JP4769232B2 - Mounting machine and component adsorption device - Google Patents

Description

  The present invention relates to a mounting machine and a component suction device for mounting an electronic component on a printed circuit board.

  2. Description of the Related Art Conventionally, in a mounting machine that mounts electronic components on a printed board, an electronic component supplied to a component supply position is sucked by a suction nozzle of a head, transferred to the printed board, and mounted.

  In such a mounting machine, when the component at the component supply position is picked up by the suction nozzle, the suction nozzle is moved toward the suction target position set in advance, but the component supplied to the component supply position Therefore, a technique for confirming the suction position and correcting the suction position as necessary has been proposed.

  For example, in the mounting position correction method of the mounting machine shown in Patent Document 1, a camera is provided in the head, and the component is first supplied to the component imaging position by a tape feeder that supplies the component, and the camera is moved to the sky above that position. Then, the part is imaged to recognize the part, and the suction target position is corrected based on the recognition result. After that, after moving the component at the component imaging position to the component supply position, the suction nozzle is moved to the corrected suction target position to suck the component.

In addition, the suction position correction method for a mounting machine disclosed in Patent Document 2 recognizes the component storage unit by moving the camera provided in the head to the position above the component at the component supply position, and based on the recognition result, the target suction position To correct. Thereafter, the camera is retracted from the position above the component, and the suction nozzle is moved to the position above the component, and then the suction nozzle is moved to the corrected suction target position to suck the component.
JP 2006-351911 JP 2005-101586 A

  However, the former mounting machine shown in Patent Document 1 requires a lot of time for the operation of moving the component to the component imaging position and the operation of moving the component from the component imaging position to the component supply position during component imaging. In the latter mounting machine shown in Patent Document 2, too much time is required for the operation of moving the camera to the position above the component and the operation of retracting from the position above the component at the time of component imaging. However, there was a problem that the production efficiency was lowered.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a mounting machine and a component suction device that can improve production efficiency.

  The present invention provides the following means.

[1] Component supply means for supplying a component to a component supply position;
A head having a suction nozzle for sucking parts;
An overhead moving means for moving the suction nozzle to an empty position of a preset reference suction target position at the component supply position;
A recognition unit that is provided in the head and recognizes the component at the component supply position after the suction nozzle is moved above the reference suction target position by the sky moving unit;
Based on the information from the recognition means, calculate an appropriate suction position for the suction nozzle component, check the appropriate suction position and the reference suction target position, and correct the reference suction target position as necessary. Suction position confirmation means to perform,
Lowering the suction nozzle above the part and moving it to the suction target position after correction if it is corrected if necessary, or moving it to the reference suction target position if it is not corrected. Adsorbing means,
The recognition means is constituted by a camera that images the part from above,
The camera's imaging direction is tilted with respect to the vertical direction ,
After the suction nozzle starts to descend from the upper position of the reference suction target position, the recognition unit recognizes the component supply position,
A component suction device , wherein when the correction is made as necessary, the suction nozzle moves downward while moving in the horizontal direction .

[2] The component suction device according to [1], wherein an appropriate suction position is set at a center position of the component.

[ 3 ] The component suction device according to item 1 or 2 , wherein a plurality of suction nozzles are provided, and a recognition unit is provided corresponding to each suction nozzle.

[ 4 ] The component suction device according to any one of items 1 to 3 ,
A mounting machine comprising: a component transfer means for moving a suction nozzle that sucks a component to a substrate position and mounting the component on the substrate.

According to the component suction device according to the invention [1], when the component is recognized, the movement operation of the recognition means and the movement operation of the component become unnecessary, the time required for component recognition can be shortened, and the production efficiency can be improved. . Furthermore, it is possible to reliably recognize the parts.
Furthermore, since the lowering operation of the suction nozzle and the recognition operation by the recognition means are performed in parallel, the production efficiency can be further improved.

With the component suction device according to the invention [2], the center position of the component can be suctioned.

According to the component adsorption device according to the invention [3], the production efficiency can be further improved.

According to the mounting machine according to the invention [4], similarly to the above, the time required for component recognition can be shortened and the production efficiency can be improved.
Furthermore, since the lowering operation of the suction nozzle and the recognition operation by the recognition means are performed in parallel, the production efficiency can be further improved.

  FIG. 1 is a plan view showing a mounting machine to which a component suction device according to an embodiment of the present invention is applied. As shown in the figure, this mounting machine is provided on a base 11 and conveys a substrate (printed substrate W), a component supply unit 3 provided on both sides of the conveyor 2, and a conveyor 2. And a head 4 provided above the head.

  The component supply unit 3 is configured such that a plurality of tape feeders 31...

  The component storage tape (reel tape) set in the tape feeder 31 is affixed to a base tape in which electronic components E are stored in cavities (pockets) provided at predetermined intervals, and to the upper surface of the base tape. And top tape.

  This component storage tape is set in the tape feeder 31, and every time the component E is picked up by the head 4, the top tape is gradually peeled off and the base tape of the component storage tape is sequentially fed forward. The cavity portion in which the component E is stored is sequentially sent to the component supply position 30.

  Further, the component E thus sent to the component supply position 30 is picked up by the suction nozzle 42 of the head 4 from the inside of the cavity, as will be described later.

  In the present invention, a tray feeder configured to supply the component E from a component supply container such as a pallet can also be used as the component supply unit 3 in the component supply unit 3.

  The head 4 can move in an area extending between the component supply position and the mounting position on the printed circuit board W so that the component E supplied from the tape feeder 31 to the component supply position 30 can be picked up and mounted on the printed circuit board W. It has become. Specifically, the head 4 is supported by a head support member 142 extending in the X-axis direction (conveying direction of the conveyor 2) so as to be movable in the X-axis direction. The head support member 142 is supported at both ends thereof by guide rails 143 and 143 extending in the Y-axis direction (direction orthogonal to the X-axis in the horizontal plane) so as to be movable in the Y-axis direction. The head 4 is driven in the X-axis direction by the X-axis motor 144 via the ball screw 145, and the head support member 142 is driven in the Y-axis direction by the Y-axis motor 146 via the ball screw 147. It is like that.

  As shown in FIGS. 1 to 4, a plurality of suction nozzles 42 for mounting components are arranged in the head 4 side by side in the X-axis direction.

  Each suction nozzle 42 is driven in a vertical direction (Z-axis direction) by an elevating mechanism using a Z-axis motor as a drive source, and is rotated in a rotation direction (R-axis direction) by a rotation drive mechanism using an R-axis motor as a drive source. To be driven.

  Each suction nozzle 42 is supplied with negative pressure from a negative pressure means (not shown) at the time of component suction, and can suck electronic components by suction force due to the negative pressure.

  As will be described in detail later, in the present embodiment, when a component is sucked by the suction nozzle 42, the suction nozzle 42 is moved to a position above the component supplied to the component supply position 30 by moving the head 4. The suction nozzle 42 is lowered to be close to the suction position of the component, and the suction nozzle 42 sucks the component.

  Further, the head 4 is provided with head side cameras (recognizing means) 43... For suction position correction constituted by CCD cameras or the like corresponding to the respective suction nozzles 42.

  As shown in FIGS. 3 and 4, the head side camera 43 is set so that its optical axis (imaging direction) L is obliquely downward, that is, tilted with respect to the vertical direction. In a state in which 42 is arranged above the component at the component supply position 30, the component at the component supply position 30 can be imaged by the head-side camera 43 corresponding to the suction nozzle 42. Note that the head-side camera 43 can image the component at the component suction position 30 regardless of the operation of the suction nozzle 42, for example, regardless of whether the suction nozzle 42 is lowered toward the component. .

  The head-side camera 43 is not limited to imaging of components, but can also recognize and recognize the position reference mark of the printed circuit board W carried into the mounting machine, the board ID mark, and the like.

  As shown in FIG. 1, a fixed camera 12 is provided upward between each of the conveyor 2 and the component supply units 3 on both sides in the mounting machine. The fixed camera 12 is constituted by a line sensor camera or the like, and can recognize a component sucked by the suction nozzle 42 of the head 4 from the lower side.

  FIG. 5 is a block diagram showing a control system of the mounting machine in the present embodiment. As shown in the figure, the mounting machine of this embodiment includes a control device (controller) 6 composed of a personal computer or the like, and various operations of the mounting machine are controlled by the control device 6.

  The control device 6 includes an arithmetic processing unit 60, a mounting program storage unit 63, a conveyance system data storage unit 64, a motor control unit 65, an external input / output unit 66 and an image processing unit 67.

  The arithmetic processing unit 60 comprehensively manages various operations of the mounting machine.

  The mounting program storage unit 63 stores a mounting program (production program) for mounting each electronic component on the printed circuit board W. This mounting program is based on the mounting position (coordinates) and orientation of each electronic component based on the circuit pattern of the printed circuit board W, and the (coordinates) of the suction position (suction target position) of the component supplied to the component supply position 30 of each tape feeder 31. ) Etc. are included.

  In addition, as will be described later, this mounting program includes a program for confirming and correcting the suction target position for the component when the component supplied to the component supply position 30 is sucked by the suction nozzle 42, A program for moving the suction nozzle 42 to the corrected suction target position is also included.

  The transport system data storage unit 64 stores various data related to transport of the printed circuit board W on the production line.

  The motor control unit 65 controls the operation of the drive motors and the like of the XYZR axes of the head 4 and the suction nozzle 42.

  The external input / output unit 66 inputs / outputs various information to / from various sensors provided in the mounting machine, a stopper for positioning and stopping the printed circuit board W on the conveyor 2, and the like.

  The image processing unit 67 processes image data captured by the component imaging camera 12 and the board imaging camera 43.

  The control device 6 is connected to an input unit 61 such as a keyboard and a mouse for inputting various information.

  Furthermore, a display unit 62 such as a liquid crystal display or a CRT display for displaying various information is connected to the control device 6.

  In the mounting machine having the above configuration, the control device 6 operates in response to an operation start command input via the input unit 61, and the drive of each drive unit is controlled by the control device 6, and the following mounting is performed. Operation is automatic.

  First, the unmounted printed circuit board W is transported to a predetermined mounting position by the conveyor 2. Subsequently, as will be described in detail later, the head 4 moves to the component supply position 30, and the predetermined component E is sucked by each suction nozzle 42 (step S1 in FIG. 6).

  Next, the head 4 moves to the position of the printed circuit board W, and the parts E sucked by the respective suction nozzles 42 are respectively mounted at predetermined positions on the printed circuit board W (step S2).

  If the mounting of all the predetermined components E on the printed circuit board W is not completed (NO in step S3), the above operation is repeated and all the components E are mounted on the printed circuit board W (step S3). YES in S3), the mounting process is completed, and the mounted printed board W is carried out by the conveyor 2, while the next non-mounted printed board W is carried to the mounting position, and the mounting process is performed in the same manner as described above. Is called.

  Next, the suction process (step S1 in FIG. 6) in the mounting process will be described in detail. To suck the component E supplied to the component supply position 30 of the tape feeder 31 by, for example, the first suction nozzle 42, the head 4 moves in the XY axis direction as shown in FIG. 7 (step S11). The first suction nozzle 42 arrives at the upper position (part upper position) of the component supply position 30 (step S12). At the time of moving to the position above the part, the suction nozzle 42 rotates in the R-axis direction and the direction with respect to the part E is adjusted as necessary. The rotation of the suction nozzle 42 in the R-axis direction may be performed after reaching the position above the part and before sucking the part E.

  3 and 4, when the suction nozzle 42 is arranged at the position above the component, the suction nozzle 42 is positioned upward (true) with respect to the suction target position before correction (reference) to be described later (reference). (Above).

  Here, as the hardware in the present embodiment, the head support member 142 that moves the head 4 in the XY-axis direction, the guide rail 143, the X-axis motor 144, the ball screws 145 and 147, the Y-axis motor 146, and other head moving means. The sky moving means is configured, and the sky moving means is configured by a program of the control device 6 that controls the driving of the head moving means and moves the suction nozzle 42 to the above-the-part-over position as software.

  After being arranged at the position above the part, the first suction nozzle 42 starts to descend, and the suction nozzle 42 moves toward the part E at the part supply position 30.

  When the lowering of the suction nozzle 42 is started, the part E at the part supply position 30 is imaged by the head side camera 43 corresponding to the suction nozzle 42 as shown in FIGS.

  Then, the part E is recognized based on the imaging data, and it is determined whether or not there is any abnormality such as whether the part E is actually arranged or the part is not turned over (step S14 in FIG. 7). .

  Specifically, for example, since no components are arranged in the splice portion (joint portion) of the component storage tape set in the tape feeder 31, when the splice portion is fed to the component supply position 30, the component supply position 30 does not actually have any parts. When there is no part, the part cannot be recognized from the image data of the head-side camera 43. Therefore, it can be determined that the part does not exist at the part supply position 30 because the part cannot be recognized.

  Also, in recognized parts, characters, marks, predetermined parts, etc. provided on the upper surface of the part cannot be recognized, or the reference part shape set in advance is collated with the recognized part shape. If they do not match, it can be determined that there is a component abnormality by turning the component over.

  When it is determined that there is a component abnormality in accordance with such a determination criterion (NO in step S14), that is, when there is a high possibility of a suction failure, the lowering of the suction nozzle 42 is stopped, the suction nozzle 42 is raised, and the component is supplied. Return to the sky above position 30.

  On the other hand, the component storage tape of the tape feeder 31 having the component abnormality is fed out by one pitch (one component), and the cavity portion or the like having the component abnormality is forwarded and discarded as it is. The component (cavity part) is supplied to the component supply position 30 (step S15).

  Thereafter, again, the head side camera 43 recognizes the image of the component (step S13), and determines whether there is a component abnormality (step S14).

  If there is no component abnormality (YES in step S14), the suction position is confirmed and corrected as necessary (step S16) as described below.

  When confirming and correcting the suction position First, a part is recognized based on the imaging data of the head-side camera 43, and an appropriate suction position for the part is obtained from the recognition information. For example, when a suction position mark is given to a component, the suction position mark is recognized, and the position (coordinates) of the mark is calculated. When the center position (center of gravity position) of the part is picked up, the external shape of the part, characters, marks, and predetermined parts provided on the upper surface of the part are recognized, and the center of the part is determined from the recognition result. The position (coordinates) is calculated. Note that the suction position of the component is not necessarily limited to the center position, and a position displaced from the center may be set as the suction position.

  On the other hand, a reference suction target position is set in advance in the production program (mounting program) stored in the control device 6, and the reference suction target position is compared with the calculated appropriate suction position. (Confirmation of suction position) When the reference suction target position is displaced from the calculated appropriate suction position, a positional deviation amount (correction value) of the reference suction target position with respect to the appropriate suction position is obtained. The reference suction target position is corrected based on the displacement amount, and a new suction target position after correction is calculated (step S16). Needless to say, there is no positional deviation between the calculated appropriate suction position and the reference suction target position, and no correction is necessary when the two positions match.

  Here, the confirmation and correction of the suction position is automatically performed by the control device 6 in accordance with the suction position confirmation correction program included in the mounting program. Therefore, the control device 6 functions as a suction position confirmation correcting means (suction position confirmation means) for checking and correcting the suction position.

  Thereafter, the suction nozzle 42 descends along the Z-axis direction while the head 4 moves in the XY-axis direction so that the suction nozzle 42 reaches the suction target position. Thus, the suction nozzle 42 comes close to the suction position (suction target position) of the component E arranged at the component supply position 30, and the component E is sucked by the suction nozzle 42 at that position (step S17).

  As the hardware in the present embodiment, a descending suction means is configured by a lifting mechanism for moving the suction nozzle 42 in the Z-axis direction and a negative pressure means for supplying a negative pressure to the suction nozzle 42. The lowering suction means is configured by a program of the control device 6 that lowers the nozzle 42 from the position above the component and moves it to the suction target position and sucks the component E by the suction nozzle 42.

  As described above, after the component E is sucked by the first suction nozzle 42, the component E is sucked by the second, third,...

  After the component suction process is completed in this way, the mounting process (step S2 in FIG. 6) is performed as described above.

  As described above, according to the mounting machine of the present embodiment, the head-side camera 43 for suction component recognition is attached to the head 4 and the suction nozzle 42 is disposed at the position above the component until the component E is sucked. In the meantime, since the part E at the part supply position 30 can be imaged by the head-side camera 43, when the part E is imaged, the camera is moved to the position above the part or the camera is retracted from the position above the part. This eliminates the need to move the component to the component imaging position and then moves the component to the component supply position, thereby shortening the time required for imaging. Therefore, the tact time can be shortened and the production efficiency can be improved.

  In addition, since the lowering operation of the suction nozzle 42 and the imaging operation of the component E by the head side camera 43 are performed in parallel, these operations are further performed as compared with the case where the operations are performed in sequence at different times. The tact time can be shortened and the production efficiency can be further improved.

  In the present embodiment, the part to be actually picked up is recognized by the head-side camera 43 in a state where the part is actually picked up, and the part picking position (suction target position) is confirmed from the recognition result. Since the correction is made, the position and shape of the part to be sucked can be accurately grasped, the sucking position can be obtained with high accuracy, and the picking precision and thus the mounting precision can be improved.

  In the present embodiment, since the suction nozzle 42 is arranged at a position above the component and then the correction in the X and Y axes directions is performed, the head is retracted from the component sky after imaging the component as in the prior art. As compared with the case where the head 4 is moved in the XY direction, the amount of movement of the head 4 in the XY axis direction after position correction (after component imaging) can be reduced, and the position accuracy can be further improved.

  Furthermore, in this embodiment, when there is a supply part abnormality such as a missing part or turnover, the suction operation is resumed after supplying a new part without performing the suction operation on the part. Therefore, it is possible to prevent the adsorption failure. Therefore, it is possible to effectively prevent operation interruption and delay due to poor adsorption, and further improve production efficiency.

  In the above-described embodiment, the mounting machine (component suction device) in which the plurality of suction nozzles 42 are attached in a state where the horizontal movement with respect to the head 4 is prohibited has been described as an example. However, the present invention is not limited thereto. The present invention can also be applied to a component suction device such as a rotary head in which a plurality of suction nozzles 42 are provided so as to be movable in the horizontal direction with respect to the head 4.

  For example, as shown in FIG. 8, the head 4 is provided with a rotary plate 41 having a circular shape in a plan view so as to be rotatable around the axis in the vertical direction (Z-axis direction) with the center as a fulcrum. A plurality of suction nozzles 42 are provided downward at predetermined intervals in the circumferential direction on the outer periphery of the nozzle. Then, by rotating the rotating plate 41, one desired suction nozzle 42 among the plurality of suction nozzles 42 can be selectively disposed at the suction allowable position 411 as shown by hatching in FIG. The parts can be picked up by the suction nozzle 42 arranged at 411. Further, a head-side camera 43 that is not interlocked with the rotation operation of the rotary plate 41 is provided in the vicinity of the suction allowable position 411 in the head 4. In the same manner as in the above-described embodiment, the head-side camera 43 is disposed between the time when the suction nozzle 42 at the suction allowable position 411 is disposed at the upper position (part upper position) of the component supply position 30 and before the component is sucked. The component at the component supply position 30 can be imaged.

  Even when the present invention is applied to a mounting machine (component suction device) having a rotary head 41 capable of selectively using such a plurality of suction nozzles 42, the same operation as in the above embodiment is performed. An effect can be obtained. Further, when the rotary head 41 is employed, the number of head-side cameras 43 can be reduced, and the number of parts can be reduced and the structure can be simplified.

  In the above embodiment, the mounting machine (component suction device) in which a plurality of suction nozzles 42 are provided in the head 4 has been described as an example. However, the present invention is not limited thereto, and in the present invention, the suction nozzle 42 is provided in the head 4. The present invention can also be applied to a single mounting machine (component adsorption device).

  In the above embodiment, the head side camera 43 recognizes the component, and the suction target position is corrected based on the recognition result. However, the present invention is not limited to this, and in the present invention, the head side camera A cavity (pocket) for component storage of the component storage tape may be recognized, and the suction target position may be corrected based on the recognition result. In this case, for example, an appropriate suction position such as the center position of the cavity may be calculated from the planar shape of the cavity, and the suction target position may be confirmed and corrected based on the appropriate suction position.

  Further, in the above embodiment, the suction nozzle 42 is moved to the position above the part and lowered, and the part E is imaged by the head side camera 43. However, the present invention is not limited to this, and in the present invention, the suction nozzle 42 The part 42 may be imaged by the head side camera 43 in a state where the part 42 is stopped at the position above the part, and then the suction nozzle 42 may be lowered.

  Furthermore, when the component E is recognized by the head-side camera 43 with the suction nozzle 42 stopped at the position above the component, the position in the XY axis direction is corrected at the position above the component without lowering the suction nozzle 42, The suction nozzle 42 may be lowered.

  In the above embodiment, each suction nozzle 42 is provided with a head-side camera 43. However, the present invention is not limited to this. In the present invention, one head-side camera is provided for each of two or more suction nozzles 42. 43 may be provided and two or more parts corresponding to two or more suction nozzles may be imaged by one head-side camera 43. In particular, when the head-side camera 43 having a large angle of view is used, all the parts corresponding to all the suction nozzles 42 provided in the head 4 can be imaged by one head-side camera 43.

  Moreover, in the said embodiment, although the case where the tape feeder 31 is used as a component supply means is mentioned as an example, it is not restricted only to that, In the present invention, a tray feeder may be adopted as the component supply means. Alternatively, the tray feeder and the tape feeder 31 may be used in combination. Also in this case, the same effect can be obtained as in the above embodiment.

It is a top view which shows the mounting machine concerning one Embodiment of this invention. It is a perspective view which shows the head arrange | positioned in the component empty position in the mounting machine of embodiment. It is a side view which shows the head arrange | positioned in the mounting position of components in the mounting machine of embodiment. It is a perspective view for demonstrating the component imaging condition by the head side camera in the mounting machine of embodiment. It is a block diagram which shows the control system of the mounting machine of embodiment. It is a flowchart for demonstrating mounting operation | movement in the mounting machine of embodiment. It is a flowchart for demonstrating the component adsorption | suction operation | movement in the mounting machine of embodiment. It is a top view which shows the head employable as a modification of this invention.

Explanation of symbols

30 Component supply position 31 Tape feeder (component supply means)
4 Head 42 Suction nozzle 43 Head side camera (recognition means)
E Component W Printed circuit board

Claims (4)

Component supply means for supplying a component to a component supply position;
A head having a suction nozzle for sucking parts;
An overhead moving means for moving the suction nozzle to an empty position of a preset reference suction target position at the component supply position;
A recognition unit that is provided in the head and recognizes the component at the component supply position after the suction nozzle is moved above the reference suction target position by the sky moving unit;
Based on the information from the recognition means, calculate an appropriate suction position for the suction nozzle component, check the appropriate suction position and the reference suction target position, and correct the reference suction target position as necessary. Suction position confirmation means to perform,
Lowering the suction nozzle above the part and moving it to the suction target position after correction if it is corrected if necessary, or moving it to the reference suction target position if it is not corrected. Adsorbing means,
The recognition means is constituted by a camera that images the part from above,
The camera's imaging direction is tilted with respect to the vertical direction ,
After the suction nozzle starts to descend from the upper position of the reference suction target position, the recognition unit recognizes the component supply position,
A component suction device , wherein when the correction is made as necessary, the suction nozzle moves downward while moving in the horizontal direction .   The component suction device according to claim 1, wherein an appropriate suction position is set at a center position of the component. With the suction nozzle is plurality, component suction device according to claim 1 or 2 recognizing means are provided corresponding to each suction nozzle. The component adsorption device according to any one of claims 1 to 3 ,
A mounting machine comprising: a component transfer means for moving a suction nozzle that sucks a component to a substrate position and mounting the component on the substrate.

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