JP2017139388A - Mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting method and apparatus therefor, for performing mounting after efficient positioning of a position of an emitter of a light-emitting component on a board.SOLUTION: A CPU, in mounting a light-emitting component 75 including an emitter 77 on a board 70, images an imaging range 35 including the emitter 77 of the light-emitting component 75 to acquire a light-emitting component image. The CPU, next, detects coordinates of the center of the emitter 77 (emitter detection center coordinates) on the basis of the light-emitting component image. Then, the CPU, on the basis of the emitter detection center coordinates, holds the light-emitting component 75 and moves the light-emitting component 75 onto the board 70 to mount the light-emitting component 75 so that the center of the emitter 77 is positioned at predetermined coordinates on the board 70. The CPU, on the basis of the emitter detection center coordinates and positional relation between emitter design center coordinates and holding coordinates, derives actual holding coordinates having the same positional relation with respect to the emitter detection center coordinates and holds the light-emitting component 75 at the actual holding coordinates to arrange the held part at mounting coordinates.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a mounting apparatus.

  2. Description of the Related Art Conventionally, a mounting device for mounting a light emitting component including a light emitting body such as an LED on a substrate is known. Also, a mounting apparatus is known that accurately positions the light emission center of a light emitter on a substrate even when the position accuracy of the light emitter in the light emitting component is poor. For example, the bonding apparatus described in Patent Document 1 first captures an image with the light emitting component emitting light, and calculates the relative coordinates between the light emission center and the outer shape reference point of the light emitting component based on the image. Next, this apparatus captures an image in a state where the light emitting component is held by the holding unit, and recognizes the outer shape reference point of the light emitting component based on the captured image. Then, this device calculates the position of the light emission center based on the recognized outline reference point and the calculated relative coordinates, and corrects the bonding position when the positional deviation amount between the position and the bonding position is large. Light emitting components are bonded on the substrate.

JP 2000-150970 A

  As described above, in Patent Document 1, in order to accurately position the light emission center on the substrate, light emission is performed in each of a state where the light emitting component is not held by the holding unit and a state where the light emitting component is held by the holding unit. Imaging of parts was necessary and not always efficient.

  The present invention has been made in view of such problems, and a main object thereof is to efficiently position and mount the position of the light emitter of the light emitting component on the substrate.

  The present invention adopts the following means in order to achieve the main object described above.

The first light emitting component mounting method of the present invention includes:
A method of mounting a light emitting component that mounts a light emitting component having a light emitter on a substrate,
An imaging step of acquiring an image of a light emitting component by imaging an area including at least a part of the light emitter in the light emitting component by an imaging unit;
A light emitter position detecting step for detecting the position of the light emitter based on the light emitting component image;
Based on the position of the light emitter detected in the light emitter position detection step, the component holding means is aligned with the light emitting component so that the component holding means and the light emitter are in a predetermined positional relationship, and the component A component holding step of holding the light emitting component by a holding means;
Based on the predetermined positional relationship, a mounting step of positioning the component holding means holding the light emitting component with respect to the substrate and mounting the light emitting component on the substrate;
Is included.

  According to the first light emitting component mounting method of the present invention, when a light emitting component having a light emitter is mounted on a substrate, a light emitting component image is obtained by imaging an area including at least a part of the light emitter among the light emitting components. . Next, the position of the light emitter is detected based on the light emitting component image. Based on the detected position of the light emitter, the component holding means is aligned with the light emitting component so that the component holding means and the light emitter are in a predetermined positional relationship, and the light emitting component is held. Further, based on a predetermined positional relationship, the component holding means holding the light emitting component is positioned with respect to the substrate, and the light emitting component is mounted on the substrate. Thus, based on the position of the light emitter, the component holding means and the light emitter are aligned so as to have a predetermined positional relationship to hold the light emitting component, and the component holding means is mounted on the substrate in consideration of the positional relationship. By positioning and mounting on the substrate, the light emitter can be accurately positioned on the substrate even if the position of the light emitter in the light emitting component deviates from the design value. Further, since it is not necessary to image the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate. Note that it is only necessary that the light emitting component can be mounted so that a specific portion of the light emitter is arranged at a predetermined coordinate on the substrate, and the predetermined coordinate on the substrate is stored in advance or the predetermined coordinate on the substrate is derived. It is not essential.

The second light emitting component mounting method of the present invention includes:
A light emitting component mounting apparatus method for mounting a light emitting component having a light emitter on a substrate,
An imaging step of acquiring an image of a light emitting component by imaging an area including at least a part of the light emitter in the light emitting component by an imaging unit;
A light emitter position detecting step for detecting the position of the light emitter based on the light emitting component image;
Positioning the component holding means at a predetermined holding position, and holding the light emitting component by the component holding means;
Based on the position of the light emitter detected in the light emitter position detection step and the predetermined holding position, the positional relationship between the holding means and the light emitter in the light emitting component held by the holding means is calculated. Process,
Based on the positional relationship, the mounting step of mounting the light emitting component on the substrate by positioning the component holding means holding the light emitting component at the mounting position on the substrate;
Is included.

  In the second light emitting component mounting method of the present invention, when a light emitting component having a light emitter is mounted on a substrate, a light emitting component image is obtained by imaging a region including at least a part of the light emitter of the light emitting component. . Next, the position of the light emitter is detected based on the light emitting component image. The component holding means is positioned at a predetermined holding position, and the light emitting component is held by the component holding means. At the same time, based on the detected position of the light emitter and the previous holding position, the positional relationship between the holding means and the light emitter in the light emitting component held by the holding means is calculated. Based on the positional relationship, the component holding means holding the light emitting component is positioned at the mounting position on the substrate, and the light emitting component is mounted on the substrate. In this way, the positional relationship between the holding means and the light emitter is calculated based on the detected position and holding position of the light emitter, and the component holding means is positioned based on the positional relationship and the light emitting component is mounted on the substrate. Therefore, even if the position of the light emitter in the light emitting component deviates from the design value, the light emitter can be accurately positioned on the substrate. Further, since it is not necessary to image the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate.

  In the first or second light emitting component mounting method of the present invention, at least a period from when the light emitting component is imaged at least in the imaging step until the light emitting component is held by the holding means in the component holding step. May include a mounting and holding step of holding the light emitting component on a mounting table. In this way, since the light emitting component is held on the mounting table after the light emitting component is imaged until the light emitting component is held by the holding means, the light emitter can be positioned on the substrate more accurately. .

The first mounting apparatus of the present invention is
A mounting device for mounting a light emitting component having a light emitter on a substrate,
Component holding means capable of holding the light emitting component;
Moving means for moving the component holding means;
An imaging unit that captures an area including at least a part of the light emitter in the light emitting component to obtain a light emitting component image;
A light emitter position detecting means for detecting a coordinate position of a specific part of the light emitter based on the light emitting component image;
Holding and mounting control means for controlling the operation of the component holding means and the moving means to control the holding of the light emitting components and the mounting on the substrate;
With
When the component holding means holds the light emitting component, the holding and mounting control means determines whether the component holding means and the light emitter are based on the position of the light emitter detected by the light emitter position detecting means. When the component holding means is aligned with the light emitting component so as to be in a positional relationship, and the light emitting component held by the component holding means is mounted on the substrate, the component holding means is based on the predetermined positional relationship. Is positioned with respect to the substrate.

  In the first mounting apparatus of the present invention, when a light emitting component having a light emitter is mounted on a substrate, a region including at least a part of the light emitter is imaged to obtain a light emitting component image. Next, the position of the light emitter is detected based on the light emitting component image. Then, when the component holding means holds the light emitting component, the component holding means is positioned on the light emitting component based on the detected position of the light emitting body so that the component holding means and the light emitting body have a predetermined positional relationship. Further, when the light emitting component held by the component holding means is mounted on the substrate, the component holding means holding the light emitting component is positioned with respect to the substrate based on a predetermined positional relationship. Thus, based on the position of the light emitter, the component holding means and the light emitter are aligned so as to have a predetermined positional relationship to hold the light emitting component, and the component holding means is mounted on the substrate in consideration of the positional relationship. By positioning and mounting on the substrate, the light emitter can be accurately positioned on the substrate even if the position of the light emitter in the light emitting component deviates from the design value. Further, since it is not necessary to image the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate.

The second mounting apparatus of the present invention is
A mounting device for mounting a light emitting component having a light emitter on a substrate,
Component holding means capable of holding the light emitting component;
Moving means for moving the component holding means;
Imaging means for capturing a light-emitting component image by capturing an area including at least a part of the light-emitting body in the light-emitting component;
A light emitter position detecting means for detecting the position of the light emitter based on the light emitting component image;
Holding and mounting control means for controlling the operation of the component holding means and the moving means to control the holding of the light emitting components and the mounting on the substrate;
With
When the component holding means holds the light emitting component, the holding and mounting control means aligns the component holding means at a predetermined holding position, and places the light emitting component held by the component holding means on the substrate. When mounting, the light-emitting component is calculated based on the positional relationship between the holding means and the light-emitting body in the light-emitting component held by the holding means, which is calculated from the position of the light-emitting body and the predetermined holding position. The held component holding means is positioned at a mounting position on the substrate, and the light emitting component is mounted on the substrate.

  In the second mounting apparatus of the present invention, when a light emitting component having a light emitter is mounted on a substrate, a region including at least a part of the light emitter is imaged to obtain a light emitting component image. Next, the position of the light emitter is detected based on the light emitting component image. When the component holding means holds the light emitting component, the component holding means is positioned at a predetermined holding position. When mounting the light emitting component held by the component holding means on the substrate, the light emitting component is mounted based on the positional relationship between the holding means and the light emitter calculated from the position of the light emitter and the predetermined holding position. The held component holding means is positioned at the mounting position on the substrate, and the light emitting component is mounted on the substrate. As described above, the component holding means is positioned based on the positional relationship between the holding means and the light emitter calculated from the detected position and holding position of the light emitting body, and the light emitting component is mounted on the substrate. Even if the position of the light emitter is deviated from the design value, the light emitter can be accurately positioned on the substrate. Further, since it is not necessary to image the light emitting component while the light emitting component is held by the holding means, the light emitting component can be efficiently positioned and mounted on the substrate.

  In the first or second mounting apparatus of the present invention, the mounting device is further provided on the mounting table on which the light emitting component is mounted when the light emitting component is imaged by the imaging unit, and at least by the imaging unit. Between the time when the light emitting component is imaged and the time when the light emitting component is held by the holding unit, there may be provided mounting holding means for holding the light emitting component on the mounting table. In this way, since the light emitting component is held on the mounting table after the light emitting component is imaged until the light emitting component is held by the holding means, the light emitter can be positioned on the substrate more accurately. .

1 is a schematic explanatory diagram of a mounting system 10. FIG. The flowchart which shows an example of a mounting process routine. 6 is an explanatory diagram of mounting information 67 stored in the HDD 64. FIG. Explanatory drawing which shows the various coordinates at the time of mounting the light emitting component 75 on the board | substrate 70. FIG. The flowchart which shows an example of the mounting process routine of a modification. Explanatory drawing which shows the various coordinates at the time of mounting the light emitting component 75 on the board | substrate 70. FIG. The schematic explanatory drawing of the mounting system 10 of a modification. Explanatory drawing at the time of imaging the light emitting component 75 on the mounting base 90. FIG.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of the mounting system 10. The mounting system 10 of the present embodiment includes a mounting device 11 that mounts components including a light emitting component 75 described later on the substrate 70, and a mounting management computer 80 that manages and sets information related to the mounting processing. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG. In addition, the mounting process includes a process of placing, placing, mounting, inserting, joining, and bonding components on a substrate.

  As shown in FIG. 1, the mounting apparatus 11 includes a transport unit 18 that transports a substrate, a sampling unit 21 that performs a mounting process of sampling components and placing them on the substrate 70, and a mounting unit 11 that is disposed in the sampling unit 21. A mark camera 34 that images a reference mark, a reel unit 56 that feeds a component from a reel 57, a parts camera 54 that images a component, and a control device 60 that controls the entire apparatus such as the sampling unit 21 and the mark camera 34 are provided. Yes.

  The transport unit 18 includes support plates 20 and 20 that are provided at intervals in the front and rear direction in FIG. 1 and extend in the left-right direction, and conveyor belts 22 and 22 that are provided on the surfaces of the support plates 20 and 20 that face each other. ing. The conveyor belts 22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. The substrate 70 is placed on the upper surfaces of the pair of conveyor belts 22 and 22 and is conveyed from left to right. The substrate 70 is supported from the back side thereof by a large number of support pins 23 erected.

  The sampling unit 21 includes a mounting head 24, an X-axis slider 26, a Y-axis slider 30, and the like. The mounting head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed inside the mounting apparatus 11. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The mounting head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each slider 26 and 30 is driven by a drive motor (not shown).

  The mounting head 24 includes a nozzle 40 that picks up and collects components, and a nozzle holder 42 that can be attached and detached with one or more nozzles 40. In the present embodiment, the nozzle holder 42 includes 12 nozzle holders, and 12 nozzles 40 can be attached thereto. The nozzle holder 42 is held by the mounting head 24 in a rotatable state. The nozzle 40 uses pressure to adsorb components at the nozzle tip or release components adsorbed at the nozzle tip. The nozzle 40 is moved up and down in a Z-axis direction (vertical direction) orthogonal to the X-axis and Y-axis directions by a holder lifting device using a Z-axis motor 45 as a drive source. The mounting head 24 sucks and holds the component by the nozzle 40, but is not particularly limited as long as the component can be held. For example, the mounting head 24 may include a mechanical chuck that holds and holds components.

  The mark camera 34 is a device that images the substrate 70 from above, and is disposed on the lower surface of the X-axis slider 26. The mark camera 34 is a camera for reading a reference mark attached to the substrate 70, which is an imaging region below and indicates a reference position of the substrate 70, a reference position where components are arranged, and the like. The mark camera 34 moves in the XY direction as the mounting head 24 moves.

  The reel unit 56 includes a plurality of reels 57 around which a tape storing components is wound, and is detachably attached to the front side of the mounting apparatus 11. The tape is unwound from the reel 57 and sent out by the feeder unit 58 to a collection position where the tape is collected by the mounting head 24. A plurality of feeders 58 are provided corresponding to the number of reels 57 that can be attached to and detached from the mounting apparatus 11.

  The parts camera 54 is disposed in front of the support plate 20 on the front side of the transport unit 18. The imaging range of the parts camera 54 is above the parts camera 54. When the nozzle 40 that sucks a component passes above the part camera 54, the parts camera 54 images the state of the component sucked by the nozzle 40 and outputs the image to the control device 60.

  As shown in FIG. 1, the control device 60 is configured as a microprocessor centered on a CPU 61, and includes a ROM 62 that stores a processing program, a RAM 63 that is used as a work area, an HDD 64 that is a storage unit that stores various data, An input / output interface 65 for exchanging electrical signals with an external device is provided, and these are connected via a bus 66. The control device 60 is connected to the transport unit 18, the sampling unit 21, the mark camera 34, the parts camera 54, the reel unit 56, and the like so as to be capable of bidirectional communication, and receives image signals from the mark camera 34 and the parts camera 54. To do. Each slider 26 and 30 is equipped with a position sensor (not shown), and the control device 60 controls the drive motor of each slider 26 and 30 while inputting position information from these position sensors.

  The management computer 80 is a PC that manages information related to the mounting process, and includes an input device 87 such as a mouse and a keyboard, a display 88, and the like. In the HDD (not shown) of the management computer 80, production job data including mounting information 67 described later is stored in the HDD (not shown). In addition to the mounting information 67, the production job data includes information on how many boards 70 on which components are mounted, and information such as the position of the reference mark on the board 70.

  Next, the operation of the mounting system 10 according to the present embodiment configured as described above, in particular, mounting processing in which the mounting apparatus 11 mounts various components on the board 70 will be described. FIG. 2 is a flowchart showing an example of a mounting process routine executed by the CPU 61 of the control device 60. This routine is stored in the HDD 64 of the mounting apparatus 11 and executed according to a start instruction from the worker. When this routine is executed, the CPU 61 of the control device 60 acquires production job data including the mounting information 67 from the management computer 80 and stores it in the HDD 64 (step S100). The CPU 61 may receive the production job data from the management computer 80 in advance and store it in the HDD 64.

  FIG. 3 is an explanatory diagram of the mounting information 67 stored in the HDD 64. As shown in the figure, the mounting information 67 includes information associating the mounting order of components to be mounted on the substrate 70, the component type, mounting coordinates, holding coordinates, and the like. The mounting coordinates are coordinates (XY coordinates) representing the position on the board 70 where the component is placed. The holding coordinates are coordinates (XY coordinates) representing a position where the component is sucked and held. In the present embodiment, the holding coordinates are determined in advance as the coordinates of the center of the component (the center in the XY direction).

  Here, the components determined to be mounted by the mounting information 67 include a light emitting component 75. In the present embodiment, it is assumed that the component A shown in FIG. FIG. 4 is an explanatory diagram showing various coordinates when the light emitting component 75 is mounted on the substrate 70. As shown in the lower part of FIG. 4, the light emitting component 75 includes a support substrate 76 and a light emitter 77 such as an LED attached on the support substrate 76. As shown in the lower part of FIG. 4, the center position of the light emitting component 75, that is, the center position (component center coordinates) of the support substrate 76 is the coordinates (C1, D1). In the light emitting component 75, the design position of the light emitter 77 in the light emitting component 75 is determined in advance. As shown in the lower part of FIG. 4, when the light emitter 77 is attached to the design position (when the light emitter 77 is at the position of the broken line), the center position (light emitter design center coordinates) of the light emitter 77 is a coordinate ( A1, B1). The holding coordinates (C1, D1) are shifted from the light emitter design center coordinates (A1, B1) by a coordinate r in the left direction and a coordinate s in the forward direction. That is, holding coordinates (C1, D1) = coordinates (A1-r, B1-s). In other words, the relative position of the holding coordinates with respect to the light emitter design center coordinates is the coordinates (−r, −s). As shown in FIG. 3, the mounting information 67 includes coordinates (C1, D1) as holding coordinates corresponding to the component A (light emitting component 75). Further, the mounting information 67 includes coordinates (A1, B1) as light emitter design center coordinates corresponding to the component A (light emitting component 75). As described above, the mounting information 67 includes the positional relationship between the light emitter design center coordinate that is the center of the light emitter 77 and the holding coordinates at which the mounting head 24 holds the light emitting component 75. The holding coordinates and the light emitter design center coordinates are values determined for each type of the light emitting component 75. Therefore, as shown in FIG. 3, the holding coordinates and the light emitter design center coordinates corresponding to the part A have the same values in the mounting order 1 and the mounting order 2. Further, in the mounting information 67, the values of the light emitter design center coordinates are not associated with components other than the light emitting component 75 (components B to G, etc.).

  In the present embodiment, the mounting coordinates are coordinates with the reference mark of the substrate 70 as the origin. Further, the holding coordinates and the light emitter design center coordinates are coordinates having a reference position stored in advance in the HDD 64 corresponding to each of the plurality of feeder units 58 as an origin. Further, the holding coordinates and the light emitter design center coordinates are the parts that are unwound from the reel 57 and collected next on the mounting head 24 among the parts stored on the tape of the reel 57 (the sampling position by the feeder unit 58). The coordinates of the parts sent to the

  When production job data including such mounting information 67 is stored, the CPU 61 transports the substrate 70 (step S110). In this processing, the CPU 61 transports the substrate 70 by the conveyor belt 22 of the transport unit 18 and fixes the substrate 70 at a predetermined mounting position where processing for placing components is performed. Next, the CPU 61 performs a process of detecting the position of the reference mark on the substrate 70 (step S120). In this process, the CPU 61 moves the mark camera 34 to the position of the board mark based on the production job data by the sliders 26 and 30. Next, the CPU 61 causes the mark camera 34 to image the substrate mark. Then, the CPU 61 detects the position (XY coordinate) of the reference mark based on the captured image and stores it in the RAM 63. The CPU 61 grasps coordinates (for example, mounting coordinates) on the substrate 70 in the subsequent processing using the detected coordinates of the reference mark as the origin.

  Subsequently, the CPU 61 determines one non-arranged component to be picked up according to the mounting order of the mounting information 67 (step S140). Then, the CPU 61 determines whether or not the suction target is the light emitting component 75 (step S150). The CPU 61 makes this determination based on, for example, the component type to be picked up in the mounting information 67. The CPU 61 may make this determination based on whether or not the light emitting body design center coordinates are associated with the component to be picked up in the mounting information 67.

  When the suction target is the light emitting component 75 in step S150, the CPU 61 causes the mark camera 34 to capture the light emitting body 77 of the light emitting component 75 to acquire a light emitting component image (step S160). In this process, the CPU 61 first acquires the light emitter design center coordinates to be attracted determined by the mounting information 67 from the HDD 64. Then, the CPU 61 moves the mark camera 34 so that the center of the imaging range 35 (see the lower part of FIG. 4) of the mark camera 34 is located at the light emitter design center coordinates corresponding to the feeder unit 58 that sends out the suction target. Then, the CPU 61 acquires a light emitting component image by the mark camera 34. As shown in FIG. 4, the field of view of the mark camera 34, that is, the imaging range 35 is determined in advance so that the entire light emitter 77 can be imaged. Further, the imaging range 35 is empirically determined in advance so that the entire light emitter 77 can be imaged even if the position of the light emitter 77 in the light emitting component 75 is deviated from the design value. In the present embodiment, the imaging range 35 can capture the entire light-emitting body 77 and the outer portion of the light-emitting component 75 (for example, the front, back, left, or right end or corner of the support substrate 76) as one image. It was not so large.

  Subsequently, the CPU 61 detects the actual position of the light emitter 77 based on the acquired light emitting component image. That is, the coordinates of the center of the light emitter 77 (light emitter detection center coordinates) are detected (step S170). In this process, the CPU 61 first compares the light emitting component image with a comparative image obtained by capturing the light emitting component 75 around the light emitter 77 in advance. Then, the CPU 61 detects the region of the light emitter 77 in the light emitting component image based on the comparison result, and detects the light emitter detection center coordinates based on the center position of the detected region. Thereby, for example, when the position of the light emitter 77 in the light emitting component 75 is as designed, the CPU 61 detects the same coordinates as the light emitter design center coordinates (A1, B1) as the light emitter detection coordinates. On the other hand, when the position of the light emitter 77 in the light emitting component 75 is shifted from the design value by a coordinate a in the left direction and a coordinate b in the forward direction as shown in the lower part of FIG. 4, the CPU 61 determines the coordinates (A2, B2). = Coordinates (A1-a, B1-b) are detected as light emitter detection coordinates. Note that the comparison image may be included in the production job data or may be stored in advance in the HDD 64. Further, the reference information for detecting the light emitter detection center coordinates based on the light emitting component image is sufficient as long as the comparison image is not used. For example, a threshold value for identifying a color difference between the pixel of the light emitter 77 and the pixel of the support substrate 76 in the light emitting component image may be included in the production job data as reference information.

  Next, the CPU 61 derives actual holding coordinates that are positions where the light emitting component 75 should actually be picked up based on the detected light emitting body detection center coordinates and the holding coordinates and the light emitting body design center coordinates included in the mounting information 67. (Step S180). In this process, the CPU 61 first derives a deviation amount (difference between both coordinates) in the XY directions from the light emitter design center coordinates to the light emitter detection center coordinates. Next, the CPU 61 derives coordinates that are shifted from the held coordinates by a deviation amount as actual held coordinates. For example, when the position of the light emitter 77 in the light emitting component 75 is as designed, the light emitter design center coordinates and the light emitter detection center coordinates are the same, and the deviation amount is (0, 0). For this reason, the CPU 61 derives the same coordinates as the holding coordinates included in the mounting information 67 as the actual holding coordinates. On the other hand, when the position of the light emitter 77 in the light emitting component 75 deviates from the design value as shown in the lower part of FIG. 4, the light emitter detection center coordinates (A2, B2) are changed from the light emitter design center coordinates (A1, B1). ) Is (−a, −b). Therefore, the CPU 61 actually holds coordinates (C2, D2) = coordinates (C1-a, D1-b) that are shifted from the holding coordinates (C1, D1) included in the mounting information 67 by a shift amount (−a, −b). Derived as coordinates. As can be seen from FIG. 4, the actual holding coordinates (C2, D2) are coordinates (A2-r, B2) that are shifted from the luminous body detection center coordinates (A2, B2) by a coordinate r in the left direction and a coordinate s forward. -S). Accordingly, as can be seen from FIG. 4, the positional relationship between the light emitter detection center coordinates (A2, B2) and the actual holding coordinates (C2, D2) when the position of the light emitter 77 deviates from the design value is the light emission. This is the same as the positional relationship between the light emitter design center coordinates (A1, B1) and the holding coordinates (C1, D1) when the position of the body 77 is as designed. That is, the positional relationship between the light emitter detection center coordinates (A2, B2) and the actual holding coordinates (C2, D2) is from the light emitter design center coordinates (A1, B1) to the light emitter detection center coordinates (A2, B2). It is not affected by the amount of deviation (-a, -b). In this way, the CPU 61 derives the actual holding coordinates so that the positional relationship between the light emitter detection center coordinates and the actual holding coordinates is always the same regardless of the amount of deviation of the position of the light emitter 77 from the design value. Yes. Then, the CPU 61 aligns the nozzle 40 so that the nozzle 40 and the light emitter 77 have a predetermined positional relationship, and causes the nozzle 40 to hold the light emitting component 75. That is, the CPU 61 moves the mounting head 24 so that the center position of the nozzle 40 is located at the actual holding coordinates, and sucks and holds the light emitting component 75 at the actual holding coordinates (step S190). In this way, when the light emitting component 75 is held by the mounting head 24, the CPU 61 does not hold the coordinates specified by the mounting information 67 but holds the actual holding coordinates derived based on the light emitter detection center coordinates. On the other hand, when the suction target is not the light emitting component 75 in step S150, the CPU 61 moves the mounting head 24 so that the center of the nozzle 40 is positioned at the holding coordinates specified by the mounting information 67, and selects the suction target component. Suck and hold at the holding coordinates (step S200).

  When the suction target is sucked in step S190 or step S200, the CPU 61 determines whether or not the number of components sucked by the mounting head 24 is less than the number of nozzles 40 (12) of the nozzle holder 42 (step S210). . In step S210, when the number of parts picked up is less than the number of nozzles 40 of the nozzle holder 42, the CPU 61 performs the processing after step S140. That is, the CPU 61 sequentially sets the suction target. If the suction target is the light-emitting component 75, the CPU 61 sucks the component with the actual holding coordinates. If the suction target is a component other than the light-emitting component 75, the CPU 61 Adsorbed by holding coordinates by 40. In step S210, when the number of sucked parts is not less than the number of nozzles 40 of the nozzle holder 42, that is, when all the 12 nozzles 40 of the nozzle holder 42 suck and hold the parts, the CPU 61 The holding state of the component held by the nozzle 40 is acquired (step S220). In this process, the CPU 61 moves the mounting head 24 to the upper part of the parts camera 54 and acquires an image captured by the parts camera 54. The CPU 61 analyzes this image and determines the presence / absence of an abnormality related to a component abnormality, a posture such as a tilt of the component, and a holding position shift. In addition, the CPU 61 discards the part having an abnormality. In the present embodiment, the CPU 61 omits the determination of whether there is an abnormality in the light emitting component 75. Further, when all the components held by the nozzle 40 of the nozzle holder 42 are the light emitting components 75, the CPU 61 does not perform imaging by the parts camera 54, and omits the processing of step S220 itself. However, the CPU 61 may not omit these, or may omit a specific type of light-emitting component among the light-emitting components 75.

  Next, the CPU 61 places (mounts) the components held by the mounting head 24 at the mounting coordinates on the substrate 70 (step S230). In this process, the CPU 61 moves the mounting head 24 so that the center position of the nozzle 40 holding the component is positioned at the mounting coordinates, and lowers the component by the Z-axis motor 45 to place the component at the mounting coordinates. To do. That is, the CPU 61 moves the component and arranges it on the board 70 so that the part holding the component is arranged at the mounting coordinates. The CPU 61 sequentially arranges a plurality of components held by the mounting head 24 at mounting coordinates according to the mounting order of the mounting information 67.

  Here, a case where the light emitting component 75 is arranged at the mounting coordinates will be described with reference to FIG. As described above, even if the position of the light emitter 77 in the light emitting component 75 is deviated from the design value, the positional relationship between the actual holding coordinates of the light emitting component 75 and the light emitter detection center coordinates is the same. Therefore, as shown in FIG. 4, when the portion where the CPU 61 holds the light emitting component 75 (the portion corresponding to the actual holding coordinates (C2, D2) at the time of suction) is arranged at the mounting coordinates (G, H), the light emitter 77. Is located at predetermined coordinates (E, F) = coordinates (G + r, H + s). As described above, in the present embodiment, the CPU 61 holds the light emitting component 75 in the actual holding coordinates and arranges them in the mounting coordinates, so that the center of the light emitter 77 is predetermined regardless of the positional deviation from the design value of the light emitter 77. It is arranged at the coordinates. This predetermined coordinate is a desired position on the substrate 70 where the center of the light emitter 77 is to be arranged. That is, the mounting coordinates included in the mounting information 67 are calculated back from the predetermined coordinates so that the positional relationship between the predetermined coordinates and the mounting coordinates is the same as the positional relationship between the light emitter design center coordinates and the holding coordinates. It is predetermined. Note that the position of the support substrate 76 in the light emitting component 75 changes in accordance with the positional deviation from the design value of the light emitter 77 in the light emitting component 75. In the upper part of FIG. 4, the position of the support substrate 76 on the substrate 70 after mounting when the position of the light emitter 77 is as designed is indicated by a broken line. The position of the support substrate 76 on the substrate 70 after mounting when the light emitter detection center coordinates of the light emitter 77 are the coordinates (A2, B2) is indicated by a solid line. Thus, in step S230, the CPU 61 positions the nozzle 44 with respect to the substrate 70 based on the positional relationship between the actual holding coordinates and the light emitter detection center coordinates, and arranges the light emitting component 75 on the substrate 70. It is.

  When all the components held by the mounting head 24 are placed on the board 70 in step S230, the CPU 61 determines whether there are any parts not placed on the current board 70 based on the mounting information 67 (step S240). ), When there are unarranged parts, the processing from step S130 is executed. That is, the CPU 61 changes the nozzle 40 as necessary, and if the suction target is the light emitting component 75, holds it in the actual holding coordinates, and if the suction target is other than the light emitting component 75, holds it in the holding coordinates and holds it. Place the components on the mounting coordinates. On the other hand, when there are no unarranged components on the current board 70, the CPU 61 ejects the current board 70 that has been mounted (step S250), and determines whether or not production is complete based on the number of boards that have been mounted. (Step S260). When the production is not completed, the CPU 61 repeatedly executes the processes after step S110. On the other hand, when the production is completed, the CPU 61 ends this routine.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The nozzle 40 of this embodiment corresponds to the component holding means of the present invention, the X-axis slider 26 and the Y-axis slider 30 correspond to the moving means, the mark camera 34 corresponds to the imaging means, and the control device 60 corresponds to the light emitter position. It corresponds to detection means and holding / mounting control means.

  According to the mounting system 10 described above, when mounting the light emitting component 75 having the light emitter 77 on the substrate 70, the CPU 61 captures an image of an area including at least a part of the light emitter 77 in the light emitting component 75 and emits light. Acquire a part image. Next, the CPU 61 detects the coordinates of the specific part (center) of the light emitter 77 (light emitter detection center coordinates) as the position of the issuer 77 based on the light emitting component image. Then, when the nozzle 40 holds the light emitting component 75, the CPU 61 has a predetermined positional relationship between the issuer detection center coordinates and the actual holding coordinates based on the detected position of the light emitter 77. The nozzle 40 is positioned on the light emitting component 75 so that the center position of the nozzle 40 is located at the actual holding coordinates so that the nozzle 40 and the light emitter 77 have a predetermined positional relationship. Further, when the light emitting component 75 held by the nozzle 40 is mounted on the substrate 70, the center of the light emitter 77 is set to a desired position on the substrate 70 based on the positional relationship between the issuer detection center coordinates and the actual holding coordinates. The center of the nozzle 40 holding the light emitting component 75 is positioned at the mounting coordinates on the substrate 70 so that Thus, the CPU 61 aligns the nozzle 40 and the light emitter 77 so as to have a predetermined positional relationship based on the position of the light emitter 77, holds the light emitting component 75, and considers the positional relationship of the nozzle 61. 40 is positioned with respect to the substrate 70 and mounted. Therefore, even if the position of the light emitter 77 in the light emitting component 75 is deviated from the design value, the light emitter 77 can be accurately positioned on the substrate 70. Further, since it is not necessary to image the light emitting component 75 while the light emitting component 75 is held by the nozzle 40, the light emitting component 75 can be efficiently positioned and mounted on the substrate 70. In some cases, after the light emitting component 75 is mounted on the substrate 70, a lens component or the like is placed on the light emitting body 77. At this time, if the positional relationship between the lens component and the light emitter 77 is deviated, a desired luminance may not be obtained. Further, there are cases where the position of the lens component on the substrate 70 cannot be changed according to the position of the light emitter 77, such as when a part of the lens component is inserted and fixed in the hole formed in the substrate 70. Even in such a case, in the mounting apparatus 11, the CPU 61 accurately positions the center of the light emitter 77 at a predetermined coordinate regardless of the positional deviation of the light emitter 77 in the light emitting component 75, so that desired luminance can be easily obtained. Further, in the description using FIG. 4, the case where the position of the light emitter 77 in the light emitting component 75 is deviated from the design value is illustrated, but the position of the entire light emitting component 75 collected by the mounting head 24 is deviated. Even in this case, the light emitting body 77 can be positioned on the substrate 70 with high accuracy by the CPU 61 performing the above-described processing. In other words, in the above-described embodiment, the CPU 61 performs mounting based on the light emitter detection center coordinates instead of the coordinates of the light emitting components 75. Therefore, the positional deviation of the light emitter 77 due to the positional deviation of the entire light emitting component 75, and the light emission. The light emitter 77 can be accurately positioned on the substrate 70 without particularly distinguishing which of the positional deviations of the light emitter 77 in the component 75 has occurred. Similarly, when both the positional deviation of the entire light emitting component 75 and the positional deviation of the light emitter 77 in the light emitting component 75 occur, the CPU 61 can similarly position the light emitter 77 on the substrate 70 with high accuracy. In addition, as a case where the position of the whole light emitting component 75 has shifted | deviated, the case where the position of the light emitting component 75 in a tape has shifted, the case where the shift | offset | difference has arisen in the tape feed by the feeder part 58, etc. are mentioned, for example.

  Also, the HDD 64 has the same positional relationship between the light emitter design center coordinates and the holding coordinates of the light emitter 75 and the positional relationship between the light emitter design center coordinates and the holding coordinates with respect to the predetermined coordinates on the substrate 70. Mounting information 67 including mounting coordinates on a certain substrate 70 is stored. Then, the CPU 61 derives actual holding coordinates having the same positional relationship with respect to the light emitter detection center coordinates based on the light emitter detection center coordinates and the stored positional relationship, and holds the light emitting component 75 in the actual holding coordinates. The held part is placed at the mounting coordinates. As described above, the CPU 61 determines the actual holding coordinates based on the light emitter detection center coordinates. Therefore, even if the position of the light emitter 77 in the light emitting component 75 deviates from the design value, the positional relationship between the center of the light emitter 77 and the held portion in the light emitting component 75 is always constant. As a result, the CPU 61 can accurately position the center of the light emitter 75 at a predetermined coordinate on the substrate 70 only by positioning the portion held by the mounting head 24 of the light emitting component 75 to the mounting coordinates stored in advance. it can.

  Further, the positional relationship stored in the HDD 64 is the positional relationship between the light emitter design center coordinates and the holding coordinates. Therefore, when the position of the light emitter 77 in the light emitting component 75 is as designed, the center position of the light emitting component 75 becomes the actual holding coordinates. Further, when the position of the light emitter 77 is deviated from the design value, the position deviated from the center position of the light emitting component 75 is the actual holding coordinates. That is, the position corresponding to the positional deviation of the light emitter 77 with respect to the center position of the light emitting component 75 becomes the actual holding coordinates. For this reason, for example, compared to a case where the actual holding coordinates are determined using the vicinity of the end of the light emitting component 75 as a reference (holding coordinates), the state where the actual holding coordinates are deviated from the light emitting component 75 and the light emitting component 75 cannot be held occurs. It becomes difficult.

  Furthermore, since the mark camera 34 also serves as an imaging means for imaging the light emitting component 75, the number of components of the mounting apparatus 11 can be reduced. Further, the mark camera 34 has a narrow field of view and may not be able to capture the light emitter 77 and the outer portion of the light emitting component 75 as one image. That is, there may be a case where an image capable of acquiring both the light emitter detection center coordinates and the information regarding the outer shape of the light emitting component 75 cannot be captured. In such a case, the significance of applying the present invention that does not require information on the outer shape of the light-emitting component 75 based on the light-emitting component image is particularly high. In addition, you may make it use the information regarding an external shape together.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the CPU 61 derives the actual holding coordinates based on the light emitter detection center coordinates, holds the light emitting component 75 in the actual holding coordinates, and places the held portion in the mounting coordinates. Not limited. The mounting device 11 may be mounted so that the center of the light emitting component 75 is arranged at a predetermined coordinate on the substrate 70 based on the light emitter detection center coordinates detected from the light emitter image. For example, the CPU 61 positions the nozzle 40 at a predetermined holding position when the nozzle 40 holds the light emitting component 75 and mounts the light emitting component 75 held by the nozzle 40 on the substrate 70. The mounting position of the nozzle 40 holding the light emitting component 75 on the substrate 70 based on the positional relationship between the nozzle 40 and the light emitter 77 in the light emitting component 75 held by the nozzle 40 calculated from the position 77 and a predetermined holding position. The light emitting component 75 may be mounted on the substrate 70 after being positioned at the position. That is, the CPU 61 controls the mounting head 24 to hold the light emitting component 75 with the holding coordinates without deriving the actual holding coordinates regardless of the light emitter detection center coordinates, and derives the mounting coordinates based on the light emitter detection center coordinates. To do. FIG. 5 is a flowchart illustrating an example of a mounting process routine according to a modification. This routine is the same as the mounting process routine of FIG. 2 except that steps S175a to S190a are performed instead of steps S180 to S190 described above. When the mounting process routine of this modification is performed, in the mounting information 67 stored in the HDD 64 in step S100, it is desired to place the predetermined coordinates (the center of the light emitter 77) on the light emitting component 75 instead of the mounting coordinates. Assume that desired coordinates on the substrate 70) are associated with each other. In the mounting processing routine of this modification, after detecting the light emitter detection center coordinates based on the light emitting component image in step S170, the CPU 61 associates the light emitter detection center coordinates and the mounting information 67 with the light emitting component 75 to be picked up. A positional relationship with the held coordinates is derived (step S175a). The positional relationship derived by the CPU 61 will be described with reference to FIG. For example, when the position of the light emitter 77 in the light emitting component 75 is as designed, the CPU 61 uses the light emitter detection center coordinates (= light emitter design center coordinates) (A1, B1) as a reference (origin). The relative coordinates (−r, −s) of the held coordinates (C1, D1) are derived as the positional relationship between the light emitter detection center coordinates and the held coordinates. On the other hand, when the position of the light emitter 77 in the light emitting component 75 is the coordinates (A2, B2) deviated from the design values as shown in the lower part of FIG. 6, the CPU 61 determines the light emitter detection center coordinates (A2, B2). ) As the origin, the relative coordinates (−c, −d) = relative coordinates (−r + a, −s + b) of the holding coordinates (C1, D1) are derived as the positional relationship between the light emitter detection center coordinates and the holding coordinates. Thus, the positional relationship according to the light emitter detection center coordinates is derived. Subsequently, the CPU 61 derives mounting coordinates based on the derived positional relationship and the predetermined coordinates stored in the mounting information 67 (step S180a). The CPU 61 derives the mounting coordinates so that the position of the mounting coordinates based on the predetermined coordinates is the same as the position of the holding coordinates based on the light emitter detection center coordinates. For example, in FIG. 6, when the position of the light emitter 77 in the light emitting component 75 is as designed, the CPU 61 determines the position of the relative coordinates (−r, −s) with reference to the predetermined coordinates (E, F). The coordinates (G, H) = coordinates (E−r, F−s) are derived as mounting coordinates. On the other hand, when the luminous body detection center coordinates are the coordinates (A2, B2) in FIG. 6, the CPU 61 is at the relative coordinates (-c, -d) with the predetermined coordinates (E, F) as a reference. Coordinates (I, J) = coordinates (Ec, Fd) are derived as mounting coordinates. Then, the CPU 61 moves the mounting head 24 and sucks and holds the light emitting component 75 with the holding coordinates (step S190a), and performs the processing after step S210. Further, after step S220, the CPU 61 places (mounts) the components held by the mounting head 24 at the mounting coordinates on the substrate 70 (step S230). As described above, in the mounting device 11 according to the modified example, the CPU 61 emits light that is held at the holding coordinates so that the light emitting body detection center coordinates can be arranged at predetermined coordinates based on the positional relationship between the light emitting body detection center coordinates and the holding coordinates. The mounting coordinates are derived as the movement destination coordinates of the part 75. Thereby, even if the position of the light emitter 77 in the light emitting component 75 is deviated from the design value, the center of the light emitter 77 can be accurately positioned at the predetermined coordinates (E, F) on the substrate 70. In the mounting apparatus 11 of this modification, the light emitter design center coordinates included in the mounting information 67 are only coordinates indicating the imaging position when the light emitting component 75 is imaged in step S160. Therefore, even when the light emitter detection center coordinates are detected from the light emitting component image, other coordinates may be included in the mounting information 67 instead of the light emitter design center coordinates. Further, in the mounting apparatus 11 of the above-described modification, the predetermined coordinates are included in the mounting information 67, but the present invention is not limited to this. For example, instead of the predetermined coordinates, the mounting coordinates and the positional relationship (the positional relationship between the luminous body design center coordinates and the holding coordinates) when the position of the light emitting body 77 in the light emitting component 75 is as designed are the mounting information 67. May be included. In this case, the CPU 61 derives the amount of deviation between the positional relationship derived in step S175a and the positional relationship included in the mounting information 67, and coordinates shifted by the amount of deviation derived from the mounting coordinates included in the mounting information 67. The post-correction mounting coordinates may be derived in step S180a. In step S230, the light emitting component 75 held by the mounting head 24 by the CPU 61 may be arranged (mounted) on the corrected mounting coordinates on the substrate 70. Even in this case, the center of the light emitter 77 can be accurately positioned at predetermined coordinates (E, F) on the substrate 70.

  In the embodiment described above, the mounting information 67 includes the light emitter design center coordinates and the holding coordinates as the positional relationship between the light emitter design center coordinates and the holding coordinates of the light emitter 75. If it is the information showing a relationship, it will not be restricted to this. For example, relative coordinates representing the position of the other coordinate when the coordinate of the light emitter design center coordinate and the holding coordinate is used as a reference may be included in the mounting information 67 as information representing the positional relationship. Even in this case, the CPU 61 can derive the actual holding coordinates based on the light emitter detection center coordinates and the positional relationship included in the mounting information 67.

  In the embodiment described above, the CPU 61 detects the light emitter detection center coordinates, which are the coordinates of the center of the light emitter 77, based on the light emitting component image. What is necessary is just to detect a coordinate. For example, the CPU 61 may detect coordinates such as one of the front and rear, left and right ends and corners of the light emitter 77. Alternatively, the CPU 61 may detect coordinates such as a predetermined mark disposed on the light emitter 77. Moreover, although the light emitting component image is an image including the entire light emitter 77, the present invention is not limited to this. The imaging range 35 should just be defined so that the area | region required in order to detect the coordinate of the specific site | part of the light-emitting body 77 may be included in a light-emitting component image. Further, the CPU 61 may detect the coordinates of a plurality of specific parts of the light emitter 77, such as detecting the coordinates of the center of the light emitter 77 and the coordinates of the corners.

  In the above-described embodiment, in step S180, the CPU 61 derives the coordinates that are shifted from the holding coordinates by the shift amount in the XY directions from the light emitter design center coordinates to the light emitter detection center coordinates as the actual holding coordinates. That is, the CPU 61 derives the actual holding coordinates in consideration of the displacement of the light emitter 77 in the X and Y directions. At this time, the CPU 61 may derive the actual holding coordinates in consideration of the inclination of the light emitter 77 on the XY plane (shift in the rotation direction). For example, the mounting apparatus 11 has a positional relationship between the coordinates of the plurality of specific parts of the light emitter 77 and the holding coordinates, and a positional relationship between the coordinates of the plurality of specific parts and the holding coordinates with respect to the plurality of predetermined coordinates on the substrate 70. Mounting information 67 including mounting coordinates on the substrate 70 that are in the same positional relationship may be stored in the HDD 64. And CPU61 is based on the coordinate of the some specific site | part detected from the light emitting component image, and the stored positional relationship, The same positional relationship as the positional relationship memorize | stored with respect to the coordinate of the some specific site | part detected. The mounting head 24, the X-axis slider 26, and the Y-axis slider 30 may be controlled so that the actual holding coordinates are derived and the portion where the light-emitting component 75 is held and held is mounted on the mounting coordinates. . Specifically, for example, the CPU 61 may perform the following processing in steps S100, S170, and S180 of the above-described embodiment. In step S100, the CPU 61 coordinates the coordinates of a plurality of specific parts of the light emitter 77 (for example, the coordinates of the center of the light emitter 77 and the left front corner of the light emitter 77 when the position of the light emitter 77 is as designed). The production job data including the mounting information 67 including the coordinates of the part, the holding coordinates, and the mounting coordinates is acquired and stored in the HDD 64. In step S170, the CPU 61 detects the coordinates of a plurality of specific parts (for example, the center and the left front corner) of the light emitter 77 based on the light emitting component image. Further, the CPU 61 compares the light emitter 77 with the case where the position of the light emitter 77 is as designed based on the detected coordinates of the specific portions and the coordinates of the specific portions stored in the HDD 64. The amount of deviation (rotation angle) in the rotation direction is derived. For example, the CPU 61 derives an angle formed by a line segment connecting the coordinates of a plurality of specific parts stored in the HDD 64 and a line segment connecting the coordinates of the detected plurality of specific parts as a deviation amount in the rotation direction. . Next, in step S180, the CPU 61 derives actual holding coordinates having the same positional relationship as the positional relationship stored in the HDD 64 with respect to the detected coordinates of the plurality of specific parts. That is, the actual holding coordinates are coordinates such that the positional relationship between the coordinates of the plurality of specific parts and the holding coordinates stored in the HDD 64 and the positional relationship between the detected coordinates of the plurality of specific parts and the actual holding coordinates are the same. Is derived. In step S190, the CPU 61 sucks and holds the light emitting component 75 with the actual holding coordinates, and places (mounts) the light emitting component 75 on the mounting coordinates on the substrate 70 in step S230. At this time, the CPU 61 rotates the light emitting component 75 by the amount of deviation in the rotation direction so as to correct the amount of deviation in the rotation direction derived in step S170, and then arranges (mounts) it on the mounting coordinates on the substrate 70. . In this way, the CPU 91 includes the substrate including the inclination (positioning angle) of the light emitter 77 not only when the light emitter 77 is displaced in the XY direction but also when it is displaced in the rotational direction. It is possible to position on 70 with high accuracy. In the mounting process routine of the modified example shown in FIG. 5 as well, by using the coordinates of a plurality of specific parts of the light emitter 77, the light emitter 75 is similarly mounted on the substrate in consideration of the rotational direction shift of the light emitter 77. It is possible to position on 70 with high accuracy. Specifically, the CPU 61 detects the coordinates of a plurality of specific parts (for example, the coordinates of the center and the front left corner) based on the light emitting component image in step S170, and then detects the detected coordinates and mounting information. In step S175a, the positional relationship with the holding coordinates associated with the light emitting component 75 to be picked up is derived at 67. In step S180a, the CPU 61 determines a plurality of predetermined coordinates stored in advance as the derived positional relationship and the mounting information 67 (for example, desired coordinates on the substrate 70 where the center of the light emitter 77 and the left front corner are to be arranged). ) And the mounting coordinates are derived. That is, the CPU 61 derives the mounting coordinates so that the mounting coordinate positions based on the plurality of predetermined coordinates are the same as the holding coordinate positions based on the detected coordinates of the plurality of specific parts. Further, the CPU 61 uses an angle formed by a line segment connecting a plurality of predetermined coordinates stored in the HDD 64 and a line segment connecting the coordinates of a plurality of detected specific parts as a deviation amount in the rotation direction of the light emitter 77. To derive. In step S190a, the CPU 61 sucks and holds the light emitting component 75 with the holding coordinates, and places (mounts) the light emitting component 75 on the mounting coordinates on the substrate 70 in step S230. At this time, the CPU 61 rotates the light emitting component 75 by the amount of deviation in the rotation direction so as to correct the amount of deviation in the rotation direction derived in step S180a, and then arranges (mounts) it on the mounting coordinates on the substrate 70. .

  In the above-described embodiment, the imaging range 35 is not wide enough to capture the entire light emitter 77 and the outer portion of the light emitting component 75 as one image, but is not limited thereto. In the mounting apparatus 11, the mark camera 34 also serves as an image pickup unit that picks up the light emitting component 75. However, the present invention is not limited to this, and an image pickup unit other than the mark camera 34 may pick up the light emitting component image.

  In the embodiment described above, the holding coordinates included in the mounting information 67 are the coordinates of the center of the light emitting component 75, but are not limited to this and may be the coordinates of any part in the light emitting component 75. However, it is preferable that the coordinates of the center of the light emitting component 75 be the holding coordinates because the actual holding coordinates are out of the light emitting component 75 and the light emitting component 75 cannot be held.

  In the embodiment described above, the mounting coordinates are coordinates with the reference mark of the substrate 70 as the origin, and the holding coordinates and the light emitter design center coordinates are stored in advance in the HDD 64 corresponding to each of the plurality of feeder units 58. Although the coordinates having the reference position as the origin are used, the present invention is not limited to this, and another origin may be used.

  The order of the steps in the mounting process routine in the above-described embodiment is an example, and may be changed as appropriate.

  In the above-described embodiment, the position of the light emitter 77 of the light emitting component 75 is detected in the state of being stored in the tape of the reel 57 set in the feeder unit 58. However, the light emitting component 70 is mounted on a dedicated mounting table. The position of the light emitter 77 of the light emitting component 75 may be detected in the state. This modification will be described.

  As shown in FIG. 7, the mounting table 90 is provided between the transport unit 18 and the feeder unit 58. The mounting table 90 is a table for temporarily mounting the light emitting component 75 when the position of the light emitter 77 of the light emitting component 75 is detected. Further, the upper surface of the mounting table 90 is a mounting surface 91 that is finished flat with high accuracy. As shown in FIG. 8, the mounting surface 91 has mounting table marks 92 at four corners. The mounting table mark 92 is used to recognize the position of the mounting surface 91. The placement surface 91 is provided with four placement areas 94 for placing the light emitting components 75, and a hole 93 is provided at the center of each placement area 94. The hole 93 is connected in parallel to the vacuum pump and the air compressor via a switching valve that is an electromagnetic valve. By adjusting the switching valve, a negative pressure or a positive pressure is supplied to the hole 93. be able to. These holes 93, the switching valve, and the vacuum pump constitute a mounting holding unit that holds the light emitting component 75 on the mounting table 90. A pressure sensor for detecting the pressure in the hole 93 is provided between the hole 93 and the switching valve.

  In this modified example, in the above-described embodiment, the point that the mark camera 34 captures the light emitting body 77 of the light emitting component 75 to acquire the light emitting component image is greatly different on the mounting table 90, but the other portions are the same. The implementation process routine is almost the same. First, the CPU 61 moves the mounting head 24 and holds the light-emitting component 75 on the fuser portion 58 by the nozzle 40. When holding the light emitting component 75, the CPU 61 moves the mounting head 24 above the placement surface 91. Subsequently, the CPU 61 executes a placement operation of the light emitting component 75. That is, the CPU 61 lowers the nozzle 40 so as to place the light emitting component 75 in the placement area 94 and supplies positive pressure to the nozzle 40. At the same time, the CPU 61 controls the switching valve so that negative pressure is supplied to the hole 93 of the placement area 94. Accordingly, the light emitting component 75 is held on the mounting table while the mark camera 34 performs imaging. Thereafter, the CPU 61 controls the Z-axis motor 45 so that the nozzle 40 rises to the upper position. Subsequently, as shown in FIG. 8, the CPU 61 causes the mark camera 34 to capture an image of the upper surface of the light emitting component 75 placed in the placement area 94. Thereafter, the processing from Step S170 to Step S190 or Step S170 to S190a in the above-described embodiment is performed. After detecting the position of the light emitter 77, the CPU 61 uses the light emitting component 75 placed in the placement area 94 as the nozzle 40. Re-adsorb. That is, the CPU 61 controls the X-axis slider 26 and the Y-axis slider 30 so that the nozzle 40 comes directly above the light-emitting component 75 placed in the placement area 94, and then the tip of the nozzle 40 becomes the light-emitting component 75. The Z-axis motor 45 is controlled so as to come into contact. At the same time, the CPU 61 supplies negative pressure to the nozzle 40 to cause the light emitting component 75 to be adsorbed to the nozzle 40. At that time, the CPU 61 controls the switching valve so that a positive pressure is supplied to the hole 93 of the placement area 94. Thereby, the light emitting component 75 is easily separated from the placement area 94. Further, the CPU 61 supplies negative pressure to the hole 93 and places the light emitting component 75 on the mounting table 90 at least after the light emitting component 75 is imaged by the mark camera 34 until the light emitting component 75 is held by the nozzle 40. Since it holds, the positional deviation of the light emitting component during that time is prevented, and the light emitter can be positioned on the substrate more accurately.

  The present invention can be used in the technical field of mounting light emitting components on a substrate.

DESCRIPTION OF SYMBOLS 10 mounting system, 11 mounting apparatus, 18 conveyance part, 21 sampling part, 20 support plate, 22 conveyor belt, 23 support pin, 24 mounting head, 26 X axis slider, 28 guide rail, 30 Y axis slider, 32 guide rail, 34 mark camera, 35 imaging range, 40 nozzles, 42 nozzle holder, 45 Z-axis motor, 54 parts camera, 56 reel unit, 57 reel, 58 feeder section, 60 control device, 61 CPU, 62 ROM, 63 RAM, 64 HDD, 65 input / output interface, 66 bus, 67 mounting information, 70 substrate, 75 light emitting component, 76 support substrate, 77 light emitter, 80 management computer, 87 input device, 88 display, 90 mounting table, 91 mounting surface, 92 Mounting table mark, 93 holes, 94 mounting area.

Claims (6)

A method of mounting a light emitting component that mounts a light emitting component having a light emitter on a substrate,
An imaging step of acquiring an image of a light emitting component by imaging an area including at least a part of the light emitter in the light emitting component by an imaging unit;
A light emitter position detecting step for detecting the position of the light emitter based on the light emitting component image;
Based on the position of the light emitter detected in the light emitter position detection step, the component holding means is aligned with the light emitting component so that the component holding means and the light emitter are in a predetermined positional relationship, and the component A component holding step of holding the light emitting component by a holding means;
Based on the predetermined positional relationship, a mounting step of positioning the component holding means holding the light emitting component with respect to the substrate and mounting the light emitting component on the substrate;
Mounting method of light emitting component including A light emitting component mounting apparatus method for mounting a light emitting component having a light emitter on a substrate,
An imaging step of acquiring an image of a light emitting component by imaging an area including at least a part of the light emitter in the light emitting component by an imaging unit;
A light emitter position detecting step for detecting the position of the light emitter based on the light emitting component image;
Positioning the component holding means at a predetermined holding position, and holding the light emitting component by the component holding means;
Based on the position of the light emitter detected in the light emitter position detection step and the predetermined holding position, the positional relationship between the holding means and the light emitter in the light emitting component held by the holding means is calculated. Process,
Based on the positional relationship, the mounting step of mounting the light emitting component on the substrate by positioning the component holding means holding the light emitting component at the mounting position on the substrate;
Mounting method of light emitting component including   Further, a mounting holding step of holding the light emitting component on the mounting table at least after the light emitting component is imaged in the imaging step until the light emitting component is held by the holding means in the component holding step. The light emitting component mounting method according to claim 1, further comprising: A mounting device for mounting a light emitting component having a light emitter on a substrate, and a component holding means capable of holding the light emitting component;
Moving means for moving the component holding means;
Imaging means for capturing a light-emitting component image by capturing an area including at least a part of the light-emitting body in the light-emitting component;
A light emitter position detecting means for detecting the position of the light emitter based on the light emitting component image;
Holding and mounting control means for controlling the operation of the component holding means and the moving means to control the holding of the light emitting components and the mounting on the substrate;
With
When the component holding means holds the light emitting component, the holding and mounting control means determines whether the component holding means and the light emitter are based on the position of the light emitter detected by the light emitter position detecting means. When the component holding means is positioned on the light emitting component so as to be in a positional relationship, and the light emitting component held by the component holding means is mounted on the substrate, the component holding means is based on the predetermined positional relationship. A mounting apparatus for positioning with respect to the substrate. A mounting device for mounting a light emitting component having a light emitter on a substrate,
Component holding means capable of holding the light emitting component;
Moving means for moving the component holding means;
Imaging means for capturing a light-emitting component image by capturing an area including at least a part of the light-emitting body in the light-emitting component;
A light emitter position detecting means for detecting the position of the light emitter based on the light emitting component image;
Holding and mounting control means for controlling the operation of the component holding means and the moving means to control the holding of the light emitting components and the mounting on the substrate;
With
The holding and mounting control unit positions the component holding unit at a predetermined holding position when the component holding unit holds the light emitting component, and mounts the light emitting component held by the component holding unit on the substrate. When the light emitting component is held, the light emitting component is held based on the positional relationship between the light holding body and the light emitting component held by the holding means, which is calculated from the position of the light emitting body and the predetermined holding position. A mounting apparatus for mounting the light emitting component on the substrate by positioning the component holding means at the mounting position on the substrate. Furthermore, a mounting table on which the light emitting component is mounted when the light emitting component is imaged by the imaging means;
A mounting holding means that is provided on the mounting table and holds the light emitting component on the mounting table at least after the light emitting component is imaged by the imaging unit until the light emitting component is held by the holding unit. When,
The mounting apparatus of Claim 4 or Claim 5 provided with these.

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