JP2007250639A5 - - Google Patents
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- JP2007250639A5 JP2007250639A5 JP2006069117A JP2006069117A JP2007250639A5 JP 2007250639 A5 JP2007250639 A5 JP 2007250639A5 JP 2006069117 A JP2006069117 A JP 2006069117A JP 2006069117 A JP2006069117 A JP 2006069117A JP 2007250639 A5 JP2007250639 A5 JP 2007250639A5
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- JP
- Japan
- Prior art keywords
- substrate
- wafer
- component
- recognition
- detected
- Prior art date
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- 239000000758 substrate Substances 0.000 claims 17
- 238000001514 detection method Methods 0.000 claims 4
- 230000002950 deficient Effects 0.000 claims 2
Claims (2)
搬入された基板が、前記位置決め部に到達し、位置決めされたことを検知するステップと、
基板到達が検知されると、ウェハテーブル上にセットされているウェハ部品の良否を認識するステップと、
良品と認識されたウェハ部品を吸着し、位置決めされた前記基板に搭載するステップと、
ウェハ部品が搭載された基板を搬出するステップと、を含む部品搭載方法において、
基板の到達が検知されるまでの待機中に、ウェハテーブル上の未認識のウェハ部品の良否を認識する動作を繰り返すステップと、
認識結果を認識データとしてメモリに保存するステップと、
保存されている認識データに基づいて、次に到達した基板に搭載するウェハ部品の吸着を行なうステップと、を含むことを特徴とする部品搭載方法。 Carrying a substrate into a predetermined positioning part;
Detecting that the carried-in substrate has reached the positioning portion and has been positioned;
When the arrival of the substrate is detected, the step of recognizing the quality of the wafer component set on the wafer table;
Adsorbing a wafer component recognized as a non-defective product and mounting it on the positioned substrate;
A step of unloading the substrate on which the wafer component is mounted, and a component mounting method comprising:
Repeating the operation of recognizing the quality of unrecognized wafer parts on the wafer table during standby until the arrival of the substrate is detected;
Storing the recognition result in memory as recognition data;
And a step of adsorbing a wafer component to be mounted on the next arrived substrate based on the stored recognition data.
該搬送手段により搬入された基板が、前記位置決め部に到達し、位置決めされたことを検知する基板検知センサと、
該基板検知センサにより基板到達が検知されると、ウェハテーブル上にセットされているウェハ部品の良否を認識する部品認識手段と、
該部品認識手段により良品と認識されたウェハ部品を吸着し、位置決めされた前記基板に搭載する搭載ヘッドとを備えていると共に、前記搬送手段により、ウェハ部品が搭載された基板を搬出する部品搭載装置において、
前記基板検知センサにより、基板の到達が検知されるまでの待機中に、前記部品認識手段によりウェハテーブル上の未認識のウェハ部品の良否を認識する動作を繰り返し、その結果を認識データとしてメモリに保存すると共に、保存されている認識データに基づいて、次に到達した基板に搭載するウェハ部品の吸着を行なう制御手段を備えたことを特徴とする部品搭載装置。 Conveying means for carrying the substrate in and out of the predetermined positioning portion;
A substrate detection sensor for detecting that the substrate carried in by the conveying means has reached the positioning portion and has been positioned;
When the substrate detection is detected by the substrate detection sensor, the component recognition means for recognizing the quality of the wafer component set on the wafer table;
A component mounting unit that picks up a wafer component recognized as a non-defective product by the component recognition unit and mounts it on the positioned substrate, and carries out the substrate on which the wafer component is mounted by the transport unit. In the device
By the substrate detection sensor, while waiting to reach the substrate is detected, the component recognition unit by Just repeat the operation to recognize the quality of the wafer components unrecognized on the wafer table, the result as recognition data A component mounting apparatus comprising: a control unit configured to store a wafer component to be mounted on a substrate that has arrived next, based on the stored recognition data, while being stored in a memory.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006069117A JP4800076B2 (en) | 2006-03-14 | 2006-03-14 | Component mounting method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006069117A JP4800076B2 (en) | 2006-03-14 | 2006-03-14 | Component mounting method and apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007250639A JP2007250639A (en) | 2007-09-27 |
| JP2007250639A5 true JP2007250639A5 (en) | 2009-04-23 |
| JP4800076B2 JP4800076B2 (en) | 2011-10-26 |
Family
ID=38594645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006069117A Expired - Fee Related JP4800076B2 (en) | 2006-03-14 | 2006-03-14 | Component mounting method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4800076B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011249646A (en) * | 2010-05-28 | 2011-12-08 | Fuji Mach Mfg Co Ltd | Operating time adjusting method |
| KR101183101B1 (en) | 2011-05-06 | 2012-09-21 | 주식회사 프로텍 | Method of die bonding for flip chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0812879B2 (en) * | 1985-09-30 | 1996-02-07 | 株式会社東芝 | Semiconductor pellet mounter |
-
2006
- 2006-03-14 JP JP2006069117A patent/JP4800076B2/en not_active Expired - Fee Related
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