JP7117507B2 - Component mounting method and component mounting device - Google Patents

Description

The present invention relates to a component mounting method and a component mounting apparatus for picking up a component stored in a component carrier and mounting it on a board.

Before picking up the components stored in the carrier tape, which is a component carrier, with the suction nozzle of the mounting head, the components in the carrier tape are photographed by the camera attached to the mounting head to inspect the directionality of the components (hereinafter referred to as direction inspection). things are known. For example, Patent Literature 1 discloses a component mounting apparatus that performs an inspection of the polarity direction of a component (hereinafter referred to as a polarity inspection), which is a type of direction inspection. The component mounting apparatus described in Patent Document 1 recognizes the external shape of the component from the imaging result of the camera, and also recognizes the polarity mark formed on the upper surface of the component to indicate the directionality of the component, and recognizes the recognized external shape of the component and the polarity mark. The orientation of the part is detected from the positional relationship of

JP 2004-356604 A

However, in the prior art including Patent Document 1, when the difference in brightness between the carrier tape and the component is small, the image captured by the camera attached to the mounting head cannot correctly recognize the outline of the component, and the position of the component is shifted in the carrier tape. There was a problem that the orientation of the parts could not be accurately recognized when the parts were rotating or rotating.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting method and a component mounting apparatus capable of accurately recognizing the orientation of a component.

A component mounting method according to the present invention is a component mounting method for picking up a component stored in a component carrier with a suction nozzle and mounting the component on a substrate, wherein the upper surface of the component stored in the component carrier is imaged by a first camera. recognizing, from an image obtained by the first camera, a first positional relationship indicating a positional relationship between a mark indicating the orientation of the component and a target suction position where the suction nozzle is positioned during picking up, and the target suction position; The suction nozzle is positioned at the position of the vacuum suction to pick up the upper surface of the component, the lower surface of the component held by the suction nozzle is imaged by a second camera, and from the image obtained by the second camera, A second positional relationship indicating a positional relationship between an outer shape of the component and a suction nozzle holding the component is recognized, and the position of the mark with respect to the outer shape is specified based on the first positional relationship and the second positional relationship. Then, the direction of the component held by the suction nozzle is determined, and the component held by the suction nozzle is mounted on the board based on the result of the determination.

A component mounting apparatus according to the present invention includes a mounting head that picks up a component stored in a component carrier with a suction nozzle and mounts it on a substrate, a mounting head moving mechanism that moves the mounting head, the mounting head and the mounting head movement. a mounting control unit that controls a mechanism to pick up the upper surface of the component stored in the component carrier by the suction nozzle by vacuum suction, and mounts the component held by the suction nozzle onto the substrate; a first camera that captures an image of the top surface of the component held by the suction nozzle; a second camera that captures an image of the bottom surface of the component held by the suction nozzle; and a first recognizing unit for recognizing a first positional relationship indicating a positional relationship between the suction target position where the suction nozzle is positioned at the time of picking up, and the outer shape of the part from the image obtained by the second camera. a second recognition unit that recognizes a second positional relationship indicating a positional relationship with a suction nozzle that holds the component; a determination unit that identifies and determines the orientation of the component held by the suction nozzle, wherein the mounting control unit mounts the component held by the suction nozzle on the substrate based on the result of the determination.

According to the present invention, the orientation of parts can be accurately recognized.

1 is a plan view showing the configuration of a component mounting apparatus according to an embodiment of the present invention; FIG. FIG. 1 is an explanatory diagram of the configuration of a mounting head provided in a component mounting apparatus according to an embodiment of the present invention; 1(a) side view and (b) plan view of a directional component mounted on a substrate by a component mounting apparatus according to an embodiment of the present invention. FIG. FIG. 4 is an explanatory diagram of imaging operation of the component pick-up position of the tape feeder by the head camera provided in the component mounting apparatus according to the embodiment of the present invention; Explanatory drawing of the carrier tape pitch-fed by the tape feeder captured by the head camera provided in the component mounting apparatus according to the embodiment of the present invention. FIG. 2 is an explanatory diagram of a component imaging operation by a component recognition camera provided in the component mounting apparatus according to one embodiment of the present invention; 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 3 is a diagram showing an example of a pocket captured image of a directional component supplied by a tape feeder provided in a component mounting apparatus according to an embodiment of the present invention; FIG. 2 is a diagram showing an example of a component recognition image captured by a component recognition camera included in the component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a flowchart of a component mounting method in a component mounting apparatus according to one embodiment of the present invention;

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, etc. described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting apparatus. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. In FIG. 1 and a part described later, the two axial directions perpendicular to each other in the horizontal plane are the X direction of the substrate transfer direction (horizontal direction in FIG. 1) and the Y direction perpendicular to the substrate transfer direction (vertical direction in FIG. 1). is shown. In FIG. 2 and a part described later, the Z direction (vertical direction in FIG. 2) is shown as the height direction orthogonal to the horizontal plane, and the θ direction, which is the direction of rotation about the axis in the Z direction (Z axis), is shown. be The Z direction is the vertical direction when the component mounting apparatus is installed on a horizontal plane.

First, the configuration of the component mounting apparatus 1 will be described with reference to FIGS. In FIG. 1, a substrate transfer mechanism 2 is installed in the X direction at the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 carried in from the upstream side in the X direction, and positions and holds it at a mounting work position by the mounting head described below. Further, the board transfer mechanism 2 carries out the board 3 on which the component mounting work is completed to the downstream side. A component supply unit 4 is installed on each side of the board transfer mechanism 2 .

A plurality of tape feeders 5 are mounted in parallel in the X direction on both component supply units 4 . The tape feeder 5 pitch-feeds the carrier tape in which pockets for storing components are formed in a direction (tape feeding direction) from the outside of the component supply unit 4 toward the board transport mechanism 2, whereby the mounting head picks up the components. Parts are supplied to the parts pick-up position. A tray feeder 7 for supplying a tray 6 holding the components D in an aligned manner to a component pick-up position is attached to one of the component supply units 4 . In this manner, the tape feeder 5 and the tray feeder 7 of the component supply section 4 supply the components D stored in component carriers such as carrier tapes and trays 6 to the component pick-up position.

Here, the structure of the component D will be described with reference to FIGS. 3(a) and 3(b). The component D shown in FIG. 3A has a plurality of terminals to be joined to the electrodes of the substrate 3 on its lower surface Dd. In this specification, a BGA (Ball Grid Array) in which a plurality of bumps B are formed as terminals will be described as an example. In FIG. 3(b), on the upper surface Du of the component D, in addition to the letter L for identifying the component D, marks M such as symbols and codes are formed by printing or the like. The position of the mark M on the component D indicates the orientation of the directional component D, such as a polar component D such as a diode, or a component D such as a transistor or BGA having a direction to be mounted on the substrate 3 .

In FIG. 1, a Y-axis table 8 having a linear drive mechanism is arranged at both ends in the X direction on the upper surface of the base 1a. A beam 9 similarly provided with a linear mechanism is coupled to the Y-axis table 8 so as to be movable in the Y direction. A mounting head 10 is mounted on the beam 9 so as to be movable in the X direction.

In FIG. 2, the mounting head 10 includes a plurality of (here, four) mounting units 10a each having an elevation drive mechanism. At the lower end of each mounting unit 10a, a suction nozzle 10b for holding the component D by vacuum suction is mounted. Each mounting unit 10a raises and lowers the suction nozzle 10b by driving an elevation drive mechanism (arrow a). The mounting head 10 also includes a nozzle rotation mechanism 10c that rotates the suction nozzle 10b in the θ direction (arrow b) about the nozzle axis AN in the Z direction.

In FIG. 1, the Y-axis table 8 and the beam 9 constitute a mounting head moving mechanism 11 for moving the mounting head 10 in horizontal directions (X direction and Y direction). The mounting head moving mechanism 11 and the mounting head 10 pick up the upper surface Du of the component D from the component picking positions of the tape feeder 5 and the tray feeder 7 mounted on the component supply unit 4 by vacuum suction with the suction nozzle 10b, and pick up the substrate. A component mounting operation is performed in which the board 3 held by the transport mechanism 2 is transported to the mounting position and mounted.

In the component mounting operation, the mounting head 10 moves above the component supply unit 4, picks up a predetermined component D with each suction nozzle 10b, moves above the substrate 3, and picks up the component D held by each suction nozzle 10b. to each mounting position, repeating a series of turns. In this manner, the mounting head 10 picks up the component D stored in the component carrier (carrier tape, tray 6) with the suction nozzle 10b and mounts it on the substrate 3. FIG.

In FIG. 1, the beam 9 is equipped with a head camera 12 positioned on the lower surface side of the beam 9 and moving integrally with the mounting head 10 . As the mounting head 10 moves, the head camera 12 moves above the board 3 positioned at the mounting work position of the board transport mechanism 2 and picks up a board mark (not shown) provided on the board 3 . to recognize the position of the substrate 3. Further, the head camera 12 moves above the component supply unit 4 and captures an image of the component D supplied to the component pick-up position from above.

Here, referring to FIGS. 4 and 5, the imaging operation of the component D supplied to the component picking position by the head camera 12 will be described using an example in which the component carrier is the carrier tape 16. FIG. In FIG. 4, a pressing member 5a for guiding the carrier tape 16 from above is installed above the tape feeder 5. As shown in FIG. An opening 5b is formed in the pressing member 5a, and this opening 5b serves as a component pickup position P where the mounting head 10 picks up the component D. As shown in FIG.

FIG. 5 shows a state in which the carrier tape 16 near the component pick-up position P is viewed from above, and the holding member 5a is omitted. A base tape 16a of the carrier tape 16 is formed with recessed pockets 16b for storing components D and feeding holes 16c engaged with sprockets (not shown) for feeding the carrier tape 16 at regular intervals. A cover tape 16d is attached to the upper surface of the pocket 16b in which the component D is stored.

In FIG. 4, the cover tape 16d is peeled off and folded back at the edge 5c of the opening 5b. As a result, the upper side of the pocket 16b on the downstream side (on the right side in FIG. 4) including the component pick-up position P is opened. The head camera 12 moves above the component extraction position P by driving the mounting head moving mechanism 11 (arrow c), and images the component D stored in the pocket 16b at the component extraction position P through the opening 5b. Thus, the head camera 12 is a first camera that images the upper surface Du of the component D housed in the component carrier (carrier tape 16). Hereinafter, the pocket 16b pitch-fed to the component pick-up position P will be referred to as a "target pocket 16e".

In FIG. 1, a component recognition camera 13 and a disposal unit 14 are installed between the component supply unit 4 and the substrate transport mechanism 2 . The component recognition camera 13 takes an image of the component D held by the suction nozzle 10b from below when the mounting head 10 that has taken out the component D from the component supply unit 4 is positioned above the component recognition camera 13 (see FIG. 6). ). Thus, the component recognition camera 13 is a second camera that captures the lower surface Dd of the component D held by the suction nozzle 10b. In the component mounting operation of the component D on the board 3 by the mounting head 10, the mounting position is corrected in consideration of the recognition result of the board 3 by the head camera 12 and the recognition result of the component D by the component recognition camera 13. FIG.

In FIG. 1, among the components D held by the mounting head 10, the components D that are not mounted on the board 3 are disposed of in the disposal unit 14. FIG. A touch panel 15 operated by a worker is installed at a position where the worker works on the front surface of the component mounting apparatus 1 . The touch panel 15 displays various information on its display section, and the operator inputs data and operates the component mounting apparatus 1 using operation buttons displayed on the display section.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. A control unit 20 provided in the component mounting apparatus 1 includes a substrate transport mechanism 2, a component supply unit 4, a mounting head 10, a mounting head moving mechanism 11, a head camera 12 (first camera), a component recognition camera 13 (second camera) and the touch panel 15 are connected. The control unit 20 includes a first recognition unit 21 , a second recognition unit 22 , a determination unit 23 , a mounting control unit 24 , a production data storage unit 25 , a parts information storage unit 26 and a recognition result storage unit 27 .

The component information storage unit 26 is a storage device, and stores the component name, size, presence/absence of directionality of the component D mounted on the substrate 3, and information on the mark M used for direction detection when there is directionality, and the component information. Orientation detection information for detecting the orientation of the part, such as the position of the mark M with respect to the outer shape of D, is stored. The production data storage unit 25 is a storage device, and stores the component name (type), mounting position (XY coordinates), and mounting angle (orientation of the component when mounted) of the component D that is referred to when mounting the component D on the substrate 3. store production data, including

In FIG. 7, the first recognition unit 21 recognizes the position of the mark M by recognizing the pocket recognition image captured by the head camera 12 of the target pocket 16e. The position of the mark M recognized by the first recognition unit 21 is the position of the mark M on the upper surface Du of the component D with the suction target position where the suction nozzle 10b is positioned as the origin. Here, an example of the pocket recognition image 12a and recognition of the position of the mark M will be described with reference to FIG. In the pocket recognition image 12a, the center line 12x in the X direction and the center line 12y in the Y direction are superimposed and displayed. The intersection of the center line 12x in the X direction and the center line 12y in the Y direction is the center 12c of the pocket recognition image 12a and the center of the field of view 12b (see FIG. 5).

In FIG. 8, when acquiring the pocket recognition image 12a, first, when picking up the component D, the head camera 12 is picked up so that the suction target position Cp where the suction nozzle 10b is positioned coincides with the center of the imaging field 12b. Align above position P. As a result, the center 12c of the pocket recognition image 12a coincides with the suction target position Cp. Next, the first recognition unit 21 detects the mark M from the pocket recognition image 12a and specifies the position (Xm, Ym) of the mark M with the center 12c of the pocket recognition image 12a as the origin. The detection of the mark M from the pocket recognition image 12a by the first recognition unit 21 can utilize a known image recognition technique such as pattern matching.

As described above, since the center 12c of the pocket recognition image 12a and the target suction position Cp match, the position (Xm, Ym) of the mark M is the coordinates with the target suction position Cp as the origin, that is, the mark M and the pickup position This is a first positional relationship that indicates the positional relationship between the suction target position Cp where the suction nozzle 10b picks up the component D. FIG. The recognized position (Xm, Ym) of the mark M is stored in the recognition result storage unit 27, which is a storage device. In this way, the first recognition unit 21 recognizes the position of the suction nozzle 10b at the time of pickup and the mark M indicating the direction of the component from the image (pocket recognition image 12a) obtained by the first camera (head camera 12). A first positional relationship (Xm, Ym) indicating the positional relationship with the target suction position Cp is recognized.

In FIG. 7, the second recognition unit 22 performs recognition processing on the image of the lower surface Dd of the component D captured by the component recognition camera 13, and recognizes the position of the component D with respect to the suction nozzle 10b vacuum-sucking the component D. do. Here, an example of the component recognition image 13a of the component D sucked by the suction nozzle 10b imaged by the component recognition camera 13 and recognition of the position of the component D will be described with reference to FIG. In the component recognition image 13a, the center line 13x in the X direction and the center line 13y in the Y direction are superimposed and displayed. The intersection of the center line 13x in the X direction and the center line 13y in the Y direction is the center 13c of the component recognition image 13a.

In FIG. 9, first, the suction nozzle 10b holding the component D moves into the imaging field of the component recognition camera 13 and stops. At this time, the mounting position of the component recognition camera 13 and the stop position of the suction nozzle 10b are adjusted so that the center 13c of the component recognition image 13a and the center Cn of the suction nozzle 10b are aligned. Next, the second recognition unit 22 recognizes the positions of the plurality of bumps B from the component recognition image 13a, and calculates the center of the bump array and the inclination in the horizontal plane from the positions of the plurality of bumps B obtained by recognition. The center and inclination of the bump array are used to calculate a correction value when the component D vacuum-sucked by the suction nozzle 10b is mounted on the substrate 3. FIG.

Furthermore, when the component D is a component D that requires direction inspection, the second recognition unit 22 detects the outer shape De of the component D from the component recognition image 13a. Next, the second recognition unit 22 calculates the position (Xe, Ye) of the center Ce of the outline De of the component D with the center 13c of the component recognition image 13a as the origin and the angle θe of the outline of the component D.

As described above, the center 13c of the component recognition image 13a substantially coincides with the center Cn of the suction nozzle 10b, so the position (Xe, Ye) of the center Ce of the outline De of the component D and the angle θe of the outline of the component D are This is a second positional relationship showing the positional relationship between the outer shape De of the component D and the center Cn of the suction nozzle 10b. The calculated position (Xe, Ye) of the center Ce of the outline De and the angle θe of the outline are stored in the recognition result storage unit 27 .

In this way, the second recognition unit 22 recognizes the outline De of the component D and the center of the suction nozzle 10b holding the component D from the image (component recognition image 13a) obtained by the second camera (component recognition camera 13). A second positional relationship indicating a positional relationship with Cn is recognized. Depending on the type of the component D, the second recognizing unit 22 may detect the position (Xe, Ye) of the center Ce of the outer shape De, the position of the angle θe, the characteristic portion unique to the component, etc. instead of the positions of the plurality of bumps B. , a correction value for mounting the component D on the board 3 is calculated.

In FIG. 7, the determination unit 23 determines whether the orientation of the component D held by the suction nozzle 10b is correct based on the first positional relationship (Xm, Ym) and the second positional relationship (Xe, Ye, θe). Determine whether or not Here, determination of component orientation by the determination unit 23 will be described with reference to the component recognition image 13a in FIG. Since the suction target position Cp of the suction nozzle 10b, which is the origin of the first positional relationship (Xm, Ym), is the target position of the suction nozzle 10b that suctions the component D, the center Cn of the suction nozzle 10b is the origin of the component D. It is held by the suction nozzle 10b while maintaining the first positional relationship (Xm, Ym), and is imaged by the component recognition camera 13. FIG.

Therefore, the first positional relationship (Xm, Ym) can be regarded as coordinates with the center Cn of the suction nozzle 10b as the origin. Further, since the component recognition camera 13 images the component D from the lower surface Dd side in the direction opposite to the head camera 12, the component D in the component recognition image 13a is vertically inverted with respect to the component D in the pocket recognition image 12a. there is That is, the first positional relationship (Xm, Ym) has the origin at the center Cn of the suction nozzle 10b in the component recognition image 13a, and is vertically inverted with respect to the center line 13y in the Y direction.

Both the inverted first positional relationship (Xm, -Ym) and the second positional relationship (Xe, Ye, θe) are coordinates with the center Cn of the suction nozzle 10b as the origin. Therefore, the position of the mark M with respect to the outer shape De of the part D can be specified by calculating the difference between the two. A simple calculation ignoring the angular deviation θe yields the position of the mark M with respect to the outer shape De of the part D (Xm−Xe, −Ym−Ye).

In FIG. 7, the determining unit 23 determines, based on the calculated position of the mark M with respect to the outer shape De of the component D and the position of the mark M with respect to the outer shape De of the component D included in the direction detection information, that the suction nozzle 10b is held. Specify the orientation of the part D to be used. Next, the determination unit 23 refers to the mounting angle for mounting the component D on the substrate 3 stored in the production data storage unit 25, and determines whether or not the orientation of the component D held by the suction nozzle 10b is correct. judge. If the orientation of the component is incorrect, the determination unit 23 calculates the rotation angle for rotating the suction nozzle 10b in the θ direction in order to correct the orientation of the component D to the correct component orientation. In this way, the determination unit 23 specifies the position of the mark M with respect to the outer shape De of the component D from the first positional relationship (Xm, Xm) and the second positional relationship (Xe, Ye, θe), and determines the position of the suction nozzle. The orientation of the part D held by 10b is determined.

In FIG. 7, the mounting control unit 24 controls the mounting head 10 and the mounting head moving mechanism 11 to vacuum-suck the upper surface Du of the component D stored in the component carrier (carrier tape 16, tray 6) by the suction nozzle 10b. to pick up the component D held by the suction nozzle 10b and mount the component D on the board 3. In the case of the component D that is not subject to direction inspection, the mounting control unit 24 mounts the component D held by the suction nozzle 10b on the substrate 3 based on the correction value calculated from the positions of the plurality of bumps B obtained by recognition. Let

In the case of the component D that is the target of the direction inspection, the mounting control unit 24 mounts the component D held by the suction nozzle 10b on the substrate 3 based on the determination result of the component orientation of the component D by the determination unit 23 . More specifically, when the determination unit 23 determines that the orientation of the component is correct, the mounting control unit 24 determines the stop position and angle of the suction nozzle 10b based on the correction value calculated from the positions of the plurality of bumps B. It is mounted on the substrate 3 after correction. Further, when the determination unit 23 determines that the orientation of the component is not correct, the mounting control unit 24 causes the disposal unit 14 to discard the component D held by the suction nozzle 10b, or causes the nozzle rotation included in the mounting head 10 to be discarded. The mechanism 10c rotates the suction nozzle 10b to change the direction of the component to the correct direction, and then attach the component to the substrate 3. - 特許庁

Next, referring to FIG. 10, in the component mounting apparatus 1, a component D stored in a component carrier (carrier tape 16, tray 6) is picked up by a suction nozzle 10b and mounted on the substrate 3 for one turn. will be explained. First, the head camera 12 (first camera) captures an image of the upper surface Du of the component D to be subjected to direction inspection among the components D picked up by the suction nozzle 10b in that turn (ST1). Next, the first recognition unit 21 determines the positional relationship between the mark M indicating the direction of the component and the target suction position Cp where the suction nozzle 10b is positioned during pickup from the image (pocket recognition image 12a) obtained by the head camera 12. (ST2).

Next, the mounting control unit 24 controls the mounting head 10 and the mounting head moving mechanism 11 to position the suction nozzle 10b at the suction target position Cp to vacuum-suck the upper surface Du of the component D, and attach the component to each of the plurality of suction nozzles 10b. D is picked up (ST3). Next, the component recognition camera 13 (second camera) images the lower surface Dd of the component D held by the suction nozzle 10b (ST4).

In FIG. 10, the second recognition unit 22 then recognizes a plurality of bumps B from the image (component recognition image 13a) obtained by the component recognition camera 13, and calculates a correction value when mounting the component D on the board 3. do. Further, when the component D is to be inspected for orientation, the second recognition unit detects the outline De of the component D and the suction nozzle holding the component D from the image obtained by the component recognition camera 13 (component recognition image 13a). A second positional relationship (Xe, Ye, θe) indicating the positional relationship with the center Cn of 10b is recognized (ST5).

Next, the determining unit 23 specifies the position of the mark M with respect to the outer shape De from the first positional relationship and the second positional relationship for the part D to be inspected for orientation, and determines the position of the part D held by the suction nozzle 10b. Check the orientation of the parts. As a result of the orientation check, if it is determined that the orientation of the component is incorrect, the mounting control section 24 causes the disposal section 14 to discard the component D held by the suction nozzle 10b (ST6).

Next, the mounting control unit 24 corrects the stop position and the angle of the suction nozzle 10b based on the correction values obtained by the second recognition unit 22, and corrects the component D that is not subject to the orientation inspection and the component whose orientation is incorrect in the orientation inspection. The component D determined to be correct is mounted on the board 3 (ST7). This completes the component mounting for one turn. Although the correction value is calculated based on the positions of the plurality of bumps B in the present embodiment, the correction value is calculated based on the second positional relationship (Xe, Ye, θe), the positions of characteristic parts unique to the component, and the like. may be used.

As described above, the component mounting apparatus 1 of the present embodiment includes the mounting control section 24 that controls the mounting head 10 and the mounting head moving mechanism 11 to pick up the component D by the suction nozzle 10b and mount it on the board 3. and a first positional relationship indicating the positional relationship between the mark M indicating the component orientation and the suction target position Cp of the suction nozzle 10b from the image obtained by the first camera (head camera 12). A second positional relationship indicating a positional relationship between the external shape De of the component D and the suction nozzle 10b holding the component D is recognized from an image obtained by the recognition unit 21 and the second camera (component recognition camera 13). 2, a determination unit 23 that determines the orientation of the component D held by the suction nozzle 10b by specifying the position of the mark M with respect to the outer shape De from the first positional relationship and the second positional relationship, It has

Then, the mounting control unit 24 mounts the component D held by the suction nozzle 10b on the board 3 based on the determination result of the orientation of the component. As a result, even if the difference in brightness between the component carrier (carrier tape 16, tray 6) and the component D is small and the head camera 12 cannot recognize the outline De of the component D, the orientation of the component can be accurately recognized. be able to.

INDUSTRIAL APPLICABILITY The component mounting method and component mounting apparatus of the present invention have the effect of accurately recognizing the orientation of components, and are useful in the field of mounting components on substrates.

1 component mounting device 3 substrate 6 tray (component carrier)
REFERENCE SIGNS LIST 10 Mounting head 10b Suction nozzle 10c Nozzle rotating mechanism 11 Mounting head moving mechanism 12 Head camera (first camera)
13 component recognition camera (second camera)
14 disposal unit 16 carrier tape (component carrier)
Cn Suction nozzle center Cp Suction target position D Part Dd Bottom surface De Outline Du Top surface M Mark θe Angle

Claims (8)

A component mounting method for picking up a component stored in a component carrier with a suction nozzle and mounting it on a substrate,
imaging the upper surface of the component housed in the component carrier with a first camera;
recognizing from the image obtained by the first camera a first positional relationship indicating the positional relationship between a mark indicating the orientation of the component and a target suction position where the suction nozzle is positioned during pickup;
positioning a suction nozzle at the suction target position to vacuum-suck the upper surface of the component to pick it up;
capturing an image of the lower surface of the component held by the suction nozzle with a second camera;
recognizing a second positional relationship indicating a positional relationship between an outer shape of the part and a suction nozzle holding the part from the image obtained by the second camera;
determining the orientation of the part held by the suction nozzle by specifying the position of the mark with respect to the outer shape from the first positional relationship and the second positional relationship;
A component mounting method, wherein the component held by the suction nozzle is mounted on a board based on the result of the determination. Further, from the image obtained by the second camera, recognizing the positional deviation and the angle indicating the positional relationship between the position of the held part and the suction nozzle holding the part,
2. The component mounting method according to claim 1, wherein, when it is determined that the direction of the component is correct, the stopping position and the angle of the suction nozzle are corrected according to the positional deviation and the angle when mounting the component on the substrate. 3. The component mounting method according to claim 1, wherein the component held by said suction nozzle is discarded when it is determined that the orientation of the component is incorrect. 3. The method of mounting a component according to claim 1, wherein, when it is determined that the orientation of the component is incorrect, the suction nozzle is rotated to correct the orientation of the component before mounting the component on the board. a mounting head that picks up a component stored in a component carrier with a suction nozzle and mounts it on a substrate;
a mounting head moving mechanism for moving the mounting head;
Mounting control for controlling the mounting head and the mounting head moving mechanism to pick up the top surface of the component stored in the component carrier by the suction nozzle by vacuum suction, and mount the component held by the suction nozzle on the substrate. Department and
a first camera that captures an image of the upper surface of the component housed in the component carrier;
a second camera that captures an image of the lower surface of the component held by the suction nozzle;
a first recognition unit that recognizes a first positional relationship indicating a positional relationship between a mark indicating the orientation of the component and a target suction position where the suction nozzle is positioned during pickup from the image obtained by the first camera; ,
a second recognition unit that recognizes a second positional relationship indicating a positional relationship between an outer shape of the component and a suction nozzle that holds the component from an image obtained by the second camera;
a determination unit that determines the orientation of the component held by the suction nozzle by specifying the position of the mark with respect to the outline from the first positional relationship and the second positional relationship;
The component mounting apparatus, wherein the mounting control unit mounts the component held by the suction nozzle on a board based on the result of the determination. Further, the second recognition unit recognizes positional deviation and angle indicating the positional relationship between the position of the held part and the suction nozzle holding the part from the image obtained by the second camera,
wherein, when the determination unit determines that the orientation of the component is correct, the mounting control unit corrects the stop position and the angle of the suction nozzle based on the positional deviation and the angle when mounting the component on the substrate. Item 6. A component mounting device according to Item 5. Furthermore, a discarding unit for discarding the parts held by the suction nozzle is provided,
7. The component mounting according to claim 5, wherein said mounting control unit causes said discarding unit to discard said component held by said suction nozzle when said determining unit determines that the direction of said component is not correct. Device. Furthermore, the mounting head includes a nozzle rotation mechanism that rotates the suction nozzle,
7. When the determination unit determines that the orientation of the component is not correct, the mounting control unit rotates the suction nozzle to correct the orientation of the component, and then mounts the component on the substrate. The component mounting device described in .

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