JP2011249646A - Operating time adjusting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an operating time adjusting method capable of reducing power consumption.SOLUTION: The operating time adjusting method adjusts operating time of a circuit board production method having a plurality of operations that are performed in parallel with each other by apparatus 30 and 31 of different types. The operating time adjusting method includes a latest operation specification step for specifying the latest operation having the latest finish time out of the plurality of operations, and an operation delay step for delaying the finish time of other operations so that the time difference T1 between the finish time of the latest operation and the finish time of other operation is shortened.

Description

  The present invention relates to an operation time adjustment method performed when a circuit board is produced using, for example, an electronic component mounting machine or a screen printing machine.

  The electronic component mounter is used for mounting an electronic component on a circuit board. Conventionally, from the viewpoint of improving production capacity, the operation of each device (for example, a conveyor, an XY robot, etc.) constituting an electronic component mounting machine has been steadily increasing in speed.

  However, in recent years, in order to reduce the burden on the environment, energy saving of manufacturing facilities has begun to be emphasized. For this reason, in the production of circuit boards, it is necessary to reduce the power consumption of the equipment while maintaining the production capacity.

  Patent Document 1 discloses an electronic component mounting machine having two head units. In the mounting process of mounting the electronic component on the circuit board, each of the two head units performs a suction operation for sucking the electronic component from the component supply device and a mounting operation for mounting the sucked electronic component at a predetermined position on the circuit board. Execute alternately. When one head unit performs a mounting operation, the other head unit performs a suction operation.

  If a plurality of head units are simultaneously driven at high speed, power consumption increases. Therefore, in the case of the electronic component mounting machine of Patent Document 1, the moving speed of the suction operation of the other head unit when one head unit performs the mounting operation is slowed down. For this reason, it is possible to reduce power consumption while maintaining the number of component mounting points per unit time.

JP 2008-198737 A

  Both of the two head units perform the same operation (suction operation and mounting operation) by the same mechanism. The two head units are the same kind of devices. For this reason, in the case of the electronic component mounting machine of patent document 1, it is easy to divert the moving speed set with respect to the adsorption operation of one head unit to the adsorption operation of the other head unit. Therefore, it is easy to set the moving speed of the suction operation.

  Further, when comparing the suction operation and the mounting operation, it is clear that the mounting operation requires a longer time than the suction operation. For this reason, it is only necessary to assume a delay in the suction operation. That is, in the case of the electronic component mounting machine of Patent Document 1, it is not necessary to assume a case where the suction operation takes longer than the mounting operation. That is, it is not necessary to assume a delay in the mounting operation.

  As described above, when a plurality of operations (adsorption operation and mounting operation in the case of Patent Document 1) are performed by the same type of device (a head unit in the case of Patent Document 1), it is easy to delay the work that ends earlier. It is. For this reason, it is easy to reduce power consumption. On the other hand, when a plurality of operations are performed by different types of devices, it is difficult to delay the work that ends earlier. For this reason, it is difficult to reduce power consumption.

  However, in order to further reduce the power consumption during circuit board production, it is necessary to review not only the mounting process but also the power consumption of other processes. For this purpose, even if a plurality of operations are performed by different types of devices, it is necessary to delay the work to be completed earlier.

  The operation time adjustment method of the present invention has been completed in view of the above problems. An object of the present invention is to provide an operation time adjustment method capable of reducing power consumption even when a plurality of operations are performed by different apparatuses.

  (1) In order to solve the above problem, an operation time adjustment method of the present invention is an operation time adjustment method of a circuit board production method having a plurality of operations performed in parallel with each other by different devices, In order to reduce the time difference between the latest operation specifying step for specifying the latest operation with the latest end time, the end time of the latest operation, and the end time of the other operation. An operation delaying step of delaying the end time of the operation of the operation (corresponding to claim 1).

  In the circuit board production method, a plurality of operations are performed in parallel by different apparatuses. In other words, a plurality of operations are performed simultaneously in time series. The operation time adjustment method of the present invention includes a latest operation specifying step and an operation delay step. In the latest operation specifying step, the latest operation having the latest end time among the plurality of operations is specified. In the operation delaying step, the time difference between the end time of the latest operation and the end time of the operation other than the latest operation is reduced by delaying the end time of the operation other than the latest operation.

  According to the operation time adjustment method of the present invention, the end time of the latest operation is not delayed. For this reason, the production capacity of the circuit board can be maintained. On the other hand, the end time of operations other than the latest operation is delayed. For this reason, the moving speed of the apparatus that performs an operation other than the slowest operation can be reduced. Further, it is possible to reduce the acceleration and deceleration of a device that performs an operation other than the slowest operation. Therefore, according to the operation time adjustment method of the present invention, it is possible to reduce power consumption even though a plurality of operations are performed by different types of devices.

  Further, even when the order of completion of a plurality of operations changes depending on the specifications of a circuit board to be produced, the latest operation can be specified by the latest operation specifying step. For this reason, power consumption can be reduced not only when the slowest operation is always determined as a specific operation but also when the slowest operation changes.

  (2) Preferably, in the configuration of (1), the plurality of operations include at least a substrate transport operation for transporting and fixing a circuit board to a mounting area, and a suction nozzle that is moved to a suction position. It is better to have a configuration that includes a component tip gripping operation for sucking the electronic component by the suction nozzle (corresponding to claim 2).

  In this configuration, the operation time adjusting method of the present invention is used for an electronic component mounting machine. The substrate transfer operation is performed using, for example, a belt conveyor. On the other hand, the component tip gripping operation is performed using a suction nozzle, a moving device that moves the suction nozzle (for example, an XY robot that moves the suction nozzle in the horizontal direction), and the like.

  When the electronic component suction is started after the circuit board is carried in, the time required for the electronic component suction is downtime. Alternatively, when the circuit board loading is started after the electronic components are attracted, the time required for the circuit board loading is downtime. For this reason, the board conveying operation and the component tip gripping operation are performed in parallel with each other. According to this configuration, it is possible to reduce the power consumption required for the board transfer operation, the component tipping operation, or other operations performed in parallel with these operations.

  (3) Preferably, in the configuration of (1), the plurality of operations include at least a component moving operation for moving the electronic component to the suction position, and a component picking operation for moving the suction nozzle to the suction position; Is preferable.

  In this configuration, the operation time adjusting method of the present invention is used for an electronic component mounting machine. The component moving operation is performed using a component supply device such as a pallet unit. On the other hand, the component pick-up operation is performed using a moving device that moves the suction nozzle (for example, an XY robot that moves the suction nozzle in the horizontal direction).

  When the movement of the suction nozzle is started after the movement of the electronic component, the movement time of the suction nozzle becomes a downtime. Alternatively, when the movement of the electronic component is started after the suction nozzle is moved, the time required for the movement of the electronic component is downtime. For this reason, the component movement operation and the component pick-up operation are performed in parallel with each other. According to this configuration, it is possible to reduce power consumption required for the component movement operation, the component pick-up operation, or other operations performed in parallel with these operations.

  (4) Preferably, in the configuration of (1), the plurality of operations include a substrate transport operation for transporting and fixing a circuit board having a mark to at least a mounting area, and a mark imaging device for capturing the mark. Is preferably configured to include an imaging device moving operation for moving to the planned mark position when the circuit board arrives at the mounting area.

  In this configuration, the operation time adjusting method of the present invention is used for an electronic component mounting machine. The substrate transfer operation is performed using, for example, a belt conveyor. On the other hand, the imaging apparatus moving operation is performed using a moving apparatus that moves the mark imaging apparatus (for example, an XY robot that moves the mark imaging apparatus in the horizontal direction).

  When the movement of the mark imaging device is started after the circuit board is carried in, the time required for the movement of the mark imaging device is downtime. Alternatively, when the circuit board loading is started after the mark imaging apparatus is moved, the time required for loading the circuit board is downtime. For this reason, the substrate transport operation and the imaging device moving operation are performed in parallel with each other. According to this configuration, it is possible to reduce power consumption required for the substrate transport operation, the imaging apparatus moving operation, or other operations performed in parallel with these operations.

  (5) Preferably, in the configuration of (1), the plurality of operations include at least a first component mounting operation of mounting an electronic component on the first circuit board in the first mounting area of the first lane, It is better to have a configuration including a second substrate transport operation for transporting and fixing the second circuit board to the second mounting area of two lanes.

  In this configuration, the operation time adjusting method of the present invention is used for an electronic component mounting machine. The first component mounting operation is performed using, for example, a suction nozzle and a moving device that moves the suction nozzle (for example, an XY robot that moves the suction nozzle in the horizontal direction). On the other hand, the second substrate transfer operation is performed using, for example, a belt conveyor.

  When carrying in of the second circuit board is started after mounting the electronic components on the first circuit board, the time required for carrying in the second circuit board becomes downtime. Alternatively, when the mounting of the electronic component on the first circuit board is completed after the second circuit board is carried in, the time required for mounting the electronic component is downtime. For this reason, the first component mounting operation and the second substrate carrying operation are performed in parallel with each other. According to this configuration, it is possible to reduce power consumption required for the first component mounting operation, the second substrate transfer operation, or other operations performed in parallel with these operations.

  (6) Preferably, in the configuration of (1), the plurality of operations include at least an image processing operation for performing image processing based on imaging data of an electronic component, and an adsorption that sucks the captured electronic component. A component feed start operation for starting the nozzle toward the mounting position of the electronic component when the circuit board arrives in the mounting area, and after the latest operation is finished, the result of the image processing It is better to change the destination of the suction nozzle from the planned mounting position to the correction position based on the above and move the suction nozzle to the correction position.

  In this configuration, the operation time adjusting method of the present invention is used for an electronic component mounting machine. The image processing operation is performed using, for example, a component imaging device such as a parts camera or an image processing device. On the other hand, the component feeding start operation is performed using a moving device that moves the suction nozzle (for example, an XY robot that moves the suction nozzle in the horizontal direction).

  When the component feeding is started after the image processing, the time required to move the suction nozzle to the correction position is downtime. Alternatively, when the image processing is started after the parts are fed, the time required for the image processing and the time required for moving the suction nozzle from the planned mounting position to the correction position are downtime. For this reason, the image processing operation and the component feeding start operation are performed in parallel with each other. According to this configuration, it is possible to reduce power consumption required for the image processing operation, the component feed start operation, or other operations performed in parallel with these operations.

  (7) Preferably, in the configuration of the above (1), the plurality of operations include at least a film forming operation for forming a flux film at a dip position and an adsorption nozzle that sucks an electronic component immediately above the dip position. It is better to have a configuration that includes a dip component feeding operation that moves the dip.

  In this configuration, the operation time adjusting method of the present invention is used for an electronic component mounting machine. The film forming operation is performed using a dip flux unit. On the other hand, the dip component feeding operation is performed using a moving device that moves the suction nozzle (for example, an XY robot that moves the suction nozzle in the horizontal direction).

  When the movement of the suction nozzle is started after the formation of the flux film, the time required for the movement of the suction nozzle is downtime. Alternatively, when the formation of the flux film is started after the suction nozzle is moved, the time required for forming the flux film is downtime. For this reason, the film forming operation and the dip component feeding operation are performed in parallel with each other. According to this configuration, it is possible to reduce power consumption required for the film forming operation, the dip component feeding operation, or other operations performed in parallel with these operations.

  (8) Preferably, in the configuration of (1), the plurality of operations include at least a receiving preparation operation in which a disposal unit secures a disposal position for receiving an electronic component to be discarded, and the electronic component. It is better to have a configuration that includes a sucking nozzle feeding operation for moving the sucked suction nozzle to the disposal position.

  In this configuration, the operation time adjusting method of the present invention is used for an electronic component mounting machine. The acceptance preparation operation is performed using a discard unit such as an NG parts discharge unit or a tray unit. On the other hand, the disposal component feeding operation is performed using a suction nozzle, a moving device that moves the suction nozzle (for example, an XY robot that moves the suction nozzle in the horizontal direction), and the like.

  When the movement of the suction nozzle is started after completion of the acceptance state, the time required for the movement of the suction nozzle becomes a downtime. Alternatively, when the adjustment of the acceptance posture of the electronic component is started after the suction nozzle is moved, the time required for the preparation of the acceptance posture is downtime. For this reason, the acceptance preparation operation and the disposal component feeding operation are performed in parallel with each other. According to this configuration, it is possible to reduce power consumption required for the reception preparation operation, the disposal component feeding operation, or other operations performed in parallel with these operations.

  According to the present invention, it is possible to provide an operation time adjustment method capable of reducing power consumption even when a plurality of operations are performed by different apparatuses.

It is a perspective view of the electronic component mounting machine with which the operation time adjustment method of 1st embodiment is used. It is a top view of the same electronic component mounting machine. It is a block diagram of the same electronic component mounting machine. (A) is a timing chart before operation time adjustment of a board | substrate conveyance operation | movement and a component tip gripping operation | movement. (B) is a timing chart after adjusting the operation time of the board conveying operation and the component tip gripping operation. (A) is a timing chart before operation time adjustment of component movement operation and component pick-up operation. (B) is a timing chart of the component movement operation and the component pick-up operation after adjusting the operation time. (A) is a timing chart before operation time adjustment of a board | substrate conveyance operation and an imaging device movement operation. (B) is a timing chart after adjustment of the operation time of the substrate transport operation and the imaging apparatus moving operation. (A) is a timing chart before operation time adjustment of the first component mounting operation and the second substrate carrying operation. (B) is a timing chart after the operation time adjustment of the first component mounting operation and the second substrate carrying operation. (A) is a timing chart before the operation time adjustment of the image processing operation and the component feeding start operation. (B) is a timing chart after adjusting the operation time of the image processing operation and the component feeding start operation. (A) is a timing chart before the operation time adjustment of the film forming operation and the dip component feeding operation. (B) is a timing chart after adjusting the operation time of the film forming operation and the dip component feeding operation. (A) is a timing chart before operation time adjustment of an acceptance preparation operation and a disposal component feeding operation. (B) is a timing chart after the operation time adjustment of the acceptance preparation operation and the disposal component feeding operation.

  Hereinafter, an embodiment in which the operation time adjusting method of the present invention is used in an electronic component mounting machine will be described.

<< First Embodiment >>
In the present embodiment, the board transfer operation and the component tip gripping operation are adjusted.

<Mechanical configuration of electronic component mounting machine>
First, the mechanical configuration of the electronic component mounting machine will be described. FIG. 1 is a perspective view of an electronic component mounting machine in which the operation time adjusting method of this embodiment is used. FIG. 2 shows a top view of the electronic component mounting machine. In FIG. 1, the base 2 and the housing of the module 3 are shown through. In FIG. 2, the housing of the module 3 is omitted. Further, the Y-direction slider 310, the Y-direction guide rail 312 and the X-direction guide rail 313 are indicated by alternate long and short dash lines.

  As shown in FIGS. 1 and 2, the electronic component mounting machine 1 includes a base 2, a module 3, a tray unit 4, a dip flux unit 5, an NG parts discharge unit 6, and a carriage 9. Yes. The base 2 is arranged on the floor F of the factory.

[Module 3]
The module 3 includes a substrate transfer device 30, an XY robot 31, a mounting head 32, a mark camera 33, and a parts camera 34. A plurality of electronic component mounting machines (not shown) are arranged in series on the left and right sides of the electronic component mounting machine 1.

(Substrate transfer device 30)
The substrate transfer device 30 includes a fixed wall 300, a front movable wall 301f, a rear movable wall 301r, a first backup table 302f, a second backup table 302r, a pair of left and right guide rails 303L and 303R, and a first transfer. A conveyor 304f, a second conveyor 304r, and a base 305 are provided.

  The base 305 has a rectangular plate shape. The base 305 is disposed on the upper surface of the base 2. Each of the pair of left and right guide rails 303L and 303R extends in the front-rear direction. The pair of left and right guide rails 303L and 303R are spaced apart from the left and right edges of the upper surface of the base 305.

  The fixed wall 300 is erected on the upper front edge of the base 305. The fixed wall 300 has a C-shaped plate shape that opens downward. The C-shaped ends of the fixed wall 300 are connected to the front ends of a pair of left and right guide rails 303L and 303R.

  The front movable wall 301f is disposed behind the fixed wall 300. The front movable wall 301f has a C-shaped plate shape that opens downward. The C-shaped ends of the front movable wall 301f are attached to a pair of left and right guide rails 303L and 303R so as to be slidable in the front-rear direction. A first lane L1 is defined between the fixed wall 300 and the front movable wall 301f.

  The rear movable wall 301r is disposed behind the front movable wall 301f. The rear movable wall 301r has a C-shaped plate shape that opens downward. The C-shaped ends of the rear movable wall 301r are attached to a pair of left and right guide rails 303L and 303R so as to be slidable in the front-rear direction. A second lane L2 is defined between the front movable wall 301f and the rear movable wall 301r.

  Thus, the front movable wall 301f and the rear movable wall 301r are movable in the front-rear direction. For this reason, the conveyance width of the first lane L1 and the conveyance width of the second lane L2 can each be expanded or reduced.

  The first transport conveyor 304f includes a pair of front and rear conveyor belts. Each of the pair of front and rear conveyor belts extends in the left-right direction. The front conveyor belt is disposed on the rear surface of the fixed wall 300. The rear conveyor belt is disposed on the front surface of the front movable wall 301f. The first circuit board B1 is installed on the pair of front and rear conveyor belts. The first circuit board B1 is transported from the left to the right on the first lane L1 by the first transport conveyor 304f.

  The second conveyor 304r includes a pair of front and rear conveyor belts. Each of the pair of front and rear conveyor belts extends in the left-right direction. The front conveyor belt is disposed on the rear surface of the front movable wall 301f. The rear conveyor belt is disposed in front of the rear movable wall 301r. A second circuit board B2 is installed on the pair of front and rear conveyor belts. The second circuit board B2 is transported from the left to the right on the second lane L2 by the second transport conveyor 304r.

  The first backup table 302f has a rectangular plate shape. The first backup table 302f is disposed below the first circuit board B1. The first backup table 302f can be moved up and down. A large number of backup pins are arranged on the upper surface of the first backup table 302f. In the first mounting area A1, the first circuit board B1 is supported from below by a number of backup pins.

  The second backup table 302r has a rectangular plate shape. The second backup table 302r is disposed below the second circuit board B2. The second backup table 302r can be moved up and down. A large number of backup pins are arranged on the upper surface of the second backup table 302r. In the second mounting area A2, the second circuit board B2 is supported from below by a number of backup pins.

(XY robot 31)
The X direction corresponds to the left-right direction. The Y direction corresponds to the front-rear direction. The XY robot 31 includes a Y direction slider 310, an X direction slider 311, a pair of left and right Y direction guide rails 312, and a pair of upper and lower X direction guide rails 313.

  The pair of left and right Y-direction guide rails 312 are disposed on the upper surface of the housing internal space of the module 3. Each of the pair of left and right Y-direction guide rails 312 extends in the front-rear direction. The Y-direction slider 310 has a long block shape in the left-right direction. The Y-direction slider 310 is attached to a pair of left and right Y-direction guide rails 312 so as to be slidable in the front-rear direction.

  The pair of upper and lower X-direction guide rails 313 is disposed on the front surface of the Y-direction slider 310. The X direction slider 311 has a rectangular plate shape. The X-direction slider 311 is attached to a pair of upper and lower X-direction guide rails 313 so as to be slidable in the left-right direction.

(Mounting head 32)
The mounting head 32 is attached to the X direction slider 311. For this reason, the mounting head 32 can be moved in the front-rear and left-right directions by the XY robot 31. Further, the mounting head 32 can slide downward with respect to the X-direction slider 311. A cylindrical holder (not shown) projects from the lower surface of the mounting head 32. The holder is rotatable about the axis. A suction nozzle 320 is attached to the holder. A negative pressure or a positive pressure is supplied to the suction nozzle 320 via a pipe (not shown).

(Mark camera 33, parts camera 34)
The mark camera 33 is attached to the mounting head 32. As shown in FIG. 2, fiducial marks B10 and B20 for positioning are printed on the first circuit board B1 and the second circuit board B2. The mark camera 33 is used for imaging the fiducial marks B10 and B20. The parts camera 34 is disposed in front of the fixed wall 300. The parts camera 34 is used for imaging the electronic component sucked by the suction nozzle 320.

[Car 9, tray unit 4]
The carriage 9 can move on the floor F of the factory by means of wheels 90. The carriage 9 is fixed to the front surface of the base 2. The tray unit 4 is mounted on the carriage 9. The tray unit 4 includes a case 40, a magazine 41 (shown by a dotted line in FIG. 2), and a shuttle conveyor 42.

  The case 40 has a rectangular box shape that is long in the vertical direction. A tray outlet (not shown) is opened on the rear surface of the case 40. The magazine 41 has a rectangular box shape. The magazine 41 is accommodated inside the case 40. The magazine 41 can be moved up and down. A large number of trays 410 are stacked in the vertical direction inside the magazine 41. A large number of electronic components are mounted on the large number of trays 410, respectively. The shuttle conveyor 42 extends behind the case 40. The shuttle conveyor 42 is connected to the tray outlet.

  In this manner, by moving the magazine 41 up and down, the tray 410 on which desired electronic components are mounted can be taken out from the case 40. Further, the tray 410 can be sent backward by the shuttle conveyor 42.

[Dip flux unit 5]
The dip flux unit 5 is disposed on the right side of the tray unit 4. The dip flux unit 5 includes a rotary table 50 and a squeegee 51. The rotary table 50 has a disk shape. The rotary table can rotate around an axis. A flux (not shown) is supplied to the upper surface of the rotary table 50. The squeegee 51 is disposed above the rotary table 50. When the rotary table 50 supplied with the flux is rotated, the squeegee 51 spreads the flux over substantially the entire upper surface of the rotary table 50. For this reason, a flux film (not shown) having a substantially constant film thickness is formed on the upper surface of the rotary table 50.

[NG parts discharge unit 6]
The NG parts discharge unit 6 is disposed on the left side of the tray unit 4. The NG parts discharge unit 6 includes a discharge conveyor 60. A defective electronic component is placed on the discharge conveyor 60 by the suction nozzle 320. The placed electronic components are discharged by the discharge conveyor 60 to the front of the tray unit 4, that is, outside the apparatus.

<Electrical configuration of electronic component mounting machine>
Next, the electrical configuration of the electronic component mounting machine will be described. FIG. 3 shows a block diagram of an electronic component mounter in which the operation time adjustment method of this embodiment is used. As shown in FIG. 3, the electronic component mounting machine 1 includes a control device 7 and an image processing device 8 in addition to the devices and units described above. The control device 7 includes a computer 70 and a plurality of drive circuits. The computer 70 includes an input / output interface 700, a calculation unit 701, and a storage unit 702.

  The input / output interface 700 is connected to a magazine lift motor 49a of the tray unit 4, a shuttle conveyor motor 49b, a transfer width change motor 309a of the substrate transfer device 30, a transfer conveyor motor 309b, a table lift motor 309c, via a drive circuit, respectively. Carry-in sensor 309d, discharge conveyor motor 69a of NG parts discharge unit 6, table rotation motor 59a of dip flux unit 5, X-axis motor 319a of XY robot 31, Y-axis motor 319b, Z-axis of mounting head 32 (corresponding to the vertical direction) ) A motor 329a and a θ axis (corresponding to the horizontal rotation direction) motor 329b are electrically connected. The motors, sensors, and drive circuits of the substrate transport apparatus 30 are arranged two by two for the first lane L1 and for the second lane L2. Further, the image processing apparatus 8 is electrically connected to the input / output interface 700. A mark camera 33 and a parts camera 34 are electrically connected to the image processing apparatus 8.

  Signals from the respective devices and units of the electronic component mounting machine 1 are intensively transmitted to the computer 70. The storage unit 702 stores various programs such as production programs necessary for mounting electronic components. The computing unit 701 calculates the time required to produce one circuit board based on the production program. As a result, the calculation unit 701 sets the moving speed, acceleration, deceleration, and the like of each device or each unit. At this time, the calculation unit 701 adjusts the operation time as described later.

<Operation time adjustment method>
Next, the operation time adjustment method of this embodiment will be described. The following description relates to the first lane L1, but the same applies to the second lane L2.

  The first circuit board B1 is transferred from another electronic component mounting machine on the upstream side to the electronic component mounting machine 1 of the present embodiment. On the other hand, the electronic component to be mounted on the first circuit board B1 first has already been determined according to the type of the first circuit board B1 to be delivered. For this reason, it is possible to pick up electronic components with the suction nozzle 320 before the first circuit board B1 arrives at the first mounting area A1. In such a case, the board transfer operation and the component tip gripping operation are adjusted.

[Substrate transport operation]
As shown in FIG. 2, the board conveying operation is an operation for carrying the first circuit board B1 into the first mounting area A1 and fixing it. First, as illustrated in FIG. 3, the control device 7 drives the transport conveyor motor 309 b of the substrate transport device 30. Then, the first conveyer 304f shown in FIG. 1 is moved to move the first circuit board B1 shown in FIG. 2 to the first mounting area A1.

  Next, as shown in FIG. 3, the control device 7 drives the table elevating motor 309 c of the substrate transfer device 30. Then, as shown in FIG. 1, the first backup table 302f is raised, and the first circuit board B1 is raised by a predetermined amount. Then, the first circuit board B1 is fixed.

  As shown in FIG. 2, the time required for the substrate transport operation is the time from when the first circuit board B1 passes through the entrance P1 until it reaches the first mounting area A1 and is fixed. Note that the information that “the first circuit board B1 has passed through the inlet P1” is detected by the carry-in sensor 309d and transmitted to the computer 70, as shown in FIG.

[Part gripping operation]
As shown in FIG. 2, the component tip gripping operation is an operation in which the mounting head 32, that is, the suction nozzle 320 is moved to the suction position P2, and the electronic component at the suction position P2 is sucked by the suction nozzle 320. First, as shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the suction nozzle 320 is moved to the suction position P2.

  Next, as shown in FIG. 3, the control device 7 drives the Z-axis motor 329 a of the mounting head 32. Then, as shown in FIG. 1, the suction nozzle 320 is lowered. Then, a negative pressure is supplied to the suction nozzle 320, and the suction nozzle 320 sucks the electronic component at the suction position P2.

  In addition, after both the board transfer operation and the component tip gripping operation are completed, the component mounting operation is performed. That is, the electronic component sucked by the component tip gripping operation is mounted on the first circuit board B1 fixed to the first mounting area A1 by the substrate transporting operation.

[Adjustment of operating time]
FIG. 4A shows a timing chart of the substrate transport operation and the component tip gripping operation before adjusting the operation time. FIG. 4B shows a timing chart after adjusting the operation time of the board conveying operation and the component tip gripping operation. The operation time adjustment method includes a latest operation specifying step and an operation delay step.

(Slowest motion identification process)
In this step, as shown in FIG. 3, the calculation unit 701 calculates the timing for performing the substrate transport operation and the time required for the substrate transport operation. Further, the calculation unit 701 calculates the timing for performing the component tip gripping operation and the time required for the component tip gripping operation. Further, a time difference T1 between the end time of the board conveying operation and the end time of the component tip gripping operation is calculated. As a result, as shown in FIG. 4A, the calculation unit 701 recognizes that the board transfer operation ends later than the component tip gripping operation. That is, it is determined that the substrate transfer operation is the latest operation.

(Operation delay process)
In this step, as shown in FIG. 4B, the end time of the component tip gripping operation is delayed. That is, the time difference T1 is set to substantially zero. Specifically, the movement speeds of the XY robot 31 and the mounting head 32 are slowed down. Further, the acceleration and deceleration of the XY robot 31 and the mounting head 32 are reduced.

  In the above example, the case has been described in which the board conveying operation is completed later than the component first gripping operation. When the component tip gripping operation ends later than the substrate transfer operation, the end time of the substrate transfer operation is delayed. Specifically, the moving speeds of the first transfer conveyor 304f and the first backup table 302f are decreased. Further, the acceleration and deceleration of the first transfer conveyor 304f and the first backup table 302f are reduced.

<Effect>
Next, the effect of the operation time adjustment method of this embodiment will be described. According to the operation time adjustment method of the present embodiment, as shown in FIGS. 4A and 4B, the end time of the substrate transfer operation which is the latest operation is not delayed. For this reason, the production capacity of the first circuit board B1 can be maintained. On the other hand, the end time of the component first grabbing operation that is not the latest operation is delayed. For this reason, the moving speed of the XY robot 31 and the mounting head 32 can be slowed down. Further, the acceleration and deceleration of the XY robot 31 and the mounting head 32 can be reduced. Therefore, according to the operation time adjustment method of this embodiment, the power consumption of the electronic component mounting machine 1 can be reduced.

<< Second Embodiment >>
In the present embodiment, the component movement operation and the component pick-up operation of the electronic component mounter of the first embodiment are adjusted. Here, only differences from the first embodiment will be described with reference to FIGS.

  The electronic components are supplied from the tray unit 4 to the suction position P2 together with the tray 410. The electronic component at the suction position P2 is taken out by the suction nozzle 320. In such a case, the component movement operation and the component pickup operation are adjusted.

<Operation time adjustment method>
First, the operation time adjustment method of this embodiment will be described. The following description relates to the first lane L1, but the same applies to the second lane L2.

[Part movement operation]
The component moving operation is an operation of moving the electronic component to the suction position P2, as shown in FIG. First, as shown in FIG. 3, the magazine elevating motor 49 a of the tray unit 4 is driven by the control device 7. Then, as shown in FIG. 2, the magazine 41 is moved up and down so that the height of the tray 410 on which desired electronic components are mounted and the height of the tray outlet of the case 40 are aligned.

  Next, as shown in FIG. 3, the control device 7 drives the shuttle conveyor motor 49 b of the tray unit 4. Then, as shown in FIG. 2, the shuttle conveyor 42 is moved rearward, and the tray 410, that is, the desired electronic component is moved to the suction position P2.

[Part picking operation]
The component pick-up operation is an operation of moving the mounting head 32, that is, the suction nozzle 320 to the suction position P2, as shown in FIG. As shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the suction nozzle 320 is moved to the suction position P2.

  Note that after both the component movement operation and the component pick-up operation are completed, a component suction operation is performed. That is, the electronic component set at the suction position P2 by the component moving operation is sucked by the suction nozzle 320 that has been moved to the suction position P2 by the component pick-up operation.

[Adjustment of operating time]
FIG. 5A shows a timing chart of the component movement operation and the component pick-up operation before adjusting the operation time. FIG. 5B shows a timing chart of the component movement operation and the component pick-up operation after adjusting the operation time. The operation time adjustment method includes a latest operation specifying step and an operation delay step.

(Slowest motion identification process)
In this step, as shown in FIG. 3, the calculation unit 701 calculates the timing for performing the component moving operation and the time required for the component moving operation. In addition, the calculation unit 701 calculates the timing for performing the component pick-up operation and the time required for the component pick-up operation. Further, a time difference T2 between the end time of the component movement operation and the end time of the component pick-up operation is calculated. As a result, as shown in FIG. 5A, the calculation unit 701 recognizes that the component moving operation ends later than the component pick-up operation. That is, it is determined that the component moving operation is the latest operation.

(Operation delay process)
In this step, as shown in FIG. 5B, the end time of the component pick-up operation is delayed. That is, the time difference T2 is set to substantially zero. Specifically, the moving speed of the XY robot 31 is slowed down. Further, the acceleration and deceleration of the XY robot 31 are reduced.

  In the above example, the case where the component movement operation ends later than the component pickup operation has been described. When the component picking-up operation ends later than the component moving operation, the end time of the component moving operation is delayed. Specifically, the moving speed of the magazine 41 and the shuttle conveyor 42 is slowed down. Further, the acceleration and deceleration of the magazine 41 and the shuttle conveyor 42 are reduced.

<Effect>
Next, the effect of the operation time adjustment method of this embodiment will be described. According to the operation time adjustment method of the present embodiment, as shown in FIGS. 5A and 5B, the end time of the component movement operation that is the latest operation is not delayed. For this reason, the production capacity of the first circuit board B1 can be maintained. On the other hand, the end time of the component pick-up operation that is not the latest operation is delayed. For this reason, the moving speed of the XY robot 31 can be slowed down. Further, the acceleration and deceleration of the XY robot 31 can be reduced. Therefore, according to the operation time adjustment method of this embodiment, the power consumption of the electronic component mounting machine 1 can be reduced.

<< Third embodiment >>
In the present embodiment, the substrate carrying operation and the imaging device moving operation of the electronic component mounting machine of the first embodiment are adjusted. Here, only differences from the first embodiment will be described with reference to FIGS.

  In order to accurately mount the electronic component on the first circuit board B1, the first circuit board B1 needs to be accurately arranged in the first mounting area A1. The state of the first circuit board B1 in the first mounting area A1 is recognized by imaging the fiducial mark B10 with the mark camera 33. In such a case, the substrate transfer operation and the imaging device moving operation are adjusted.

<Operation time adjustment method>
First, the operation time adjustment method of this embodiment will be described. The following description relates to the first lane L1, but the same applies to the second lane L2.

[Substrate transport operation]
The substrate transfer operation is the same as in the first embodiment. The first circuit board B1 is transferred to the first mounting area A1 by the board transfer operation.

[Imaging device moving operation]
As shown in FIG. 2, the image pickup apparatus moving operation refers to the mounting head 32 up to the planned mark position P3 (the planned arrival position of the fiducial mark B10) when the first circuit board B1 arrives in the first mounting area A1. That is, this is an operation for moving the mark camera 33. As shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the mark camera 33 is moved to the planned mark position P3.

  Note that the mark imaging operation is performed after both the substrate transport operation and the imaging apparatus moving operation are completed. That is, the fiducial mark B10 of the first circuit board B1 fixed to the first mounting area A1 by the substrate transporting operation is imaged by the mark camera 33 that has moved to the planned mark position P3 by the imaging device moving operation. Then, the state of the first circuit board B1 is confirmed.

[Adjustment of operating time]
FIG. 6A shows a timing chart of the substrate transfer operation and the imaging device moving operation before adjusting the operation time. FIG. 6B shows a timing chart of the substrate transport operation and the imaging apparatus moving operation after adjusting the operation time. The operation time adjustment method includes a latest operation specifying step and an operation delay step.

(Slowest motion identification process)
In this step, as shown in FIG. 3, the calculation unit 701 calculates the timing for performing the substrate transport operation and the time required for the substrate transport operation. Further, the calculation unit 701 calculates the timing for performing the imaging apparatus moving operation and the time required for the imaging apparatus moving operation. In addition, a time difference T3 between the end time of the substrate transfer operation and the end time of the imaging device moving operation is calculated. As a result, as shown in FIG. 6A, the calculation unit 701 recognizes that the substrate transport operation ends later than the imaging device moving operation. That is, it is determined that the substrate transfer operation is the latest operation.

(Operation delay process)
In this step, as shown in FIG. 6B, the end time of the imaging device moving operation is delayed. That is, the time difference T3 is set to substantially zero. Specifically, the moving speed of the XY robot 31 is slowed down. Further, the acceleration and deceleration of the XY robot 31 are reduced.

  In the above example, the case has been described in which the substrate transfer operation ends later than the imaging device moving operation. When the imaging apparatus moving operation ends later than the substrate transfer operation, the end time of the substrate transfer operation is delayed. Specifically, the moving speeds of the first transfer conveyor 304f and the first backup table 302f are decreased. Further, the acceleration and deceleration of the first transfer conveyor 304f and the first backup table 302f are reduced.

<Effect>
Next, the effect of the operation time adjustment method of this embodiment will be described. According to the operation time adjustment method of the present embodiment, as shown in FIGS. 6A and 6B, the end time of the substrate transfer operation which is the latest operation is not delayed. For this reason, the production capacity of the first circuit board B1 can be maintained. In contrast, the end time of the imaging device moving operation that is not the latest operation is delayed. For this reason, the moving speed of the XY robot 31 can be slowed down. Further, the acceleration and deceleration of the XY robot 31 can be reduced. Therefore, according to the operation time adjustment method of this embodiment, the power consumption of the electronic component mounting machine 1 can be reduced.

<< Fourth Embodiment >>
In the present embodiment, the first component mounting operation and the second substrate carrying operation of the electronic component mounting machine of the first embodiment are adjusted. Here, only differences from the first embodiment will be described with reference to FIGS.

  When a circuit board is produced on a single lane, the operation of mounting electronic components on the circuit board cannot be performed while the circuit board is carried into the mounting area or while the circuit board is carried out of the mounting area. Therefore, the electronic component mounter 1 is dual lane so that the electronic component mounting operation can be performed even while the board is being transported. That is, a circuit board (first circuit board B1 and second circuit board B2) is produced using two lanes (first lane L1 and second lane L2). Specifically, the circuit board is produced by moving the mounting head 32 back and forth between the first mounting area A1 and the second mounting area A2. In such a case, the first component mounting operation and the second substrate carrying operation are adjusted.

<Operation time adjustment method>
First, the operation time adjustment method of this embodiment will be described.

[First component mounting operation]
As shown in FIG. 2, the first component mounting operation is an operation of mounting an electronic component on the first circuit board B1 in the first mounting area A1 of the first lane L1. First, as shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the mounting head 32, that is, the suction nozzle 320 is moved to the suction position P2.

  Next, as shown in FIG. 3, the control device 7 drives the Z-axis motor 329 a of the mounting head 32. Then, as shown in FIG. 1, the suction nozzle 320 is lowered. Then, a negative pressure is supplied to the suction nozzle 320, and the suction nozzle 320 sucks the electronic component at the suction position P2.

  Thereafter, as shown in FIG. 3, the control device 7 drives the Z-axis motor 329 a of the mounting head 32. Then, as shown in FIG. 1, the suction nozzle 320 is raised. Subsequently, as shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the suction nozzle 320 is moved to the first mounting position P4 of the first circuit board B1.

  Then, as shown in FIG. 3, the Z-axis motor 329 a of the mounting head 32 is driven by the control device 7. Then, as shown in FIG. 1, the suction nozzle 320 is lowered. Finally, positive pressure is supplied to the suction nozzle 320, and the electronic component is mounted at the first mounting position P4 by the suction nozzle 320. In the first component mounting operation, the above series of operations is repeatedly executed until a desired number of electronic components can be mounted.

[Second substrate transfer operation]
The second substrate transfer operation is the same as the substrate transfer operation of the first embodiment. First, the second conveyor 304r shown in FIG. 1 is moved to move the second circuit board B2 shown in FIG. 2 to the second mounting area A2. Next, the second backup table 302r is raised, and the second circuit board B2 is raised by a predetermined amount. Then, the second circuit board B2 is fixed.

  As shown in FIG. 2, the time required for the second substrate transport operation is the time from when the second circuit board B2 passes through the entrance P1 until it reaches the second mounting area A2 and is fixed. Note that the information that “the second circuit board B2 has passed through the inlet P1” is detected by the carry-in sensor 309d and transmitted to the computer 70, as shown in FIG.

  Note that after both the first component mounting operation and the second substrate carrying operation are completed, the second component mounting operation is performed. That is, the electronic component is mounted on the second circuit board B2 fixed to the second mounting area A2 by the second substrate transfer operation by the suction nozzle 320 after the first component mounting operation is completed.

[Adjustment of operating time]
FIG. 7A shows a timing chart of the first component mounting operation and the second substrate carrying operation before the operation time adjustment. FIG. 7B shows a timing chart after adjusting the operation time of the first component mounting operation and the second substrate carrying operation. The operation time adjustment method includes a latest operation specifying step and an operation delay step.

(Slowest motion identification process)
In this step, as shown in FIG. 3, the calculation unit 701 calculates the timing for performing the first component mounting operation and the time required for the first component mounting operation. In addition, the calculation unit 701 calculates the timing for performing the second substrate transport operation and the time required for the second substrate transport operation. Further, a time difference T4 between the end time of the first component mounting operation and the end time of the second substrate carrying operation is calculated. As a result, as shown in FIG. 7A, the calculation unit 701 recognizes that the first component mounting operation ends later than the second substrate carrying operation. That is, it is determined that the first component mounting operation is the latest operation.

(Operation delay process)
In this step, as shown in FIG. 7B, the end time of the second substrate transfer operation is delayed. That is, the time difference T4 is set to substantially zero. Specifically, the moving speeds of the second conveyor 304r and the second backup table 302r are decreased. Further, the acceleration and deceleration of the second transfer conveyor 304r and the second backup table 302r are reduced.

  In the above example, the case where the first component mounting operation ends later than the second substrate carrying operation has been described. When the second substrate transfer operation ends later than the first component mounting operation, the end time of the first component mounting operation is delayed. Specifically, the movement speeds of the XY robot 31 and the mounting head 32 are slowed down. Further, the acceleration and deceleration of the XY robot 31 and the mounting head 32 are reduced.

<Effect>
Next, the effect of the operation time adjustment method of this embodiment will be described. According to the operation time adjustment method of the present embodiment, as shown in FIGS. 7A and 7B, the end time of the first component mounting operation which is the latest operation is not delayed. For this reason, the production capacity of the first circuit board B1 and the second circuit board B2 can be maintained. In contrast, the end time of the second substrate transfer operation that is not the latest operation is delayed. For this reason, the moving speed of the 2nd conveyance conveyor 304r and the 2nd backup table 302r can be made slow. Further, the acceleration and deceleration of the second transport conveyor 304r and the second backup table 302r can be reduced. Therefore, according to the operation time adjustment method of this embodiment, the power consumption of the electronic component mounting machine 1 can be reduced.

<< Fifth Embodiment >>
In the present embodiment, the image processing operation and the component feeding start operation of the electronic component mounter of the first embodiment are adjusted. Here, only differences from the first embodiment will be described with reference to FIGS.

  The planned mounting position P6 of the electronic component on the first circuit board B1 is determined in advance. However, the planned mounting position P6 is set on the assumption that the center of the suction nozzle 320 and the center of gravity of the sucked electronic component match. For this reason, depending on the suction state of the electronic component with respect to the suction nozzle 320, it is necessary to change the destination of the suction nozzle 320 from the planned mounting position P6 to the correction position P9. For example, when the electronic component is sucked by ΔY with respect to the center of the suction nozzle 320, the center of the suction nozzle 320 is not set at the correction position P9 shifted by ΔY instead of the planned mounting position P6. An electronic component cannot be mounted at the planned mounting position P6. For this reason, the electronic component sucked by the suction nozzle 320 is picked up by the parts camera 34, and the image is processed by the image processing device 8. On the other hand, the electronic component after image processing needs to be conveyed from the component imaging position P5 to the planned mounting position P6. In such a case, the image processing operation and the component feeding start operation are adjusted.

<Operation time adjustment method>
First, the operation time adjustment method of this embodiment will be described. The following description relates to the first lane L1, but the same applies to the second lane L2.

[Image processing operation]
The image processing operation is an operation in which an image of an electronic component sucked by the suction nozzle 320 shown in FIG. 2 is picked up by the parts camera 34 and the image is processed by the image processing device 8 shown in FIG. By the image processing operation, the suction state of the electronic component with respect to the suction nozzle 320 is confirmed.

[Part feed start operation]
As shown in FIG. 2, the component feed start operation refers to the mounting head 32, that is, the suction nozzle, from the component imaging position P5 directly above the parts camera 34 toward the preset mounting position P6 of the first circuit board B1. 320 is an operation of starting 320. As shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the suction nozzle 320 is started toward the planned mounting position P6.

  After both the image processing operation and the component feeding start operation are completed, a correction operation is performed. That is, the suction nozzle 320 that is moving toward the mounting position P6 is moved by the component feed start operation to the correction position P9 corrected by the image processing operation. That is, the destination of the suction nozzle 320 is changed from the planned mounting position P6 to the correction position P9.

[Adjustment of operating time]
FIG. 8A shows a timing chart of the image processing operation and the component feed start operation before adjusting the operation time. FIG. 8B shows a timing chart of the image processing operation and the component feed start operation after adjusting the operation time. The operation time adjustment method includes a latest operation specifying step and an operation delay step.

(Slowest motion identification process)
In this step, as shown in FIG. 3, the calculation unit 701 calculates the timing for performing the image processing operation and the time required for the image processing operation. In addition, the calculation unit 701 calculates the timing for performing the component feed start operation and the time required for the component feed start operation. Further, a time difference T3 between the end time of the image processing operation and the end time of the component feed start operation is calculated. As a result, as shown in FIG. 8A, the calculation unit 701 recognizes that the image processing operation ends later than the component feeding start operation. That is, it is determined that the image processing operation is the latest operation.

(Operation delay process)
In this step, as shown in FIG. 8B, the end time of the component feeding start operation is delayed. That is, the time difference T5 is set to approximately zero. Specifically, the moving speed of the XY robot 31 is slowed down. Further, the acceleration and deceleration of the XY robot 31 are reduced.

<Effect>
Next, the effect of the operation time adjustment method of this embodiment will be described. According to the operation time adjustment method of the present embodiment, as shown in FIGS. 8A and 8B, the end time of the image processing operation that is the latest operation is not delayed. For this reason, the production capacity of the first circuit board B1 can be maintained. In contrast, the end time of the component feeding start operation that is not the latest operation is delayed. For this reason, the moving speed of the XY robot 31 can be slowed down. Further, the acceleration and deceleration of the XY robot 31 can be reduced. Further, the suction nozzle 320 is not re-driven toward the correction position P9 after temporarily stopping at the planned mounting position P6. That is, the suction nozzle 320 does not perform a “stop and go operation” with high power consumption. Therefore, according to the operation time adjustment method of this embodiment, the power consumption of the electronic component mounting machine 1 can be reduced.

<< Sixth Embodiment >>
In the present embodiment, the film forming operation and the dip component feeding operation of the electronic component mounting machine of the first embodiment are adjusted. Here, only differences from the first embodiment will be described with reference to FIGS.

  In order to improve the “attachment” of the solder, flux may be applied to the bumps and terminals of the electronic component. In such a case, the dip flux unit 5 is used. The application of the flux is performed by immersing bumps or terminals of electronic components in a flux film formed on the upper surface of the turntable 50. However, if the electronic component is immersed once, “film breakage” or the like occurs in the flux film. That is, the state of the flux film is deteriorated. For this reason, it is necessary to form a new flux film next time before immersing the electronic component. On the other hand, in order to apply the flux, it is necessary to convey the electronic component to the dip flux unit 5. In such a case, the film forming operation and the dip component feeding operation are adjusted.

<Operation time adjustment method>
First, the operation time adjustment method of this embodiment will be described. The following description relates to the first lane L1, but the same applies to the second lane L2.

[Film formation operation]
The film forming operation is an operation of forming a flux film on the rotary table 50 of the dip flux unit 5, that is, the dip position P7, as shown in FIG. First, a predetermined amount of flux is supplied to the rotary table 50. Next, as shown in FIG. 3, the table rotation motor 59 a of the dip flux unit 5 is driven by the control device 7. Then, as shown in FIG. 2, the rotary table 50 is rotated. At this time, the squeegee 51 spreads the flux over substantially the entire upper surface of the rotary table 50. For this reason, a flux film having a substantially constant film thickness is formed on the upper surface of the turntable 50.

[Dip parts feed operation]
As shown in FIG. 2, the dip component feeding operation is an operation of moving the suction nozzle 320 that sucks the electronic component to a position immediately above the dip position P7. As shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the suction nozzle 320 that sucks the electronic component is moved to a position immediately above the dip position P7.

  After both the film forming operation and the dip component feeding operation are completed, the component dipping operation is performed. That is, the suction nozzle 320 is lowered so as to be close to the rotary table 50. Then, the bumps and terminals of the electronic components conveyed by the dip component feeding operation are immersed in the flux film formed by the film forming operation.

[Adjustment of operating time]
FIG. 9A shows a timing chart of the film forming operation and the dip component feeding operation before adjusting the operation time. FIG. 9B shows a timing chart after adjusting the operation time of the film forming operation and the dip component feeding operation. The operation time adjustment method includes a latest operation specifying step and an operation delay step.

(Slowest motion identification process)
In this step, as shown in FIG. 3, the calculation unit 701 calculates the timing for performing the film forming operation and the time required for the film forming operation. Further, the calculation unit 701 calculates the timing for performing the dip component feeding operation and the time required for the dip component feeding operation. Further, a time difference T6 between the end time of the film forming operation and the end time of the dip component feeding operation is calculated. As a result, as shown in FIG. 9A, the calculation unit 701 recognizes that the film forming operation ends later than the dip component feeding operation. That is, it is determined that the film forming operation is the latest operation.

(Operation delay process)
In this step, as shown in FIG. 9B, the end time of the dip component feeding operation is delayed. That is, the time difference T6 is set to approximately zero. Specifically, the moving speed of the XY robot 31 is slowed down. Further, the acceleration and deceleration of the XY robot 31 are reduced.

  In the above example, the case where the film forming operation ends later than the dip component feeding operation has been described. When the dip component feeding operation ends later than the film forming operation, the end time of the film forming operation is delayed. Specifically, the rotation speed of the rotary table 50 is decreased. Further, the rotational acceleration and rotational deceleration of the rotary table 50 are reduced.

<Effect>
Next, the effect of the operation time adjustment method of this embodiment will be described. According to the operation time adjustment method of the present embodiment, as shown in FIGS. 9A and 9B, the end time of the film formation operation which is the latest operation is not delayed. For this reason, the production capacity of the first circuit board B1 can be maintained. On the other hand, the end time of the dip component feeding operation which is not the latest operation is delayed. For this reason, the moving speed of the XY robot 31 can be slowed down. Further, the acceleration and deceleration of the XY robot 31 can be reduced. Therefore, according to the operation time adjustment method of this embodiment, the power consumption of the electronic component mounting machine 1 can be reduced.

<< Seventh Embodiment >>
In the present embodiment, the reception preparation operation and the disposal component feeding operation of the electronic component mounting machine of the first embodiment are adjusted. Here, only differences from the first embodiment will be described with reference to FIGS.

  The electronic component is taken out from the tray 410 by the suction nozzle 320 at the suction position P2. The extracted electronic component is inspected by the parts camera 34. If the electronic component is defective as a result of the inspection, the electronic component is discarded by the NG parts discharging unit 6. Here, electronic components for disposal are already arranged on the upper surface of the discharge conveyor 60 of the NG parts discharge unit 6 at predetermined intervals. For this reason, in order to add a new electronic component for disposal to the discharge conveyor 60, it is necessary to secure a disposal position P8 on which nothing is mounted on the upper surface of the discharge conveyor 60. On the other hand, in order to discard the electronic component, it is necessary to transport the electronic component to the disposal position P8. In such a case, the receiving preparation operation and the disposal component feeding operation are adjusted.

<Operation time adjustment method>
First, the operation time adjustment method of this embodiment will be described. The following description relates to the first lane L1, but the same applies to the second lane L2.

[Preparation operation]
As shown in FIG. 2, the acceptance preparation operation is an operation of securing a disposal position P8 at the rear end of the upper surface of the discharge conveyor 60 of the NG parts discharge unit 6. As shown in FIG. 3, the control device 7 drives the discharge conveyor motor 69 a of the NG parts discharge unit 6. Then, as shown in FIG. 2, the discharge conveyor 60 is rotated in the direction in which the upper surface moves forward. At this time, a disposal position P8 is secured at the rear end of the discharge conveyor 60.

[Disposal part feeding operation]
As shown in FIG. 2, the disposal component feeding operation is an operation of moving the suction nozzle 320 that has attracted the disposal electronic component to the disposal position P8. First, as shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the suction nozzle 320 that sucks the electronic component is moved to a position immediately above the disposal position P8. Next, as shown in FIG. 3, the control device 7 drives the Z-axis motor 329 a of the mounting head 32. Then, as shown in FIG. 1, the suction nozzle 320 is lowered. Finally, a positive pressure is supplied to the suction nozzle 320, and the electronic component is mounted at the disposal position P8 by the suction nozzle 320.

  Note that after both the acceptance preparation operation and the disposal component feeding operation are completed, the component ejection operation is performed. That is, the discharge conveyor 60 is rotated in the direction in which the upper surface moves forward. Then, the electronic components are sent out to the front of the tray unit 4, that is, outside the machine.

[Adjustment of operating time]
FIG. 10A shows a timing chart of the acceptance preparation operation and the disposal component feeding operation before adjusting the operation time. FIG. 10B shows a timing chart after the operation time adjustment of the acceptance preparation operation and the disposal component feeding operation. The operation time adjustment method includes a latest operation specifying step and an operation delay step.

(Slowest motion identification process)
In this step, as shown in FIG. 3, the calculation unit 701 calculates the timing for performing the acceptance preparation operation and the time required for the acceptance preparation operation. In addition, the calculation unit 701 calculates the timing for performing the disposal component feeding operation and the time required for the disposal component feeding operation. Further, a time difference T7 between the end time of the acceptance preparation operation and the end time of the disposal component feeding operation is calculated. As a result, as shown in FIG. 10A, the calculation unit 701 recognizes that the receiving preparation operation ends later than the disposal component feeding operation. That is, it is determined that the acceptance preparation operation is the latest operation.

(Operation delay process)
In this step, as shown in FIG. 10B, the end time of the disposal component feeding operation is delayed. That is, the time difference T7 is set to substantially zero. Specifically, the movement speeds of the XY robot 31 and the mounting head 32 are slowed down. Further, the acceleration and deceleration of the XY robot 31 and the mounting head 32 are reduced.

  In the above example, the case where the receiving preparation operation ends later than the disposal component feeding operation has been described. When the disposal component feeding operation ends later than the acceptance preparation operation, the end time of the acceptance preparation operation is delayed. Specifically, the moving speed of the discharge conveyor 60 is decreased. Further, the acceleration and deceleration of the discharge conveyor 60 are reduced.

<Effect>
Next, the effect of the operation time adjustment method of this embodiment will be described. According to the operation time adjustment method of the present embodiment, as shown in FIGS. 10A and 10B, the end time of the reception preparation operation that is the latest operation is not delayed. For this reason, the production capacity of the first circuit board B1 can be maintained. On the other hand, the end time of the discard component feeding operation which is not the latest operation is delayed. For this reason, the moving speed of the XY robot 31 and the mounting head 32 can be slowed down. Further, the acceleration and deceleration of the XY robot 31 and the mounting head 32 can be reduced. Therefore, according to the operation time adjustment method of this embodiment, the power consumption of the electronic component mounting machine 1 can be reduced.

<< Eighth Embodiment >>
In the present embodiment, the reception preparation operation and the disposal component feeding operation of the electronic component mounting machine of the first embodiment are adjusted. Here, only differences from the first embodiment will be described with reference to FIGS. The difference between the present embodiment and the seventh embodiment is that the tray unit 4 is used instead of the NG parts discharge unit 6 for disposal of electronic components.

  The electronic component is taken out from the tray 410 by the suction nozzle 320 at the suction position P2. The extracted electronic component is inspected by the parts camera 34. As a result of the inspection, if the electronic component is defective, the electronic component may be returned (discarded) to the take-out tray 410 instead of the NG parts discharge unit 6. However, the tray unit 4 has already begun to prepare another tray 410 on which electronic components to be set next at the suction position P2 are mounted. For this reason, when discarding the electronic component, it is necessary to return the tray 410 as the take-out source to the suction position P2. On the other hand, in order to discard the electronic component, it is necessary to transport the electronic component to the suction position P2. In such a case, the receiving preparation operation and the disposal component feeding operation are adjusted.

<Operation time adjustment method>
First, the operation time adjustment method of this embodiment will be described. The following description relates to the first lane L1, but the same applies to the second lane L2.

[Preparation operation]
As shown in FIG. 2, the acceptance preparation operation is an operation of preparing a tray 410 from which electronic components for disposal are taken out at the suction position P2 (corresponding to the disposal position P8 in this embodiment). First, as shown in FIG. 3, the magazine elevating motor 49 a of the tray unit 4 is driven by the control device 7. Then, as shown in FIG. 2, the magazine 41 is raised and lowered to align the desired height of the tray 410 with the height of the tray outlet of the case 40.

  Next, as shown in FIG. 3, the control device 7 drives the shuttle conveyor motor 49 b of the tray unit 4. Then, as shown in FIG. 2, the shuttle conveyor 42 is moved rearward, and the desired tray 410 is moved to the suction position P2 (discard position).

[Disposal part feeding operation]
As shown in FIG. 2, the disposal component feeding operation is an operation of moving the suction nozzle 320 that has attracted the electronic component for disposal to the suction position P2 (discard position). First, as shown in FIG. 3, the X-axis motor 319 a and the Y-axis motor 319 b of the XY robot 31 are driven by the control device 7. Then, as shown in FIG. 2, the suction nozzle 320 that sucks the electronic component is moved to a position just above the suction position P2 (discard position). Next, as shown in FIG. 3, the control device 7 drives the Z-axis motor 329 a of the mounting head 32. Then, as shown in FIG. 1, the suction nozzle 320 is lowered. Finally, positive pressure is supplied to the suction nozzle 320, and the electronic component is mounted at the suction position P2 (discard position) by the suction nozzle 320.

  Note that after both the acceptance preparation operation and the disposal component feeding operation are completed, the component ejection operation is performed. That is, the shuttle conveyor 42 is moved forward, and the tray 410 on which electronic components are mounted is stored in the magazine 41.

[Adjustment of operating time]
The adjustment of the operation time is the same as in the seventh embodiment. For this reason, explanation is omitted.

<Effect>
The operation time adjustment method of the present embodiment has the same effects as the operation time adjustment method of the seventh embodiment.

<< Other >>
The embodiment of the operation time adjustment method of the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  For example, in the above embodiment, one suction nozzle 320 is disposed on the mounting head 32. However, a plurality of (for example, four, eight, twelve) suction nozzles 320 may be arranged on the mounting head 32. In this case, compared with the case where the suction nozzle 320 is single, the time required for the suction of the electronic component becomes longer. For this reason, the time required for the component tip gripping operation of the first embodiment (see FIG. 4) and the component suction operation of the second embodiment (see FIG. 5) becomes longer.

  Moreover, in the said embodiment, although the electronic component was supplied from the tray unit 4, you may supply an electronic component from a cassette type feeder. The cassette type feeder is provided with a supply reel. The supply reel is formed by winding an elongated tape, and has a disk shape. A plurality of electronic components are enclosed in the tape of the supply reel spaced apart at predetermined intervals in the longitudinal direction. Electronic components may be supplied using such a cassette type feeder.

  Further, the operation time adjustment method of the present invention may be used for operations other than the operations exemplified in the above embodiment. That is, if a plurality of operations are performed in parallel with each other by different devices, the power consumption can be reduced by using the operation time adjustment method of the present invention. In the above embodiment, the number of operations performed in parallel is two, but the number of operations is not particularly limited. There may be three or more.

  Moreover, in the said embodiment, although the operation time adjustment method of this invention was used for the electronic component mounting machine 1, you may use for a screen printer. Even in the case of a screen printing machine, for example, the circuit board preparation operation and the squeegee preparation operation are performed in parallel with each other. The circuit board preparation operation is an operation of bringing the circuit board before printing into contact with the screen mask. Specifically, first, the circuit board to be carried in and the mark on the screen mask are imaged by the imaging device, and the lower circuit board and the upper screen mask are aligned in the horizontal direction. Next, the circuit board is raised, and the circuit board is brought into contact with the lower surface of the screen mask. On the other hand, the squeegee preparation operation is an operation of moving the squeegee head to a printing position on the upper surface of the screen mask. When the operation time adjusting method of the present invention is used for such a plurality of operations, the power consumption of the screen printer can be reduced.

1: electronic component mounting machine, 2: base, 3: module, 4: tray unit, 5: dip flux unit, 6: parts discharge unit, 7: control device, 8: image processing device, 9: cart.
30: substrate transfer device, 31: XY robot, 32: mounting head, 33: mark camera, 34: parts camera, 40: case, 41: magazine, 42: shuttle conveyor, 49a: magazine lifting motor, 49b: shuttle conveyor motor 50: rotary table, 51: squeegee, 59a: table rotation motor, 60: discharge conveyor, 69a: discharge conveyor motor, 70: computer, 90: wheels.
300: fixed wall, 301f: front movable wall, 301r: rear movable wall, 302f: first backup table, 302r: second backup table, 303L: guide rail, 303R: guide rail, 304f: first transport conveyor, 304r: Second conveyor, 305: base, 309a: conveyor width change motor, 309b: conveyor conveyor motor, 309c: table lift motor, 309d: carry-in sensor, 310: Y-direction slider, 311: X-direction slider, 312: Y-direction guide Rail, 313: X direction guide rail, 319a: X axis motor, 319b: Y axis motor, 320: Suction nozzle, 329a: Z axis motor, 329b: θ axis motor, 410: Tray, 700: Input / output interface, 701: Calculation unit, 702: storage unit.
A1: first mounting area, A2: second mounting area, B1: first circuit board, B10: fiducial mark, B2: second circuit board, B20: fiducial mark, F: floor surface, L1: first One lane, L2: second lane, P1: entrance, P2: suction position, P3: planned mark position, P4: first mounting position, P5: component imaging position, P6: planned mounting position, P7: dip position, P8: Discard position, P9: correction position, T1 to T7: time difference.

Claims (2)

An operation time adjustment method for a circuit board production method having a plurality of operations performed in parallel with each other by different devices,
Among the plurality of operations, the latest operation specifying step for specifying the latest operation having the latest end time;
An operation delay step of delaying the end time of the other operation so as to reduce a time difference between the end time of the latest operation and the end time of the other operation;
An operation time adjustment method characterized by comprising: The plurality of operations include at least
Board transport operation to transport and fix the circuit board to the mounting area;
A component tip gripping operation in which the suction nozzle is moved to the suction position and the electronic component at the suction position is sucked by the suction nozzle;
The operation time adjusting method according to claim 1, wherein:

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