JP2007250639A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To raise mounting efficiency while a component recognizing operation is performed immediately before suction and an operation to suck a good component and mount it on a substrate is defined as a basis. <P>SOLUTION: A component mounting device includes: a mounting head 20 for sucking a wafer component W, which is recognized as the good component by a component recognizing camera 18, and mounting it on the positioned substrate S; and a control means 30 for recognizing the quality of the unrecognized wafer component W on a wafer table 16 with the use of the recognizing camera 18 during a waiting period till a substrate detecting sensor 14 detects the arrival of the substrate, preserving the recognition result in a memory as recognition data, and sucking the wafer component to be mounted on the subsequently arriving substrate, based on the preserved recognition data. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus suitable for application when a wafer component is directly picked up from a diced wafer and is sequentially mounted and mounted on a substrate positioned at a predetermined position.

  In general, a board product is produced by mounting electronic components on a wiring board such as a printed board using a chip mounter. As one of the production processes, there is so-called die bonding in which a divided wafer part after dicing placed on a wafer table is mounted on a substrate.

  Normally, wafer parts are inspected after dicing, and defective products are supplied with so-called BAD marks. Therefore, in the conventional die bonding, after the substrate is transported to a predetermined position and positioned, only the wafer component without the BAD mark is selected by the recognition device attached to the mounting head, and the mounting head The non-defective wafer parts were picked up and mounted on the substrate.

  Patent Document 1 discloses a technique for creating mapping data in which the positions of non-defective products and defective products are recorded for wafer parts on a wafer that has been diced in advance in order to increase the work efficiency of die bonding. Since this needs to be performed in a separate process and requires format conversion depending on the apparatus used, the efficiency is not necessarily improved.

JP-A-11-112476

  However, when a wafer part is picked up and mounted on the substrate positioned as described above, since the BAD mark recognition operation has been performed immediately before the picking up conventionally, the BAD mark is continuous. Has a problem that the recognition operation is repeated until the part is picked up, so that time is lost.

  The present invention has been made in order to solve the above-mentioned conventional problems, and performs an operation of recognizing the quality of a wafer part immediately before suction, and is based on the operation of picking up a good part and mounting it on a substrate. It is an object of the present invention to provide a component mounting method that can be improved and a component mounting apparatus applied to the method.

  According to the present invention, in the component mounting method, a step of loading a substrate into a predetermined positioning unit, a step of detecting that the loaded substrate has reached the positioning unit and has been positioned, and the arrival of the substrate are detected. A step of recognizing the quality of the wafer component set on the wafer table, a step of sucking the wafer component recognized as a non-defective product, mounting the wafer component on the positioned substrate, and a substrate on which the wafer component is mounted A step of recognizing the quality of an unrecognized wafer component on the wafer table during standby until the arrival of the substrate is detected, and the recognition result as a recognition data in a memory. A step of storing, and a step of sucking a wafer component to be mounted on the next reached substrate based on the stored recognition data. By the useless, it is obtained by solving the above problems.

  In the component mounting apparatus, the present invention also detects that the board that carries the board into and out of the predetermined positioning part and the board carried by the carrying means reach the positioning part and are positioned. A substrate detection sensor, a component recognition means for recognizing the quality of a wafer part set on a wafer table when the substrate detection sensor detects arrival of the substrate, and a wafer recognized as a non-defective product by the component recognition means A mounting head for picking up a component and mounting it on the positioned substrate, and in a component mounting apparatus for unloading the substrate on which the wafer component is mounted by the transfer means, the substrate detection sensor While waiting until arrival is detected, the component recognition means recognizes the quality of unrecognized wafer components on the wafer table and recognizes the result. The above-mentioned problem is solved in the same manner by providing a control means for sucking a wafer component to be mounted on the next reached substrate based on the stored recognition data. .

  According to the present invention, in addition to the operation of sucking and mounting non-defective products after determining the quality of wafer parts for each substrate, it is possible to perform suction and mounting based on recognition data collected during standby of the substrate. The production tact of the substrate product on which the wafer component is mounted can be shortened and the production efficiency can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view schematically showing an outline of a component mounting apparatus according to an embodiment of the present invention.

  In the component mounting apparatus of the present embodiment, the substrate S is carried into and out of the predetermined positioning unit 10, and the substrate S carried in by the carrying device 12 reaches the positioning unit 10, and is positioned (clamped). ) And a component recognition camera that recognizes (determines) the quality of the wafer component W set on the wafer table 16 when the substrate detection sensor 14 detects the arrival of the substrate. 18 and a mounting head 20 that sucks a wafer part W recognized as a non-defective product by the part recognition camera 18 and mounts it on the substrate S that has been positioned.

  The component recognition camera 18 is fixed to the XY drive unit 22 integrally with the mounting head 20 and is movable in the plane direction. The camera 18 dices and divides the wafer (not shown). ) Recognizing whether or not the BAD mark preliminarily attached to the wafer component W is determined, and adhering the non-defective product by the suction nozzle (not shown) of the mounting head 20 and picking it up from the wafer table 18, The control device 30 can automatically perform the operation of mounting the component on the substrate S positioned on the positioning unit 10.

  In the present embodiment, a conventional mounting operation in which the controller 30 recognizes a non-defective product by the component recognition camera 18 every time the board S is carried in, as described above, and picks and mounts the component immediately before suction. To do.

  In the present embodiment, in addition to the conventional control operation, for example, after the substrate on which the wafer part W is mounted is carried out by the control device 30 by the control device 12, the next substrate is carried in by the substrate detection sensor 14. During standby until detection, the component recognition camera 18 recognizes the quality of the unrecognized wafer component W on the wafer table 16 (presence of BAD mark) and stores the recognition data in a memory (not shown). At the same time, when the next substrate S arrives, a control operation for sucking and mounting the wafer component on the positioned substrate S is performed based on the stored recognition data.

  Next, the operation of the present embodiment will be described with reference to the flowchart of FIG.

  When the production is started, the control device 30 determines whether or not waiting for substrate loading in Step 1 and if it is not waiting for loading (NO), that is, if the substrate detection sensor 14 detects the positioning of the substrate S, the substrate S is determined. On the other hand, the conventional production operation shown in FIG. 3 to be described later is performed (step 2), and when the production is completed without the next substrate (step 3), the production is terminated.

  On the other hand, when it is determined that the substrate is waiting (YES in step 1), it is determined whether or not there is a wafer part W whose BAD mark is unrecognized (step 4). The presence / absence of a BAD mark is recognized for the component W (step 5), and if a BAD mark is detected from the recognition result (YES in step 6), the detected position and result are stored in the memory as recognition data.

  After step 7, if both step 4 and step 6 are NO, the process proceeds to step 3 and repeats this operation while waiting for the substrate to be loaded, thereby recognizing the non-defective / defective product recognition data of wafer part W. To accumulate.

  Next, the production operation performed in Step 2 when the substrate S has reached NO in Step 1 will be described with reference to the flowchart of FIG.

  First, in step 11, it is determined whether or not the BAD mark of the wafer portion W at the next suction position has been recognized and the recognition data is stored in the memory. If it is already recognized as a non-defective product (YES) Wafer component W is sucked (step 12) and mounted on substrate S (step 13). The above operations of Step 11 to Step 13 are repeated until the mounting operation of all components is completed if possible.

  On the other hand, if it is not yet recognized in step 11 (NO), the BAD mark at the suction position is recognized as in the conventional case, and if it is determined as a non-defective product from the recognition result (NO in step 16), the wafer part Step 12 and step 13 are mounted on W. Conversely, if it is determined from the recognition result that there is a BAD mark (YES in Step 16), the wafer part W at the next suction position moves to BAD. The mark is recognized, and the process returns to step 16.

  Note that the BAD mark position information that is recognized while waiting for substrate transport and temporarily stored in the memory needs to be re-recognized by saving the file to a file so that the BAD mark can be re-recognized when the apparatus is turned on again. There may be no.

  Also, when recognizing a BAD mark waiting for substrate transfer, the difference in the amount of reflected light due to the difference in the reflection area of the wafer component is detected at the same time. By performing the operation, it is possible to skip the operation of confirming the suction position of the defective part during production, and to further improve the tact time.

  According to the present embodiment described in detail above, the BAD mark recognition operation immediately before the suction operation, which has been performed conventionally, is performed automatically by waiting for the substrate transfer (including during the transfer) when performing the BAD mark recognition operation. Can be eliminated as much as possible, so that it is possible to shorten the production tact time at the time of mounting the wafer part and improve the productivity. Naturally, when there is no BAD mark recognized component at the time of component suction, BAD mark recognition is performed just before suction.

  Therefore, when the loading of the substrate S is stopped for a long time due to parts being cut off in the previous process or the like, it is possible to recover the time loss due to the stopping of loading by performing the BAD mark recognition during that time. Become.

The top view including the block diagram which shows the outline | summary of the component mounting apparatus of one Embodiment which concerns on this invention Flow chart for explaining the operation of this embodiment Another flowchart for explaining the operation of this embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Positioning part 12 ... Conveying device 14 ... Board | substrate detection sensor 16 ... Wafer table 18 ... Component recognition camera 20 ... Mounting head 22 ... XY drive part 30 ... Control apparatus

Claims (2)

Carrying a substrate into a predetermined positioning part;
Detecting that the loaded substrate has reached the positioning portion and has been positioned;
When the arrival of the substrate is detected, the step of recognizing the quality of the wafer component set on the wafer table;
Adsorbing a wafer component recognized as a non-defective product and mounting it on the positioned substrate;
A step of unloading the substrate on which the wafer component is mounted, and a component mounting method comprising:
Recognizing the quality of unrecognized wafer parts on the wafer table during standby until the arrival of the substrate is detected;
Storing the recognition result in memory as recognition data;
And a step of adsorbing a wafer component to be mounted on the next arrived substrate based on the stored recognition data. Conveying means for carrying the substrate in and out of the predetermined positioning portion;
A substrate detection sensor for detecting that the substrate carried in by the conveying means has reached the positioning portion and has been positioned;
When the substrate detection is detected by the substrate detection sensor, the component recognition means for recognizing the quality of the wafer component set on the wafer table;
A component mounting unit that picks up a wafer component recognized as a non-defective product by the component recognition unit and mounts it on the positioned substrate, and carries out the substrate on which the wafer component is mounted by the transport unit. In the device
While waiting until the substrate detection is detected by the substrate detection sensor, the component recognition means recognizes the quality of the unrecognized wafer components on the wafer table, and stores the result in the memory as recognition data. A component mounting apparatus comprising control means for sucking a wafer component to be mounted on the substrate that has arrived next based on the stored recognition data.

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