WO2017051446A1

WO2017051446A1 - Part supply system

Info

Publication number: WO2017051446A1
Application number: PCT/JP2015/076822
Authority: WO
Inventors: 達松本
Original assignee: 富士機械製造株式会社
Priority date: 2015-09-22
Filing date: 2015-09-22
Publication date: 2017-03-30
Also published as: CN108136595A; JPWO2017051446A1; CN108136595B

Abstract

A part supply device is configured so that a suction nozzle or chuck can be mounted on a work head. For each part to be held, a part holder that is capable of holding said part and the holding surface of the part to be held by said part holder are stored in a storage device as a correlation table. Parts that are scattered on a part support member are imaged by an imaging device and on the basis of said imaging data and the correlation table, a part holder is specified for each of the multiple parts on the part support member, thereby making it possible for the parts to be held by a suction nozzle or chuck and making it possible to hold parts that have a variety of orientations using the part holders.

Description

Parts supply system

The present invention relates to a component supply system having a component support portion that supports a plurality of components in a scattered state.

In a component supply system having a component support unit that supports a plurality of components in a scattered state, the component support unit holds the components supported by the component support unit and aligns the components in a component supply position. The parts are supplied by placing them on the screen. The following patent document describes a technique for gripping scattered parts by a robot hand.

JP-A-6-127698

According to the technique described in the above-mentioned patent document, the scattered parts can be held to some extent by the parts holder. However, since a plurality of components are scattered in various postures on the component support portion, there is a possibility that only one component support tool can hold a component in a predetermined posture. This invention is made | formed in view of such a situation, and makes it a subject to hold | maintain the components of various attitude | positions with a component holder.

In order to solve the above-described problem, a component supply system according to the present invention includes a component support unit that supports a plurality of components in a scattered state, an imaging device that captures an image of the component supported by the component support unit, A suction nozzle for sucking and holding a component supported by the component support portion, a gripping tool for gripping the component supported by the component support portion with a plurality of claws, and any one of the suction nozzle and the gripping tool A work head to which the work head is exchangeably mounted, a moving device that moves the work head to an arbitrary position, a control device, and a storage device, and the control device takes an image of a component imaged by the imaging device Based on the data, at least one of the suction nozzle and the gripping tool is determined as an object to be attached to the work head.

In the component supply system according to the present invention, a suction nozzle or a chuck can be attached to the work head. Then, at least one of the suction nozzle and the chuck is determined as a component holder to be mounted on the work head. Thereby, it becomes possible to hold | maintain components with a suction nozzle or a chuck | zipper, and it becomes possible to hold | maintain components of various attitude | positions with a component holder.

It is a perspective view which shows a component mounting machine. It is a perspective view which shows the component mounting apparatus of a component mounting machine. It is a perspective view which shows a bulk parts supply apparatus. It is a perspective view which shows a components supply unit. It is a perspective view which shows the components supply unit of the state which the components collection container raised to the raise end position. It is a perspective view which shows a component holding head. It is a figure which shows a chuck | zipper. It is a figure which shows the component receiving member of the state in which the lead component was accommodated. It is a block diagram which shows the control apparatus of a component mounting machine. It is a perspective view which shows a component scattered state implementation | achievement apparatus. It is a figure which shows the component support member of the state by which the some lead component was scattered. It is a figure which shows the component support member of the state by which the some lead component was scattered. It is a figure which shows the chuck which hold | grips a lead component. It is a figure which shows notionally the comparison table of lead components. It is a figure which shows the component support member of the state by which the some electronic circuit component was scattered. It is a figure which shows notionally the contrast table of an electronic circuit component. It is a perspective view showing a component scattered state realization device and a component return device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

<Configuration of component mounter>
FIG. 1 shows a component mounter 10. The component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12. The component mounter 10 includes an apparatus main body 20, a base material conveyance holding device 22, a component mounting device 24,

imaging devices

26 and 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 9) 34. Yes. The circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.

The apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40. The substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52. The conveyance device 50 is a device that conveys the circuit substrate 12, and the clamp device 52 is a device that holds the circuit substrate 12. Thereby, the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position. In the following description, the conveyance direction of the circuit substrate 12 is referred to as an X direction, a horizontal direction perpendicular to the direction is referred to as a Y direction, and a vertical direction is referred to as a Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

The component mounting device 24 is disposed in the beam portion 42 and includes two

work heads

60 and 62 and a work head moving device 64. Each

work head

60, 62 has a component holder 66 (see FIG. 2) 66 such as a chuck and a suction nozzle, and holds the component by the component holder 66. The work head moving device 64 includes an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two

working heads

60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70. Further, as shown in FIG. 2, each

work head

60, 62 is detachably attached to the

sliders

74, 76, and the Z-direction moving device 72 individually moves the

sliders

74, 76 in the vertical direction. That is, the

work heads

60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.

The imaging device 26 is attached to the slider 74 in a state of facing downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. Thereby, the imaging device 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the imaging device 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the imaging device 28 images the components held by the component holder 66 of the

work heads

60 and 62.

The component supply device 30 is disposed at one end of the frame portion 40 in the front-rear direction. The component supply device 30 includes a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device that supplies components placed on the tray. The feeder-type component supply device is a device that supplies components using a tape feeder (not shown) and a stick feeder (not shown).

The bulk component supply device 32 is disposed at the other end portion of the frame portion 40 in the front-rear direction. The separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture. Below, the structure of the component supply apparatus 32 is demonstrated in detail. Note that examples of the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components having leads and components not having leads.

As shown in FIG. 3, the bulk component supply device 32 includes a main body 80, a component supply unit 82, an imaging device 84, and a component delivery device 86.

(A) Component supply unit The component supply unit 82 includes a component supplier 88, a component scattered state realization device 90, and a component return device 92, and the component supplier 88, the component scattered state realization device 90, and the component return device 92. Are integrally configured. The component supply unit 82 is detachably assembled to the base 96 of the main body 80. In the bulk component supply device 32, five component supply units 82 are arranged in a line in the X direction.

(I) Component supplier The component supplier 88 includes a component container 100, a housing 102, and a grip 104 as shown in FIG. The component container 100 has a generally rectangular parallelepiped shape, and an upper surface and a front surface are open. The bottom surface of the component container 100 is an inclined surface 116, which is inclined toward the front surface where the component container 100 is opened.

The housing 102 has a pair of side walls 120, and the component container 100 is slidably held between the pair of side walls 120. An inclined plate 152 is fixedly disposed between the pair of side walls 120 so as to be positioned in front of the lower end portion of the front surface of the component container 100. The inclined plate 152 is inclined so as to descend toward the front.

The grip 104 is disposed at an end portion on the rear side of the housing 102 and includes a fixed gripping member 170 and a movable gripping member 172. The movable gripping member 172 can be moved toward and away from the fixed gripping member 170. The movable gripping member 172 is connected to the rear surface of the component container 100 by a connecting arm (not shown). As a result, when the grip 104 is gripped, the movable gripping member 172 approaches and separates from the fixed gripping member 170, and the component container 100 swings between the pair of side walls 120.

Further, the component supplier 88 is disposed between a pair of side frame portions 190 assembled to the base 96, and can be attached to and detached from the base 96. A lock mechanism (not shown) is provided at the lower end of the movable grip member 172 of the grip 104, and the lock mechanism is released when the grip 104 is gripped. That is, when the operator holds the grip 104 of the component supplier 88 and lifts the component supplier 88, the component supplier 88 is removed from between the pair of side frame portions 190.

(Ii) Component scattered state realization device The component scattered state realization device 90 includes a component support member 220, a component support member moving device 222, and a feeder vibration device 224. The component support member 220 has a generally longitudinal plate shape and is disposed so as to extend forward from below the inclined plate 152 of the component feeder 88. Side wall portions 228 are formed on both side edges in the longitudinal direction of the component support member 220.

The component support member moving device 222 is a device that moves the component support member 220 in the front-rear direction by driving an electromagnetic motor (see FIG. 9) 223. As a result, the component support member 220 moves in the front-rear direction slightly below the lower end of the inclined plate 152 of the component supplier 88 with the upper surface of the component support member 220 being horizontal.

The feeder vibration device 224 includes a cam member 240, a cam follower 242, and a stopper 244. The cam member 240 has a plate shape and is fixed to the outer side surface of the side wall portion 228 so as to extend in the front-rear direction. At the upper end of the cam member 240, a plurality of teeth 245 are formed at equal intervals in the front-rear direction. The cam follower 242 includes a lever 252 and a roller 254. The lever 252 is disposed at the lower end portion of the side wall 120 of the component supplier 88 and can swing around the upper end portion. The roller 254 is rotatably held at the lower end portion of the lever 252. The lever 252 is biased in the forward direction by the elastic force of a coil spring (not shown). The stopper 244 is provided in a protruding shape on the side wall 120, and a lever 252 biased by the elastic force of the coil spring is in contact with the stopper 244.

(Iii) Component Return Device The component return device 92 includes a container lifting device 260 and a component collection container 262 as shown in FIG. The container elevating device 260 includes an air cylinder 266 and an elevating member 268, and the elevating member 268 moves up and down by the operation of the air cylinder 266. The air cylinder 266 is fixed to the front end of the component support member 220. Thus, the air cylinder 266 moves in the front-rear direction together with the component support member 220 by the operation of the component support member moving device 222.

The component collection container 262 is disposed on the upper surface of the elevating member 268 and moves up and down by the operation of the air cylinder 266. The component collection container 262 has a box shape with an open top surface, and is rotatably held on the top surface of the elevating member 268. As shown in FIG. 4, a protruding pin 272 is disposed at the rear end of the component collection container 262. The protruding pin 272 protrudes outward on the side of the component collection container 262. Further, an engagement block 274 is fixed inside the upper end portion on the front side of the side frame portion 190. As shown in FIG. 5, when the component collection container 262 is raised to the rising end position by the operation of the air cylinder 266, the protruding pin 272 is engaged with the engagement block 274. Thereby, the parts collection container 262 rotates.

(B) Imaging Device As shown in FIG. 3, the imaging device 84 includes a camera 290 and a camera moving device 292. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 so as to extend in the width direction of the loose component supply device 32 above the component supplier 88. The slider 298 is slidably attached to the guide rail 296, and slides to an arbitrary position by the operation of the electromagnetic motor (see FIG. 9) 299. The camera 290 is attached to the slider 298 so as to face downward.

(C) Component Delivery Device The component delivery device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304, as shown in FIG.

The component holding head moving device 300 includes an X direction moving device 310, a Y direction moving device 312, and a Z direction moving device 314. The Y-direction moving device 312 has a Y slider 316 disposed above the component supply unit 82 so as to extend in the X direction. The Y slider 316 is driven by an electromagnetic motor (see FIG. 9) 319. , Move to any position in the Y direction. The X-direction moving device 310 has an X-slider 320 disposed on the side surface of the Y-slider 316. The X-slider 320 is moved to an arbitrary position in the X-direction by driving an electromagnetic motor (see FIG. 9) 321. Moving. The Z-direction moving device 314 has a Z-slider 322 disposed on the side surface of the X-slider 320. The Z-slider 322 is moved to an arbitrary position in the Z-direction by driving an electromagnetic motor (see FIG. 9) 323. Moving.

The component holding head 302 includes a head body 330, a component holder 332, a holder turning device 334, and a holder rotating device 335, as shown in FIG. The head body 330 is formed integrally with the Z slider 322. The component holder 332 holds components and is detachably attached to the lower end portion of the holder 340. The component holder 332 includes a suction nozzle 332a and a chuck 332b. The suction nozzle 332 a has a suction pipe 336 at the lower end, and holds and holds the component at the tip of the suction pipe 336. Further, the chuck 332b includes a main body portion 337 and a pair of claw portions 338, as shown in FIG. The pair of claw portions 338 are disposed so as to extend downward from the lower surface of the main body portion 337, and slide so as to be able to approach and separate from each other. Accordingly, the chuck 332b causes the pair of claw portions 338 to approach each other so that the parts are sandwiched by the pair of claw portions 338, and the pair of claw portions 338 are separated from each other to thereby separate the pair of claw portions 338. Remove the parts from between. The holder 340 can be bent at the support shaft 344, and the holder 340 is bent 90 degrees upward by the operation of the holder turning device 334. As a result, the component holder 332 attached to the lower end of the holder 340 turns 90 degrees and is positioned at the turning position. That is, the component holder 332 turns between the non-turning position and the turning position by the operation of the holder turning device 334. Further, the holder rotating device 335 rotates the component holder 332 around its axis.

Further, as shown in FIG. 3, a holder station 350 is disposed on the upper surface of the base 96. The holder station 350 stores a plurality of types of suction nozzles 332a and a plurality of types of chucks 332b. The suction nozzle 332a or the chuck 332b mounted on the holder 340 of the component holding head 302, and the holder station 350 The suction nozzle 332a or the chuck 332b housed in the holder is exchanged by the operation of the holder station 350 and the component holding head moving device 300.

Further, as shown in FIG. 3, each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, and is fixed to the main body 80 side by side in front of the component supply unit 82. Has been. Five component receiving members 392 are mounted on the component carrier 388 in a row in the horizontal direction, and the components are placed on each component receiving member 392.

Specifically, as shown in FIG. 8, the component supplied by the bulk component supply device 32 is an electronic circuit component having a lead 410 (hereinafter may be abbreviated as “lead component”) 410. The block-shaped component main body 412 and two leads 414 protruding from the bottom surface of the component main body 412 are configured. The component receiving member 392 is formed with a component receiving recess 416. The component receiving recess 416 is a stepped recess, and includes a main body receiving recess 418 that opens to the top surface of the component receiving member 392 and a lead receiving recess 420 that opens to the bottom surface of the main body receiving recess 418. Yes. The lead component 410 is inserted into the component receiving recess 416 with the lead 414 facing downward. As a result, the lead 414 is inserted into the lead receiving recess 420 and the lead component 410 is placed inside the component receiving recess 416 with the component main body 412 inserted into the main body receiving recess 418.

Further, as shown in FIG. 3, the component carrier moving device 390 is a plate-like longitudinal member, and is disposed on the front side of the component supply unit 82 so as to extend in the front-rear direction. On the upper surface of the component carrier moving device 390, a component carrier 388 is slidably arranged in the front-rear direction, and is slid to an arbitrary position in the front-rear direction by driving an electromagnetic motor (see FIG. 9) 430. When the component carrier 388 slides in a direction approaching the component supply unit 82, the component carrier 388 slides to a component receiving position located within the movement range of the component holding head 302 by the component holding head moving device 300. On the other hand, when the component carrier 388 slides in the direction away from the component supply unit 82, the component carrier 388 slides to the component supply position located within the movement range of the work heads 60 and 62 by the work head moving device 64.

Further, as shown in FIG. 9, the control device 34 includes an overall control device 450, a plurality of individual control devices (only one is shown in the figure) 452, an image processing device 454, and a storage device 456. Including. The overall control device 450 is configured mainly by a computer, and is connected to the base material conveyance holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the loose component supply device 32. ing. Thereby, the overall control device 450 controls the base material conveyance holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the loose component supply device 32 in an integrated manner. The plurality of individual control devices 452 are configured mainly by a computer, and are provided in the base material conveyance holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. (In the figure, only the individual control device 452 corresponding to the bulk component supply device 32 is shown). The individual control device 452 of the bulk component supply device 32 is connected to a component scattered state realization device 90, a component return device 92, a camera moving device 292, a component holding head moving device 300, a component holding head 302, and a shuttle device 304. Thereby, the individual control device 452 of the bulk component supply device 32 controls the component scattered state realization device 90, the component return device 92, the camera moving device 292, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. . In addition, the image processing device 454 is connected to the imaging device 84 and processes imaging data captured by the imaging device 84. The image processing device 454 is connected to the individual control device 452 of the bulk component supply device 32. As a result, the individual control device 452 of the bulk component supply device 32 acquires the imaging data captured by the imaging device 84. The storage device 456 stores various data and is connected to the individual control device 452. As a result, the individual control device 452 acquires various data from the storage device 456.

<Operation of component mounter>
In the component mounting machine 10, the component mounting operation is performed on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration. Specifically, the circuit substrate 12 is transported to the work position, and is fixedly held by the clamp device 52 at that position. Next, the imaging device 26 moves above the circuit substrate 12 and images the circuit substrate 12. Thereby, the information regarding the error of the holding position of the circuit base material 12 is obtained. In addition, the component supply device 30 or the bulk component supply device 32 supplies components at a predetermined supply position. It should be noted that the supply of components by the bulk component supply device 32 will be described in detail later. Then, one of the work heads 60 and 62 moves above the component supply position, and the component holder 66 holds the component. Subsequently, the work heads 60 and 62 holding the components move above the imaging device 28, and the components held by the component holder 66 are imaged by the imaging device 28. As a result, information on the error of the component holding position can be obtained. Then, the work heads 60 and 62 holding the components move above the circuit substrate 12 and correct the held components for errors in the holding position of the circuit substrate 12, errors in the holding position of the components, and the like. And mounted on the circuit substrate 12.

<Operation of bulk parts supply device>
(A) Lead component supply by bulk component supply device In the bulk component supply device 32, the lead component 410 is thrown into the component container 100 of the component feeder 88 by the operator, and the lead component 410 thus loaded is the component. By the operation of the supply unit 82 and the component delivery device 86, the component is supplied while being placed on the component receiving member 392 of the component carrier 388. Specifically, the operator inputs the lead component 410 from the opening on the upper surface of the component container 100 of the component supplier 88. At this time, the component support member 220 is moved below the component supplier 88 by the operation of the component support member moving device 222, and the component collection container 262 is located in front of the component supplier 88.

The lead component 410 thrown from the opening on the upper surface of the component container 100 falls on the inclined surface 116 of the component container 100 and spreads on the inclined surface 116. At this time, when the lead component 410 that has fallen on the inclined surface 116 rolls over the inclined plate 152, the lead component 410 is accommodated in the component collection container 262 located in front of the component supplier 88.

After the lead component 410 is inserted into the component container 100, the component support member 220 is moved from the lower part of the component feeder 88 to the front by the operation of the component support member moving device 222. At this time, if the cam member 240 reaches the cam follower 242, the roller 254 of the cam follower 242 gets over the teeth 245 of the cam member 240 as shown in FIG. The lever 252 of the cam follower 242 is biased in the forward direction by the elastic force of the coil spring, and the forward bias of the lever 252 is restricted by the stopper 244. For this reason, when the component support member 220 moves forward, the roller 254 and the teeth 245 are maintained in mesh with each other, the lever 252 does not rotate forward, and the roller 254 has the teeth 245. Get over. At this time, the component feeder 88 moves up and down as the roller 254 gets over the teeth 245. That is, in a state where the roller 254 is engaged with the teeth 245, the component support member 220 moves forward, so that the roller 254 gets over the plurality of teeth 245, and the component feeder 88 continuously vibrates in the vertical direction. .

The lead component 410 spreading on the inclined surface 116 of the component container 100 moves forward due to the vibration of the component feeder 88 and the inclination of the inclined surface 116, and the upper surface of the component support member 220 via the inclined plate 152. To be discharged. At this time, the lead part 410 is prevented from dropping from the component support member 220 by the side wall portion 228 of the component support member 220. The lead parts 410 are scattered on the upper surface of the part support member 220 as the part support member 220 moves forward.

When the lead components 410 are scattered on the component support member 220 from the inside of the component container 100, as shown in FIGS. 11 and 12, the lead component 410 is placed on the component support member 220 in various postures. Scattered. Specifically, the component body 412 of the lead component 410 has a generally rectangular parallelepiped shape and has six surfaces. These six surfaces are a bottom surface 500 from which the lead 414 extends, a top surface 502 facing the bottom surface 500, and four

side surfaces

504, 506, 508, 510. Of these four

side surfaces

504, 506, 508, 510, a side surface (hereinafter sometimes referred to as “first side surface”) 504 and a side surface (hereinafter sometimes referred to as “second side surface”). 506 is opposed to a side surface (hereinafter may be referred to as “third side surface”) 508 and a side surface (hereinafter may be referred to as “fourth side surface”) 510. Note that the surface areas of the first side surface 504 and the second side surface 506 are larger than the surface areas of the third side surface 508 and the fourth side surface 510. The lead 414 is bent in an L shape, and is divided into a base end portion 512 extending from the component main body 412 and a bent portion 514 bent at a right angle toward the first side surface 504 side.

When the lead components 410 having such a shape are scattered on the component support member 220, the lead component 410 is supported on the component support member 220 in approximately two postures. Specifically, a posture with the first side surface 504 facing upward (hereinafter sometimes referred to as “first posture”) and a posture with the second side surface 506 facing upward (hereinafter referred to as “second posture”). The lead component 410 is supported on the component support member 220 in any one of the two postures. This is because the upper surface 502, the third side surface 508, and the fourth side surface 510 have a small surface area, and the lead 414 is disposed on the bottom surface 500. Note that, in the lead component 410 in the first posture, the first side surface 504 is in a state of facing upward, but in the lead component 410 in the second posture, the second side surface 506 is in a posture of facing obliquely upward. This is because the lead 414 is bent in the direction of the first side surface 504. Specifically, the bent portion 514 of the lead 414 is bent beyond the first side surface 504, and in the lead component 410 in the second posture, at the end on the upper surface 502 side of the first side surface 504 and the tip of the bent portion 514. The component support member 220 is in contact with the upper surface. For this reason, the first side surface 504 is inclined, and the second side surface 506 facing the first side surface 504 faces obliquely upward.

In the lead components 410 scattered in such a posture, the lead components 410 may not be appropriately held by one type of component holder 332. Specifically, for example, when a chuck is employed as the component holder 332, the lead component is held by the chuck by sandwiching the third side surface 508 and the fourth side surface 510 of the lead component 410 by a pair of claws of the chuck. 410 can be gripped. Although the lead component 410 in the second posture is inclined, the third side surface 508 and the fourth side surface 510 are perpendicular to the upper surface of the component support member 220, and therefore, as shown in FIG. It is possible to sandwich the third side surface 508 and the fourth side surface 510 of the lead component 410 by the pair of claws 338.

However, as shown in FIG. 11, the lead component 410a and the lead component 410b are scattered at close positions, and the gap between the fourth side surface 510 of the lead component 410a and the fourth side surface 510 of the lead component 410b is very large. Very few. Therefore, the claw of the chuck cannot be inserted into the gap between the fourth side surface 510 of the lead component 410a and the fourth side surface 510 of the lead component 410b, and the lead component 410a and the lead component 410b are gripped by the chuck. I can't.

Further, when a suction nozzle is employed as the component holder 332, the lead component 410 can be sucked and held on the first side surface 504 or the second side surface 506 facing upward from the lead component 410. Although the second side surface 506 of the lead component 410 in the second posture is inclined, the holder 340 is rotated according to the inclination angle of the second side surface 506 by the holder rotating device 334, as shown in FIG. In addition, the suction nozzle as the component holder 332 is perpendicular to the second side surface 506. Accordingly, the second side surface 506 can be appropriately sucked and held by the suction nozzle. However, the lead components 410d are scattered at positions close to the side wall portion 228. For this reason, when the component holder 332 is tilted to suck and hold the second side surface 506 of the lead component 410d, the component holder 332 comes into contact with the side wall portion 228, and the lead component 410d is sucked and held by the suction nozzle. I can't.

In this way, there are cases where the lead components 410 scattered in various states cannot be appropriately held by one type of component holder 332. For this reason, in the loose component supply device 32, two types of holders, that is, a suction nozzle and a chuck, are set as the component holder 332 for holding the lead component 410. Specifically, in the storage device 456 of the bulk component supply device 32, as shown in FIG. 14, the type of component, a component holder 332 that can hold the component, and a component that is held by the component holder 332 are held. The face is associated and stored as a comparison table. In this comparison table, the suction nozzle A and the chuck A are set for the lead component 410. In the suction nozzle, the first side surface 504 or the second side surface 506 is set as the holding surface, and in the chuck, the third side surface 508 and the fourth side surface 510 are set as the holding surfaces.

The holder station 350 accommodates a plurality of types of suction nozzles 332a and a plurality of types of chucks 332b. Among the plurality of types of suction nozzles 332a, a plurality of types of suction nozzles A and a plurality of types of suction nozzles A A predetermined type of chuck A among the types of chucks 332b is stored in the comparison table. Further, even for a different type of component from the lead component 410, a plurality of types of suction nozzles 332 a and chucks 332 b are selected according to the shape, area, etc. A plurality of types are stored in the comparison table. Note that one type of suction nozzle 332a or chuck 332b may be set for a plurality of types of components, and there are a plurality of types for a suction surface of a predetermined component or a surface of a gripping surface. In some cases, the suction nozzle 332a or the chuck 332b is set.

When the lead component 410 is scattered on the component support member 220, the camera 290 of the imaging device 84 moves above the component support member 220 by the operation of the camera moving device 292 and images the lead component 410. . A component holder that can hold the lead component 410 (hereinafter may be referred to as “target component holder”) based on the imaging data captured by the camera 290 and the comparison table is provided for each lead component. Specified. Specifically, first, based on the imaging data, it is specified that the component scattered on the component support member 220 is the lead component 410. Based on the comparison table, the suction nozzle A and the chuck A are specified as target component holders for the lead component 410. Next, since the lead component 410a cannot be held by the chuck A due to the presence of the lead component 410b, the suction nozzle A is specified as the target component holder. Further, since the lead component 410b cannot be held by the chuck A due to the presence of the lead component 410a, the suction nozzle A is specified as the target component holder. Further, since there is no obstacle to holding the lead component 410c, the suction nozzle A and the chuck A are specified as target component holders. Further, since the lead component 410d cannot be held by the suction nozzle A due to the presence of the side wall portion 228, the chuck A is specified as the target component holder.

Thus, when the target component holder is specified for each of the plurality of lead components on the component support member 220, the lead component 410 is held by the specified target component holder. Specifically, for example, when the suction nozzle A is mounted on the holder 340 of the component holding head 302, any one of the lead component 410a, the lead component 410b, and the lead component 410c is the suction nozzle. Adsorbed and held by A. Further, for example, when the chuck A is mounted on the holder 340 of the component holding head 302, any one of the

lead components

410 c and 410 d is held by the chuck A. In the following description, a case where the chuck A among the plural types of suction nozzles 332a and chucks 332b is mounted on the component holding head 302 will be described.

The component holding head 302 to which the chuck A is mounted is moved upward to either the lead component 410c or the lead component 410d, and either the lead component 410c or the lead component 410d is gripped by the chuck A. Then, the component holding head 302 is moved above the component carrier 388. At this time, the component carrier 388 is moved to the component receiving position by the operation of the component carrier moving device 390. Further, when the component holding head 302 moves above the component carrier 388, the component holder 332 is turned to the turning position. Further, the component holder 332 is rotated by the operation of the holder rotation device 335 so that the lead 414 of the lead component 410 held by the component holder 332 in the turning position faces downward in the vertical direction.

When the component holding head 302 moves above the component carrier 388, the lead component 410 with the lead 414 facing downward in the vertical direction is inserted into the component receiving member 392. As a result, as shown in FIG. 8, the lead component 410 is placed on the component receiving member 392 with the lead 414 facing downward in the vertical direction.

When the lead component 410 is placed on the component receiving member 392, the component carrier 388 is moved to the component supply position by the operation of the component carrier moving device 390. Since the component carrier 388 moved to the component supply position is located in the movement range of the work heads 60 and 62, the lead component 410 is supplied at this position in the loose component supply device 32. As described above, in the loose component supply device 32, the lead component 410 is supplied with the lead 414 facing downward and the upper surface 502 facing the bottom surface 500 to which the lead 414 is connected facing upward. Therefore, the component holder 66 of the work heads 60 and 62 can appropriately hold the lead component 410.

In addition, while the component holding head 302 moves toward the component carrier 388 and places the lead component 410 on the component receiving member 392, the lead components 410 scattered on the component support member 220 are removed. The image is picked up again by the camera 290, and the target component holder is specified again for each lead component based on the image pickup data and the comparison table. That is, each time the lead component 410 is held by the component holder 332, the lead component 410 is imaged by the camera 290, and the target component holder is specified for each lead component based on the imaging data and the comparison table. Is done. This is because the position of the lead component 410 on the component support member 220 may be shifted when the lead component 410 is held by the component holder 332. Then, the component holding head 302 is returned to above the component support member 220 after placing the lead component 410 on the component receiving member 392 of the component carrier 388.

When the component holding head 302 is returned to above the component support member 220, if there is a lead component 410 in which the chuck A is specified as the target component holder, the lead component 410 is gripped by the chuck A. Then, as described above, the gripped lead component 410 is placed on the component receiving member 392. On the other hand, when there is no lead component 410 for which the chuck A is specified as the target component holder, the component holding head 302 is moved above the holder station 350 and the chuck A attached to the holder 340 is held. Housed in the tool station 350. Then, the suction nozzle A is mounted on the holder 340 from among the plurality of types of suction nozzles 332 a and chucks 332 b housed in the holder station 350. Then, the component holding head 302 is moved above the component support member 220.

When the component holding head 302 is moved above the component support member 220, the lead component 410 in which the suction nozzle A is specified as the target component holder is sucked and held by the suction nozzle A. Then, as described above, the gripped lead component 410 is placed on the component receiving member 392. As described above, in the bulk component supply device 32, when the lead component 410 is held by one of the suction nozzle A and the chuck A and the lead component 410 that can be held by one of the component support members 220 disappears, the suction nozzle The lead component 410 is held by the other of A and chuck A. As a result, many lead components 410 scattered on the component support member 220 can be held by the component holder 332.

In the above description, every time the lead component 410 on the component support member 220 is held by the component holder 332, the lead component 410 of the component support member 220 is imaged by the camera 290. The plurality of lead components 410 can be sequentially held by the component holder 332. Specifically, when the target component holder is specified for each lead component based on the imaging data and the comparison table, the position information for each lead component and information on the target component holder for each lead component (hereinafter, “ May be described as “position / holding device information”).

Then, when the lead component 410 is held by the chuck A or the suction nozzle A mounted on the component holding head 302, the position / holding tool information stored in the storage device 456 is referred to. As a result, the position of the lead component 410 on the component support member 220 is specified, and the target component holder corresponding to the lead component 410 is specified. For this reason, the lead component 410 whose position is specified based on the position / holding tool information is held by the component holder 332 specified according to the lead component 410. That is, the lead component 410 is held by the component holder 332 mounted on the component holding head 302, and after the held component is placed on the component receiving member 392, imaging by the camera 290 is not performed. Based on the position / holder information stored in the storage device 456, the next lead component 410 is held by the component holder 332 attached to the component holding head 302. Further, even after the component holder 332 mounted on the component holding head 302 is replaced with the component holder 332 accommodated in the holder station 350, the image is not captured by the camera 290 and stored in the storage device 456. The next lead component 410 is held by the replaced component holder 332 based on the position / holder information. As a result, the number of times of imaging by the camera 290 can be reduced.

In addition, the bulk component supply device 32 can supply electronic circuit components without leads 414 in addition to the lead components 410. A method for supplying the electronic circuit component 520 having the shape shown in FIG. 15 will be described below. The electronic circuit component 520 has a generally rectangular parallelepiped shape and has six surfaces. These six surfaces are a top surface 522 having a large surface area, a bottom surface 524 facing the top surface 522, and four

side surfaces

526, 528, 530, and 532. Of these four

side surfaces

526, 528, 530, and 532, a side surface (hereinafter may be described as “first side surface”) 526 and a side surface (hereinafter may be described as “second side surface”). 528 faces each other, and a side surface (hereinafter sometimes referred to as “third side surface”) 530 and a side surface (hereinafter sometimes referred to as “fourth side surface”) 532 face each other. The first side surface 526 and the second side surface 528 are continuous with the long sides of the top surface 522 and the bottom surface 524, and the third side surface 530 and the fourth side surface 532 are continuous with the short sides of the top surface 522 and the bottom surface 524.

When the electronic circuit component 520 having such a shape is scattered on the component support member 220 according to the same procedure as that of the lead component 410, the electronic circuit component 520 is in a posture in which the top surface 522 or the bottom surface 524 is directed upward. And supported on the component support member 220. This is because the surfaces other than the top surface 522 and the bottom surface 524, that is, the four

side surfaces

526, 528, 530, and 532 have a small surface area.

For the electronic circuit components 520 scattered in such an attitude, the comparison table shown in FIG. 16 is stored in the storage device 456. In the comparison table for the electronic circuit component 520, a chuck B and a chuck C are set as a target component holder from among a plurality of types of suction nozzles 332a and chucks 332b. The pair of claws of the chuck B are disposed in a relatively close state, and the pair of claws of the chuck C are disposed in a relatively separated state. Therefore, in the chuck B, the first side surface 526 and the second side surface 528 are set as the holding surfaces, and in the chuck C, the third side surface 530 and the fourth side surface 532 are set as the holding surfaces.

When the target component holder is specified for each electronic circuit component 520 scattered on the component support member 220 using the comparison table set in this way, the camera 290 also performs the same as in the case of the lead component 410. The component support member 220 is imaged. Thereby, based on the imaging data, it is specified that the components scattered on the component support member 220 are the electronic circuit components 520. Based on the comparison table, the chuck B and the chuck C are specified as target component holders of the electronic circuit component 520. Next, since the electronic circuit component 520a cannot be held by the chuck C due to the presence of the electronic circuit component 520b, the chuck B is specified as the target component holder. Further, since the electronic circuit component 520b cannot be held by the chuck C due to the presence of the electronic circuit component 520a, the chuck B is specified as the target component holder. Further, since there is no obstacle to holding the electronic circuit component 520c, the chuck B and the chuck C are specified as target component holders. Further, since the electronic circuit component 520d cannot be held by the chuck B due to the presence of the electronic circuit component 520e, the chuck C is specified as the target component holder. Further, since the electronic circuit component 520e cannot be held by the chuck B due to the presence of the electronic circuit component 520d, the chuck C is specified as the target component holder. Further, since the electronic circuit component 520f cannot be held by the chuck C due to the presence of the side wall portion 228, the chuck B is specified as the target component holder.

Thus, when the target component holder is specified for each of the plurality of electronic circuit components 520 on the component support member 220, the electronic circuit component 520 is held by the specified target component holder. The holding method of the electronic circuit component 520 by the target component holder and the mounting method of the held electronic circuit component 520 on the component receiving member 392 are the holding method of the lead component 410 and the component receiving of the lead component 410. Since it is the same as the mounting method to the member 392, description is abbreviate | omitted. Even when the electronic circuit component 520 is held, like the lead component 410, each time the electronic circuit component 520 is held, the component support member 220 is imaged and based on the imaging data and the comparison table. The target component holder may be specified, and the target component holder may be specified based on the position / holding tool information stored in the storage device 456.

(B) Part Collection The bulk part supply apparatus 32 can collect the lead parts 410 or the electronic circuit parts 520 scattered on the part support member 220. Specifically, the component support member 220 is moved downward of the component feeder 88 by the operation of the component support member moving device 222. At this time, as shown in FIG. 17, when the lead components 410 are scattered on the component support member 220, the lead components 410 are blocked by the inclined plate 152 of the component feeder 88 to support the components. The lead component 410 on the member 220 is scraped off inside the component collection container 262.

Next, the parts collection container 262 is raised by the operation of the container lifting device 260. At this time, as shown in FIG. 5, the protruding pin 272 disposed in the component collection container 262 engages with an engagement block 274 disposed inside the side frame portion 190. Thereby, the component collection container 262 rotates, and the lead component 410 in the component collection container 262 is returned to the inside of the component container 100.

In the bulk component supply device 32, as described above, the lead component 410 is picked up from the component support member 220 by the two types of component holders 332 such as a chuck or a suction nozzle. The electronic circuit component 520 is picked up from the component support member 220 by the two types of component holders 332 of the chuck B or the chuck C. For this reason, in the bulk component supply device 32, the number of lead components 410 or electronic circuit components 520 returned to the component container 100 can be reduced.

Then, when the lead component 410 or the electronic circuit component 520 is returned to the component container 100, the operator holds the grip 104 of the component supplier 88, thereby locking the component supplier 88 as described above. Is released. Then, when the operator lifts the component supplier 88, the component supplier 88 is removed from between the pair of side frame portions 190. As a result, the lead component 410 is recovered from the component supplier 88 outside the bulk component supply device 32.

Note that the individual control device 452 of the component supply device 32 includes a determination unit 470, a component holding unit 472, and a storage control unit 474, as shown in FIG. The determination unit 470 is a functional unit for determining the target component holder based on the imaging data and the comparison table. The component holding unit 472 is a functional unit for holding a component with the determined target component holder. The storage control unit 474 is a functional unit for holding a component by the component holder 332 based on the position / holding tool information stored in the storage device 456.

The present invention is not limited to the above-described embodiments, and can be implemented in various modes with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, all the components on the component support member 220 are picked up based on the position / holding tool information. Before picking up a component that can be held by the component holder 332 and holding the component by another type of component holder 332, the component support member 220 is imaged again by the camera 290, and new position / holder information is obtained. You may create it. That is, for example, based on the position / holding tool information stored in the storage device 456, the lead component 410 is held by the suction nozzle. Then, after the suction nozzle is replaced with a chuck, the component support member 220 is imaged by the camera 290, and new position / holding tool information is created based on the imaging data and the comparison table. Then, the lead component 410 may be held by a chuck based on the new position / holding tool information.

32: Bulk component supply device (component supply system) 84: Imaging device 220: Component support member (component support portion) 300: Component holding head moving device (moving device) 302: Component holding head (working head) 332: Component holder (Suction nozzle) (Gripping tool) 452: Individual control device (control device) 456: Storage device

Claims

A component support section for supporting a plurality of components in a scattered state;
An imaging device for imaging a component supported by the component support unit;
A suction nozzle for sucking and holding a component supported by the component support section;
A gripping tool for gripping a component supported by the component support portion with a plurality of claws;
A work head on which any one of the suction nozzle and the gripping tool is replaceably mounted;
A moving device for moving the working head to an arbitrary position;
A control device;
A storage device, and
The control device is
A component supply system, wherein at least one of the suction nozzle and the gripper is determined as an object to be attached to the work head based on imaging data of a component imaged by the imaging device.
The storage device is
Storing the type of component and at least one of the suction nozzle capable of holding the component and the gripping tool in association with each other;
The control device is
A type of a component supported by the component support unit is specified based on the imaging data, and at least of the suction nozzle and the gripper stored in the storage device in association with the specified type of the component 2. The component supply system according to claim 1, wherein one of the components is determined as an object to be attached to the work head.
The gripping tool grips the component by sandwiching two opposing surfaces of the component,
The storage device is
Storing the type of component, the gripping tool capable of gripping the component, and two opposing surfaces of the component sandwiched by the gripping tool,
The control device is
After identifying the type of component supported by the component support unit based on the imaging data, the gripping tool associated with the identified type of component and stored in the storage device is identified, and the grip The gripping tool is determined as an object to be attached to the work head when two opposing surfaces of the component associated with the tool can be gripped by the gripping tool. The component supply system according to claim 2.
The storage device is
Based on imaging data of a plurality of parts imaged by the imaging device, storing positional information regarding the positions of the plurality of parts that can be held by at least one of the suction nozzle and the gripping tool,
The control device is
Based on the position information stored in the storage device, the position of the working head is moved and supported by the component support portion by at least one of the suction nozzle and the gripping tool determined by the control device. The component supply system according to any one of claims 1 to 3, wherein a component is held.