JPH06244245A - Semiconductor device bonding device - Google Patents

Abstract

PURPOSE:To obtain a face down bonding device, which facilitates control of the characteristics of a semiconductor device by the slight improvement to a conventional die bonding device, by a method wherein the face down bonding device is constituted of a first transfer means, a first recognition means, a second transfer means, a second recognition means, a collating means and a bonding means, which are respectively specified. CONSTITUTION:A face down bonding device is constituted of a first transfer means, which turns an active element surface 2 of a semiconductor element 1 down ward and transfers the element 1, a first recognition means, which recognizes data on a pattern on the surface 2 of the element 1 and consists of an infrared camera 4 and an infrared microscope 3, a second transfer means, which sucks the element 1 from over and transfers the element 1 to a material 7 to be mounted, a second recognition means (a camera) 8 to recognize data on a pattern on the surface of the material 7 to be mounted, a collating means to collate the data on the pattern on the surface 2 of the element 1 with the data on the patter on the surface of the material 7 and a bonding means to bond the element 1 to the material 7 to be mounted on the basis of the collated result.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element bonding apparatus, and more specifically, in the process of assembling a semiconductor element, the active element surface of the semiconductor element is made to face a mounted object such as a lead frame or a circuit board. The present invention relates to a face-down joining device for joining.

[0002]

2. Description of the Related Art A conventional face-down joining process will be described with reference to a conventional face-down joining process diagram of FIG.

First, a tape is attached to the back surface of the wafer 20, and the periphery of the tape is held by a dedicated ring.
The camera 22a is used to recognize the dicing line from the active element surface 21 of the wafer 20 and cut along the line (FIG. 4A, dicing step).

Next, the active element surface 21 of the diced semiconductor element 23 is recognized, and non-defective products are jig-filled in the tray 25a using the collet 24a (FIG. 4B, chip selection step). After that, the jig-filled tray 25a is covered with an empty tray 25b and inverted so that the active element surface 21 of the semiconductor element 23 faces downward (FIG. 4C, inversion step).

Next, the inverted semiconductor element 23 is vacuum-adsorbed and picked up from above using a collet 24b,
The pattern of the active element surface 21 and the electrodes are recognized by the camera 22b provided below, and the surface pattern of the mounted object 26 is recognized by the camera 22c to face the surface of the mounted object 26 up to the mounting position obtained. Down joining is performed (FIG. 4D, joining step).

A method of attaching a tape to the active element surface to protect the active element surface of the wafer and cutting the semiconductor element into individual pieces has been reported up to now (Japanese Patent Laid-Open No. 55-53437). JP-A-60-4010, etc.), there was no method of directly performing face-down bonding in this state.

[0007]

However, when the above-mentioned conventional face-down joining method is used, there are the following problems.

First, in a semiconductor element assembling process such as wire bonding, the dicing semiconductor element 23 is directly picked up on the tape to be mounted 2
6 and the chip selection step is often omitted.
Therefore, in the case of face-down bonding, as compared with the assembly of the semiconductor element 23 using wire bonding or the like, there are many steps such as chip selection and reversal.

Secondly, in the case of face-down bonding, a plurality of semiconductor elements 23 may be mounted on one mounted object 26 by selecting them according to the characteristics of the wafer test.
Further, a defective semiconductor element 23 mounted is removed by a test after assembling and another semiconductor element 23 is mounted to perform repair work. In this case as well, a wafer having the same characteristics as the wafer test is mounted. However, since the semiconductor elements 23 are transferred to the tray 25a, individual characteristics of the semiconductor elements 23 selected on the tray 25a can be managed by the individual coordinates of the semiconductor elements 23 in a wafer form and the mapping data in which the wafer test results are recorded. Instead, it is troublesome to manage, such as recording on a sheet when the sheet is transferred to the tray 25a.

Thirdly, in the conventional face-down bonding apparatus, the active element surface 2 of the semiconductor element 23 picked up is used.
1 is recognized from the lower side during conveyance, and a mechanism for deciding the mounting position by collating this data with the position data of the mounted object 26 is required, which complicates the structure.

It is an object of the present invention to provide a face-down bonding apparatus in which characteristics of semiconductor elements can be easily controlled by slightly improving the conventional die bonding apparatus.

[0012]

A semiconductor element bonding apparatus according to the present invention comprises a first transfer means for transferring the semiconductor element with the active element surface of the semiconductor element facing downward and a pattern of the active element surface of the semiconductor element. A first recognizing means for recognizing data, which includes an infrared camera and an infrared microscope, a second conveying means for vacuum-sucking the semiconductor element from above and conveying it to a mounting object, and recognizing pattern data on the surface of the mounting object. Second recognizing means, collating means for collating the pattern data of the active element surface of the semiconductor element with the pattern data of the surface of the mounted object, and the semiconductor element and the mounted object based on the collated result. It has a joining means for joining.

[0013]

By using the present invention, the chip selecting step and the reversing step can be omitted, so that the assembling step is simplified. Further, since the bonding can be performed based on the mapping data of the wafer test result, it becomes easy to select the characteristics of the semiconductor element and mount and repair it. Further, the semiconductor element can be supplied to the face-down joining apparatus while being attached to the tape in a dicing state and directly mounted, and the mechanism of the face-down joining apparatus can be simplified.

[0014]

EXAMPLES The present invention will be described in detail below based on examples. FIG. 1 is a configuration diagram of a face-down joining device according to an embodiment of the present invention, FIG. 2 is an external view of a face-down joining device according to an embodiment of the present invention, FIG. 3A is a mapping diagram for a surface, and FIG. (B) is a mapping diagram in which coordinates are converted for the back surface. In FIG. 1, reference numeral 1 is a semiconductor element, 2 is an active element surface, 3 is an infrared microscope, 4 is an infrared camera. Since infrared rays pass through silicon and are reflected by metal components, the infrared microscope 3 and the infrared camera 4 are used. Then, the pattern of the metal wiring portion, the electrode pad, etc. of the active element surface 2 of the diced wafer is recognized. Further, 5 is an active element surface 2
The tip has a spherical shape or a flat shape so as not to damage it, and pushes up the semiconductor element 1 from below.
Is a collet for vacuum-sucking the semiconductor element 1 from above, 7 is a mounted object on which the semiconductor element 1 is mounted, and 8 is a camera for recognizing pattern data of the mounted object 7 from above.
In FIG. 2, 9 is a wafer magazine, 10 is a mounted magazine, 11 is a ball screw driven by a motor, and is linearly guided by two guide posts to move up and down, and stopped at each groove of the wafer magazine 9. Wafer loader, 1
2 is a chuck claw 13 at the center of the linearly guided arm.
, A wafer transfer unit 14 is provided, 14 is a wafer table which is a three-axis table of XY-θ for positioning a semiconductor element to be picked up, and 15 is an XY-
1 shows a bonding head which is composed of a Z triaxial table and has a collet 6 having a suction function at its tip.

Next, a face-down joining process using the face-down joining apparatus according to one embodiment of the present invention will be described.

First, stored in the wafer magazine 9,
A wafer (not shown) that has been diced and is attached to a tape with the active element surface 2 facing down and held in a dedicated ring.
The wafer loader 11 performs height positioning, the chuck claws 13 grab the dedicated rings, pull them one by one, carry them along the rails, and then push in the rear part of the dedicated rings to supply them to the wafer table 14.

Next, the infrared microscope 3 and the infrared camera 4
The pattern of the aluminum wiring or the electrode portion of the active element surface 2 of the semiconductor element 1 is recognized from the upper side by using, and the wafer table 14 is positioned based on this data.
While pushing up from below using the push-up needle 5, the semiconductor element 1 is vacuum-sucked from above by the collet 6.

Next, the loader (not shown) is used to perform height positioning with respect to the mounted object 7 before mounting, and for example, a dedicated pin with a vertical drive mechanism is provided on the mounted object 7. It is inserted into a hole (not shown) and conveyed by a uniaxial table along the guide rail to the mounting position, and the camera 8 recognizes the detailed pattern of the mounted portion of the mounted object 7, and the pattern data and the infrared microscope. 3 and the pattern data of the active element surface 2 of the semiconductor element 1 recognized by the infrared camera 4 are collated, and the bonding head 15 performs face-down bonding at a predetermined position.

Thereafter, the mounted object 7 on which the semiconductor element 1 is mounted is further transported along the guide rails and stored in the mounted object magazine 10b of the unloader.

In order to determine whether the semiconductor device 1 to be picked up is a good product or a defective product, the infrared microscope 3 and the infrared camera 4 determine whether the semiconductor device 1 is a good product or a defective product by including a metal component in the ink applied to the defective semiconductor device during the wafer test. It is possible to recognize good products and select and install only good products.

Further, when the characteristics of the semiconductor element are judged and mounted, as shown in FIG. 3, the mapping data (FIG. 3A) showing the characteristic data of the wafer test is arranged on the basis of, for example, the orientation flat. The data (X coordinate) is converted into the reverse mapping data (FIG. 3B), and the semiconductor device 1 having the characteristic data specified based on this data is converted.
Can be selected and mounted.

In addition to the circuit board, the mounted object of the above-described embodiment is applicable to all materials such as glass, film, and lead frame that are bonded to the active element surface 2 of the semiconductor element 1, and supply thereof. The method and transfer method differ depending on the mounted object.

[0023]

As described above in detail, by using the present invention, the face-down joining which has been conventionally performed by using the complicated joining apparatus can be easily performed by using the infrared microscope and the infrared camera in the existing die bonder. You can Also, the sorting process and the reversing process can be omitted,
Since semiconductor elements are supplied in a wafer state and bonded based on mapping data, semiconductor element management is easy and repair work can be performed easily. Furthermore, the active element surface of the semiconductor element is attached to the tape and supplied, and the back surface is vacuum-adsorbed by the collet, so there is no contamination or scratch on the active element surface.
There is no quality defect.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a face-down joining device according to an embodiment of the present invention.

FIG. 2 is an external view of the face-down joining device.

FIG. 3A is a front surface mapping diagram, and FIG. 3B is a back surface mapping diagram.

FIG. 4 is a configuration diagram of a conventional face-down joining device.

[Explanation of symbols] 1 semiconductor element 2 active element surface 3 infrared microscope 4 infrared camera 5 push-up needle 6 collet 7 mounted object 8 camera 9 wafer magazine 10 mounted object magazine 11 wafer loader 12 wafer transfer unit 13 chuck claw 14 wafer table 15 Bonding head

Claims (1)

[Claims] 1. A first transport means for transporting the semiconductor element with the active element surface of the semiconductor element facing downward, and an infrared camera and an infrared microscope for recognizing pattern data of the active element surface of the semiconductor element. 1 recognition means, second transfer means for vacuum-sucking the semiconductor element from above and transferring it to the mounted object, second recognition means for recognizing pattern data on the surface of the mounted object, and active element of the semiconductor element It is characterized by having a collating means for collating the pattern data of the surface and the pattern data of the surface of the mounted object, and a joining means for joining the semiconductor element and the mounted object based on the collated result. Semiconductor element bonding equipment.