JP2001267798A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device that can shorten the moving distance of a placement head for reducing the cycle time, and has superior placement position accuracy. SOLUTION: A part-supplying part 3 that is set by combining a pallet (component supplying tool) 3a with a vibration feeder 30, and a component supplying part 4 where a printed circuit board (an object to be mounted) 4a is set are allowed to reciprocate in X-axis directions that are independent and in parallel with each other. Also, a placement head 6 having a suction nozzle (part retention mechanism) 5 that is allowed to reciprocate in the Z-axis direction is allowed to linearly reciprocate in the Y-axis direction orthogonally crossing the X-axis direction. Furthermore, a part image pickup camera (part image pickup means) 7 for picking up the image of an electronic component that is retained by the suction nozzle 5 is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus, and more particularly, to a component mounting apparatus used for mounting an electronic component on a mounting object such as a printed circuit board.

[0002]

2. Description of the Related Art One of conventional component mounting apparatuses used for mounting electronic components is a XY-axis robot provided with a holding mechanism for holding the electronic components (such as a suction nozzle for sucking the electronic components by vacuum or a mechanical device). A head equipped with a chuck mechanism for gripping is attached, and the head is moved while holding the electronic component by the holding mechanism, so that the electronic component is mounted at a predetermined position on a mounting target such as a predetermined printed circuit board. There is a component mounting device.

As a component mounting apparatus of this type, for example, as shown in FIG. 4, a component supply section 51 on which a component supply jig such as a component aligning tray is placed, and a substrate on which electronic components are mounted are provided. A mounting head 54 provided with a component mounting unit 52 on which a mounting target such as a component is mounted, a component holding mechanism 53 such as a vacuum suction nozzle for suctioning and holding an electronic component from the component supply unit 51, and a mounting head 54 An XY-axis robot 55, a component imaging unit (camera) 56 for imaging the electronic component held by the component holding mechanism 53 of the mounting head 54 at a predetermined position in order to obtain position information of the electronic component,
A mounting object imaging means (camera) 57 for imaging a component mounting target such as a board in order to obtain mounting position information;
In a state where the electronic component is sucked and held by the component holding mechanism 53 of the mounting head 54, the mounting head 54 is moved by arrows a, b, and
There is a component mounting apparatus that mounts an electronic component at a predetermined position on a mounting target by moving the electronic component in a direction indicated by c and d.

[0004]

By the way, in the above-mentioned conventional component mounting apparatus, the mounting head 54 is moved to the component pickup position, the imaging position by the component imaging means 56 for component position recognition, and the component mounting position (for example, the substrate mounting position). On the predetermined position)
Must be moved to a total of three positions, the moving distance (flow line) of the mounting head 54 becomes long, and the time required to move and stop the mounting head 54 and the The total time required for the arithmetic processing is required, which is a factor that makes it difficult to shorten the tact time. There is also a component mounting apparatus in which a mounting target image pickup unit (camera) for confirming a component mounting position is mounted on a mounting head. In this case, a board or the like as a mounting target is imaged. It is necessary to move the mounting head to at least four positions including the positions for the movement, and there is a problem that the flow line becomes longer.

In the above-described conventional component mounting apparatus, when the component mounting section (substrate to be mounted) 52 is mounted on an XY table (not shown), the mounting head 54 moves in the same direction as the moving direction. In addition, there is a case where it is necessary to finely adjust the mounting position by moving the XY table, which not only makes the position control difficult, but also causes a problem that the equipment is duplicated and the cost is increased.

On the other hand, in the component supply section, it is common to set a component supply jig such as a tray in which a large number of electronic components are arranged and arranged. However, in order to further improve productivity by automation, the component supply section is required. Alternatively, it is desirable to continuously supply components to the component supply jig, and a measure in this regard is required.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems of the conventional component mounting apparatus, in which the moving distance of the mounting head is short, the tact time can be shortened, and the component having excellent mounting position accuracy can be obtained. It is intended to provide a mounting device.

[0008]

According to the present invention, there is provided a component supply jig, or one or more of a vibration feeder, a bulk feeder, a tape feeder, and an adhesive sheet feeder, which are set in combination, and driven in a predetermined direction. A component supply unit that is linearly driven back and forth, a mounting object is set, and a component mounting unit that is linearly driven back and forth by a driving unit in a direction parallel to the moving direction of the component supply unit, and holds the component. A component holding mechanism for performing a linear reciprocating drive in a direction orthogonal to the moving direction of the component supply unit and the component mounting unit by a driving unit, and picks up a component set in the component supply unit; A mounting head for mounting a component at a predetermined position on a mounting target set in a component mounting section, and a component held by a component holding mechanism of the mounting head are mounted on the mounting head. A component imaging unit that captures images in the process of linearly moving, a drive control unit that drives and controls the component supply unit, the component mounting unit, and the mounting head, respectively, and an image calculation processing unit that performs arithmetic processing on an image obtained by the component imaging unit. A component mounting apparatus characterized by comprising:

[0009]

According to the component supply apparatus of the present invention, the component supply unit and the component mounting unit are independently reciprocated and driven in parallel with each other, and the mounting head provided with the component holding mechanism is provided with the component supply unit. The component and the component mounting unit are reciprocated in the direction orthogonal to the moving direction, and the component held by the component holding mechanism is imaged by the component imaging unit. And the correction information of the mounting position can be obtained. Therefore, it is possible to pick up the component from the component supply unit and mount the component at the predetermined position of the mounting target of the component mounting unit with high accuracy simply by moving the mounting head linearly in the predetermined direction. As a result, the mounting head is 3
The moving distance can be shortened as compared with the case of moving to one or four positions, the tact time can be shortened, the equipment is prevented from being duplicated, the economy is excellent, and the mounting position accuracy is high. A component mounting device can be provided.

Further, in the present invention, in the component supply section, a component supply jig such as a tray or a pallet, or one or a combination of a vibration feeder, a bulk feeder, a tape feeder, and an adhesive sheet feeder is set. Therefore, it is possible to continuously supply parts having different types and sizes, and it is possible to further increase productivity by automation.

[0011]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIGS. 1 and 2 are views for explaining a component mounting apparatus according to an embodiment of the present invention. FIG. 1 is a perspective view showing the entire configuration of the component mounting apparatus. FIG. It is a top view which shows operation | movement schematically.

In FIG. 1, reference numeral 1 denotes a component mounting device. The component mounting device 1 includes an L-shaped base member 2, a component supply section 3, a component mounting section 4, and four vacuum suction nozzles (a component holding mechanism). ) 5 and a component imaging camera (component imaging means) 7 and the like. The component mounting apparatus 1 further includes a drive control unit (not shown) for driving and controlling the component supply unit 3, the component mounting unit 4, the suction nozzle 5, and the mounting head 6, respectively, and arithmetically processes images from the component imaging camera 7. Image processing means (not shown).

The base member 2 is integrally formed of concrete, ceramic, a composite material of metal and ceramic, or marble, which is a material having a higher vibration damping rate and a smaller coefficient of thermal expansion than a metal member. The vertical wall 2b is formed integrally with the rear end of the base body 2a. This makes it possible to efficiently attenuate the vibration of each mechanism during operation, suppress the displacement of each mechanism due to the heat generated by the driving means such as a linear motor, and maintain the mounting position accuracy of the electronic component at a high level. Further, since the base member 2 is integrally formed of the above-described material, the phases when the respective mechanisms vibrate become the same, and the adverse effects due to the vibration are suppressed as compared with the case where the respective mechanisms vibrate separately. It becomes possible.

The component supply section 3 is disposed at the left end of the base body 2a when viewed from the front of the apparatus. The component supply section 3 is driven by a linear motor (not shown) along a linear motor slider (drive means) in the X-axis direction (front-back direction). Is reciprocated linearly. A pallet (component supply jig) 3a on which a large number of electronic components are arranged is set on the upper surface of the component supply unit 3. The pallet 3a has storage recesses for storing electronic components, and the storage recesses are arranged at a pitch corresponding to the arrangement pitch of the vacuum suction nozzles 5 described above. Thereby, four suction nozzles 5 can be used at a time.
It is possible to hold individual electronic components.

A vibration feeder 30 is provided in the component supply section 3. The vibration feeder 30 sequentially supplies a large number of electronic components to the respective storage recesses of the pallet 3a by the vibration supply unit 32.

The component mounting section 4 is arranged at the center of the base body 2a, and is driven by a linear motor 8 along a pair of linear motor sliders 8a, 8a in an X-axis parallel to the moving direction of the component supply section 3. It is reciprocated linearly in the direction. On the upper surface of the component mounting section 4, a printed circuit board (mounting target) 4a on which electronic components are mounted is set.

The mounting head 6 is located above the component supply section 3 and the component mounting section 4, and is disposed on a gantry 9 fixed to the vertical wall 2b. A pair of linear motor sliders 10 and 10 are attached and fixed to the gantry 9. The mounting head 6 is moved by the linear motor 11 along the linear motor slider 10 in the Y-axis direction (lateral direction) orthogonal to the X-axis direction. It is reciprocated linearly.

As the linear motor 11 for driving the mounting head 6, a direct drive type linear motor is used. As a linear motor circular coder, a full-closed high-precision positioning can be performed.
What used a glass scale, a metal scale, etc. is used.

Each of the vacuum suction nozzles 5 is fixed to a fixing member 5a, and the fixing member 5a is a pair of linear motor sliders 12a and 12a fixed to the mounting head 6.
It is supported movably in the Z-axis direction (vertical direction) along 12a. The fixing member 5a is provided with the servo motor 1
By rotating the cam plate 14 connected to 3, the cam plate 14 is driven to reciprocate in the Z-axis direction. Further, each of the suction nozzles 5
The electronic component sucked and held by the rotation positioning drive means (not shown) is supported so as to be rotatable and positionable around the Z axis (the direction θ in FIG. 1).

The component imaging camera 7 is disposed and fixed between the component supply unit 3 and the component mounting unit 4. When the mounting head 6 moves linearly from the component supply unit 3 to the component mounting unit 4, the suction is performed. The electronic component held by the nozzle 5 is imaged. The reference point of the electronic component imaged by the camera 7 (generally, the center point of the suction nozzle)
Is calculated, and the X-axis, Y-axis and θ correction amounts are calculated in accordance with the deviation.

The component supply unit 3 and the component imaging camera 7
An application portion 16 filled with an adhesive, a conductive adhesive, a solder paste, or the like is disposed between the two. When the electronic component picked up by the component supply unit 3 is conveyed to the component mounting unit 4 by the application unit 16, an adhesive or a solder paste can be automatically applied to the electronic component, thereby improving productivity. it can.

Further, a multipurpose head 17 is provided on the gantry 9 independently of the mounting head 6. The multipurpose head 17 is linearly reciprocated in the Y-axis direction along the linear motor slider 10 by a linear motor 18. In addition, a substrate imaging camera 19 is disposed on the target head 17. A shift from the mounting position of the printed board 4a imaged by the board imaging camera 19 is obtained, and the X-axis and Y-axis correction amounts are calculated according to the shift.

Since the multipurpose head 17 is arranged independently of the mounting head 6, when the mounting head 6 is performing the electronic component pickup operation in the component supply unit 3,
The printed circuit board 4a can be imaged, and the tact time can be reduced. The other purpose head 17 includes:
In addition to the camera 19, for example, an adhesive dispenser for applying an adhesive to the printed circuit board 4a can be mounted.

The component mounting apparatus 1 of the present embodiment carries the printed circuit board assembled by the pre-process facility A to the component mounting section 4, and the mounted printed circuit board on which the electronic components are mounted by the component mounting section 4. There is provided a component transport section 20 for transporting the component 4a to the post-processing equipment B.

The component transport section 20 includes a pair of carry-in rails 21 and 2 arranged in parallel at the right end on the base body 2a.
1 and unloading rails 22, 22, and the loading and unloading rails 2
Loading and unloading carts 23 and 24 reciprocating in the X-axis direction along the directions 1 and 22; timing belts 25 and 25 and a rotary drive motor 26 for independently reciprocating the carts 23 and 24; Transfer members 27, 27 disposed above the carry-out carriages 23, 24 and gripping the printed circuit boards set on the carriages 23, 24, and the transfer members 27 are vertically (Z-axis) and left-right ( (A Y-axis direction).

Then, the printed circuit board assembled in the pre-process facility A is transferred to the carry-in vehicle 23 waiting at the delivery position of the pre-process facility A. In this state, the carry-in cart 23 is moved in parallel with the component mounting section 4. Move to a certain position. Next, the transfer member 27 transfers the printed circuit board of the carry-in carriage 23 to a predetermined position of the component mounting section 4 for setting.

Next, when the mounting of the components on the printed circuit board is completed, the transfer member 27 transfers the mounted printed circuit board to the unloading cart 24, and the unloading cart 24 moves to the delivery position of the post-process equipment B.

Next, the operation and effect of this embodiment will be described.

In order to mount an electronic component on a printed circuit board by the component mounting apparatus 1 of the present embodiment, first, the vibration feeder 30 supplies the electronic component to each storage recess of the pallet 3a,
The component supply unit 3 moves in the X-axis direction, and the mounting head 6 moves in the Y-axis direction to perform positioning at a predetermined pickup position (where the center of the suction nozzle coincides with the center of the storage recess). At this pickup position, the fixing member 5a descends to suck and hold the electronic component with each suction nozzle 5, and thereafter the suction nozzle 5 rises.

During the pick-up process, the other-purpose head 17 moves above the printed circuit board 4a set on the component mounting section 4, the camera 19 captures an image of the printed circuit board, and the image processing means operates the X-axis with respect to the target mounting position. , And Y-axis correction amounts are calculated. After the imaging, the other-purpose head 17 retreats to a position where it does not interfere with the mounting head 4.

On the other hand, in the component transport section 20, the carry-in cart 23 carries in the printed circuit board assembled by the pre-process facility A, and the transfer member 27 is set in the component mounting section 4.

Following the pickup step, the mounting head 6 moves linearly above the component mounting section 4. During this movement, the component imaging camera 7 captures an image of the electronic component held by each suction nozzle 5, and the image calculation processing means determines the correction amount of each electronic component for the suction nozzle 5 in the X-axis, Y-axis, and θ directions. calculate.

Then, the mounting head 6 moves above the printed circuit board 4a of the component mounting section 4, and in this state, the calculated correction amount is adjusted so that the electronic component matches the predetermined mounting position of the printed circuit board 4a. Are added, the positioning of the component mounting section 4 in the X-axis direction is performed, the positioning of the mounting head 6 in the Y-axis direction is performed, and each suction nozzle 5 is rotated by a predetermined angle to determine the positioning in the θ direction. Is performed.

Subsequently, the fixing member 5a is lowered to mount the electronic component at a predetermined mounting position on the printed circuit board 4a. Thereafter, the fixing member 5a rises and returns to the position where the next electronic component should be picked up. By repeating such a series of operations, each electronic component is mounted on the printed circuit board 4a. Thereafter, the mounted printed circuit board 4a is transferred to the unloading cart 24 via the transfer member 27, and is unloaded to the post-process equipment B.

As described above, according to the present embodiment, the component supply unit 3 and the component mounting unit 4 are independently controlled in the front-rear direction (X
A mounting head 6 provided with a suction nozzle 5 movable in the vertical direction (Z-axis direction) and movable in the left-right direction (Y-axis direction) is provided. The electronic component sucked and held by the nozzle 5 is transferred to the mounting head 6.
The electronic camera is imaged by the component imaging camera 7 while the mounting head 6 is moving, so that the mounting position correction information can be obtained. Thus, by simply moving the mounting head 6 linearly in the Y-axis direction, an electronic component can be picked up from the component supply unit 3 and can be accurately mounted at a predetermined mounting position on the printed circuit board 4a of the component mounting unit 4. as a result,
The moving distance can be shortened as compared with the case where the mounting head is moved to three or four positions as in the conventional case, the tact time can be shortened, and the equipment can be prevented from being duplicated. It is possible to provide the component mounting apparatus 1 having excellent mounting properties and high mounting position accuracy.

In this embodiment, since the pallet 3a and the vibration feeder 30 for supplying the electronic components to the pallet 3a are set in combination in the component supply section 3, the electronic components having different types and sizes are continuously provided. Supply can be performed, continuous operation can be performed, and productivity can be further improved.

In this embodiment, the printed circuit board assembled in the pre-process facility A is mounted on the component mounting section 4 together with the component supply section 3 and the component mounting section 4 for mounting electronic components on the printed board.
Is provided, and the component transfer section 20 for transferring the mounted printed circuit board to the post-process equipment B is provided, so that unmanned operation and continuous production are possible, and productivity can be greatly improved.

In the above-described embodiment, the case has been described in which the vibration feeder 30 is combined with the component supply unit 3 to continuously supply electronic components. However, the present invention is not limited to this. As shown in FIG. 3, a tape feeder 35 may be combined with the component supply unit 3. The tape feeder 35 has a component base 37 having a large number of electronic components taped on a fixed base 36 fixed to the component supply unit 3.
Is mounted, and the component train 37 is conveyed by a drive roller 38. Also in this case, the electronic components can be sequentially supplied to the pallet 3a, and the same effect as described above can be obtained.

In the above embodiment, the case where the electronic component is mounted on the printed circuit board has been described. However, the component mounting apparatus of the present invention is not limited to this, and can be applied to, for example, assembling of precision machine components. is there.

Further, in the above-mentioned component supply section,
Not only the above-described vibration feeder and tape feeder but also other continuous supply mechanisms such as a bulk feeder and an adhesive sheet feeder can be combined.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram for explaining a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view schematically showing a mounting operation of the component mounting apparatus.

FIG. 3 is a schematic diagram showing a component supply method according to another embodiment of the above embodiment.

FIG. 4 is a schematic view showing a conventional general component mounting operation.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component mounting device 3 Component supply part 4 Component mounting part 4a Printed circuit board (mounting target) 5 Vacuum suction nozzle (component holding mechanism) 6 Mounting head 7 Component imaging camera (component imaging means) 8, 11 Linear motor (drive means) 30 Vibration feeder 35 Tape feeder X Moving direction of component supply section and component mounting section Y Moving direction of mounting head Z Moving direction of suction nozzle

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Hozumi Nashima 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company Murata Manufacturing Co., Ltd. (72) Inventor Teruki Nishi 2-26-10 Tenjin, Nagaokakyo-city, Kyoto Stock (72) Inventor Masatoshi Kajiwara 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto F-term (reference) 5M313 AA01 AA11 AA15 AA23 CC03 CC04 DD31 DD41 EE02 EE03 EE24 EE25 EE33 EE37 FF24 FF26 FF28 FF29 FG04

Claims (1)

[Claims] 1. A component supply jig or a vibration feeder,
One or more of a bulk feeder, a tape feeder, and an adhesive sheet feeder are set in combination, and a component supply unit that is linearly reciprocally driven in a predetermined direction by a driving unit; And a component holding mechanism for linearly reciprocatingly driving the component supply unit in a direction parallel to the moving direction of the component supply unit, and a component holding mechanism for holding a component, wherein the drive unit moves the component supply unit and the component mounting unit. A mounting head that linearly reciprocates in a direction perpendicular to the direction, picks up a component set in the component supply unit, and mounts the component at a predetermined position on a mounting target set in the component mounting unit; Component imaging means for imaging a component held by a component holding mechanism of the mounting head while the mounting head is moving linearly; a component supply unit and a component mounting unit And a drive control means for controlling the driving of the mounting head, and an image processing means for calculating an image by the component imaging means.