like (hereinafter referred to as a “board”) that sucks an electronic component from a component supply unit and is positioned at a mounting work position. The component mounting apparatus which mounts to ") is known. In this type of device, a board recognition camera is usually mounted on the head unit. The camera captures marks on the board and recognizes the position of the board in advance to ensure component mounting accuracy. I am doing so. Also, recently, when recognizing the position of the substrate, until the head unit completely stops at the target position so as to improve the substrate recognition accuracy by eliminating the influence of vibration due to inertial force when the head unit is stopped. There has also been proposed a technique in which the mark is imaged after waiting for settling time or settling time (for example, Patent Document 1).
Japanese Patent Laid-Open No. 2007-35946

  By the way, in the component mounting apparatus, a plurality of mounting stages (mounting processing units) each having a head unit are arranged along the substrate transport path, and the substrate to be transported is held on a movable table, and each mounting stage side There is something that pulls in and implements the mounting process. In this apparatus, the position recognition is performed after the substrate is pulled (moved) to a predetermined work position on the mounting stage. At that time, the substrate is vibrated by the inertial force of the movable table, and the recognition accuracy is improved. It may be a problem. Therefore, it is difficult to accurately recognize the position of the substrate simply by setting the settling time for the control on the head unit (camera) side as in the prior art, and there is room for improvement in this respect.

  Since the weight of the substrate varies depending on the type and size of the substrate, the time required for the substrate to stably stop at the target position also varies depending on the substrate type. Further, when a plurality of stages are close to each other, it is conceivable that vibrations of adjacent stages affect each other. Therefore, when taking the above improvement measures, it is necessary to take this point into consideration.

  The present invention has been made in view of the above circumstances, and in a component mounting apparatus that performs a mounting process by pulling (moving) a board to a predetermined work position, the object on the board is recognized more accurately. The purpose is to be able to.

In order to solve the above-described problems, the present invention captures and recognizes an object on a substrate which is transported to a predetermined work position by a movable table and positioned by an image pickup unit arranged corresponding to the work position. In the component mounting apparatus configured to, the imaging unit is configured to capture an image of the object on the substrate when a preset standby time has elapsed after the movable table is disposed at the working position. have a control means for controlling, the control means, the objects on the substrate when the waiting time has elapsed successively captured a plurality of times, the position error is a predetermined reference value of the object between these images In the case of exceeding the above, the image pickup means is controlled so as to retake the object .

  According to this configuration, the object can be imaged in a state where the substrate is more stably stopped with respect to the work position, and the object is recognized or the position of the substrate is recognized via the object. Etc. can be performed accurately.

In particular, when the object on the substrate is continuously imaged a plurality of times and the positional error between the objects of these images exceeds a predetermined reference value, re-shooting is performed, i.e., on the captured image Based on this, it is checked whether or not the substrate is stably stopped. When the substrate is not stably stopped (when the position error of the object exceeds the reference value), re-shooting is performed. Therefore , when the substrate (movable table) continuously vibrates due to the inertial force during positioning, or when the substrate vibrates due to other factors, the substrate still vibrates after the standby time has elapsed. Inconveniences such as the final recognition of the object being avoided.

Incidentally, the control means, when photographing again, it is preferred that is to further control the imaging means to image the object at the time when the predetermined standby time has elapsed (claim 2).

  According to this configuration, it is possible to capture an image of a target object in a state where the substrate is more stably stopped during re-taking.

In this case, the control means, as the waiting time for the retaking, it is preferable that is what determines the time according to the deviation between the reference value and the position error (claim 3).

  According to this configuration, it is possible to reduce the standby time for re-taking to the minimum necessary source.

In the above configuration (the component mounting apparatus according to claim 2 or 3 ), the standby time immediately after the board is placed at the work position is set as the initial standby time, and the standby time at the time of the re-taking is additionally set as standby. When time is taken, the control unit may update and set the total time of the initial standby time and the additional standby time as the initial standby time when the re-taking is performed.

  According to this configuration, the previous result is reflected in the initial standby time of the next substrate (subsequent substrate). In other words, for subsequent substrates, the first imaging of the target object is performed after the time required for the substrate to stably stop at the working position after the previous placement, and the object is first imaged. Therefore, unnecessary re-shooting can be reduced.

Further, in the above configuration (the component mounting apparatus according to any one of claims 1 to 3 ), the standby time immediately after the substrate is placed at the work position is the initial standby time, and the reference value is the first. When the position error is smaller than the second reference value (<first reference value) when the reference value is set, the control means shortens the initial standby time and sets the time after the shortening to the initial value. An update setting may be made as the waiting time. In this case, it is preferable that the control means determines a time corresponding to a deviation between the second reference value and the position error as the shortening time. According to such a configuration, it is possible to avoid a longer standby time than necessary.

  According to the component mounting apparatus of the present invention, it is possible to recognize an image of an object on a board that is transported and positioned to a work position by a movable table in a state where the board is more stably stopped at the work position. Become. Therefore, the recognition of the object or the position recognition of the substrate through the object can be performed more accurately.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  1 and 2 schematically show an embodiment of a component mounting apparatus according to the present invention. FIG. 1 is a plan view and FIG. 2 is a sectional view showing the component mounting apparatus.

  In these drawings, a component mounting apparatus 1 (hereinafter referred to as a mounting machine 1) conveys a printed board P (hereinafter abbreviated as a board P) from the upstream side to the downstream side (in FIG. 1, from the right side to the left side). The electronic components are respectively mounted on the substrate P by a plurality of mounting stages provided along the transport direction, in the illustrated example, four mounting stages 4 to 7 (first mounting stage 4 to fourth mounting stage 7). It is. In the following description, the direction parallel to the transport direction of the substrate P is defined as the X direction, and the direction orthogonal thereto is defined as the Y direction. Further, when simply referring to the upstream side and the downstream side, it follows the transport direction of the substrate P.

  The mounting machine 1 has a base 11 including first to sixth six Y frames 16 to 21. On the base 11, the four mounting stages 4 to 7 described above and The substrate P is received from the upstream device and loaded into the first mounting stage 4 on the most upstream side, and the loading stage 8 provided with the loading device 12 and the fourth mounting stage 7 located on the most downstream side. An unloading stage 9 having an unloading device 13 for unloading to a downstream device and a substrate transfer device 3 for moving the substrate P from the upstream side to the downstream side in the X direction are provided.

  The first to sixth Y frames 16 to 21 are frames extending in the Y direction, and are provided at predetermined intervals in the X direction. Among these Y frames 16 to 21, Y frames 16 and 21 (first Y frame 16 and sixth Y frame 21) at both ends in the X direction are provided over substantially the entire base 11. Further, the third and fifth Y frames 18 and 20 are provided from the front end of the apparatus (lower end in FIG. 1) to the central portion in the Y direction on the base 11, while the second and fourth Y frames are provided. The frames 17 and 19 are provided from the rear end of the apparatus to the center in the Y direction on the base 11. A concave portion 22 for allowing the substrate P to pass therethrough is formed at a position corresponding to the center portion in the Y direction of the base 11 in the Y frames 16 to 21 as shown in FIG.

  As shown in FIG. 1, the mounting stages 4 to 7 basically have a common structure except that the mounting positions and directions are different. Therefore, here, the first mounting stage 4 positioned on the most upstream side will be described, and the other mounting stages 5 to 7 will be assigned the same reference numerals and detailed description thereof will be omitted.

  As shown in FIG. 2 and FIG. 2, the mounting stage 4 has a transfer means 23 for moving the substrate P in the Y direction between a transfer position (to be described later) and a mounting position (work position), and is adjacent to the transfer means 23. Are provided with a plurality of tape feeders 24 and a component transfer means 26 for transferring components from the tape feeder 24 onto the substrate P.

  The transfer means 23 includes a pair of guide rails 31 extending in the Y direction, a movable table 32 supported movably on the guide rails 31, a Y direction drive device 33 that moves the movable table 32 in the Y direction, The conveyor 34 is provided on the movable table 32 and a clamp mechanism 35 for restricting the movement of the substrate P relative to the table 32. The Y-direction drive device 33 extends in the Y direction and is rotatably supported by a ball screw shaft 33a, a motor 33b for rotating the ball screw shaft 33a, and the ball screw shaft 33a. The table 32 is moved along the guide rail 31 along the guide rail 31 along with the conveying position indicated by the solid line and two points along with the rotation of the ball screw shaft 33a by the motor 33b. It is comprised so that it may move over the mounting position shown with a dashed line. The transport position is positioned at the center of the base 11 in the Y direction, and the mounting position is positioned near the tape feeder 24.

  The conveyor 34 has a pair of endless belts 34a that support both ends of the substrate P in the Y direction and convey the substrate P in the X direction. These endless belts 34a are supported so as to be able to move around, and the substrate P supported on the belt 34a is rotated in the X direction (transport direction) by the substrate transport device 3 to be described later. The substrate P is configured to move in the X direction. The clamp mechanism 35 includes a pair of pressure receiving members 35a and 35a positioned above both ends of the substrate P in the Y direction, and a push-up device 35b that pushes up the substrate P from below. The substrate P is clamped by lifting P from the lower side by the lifting device 35b and pressing it against the pressure receiving members 35a and 35a.

  The component transfer means 26 is provided at the upper ends of the first and third Y frames 16 and 18 and extends in the Y direction, and is horizontally mounted between the guide rails 41. A support member 42 that extends in the X direction and is movably supported by the guide rail 41, a pair of Y-direction drive devices 43 and 43 that drive the support member 42, and the support member 42 that is provided in the X direction. A second guide rail 44 extending to the head, a head unit 45 movably supported by the second guide rail 44, an X-direction drive device 46 for driving the head unit 45, and the head unit 45 being movable up and down. And a plurality of suction heads 48 that are individually driven by an elevating device including a Z-axis motor 47 and the like. As shown in FIG. 2, each of the suction heads 48 includes a suction nozzle 48a for sucking parts, and a rotation drive device including an R-axis motor 48b for rotating the suction nozzle 48a about the vertical axis. It has.

  The Y-direction drive device 43 includes a Y-axis motor 43a fixed to one end of the first and third Y frames 16 and 18, and is connected to the Y-axis motor 43a and extends in the Y direction. And a ball nut 43c that is rotatably supported by the support member 42 and screwed to the ball screw shaft 43b. Further, although not shown in detail, the X-direction drive device 46 has an X-axis motor 46a (shown in FIG. 3) fixed to one end portion in the X direction of the support member 42, and one end portion on the X-axis motor 46a. And a ball screw shaft (not shown) that extends in the X direction and is rotatably supported by the support member 42, and a ball nut (not shown) that is supported by the head unit 45 and that engages with the ball screw. Etc.

  That is, the component transfer means 26 moves the head unit 45 in the X direction and the Y direction by the operation of the driving devices 43 and 46 in the Y direction and the X direction, thereby mounting the head unit 45 on the head unit 45. The suction head 48 is configured to suck a component from an arbitrary tape feeder 24 and transfer it to an arbitrary position on the substrate P at the mounting position.

  The head unit 45 is provided with a first imaging device 49a (imaging means according to the present invention) for recognizing the substrate P disposed at the mounting position. The first imaging device 49a is integrally provided with a camera body including a CCD area sensor and an illumination device that provides illumination for imaging, and various marks (fiducials) on the substrate P arranged at the mounting position. And the image signal is output to the controller 60 which will be described later.

  Further, on the base 11, a second imaging device 49 b (see FIG. 3) for recognizing the components sucked by the suction heads 48 a of the head unit 45 is provided. The second imaging device 49b also has a configuration that is substantially the same as that of the first imaging device 49a except that the camera body includes a CCD linear sensor. The suction component is imaged from below, and the image signal is output to the controller 60 described later.

  As shown in FIG. 1, the mounting stages 4 to 7 configured as described above are arranged in a staggered pattern from the upstream side to the downstream side in the transport direction, and the movable tables 32 of the mounting stages 4 to 7 are provided. When arranged at the transfer position, the conveyors 34 of these movable tables 32 are arranged in a line in the X direction so as to form a transfer path for the substrate P.

  The substrate transfer device 3 is arranged above the position where the movable tables 32 (conveyors 34) are arranged in this way.

  Although not shown in detail, the substrate transport device 3 includes a transport shaft 52 extending in the X direction, an unillustrated shaft driving device including an air cylinder that moves the transport shaft 52 forward and backward in the X axis direction, and the transport described above. The shaft 52 is composed of a pressing member 53 and the like provided so as to be able to protrude and retract downward, and the conveying shaft 52 is fixed in a state where the pressing member 53 protrudes downward (state shown in FIG. 2). By being driven forward in the X direction by the stroke, the substrate P on each movable table 32 (conveyor 34) disposed at the transfer position is moved downstream while being pressed by the pressing member 53. Yes. A pair of the pressing members 53 are provided corresponding to the mounting stages 4 to 7, respectively, and when the substrate P is transported, the substrates P of the mounting stages 4 to 7 are respectively pressed from both sides in the X direction by the pair of pressing members 53. The position is regulated by sandwiching them. After the substrate P is transported to the downstream side, the pressing member 53 is accommodated in the transport shaft 52, and then the transport shaft 52 is driven backward by the predetermined stroke, so that the transport shaft 52 is moved to the original position. To be reset.

  FIG. 3 schematically shows a configuration of a controller 60 (corresponding to the control means of the present invention) for controlling the mounting machine 1 in a block diagram.

  In this figure, a controller 60 includes an arithmetic processing unit 61 composed of a CPU and the like, a mounting program storage unit 62 that stores a mounting program, and a data storage unit 63 that stores various data relating to boards and components necessary for mounting work. And a motor control unit 64 that controls driving of various motors (only a part of the motors are shown in the figure) such as the motors 46a, 43a, 47, and 48b that drive the head unit 45, and the mounting machine 1. It includes an external input / output unit 65 such as various sensors 70, an image processing unit 66 that performs predetermined image processing on image data acquired by the imaging devices 49a and 49b, a display unit 67 such as a liquid crystal display, and the like. Yes.

  The arithmetic processing unit 61 controls driving of the head units 45 and the like in the mounting stages 4 to 7 in accordance with a predetermined mounting program stored in the mounting program storage unit 62, and various kinds of requests required for the mounting process. By performing the arithmetic processing, a series of mounting processes of the mounting stages 4 to 7 are comprehensively controlled. In particular, in this embodiment, the recognition of the substrate P performed before the mounting work in the mounting stages 4 to 7 is performed. In the (position recognition) processing, processing such as imaging of the substrate P by the imaging device 49 and recognition of the substrate P based on the image is controlled based on standby time data stored in the data storage unit 63. It is configured as follows.

  Specifically, the position recognition of the substrate P is performed by sequentially using a pair of fiducial marks (FID marks; hereinafter referred to as a first mark and a second mark) attached on a diagonal line on the upper surface of the substrate P. The image is picked up by the image pickup device 49a, and the positions of the substrate P in the X direction, Y direction, and R direction are calculated from the positional relationship between the marks on the image.

  Hereinafter, a series of mounting process control of the substrate P by the arithmetic processing unit 61 will be described based on the flowcharts of FIGS. 4 and 5.

  When this flowchart starts, the arithmetic processing unit 61 starts to carry the substrate P into the first mounting stage 4 (steps S1 to S5). Specifically, after the movable table 32 of each of the mounting stages 4 to 7 is disposed at the transfer position, the transfer path of the substrate P is formed, and then the transfer device 12 is driven to move the substrate P from the transfer stage 8 to the first position. 1 It carries in on the movable table 32 (conveyor 34) of the mounting stage 4. FIG. Next, the clamp mechanism 35 is driven to fix (clamp) the substrate P to the movable table 32, and then the Y-direction drive device 33 is driven to move the movable table 32 from the transport position to the mounting position.

  In parallel with this, the head unit 45 is moved to the mark imaging position above the mounting position, that is, the imaging position of the first mark on the substrate P (step S7). At this time, the arithmetic processing unit 61 drives and controls the head unit 45 so that the head unit 45 is arranged at the imaging position at a timing earlier than the board P is arranged at the mounting position.

  Next, the arithmetic processing unit 61 determines whether or not the substrate P (movable table 32) has arrived at the mounting position (step S9). If it is determined that it has arrived, the re-taking counter is reset (step S11) and stored in advance. In accordance with the waiting time (FID recognition waiting time (T1); corresponding to the initial waiting time according to the present invention), the waiting time is counted by a timer (not shown) from the arrival time point, and after the elapse of this time, the first imaging is performed. The device 49a captures the first mark twice in succession (steps S15 and S17).

  Then, based on these image data, the arithmetic processing unit 61 calculates position errors (Δx, Δy) of both marks in the X direction and Y direction, and further, an error in each direction and a preset standard value α ( 0 <α) is compared to determine whether or not the error value (at least one of Δx and Δy) is less than the standard value α (step S19).

  If NO is determined here, the re-taking counter n is incremented (step S55), and a preset standby time (FID recognition wait time (Δt); corresponding to the additional standby time according to the present invention) is set. After counting by the timer (step S57), the process proceeds to step S15 again, and the first mark is taken again. Finally, the first mark is repeatedly imaged until the error (Δx, Δy) is less than the standard value α.

  That is, the standard value α is a value set based on the imaging result of the first mark when the substrate P is stably stopped, and the arithmetic processing unit 61 continues the first mark twice. By comparing the error (Δx, Δy) when the image is taken with this standard value α, it is evaluated whether or not the substrate P is stably stopped at the mounting position, and can be evaluated as being stable. Only in this case, the process proceeds to the next process (the process of step S21).

  If it is determined that the value of the error (Δx, Δy) is less than the standard value α (YES in step S19), the arithmetic processing unit 61 first images captured immediately before (the image captured in step S17). ) And the data are stored as the recognition result of the first mark (step S21). Further, the initial standby time (T1) in step S13 is retaken and updated according to the counter value (n) (step S23). Specifically, a value obtained by adding the added waiting time (Δt × n) to the initial waiting time (T1) is stored as a new initial waiting time (T1).

  Next, the arithmetic processing unit 61 sets a predetermined standard value β (0 <β <) as many times as the number (N) of preset position error values (both Δx and Δy) finally obtained in step S19. It is determined whether or not α or less (step S25). In other words, it is determined whether or not the final value of the position error (Δx, Δy) is continuously equal to or less than the standard value β for N substrates P that are continuously produced. If it is determined, the initial standby time (T1) in step S13 is shortened by a preset subtraction value (ΔT).

  That is, when the finally obtained position error (Δx, Δy) is equal to or less than the standard value β, the error (Δx, Δy) <standard after satisfying the condition of error (Δx, Δy) <standard value α. It can be considered that a time until the condition of the value β is satisfied and a standby time longer than necessary is set. Therefore, when the situation where the final position error values (Δx, Δy) are equal to or less than the standard value β continues for a predetermined number of times (N), the initial waiting time (T1) is set to a preset subtraction value (ΔT). Only to shorten.

When the recognition of the first mark is completed in this manner, the arithmetic processing unit 61 moves the head unit 45 to the imaging position of the second mark, and determines that the head unit 45 has arrived at the imaging position, a standby stored in advance. According to the time (FID recognition waiting time (T2)), the waiting time (T2) is measured by the timer from the arrival time, and after the time has elapsed, the second image is imaged by the first imaging device 49a, and the coordinate position thereof (X2, y2) is obtained (steps S31 to S37). The standby time (T2) is settling time until the head unit 45 stably stops at the imaging position of the second mark, and an actual measurement value obtained by a test or the like is applied.

  When the second mark is imaged and recognized, the arithmetic processing unit 61 recognizes the first mark recognition result (x1, y1) stored in step S21 and the second mark recognition result (x2, y2) in step S37. Based on the above, the position recognition of the board P, that is, the positions of the board P in the X direction, the Y direction, and the R direction are obtained (step S39), and then the process proceeds to the component mounting operation.

  In this component mounting operation, the arithmetic processing unit 61 first moves the head unit 45 above the tape feeder 24 and sucks the components by the suction heads 48 (step S41). Specifically, after moving the head unit 45 so that the suction head 48 is positioned above the target tape feeder 24, the suction head 48 is moved up and down to suck the components in the tape by the suction head 48a. Let it be removed. At this time, if possible, the plurality of suction heads 48 simultaneously suck the components from the plurality of tape feeders 24.

  When the suction of the components is completed, the arithmetic processing unit 61 moves the head unit 45 above the substrate P, and during the movement, the components sucked by the suction heads 48 are predetermined above the second imaging device 49b. Move along the path. Thereby, the suction component of each suction head 48 is imaged by the second imaging device 49b, and the suction state (suction displacement) of the component is recognized based on the image (step S43). Then, the target position of the head unit 45 is corrected based on the recognition result and the recognition result of the substrate P obtained in step S39. When the head unit 45 reaches the substrate P, the suction head 48 is driven up and down for the first time. These components are mounted on the substrate P, and the remaining components are sequentially mounted on the substrate P while the head unit 45 is moved intermittently (step S45).

  When all the suction components are mounted on the substrate P in this way, the arithmetic processing unit 61 determines whether or not all the components for which the first mounting stage 4 is in charge have been mounted on the substrate P (step S47). If it is determined, the process proceeds to step S41, and the component mounting operation is continued according to the processes in steps S41 to S45. If it is finally determined YES in step S47, the board P is unloaded from the mounting position (steps S49 to S53). Specifically, the movable table 32 is moved from the mounting position to the transfer position, the substrate P is fixed by the clamp mechanism 35, and then the substrate transfer device 3 is driven to move the movable table 32 of the first mounting stage 4. The substrate P is transferred onto the movable table 32 of the second mounting stage 5 on the downstream side.

  In the above description, the control of the first mounting stage 4 has been mainly described, but the control of the other mounting stages 5 to 7 is basically the same.

  As described above, in the mounting machine 1, the substrate P received at the transfer position is moved to the mounting position along with the movement of the movable table 32, and the mounting process is performed here. The position of the substrate P is recognized by imaging the first and second marks on the substrate P by the first imaging device 49a disposed above the mounting device. 1, after the substrate P is moved to the mounting position, the first mark is imaged and recognized after a predetermined waiting time (T1) has elapsed, so the substrate P (movable table 32) is mounted at the mounting position. To avoid the inconvenience that the first mark is recognized in a situation where the movable table 32 (substrate P) vibrates due to an inertial force before it is stably stopped, i.e., immediately after placement at the mounting position. Do Theft is possible. In addition, since the second mark is imaged and recognized after the head unit 45 is moved to the imaging position and after a waiting time (T2) corresponding to the settling time has elapsed, the head unit 45 (first imaging device 49a). ) Can be avoided such that the second mark is recognized before it stops stably. Therefore, it is possible to avoid the inconvenience that the first and second marks are imaged and recognized while the substrate P, the first imaging device 49a and the like are in an unstable state, and the accuracy of the position recognition of the substrate P can be improved. There is an effect.

  In particular, when recognizing the first mark, as described above, after the standby time (T1) has elapsed, the first mark is imaged twice in succession, and their position error (Δx, Δy) and a predetermined specified value α. To evaluate whether or not the substrate P is stably stopped (step S19 in FIG. 4). If the evaluation is negative, the first mark is retaken and finally When it can be evaluated that the substrate P is stably stopped, the first mark is finally recognized based on the image (step S21 in FIG. 4). There exists an effect that it can carry out in the state where the board | substrate P stopped more reliably. On the other hand, since the second mark is recognized only when the substrate P is evaluated to be stably stopped in this way (step S37 in FIG. 4), the above-described standby is performed before the substrate P is stably stopped. It is possible to satisfactorily avoid the inconvenience that the second mark is recognized after the time (T2) has elapsed. Therefore, there is an effect that the reliability of the recognition of the second mark can be improved.

In addition, the structure which recognizes each mark after evaluating whether the board | substrate P has stopped stably after progress of waiting time (T1) in this way is the mounting machine 1 which has several mounting stages 4-7. Is particularly effective. That is, in the above configuration in which the plurality of mounting stages 4 to 7 are adjacent, the vibration of the adjacent mounting stages 4 to 7 affects each other in addition to the vibration due to the inertial force when positioning the substrate P at the mounting position. It is possible to vibrate. Therefore, it is necessary to avoid the recognition of each mark under such a situation. However, according to the mounting machine 1, the board P is not connected even after the standby time (T1) has elapsed. If you can not evaluate to have stopped stably it is never recognized real qualitative first mark (step S21 in FIG. 4) is performed. Therefore, after the standby time (T1) has elapsed, it is possible to effectively avoid the inconvenience that the recognition of the mark is performed under the situation where the substrate P is vibrating under the influence of the adjacent mounting stages 4 to 7. it can. Furthermore, the weight of the substrate P varies depending on the type of the substrate P, and the inertial force when positioning the substrate P at the mounting position is also different for each type of substrate P. For this reason, depending on the type of the substrate P, it is conceivable that the vibration of the substrate P continues even after the standby time (T1) has elapsed. In such a case as well, according to the mounting machine 1, the substrate P is stably provided. Since it is not possible to substantially recognize the first mark until it can be evaluated that it has stopped, the mark can be recognized after the substrate P has been stably stopped for any type.

  In the mounting machine 1, when the first mark is re-taken, a new initial standby time (T1) is set by adding the added standby time (Δt × n) to the initial standby time (T1). As a result, the initial standby time (T1) is updated, and the situation in which the position error (Δx, Δy) of the mark image finally obtained upon recognition of the first mark is equal to or less than the standard value β is a predetermined number of times (N). In the case of continuing, the initial standby time (T1) is updated by shortening the initial standby time (T1) by a preset subtraction value (ΔT), and when the first mark on the subsequent substrate P is imaged, this updated Since the first imaging device 49a is controlled according to the initial standby time (T1), the initial standby time (T1) can be optimized in accordance with the specific operation status of the mounting machine 1 and the like. Therefore, it is possible to effectively avoid the inconvenience that the number of times of re-taking the first mark is unnecessarily increased and the processing load on the arithmetic processing unit 61 is increased, or the standby time (T1) at the time of imaging the first mark is unnecessarily prolonged. There is also an effect that can be done.

  In addition, the mounting machine 1 demonstrated above is an example of preferable embodiment of the component mounting apparatus which concerns on this invention, The specific structure can be suitably changed in the range which does not deviate from the summary of this invention.

  For example, in the above embodiment, when the first mark is retaken, the first mark is imaged by setting a certain additional waiting time (Δt) (step S57 in FIG. 4). Based on the comparison between the position error (Δx, Δy) of the first mark image captured at the standard value α and the standard value α, an additional waiting time (Δt) corresponding to the deviation between the standard value α and the error (Δx, Δy) May be set. In other words, there is a correlation between the deviation and the time required for the substrate P to stably stop. Therefore, by setting the additional standby time (Δt) according to the deviation, the first There is an advantage that it is possible to reduce the processing load of the arithmetic processing unit 61 and the like by reducing the number of execution times of the mark re-taking loop (processing). Similarly, when the initial standby time (T1) is shortened (step S27 in FIG. 4), based on the comparison between the position error (Δx, Δy) of the mark image captured immediately before and the standard value β, The time may be shortened by a time corresponding to the deviation of the error (Δx, Δy) with respect to the standard value β.

  In the above embodiment, only when the first mark is recognized, the same mark is imaged twice in succession to evaluate whether the substrate P is stably stopped (steps S15 to S19 in FIG. 4). The re-taking process (steps S55 and S57 in FIG. 4) is performed according to the above, but the same process may be performed when the second mark is recognized.

  In the above-described embodiment, the standby time (T1, T2) is updated every time as necessary. For example, the standby time is set for every fixed number of sheets or only for a certain number of sheets immediately after the start of production. The time (T1, T2) may be updated, and otherwise, the set waiting time (T1, T2) may be maintained. That is, as the production of the substrate P progresses, the standby time (T1, T2) tends to be stabilized without greatly changing. Therefore, after the production of the substrate P has progressed to some extent, the processing load on the arithmetic processing unit 61 may be reduced by maintaining the stable standby time (T1, T2) in a fixed manner. Specifically, the processes of steps S15 to S19, S23 to 27, S55, and S57 of FIGS. 4 and 5 may be skipped.

  In the above embodiment, as an application example of the present invention, the case where the first imaging device 49a images the fiducial mark on the substrate P has been described. However, the imaging target does not necessarily need to be a mark. For example, it may be a component mounted on the substrate P.

It is a top view which shows schematic structure of the component mounting apparatus by one Embodiment of this invention. It is the II-II sectional view taken on the line in FIG. It is a block diagram which shows the structure of the controller of a component mounting apparatus. It is a flowchart which shows an example of the mounting operation control by the said controller (arithmetic processing part). It is a flowchart which shows an example of the mounting operation control by the said controller (arithmetic processing part).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Printed circuit board 4-7 Mounting stage 8 Loading stage 9 Unloading stage 60 Controller 61 Arithmetic processing part 62 Mounting program memory | storage part 63 Data storage means 64 Motor control means 65 External input / output means 66 Image processing means

Claims (3)

In a component mounting apparatus configured to capture and recognize an object on a substrate that is transported to a predetermined work position by a movable table and positioned by an image pickup unit that is arranged corresponding to the work position.
After the movable table is placed on the working position, it has a control unit for controlling the imaging means to image the object on the substrate when the predetermined standby time has elapsed,
When the standby time has elapsed, the control means continuously images the object on the substrate a plurality of times, and when the position error between the objects of these images exceeds a predetermined reference value, the object A component mounting apparatus , wherein the imaging means is controlled so as to re-shoot an object. The component mounting apparatus according to claim 1,
Wherein, when the prior SL Ta Ri re further component mounting apparatus characterized by controlling the imaging means to image the object at the time when the predetermined standby time has elapsed. In the component mounting apparatus according to claim 2,
The component mounting apparatus, wherein the control means determines a time according to a deviation between the reference value and the position error as a standby time at the time of re-taking .

Images