JP2007305775A - Component mounting method, component mounting device and component mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To advance effectively the mounting process of a component and secure high mounting accuracy. <P>SOLUTION: The component is mounted to a substrate P by first and second head units 5A, 5B. The component mounting method comprises a process for obtaining coordinate transformation data between both the units 5A, 5B by photographing a common mark on the substrate P by first and second substrate cameras 23A, 23B equipped on the units 5A, 5B; a process for photographing and recognizing a mark commonly used for the component mounting by at least both the units 5A, 5B among the marks of the substrate P by the first camera 23A; a process for obtaining the correction data for a part in charge of the first unit 5A among parts mounted to the substrate P based on mark actually measuring position data, and obtaining the correction data in a part in charge of the second unit 5B based on the mark actually measuring position data and the coordinate transformation data; and a process for mounting the component by driving both the unit 5A, 5B while the components are mounted through these processes, respectively, at each substrate to be mounted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component mounting method using a component mounting apparatus that takes out a component from a component supply unit by a head unit for mounting components and mounts the component on a substrate such as a printed circuit board, and the like.

  2. Description of the Related Art Conventionally, a component mounting apparatus is generally known in which a chip-shaped component such as an IC or a transistor is attracted from a component supply unit and mounted on a printed board by a movable component mounting head unit. In this type of component mounting apparatus, in order to ensure mounting accuracy with respect to the board, the head unit is provided with a camera that moves integrally with the head unit, and by recognizing a mark on the board by this camera, the relative relationship between the head unit and the board is achieved. Recognizing such a positional relationship (positional displacement of a mounted part on a substrate) is performed.

Further, in this type of component mounting apparatus, thermal expansion due to sliding friction or the like occurs in the mechanism portion in order to move the head unit at a high speed, resulting in mounting deviation (mounting error) due to head unit movement error. It is possible that this will occur. Accordingly, a component mounting apparatus that detects and corrects the movement error of the head unit due to such thermal expansion has been proposed (for example, Patent Document 1). In this apparatus, a pair of marks fixedly arranged on the apparatus main body using the camera is recognized at regular intervals, and a head accompanying the above-described thermal expansion or the like based on a change in the image interval between these marks. The movement error of the unit is obtained, and correction data corresponding to this error is obtained to drive and control the head unit.
JP-A-8-18289

  In recent years, with this type of component mounting apparatus, it has been required to mount more components on a single board as the density of the board increases. There is also a need to process multi-planar substrates that include a large number of formed areas. For this reason, there are not a few substrates on which a large number of marks are attached, and it is required to capture and recognize a large number of marks with a camera when mounting this type of substrate.

  On the other hand, component mounting devices are required to have higher mounting speeds. In recent years, twin-head devices that individually drive a plurality of head units have been considered. There has been conceived an apparatus that efficiently performs a mounting operation by alternately sucking components from a supply unit and mounting components on a substrate by separate head units. In this type of apparatus, since each head unit has a separate drive mechanism, it is required to perform mark recognition for each head unit to detect head movement errors due to thermal expansion or the like.

  In other words, in such a twin-head type component mounting apparatus, when a multi-sided substrate or the like including a large number of marks is targeted, mark recognition for detecting a head unit movement error is applied to the substrate. As a result, it is necessary to recognize a large number of marks for each head unit, resulting in an increase in mark recognition processing time through the mounting process of a single substrate. For this reason, this is an issue in efficiently implementing the mounting process.

  An object of the present invention is to advance component mounting processing more efficiently and accurately in a component mounting apparatus or the like that individually drives a plurality of head units and mounts components on a substrate.

  In order to solve the above-mentioned problems, the present invention has a plurality of component mounting head units that are individually driven, and each of these head units takes out a component from a component supply unit and mounts it on a substrate. In the component mounting method according to claim 1, wherein one of the head units is a first head unit and the other head unit is a second head unit, and a reference mark for imaging a common reference mark by an imaging means mounted on the head unit. At least both of the correlation data creation step for obtaining correlation data corresponding to the movement error between the first head unit and the second head unit by performing the recognition actual measurement process and the substrate mark attached to the substrate stopped at the predetermined position. A plurality of marks including marks commonly used for component mounting by the head unit The board mark actual measurement position acquisition step of acquiring the actual measurement position data of the mark by performing the process of measuring the board mark recognition imaged by the imaging means of one head unit, and the component by the first head unit of the mounted portion of the board The correction data according to the positional deviation of the part to be mounted is obtained based on the measured position data of the board mark, and the correction data according to the positional deviation of the part to be mounted on which the component is mounted by the second head unit is obtained. Correction data creation step determined based on the actual measurement position data and the correlation data, and a component mounting step of mounting the component on the mounted portion of the substrate by driving the first and second head units based on the correction data And mounting the component through each of the above steps for each substrate to be mounted ( Motomeko 1).

  According to this method, for each mounted substrate, movement errors between the head units based on the reference mark recognition actual measurement process for imaging a common reference mark by the imaging means provided in each head unit, for example, an assembly error of the drive system or in operation Correlation data corresponding to the movement error between the head units due to thermal expansion or the like is obtained. Then, the substrate mark recognition actual measurement process is performed by the imaging means equipped in the first head unit. For the first head unit, the position of the mounted portion of the substrate is determined based on the correction data obtained based on the substrate mark recognition actual measurement process. The component mounting position according to the deviation is corrected with high accuracy. On the other hand, for the second head unit, the board mark recognition actual measurement process for the board mark commonly used in the mounting process of the first head unit is omitted, and the board mark recognition actual measurement process using the imaging means of the first head unit is omitted. Correction data is obtained based on the actually measured position data of the board mark obtained by the above and the correlation data, and the component mounting (mounting) position is corrected based on the positional deviation of the mounted portion of the board based on the correction data. It becomes. That is, a part or all of the substrate mark recognition actual measurement process by the second head unit (all in the case where the reference mark is fixedly arranged on the apparatus base) is omitted, thereby the substrate mark recognition actual measurement process. Is reduced in time. The correction data of the second head unit based on the omitted substrate mark is used for the correlation data obtained (updated) for each substrate and the substrate mark recognition measurement process using the imaging means of the first head unit. By obtaining the correction data based on this, the correction accuracy of the component mounting position by the second head unit is ensured.

  In this method, when the actual moving coordinate system of the first head unit is assumed to be the first coordinate system, the actual moving coordinate system of the second head unit is assumed to be the second coordinate system. In the data creation step, as the correlation data, the measured position of the mark on the first coordinate system obtained by the substrate mark recognition actual measurement process using the imaging means of the first head unit is converted into a position on the second coordinate system. The coordinate conversion data to be obtained is obtained, and in the correction data creation step, the actual position of the substrate mark obtained by the substrate mark recognition actual measurement process using the imaging means of the first head unit is converted based on the coordinate conversion data, and obtained by this conversion. It is preferable to obtain correction data corresponding to the positional deviation of the mounted part where the second head unit mounts the component based on the position of the printed board mark. That (claim 2).

  According to this method, it is possible to more accurately obtain (approximate) the position of the substrate mark omitted in the substrate mark recognition actual measurement process using the imaging device equipped in the second head unit. It is possible to improve the reliability of the correction data relating to the above.

  In this method, when the substrate mark actual position acquisition step is the first mark actual position acquisition step, the first mark actual position acquisition step separately captures an image by the imaging means of the first head unit. A second mark actual position acquisition step of acquiring actual position data of the mark by performing a substrate mark recognition actual measurement process of imaging at least a pair of substrate marks of the plurality of substrate marks by the imaging means of the second head unit; The first and second mark actual position acquisition steps are performed prior to the correlation data generation step, and the at least one pair of substrates acquired in the first and second mark actual position acquisition steps are performed in the correlation data generation step. It is preferable to use the mark as the reference mark and obtain the correlation data based on the measured position of the mark. There (claim 3).

  According to this method, since the substrate mark attached to the substrate is also used as a reference mark, correlation data can be obtained by a rational method.

  In this method, if there is a unique board mark used only for a mounted part on which the second head unit mounts a component among the board marks attached to the board, the unique mark is imaged. Board mark recognition actual measurement processing is performed in the second mark mounting position acquisition step to acquire actual mark actual position data, and in the correction data creation step, the second head unit performs mounting of a part to be mounted. Of these, for the portion using the unique mark, the correction data is obtained based on the measured position data of the unique mark.

  Thus, if the actual position of the unique mark is obtained based on the substrate mark recognition actual measurement process using the imaging means of the second head unit, the reliability of the correction data for the portion using the unique mark is improved, As a result, the mounting accuracy can be increased.

  Even when there is a unique board mark as described above, the measured position data of the unique mark is obtained by performing the board mark recognition actual measurement process for imaging the unique board mark in the first mark mounting position obtaining step. In the correction data creation step, the measurement data of the unique mark obtained in the first mark mounting position obtaining step is the correction data for the portion using the unique mark in the mounted portion where the second head unit mounts the component. You may make it obtain | require based on position data and the said correlation data (Claim 5).

  In this way, it is possible to perform the actual measurement processing of most substrate marks in the first mark mounting position acquisition step.

  On the other hand, the component mounting apparatus according to the present invention includes first and second head units for component mounting that are individually driven, and components that are mounted on a substrate by taking out components from the component supply unit using these head units. In the mounting apparatus, the mark recognition imaging means that is mounted on each of the head units and moves integrally with each head unit, and the reference mark recognition measurement process that images a common reference mark by the imaging means of each head unit. Based on this, the correlation data corresponding to the movement error between the first head unit and the second head unit is created, and the correlation data is updated for each substrate by causing the reference mark recognition actual measurement process to be performed for each mounted substrate. Correlation data creation means and at least one of a plurality of substrate marks attached to the substrate brought into and stopped at a predetermined position Substrate mark actual measurement position for acquiring actual measurement position data of the mark by performing a substrate mark recognition actual measurement process in which a plurality of marks including a mark commonly used for component mounting by both head units are imaged by the imaging means of the first head unit. The correction means according to the positional deviation of the portion on which the component is mounted by the first head unit of the mounting portion of the substrate and the component is obtained based on the measured position data of the substrate mark, and the component by the second head unit Correction data creating means for obtaining correction data corresponding to the positional deviation of the mounted portion on which the mounting is performed based on the measured position data of the substrate mark and the correlation data, and the first and second head units based on the correction data. Drive control means for mounting components on the mounted portion of the board by driving each; In which it comprises (Claim 6).

  According to this apparatus, the component mounting method according to claims 1 to 5 can be effectively implemented.

  In addition, another component mounting method of the present invention includes a plurality of component mounting apparatuses connected in series, and each component mounting apparatus takes out a component from a component supply unit and mounts it on a substrate. A component mounting method in a component mounting system including a head unit, wherein, in a head device of the plurality of units, a mark used in the head device among the board marks attached to a substrate stopped at a predetermined position is imaged The actual measurement position data of the mark is acquired by performing the actual measurement processing of the substrate mark recognition imaged by the means, and the actual measurement position data is transferred to a subsequent device other than the head device, and the substrate is covered based on the actual measurement position data. Correction data corresponding to the positional deviation of the part where the component is mounted by the leading device is obtained from the mounting part, and the head unit is based on the correction data. The component is mounted on the leading device by driving the head, and then, in the subsequent devices other than the leading device, the measured position data is acquired in the leading device among the substrate marks of the substrate stopped at the predetermined position. Substrate mark recognition measurement processing is performed in which a part of the image is picked up by the imaging means, and the head unit and the leading device of the subsequent device are based on the measured position data of the substrate mark and the mounting position data of the leading device corresponding to the data. Correlation data corresponding to the movement error with the head unit is obtained, and based on the measured position data of the substrate mark commonly used in the subsequent apparatus among the measured position data transferred from the head apparatus and the correlation data The correction data corresponding to the positional deviation of the part where the subsequent device mounts the component in the mounted part of the board is obtained. It is obtained to perform the component mounting in the subsequent device by driving the head unit based on the (claim 7).

  According to this method, in the leading device, the correction of the component mounting position according to the positional deviation of the mounted portion of the board is performed by the correction data obtained based on the board mark recognition actual measurement process using the imaging means equipped in the head unit. Performed with high accuracy. On the other hand, a part of the substrate mark recognition actual measurement process is omitted in the succeeding apparatus, and specifically, the substrate mark recognition actual measurement process commonly used in the leading apparatus is omitted. Time required is reduced. Then, the correction data based on the omitted board mark is obtained based on the correlation data and the mounting position data of the board mark acquired by the leading device. Correction accuracy is also ensured.

  On the other hand, a component mounting system according to the present invention includes a plurality of component mounting devices connected in series, and each component mounting device takes out components from a component supply unit and mounts them on a substrate. In a component mounting system including a unit and an image pickup unit that moves integrally with the head unit and picks up a board mark attached to the substrate, the image pickup unit uses the image pickup unit in the head of the plurality of component mounting apparatuses. A transfer means for transferring the measured position data of the substrate mark acquired by performing mark recognition actual measurement processing for imaging the mark to a subsequent device other than the leading device, and each succeeding device has a leading device among the substrate marks. This is performed by performing a substrate mark recognition actual measurement process in which a part of the substrate mark for which the actual measurement position data is acquired is imaged by the imaging means. Based on the measured position data of the board mark and the mounting position data corresponding to the mounting position data included in the transfer data transferred from the head device, according to the movement error between the head unit of the subsequent device and the head unit of the head device Based on the correlation data creation means for obtaining the correlation data, and the correlation data and the measured position data included in the transfer data, according to the positional deviation of the part where the component is mounted by the subsequent device among the mounted parts of the board Correction data creating means for obtaining correction data, and drive control means for mounting components in the succeeding apparatus by driving the head unit based on the correction data (Claim 8). .

  According to this apparatus, the component mounting method according to claim 7 can be effectively performed.

  According to the component mounting method and the component mounting apparatus of the present invention, the correlation data corresponding to the movement error between the first head unit and the second head unit is obtained for each mounted substrate, and the first head unit is assigned to the unit. While correcting the component mounting position in accordance with the positional deviation of the mounted portion of the board by obtaining correction data based on the board mark recognition actual measurement process by the equipped imaging means, the second head unit has the board mark. Since the correction accuracy of the component mounting position is ensured by obtaining the correction data based on the result and the correlation data using the result of the recognition actual measurement process, the total board mark recognition actual measurement process The component mounting process by each head unit is advanced accurately while the component mounting process is efficiently advanced by reducing the time required for Rukoto can.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a component mounting apparatus according to the present invention (a component mounting apparatus in which the component mounting method according to the present invention is used). In these drawings, a substrate transporting conveyor 2 is disposed on a base 1 of a mounting machine, and a printed board P (hereinafter abbreviated as “substrate P”) is transported on the conveyor 2 to perform a predetermined mounting operation. It stops at the position. When necessary in the following description, the direction of the conveyor 2 is described as the X-axis direction, the direction orthogonal to the Y-axis direction on the horizontal plane is described as the Y-axis direction, and the direction orthogonal to the X-axis and Y-axis is described as the Z-axis direction. Do.

  Specifically, the conveyor 2 includes an entrance-side conveyor 2A, a work conveyor 2B, and an exit-side conveyor 2C arranged in the X-axis direction. The substrate P is not shown here with the work conveyor 2B as the mounting work position. The component mounting process proceeds in a state of being clamped by the clamp mechanism.

  Although not shown in detail, the work conveyor 2B is connected to a drive mechanism in the Y-axis direction using the servo motor 18 as a drive source, and in the Y-axis direction while holding the substrate P during component mounting processing. Driven, the components can be mounted at an arbitrary position on the substrate P by moving the head units 5A and 5B described later and the work conveyor 2B.

  On both sides of the conveyor 2 in the Y-axis direction, component supply units 4A and 4B for supplying mounted components are provided. In these component supply units 4A and 4B, multiple rows of tape feeders are arranged in the X-axis direction, and tray feeders (not shown) are arranged. Each tape feeder is detachably equipped with a reel on which a tape containing small chip components such as ICs, transistors, capacitors, etc. is wound, and the tape is intermittently fed from the reel to the component takeout part at the tip of the feeder. The components in the tape are picked up by a mounting head 20 described later while being fed out. In addition, the tray feeder is configured to supply components such as package components in a matrix on the tray.

  Above the base 1, a pair of head units 5A and 5B (referred to as a first unit 5A and a second unit 5B) for mounting components are further provided.

  These head units 5A and 5B are movable in the X-axis direction and the Y-axis direction, respectively, within a certain area, and the movement in the X-axis direction is performed independently, while the movement in the Y-axis direction is performed. It is configured to be performed integrally. That is, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member is disposed on the fixed rail 7. 11 is arranged, and a nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 includes guide members 13A and 13B extending in the X-axis direction on both sides in the Y-axis direction (upper and lower sides in FIG. 1) and a ball screw driven by X-axis servomotors 15A and 15B. The shafts 14A and 14B are respectively disposed, and the head units 5A and 5B are movably mounted on the guide members 13A and 13B, respectively, and the head units 5A and 5B are not provided respectively. Are screwed into the ball screw shafts 14A and 14B, respectively. As the ball screw shaft 8 is rotated by the operation of the Y-axis servo motor 9, the support member 11 moves in the Y-axis direction, and this movement causes the head units 5A and 5B to move integrally in the Y-axis direction. As each ball screw shaft 14A, 14B is rotated by the operation of each X-axis servomotor 15A, 15B, each head unit 5A, 5B moves independently in the X-axis direction with respect to the support member 11. .

  Each of the head units 5A and 5B is mounted with a plurality of mounting heads 20 (hereinafter abbreviated as heads 20) for sucking components and mounting them on the substrate P. In this embodiment, eight head units 5A and 5B are mounted. The heads 20 are mounted in a line in the X axis direction.

  These heads 20 are respectively connected to an elevating mechanism using a Z-axis servomotor 24 (see FIG. 3) as a drive source and a rotating mechanism using an R-axis servomotor 25 (see FIG. 3) as a drive source. The mechanism is individually driven in the vertical direction (Z-axis direction) and around the axis (R-axis direction) with respect to the head units 5A and 5B.

  A nozzle 21 for sucking parts is provided at the tip of each head 20. Each nozzle 21 is connected to a negative pressure supply means via a valve or the like not shown in the figure, and during mounting work, negative pressure is supplied to the nozzle tip as necessary, and the suction of components is performed by this negative pressure. It is like that.

  The head units 5A and 5B are further equipped with substrate recognition cameras 23A and 23B (referred to as a first substrate camera 23A and a second substrate camera 23B) composed of a CCD area sensor or the like. These cameras 23A and 23B image various marks attached to the substrate P arranged at the mounting work position. The cameras 23A and 23B face downward with respect to the head units 5A and 5B, that is, in a state where the imaging direction is downward. Equipped permanently.

  Further, a component recognition camera 17 (referred to as a component camera 17) including a CCD line sensor or the like for imaging the suction component by each head 20 is provided on the base. The component camera 17 is provided in each of the component supply units 4A and 4B. When the head units 5A and 5B pass above the camera 17, the suction component of each head 20 is imaged from the lower side. It is supposed to be.

  FIG. 3 shows the configuration of the controller 30 that processes signals from the cameras 17, 23A, and 23B and controls various driving units.

  In this figure, a controller 30 includes an arithmetic processing unit 31 constituted by a CPU, a mounting program storage unit 32 that stores a mounting program, and a data storage unit 33 that stores various data for board transfer, component mounting, and the like. A motor control unit 34 for controlling the X-axis, Y-axis, Z-axis, and R-axis motors 15A, 15B, 9, 24, 25 for driving the head units 5A, 5B and the head 20, and an external input / output unit 35 An image processing unit 36, a data communication unit 37, and the like.

  The motor control unit 34 adjusts the values of 15A, 15B, 9, 24, 25 based on the signals from the encoders provided in the motors 15A, 15B, 9, 24, 25 and the target values given from the arithmetic processing unit 31. It comes to perform control. The external input / output unit 35 is connected to various sensors 27 such as sensors for detecting the loading / unloading of the substrate P as an input element, and to the clamp driving unit 28 as an output element. In addition to this, a conveyance drive mechanism, a conveyor interval adjustment drive mechanism, and the like, which are not shown, are also connected to the external input / output unit 35.

  The image processing unit 36 is connected to the first substrate camera 23A, the second substrate camera 23B, and the component camera 17, and image signals from these cameras are taken into the image processing unit 36 to perform predetermined image processing. Then, the image data is sent to the arithmetic processing unit 31.

  The arithmetic processing unit 31 performs control of the conveyor 2 and the like for loading and unloading the substrate P, control of the clamp driving unit 28 for clamping operation when loading and unloading the substrate, and the like via the external input / output unit 35. At the same time, control of the head units 5A, 5B and the heads 15A, 15B, 9, 24, 25 is performed via the motor control unit 34 during the mounting operation. Further, as shown in FIG. 4, it functions as a correlation data creation means, a board mark actual position data creation means (corresponding to the board mark actual position data acquisition means according to the present invention), and a correction data creation means. The correction data of the component mounting position corresponding to the positional deviation of the mounting portion is obtained, and the operation of each head unit 5A, 5B is controlled based on the correction data.

  Here, the function as each means of the arithmetic processing unit 31 will be described.

<Measuring method for PCB mark measurement position data>
The arithmetic processing unit 31 uses the substrate cameras 23A and 23B to position each mark (actually measured position data) based on image data obtained by a mark recognition actual measurement process for actually imaging various postscripts attached to the substrate P. Ask for.

<Correlation data creation method>
The arithmetic processing unit 31 images two common reference marks attached to the substrate P using the substrate cameras 23A and 23B, specifically, a substrate fiducial mark M1, which will be described later, and measures the mark M1 using the images. Based on the position data, coordinate conversion data (correlation data according to the present invention) corresponding to a movement error between the first head unit 5A and the second head unit 5B is created. Specifically, by obtaining the coordinate transformation parameters K, θ, ΔX, and ΔY based on the following Equation 1, the coordinate transformation (formula) data of Equation 2, that is, the coordinate system in which the first head unit 5A actually moves is the first. Assuming a coordinate system, and assuming that the coordinate system in which the second head unit 5B actually moves is the second coordinate system, the measured position of the mark on the first coordinate system imaged using the first substrate camera 23A is A coordinate conversion formula for converting to a position on the second coordinate system is created.

here,
K: Scale θ: Rotation angle ΔX: Shift amount in the X-axis direction ΔY: Shift amount in the Y-axis direction Note that (A · X1, A · Y1) and (A · X2, A · X2) are based on mark recognition measurement processing for imaging the two substrate fiducial marks M1 using the first substrate camera 23A, respectively. The obtained actual measurement position (coordinates) of the mark M1, (B · X1, B · Y1) and (X2b, X2b) are used for mark recognition measurement processing for imaging the mark M1 using the second substrate camera 23B. This is an actually measured position (coordinates) of the mark M1 obtained based on the above.

here,
(RA · x, RA · y) is the measured position (coordinates) of the mark obtained from the image data by performing the mark recognition actual measurement process using the first substrate camera 23A, and (VB · x, VB · y) is a value after conversion of the measured position (RA · x, RA · y).

<Correction data creation means>
The arithmetic processing unit 31 is a mark actual position data obtained based on a mark recognition actual measurement process using the first board camera 23A among the marks attached to the board P, and a theoretical position of the mark previously incorporated in the mounting program. Based on the data, the correction data corresponding to the positional deviation of the portion of the mounted portion of the substrate P that is in charge of the first head unit 5A (the portion on which the component is mounted) is obtained.

  In addition, the arithmetic processing unit 31 also obtains correction data corresponding to the positional deviation of a part (part on which component mounting) is performed by the second head unit 5B in the mounted part of the substrate P.

  Here, the arithmetic processing unit 31 first applies correction data for a portion that uses a common mark (that is, a mark that is commonly used in component mounting of both head units 5A and 5B) among the mounted portions to the first substrate. A conversion position of the common mark is obtained based on the actual measurement position data of the mark obtained by the mark recognition measurement process using the camera 23A and the correlation data, and the target position is calculated based on the conversion position data and the theoretical position data of the mark. Correction data corresponding to the positional deviation of the mounting portion is obtained. Further, correction data of a portion using a unique mark (that is, a mark used only for component mounting by the second head unit 5B) in the mounted portion is based on a mark recognition measurement process using the second board camera 23B. Based on the actual measured position data of the mark and the theoretical position data of the mark, correction data corresponding to the positional deviation of the mounted portion is obtained.

  Here, an example of a board P on which a component mounting process is performed by the component mounting apparatus and a mark attached thereto will be described with reference to FIG.

  This figure shows a so-called multi-sided board (hereinafter referred to as a board P unless otherwise necessary). This board P is a board P including a plurality of blocks (four blocks A to D in the illustrated example) on which the same circuit is formed, and after performing the component mounting process using the whole as one board, Each block A to D is used separately. A pair of substrate fiducial marks M1 (referred to as BFID marks M1) for recognizing the substrate position is formed at the corners of the substrate P. Each of the blocks A to D is formed with a pair of local fiducial marks M2 (referred to as LFID marks M2) for recognizing each block position at the corners, and the mounting accuracy is particularly required among the mounted parts. A point fiducial mark (referred to as PFID mark M3) is formed in the vicinity of the portion to be formed.

  Of these marks M1 to M3, the BFID mark M1 and the LFID mark M2 are marks necessary for obtaining the correction data when mounting both the head units 5A and 5B. In the present embodiment, The BFID mark M1 corresponds to the reference mark, and the LFID mark M2 corresponds to the common mark. On the other hand, with respect to the PFID mark M3, depending on which head unit 5A, 5B mounts a component on a mounted part that uses (uses) this mark M3, in this embodiment, the second head unit 5B It shall be in charge of mounting the parts of the part. Accordingly, it is assumed that the PFID mark M3 corresponds to the unique mark.

  Next, an example of the mounting operation control performed by the controller 30 will be described with reference to the flowcharts of FIGS.

  According to FIG. 6, the controller 30 first drives the conveyor 2 to carry the substrate P onto the work conveyor 2 </ b> B as the mounting work position, and after loading, controls the clamp driving unit 28 to clamp the substrate P. Positioning is performed on the work conveyor 2B (step S1). At this time, the work conveyor 2B is arranged at a predetermined reference position aligned in the X-axis direction together with the entrance-side conveyor 2A and the exit-side conveyor 2C.

  Next, the head unit 5A, 5B is sequentially driven in a state where the work conveyor 2B is stopped at the reference position, thereby executing a process for recognizing the mark attached to the substrate P (step S3). This mark recognition process is performed according to the subroutine of FIG. In the following description, for the sake of convenience, the description will be made on the case where the substrate to be mounted is the substrate P shown in FIG.

  Based on FIG. 10, first, the controller 30 determines whether or not the mark recognition processing related to the mounted portion for which the first head unit 5A is in charge (step S10). The head unit 5A is moved onto the substrate P, and the pair of BFID marks M1 on the substrate P are sequentially imaged by the first substrate camera 23A (step S12). Then, based on the theoretical position data and the measured position data of the BFID mark M1, the BFID mark M1 is used in the correction data corresponding to the positional deviation of the substrate P, that is, in the mounted portion in charge of the first head unit 5A. Correction data corresponding to the positional deviation of the part is obtained (step S14). Further, the measured position data of the BFID mark M1 is stored (step S16).

  Next, it is determined whether or not there is another mark to be recognized among the marks related to the mounted portion in charge of the first head unit 5A (step S18). If YES is determined, the first head unit 5A is moved, the mark is sequentially picked up by the first substrate camera 23A, and the first head is based on the theoretical position data and the measured position data of the mark. Correction data corresponding to the positional deviation of the portion using the mark among the mounted portions handled by the unit 5A is obtained (steps S20 and S22). Also, the measured position data of the mark is stored (step S24). Specifically, for example, in the case of the substrate P shown in FIG. 5, the mark recognition actual measurement processing of the LFID mark M2 is performed in the processing of steps S20 and S22, and the actual measurement position data and the theoretical position data of the LFID mark M2 are obtained. The correction data corresponding to the positional deviation of the portion of the mounted portion that uses the LFID mark M2 is obtained.

  On the other hand, if YES is determined in step S10, the second head unit 5B is moved onto the substrate P, the pair of BFID marks M1 are sequentially imaged by the second substrate camera 23B, and the BFID mark M1 Based on the theoretical position data and the measured position data, the correction data corresponding to the position shift of the substrate P, that is, the position shift of the portion using the BFID mark M1 in the mounted portion in charge of the second head unit 5B. Correction data is obtained and further measured position data of the BFID mark M1 is stored (steps S28 to S32).

  Next, it is determined whether or not there is another mark to be recognized among the marks related to the mounted portion that the first head unit 5A is in charge of (step S34). If YES is determined here, the head unit is further included in the mark. It is determined whether or not there is a mark (common mark) that is commonly used in the component mounting process by 5A and 5B (step S36).

  For example, in the case of the substrate P shown in FIG. 5, since the LFID mark M2 corresponds to the common mark as described above, YES is determined here. In this case, the mark recognition actual measurement process for the LFID mark M2 is not performed, and the position of the LFID mark M2 is approximated from existing data.

  That is, the actual position data (data stored in steps S16 and S32) of the BFID mark M1 respectively obtained by the mark recognition actual measurement process by the substrate cameras 23A and 23B is read, and the coordinate conversion data (Equation 2) is read based on these mounting position data. Reference position), and the actual position of the LFID mark M2 (data stored in step S24) obtained based on the mark recognition actual measurement process by the first substrate camera 23A is substituted into the coordinate conversion data. Data conversion values are obtained (steps S42 to S48). Thus, the position of the LFID mark M2 is obtained as an approximate value without actually imaging the LFID mark M2 with the second substrate camera 23B.

  Then, based on the position data obtained in step S48, that is, the converted position data (approximate value) of the LFID mark M2 and the theoretical position data of the LFID mark M2, the LFID mark in the mounted portion in charge of the second head unit 5B. Correction data corresponding to the positional deviation of the portion using M2 is obtained (step S50).

  Next, it is determined whether or not there is another mark to be recognized among the marks related to the mounted portion that the second head unit 5B is in charge of (step S52). If YES is determined here, the process proceeds to step S38. If NO is determined, the process proceeds to step S26.

  On the other hand, if NO is determined in step S36, that is, if there is a mark (only the above-mentioned unique mark) that is used only for the mounted part that the second head unit 5B is in charge of, the second head unit 5B is moved. The second board camera 23B sequentially picks up the mark, and based on the theoretical position data and the measured position data of the mark, the position shift of the portion using the mark among the mounted parts in charge of the second head unit 5B. Corresponding correction data is obtained (steps S38 and S40). Specifically, for example, in the case of the substrate P shown in FIG. 5, since the PFID mark M3 corresponds to the unique mark, the mark recognition actual measurement processing of the PFID mark M3 is performed, and the actual position data and the theoretical position data obtained thereby are determined. Based on the above, the correction data corresponding to the positional deviation of the portion of the mounted portion using the PFID mark M3 is obtained.

  When it is finally determined that the mark recognition process has been completed (YES in step S26), the process according to this flowchart is terminated, and the process proceeds to step S4 in FIG. 6 to execute the component mounting process.

  In the component mounting process, for example, the first head unit 5A is moved above the component supply unit 4A, the components are taken out from the tape feeder or tray feeder by each head 20, and then the first head unit 5A is moved to the component camera. 17, after picking up the picked-up components of each head 20 and examining the picked-up state, the components are mounted while sequentially moving the first head unit 5 </ b> A on a predetermined mounted portion of the substrate P. In this mounting, the first head unit 5A is driven only in the X-axis direction, and the positioning of the head 20 and the mounted portion in the Y-axis direction is performed by driving the work conveyor 2B in the Y-axis direction. At this time, the first head unit 5A and the work are determined based on the correction data obtained by the mark recognition process (correction data obtained in steps S14 and S22 in FIG. 7) and the component suction state obtained by the component recognition of the component camera 17. By driving and controlling the conveyor 2B, the components are mounted with high precision by the first head unit 5A.

  The second head unit 5B is arranged above the component supply unit 4 while the component mounting process by the first head unit 5A is in progress. Accordingly, the component is removed from the component supply unit 4B by the second head unit 5B using the period of the component mounting process by the first head unit 5A, and the component mounting process by the first head unit 5A is completed. As described above, the components are mounted on the predetermined mounting portion of the substrate P while the second head unit 5B is sequentially moved. Also in this case, the second head unit 5B is based on the correction data obtained by the mark recognition process (correction data obtained in steps S30, S40 and S50 in FIG. 7) and the component suction state obtained by the component recognition of the component camera 17. Further, by driving and controlling the work conveyor 2B, the mounting of components by the second head unit 5B is performed with high accuracy.

  Thereafter, the component mounting process is alternately performed on the board P by the head units 5A and 5B. When the mounting of all the parts on the board P is completed, the work conveyor 2B is reset to the reference position and the conveyor 2 is driven. Thus, the substrate P is carried out to the next process (step S5).

  Then, it is determined whether or not there is a substrate P to be mounted next (step S6). If YES is determined here, the process returns to step S1 to carry the next substrate P into the apparatus, and NO. If it is determined, the mounting process of a series of components on the board P is terminated.

  According to the component mounting apparatus (component mounting method) as described above, for the component mounting processing by the first head unit 5A, the mark recognition measurement processing of the substrate P is performed by the first substrate camera 23A equipped in the unit 5A. Since the first head unit 5A and the like are driven and controlled based on the correction data obtained by the mark recognition actual measurement process (correction data obtained in steps S14 and S22 in FIG. 7), the first head unit 5A in the mounted portion of the substrate P is controlled. The component mounting position can be corrected with high accuracy in accordance with the positional deviation of the portion in charge of.

  On the other hand, in the component mounting process by the second head unit 5B, the mark recognition actual measurement process is omitted for the mark (LFID mark M2 in the example of FIG. 5) that is used in common with the mounting process by the first head unit 5A. Then, correction data is obtained using the actual position data acquired by performing the mark recognition actual measurement process by the first substrate camera 23A (steps S42 to S50 in FIG. 7), and the second head unit 5B and the like are driven based on this correction data. I try to control it. Therefore, the time required for the mark recognition actual measurement processing of the substrate P can be reduced.

  Then, a mark for which the mark recognition actual measurement process is omitted is obtained based on the mark recognition actual measurement process in which a common mark (BFID mark M1 in the example of FIG. 5) is imaged by the first and second substrate cameras 23A and 23B. The coordinate conversion (formula) data is used to convert the result of the mark recognition measurement process (mounting position data) by the first board camera 23A using this coordinate conversion data, thereby obtaining the position as an approximate value, and based on this approximate value. Since the correction data is created, reliable data can be created for the correction data based on the mark in which the mark recognition actual measurement process is omitted. In particular, coordinate conversion data is not continuously used as a fixed value, but is obtained (updated) for each mounted substrate, so that the reliability of the finally obtained correction data is higher. Therefore, the correction accuracy of the component mounting position by the second head unit 5B is also ensured satisfactorily. That is, if the component mounting process is continuously performed, the movement error of both the head units 5A and 5B may vary with time due to a change with time of the mechanism portion that drives the head units 5A and 5B, for example, thermal expansion. In such a situation, when the coordinate conversion data is continuously used as a fixed value, the difference between the actually measured position and the conversion data (approximate value) increases, and the reliability of the required correction data decreases with time. It is possible to do. However, in this apparatus, since the coordinate conversion data is updated for each mounted substrate as described above, the movement of the head units 5A and 5B as described above is required when obtaining correction data based on a mark in which the mark recognition actual measurement process is omitted. As a result, the variation of the error is taken into account, and as a result, the reliability of the correction data can be continuously maintained.

  Therefore, according to this component mounting apparatus, the total mark recognition measurement processing time per board can be reduced while the component mounting processing is being advanced using the pair of head units 5A and 5B as described above. The component mounting process can be advanced efficiently, and on the other hand, the component mounting process by each of the head units 5A and 5B can be performed with high accuracy.

  In the embodiment, each of the first head unit 5A and the second head unit 5B is moved by performing a reference mark recognition actual measurement process in which each of the first and second substrate cameras 23A and 23B images a common reference mark. Even if there is a difference between the errors, it is possible to eliminate the influence of the difference and make the mounting position correct. Further, it is not necessary to actually measure the movement error between the first head unit 5A and the second head unit 5B independently of each other.

  By the way, the above-described component mounting apparatus is an example of a preferred embodiment of the component mounting apparatus according to the present invention (the component mounting apparatus in which the component mounting method according to the present invention is used). The mounting method can be changed as appropriate without departing from the gist of the present invention. For example, the following configurations and methods may be adopted.

  (1) In the embodiment, taking the substrate P as shown in FIG. 5 as an example, coordinate conversion (formula) data is obtained based on the mark recognition measurement processing result of the pair of BFID marks M1 among the marks attached to the substrate P. Although this is done (steps S42 and S44 in FIG. 7), of course, this is an example, and coordinate conversion data may be obtained based on other marks. However, in consideration of fluctuations in the amount of movement of the head units 5A and 5B due to the thermal expansion of the mechanism portion, it is desirable to obtain coordinate conversion data based on the BFID mark M1 having the widest spacing among the marks attached to the substrate P.

  (2) In the embodiment, the coordinate conversion (expression) data is obtained as the correlation data according to the movement error between the first head unit 5A and the second head unit 5B as described above. For example, the head unit 5A , 5B, movement errors in the X-axis direction and Y-axis direction may be obtained as correlation data. In this case, since it becomes possible to obtain correlation data based on the mark recognition measurement process of a common mark using both board cameras 23A and 23B, the correlation data can be obtained by a simpler method. In addition, it is possible to shorten the time required for the mark recognition measurement process for obtaining correlation data.

  (3) In the embodiment, coordinate conversion (formula) data is obtained based on recognition measurement processing of a pair of marks attached to the substrate P. For example, a dedicated mark (reference mark) is provided on the base. It may be fixedly installed, and coordinate conversion data may be obtained based on the mark recognition actual measurement processing of the fixed mark. In this case, for each substrate to be processed, before the substrate P is carried into the mounting work position (working conveyor 2B), the mark recognition measurement processing of the fixed mark is performed in advance by both the substrate cameras 23A and 23B. You can do it. In this case, in the mark recognition process (see FIG. 7), for example, the processes in steps S28 to S32 are omitted. In the processes in steps S42 and S44, the coordinate conversion data is based on the result of the mark recognition actual measurement process for the fixed mark. Should be created. Accordingly, in this case, when there is no unique mark, the component mounting process can be advanced without performing any mark recognition actual measurement process for the mark on the board P for the second head unit 5B.

  (4) In the embodiment, when the mark recognition actual measurement processing of the substrate P is performed by the first substrate camera 23A in the mark recognition processing (see FIG. 7) (the processing from step S12 to step S24 in FIG. 7), Only the mark to be used is imaged for the portion of the mounted portion that is in charge of the first head unit 5A, but the portion of the second head unit 5B that is in charge in the mark recognition measurement process by the first substrate camera 23A. It is also possible to perform a recognition measurement process for the unique mark used in the above-described method, and obtain the position (approximate value) of the unique mark based on the measured position data and coordinate conversion data of the unique mark.

By the way, although embodiment described above is an example of the component mounting apparatus equipped with a pair of head unit 5A, 5B, as another example, this invention has several component mounting apparatuses each equipped with the head unit. The present invention can also be applied to a connected component mounting system. That is, as shown in FIG. 8, a plurality of unit devices 50A to 50D having the same configuration are connected in series, and in the component mounting system, the result of the mark recognition measurement process performed by the first unit device 50A (referred to as the first device 50A). May be transferred to and used by subsequent unit devices 50B to 50D (referred to as subsequent devices 50B to 50D), whereby a part of the mark recognition actual measurement processing by the subsequent devices 50B to 50D may be omitted. Hereinafter, specific operation control of each of the devices 50A to 50D in this case will be described by taking as an example the case where the substrate P shown in FIG.
(A) Leading device 50A
After the board P is loaded and positioned at a predetermined mounting work position, a mark used in the head device 50A among the marks M1 to M3 attached to the board P using a board camera equipped in the head unit (this example) Then, mark recognition measurement processing is performed on the BFID mark M1 and the LFID mark M2), and the result is transferred to the subsequent devices 50B to 50D.

Then, correction data corresponding to the positional deviation of the mounted portion is obtained based on the measured position data, and the head unit is driven based on the correction data, so that the component of the mounted portion that the head device 50A is in charge of is corrected. Implement the implementation.
(B) Subsequent device 50B (50C, 50D)
After carrying and positioning the substrate at a predetermined mounting work position, a mark recognition measurement process to be used in the subsequent device 50B among the marks M1 to M3 attached to the substrate P is performed using a substrate camera equipped in the head unit. . At this time, with the exception of the BFID mark M1, the mark recognition actual measurement process is omitted for the mark (LFID mark M2) used in common with the leading device 50A.

  Then, based on the measured position data of the BFID mark M1 and the PFID mark M3 subjected to the mark recognition actual measurement process, correction data corresponding to the positional deviation of the mounted portion using the marks M1 and M3 is obtained.

  Further, based on the measured position data of the BFID mark M1 and the measured position data of the BFID mark M1 included in the transfer data from the head device 50A, the movement error between the head unit of the head device 50A and the head unit of the subsequent device 50B is considered. Corresponding correlation data (for example, coordinate transformation (formula) data similar to that in the above embodiment) is created, and based on the coordinate transformation data and the transfer data from the head device 50A, the position shift of the mounted portion using the LFID mark M2 The correction data corresponding to is obtained.

  Then, by driving the head unit based on each correction data, the component is mounted on the mounted portion in charge of the subsequent device 50B.

  That is, although not particularly illustrated, this component mounting system has a transfer means for transferring the measured position data of the board mark from the head device 50A to the subsequent devices 50B to 50D, and each subsequent device 50B to 50D has a coordinate system. Correlation data creation means for creating correlation data such as conversion data, and correction data creation for obtaining correction data corresponding to the positional deviation of the part mounted by the subsequent devices 50B to 50D among the mounted parts based on the correlation data And drive control means for mounting components by driving the head unit based on the correction data.

  According to such a component mounting system (component mounting method), the mark (LFID mark M2 in this example) that is commonly used in the devices 50A to 50D among the marks M1 to M3 attached to the substrate P Since the mark recognition actual measurement process of the mark is omitted in the subsequent devices 50B to 50D, the total mark recognition actual measurement process time as the component mounting system can be shortened and the component mounting process can be efficiently advanced. Also in this example, for the mark (LFID mark M2) for which the mark recognition actual measurement process is omitted in the subsequent device 50B (˜50D), the common mark (LFID mark M2) on the substrate P by the substrate camera of each device 50A˜50D ( The position is approximated by converting the result (mounting position data) of the mark recognition actual measurement process in the leading device 50A using the coordinate conversion data obtained based on the mark recognition actual measurement process for imaging the BFID mark M1). Since the correction data is generated based on the value, it is possible to generate data with some reliability even for the correction data based on the mark in which the mark recognition actual measurement process is omitted. As a result, in the subsequent devices 50B to 50D The correction accuracy of the component mounting position is also ensured satisfactorily.

1 is a plan view showing an example of a component mounting apparatus according to the present invention (a component mounting apparatus to which a component mounting method according to the present invention is applied). It is a front view which shows a component mounting apparatus. It is a block diagram which shows the controller of a component mounting apparatus. It is a block diagram which shows the function structure of the arithmetic processing part contained in a controller. It is a top view which shows an example of a to-be-mounted board | substrate. It is a flowchart (main routine) which shows an example of component mounting operation control by a controller. It is a flowchart (subroutine) which shows an example of component mounting operation control (mark recognition processing) by a controller. It is a schematic diagram which shows an example of a component mounting system.

Explanation of symbols

5A 1st head unit 5B 2nd head unit 23A 1st board camera 23B 2nd board camera 30 controller 31 arithmetic processing part 32 mounting program storage part 33 data storage part 34 motor control part 35 external input / output part 36 image processing part 37 data Communication part P Printed circuit board

Claims (8)

In a component mounting method in a component mounting apparatus that has a plurality of head units for component mounting that are individually driven, and each of these head units takes out a component from a component supply unit and mounts it on a substrate.
One of the head units is a first head unit, and the other head unit is a second head unit, and a reference mark recognition measurement process is performed for imaging a common reference mark by an imaging unit equipped in the head unit. Correlation data creation step for obtaining correlation data according to the movement error between the first head unit and the second head unit by
A board mark recognition measurement process for imaging a plurality of marks including at least a mark commonly used for component mounting by both head units among the board marks attached to the board stopped at a predetermined position by the imaging means of the first head unit. Board mark actual position acquisition step of acquiring the actual position data of the mark by performing,
Based on the measured position data of the board mark, correction data corresponding to the positional deviation of the part where the part is mounted by the first head unit in the mounted part of the board is obtained, and the part is mounted by the second head unit. A correction data creation step for obtaining correction data according to the positional deviation of the mounted portion based on the measured position data of the board mark and the correlation data;
A component mounting step of mounting a component on the mounted portion of the substrate by driving the first and second head units based on the correction data;
A component mounting method, wherein a component is mounted on each substrate to be mounted through the above-described steps. In the component mounting method according to claim 1,
When the actual moving coordinate system of the first head unit is assumed to be the first coordinate system, while the actual moving coordinate system of the second head unit is assumed to be the second coordinate system,
In the correlation data creating step, as the correlation data, the measured position of the mark on the first coordinate system acquired by the substrate mark recognition actual measurement process using the imaging means of the first head unit is the position on the second coordinate system. Find the coordinate conversion data to convert to
In the correction data creation step, the measured position of the substrate mark obtained by the substrate mark recognition actual measurement process using the imaging means of the first head unit is converted based on the coordinate conversion data, and based on the position of the substrate mark obtained by this conversion. A component mounting method comprising: obtaining correction data corresponding to a positional deviation of a mounted portion where the second head unit mounts a component. In the component mounting method according to claim 2,
When the substrate mark actual position acquisition step is the first mark actual position acquisition step, apart from this, at least of the plurality of substrate marks imaged by the imaging means of the first head unit in the first mark actual position acquisition step A second mark actual position acquisition step of acquiring actual position data of the mark by performing a substrate mark recognition actual measurement process of imaging a pair of substrate marks by the imaging means of the second head unit;
Prior to the correlation data creation step, these first and second mark measured position acquisition steps are performed,
In the correlation data creating step, the correlation data is obtained based on the measured position of the mark using the at least one pair of substrate marks acquired in the first and second mark measured position acquiring step as the reference mark. Component mounting method. In the component mounting method according to claim 3,
Of the board marks attached to the board, board mark recognition actual measurement processing is performed in the second mark mounting position acquisition step for imaging a unique board mark used only for a mounted part on which the second head unit mounts a component. To obtain the measured position data of the unique mark,
In the correction data creation step, the correction data is obtained based on the measured position data of the unique mark for a portion using the unique mark among the mounted parts on which the second head unit mounts components. Component mounting method. In the component mounting method according to claim 3,
Of the board marks attached to the board, board mark recognition actual measurement processing is performed in the first mark mounting position acquisition step for imaging a specific board mark used only for a mounted part on which the second head unit mounts a component. To obtain the measured position data of the unique mark,
In the correction data creation step, the actual position data of the unique mark acquired in the first mark mounting position acquisition step is the correction data for the portion using the unique mark among the mounted parts on which the second head unit mounts components. And the correlation data. In a component mounting apparatus that has first and second head units for component mounting that are individually driven, and takes out components from the component supply unit by these head units and mounts them on a substrate.
An image pickup means for recognizing a mark, which is provided in each of the head units and moves integrally with each head unit;
Correlation data corresponding to a movement error between the first head unit and the second head unit is created based on a reference mark recognition actual measurement process for imaging a common reference mark by the imaging means of each head unit, and the reference mark Correlation data creating means for updating the correlation data for each substrate by performing recognition actual measurement processing for each mounted substrate;
A substrate on which a plurality of marks including a mark used in common for component mounting by both head units are picked up by the image pickup means of the first head unit among a plurality of substrate marks attached to the substrate carried in and stopped at a predetermined position. Board mark actual position acquisition means for acquiring actual position data of the mark by performing mark recognition actual measurement processing;
Based on the measured position data of the board mark, correction data corresponding to the positional deviation of the part where the part is mounted by the first head unit in the mounted part of the board is obtained, and the part is mounted by the second head unit. Correction data creating means for obtaining correction data according to the positional deviation of the mounted portion based on the measured position data of the board mark and the correlation data;
A component mounting apparatus comprising: drive control means for mounting a component on a mounted portion of the substrate by driving the first and second head units based on the correction data. Component mounting method in component mounting system comprising a plurality of component mounting devices connected in series, each component mounting device having a component mounting head unit for taking out components from a component supply unit and mounting them on a substrate Because
In the leading device of the plurality of units, by performing a substrate mark recognition actual measurement process in which the imaging means picks up the mark used by the leading device among the substrate marks attached to the substrate stopped at a predetermined position. Acquire actual measurement position data, transfer this actual measurement position data to subsequent devices other than the head device, and based on this actual position data, position shift of the portion of the board where the component is mounted by the head device The correction data corresponding to is obtained, and the head unit is driven based on the correction data to mount the component in the head device,
Thereafter, in a subsequent device other than the head device, a substrate mark recognition actual measurement process in which a part of the substrate mark whose actual position data is acquired in the head device among the substrate marks of the substrate stopped at a predetermined position is imaged by the imaging means. Based on the measured position data of this board mark and the mounting position data of the leading device corresponding to the data, the correlation data corresponding to the movement error between the head unit of the subsequent device and the head unit of the leading device is obtained, Of the measured position data transferred from the leading device, a part on which the subsequent device mounts a part of the mounted portion of the board based on the measured position data of the board mark commonly used in the subsequent device and the correlation data Correction data corresponding to the positional deviation of the head is obtained, and the head unit is driven based on the correction data. Component mounting method which is characterized in that the parts of the mounting in the connection device. A plurality of component mounting devices connected in series are provided, and each component mounting device takes a component from the component supply unit and mounts it on the board, and moves integrally with the head unit. In a component mounting system provided with an imaging means for imaging a board mark attached to the board,
Transfer that transfers the actual position data of the board mark acquired by performing the mark recognition actual measurement process for imaging the board mark by the imaging means in the leading device among the plurality of component mounting apparatuses, to a subsequent device other than the leading device. Having means,
For each subsequent device,
Of the board marks, the board mark recognition / measurement process is performed in which a part of the board mark for which the measured position data is acquired in the leading device is picked up by the imaging means. Correlation data creating means for obtaining correlation data according to the movement error between the head unit of the succeeding device and the head unit of the leading device, based on the mounting position data corresponding to the mounting position data included in the transfer data.
Based on the correlation data and the measured position data included in the transfer data, correction data creating means for obtaining correction data corresponding to the positional deviation of the part on which the component is mounted by the subsequent device among the mounted parts of the substrate;
A component mounting system comprising drive control means for mounting components in the subsequent device by driving the head unit based on the correction data.

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