JP2007287838A - Parts transfer device, mounting machine, and parts transfer device for parts inspection machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a parts transfer device capable of transferring parts by reliably sucking any parts by the use of a sucking means. <P>SOLUTION: The parts transfer device capable of transferring the parts of a parts supply portion arranged on a base includes: the sucking means for sucking the parts E of the parts supply portion; a moving means for moving the sucking means; and a sucking means position control means for positioning the sucking means in the upper part of a sucking position, based on information concerning the sucking position for the component to be sucked, which is arranged in the parts supply portion. The sucking position can be set to either the center position of the component to be sucked or an eccentric position deviated from the center of the component to be sucked. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component transfer apparatus for transferring a component, and more particularly to a mounting machine and a component transfer apparatus for a component inspection machine to which the component transfer apparatus is applied.

  2. Description of the Related Art Conventionally, a mounting machine that mounts an electronic component on a substrate sucks the component of the component supply unit by a suction nozzle of the head, and then moves the head to the substrate position and mounts it on the substrate.

For example, in the mounting machines shown in Patent Documents 1 and 2, the suction nozzle is moved to the center position of the component to be suctioned in the component supply unit, and the center position is sucked by the suction nozzle to hold the component. Yes.
JP-A-6-85492 JP-A-9-32499

  However, since the mounting machines shown in Patent Documents 1 and 2 suck the center position of the component by the suction nozzle, for example, it is possible to suck a component that does not have a suckable area at the center position of the component. In such a case, there arises a problem that the parts cannot be transferred.

  The present invention solves the above-described problems of the prior art, and can transfer any component that can be reliably adsorbed by the adsorbing means and can be transferred. An object is to provide an apparatus.

  In order to achieve the above object, the present invention provides the following means.

[1] A component transfer device configured to transfer components of a component supply unit provided on a base,
Adsorbing means for adsorbing the components of the component supply unit;
Moving means for moving the adsorption means;
A suction means position control means for positioning the suction means above the suction position based on information about a suction position for a part to be sucked arranged in the parts supply unit;
2. The component transfer apparatus according to claim 1, wherein the suction position can be set to either a center position of a component to be suctioned or a displacement position deviated from the center of the component to be suctioned.

  [2] The item 1 described above, wherein the suction position is obtained from a desired suction point existing for each part and a position of a part to be suctioned arranged in the part supply unit. Parts transfer device.

[3] The desired suction point is preset as a position coordinate with respect to the part shape,
A storage device for holding the position coordinate data and the position data of the part to be picked up, or holding the data of the picked-up position obtained from the position coordinate data and the position data of the part to be picked up; 3. The component transfer apparatus according to item 2, wherein

[4] Imaging means for imaging from above the components to be picked up arranged in the component supply unit;
3. The component transfer apparatus according to claim 2, further comprising a recognition unit that obtains a position of the component scheduled to be picked up based on the imaging result.

[5] The desired suction point is preset as a position coordinate with respect to a predetermined mark on the component, and a storage device that holds the position coordinate data;
Image pickup means for picking up an image of the component to be picked up arranged in the component supply unit from above,
3. The component according to item 2, wherein the position of the mark with respect to the base is obtained based on an imaging result by the imaging means, and the suction position is obtained from the mark position and the position coordinate data. Transfer device.

[6] The suction means position control means includes:
While moving the suction means suction means that sucked the parts in the parts supply part to the part mounting part provided on the base,
In the component mounting portion, the suction means is rotated to direct the direction of the component to a desired mounting direction set for the component mounted on the component mounting portion, and then the component. The component transfer apparatus according to any one of the preceding items 2 to 5, wherein the component transfer device is mounted.

[7] A second imaging unit that images the component adsorbed by the adsorption unit from below is provided.
The suction means position control means includes:
Based on the imaging result of the second imaging unit, the direction of the sucked part with respect to the suction unit is obtained, and this direction and the part placed on the part placing part on the base are set. The amount of rotation of the suction means is calculated from the desired mounting direction,
Further, the suction position of the suction means with respect to the component is obtained based on the imaging result of the second imaging means, and this suction position and a desired placement set for the component placed on the component placement portion. From the mounting position, the mounting position of the suction means is calculated,
The suction unit is moved to the mounting position of the suction unit, and the component is mounted on the component mounting unit after the suction unit is rotated based on the rotation amount. The component transfer apparatus according to any one of the preceding items 2 to 5.

[8] A mounting machine in which components of a component supply unit are transferred to a substrate by a component transfer device,
8. A mounting machine, wherein the component transfer device is configured with the component transfer device described in any one of 1 to 7 above.

[9] A component transfer device for a component inspection machine configured to transfer a component of a component supply unit to a component inspection machine when the component is inspected by a component inspection machine,
A component transfer device for a component inspection machine, comprising the component transfer device according to any one of items 1 to 7.

  According to the component transfer apparatus according to the invention [1], even if a component causes a problem when the center of the component is adsorbed by the adsorbing means, the component can be adsorbed without any defect and can be reliably transferred.

  According to the component transfer apparatus according to the above invention [2], the suction position is obtained based on the desired suction point and the position of the part to be suctioned. Can be adsorbed, surely avoid.

  According to the component transfer apparatus according to the invention [3], the position corresponding to the desired suction point can be reliably suctioned when the component is picked up by the suction means.

  According to the component transfer apparatus according to the invention [4], since the position of the component scheduled to be sucked can be accurately obtained, any desired part can be picked up based on the position. The position can be determined accurately.

  According to the component transfer apparatus according to the invention [5], since the position of the part to be sucked and the desired suction point of the part at the position can be accurately obtained, the actual part is not supplied to the part supply unit. Even in the case where the supply positions vary, it is possible to more reliably avoid the position of a component that causes a problem when it is sucked by the suction means.

  According to the component transfer device of the above invention [6], in addition to being able to adsorb while avoiding the position of the component where trouble occurs when adsorbed by the adsorbing means, the direction of the component in the component supply unit, and the component mounting unit Even when the directions of the components in the case are different or coincident, the components can be placed in a desired placement direction at a desired placement position.

  According to the component transfer apparatus according to the above invention [7], in addition to being able to adsorb while avoiding the position of the component that causes a malfunction when adsorbed by the adsorbing means, even if a positional deviation or rotational deviation occurs during the adsorbing of the component These deviations can be corrected and components can be placed with high accuracy.

  According to the invention [8], it is possible to provide a mounting machine having the same operational effects as described above.

  According to the invention [9], it is possible to provide a component transfer apparatus for a component inspection machine that exhibits the same operational effects as described above.

  FIG. 1 is a plan view showing a mounting machine 10 as a component transfer apparatus according to a first embodiment of the present invention. As shown in the figure, the mounting machine 10 of the present embodiment includes a conveyor 20 that is arranged on a base 11 and conveys a printed circuit board P, and component supply means 30 and 30 that are arranged on both sides of the conveyor 20, And an electronic component mounting head unit 40 provided above the base 11. Furthermore, the component supply means 30 and 30 have a plurality of tape feeders 31 arranged on the front side of the conveyor 20 and a tray feeder 70 arranged on the other side (rear side) of the conveyor 20.

  In the first embodiment, the components other than the tray feeder 70 constitute a mounting machine body that mounts electronic components on the printed circuit board P.

  Each tape feeder 31... As the component supply means 30 is detachably mounted with a reel wound with a tape on which small chip components such as ICs, transistors and capacitors are stored and held at predetermined intervals. The tape is intermittently fed from the reel to the tip end side of the tape feeder 31, and the chip part stored in the tape can be picked up by the head unit 40 as will be described later.

  The tray feeder 70 includes a storage portion 73 that stores the pallet 72, and is configured so that the pallet 72 can be pulled out from the storage portion 73.

  A component tray 71 is placed on the pallet 72, and each component tray 71 stores and holds a large number of electronic components (not shown) arranged in a matrix on the upper surface thereof.

  In the tray feeder 70, electronic components to be mounted on the printed circuit board P are picked up sequentially from the component tray 71 placed on the pallet 72 by the head unit 40 at a drawing position where the pallet 72 is pulled out as will be described later. It has become so.

  In the present embodiment, the component supply unit is configured by the component feeding position at the tip of the tape feeder 31, and the component supply unit is configured by the drawing position of the pallet 72 in the tray feeder 70.

  As shown in FIGS. 1 and 2, the head unit 40 is mounted on the printed circuit board P and the component supply section of the component supply means 30 so that components can be picked up from the component supply means 30 and mounted on the printed circuit board P. It is possible to move the area over. Specifically, the head unit 40 is supported by a head unit support member 42 extending in the X axis direction (substrate transport direction of the conveyor 20) so as to be movable in the X axis direction. The guide rails 43 and 43 extending in the Y-axis direction (a direction orthogonal to the X-axis in the horizontal plane) are supported so as to be movable in the Y-axis direction. The head unit 40 is driven in the X-axis direction by the X-axis servo motor 44 via the ball screw 45, and the head unit support member 42 is driven in the Y-axis direction by the Y-axis servo motor 46 via the ball screw 47. Is driven.

  The head unit 40 is mounted with a plurality of heads 41 arranged in the X-axis direction for attracting electronic components and mounting them on the substrate P. Each head 41 is driven in the vertical direction (Z-axis direction) by an elevating mechanism using a Z-axis servomotor as a drive source, and is rotated in a rotation direction (R-axis direction) by a rotary drive mechanism using an R-axis servomotor as a drive source. To be driven. A suction nozzle 4 as a suction means is provided at the tip of each head 41, and a negative pressure is supplied from a negative pressure supply means (not shown) to the suction nozzle 4 at the time of component suction. The electronic parts can be picked up with.

  In this embodiment, the head unit support member 42, the guide rail 43, the XY-axis servo motors 44 and 46, the ball screws 45 and 47, a lifting mechanism using the Z-axis servo motor as a drive source, and the R-axis servo motor as a drive source. The rotary drive mechanism constitutes moving means, and the head unit components such as the head 41 and the suction nozzle 4 constitute suction means. Further, the moving means and the suction means are included as components of the component transfer device together with the control device 6 described later.

  At the end of the head unit 40, a board photographing camera 51 is provided that is disposed downward. The camera 51 is configured to be movable in conjunction with the head unit 40 and configured to capture the state of the substrate P. Further, the camera 51 also serves as an image pickup means, and can pick up an electronic component to be picked up supplied from a component supply means such as a tray feeder 70 as will be described later.

  A component photographing camera 52 is provided on the base 11 so as to face upward. The camera 52 is configured to image a component adsorbed by the nozzle 4 of the head unit 40 and check the type of component and the adsorbed state based on the captured image. As will be described in detail later, the camera 52 also serves as a second image pickup unit that is used when correcting a positional deviation of a component attracted by the nozzle 4.

  FIG. 3 is a block diagram showing a control system of the mounting machine 10. As shown in the figure, the mounting machine 10 includes a control device 6 composed of a personal computer or the like. Various operations of the mounting machine 10 are controlled by the control device 6, and operations detailed later are automatically performed. Is to be executed.

  The control device 6 includes an arithmetic processing unit 60, a mounting program storage unit 63, a data storage unit 64, a motor control unit 65, an external input / output unit 66, and an image processing unit 67.

  The arithmetic processing unit 60 comprehensively manages various operations of the mounting machine 10. The mounting program storage means 63 stores equipment data such as mounting program data (production program data) and component data related to electronic components to be mounted. The equipment data includes the type of component to be mounted, mounting procedure, mounting position (coordinates) of the electronic component, data regarding the position of the component on the feeder when the electronic component is supplied from the feeder, such as the position of the center of the component, Data on the direction of the component and the like, as well as coordinate data on the component center position of a desired suction point (desired suction point) existing for each component are included. For most parts, the desired suction point is the component center position, and for only a small number of parts, the desired suction point is a deviation position that deviates from the component center position. In the case where the desired suction point is shifted from the component center position, the coordinate data for the component center position of the desired suction point in this part can be defined as the suction position correction data for the component center position data. . In the following, the term “adsorption position correction data” is used. In the present embodiment, the correction is used in a broad sense. For example, the term “correction” is also applied to a position where the position of the part itself is corrected or a rotational shift is corrected in addition to the position (offset) of the suction position from the center position of the part. Is used.

  The data storage unit 64 stores various data necessary for processing in the arithmetic processing unit 60.

  In the present embodiment, the storage unit 64 and the mounted program storage unit constitute a storage device.

  The motor control unit 65 controls driving of an X-axis motor, a Y-axis motor, a Z-axis motor, and an R-axis motor as moving means for the suction nozzle 4. Further, the external input / output unit 66 acquires information from various sensors such as a substrate position sensor and controls driving of a stopper or the like for positioning and stopping the substrate P on the conveyor 20.

  Further, the image processing unit 67 performs image processing on information acquired from the board photographing camera 51 and the component photographing camera 52.

  The control device 6 is connected to an input unit 61 such as a keyboard and a mouse for inputting various information, and a display unit 62 such as a CRT display and a liquid crystal display for displaying various information.

  In the present embodiment, the control device 6 constitutes a correction amount calculation unit, a correction control unit, a suction unit position control unit, and a recognition unit.

  In the mounting machine 10 configured as described above, the control device 6 operates in response to an operation start command input via the input unit 61, and the control device 6 controls the drive of each drive unit, so that the following operations are performed. Done automatically.

  First, as shown in step S1 of FIG. 4, when an unmounted board P is carried into the mounting machine 10, the board P is transported to a predetermined mounting position by the conveyor 20 and fixed at that position ( Step S2).

  Thereafter, electronic components are mounted on the substrate P. This mounting process is performed according to the equipment data such as the production program data described above. This equipment data includes data related to electronic components (position correction target components) that require the suction position correction described below, that is, a desired suction point is deviated from the component center position.

  In the present embodiment, the position correction target component E that requires correction of the suction position includes the components shown in FIGS. In the component E shown in FIG. 5, an electronic element 82 that is vulnerable to impact is installed on a small substrate 81, and a suckable region R is small, and a suction position R <b> 1 is set in the region R. Further, the component E shown in FIG. 6 has irregularities formed on the upper surface, the suckable region R is limited to the bottom surface of the concave portion, and the sucking position R1 is set in the region R.

  In this way, a component having a restriction on the suckable region R such that the suckable region R is greatly deviated from the center or the region R is small is configured as the sucking position correction target component E.

  The parts that do not require the correction of the suction position are parts other than those described above. For example, the parts that can be picked up are relatively wide at the center position.

  When the component to be mounted next (part to be suctioned) is a component that does not require the suction position correction (NO in step S3 in FIG. 4), normal mounting processing is performed. That is, the head unit 40 moves to the component feeder of the tape feeder 31 or the tray feeder 70 and sucks predetermined electronic components by the suction nozzle 4 of the head unit 40 (step S6). Subsequently, the head unit 40 moves to the substrate position, and the held component is mounted at a predetermined position on the substrate P (step S7).

  On the other hand, when the component to be mounted next (part to be suctioned) is the suction position correction target component E (YES in step S3), the suction position is corrected. Since the suction position correction target component E is usually supplied from the tray feeder 70 side of the component supply means 30, 30, the correction target component E is also supplied from the tray feeder 70 in this embodiment. And

  In this embodiment, a position correction mark is set in advance on the correction target component E. This mark is not limited to those given at the time of manufacturing the part, but can be used for position specification (position specification, such as the corner of the part body, the contour of the part body, leads, printed product number and code, etc.) Here, as shown in FIG. 5, it is assumed that a mark M serving as a position reference at the time of component manufacture is printed. The mark M is configured so that the rotation angle (rotation posture) can also be determined. That is, the mark M can specify the position of the part and the position in the rotation direction, and the position data of the mark M in the coordinate system set on the part with reference to the part center position and the coordinate system as the correction data of the suction position The position data of the desired suction point is stored in the data storage means 64.

  When the suction position is corrected (YES in step S3 in FIG. 4), the head unit 40 moves to the position of the correction target component E, and the correction target component E is imaged by the board photographing camera 51 (step S4).

  Subsequently, as shown in FIG. 7, based on the picked-up image data, the electronic device at the set position assumed to be stored in the correct position at the center position of the electronic component storage unit of the tray feeder 70 set in advance as equipment data. With respect to the center position (reference position) of the mark M in the component Ei, the positional deviation amount (x) in the X direction and the positional deviation amount in the Y direction of the center position (reference position) of the mark M in the actual captured electronic component E (Y) is calculated. That is, the board imaging camera 51 can recognize how much the electronic component Ei stored in the electronic component storage portion of the tray feeder 70 is displaced from the set position. The electronic component indicated by the imaginary line in the figure is a conceptual diagram in a state in which only the positional deviation is corrected without correcting the rotational deviation with respect to the electronic component Ei that is assumed to be at the set position. A state is shown in which the electronic component Ei is translated by the amount of displacement (x, y).

  Further, the rotational displacement amount (r) of the mark M of the actual component E with respect to the mark M of the electronic component Ei that is in the set position, that is, the actual rotation of the electronic component E with respect to the electronic component Ei that is in the set position. A deviation amount (r) is calculated. Subsequently, based on these calculation results (x, y, r), based on the following calculation formulas (1) to (3), the actual component E with respect to the suction position R1 in the electronic component Ei that is assumed to be at the set position. The correction amount of the suction position R1, that is, the position correction amount (dx) in the X direction, the position correction amount (dy) in the Y direction, and the correction amount (rotational deviation correction amount dr) in the R axis direction (rotation direction) are calculated. However, θ = rπ / 180 (the unit of r is degree), “Δx” is a distance (offset amount) in the X direction from the mark center position of the suction position R1 in the part E, and “Δy” is a distance in the Y direction ( Offset amount).

dx = Δx · cos θ−Δy · sin θ + x (1)
dy = Δx · sin θ−Δy · cos θ + y (2)
dr = r (3)
Based on the correction amounts (dx, dy, dr) calculated in this way, the suction position R1 of the head unit 40 with respect to the component E by the suction nozzle 4 is corrected. That is, when the suction nozzle 4 is moved to the suction position, the position is corrected by an amount corresponding to the position correction amount (dx, dy) and the rotation correction amount with respect to the suction position of the electronic component at the set position. The rotation angle is corrected by an amount corresponding to (dr) (step S5). Thereby, the suction nozzle 4 is accurately positioned with respect to the suction position R1 of the component E, and the component E is sucked by the suction nozzle 4 in this state (step S6).

  In the above description, the suction position is corrected for a component at a deviated position where the desired suction point is displaced from the component center position. However, in the present invention, the desired suction point is the center of the component. It is possible to correct misalignment and rotational misalignment even with respect to the component at the position. In other words, the offset amounts Δx and Δy are “0” for the parts where the desired suction point is the part center position. In this case as well, the positional deviation and the rotational deviation can be corrected by passing through step S6, and the tray feeder 70 can be corrected. This makes it possible to correctly adsorb parts supplied from the factory.

  The nozzle 4 that has sucked the component E moves the head unit 40 to the substrate position, and mounts the sucked component E at a predetermined position on the substrate P (step S7).

  The above operations (steps S3 to S7) are repeated until all components are mounted on the board (NO in step S8).

  When all the components are mounted on the substrate (YES in step S8), the fixing of the substrate P on the conveyor 20 is released (step S9), and the substrate P is carried out by the conveyor 20 (step S10). ).

  Further, when the production of the substrate P is continuously performed (NO in step S11), the next substrate P is carried in (step S1), and the mounting process is performed in the same manner as described above.

  When the last substrate P is unloaded (step S10) and the mounting process is completed (YES in step S11), the operation of the mounting machine 10 is stopped and the operation is ended.

  As described above, according to the mounting machine 10 of the present embodiment, before the component E is sucked by the suction nozzle 4, the actual component E is picked up by the camera 51, and the captured image data and the set position are The component data for the electronic component Ei to be compared is compared to calculate the correction amount of the suction position R1 in the actual component E, and the suction position R1 of the component E by the nozzle 4 is corrected according to the correction amount. Therefore, even if the electronic component Ei stored in the electronic component storage unit in the tray feeder 70 is displaced from the set position, it can be correctly sucked. Further, the component suction position R1 of the component E by the nozzle 4 is corrected based on the desired suction position data for the mark M in the component data for the electronic component Ei. In addition, the suction nozzle 4 can be sucked in a stable state with high positional accuracy at the suction position of each component. Therefore, each component can be mounted on the substrate P in a stable state with high positional accuracy, and a high-quality mounting substrate P can be produced efficiently.

  In particular, as shown in FIGS. 5 and 6, when mounting a component E whose suction position R1 is limited by the internal structure of the component or the shape of the upper surface of the component, the suction is caused by the slight displacement of each component. However, in this embodiment, since the suction position R1 is corrected with respect to the part E that is actually picked up, the positional deviation for each part can be reliably corrected, and the position accuracy can be corrected. It can be adsorbed in a stable state.

  In the above embodiment, the component E requiring position correction is supplied from the tray feeder 70 side. However, the present invention is not limited to this, and in the present invention, the suction position of the component supplied from the tape feeder 31 side is corrected. You may make it do.

  On the other hand, in the above-described embodiment, the mark M whose angle can also be determined is imaged, and the rotation correction amount is calculated based on the captured image data of the mark M. It is also possible to correct the suction position of the nozzle 4 using a mark that cannot be distinguished.

  For example, as shown in FIG. 8, the attracting position correction target component E is provided with marks M1 and M2 that cannot independently determine the rotation angle.

  In the case of correcting the suction position of the component E, the board photographing camera 51 captures and recognizes the correction target component E, and the positional deviation amount of one mark, for example, the mark M1, is calculated. That is, the positional deviation amount (x1, y1) of the mark M1 in the actual component E is calculated with respect to the mark M1 in the electronic component that is in the set position. Subsequently, based on the two marks M1 and M2 of the actual component, the rotational deviation amount (r) of the actual component E with respect to the electronic component at the set position is calculated. For example, an inclination angle (an angle with respect to the X axis) of a line segment connecting two marks M1 and M2 in an actual part is obtained, and the corresponding line segment of the electronic part obtained from the angle and the equipment data and at the set position is obtained. Are compared with each other to obtain the rotational deviation amount (r).

  Further, from these results (x1, y1, r), in the same manner as described above, the correction amount (dx, dy, dr) of the suction position in the actual part E with respect to the suction position in the electronic part that is at the set position. Is calculated. Then, by correcting the suction position of the suction nozzle 4 according to the correction amount (dx, dy, dr), the nozzle 4 is moved to the component E in a stable state at a more desirable suction point with high positional accuracy as described above. Can be adsorbed.

  Further, in this first modification, it is also possible to calculate the positional deviation amount of the other mark M2 and calculate the positional correction amount in the same manner as described above on the basis of this.

  In FIG. 8, “Δx1, Δy1” is an offset amount from the mark M1 position of the suction position R1 in the component, and “Δx2, Δy2” is an offset amount from the mark M2 position of the suction position R1.

  In this way, even if two marks M1 and M2 that cannot be distinguished by angle alone are used, the suction position can be corrected, and the same effect as described above can be obtained.

  In the first modification, the two marks M1 and M2 are simultaneously imaged by one imaging by the camera 51, and the positions of the marks M1 and M2 are calculated, thereby improving the production efficiency. Can be made. That is, when the two marks M1 and M2 are imaged in two steps, two imaging operations are required, and accordingly, the cycle time becomes longer and production efficiency may be reduced. On the other hand, in the first modification, since the two marks M1 and M2 are imaged at a time, the imaging operation is only required once, the cycle time is shortened, and the production efficiency can be improved. .

  Also in the first modified example, as in the above embodiment, the marks M1 and M2 are not limited to those given at the time of component manufacture, but include corners (corner portions) of component bodies, contours of component bodies, leads Any part that can be specified by a position that is configured by a printed product number, code, or the like may be used, and even if the same type of mark (position specifying part) is combined, different types of marks (position specifying part) May be combined.

  For example, as shown in FIG. 9, the suction position R1 may be corrected as described above using two diagonal corners M1 and M2 as two marks.

  On the other hand, in the present invention, since the mark 51 is partially imaged by the camera 51, the suction position can be accurately corrected even for an electronic component having a size larger than the camera field of view (view angle). it can. That is, as shown in FIG. 10, when correcting the suction position of an electronic component (large electronic component E) having a size larger than the angle of view G of the camera 51, a mark M that can be independently determined is provided. First, the periphery of the mark M is imaged by the camera 51. Then, based on the image data and the component data included in the equipment data, the positional deviation amount of the mark M in the actual electronic component E with respect to the electronic component assumed to be at the set position, as in the above-described embodiment and the like. Thus, the rotation deviation amount in the actual electronic component E can be calculated, and the correction amount of the suction position in the actual electronic component E can be calculated with respect to the suction position in the electronic component that is in the set position. Therefore, by correcting the suction position of the suction nozzle 4 based on the correction amount, the actual electronic component E can be sucked in a stable state with high positional accuracy by the suction nozzle 4.

  When correcting the suction position of the large electronic component E, as shown in FIG. 11, when two marks M1 and M2 that cannot be individually distinguished are provided, the camera 51 sets the marks M1 and M2 to Each of the surroundings is imaged. And based on both imaging data, like the said 1st modification, it calculates the amount of correction | amendment by calculating the position shift amount and rotation shift amount of an actual electronic component with respect to the electronic component which is in a setting position. You can do it. When the two marks M1 and M2 are arranged within the angle of view G of the camera 51, the number of times of imaging can be reduced by simultaneously imaging the two marks M1 and M2 by one imaging. .

  By the way, in the present embodiment, even if the suction nozzle 4 is misaligned or rotated with respect to the component E when the component E is sucked by the suction nozzle 4, the misalignment and rotation misalignment can be corrected. it can. That is, as shown in FIG. 1, in the mounting machine 10 of the present embodiment, a camera (second imaging unit) 52 that images the component E adsorbed by the nozzle 4 of the head unit 40 on the base 11 from below. Is provided. The camera 52 picks up an image of the nozzle 4 that has picked up the component E from below, and based on the image pickup result, the direction of the component E with respect to the nozzle 4 (actual suction direction of the component) and the position of the component E with respect to the nozzle 4 ( Obtain the actual suction position of the component. In addition, the amount of misalignment correction is calculated from the actual suction position of the component and the desired placement position (mounting position) preset for the component mounted on the component placement portion (mounting position). Then, the rotational deviation correction amount is calculated from the actual suction direction of the component and a desired placement direction (mounting direction) set in advance. When the nozzle 4 is moved to the mounting position of the substrate P, the position of the nozzle 4 is corrected by an amount corresponding to the amount of correction of the positional deviation, and the component E adsorbed by the nozzle 4 is positioned at the desired mounting position. At the same time as arranging with high accuracy, the nozzle 4 is rotated (rotated) by an amount corresponding to the rotational deviation correction amount, so that the orientation of the component E attracted to the nozzle 4 is exactly matched with a desired mounting direction. In this way, when the component E is adsorbed by the adsorption nozzle 4, even if the adsorption nozzle 4 is misaligned or rotated with respect to the component E, the misalignment and rotation misalignment are corrected, and the component can be accurately obtained. It can be mounted on the substrate P.

  Further, in the present embodiment, the direction of the component E arranged in the component supply unit (the direction of the supply component) is different from the direction of the component E when the component E is mounted on the substrate P (the direction of the mounted component). Even in such a case, the component E can be mounted without any trouble. That is, in this case, a predetermined rotation amount obtained from the angle difference between the direction of the supply component and the direction of the mounting component is set in advance. Then, when the nozzle 4 sucking the component E of the component supply unit is moved to the mounting position (mounting position) of the substrate P, the nozzle 4 is rotated by an amount corresponding to the predetermined rotation amount, and the nozzle 4 The direction of the component E attracted to the substrate is exactly matched with the direction of the desired mounting component (desired placement direction). In this state, the suction by the nozzle 4 is released and the component E is mounted (placed) on the substrate P. In the case where the nozzle 4 is rotated corresponding to a predetermined rotation amount set in advance as described above, even if there is a displacement in the suction position of the nozzle 4 as described above, the displacement is also similar to the above. It can be corrected.

  Further, as described above, after the component E is adsorbed by the adsorption nozzle 4, when correcting the displacement or rotational deviation, even when the displacement position deviated from the center of the component E by the nozzle 4 is adsorbed, Positional deviation and rotational deviation can be corrected in the same manner as described above.

  In addition, as described above, the correction of the positional deviation and the rotational deviation after the component suction is not limited to the first embodiment, but can be applied to the following second and third embodiments, and also to each modified example in the same manner as described above. And similar effects can be obtained.

  FIG. 12 is a plan view showing a mounting machine 110 according to the second embodiment of the present invention. As shown in the figure, in the mounting machine 110, the mounting machine main body and the tray feeder 70 are spaced apart from each other in the Y-axis direction, and within the movable region of the head unit 40 in the mounting machine main body, and the tray feeder. A guide rail 80 is provided between the 70 pallet extraction positions. Further, a transfer head unit 81 is provided on the guide rail 80 so as to be able to run, and the head unit 81 is provided with a head 82 having a suction nozzle capable of sucking an electronic component.

  In the mounting machine 110, a plurality of electronic components are arranged in a matrix on the tray 71 on the pallet 72 drawn out by the tray feeder. Then, the head unit 81 travels toward the tray feeder 70 side on the guide rail 80 and moves to a position corresponding to a predetermined electronic component, and the electronic component is sucked by the suction nozzle of the head 82. Regarding the positioning of the suction nozzle with respect to the electronic component, the transfer head unit 81 moves in the length direction of the guide rail 80, thereby positioning in the rail length direction (Y-axis direction) and the pallet 72 in the pull-out direction. By moving to, positioning in the direction orthogonal to the guide rail 80 (X-axis direction) is achieved.

  After a predetermined component is sucked by the suction nozzle of the head 82, the head unit 81 travels along the guide rail 80 and reaches the component mounting base 85 provided in the movable region of the head unit 40 in the mounting machine body. Move and transfer the parts onto the platform 85.

  On the other hand, the electronic component transferred to the component mounting base 85 is mounted on the substrate P by the head unit 40 of the mounting machine main body as in the above-described embodiment.

  In such a mounting machine 110, when the suction nozzle of the transfer head unit 81 is suctioned to a component, the suction position can be corrected by the same means as in the above embodiment. That is, when the suction nozzle is picked up by a component, the position identifying unit such as a mark is picked up by the camera 51 ′ that also serves as an image pickup means, and the correction amount of the pick-up position is calculated based on the picked-up data, and the head 82. The suction position of the suction nozzle is corrected.

  Reference numeral 52 ′ denotes a camera that also serves as the second image pickup means, and picks up images of the parts sucked by the suction nozzle from below.

  Needless to say, on the mounting machine main body side of the second embodiment, the suction position is corrected by the same means as in the above embodiment when the components on the component mounting base 85 are sucked by the suction nozzle of the head unit 40. It is also possible.

  In the shuttle transfer type mounting machine in which components are transferred from the tray feeder to the mounting machine main body by the shuttle, the suction position can be corrected in the same manner as described above. That is, in the shuttle transfer type mounting machine, a guide rail is bridged between the tray feeder and the mounting machine main body, and a shuttle on which an electronic component can be mounted is movably provided on the guide rail. Further, there is provided a component transfer device having a suction nozzle that is movable between the shuttle that has moved to the tray feeder side and the component supply unit of the tray feeder. The electronic component supplied to the component feeder of the tray feeder is sucked by the suction nozzle of the component transfer device, the nozzle is moved to the shuttle, and the electronic component is mounted on the shuttle. Subsequently, the shuttle is moved along the guide rail toward the mounting machine main body, and then the electronic components on the shuttle are mounted on the substrate by the head unit of the mounting machine main body.

  In this shuttle transfer type mounting machine, when the suction nozzle of the component transfer device is suctioned to the component, the suction position can be corrected by the same means as described above.

  FIG. 13 is a plan view showing an electronic component inspection machine 210 according to the third embodiment of the present invention. As shown in the figure, the base 211 of the inspection machine 210 is provided with a cassette installation section 243 on which cassettes 242 storing wafers W in which bare chips (electronic components) are diced can be stored in multiple stages. ing. The cassette 242 mounted on the cassette installation unit 243 is transported to a position below the opening 244 formed in the base 211 by a transport machine (not shown), and the bare chip is attached by the head 245 at this position. The head 245 is provided with a suction nozzle, and the bare chip is sucked by the suction nozzle.

  The head 245 conveys the bare chip from the opening 244 to the component standby part 247 along a rail 246 extending in the Y-axis direction on the base 211.

  The component standby unit 247 is arranged on the base 211 corresponding to the rail 248 extending in the X-axis direction, and the bare chip conveyed to the component standby unit 247 is supported by the head unit 249 driven along the rail 248. It is conveyed to the inspection socket 251 on 241 and a predetermined inspection is executed.

  The head unit 249 is provided with a plurality of heads 250 as described above, and each head 250 is provided with a suction nozzle (not shown) capable of sucking a bare chip. Further, the head unit 249 is provided with a camera 51 as an imaging unit.

  In the component inspection machine 210, a component inspection device 218 is provided on the base 211 between the component standby unit 247 and the inspection socket 251.

  The component inspection apparatus 218 detects a defect of the bare chip conveyed from the component standby unit 247 to the inspection socket 251, and the bare chip detected as a defective product is detected by the head unit 249 on the defective product recovery unit on the base. Transport to 252.

  The bare chip determined as a defective product as a result of the inspection in the inspection socket 251 is transported to the defective product collection unit 252 by the head unit 249, while the bare chip determined as a non-defective product is transferred by the head unit 249. The non-defective product recovery unit 254 on the base 211 is transported.

  In such an electronic component inspection machine 210, when the bare chip of the component standby unit 247 is sucked by the suction nozzle of the head unit 249, the suction position can be corrected by the same means as in the above embodiment. In this case, a component transfer device is configured by the components constituting the head unit 249 and the means for moving the suction nozzle such as the rail 248.

  In the third embodiment, when the bare chip of the cassette 242 arranged in the opening 244 is sucked to the suction nozzle of the head 245, the suction position can be corrected by the same means as described above. . In this case, a component transfer apparatus is configured by the components constituting the head 245 and the means for moving the suction nozzle such as the rail 246.

It is a top view which shows the mounting machine with which the component transfer apparatus concerning 1st Embodiment of this invention was applied. It is a front view which shows the component transfer apparatus part of the mounting machine of 1st Embodiment. It is a block diagram which shows the control system of the mounting machine of 1st Embodiment. It is a flowchart for demonstrating operation | movement of the mounting machine of 1st Embodiment. It is a top view which shows the components by which the adsorption | suction position is correct | amended in the mounting machine of 1st Embodiment. It is a figure which shows the other components by which the adsorption | suction position is correct | amended in the mounting machine of 1st Embodiment, Comprising: The figure (a) is a top view, The figure (b) is a sectional side view. It is a conceptual diagram which shows the correction method of the adsorption | suction position in the mounting machine of 1st Embodiment. It is a top view which shows the components by which the adsorption | suction position is correct | amended based on two marks in the mounting machine of 1st Embodiment. It is a top view which shows the components by which the adsorption | suction position is correct | amended based on two corner | angular parts in the mounting machine of 1st Embodiment. It is a top view in the case of correct | amending an adsorption | suction position with respect to components larger than a camera view angle in the mounting machine of 1st Embodiment. It is a top view in the case of correct | amending an adsorption | suction position based on two marks with respect to components larger than a camera view angle in the mounting machine of 1st Embodiment. It is a top view which shows the mounting machine with which the component transfer apparatus concerning 2nd Embodiment of this invention was applied. It is a top view which shows the electronic component inspection machine with which the component transfer apparatus concerning 3rd Embodiment of this invention was applied.

Explanation of symbols

4 Adsorption nozzle (adsorption means)
10, 110 Mounting machine 11 Base 51, 51 'Board photographing camera (imaging means)
52, 52 'component photographing camera (second imaging means)
210 Electronic component inspection machine r Rotation deviation (rotation)
x, y position deviation amount E component Ei electronic component P substrate R1 suction position

Claims (9)

A component transfer device configured to transfer components of a component supply unit provided on a base,
Adsorbing means for adsorbing the components of the component supply unit;
Moving means for moving the adsorption means;
A suction means position control means for positioning the suction means above the suction position based on information about a suction position for a part to be sucked arranged in the parts supply unit;
2. The component transfer apparatus according to claim 1, wherein the suction position can be set to either a center position of a component to be suctioned or a displacement position deviated from the center of the component to be suctioned.   2. The component transfer according to claim 1, wherein the suction position is obtained from a desired suction point existing for each part and a position of a part to be suctioned arranged in the part supply unit. Mounting device. The desired suction point is preset as a position coordinate for the part shape,
A storage device for holding the position coordinate data and the position data of the part to be picked up, or holding the data of the picked-up position obtained from the position coordinate data and the position data of the part to be picked up; The component transfer apparatus according to claim 2, wherein: Imaging means for imaging from above the components to be picked up arranged in the component supply unit;
The component transfer apparatus according to claim 2, further comprising: a recognizing unit that obtains a position of the component scheduled to be sucked based on the imaging result. The desired suction point is preset as a position coordinate with respect to a predetermined mark on the component, and a storage device that holds the position coordinate data;
Image pickup means for picking up an image of the component to be picked up arranged in the component supply unit from above,
The position of the said mark with respect to the said base is calculated | required based on the imaging result by the said imaging means, The said adsorption | suction position is calculated | required by this mark position and the said position coordinate data. Parts transfer device. The suction means position control means includes:
While moving the suction means that sucked a component in the component supply unit to a component placement unit provided on the base,
In the component mounting portion, the suction means is rotated to direct the direction of the component to a desired mounting direction set for the component mounted on the component mounting portion, and then the component. The component transfer apparatus according to any one of claims 2 to 5, wherein the component transfer device is mounted. A second image pickup means for picking up an image of the part sucked by the suction means from below;
The suction means position control means includes:
Based on the imaging result of the second imaging unit, the direction of the sucked part with respect to the suction unit is obtained, and the direction and the part placed on the part placing part on the base are set. The amount of rotation of the suction means is calculated from the desired mounting direction,
Further, the suction position of the suction means with respect to the component is obtained based on the imaging result of the second imaging means, and this suction position and a desired placement set for the component placed on the component placement portion. From the mounting position, the mounting position of the suction means is calculated,
The suction unit is moved to the mounting position of the suction unit, and the component is mounted on the component mounting unit after the suction unit is rotated based on the rotation amount. The component transfer apparatus according to any one of claims 2 to 5. A mounting machine that transfers components of a component supply unit onto a substrate by a component transfer device,
A mounting machine comprising the component transfer apparatus according to claim 1, wherein the component transfer apparatus includes the component transfer apparatus according to claim 1. When inspecting a component by a component inspection machine, a component transfer device for a component inspection machine configured to transfer a component of a component supply unit to the component inspection machine,
A component transfer device for a component inspection machine, comprising the component transfer device according to claim 1.

Images